Cooling apparatus and power converter.
10 claims: 8 independent, 2 dependent
- 1循環液が流れる蒸発器通流路が内部に形成されると 共 に発熱体が外部に配置され前記発熱体が発する熱によって循環液を加熱するブロック状の蒸発器、 循環液 が流れる放熱器通流路を有し 循環液 の熱を放出する放熱器、 並びに 前記放熱器から 循環液 が送入される熱交換器低温液体送入口を有する入口ヘッダと、前記蒸発器へ 循環液 が送出される 中間温 液体送出口を有する出口ヘッダと、前記入口ヘッダ 及び 前記出口ヘッダを連結する熱交換器通流路、前記蒸発器で加熱された循環液 並びに 当該循環液の蒸気が収容されている収容部とを有する熱交換器を備え、前記熱交換器は、下方に配置された前記蒸発器と面で接合されており、前記収容部は、前記蒸発器との接合部に開口部を有し、前記出口ヘッダは、前記蒸発器との接合部に前記 中間温 液体送出口を有し、前記蒸発器は、前記開口部に対向して前記熱交換器との接合面から窪んだ前記循環液を保持する循環液保持部を有し、前記循環液保持部の下面に前記収容部へ 循環液 および当該循環液の蒸気が送出される二相流体送出口と前記収容部から循環液が送入される蒸発器高温液体送入口とを有し、前記熱交換器との接合部に前記 中間温 液体送出口に対向して前記出口ヘッダから前記循環液が送入される 中間温 液体送入口を有し、前記放熱器へ前記循環液が送出される蒸発器高温液体送出口を有し、 且つ、 内部に前記蒸発器高温液体送入口と前記蒸発器高温液体送出口とを連通する高温液体流路が形成されている冷却装置。
- 2循環液が流れる蒸発器通流路が内部に形成されると共に発熱体が外部に配置され前記発熱体が発する熱によって循環液を加熱するブロック状の蒸発器、 循環液が流れる放熱器通流路を有し循環液の熱を放出する放熱器、並びに 前記放熱器から循環液が送入される熱交換器低温液体送入口を有する入口ヘッダと、前記蒸発器へ循環液が送出される中間温液体送出口を有する出口ヘッダと、前記入口ヘッダ及び前記出口ヘッダを連結する熱交換器通流路、前記蒸発器で加熱された循環液並びに当該循環液の蒸気が収容されている収容部とを有する熱交換器を備え、 前記熱交換器は、下方に配置された前記蒸発器と面で接合されており、 前記収容部は、前記放熱器へ循環液が送出される熱交換器高温液体送出口を有すると共に、前記蒸発器との接合部に前記蒸発器から循環液および当該循環液の蒸気が送入される二相流体送入口を有し、 前記出口ヘッダは、前記蒸発器との接合部に前記中間温液体送出口を有し、 前記蒸発器は、前記熱交換器との接合部に前記二相流体送入口に対向して前記収容部へ循環液および当該循環液の蒸気が送出される二相流体送出口を有すると共に、前記熱交換器との接合部に前記中間温液体送出口に対向して前記出口ヘッダから循環液が送入される中間温液体送入口を有し、 前記収容部の下方であって 前記 熱交換器高温液体送出口が設けられた端部とは反対側の端部と 前記 放熱器通流路とを連通するバイパス流路を備え ている 冷却装置。
- 3循環液が流れる蒸発器通流路が内部に形成されると共に発熱体が外部に配置され前記発熱体が発する熱によって循環液を加熱するブロック状の蒸発器、 循環液が流れる放熱器通流路を有し循環液の熱を放出する放熱器、並びに 前記放熱器から循環液が送入される熱交換器低温液体送入口を有する入口ヘッダと、前記蒸発器へ循環液が送出される中間温液体送出口を有する出口ヘッダと、前記入口ヘッダ及び前記出口ヘッダを連結する熱交換器通流路、前記蒸発器で加熱された循環液並びに当該循環液の蒸気が収容されている収容部とを有する熱交換器を備え、 前記熱交換器は、下方に配置された前記蒸発器と面で接合されており、 前記収容部は、前記蒸発器との接合部に循環液が送出される熱交換器高温液体送出口を有すると共に、前記蒸発器との接合部に前記蒸発器から循環液および当該循環液の蒸気が送入される二相流体送入口を有し、 前記出口ヘッダは、前記蒸発器との接合部に前記中間温液体送出口を有し、 前記蒸発器は、前記熱交換器との接合部に前記二相流体送入口に対向して前記収容部へ循環液および当該循環液の蒸気が送出される二相流体送出口を有し、前記熱交換器との接合部に前記中間温液体送出口に対向して前記出口ヘッダから循環液が送入される中間温液体送入口を有し、前記熱交換器との接合部に前記熱交換器高温液体送出口に対向して前記収容部から循環液が送入される蒸発器高温液体送入口を有し、前記放熱器へ循環液が送出される蒸発器高温液体送出口を有し、且つ、内部に前記蒸発器高温液体送入口と前記蒸発器高温液体送出口とを連通する高温液体流路が形成され、 前記 収容部の下方であって 前記 熱交換器高温液体送出口が設けられた端部とは反対側の端部と 前記高温液体流路又は前記放熱器通流路 とを連通するバイパス流路を備え ている 冷却装置。
- 4前記 熱交換器は、冷却流路に冷却流体を流す熱交換器放熱部を有し、前記冷却流路は、前記熱交換器の内部に形成されている 請求項1~請求項3のいずれか1項に 記載の冷却装置。
- 5前記 蒸発器は、 前記 蒸発器通流路と 前記 高温液体流路との間に断熱するための断熱部を有する 請求項1又は請求項3 記載の冷却装置。
- 6前記 入口ヘッダは、 前記 蒸発器との接合部に 前記 熱交換器低温液体送入口を有し、前記蒸発器は、 前記 放熱器から循環液が送入される蒸発器低温液体送入口を有 し、 前記熱交換器との接合部に前記熱交換器低温液体送入口に対向して前記熱交換器へ循環液が送出される低温液体送出口を有し、内部に前記蒸発器低温液体送入口と前記低温液体送出口とを連通する低温液体流路が形成され 、且つ、前記高温液体通流路と前記低温液体流路との間に断熱するための断熱部を有する請求項3 記載の冷却装置。
- 7前記蒸発器は、複数の発熱体が配置され、他の発熱体に比べて発熱量の小さい発熱体に隣接する前記蒸発器通流路の加熱流路に循環液の流れを阻害する 流動阻害体 を有する請求項1~請求項3のいずれか1項に記載の冷却装置。
- 8前記 蒸発器は、 前記 発熱体が配置された面と反対側の面に熱を放出する補助放熱器が配置されている 請求項1~請求項3のいずれか1項に 記載の冷却装置。
- 9前記 熱交換通流路は、外壁に窪みを有する 請求項1~請求項3のいずれか1項に 記載の冷却装置。
- 10請求項1~請求項3のいずれか1項に 記載の冷却装置を備え、発熱体がインバータ 又は コンバータである電力変換装置。
Independent claims10
76 paragraphs, as filed
The present invention relates to a heat transport device, and relates to a cooling device for cooling the heat of a heating element and a power conversion device using the cooling device.
In recent years, many electronic devices have been used in important lifeline equipment such as energy supply equipment, information communication equipment, and transportation equipment. These electronic devices need to operate stably and reliably, and it is necessary to efficiently dissipate heat generated from the electronic devices. There are various forms of heat dissipation means, and there is a cooling device as one of the heat dissipation means having high efficiency, energy saving, and high reliability in line with environmental protection (see, for example, Patent Document 1). This cooling device is configured so that the heat exchange circulating solution circulates in the equipment by utilizing the density difference (buoyancy caused by the density difference) in the circulating solution transport pipe caused by the phase change of the heat exchange circulating solution. ing. That is, the apparent density of the gas-liquid two-phase fluid in the gas-liquid two-phase fluid delivery pipe from the heat heat exchanger to the two-phase fluid inlet, and the circulation solution transport pipe in the section at the same height as the section. The heat exchange circulating solution is circulated by utilizing the density difference from the heat exchange circulating solution. In addition, by repeating this circulation, the high-temperature heat transferred from the heat heat exchanger is transported to the manifest heat release heat exchanger and the radiator, and heat is required from the manifest heat release heat exchanger and the radiator. The heat is transferred to another device or a low heat source.
<patcit num="1"><text>Japanese Unexamined Patent Publication No. 2005-195226 (pages 4-6, Fig. 1)</text></patcit>
<p> The conventional cooling device as described above has a problem of low strength because the gas-liquid two-phase fluid feeding pipe for feeding and sending the circulating solution for heat exchange to the heat heat exchanger is composed of piping. It was. Further, in the cooling device as described above, when a non-condensable gas such as air invades from a fine crack, the condensation characteristics of the heat exchange circulating solution around the pipe in the heat exchange circulating solution accommodating container deteriorate, which is desired. There was a problem that the heat dissipation characteristics (heat transport characteristics) of the above could not be obtained.</p><p> The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a cooling device having high strength and good heat dissipation characteristics.</p>
<p> In the cooling device of the present invention, when an evaporator passage through which the circulating liquid flows is formed inside.<u style="single">Both</u>The heating element is placed outside<u style="single">Said</u>A block-shaped evaporator that heats the circulating fluid by the heat generated by the heating element, a radiator that has a radiator through which the circulating fluid flows and releases the heat of the circulating fluid,<u style="single">And the above</u>Heat exchanger where circulating liquid is fed from the radiator An inlet header with a low temperature liquid inlet and<u style="single">Said</u>Circulating fluid is delivered to the evaporator<u style="single">Intermediate temperature</u>An outlet header having a liquid outlet and the inlet header.<u style="single">And the above</u>Heat exchanger flow path connecting the outlet headers,<u style="single">Said</u>Circulating fluid heated by the evaporator<u style="single">And</u>A heat exchanger having an accommodating portion for accommodating the vapor of the circulating fluid is provided.<u style="single">Said</u>The heat exchanger is<u style="single">Down</u>Placed<u style="single">Said</u>It is surface-bonded to the evaporator and<u style="single">Said</u>The containment area<u style="single">The joint with the evaporator has an opening, and the said</u>The exit header is<u style="single">Said</u>The above at the joint with the evaporator<u style="single">Intermediate temperature</u>Has a liquid outlet and<u style="single">Said</u>The evaporator is<u style="single">It has a circulating fluid holding portion that faces the opening and holds the circulating fluid that is recessed from the joint surface with the heat exchanger, and the circulating fluid and the circulating fluid to the accommodating portion are on the lower surface of the circulating fluid holding portion. It has a two-phase fluid inlet to which the vapor of the above is delivered and an evaporator high-temperature liquid inlet to which the circulating liquid is fed from the accommodating portion.</u>At the joint with the heat exchanger<u style="single">The intermediate temperature</u>Facing the liquid outlet<u style="single">Said</u>From the exit header<u style="single">Said</u>Circulating fluid is sent<u style="single">Intermediate temperature</u>Has a liquid inlet<u style="single">A high-temperature liquid flow path that has an evaporator high-temperature liquid inlet / outlet for sending the circulating liquid to the radiator, and internally communicates the evaporator high-temperature liquid inlet / outlet and the evaporator high-temperature liquid inlet / outlet. Is formed</u>It is a thing.</p><p> Further, in the cooling device of the present invention, when an evaporator passage through which the circulating liquid flows is formed inside.<u style="single">both</u>The heating element is placed outside<u style="single">Said</u>A block-shaped evaporator that heats the circulating fluid by the heat generated by the heating element, a radiator that has a radiator through which the circulating fluid flows and releases the heat of the circulating fluid,<u style="single">And the above</u>Heat exchanger where circulating liquid is fed from the radiator An inlet header with a low temperature liquid inlet and<u style="single">Said</u>An outlet header with an intermediate temperature liquid outlet at which the circulating fluid is delivered to the evaporator,<u style="single">Said</u>Entrance header<u style="single">And the above</u>Heat exchanger flow path connecting the outlet headers,<u style="single">Said</u>Circulating fluid heated by the evaporator<u style="single">And</u>A heat exchanger having an accommodating portion for accommodating the vapor of the circulating fluid is provided.<u style="single">Said</u>The heat exchanger is face-to-face bonded to the evaporator located below.<u style="single">Said</u>The containment area<u style="single">The heat exchanger has a high-temperature liquid outlet for sending the circulating liquid to the radiator, and also has the above-mentioned</u>At the joint with the evaporator<u style="single">The outlet header has the intermediate temperature liquid inlet / outlet at the joint with the evaporator, and has a two-phase fluid inlet / outlet into which the circulating liquid and the vapor of the circulating fluid are fed from the evaporator. The evaporator has a two-phase fluid outlet at the joint with the heat exchanger, which faces the two-phase fluid inlet and sends the circulating liquid and the vapor of the circulating fluid to the accommodating portion, and also has the heat. The joint with the exchanger has an intermediate temperature liquid inlet that faces the intermediate temperature liquid inlet and feeds the circulating fluid from the outlet header, and is below the accommodating portion and has a high temperature of the heat exchanger. It is provided with a bypass flow path that communicates the end on the side opposite to the end provided with the liquid outlet and the radiator passage.</u>It is a thing.<u style="single">Further, in the cooling device of the present invention, a block-shaped evaporator in which a flow path through an evaporator through which a circulating liquid flows is formed inside and a heating element is arranged outside and the circulating liquid is heated by the heat generated by the heating element. A radiator having a radiator through which the circulating liquid flows and releasing the heat of the circulating liquid, a heat exchanger in which the circulating liquid is sent from the radiator, an inlet header having a low-temperature liquid inlet, and the evaporator. An outlet header having an intermediate temperature liquid outlet to which the circulating liquid is sent to, a heat exchanger passing path connecting the inlet header and the outlet header, the circulating liquid heated by the evaporator, and the steam of the circulating liquid. The accommodating portion is provided with a heat exchanger having an accommodating portion, and the heat exchanger is face-to-face bonded to the evaporator arranged below, and the accommodating portion is a joint portion with the evaporator. Has a heat exchanger high-temperature liquid inlet / outlet for sending out the circulating liquid, and has a two-phase fluid inlet / outlet for feeding the circulating liquid and the vapor of the circulating liquid from the evaporator at the joint with the evaporator. The outlet header has the intermediate temperature liquid inlet at the junction with the evaporator, and the evaporator faces the two-phase fluid inlet at the junction with the heat exchanger. It has a two-phase fluid outlet for sending the circulating liquid and the vapor of the circulating liquid to the accommodating portion, and the circulating liquid flows from the outlet header facing the intermediate temperature liquid outlet at the joint with the heat exchanger. Evaporator high-temperature liquid feed that has an intermediate-temperature liquid inlet and a circulating liquid that is fed from the accommodating portion facing the heat exchanger high-temperature liquid outlet at the joint with the heat exchanger. A high-temperature liquid having an inlet and an evaporator high-temperature liquid inlet / outlet for sending a circulating liquid to the radiator, and internally communicating the evaporator high-temperature liquid inlet and the evaporator high-temperature liquid inlet / outlet. A flow path is formed, and the end portion below the accommodating portion and opposite to the end portion provided with the heat exchanger high temperature liquid outlet and the high temperature liquid flow path or the radiator passage flow path. It is provided with a bypass flow path for communication.</u></p>
<p> According to the present invention, it is possible to provide a cooling device having high strength and good heat dissipation characteristics.</p>
<figref num="1">It is sectional drawing which shows the structure of the cooling apparatus according to Embodiment 1 of this invention.</figref><figref num="2">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 1 of this invention.</figref><figref num="3">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 1 of this invention.</figref><figref num="4">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 1 of this invention.</figref><figref num="5">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 1 of this invention.</figref><figref num="6">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 1 of this invention.</figref><figref num="7">It is sectional drawing which shows the heat exchanger passage according to Embodiment 1 of this invention.</figref><figref num="8">It is sectional drawing which shows the structure of the cooling apparatus according to Embodiment 2 of this invention.</figref><figref num="9">It is sectional drawing which shows the structure of another cooling device by Embodiment 2 of this invention.</figref><figref num="10">It is sectional drawing which shows the structure of the cooling apparatus according to Embodiment 3 of this invention.</figref><figref num="11">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 3 of this invention.</figref><figref num="12">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 3 of this invention.</figref><figref num="13">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 3 of this invention.</figref><figref num="14">It is sectional drawing which shows the structure of the cooling apparatus according to Embodiment 4 of this invention.</figref><figref num="15">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 4 of this invention.</figref><figref num="16">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 4 of this invention.</figref><figref num="17">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 4 of this invention.</figref><figref num="18">It is a figure which shows the heat transfer surface temperature of an evaporator with respect to the heating amount of the cooling apparatus according to Embodiment 4 of this invention.</figref><figref num="19">It is sectional drawing which shows the structure of the cooling apparatus according to Embodiment 5 of this invention.</figref><figref num="20">It is sectional drawing which shows the structure of the cooling apparatus according to Embodiment 6 of this invention.</figref><figref num="21">It is sectional drawing which shows the structure of another cooling apparatus according to Embodiment 6 of this invention.</figref><figref num="22">It is sectional drawing which shows the structure of the other cooling apparatus according to Embodiment 6 of this invention.</figref>
Code description
1 heat exchanger, 2 inlet header, 3 containment unit, 4 outlet header, 5 heat exchanger low temperature liquid inlet, 6 two-phase fluid inlet, 7 heat exchanger high temperature liquid inlet, 8 intermediate liquid inlet, 9 heat Exchanger flow path, 11a steam, 11b high temperature circulating fluid, 11c condensate, 12 openings, 13 sealing port, 14 evaporator, 15 evaporator flow path, 15a heating flow path, 15b unheated flow path , 15c diversion header, 16 heating element, 16a strong heating element, 16b weak heating element, 18 radiator, 19 radiator flow path, 19a diversion header, 19b merging header, 19c parallel flow path, 20 fins, 21 Heat exchanger radiator, 22 Auxiliary radiator, 23 Indentation, 24 fins, 25 Heat exchanger cooling flow path, 26 Fan, 27 Circulating fluid holding part, 28 Bypass flow path, 29 High temperature part, 30 Low temperature part, 31 Partition Plate, 32 housing, 33 radiator cooling flow path, 34 openings, 35 mountings, 36 obstruction plates, 37 insulation, 38 flow inhibitors, 41 intermediate liquid inlets, 42 two-phase fluid outlets, 43 evaporator high temperature Liquid inlet, 44 Evaporator high temperature liquid inlet, 45 evaporator low temperature liquid inlet, 46 evaporator low temperature liquid outlet, 47 high temperature liquid flow path, 48 low temperature liquid flow path.
Embodiment 1. FIG. 1 is a cross-sectional view showing the configuration of the cooling device according to the first embodiment of the present invention, and FIG. 1 (b) is a cross-sectional view of the AA cross section shown in FIG. 1 (a). In the figure, those having the same reference numerals are the same or equivalent thereof, which is common to the whole text of the specification. In FIG. 1, the cooling device is a block-shaped evaporator 14 that uses heat from the heating element 16 to change the phase of the circulating fluid into the circulating fluid and the vapor of the circulating fluid, and a heat exchanger that condenses the vapor of the circulating fluid. 1 and a radiator 18 that dissipates heat from the circulating fluid are provided, and the lower surface of the heat exchanger 1 and the upper surface of the evaporator 14 are joined by brazing, welding, or the like. The heat exchanger 1 is a cylindrical container in which the inlet header 2, the accommodating portion 3, and the outlet header 4 are connected to each other, and the inlet header 2 and the outlet header 4 use a plurality of tubular heat exchanger passages 9. Are connected. The inlet header 2 has a heat exchanger low temperature liquid inlet 5 on the side surface from which the circulating liquid is fed from the radiator 18, and the outlet header 4 circulates to the evaporator 14 at the joint with the evaporator 14 on the lower surface. It has an intermediate liquid outlet 8 through which the liquid is delivered. The accommodating portion 3 has a heat exchanger high-temperature liquid outlet 7 on the lower surface at which the circulating liquid is sent to the radiator 18, and the circulating liquid from the evaporator 14 and the circulating liquid at the joint with the evaporator 14 on the lower surface. It has a two-phase fluid inlet 6 through which steam is fed. Here, the joint portion between the heat exchanger 1 and the evaporator 14 is the joint surface between the heat exchanger 1 and the evaporator 14, and the portion where the heat exchanger 1 and the evaporator 14 are joined. Point to. In the first embodiment, the heat exchanger 1, the evaporator 14, and the radiator 18 are all made of copper, and a metal having good heat conduction is preferable.
The heat exchanger low temperature liquid inlet 5 of the inlet header 2 is connected to the radiator passage 19 of the radiator 18, and the inlet header 2 is the low temperature fed from the heat exchanger low temperature liquid inlet 5. It has a function of accommodating the circulating liquid of the above and sending the low-temperature circulating liquid to the heat exchanger through-passage 9. When the low-temperature circulating fluid sent from the heat exchanger low-temperature liquid inlet 5 is sent to the plurality of heat exchanger passages 9, the low-temperature circulating fluid flowing in each heat exchanger passage 9. In order to make the flow rate uniform, a rectifying structure (for example, a guide blade, a rectifying grid, etc.) for guiding a low-temperature circulating fluid to each heat exchanger passage 9 may be provided in the inlet header 2. Further, in order to lower the temperature of the low-temperature circulating fluid contained in the inlet header 2, protrusions such as fins may be provided on the inner wall surface of the inlet header 2 which can exchange heat with the surrounding space.
In the accommodating portion 3, a plurality of tubular heat exchanger passages 9 and a high-temperature circulating fluid 11b fed from the evaporator 14 via the two-phase fluid inlet 6 and a part of the circulating fluid are vaporized. It has a function of accommodating the steam 11a. Further, in the accommodating portion 3, the radiator passage 19 of the radiator 18 is connected to the heat exchanger high temperature liquid outlet 7, and the high temperature circulating liquid 11b is passed through the heat exchanger high temperature liquid outlet 7. It has a function of sending to the radiator 18.
The heat exchanger passage 9 is a heat exchanger due to the temperature difference between the low-temperature circulating fluid sent from the inlet header 2 and the high-temperature circulating fluid 11b and its vapor 11a contained in the accommodating portion 3. It has a function of exchanging heat through the wall of the flow path 9 and sending the circulating liquid (intermediate liquid) whose temperature has been raised by the heat exchange to the outlet header 4. Further, the heat exchanger through-passage 9 has a function of condensing the steam 11a contained in the accommodating portion 3 with the heat exchange and preventing the internal pressure of the cooling device from excessively increasing. When a multi-component fluid such as an ethylene glycol aqueous solution is used as the circulating fluid, the high-temperature circulating fluid 11b accommodated in the accommodating portion 3 and the vapor 11a are condensed and generated on the outer wall of the heat exchanger passage 9 The circulating fluid is stirred and mixed in the accommodating portion 3. In addition, in order to promote the condensation of the steam 11a contained in the accommodating portion 3, protrusions such as fins may be provided on the inner wall surface of the accommodating portion 3.
The outlet header 4 accommodates the circulating fluid sent from the heat exchanger through-passage 9 and evaporates the circulating fluid heated in the heat exchanger through-passage 9 via the intermediate liquid inlet 8. Has a function to send to. Further, similarly to the inlet header 2, a protrusion such as a rectifying structure or fins may be provided inside the outlet header 4.
The heat exchanger 1 is a container having an inlet header 2, an accommodating portion 3, and an outlet header 4, and allows low-temperature circulating liquid sent from the heat exchanger low-temperature liquid inlet 5 to be passed through the heat exchanger through-passage 9 It has a function of raising the temperature by heat exchange between the high-temperature circulating liquid 11b and the steam 11a in the accommodating portion 3 and sending the temperature from the intermediate liquid outlet 8 to the evaporator 14. Further, the heat exchanger 1 condenses the vapor 11a sent from the two-phase fluid inlet 6 into a high-temperature circulating fluid 11b, and together with the high-temperature circulating fluid 11b sent from the two-phase fluid inlet 6. Heat exchanger Has a function of sending out from the high temperature liquid outlet 7. The mounting position of the heat exchanger low temperature liquid inlet 5 may be any wall surface of the inlet header 2, and is not particularly limited. Further, the mounting position of the heat exchanger high-temperature liquid outlet 7 may be any position as long as it is on the wall surface of the accommodating portion 3 and in contact with the high-temperature circulating liquid 11b accommodated in the accommodating portion 3.
The rectangular block-shaped evaporator 14 is joined to the heat exchanger 1 on the upper surface, and the heat exchanger 1 outlet is opposed to the intermediate liquid outlet 8 of the heat exchanger 1 at the joint portion of the heat exchanger 1. It has an intermediate liquid inlet 41 to which the circulating liquid is fed from the header 4, and at the joint of the heat exchanger 1, the accommodating portion 3 of the heat exchanger 1 faces the two-phase fluid inlet 6 of the heat exchanger 1. It has a two-phase fluid outlet 42 to which the high-temperature circulating fluid 11b and the steam of the circulating fluid are sent out. Further, an evaporator passage 15 for communicating the intermediate liquid inlet 41 and the two-phase fluid inlet 42 is formed inside the evaporator 14, and a heating element 16 is provided outside the evaporator 14. It is arranged so that heat is transferred to the evaporator 14.
The evaporator flow path 15 circulates from a plurality of parallel heating flow paths 15a adjacent to the heating element 16, a non-heating flow path 15b not adjacent to the heating element 16, and the non-heating flow path 15b to the plurality of heating flow paths 15a. It has a diversion header 15c that diverts the liquid. The circulating fluid fed from the outlet header 4 of the heat exchanger 1 through the intermediate liquid inlet 41 is diverted by the diversion header 15c through the non-heated flow path 15b and flows through the plurality of heated flow paths 15a. It is delivered to the accommodating portion 3 of the heat exchanger 1 via the two-phase fluid outlet 42. Although not shown in FIG. 1, the evaporator flow path 15 may have a merging header for merging the circulating liquid from the plurality of heating flow paths 15a to the gas-liquid two-phase fluid outlet 42.
The evaporator 14 heats the circulating fluid flowing through the heating flow path 15a by the heat applied from the heating element 16 to the evaporator 14 to change the phase of at least a part of the circulating fluid into steam, and the high-temperature circulating fluid. It has the function of generating a gas-liquid two-phase fluid consisting of 11b and steam. When a multi-component fluid is used as the circulating fluid, it also has a function of concentrating the circulating fluid. Further, it also has a function of raising the gas-liquid two-phase fluid by the buoyancy generated from the difference between the apparent density of the gas-liquid two-phase fluid and the density of the circulating liquid. Therefore, the heating flow path 15a is configured so that the gas-liquid two-phase fluid flows upward.
Since the heating flow path 15a is a plurality of parallel flow paths, a large number of heating elements 16 or a large area heating element 16 can be installed in the evaporator 14, and the heat transfer area with the heating element 16 can be increased. It is possible to improve the heat dissipation characteristics of the cooling device. Further, in FIG. 1, the non-heated flow path 15b is shown as a single flow path, but both the heated flow path 15a and the non-heated flow path 15b may be a plurality of parallel flow paths. By forming the heating flow path 15a and the non-heating flow path 15b into a plurality of parallel flow paths, the evaporator 14 can be manufactured as a thin plate structure, and the evaporator 14 can be made smaller and lighter. The evaporator 14 may be molded or machined. At the time of shaving, the diversion header 15c may be formed from any one surface of the diversion header 15c to close the opening generated during the machining. Further, another member having a flat plate and a recess in the flow path portion may be manufactured by soldering or brazing.
Further, the cross-sectional shape of the flow path of the evaporator passage 15 may be circular, semi-circular, elliptical, rectangular, or a combination thereof, and protrusions such as fins may be provided on the inner wall surface. When the evaporator passage 15 has a rectangular cross section, the circulating fluid tends to stagnate at the corners of the cross section of the flow path, and it is difficult to push up the circulating fluid with steam. Therefore, the circulating fluid circulating in the cooling device The flow rate decreases and the heat transport characteristics deteriorate. Therefore, the cross-sectional shape of the evaporator passage 15 is preferably circular or elliptical.
The heating element 16 may be any as long as it can apply heat to the evaporator 14, and its dimensions, shape, configuration, etc. are not particularly limited, and it is an electronic device, a heating heater, a heat transport device, a heat radiating part of a refrigeration cycle, or the like. ..
The radiator 18 is a tubular radiator passage 19 and a radiator passage 19 that connect the heat exchanger high temperature liquid inlet 7 of the accommodating portion 3 and the heat exchanger low temperature liquid inlet 5 of the inlet header 2. It has a plurality of fins 20 arranged so that heat is transferred to at least a part of the outer wall. The radiator 18 transfers the heat held by the high-temperature circulating fluid that is sent from the accommodating portion 3 and flows through the radiator passage 19 to the surroundings (air, water, etc.) through the wall of the radiator passage 19 and the fins 20. It has a function of discharging to a fluid, soil, a solid such as a device that requires heat), and feeding a cooled low-temperature circulating liquid from the heat exchanger low-temperature liquid inlet 5 to the inlet header 2.
The radiator 18 may be directly installed in an arbitrary space (in the air, underwater, in the soil, etc.) and dissipate heat by utilizing heat conduction, natural / forced convective heat transfer, radiation, or the like. Further, the radiator 18 may use natural wind, and when the cooling device is mounted on a moving body such as a vehicle, heat may be dissipated by using running wind. Further, the cooling fluid may be flowed around the radiator 18 by using a fan or a pump to dissipate heat, and the heat is dissipated by using the exhaust air or drainage from other devices provided around the cooling device. Is also good. The radiator 18 may be any as long as it releases the heat of the circulating liquid to the outside, and its shape, dimensions, configuration, and the like are not particularly limited. Further, although the radiator passage 19 is shown as a single meandering pipe in FIG. 1, it is a diversion header or a diversion header that has a plurality of passages in parallel and divides the flow into a plurality of parallel passages. It may have a merging header for merging a plurality of parallel flow paths. Further, in order to make the flow rate of the circulating liquid flowing through each flow path uniform (improve the diversion characteristics), a rectifying structure for guiding the circulating fluid may be provided in the diversion header or the merging header. The radiator passage 19 may be a circular pipe, an elliptical pipe, a rectangular pipe, a flat pipe, a corrugated pipe (flexible pipe), or a combination thereof. Further, a protrusion such as a fin or a turbulent flow promoter may be provided on the inner wall surface of the radiator passage 19.
Next, the operation of the cooling device according to the first embodiment will be described. The circulating fluid is supplied from the inlet header 2 of the heat exchanger 1, the heat exchanger through-passage 9, the outlet header 4, the evaporator through-passage 15 of the evaporator 14, the accommodating portion 3 of the heat exchanger 1, and the radiator 18. The circulation flow path connecting the radiator flow path 19 flows in order and circulates in the cooling device. When the high-temperature circulating fluid 11b contained in the accommodating portion 3 passes through the radiator passage 19 of the radiator 18, it releases sensible heat around the radiator 18 to become a low-temperature circulating fluid. This low-temperature circulating liquid is sent from the heat exchanger low-temperature liquid inlet 5 to the inlet header 2, splits inside the inlet header 2, and is fed into a plurality of heat exchanger passages 9. When passing through the heat exchanger flow path 9, the low-temperature circulating fluid exchanges heat with the high-temperature circulating fluid 11b and steam 11a contained in the accommodating portion 3, is heated, and is preheated. The heated circulating fluid merges in the outlet header 4, is sent out to the evaporator passage 15 via the intermediate liquid inlet 8 and the intermediate liquid inlet 41, and is adjacent to the evaporator passage 15. The temperature is further raised to a higher temperature by the heating element 16 to boil, and the liquid returns to the accommodating portion 3 via the two-phase fluid inlet 42 and the two-phase fluid inlet 6 while changing to steam. The high-temperature circulating fluid 11b and the vapor 11a returned to the accommodating portion 3 exchange heat with the circulating fluid in the heat exchanger through-passage 9, and a part of the vapor 11a condenses into a condensed liquid and flows down. In addition, the high-temperature circulating fluid 11b and the condensate that have returned to the accommodating portion 3 are mixed, flowed through the circulation flow path again, and circulated in the cooling device while radiating heat, preheating, raising the temperature to the boiling temperature, and condensing. repeat.
In the cooling device of the present invention, the circulating liquid is configured to circulate in the cooling device by utilizing the density difference (buoyancy generated by the density difference) in the circulation flow path caused by the phase change of the circulating liquid. That is, the apparent density of the gas-liquid two-phase fluid in the evaporator passage 15 from the lower end of the heating element 16 to the two-phase fluid inlet 6 and the circulating fluid in the circulation flow path in the section having the same height as the section. The circulating fluid is circulated using the difference (density difference) from the density of. Further, by repeating this circulation, the heat transferred from the heating element 16 is transported to the radiator 18, and the heat is discharged from the radiator 18 to the surroundings.
Therefore, in the cooling device of the present invention, the positional relationship between the heat exchanger 1, the radiator 18, and the evaporator 14 is such that the evaporator 14 needs to be below the heat exchanger 1, and the evaporator 14 and the heat exchanger 14 need to be located below the heat exchanger 1. Other than the positional relationship with 1, the positional relationship may be different from that of the cooling device shown in FIG. For example, the radiator 18 may be above the evaporator 14 and the heat exchanger 1. The heat exchanger 1, the radiator 18, and the evaporator 14 may be made of a metal having good heat conductivity such as copper.
The circulating fluid is preferably a fluid having good thermal properties (eg, high thermal conductivity, high specific heat), good flow properties (eg, low viscosity coefficient), and a large ratio of liquid density to gas density. A liquid consisting of a single component such as distilled water, alcohol, or liquid metal, an aqueous solution such as an antifreeze solution or an alcohol aqueous solution, or a mixed liquid such as a magnetic fluid, which causes a phase change between gas and liquid is used. The vapor 11a is a circulating liquid or a part thereof vaporized, but a small amount of non-condensable gas such as air may be mixed.
As described above, in the cooling device according to the first embodiment, the heating element 16 starts from the heating element 16 while the circulating liquid circulates in the cooling device by utilizing the density difference in the circulation flow path caused by the phase change of the circulating liquid. It is configured to transport the transferred heat to the radiator 18 and release the heat from the radiator 18 to the surroundings. Therefore, a large amount of heat can be transported in all directions (horizontal direction, lower to upper, upper to lower, etc.) without using an external power for circulating the circulating liquid. Further, since a pump or the like having a moving part is not required, it is possible to provide a compact and lightweight cooling device having high durability and reliability.
Further, in the cooling device according to the first embodiment, the two-phase fluid inlet 6 and the intermediate liquid inlet 8 of the heat exchanger 1 joined to the block-shaped evaporator 14 on the surface are joined to the evaporator 14. The two-phase fluid inlet 42 of the evaporator 14 is arranged at the junction with the heat exchanger 1 so as to face the two-phase fluid inlet 6, and the intermediate liquid inlet 41 of the evaporator 14 is arranged. Is arranged at the joint with the heat exchanger 1 so as to face the intermediate liquid outlet 8. Therefore, there is no pipe portion protruding to the outside between the heat exchanger 1 and the evaporator 14, and the area of the joint portion between the heat exchanger 1 and the evaporator 14 is large, so that the airtightness is high, the strength and strength are increased. Seismic resistance can be improved and reliability can be improved.
Further, in the conventional cooling device, at least a part of the evaporator passage 15 is manufactured by bending a pipe or connecting a plurality of members, so that both ends of the evaporator passage 15 are heated. It was very difficult to accurately position and attach to the two-phase fluid inlet 6 and intermediate liquid inlet 8 of the exchanger 1 (precisely specify the length and bending angle of each part). However, in the cooling device according to the first embodiment, the block-shaped evaporator 14 is joined to the heat exchanger 1 on the surface, and the two-phase fluid inlet 6 and the intermediate liquid inlet 8 and the evaporator 14 of the heat exchanger 1 are joined. Since the two-phase fluid inlet 42 and the intermediate liquid inlet 41 are arranged so as to face each other, the mounting positions of the two-phase fluid inlet 42 and the intermediate liquid inlet 41 can be accurately defined and formed, and the production becomes very easy. Further, in order to increase the thermal contact area and improve the heat dissipation characteristics, even when the evaporator passage 15 is configured as a plurality of parallel passages, the joints do not increase and it can be easily manufactured. it can. Further, since the heating flow path 15a and the non-heating flow path 15b of the evaporator passage 15 can be arranged adjacent to each other, the cooling device can be miniaturized.
The heat exchanger 1 does not have to be a cylindrical container as shown in FIG. 1, and may be a cube or a rectangular parallelepiped. Further, the central axis of the shape of the heat exchanger 1 and the central axis of the shape of the evaporator 14 in the cross section shown in FIG. 1B may be offset from each other. By the offset arrangement, a large space can be created on the lower side of the heat exchanger 1 and on the side surface side of the evaporator 14, and the heating element 16 can be accommodated in the space without waste, and the cooling device can be provided. It can be miniaturized. Further, if the accommodating portion 3 is a cylindrical container and the offset arrangement is performed, the gas-liquid two-phase fluid fed from the two-phase fluid inlet 6 moves along the inner wall surface of the cylindrical accommodating portion 3. Since a centrifugal force larger than that of steam acts on the high-temperature circulating fluid 11b, the high-temperature circulating fluid 11b moves along the inner wall surface of the accommodating portion 3, and the vapor moves to the center of the accommodating portion 3. Therefore, the separation of the high-temperature circulating fluid 11b and the steam 11a is promoted, so that the outer wall of the heat exchanger passage 9 is more easily in contact with the steam 11a, and the heat exchange characteristics in the heat exchanger passage 9 are improved. To do. Further, since the high-speed gas-liquid two-phase fluid fed from the two-phase fluid inlet 6 is less likely to collide with the heat exchanger through-passage 9, the corrosion resistance of the heat exchanger through-passage 9 is improved. , Strength and seismic resistance are improved. Therefore, the heat exchanger passage 9 having a smaller diameter can be used, the area of the heat exchanger passage 9 can be expanded to improve the heat exchange characteristics, and the heat exchanger passage 9 can be used. It is also possible to make the wall thinner and lighter.
The heat exchanger passage 9 may be a plurality of pipes as shown in FIG. 1, may be a configuration in which a plurality of passages are aggregated, and a part of the heat exchanger passage 9 and the wall of the accommodating portion 3 may be formed. And may be integrated. Further, in FIG. 1, the heat exchanger flow path 9 is shown as a linear flow path, but it may be a U-shaped, meandering, or spiral flow path. Further, it is preferable to improve the heat exchange characteristics by attaching a protrusion such as a fin or a turbulent flow promoter to the outer wall or the inner wall of the heat exchanger flow path 9. The heat exchanger flow path 9 may be a circular tube, an elliptical tube, a rectangular tube, a flat tube, a structure in which a part of the circular tube is recessed, a corrugated tube, or the like.
2 to 6 are cross-sectional views showing another configuration of the cooling device according to the first embodiment of the present invention. FIG. 2 (b) is a cross-sectional view of the AA cross section shown in FIG. 2 (a), and FIG. 2 (c) is a cross-sectional view of the BB cross section shown in FIG. 2 (a). 3 (b) is a cross-sectional view of the AA cross section shown in FIG. 3 (a), FIG. 4 (b) is a cross-sectional view of the AA cross section shown in FIG. 4 (a), and FIG. 5 (b) is a view. It is sectional drawing in the AA cross section shown in 5 (a). Further, FIG. 6 (b) is a cross-sectional view of the AA cross section shown in FIG. 6 (a), and FIG. 6 (c) is a cross-sectional view of the BB cross section shown in FIG. 6 (a). Further, FIG. 7 is a cross-sectional view of the heat exchanger flow path according to the first embodiment of the present invention.
First, the cooling device according to the first embodiment of the present invention shown in FIG. 2 will be described. In the cooling device shown in FIG. 1, the accommodating portion 3 has a heat exchanger high-temperature liquid outlet 7 on the lower surface to which the radiator passage 19 of the radiator 18 is connected. In the cooling device shown in FIG. 2, the accommodating portion 3 has a heat exchanger high-temperature liquid outlet 7 at a joint with the evaporator 14. Further, the evaporator 14 has an evaporator high-temperature liquid inlet 44 to which the radiator passage 19 of the radiator 18 is connected on the side surface, and the heat exchanger high-temperature liquid outlet 44 is connected to the heat exchanger 1. It has an evaporator high-temperature liquid inlet 43 that faces the 7 and feeds the circulating liquid from the accommodating portion 3, and also has a high-temperature liquid that communicates the evaporator high-temperature liquid inlet 43 and the evaporator high-temperature liquid inlet 44 inside. It has a flow path 47. The high-temperature circulating liquid 11b housed in the accommodating portion 3 is sent to the high-temperature liquid flow path 47 via the heat exchanger high-temperature liquid inlet 7 and the evaporator high-temperature liquid inlet 43, and is fed to the high-temperature liquid flow path 47 through the evaporator high-temperature liquid inlet It is sent to the radiator 18 through 44.
Therefore, in the cooling device shown in FIG. 2, the number of connection points generated at the bend in the middle of the radiator passage 19 can be reduced, and the heat exchanger 1 and the evaporator 14 can be used as compared with the cooling device shown in FIG. The area of the joint can be further increased, the strength and earthquake resistance are further improved, and the reliability is improved. Further, in the cooling device shown in FIG. 1, the surface on which the heat exchanger low temperature liquid inlet 5 is arranged and the surface on which the heat exchanger high temperature liquid inlet 7 is arranged are orthogonal to each other, and the radiator passage 19 It was difficult to accurately position and attach both ends of the. However, in the cooling device shown in FIG. 2, since the surface on which the heat exchanger low temperature liquid inlet 5 is arranged and the surface on which the evaporator high temperature liquid inlet 44 is arranged are parallel, the radiator passage 19 Both ends can be easily attached. The high-temperature liquid flow path 47 can be made into a plurality of small-diameter flow paths, and the evaporator 14 can be made smaller and lighter without increasing the number of connecting portions.
Further, the cooling device has a structure in which the residual gas initially present, the residual gas contained in the enclosed circulating liquid, or the gas initially generated from the wetted portion in the apparatus is accumulated in the upper part of the accommodating portion 3. Is. Therefore, in FIG. 2, a tubular sealing port 13 is provided above the accommodating portion 3 so as to communicate with the surrounding space. The cooling device is evacuated from the sealing port 13, an appropriate amount of circulating fluid is sealed, and then degassed and sealed after a temporary operation to reduce the amount of non-condensable gas inside and improve heat dissipation characteristics. , Can be operated stably. Further, since each of the steps of vacuum exhaust, liquid filling, and residual gas discharge can be carried out by one port, the above steps can be carried out without increasing the number of parts. By attaching a connecting pipe having a large number of openings to this sealing port 13 and using it as an airtightness check port, a vacuum exhaust port, a circulating fluid filling port, a degassing port, etc., workability is greatly improved. To improve. Even if the sealing port 13 is provided in the cooling device shown in FIG. 1, the same effect can be naturally obtained. Further, since the structure is such that the non-condensable gas easily accumulates in the upper part of the accommodating portion 3, the heat exchanger passage 9 may not be provided in the upper part of the accommodating portion 3 and may be used as a space for accumulating the non-condensable gas.
Further, in the cooling device shown in FIG. 2, an auxiliary radiator 22 for discharging the heat of the heating element 16 is arranged on the surface of the evaporator 14 opposite to the surface on which the heating element 16 is arranged. Since this cooling device does not operate unless the circulating fluid is boiled in the evaporator passage 15, if the calorific value of the heating element 16 does not reach the calorific value for boiling the circulating fluid (during low heat generation), the cooling device does not operate. This cooling device does not operate, and the temperature of the heating element 16 becomes higher than when the calorific value of the heating element 16 is the amount of heat for boiling the circulating fluid (during high heat generation). Therefore, when the heat generation is low, the amount of heat that needs to be released is relatively small. Therefore, by providing the auxiliary radiator 22 on the surface of the evaporator 14 opposite to the surface on which the heating element 16 is arranged, the heating element 16 is provided. Can properly dissipate the heat of. In FIG. 2, unlike FIG. 1, the position of the heat exchanger low temperature liquid inlet 5 is provided above the central axis of the heat exchanger 1. Therefore, a larger radiator 18 can be provided, and the heat dissipation characteristics can be further improved. Other configurations and functions are the same as those of the cooling device shown in FIG.
Next, the cooling device according to the first embodiment of the present invention shown in FIG. 3 will be described. In the cooling device shown in FIG. 2, the outer shape of the heat exchanger 1 is a cylinder, but in the cooling device shown in FIG. 3, the outer shape of the heat exchanger 1 is a rectangular parallelepiped (the cross-sectional shape is rectangular). Further, the cooling device shown in FIG. 3 does not have the sealing port 13 and the auxiliary radiator 22. Since the outer shape of the heat exchanger 1 is a rectangular body, the heat exchange area (for example, the number) of the heat exchanger flow path 9 per unit volume can be made larger than that of the columnar heat exchanger 1. The heat exchange characteristics via the flow path 9 can be improved, and the heat dissipation characteristics of the cooling device can be improved. Further, as shown in FIG. 3 (b), since the center line of the evaporator 14 and the center line of the heat exchanger 1 are offset and arranged, the evaporator 1 is located below the heat exchanger 1. A large space can be created on the side surface side of the 14, the heating element 16 can be accommodated in the space without waste, and the cooling device can be miniaturized. Other configurations and functions are similar to those of the cooling device shown in FIG.
The cooling device according to the first embodiment of the present invention shown in FIG. 4 will be described. In the cooling device shown in FIG. 2, a straight tubular heat exchanger passage 9 connecting the inlet header 2 and the outlet header 4 is arranged in the accommodating portion 3. In the cooling device shown in FIG. 4, an inlet header 2 is arranged above one side surface of the accommodating portion 3, and an outlet header 4 is arranged below, and a U-shaped heat exchanger connecting the inlet header 2 and the outlet header 4 is provided. The flow path 9 is arranged in the accommodating portion 3. Therefore, the cooling device can be miniaturized, and the outer container of the heat exchanger 1 is molded, and an insert (partition between the inlet header 2 and the accommodating portion 3 and the outlet header 4) is inserted into the outer container. By charging a plate and a heat exchanger (passageway 9, etc.), the production becomes easier and the airtightness is improved.
Further, the radiator 18 has a radiator passage 19 as a parallel passage 19c composed of a plurality of flat tubes, and has a plurality of fins 20 for dissipating heat between the plurality of parallel passages 19c. .. Further, the radiator 18 includes a diversion header 19a for shunting the circulating fluid upstream of the plurality of parallel passages 19c and a merging header 19b for merging the circulating fluid downstream of the plurality of parallel passages 19c. And have. The circulating fluid sent out from the evaporator 14 flows through the diversion header 19a, the parallel flow path 19c, and the merging header 19b in this order, and is sent to the inlet header 2 of the heat exchanger 1. The heat radiator 18 shown in FIG. 4 has a lower pressure loss and improved heat dissipation characteristics as compared with the heat radiator 18 shown in FIG. Therefore, it can be miniaturized. Further, the portion of the radiator 18 in which the fin 20 is not provided as shown in FIG. 2 does not contribute much to heat dissipation, and air flows only in this portion (bypass flow occurs), resulting in poor heat dissipation characteristics. Therefore, it is necessary to devise to prevent bypass flow. In the radiator 18 shown in FIG. 4, there is no space where a bypass flow is generated, and the heat dissipation characteristics are improved. Further, since the evaporator 14 is provided with heating elements 16 on both side surfaces, more heating elements 16 can be mounted. Other configurations and functions are similar to those of the cooling device shown in FIG.
The cooling device according to the first embodiment of the present invention shown in FIG. 5 will be described. In FIG. 5, the inlet header 2 has a heat exchanger low-temperature liquid inlet 5 at the joint with the evaporator 14, and the evaporator 14 has a radiator passage 19 of the radiator 18 connected to the lower surface thereof. It has an evaporator low temperature liquid inlet 45 and an evaporator high temperature liquid inlet 44. Further, the evaporator 14 has an evaporator low temperature liquid inlet 46 facing the heat exchanger low temperature liquid inlet 5 at a joint with the heat exchanger 1, and also has an evaporator low temperature liquid inlet 45 and an evaporator low temperature. It has a low-temperature liquid flow path 48 that communicates with the liquid outlet 46. The circulating liquid sent from the radiator 18 flows through the evaporator low temperature liquid inlet 45, the low temperature liquid passage 48, the evaporator low temperature liquid inlet 46, and the heat exchanger low temperature liquid inlet 5 in this order to the inlet header 2. Will be sent. Other configurations and functions are similar to those of the cooling device shown in FIG.
In the cooling device shown in FIG. 5, the inlet header 2 has a heat exchanger low-temperature liquid inlet 5 at the joint with the evaporator 14, and the heat exchanger low-temperature liquid feed at the joint with the heat exchanger 1. Having the evaporator low temperature liquid outlet 46 facing the inlet 5, the area of the junction between the heat exchanger 1 and the evaporator 14 can be further increased, further improving strength and seismic resistance, and reliability. Is improved. Further, since the evaporator low temperature liquid inlet 45 and the evaporator high temperature liquid inlet 44 are arranged on the same surface, both ends of the radiator passage 19 can be easily attached. Further, in the cooling device shown in FIG. 5, the heat exchanger through-passage 9 is not provided in the vicinity of the two-phase fluid inlet 6, but is arranged above the accommodating portion 3. Therefore, after the high-temperature circulating fluid 11b fed from the two-phase fluid inlet 6 is decelerated, it collides with the inner wall of the accommodating portion 3 or the outer wall of the heat exchanger passage 9 and thus is resistant to the heat exchanger 1. Corrosion, strength and seismic resistance can be improved. Further, since the pressure loss at the two-phase fluid inlet 6 is reduced and the flow rate of the circulating liquid flowing through the circulation flow path is increased, the heat dissipation characteristics of the cooling device can be improved.
The cooling device according to the first embodiment of the present invention shown in FIG. 6 will be described. In FIG. 6, a plate-shaped radiator 18 having one meandering radiator passage 19 provided inside and fins 20 provided outside is provided, and a circulating fluid flowing through the radiator passage 19 is provided. The surface parallel to the flow direction of the above and the surface parallel to the flow direction of the circulating liquid flowing through the evaporator passage 15 are configured to be orthogonal to each other. Therefore, the height of the cooling device can be made smaller than that of the cooling device shown in FIG. Further, as shown in FIG. 6, the sealing port 13 may be arranged so as to communicate the inside and the periphery of the accommodating portion 3 via the inlet header 2. Further, in the cooling device shown in FIG. 6, the heat exchanger passage 9 is arranged below except for the upper part of the accommodating portion 3. Therefore, the upper part of the accommodating portion 3 functions as a non-condensable gas reservoir, the influence of the non-condensable gas is reduced, and the allowable amount of non-condensed gas is increased. Other configurations and functions are similar to those of the cooling device shown in FIG.
The heat exchanger passage 9 of the cooling device according to the first embodiment of the present invention shown in FIG. 7 will be described. The heat exchanger passage 9 shown in FIG. 7 (a) is a straight pipe, and when a plurality of heat exchanger passages 9 are provided adjacent to each other, condensation is formed on the outside of the heat exchanger passage 9. The liquids 11c are connected and a bridge of the condensate 11c is formed around the heat exchanger flow path 9 to prevent the movement of the vapor 11a. Therefore, the heat exchange area in contact between the steam 11a and the heat exchanger flow path 9 becomes small, and the heat exchange characteristics deteriorate. Since the heat exchanger passage 9 shown in FIG. 7B has a recess 23 on the outer wall, the gap between the heat exchanger passages 9 becomes non-uniform, and the large portion of this gap is filled with the condensate 11c. Is easy to flow down. Therefore, it becomes difficult to form a bridge of the condensate 11c around the heat exchanger flow path 9, the heat exchange area is not reduced, and the heat exchange characteristics are not deteriorated. Therefore, it is effective to provide the recess 23 when the heat exchanger passage 9 is provided adjacent to each other.
Embodiment 2. FIG. 8 is a cross-sectional view showing the configuration of the cooling device according to the second embodiment of the present invention, and FIG. 8 (b) is a cross-sectional view of the AA cross section shown in FIG. 8 (a). In the cooling device according to the second embodiment, the heat exchanger heat exchanger 21 is provided in the heat exchanger 1 separately from the radiator 18 to improve the heat dissipation characteristics of the cooling device, and the amount of heat generated by the heating element 16 is increased. Even if it is small, it is configured so that it can dissipate heat stably. In FIG. 8, the heat exchanger heat dissipation unit 21 includes a fin 24 provided around the outside of the accommodating unit 3, a heat exchanger cooling flow path 25 provided between the fins 24, and a heat exchanger cooling flow. It has a fan 26 that transfers the cooling fluid to the passage 25. Therefore, a part of the heat applied from the heating element 16 can be dissipated, and the heat dissipation characteristics of the cooling device are further improved. Air or liquid is used as the cooling fluid, and when liquid is used as the cooling fluid, a pump may be installed in place of the fan 26. In FIG. 8, the fan 26 (or pump) is installed upstream of the cooling flow path, but it may be installed downstream. When the cooling device is installed on a moving body such as a vehicle, the running wind may be used without installing the fan 26 or the pump. Other configurations and functions are similar to those of the cooling device shown in FIG.
In this cooling device, when the calorific value of the heating element 16 does not reach the calorific value for boiling the circulating fluid (during low heat generation), the circulating fluid does not circulate in the circulation flow path. Further, even when the high-temperature circulating liquid 11b circulates between the plurality of heating flow paths 15a (movement of the circulating liquid occurs only in the adjacent heating flow paths 15a), the circulating liquid does not circulate in the circulation flow path. However, in any of the above cases, the high-temperature circulating fluid 11b and the vapor in the evaporator passage 15 always flow into the accommodating portion 3, and therefore heat is applied to the accommodating portion 3 as in the cooling device shown in the second embodiment. By providing the exchanger heat radiating unit 21, the heat applied from the heating element 16 can be radiated to the surroundings. Further, by providing the heat exchanger heat exchanger 21 in the accommodating portion 3, it is possible to suppress an increase in the saturation pressure in the accommodating portion 3, so that the saturation temperature corresponding to this saturation pressure and the heating flow path in the evaporator 14 are provided. The difference from the temperature of the wall surface of 15a becomes large, the high-temperature circulating liquid 11b housed in the heating flow path 15a tends to boil, and the circulating liquid easily circulates in the circulation flow path. In the cooling device shown in FIG. 8, the fins 24 of the heat exchanger heat dissipation section 21 are provided around the accommodating section 3, but may also be provided in the inlet header 2 and the outlet header 4. Further, the heat exchanger heat radiating unit 21 is not particularly limited in shape, size, structure, etc., as long as the heat applied from the wall of the heat exchanger 1 can be radiated to the cooling fluid.
FIG. 9 is a cross-sectional view showing another configuration of the cooling device according to the second embodiment of the present invention, and FIG. 9 (b) is a cross-sectional view of the AA cross section shown in FIG. 9 (a). In the cooling device shown in FIG. 9, a heat exchanger cooling flow path 25 is provided in the central portion of the accommodating portion 3, and a plurality of heat exchanger through passages 9 are provided in the outer peripheral portion of the accommodating portion 3. The same effect as that of the cooling device shown in FIG. 8 can be obtained in the cooling device shown in FIG.
Embodiment 3. FIG. 10 is a cross-sectional view showing the configuration of the cooling device according to the third embodiment of the present invention. 10 (b) is a cross-sectional view of the AA cross section shown in FIG. 10 (a), and FIG. 10 (c) is a cross-sectional view of the BB cross section shown in FIG. 10 (a).
The cooling device according to the third embodiment has improved resistance to changes in body force (attractive force such as gravity and centrifugal force) when mounted on a moving body such as a vehicle. Specifically, for example, as the moving body accelerates and decelerates, the gas-liquid interface formed by the high-temperature circulating liquid 11b and the vapor 11a in the accommodating portion 3 is not horizontal, and the heat exchanger high-temperature liquid outlet 7 Even if the gas-liquid interface on the mounting part side becomes high or low and the high-temperature circulating liquid 11b in the housing part 3 does not come into contact with the heat exchanger high-temperature liquid outlet 7. It enables the high-temperature circulating fluid 11b to be sent from 3 to the radiator 18.
In FIG. 10, the evaporator 14 is provided with a circulating fluid holding portion 27 for holding a high-temperature circulating fluid 11b recessed from the joint surface at the joint portion with the heat exchanger 1 at the upper portion, and the circulating fluid holding portion 27 is provided. An evaporator high temperature liquid inlet 43 and a two-phase fluid inlet 42 are provided on the bottom surface of 27. Further, the heat exchanger 1 has an opening 12 at the joint with the evaporator 14 facing the circulating liquid holding portion 27 and integrating the two-phase fluid inlet 6 and the heat exchanger high-temperature liquid inlet 7. are doing. Therefore, the height from the evaporator high-temperature liquid inlet 43 to the gas-liquid interface in the accommodating portion 3 can be further increased without increasing the accommodating capacity of the high-temperature circulating liquid 11b in the accommodating portion 3. Therefore, the gas-liquid interface changes as the moving body decelerates, accelerates, and bends, and the high-temperature circulating liquid 11b in the accommodating portion 3 does not come into contact with the heat exchanger high-temperature liquid outlet 7 (opening 12). Even in this case, the high-temperature circulating liquid 11b can be sent from the evaporator high-temperature liquid inlet 43 to the radiator 18 via the evaporator high-temperature liquid flow path 47 and the evaporator high-temperature liquid inlet 44, and the circulating fluid 11b can be operated stably. Can be done. Other configurations and functions are similar to the cooling device shown in FIG.
11 to 13 are cross-sectional views showing another configuration of the cooling device according to the third embodiment of the present invention. 11 (b) is a cross-sectional view taken along the AA cross section shown in FIG. 11 (a), and FIG. 12 (b) is a cross-sectional view taken along the AA cross section shown in FIG. 12 (a). Further, FIG. 13 (b) is a cross-sectional view of the AA cross section shown in FIG. 13 (a), and FIG. 13 (c) is a cross-sectional view of the BB cross section shown in FIG. 13 (a).
The cooling device shown in FIGS. 11 to 13 has a configuration in which it operates stably even when there is a larger change in the gas-liquid interface than the cooling device shown in FIG. A bypass flow path 28 that communicates the end opposite to the end provided with the liquid outlet 7 with the radiator flow path 19 of the radiator 18 or the high temperature liquid flow path 47 of the evaporator 14. Is.
In FIG. 11, the end of the heat exchanger high temperature liquid outlet 7 is located below the accommodating portion 3 and is opposite to the end of the heat exchanger high temperature liquid outlet 7. A bypass flow path 28 composed of an L-shaped pipe is arranged in the lower part of the accommodating portion 3 and in the radiator flow path 19 so as to communicate with each other through 7. Since the end of the bypass flow path 28 in the accommodating portion 3 is arranged at the end opposite to the end where the heat exchanger high temperature liquid outlet 7 is provided, the high temperature circulation in the accommodating portion 3 Even when the liquid 11b does not come into contact with the heat exchanger high-temperature liquid outlet 7, the high-temperature circulating liquid 11b can be sent out to the radiator through-passage 19. Further, since the bypass flow path 28 does not project to the outside of the cooling device, an external force acts on the bypass flow path 28 so that the connection portion does not break, and the strength, earthquake resistance and airtightness are improved, and the reliability is improved. Other configurations and functions are similar to the cooling device shown in FIG.
In FIG. 12, the intermediate liquid outlet 8 and the intermediate liquid are connected to the end opposite to the end where the heat exchanger high temperature liquid outlet 7 is provided below the accommodating portion 3 and the high temperature fluid flow path 47. A bypass flow path 28 is arranged in the non-heating flow path 15b so as to communicate with the inlet 41. Other configurations and functions are similar to the cooling device shown in FIG. The same effect as that of the cooling device shown in FIG. 11 can be obtained in the cooling device shown in FIG.
In FIG. 13, in the evaporator 14 other than the evaporator communication flow path 15 and the high temperature liquid flow path 47, the end opposite to the end portion below the accommodating portion 3 where the heat exchanger high temperature liquid outlet 7 is provided. An L-shaped bypass flow path 28 is arranged so as to communicate the end on the side and the high temperature fluid flow path. Other configurations and functions are similar to the cooling device shown in FIG. The same effect as that of the cooling device shown in FIG. 11 can be obtained in the cooling device shown in FIG. In the cooling devices shown in FIGS. 12 and 13, the end of the heat exchanger 18 is located below the accommodating portion 3 and is opposite to the end where the heat exchanger high temperature liquid outlet 7 is provided. The bypass flow path 28 may be arranged so as to communicate with the flow path 19.
Embodiment 4. FIG. 14 is a diagram showing a configuration of a cooling device according to a fourth embodiment of the present invention. 14 (a) is a top view showing the configuration of the cooling device according to the fourth embodiment of the present invention, and FIG. 14 (b) is a cross-sectional view of the CC cross section shown in FIG. 14 (a). (c) is a cross-sectional view of the AA cross section shown in FIG. 14 (b).
The cooling device according to the fourth embodiment is for separating the installation environment between the high temperature section 29 mainly equipped with the heat exchanger 1, the evaporator 14 and the heating element 16 and the low temperature section 30 mainly equipped with the radiator 18. The partition plate 31 is provided between the high temperature portion 29 and the low temperature portion 30. The high temperature portion 29 preferably has a waterproof and dustproof structure when the heating element 16 is an electronic device, while the low temperature portion 30 preferably has a cooling fluid easily flowing through the radiator 18. The partition plate 31 has a function of fulfilling at least one of the waterproof, dustproof, and cooling fluid flow paths, and when a waterproof and dustproof structure is required, the housing 32 that accommodates the high temperature portion 29. As part of this, when low temperature cooling fluid flow is required, it is used as part of the side wall of the radiator cooling flow path 33 that houses the low temperature section 30.
In FIG. 14, a housing 32 for accommodating the high temperature portion 29 is provided, and a radiator cooling flow path 33 for accommodating the low temperature portion 30 and guiding the cooling fluid to the radiator 18 is provided. The partition plate 31 provided between the high temperature portion 29 and the low temperature portion 30 forms a side wall of the housing 32 and a side wall of the radiator cooling flow path 33. The radiator passage 19 penetrates the partition plate 31 and connects the radiator 18 with the low temperature liquid inlet 5 of the heat exchanger 1 and the evaporator high temperature liquid inlet 44 of the evaporator 14. Other configurations and functions are the same as those of the cooling device shown in FIG. Even if an O-ring or gasket is provided on the joint surface between the side wall of the radiator cooling flow path 33 of the high temperature portion 29 or the radiator cooling flow path 33 of the low temperature portion 30 and the partition plate 31, it may be fixed with an adhesive or the like. good.
If the radiator cooling flow path 33 is not formed, the cooling fluid escapes to a space where there is no pressure loss. However, in the cooling device shown in FIG. 14, since the radiator cooling flow path 33 is formed so that the cooling fluid flows between the fins 20 of the radiator 18, stable heat dissipation can be achieved. Further, since the housing 32 for accommodating the high temperature portion 29 is provided, the waterproof and dustproof structure of the high temperature portion 29 can be formed. Further, since the partition plate 31 constitutes the side wall of the housing 32 and the side wall of the radiator cooling flow path 33, the manufacturing cost can be reduced. Further, since the radiator 18 is attached to the radiator cooling flow path 33, the strength and seismic resistance of the cooling device are improved, and the reliability is improved. Further, if the radiator cooling flow path 33 is configured so that the cooling fluid can flow in a direction inclined with respect to the vertical direction or the horizontal direction, the cooling fluid naturally rises due to the chimney effect, and even if a fan or the like is not provided. It can dissipate heat.
15 to 17 are a top view and a cross-sectional view showing another configuration of the cooling device according to the fourth embodiment of the present invention. FIG. 15 (a) is a top view showing the configuration of the cooling device according to the fourth embodiment of the present invention, and FIG. 15 (b) is a cross-sectional view of the CC cross section shown in FIG. 15 (a). (c) is a cross-sectional view of the AA cross section shown in FIG. 15 (b). 16 (b) is a cross-sectional view taken along the AA cross section shown in FIG. 16 (a), and FIG. 17 (b) is a cross-sectional view taken along the AA cross section shown in FIG. 17 (a).
In FIG. 15, a partition plate 31 is provided so as to cover the opening 34 provided in a part of the side wall of the radiator cooling flow path 33. The same effect as that of the cooling device shown in FIG. 14 can be obtained in the cooling device shown in FIG. A plurality of openings 34 may be provided on the side wall of the radiator cooling flow path 33, and a plurality of high temperature portions 29 may be mounted. Further, in FIG. 15, the radiator 18 is attached to the radiator cooling flow path 33 via the attachment portion 35 provided at the end of the radiator 18. Therefore, similarly to the cooling device shown in FIG. 14, the radiator 18 is supported, the strength and seismic resistance of the cooling device are improved, and the reliability is improved. In the cooling device shown in FIG. 15, a baffle plate 36 is provided to cover the gap between the radiator 18 and the radiator cooling flow path 33, which is generated by providing the mounting portion 35. The baffle plate 36 may be provided on either the upstream side or the downstream side of the cooling fluid of the radiator 18. The baffle plate 36 is not limited to closing the gap due to the provision of the mounting portion 35, and is used, for example, to close the gap between the radiator 18 and the radiator cooling flow path 33 caused by the dimensional tolerance. Is also good. Other configurations and functions are the same as those of the cooling device shown in FIG.
In FIG. 16, the entrance header 2 and the partition plate 31 are joined and arranged, and the partition plate 31 forms a part of the side wall of the entrance header 2. Other configurations and functions are the same as those of the cooling device shown in FIG. The same effect as that of the cooling device shown in FIG. 14 can be obtained, and heat is transferred from the heat exchanger 1 to the radiator 18 via the partition plate 31 by heat conduction, so that the heat dissipation characteristics of the cooling device are further improved. Moreover, since the number of parts is reduced, the manufacturability is improved.
In FIG. 17, the evaporator 14 and the partition plate 31 are joined and arranged. Other configurations and functions are the same as those of the cooling device shown in FIG. The same effect as that of the cooling device shown in FIG. 16 can be obtained, and heat is transferred from the evaporator 14 to the radiator 18 via the partition plate 31 by heat conduction, so that the heat dissipation characteristics of the cooling device are further improved. In addition, the partition plate 31 functions as a reinforcing material for the heat exchanger 1 and the evaporator 14, and since there is no pipe between the radiator 18 and the heat exchanger 1 or the evaporator 14, the strength of the cooling device and the earthquake resistance Improves reliability and improves reliability.
As shown in FIGS. 16 and 17, the heat generation amount of the heating element 16 is transiently generated by joining the radiator 18 and the evaporator 14 so that heat is transferred via the partition plate 31 and the heat exchanger 1. The effect on the change is mitigated, and the temperature overshoot of the heating element 16 at the start of boiling of the circulating fluid (when the circulating fluid is not boiling, the heat transfer in the heating flow path 15a is poor and the temperature of the heating element 16 becomes higher. However, with the start of boiling, the heat transfer in the heating flow path 15a is improved and the temperature of the heating element 16 is lowered. The temperature difference at this time) can be reduced. Further, when the heating element 16 starts to generate heat when the circulating fluid in the cooling device is frozen, heat is easily transferred from the heating element 16 to the radiator 18 due to heat conduction, so that the heat is easily transferred from the heating element 16 to the radiator 18 in the radiator passage 19. The frozen circulating fluid melts, allowing the circulating fluid to move faster, improving the operating characteristics when the circulating fluid freezes.
FIG. 18 is a diagram showing the temperature of the heat transfer surface of the evaporator with respect to the calorific value of the heating element of the cooling device according to the fourth embodiment of the present invention. In FIG. 18, the Δ mark is the result of the experiment using the cooling device shown in FIG. 16, and the mark is the result of the experiment using the cooling device shown in FIG.
The temperature of the heat transfer surface of the evaporator on the vertical axis shown in FIG. 18 is the temperature of the metal portion between the heating flow path 15a and the surface of the evaporator 14, and the higher the temperature, the higher the temperature of the heating element 16. Therefore, the evaporator heat transfer surface temperature should be lower. As can be seen from FIG. 18, the temperature of the evaporator heat transfer surface of the cooling device shown in FIG. 16 and the temperature of the evaporator heat transfer surface of the cooling device shown in FIG. 17 are significantly different from each other in the calorific value of 300 W to 800 W, and are shown in FIG. The cooling device has a lower temperature on the heat transfer surface of the evaporator and has better heat dissipation characteristics as a water cooling device. Further, at any calorific value, the heat transfer surface temperature of the evaporator is about 3 to 5 K lower in the cooling device shown in FIG. 17, and from this point as well, the cooling device shown in FIG. 17 has better heat dissipation characteristics. The reason for this is that since the evaporator 14 and the radiator 18 are connected, the cooling effect is improved by making the configuration so that more heat can be transferred from the evaporator 14 to the radiator 18 by heat conduction. Since the circulating fluid in the inlet header 2 and the accommodating portion 3 is cooled by this structural change, the temperature of the steam 11a in the accommodating portion 3 becomes low, and the temperature (saturation temperature) of the heating flow path 15a wall and the steam 11a is increased. The difference has become large and it has become easier to boil.
Embodiment 5. FIG. 19 is a cross-sectional view showing the configuration of the cooling device according to the fifth embodiment of the present invention. FIG. 19 (b) is a cross-sectional view of the AA cross section shown in FIG. 19 (a). The cooling device according to the fifth embodiment is provided between the evaporator passage 15 and the high temperature liquid flow path 47, between the high temperature liquid flow path 47 and the low temperature liquid flow path 48, and between the heating flow path 15a and the non-heating flow path. A heat insulating portion 37 is provided between the 15b and the heat insulating portion 37. Therefore, heat transfer from the heated flow path 15a to the non-heated flow path 15b, from the heating flow path 15a to the high temperature liquid flow path 47, and from the high temperature liquid flow path 47 to the low temperature liquid flow path 48 can be suppressed, and the high temperature liquid flow can be suppressed. A force that can suppress boiling of the circulating liquid in the passage 47, the low-temperature liquid flow path 48, and the non-heating flow path 15b, and tends to move the circulating liquid in the circulation direction in the direction opposite to the circulation direction ( Buoyancy) can be suppressed. Other configurations and functions are the same as those of the cooling device shown in FIG. The heat insulating portion 37 is provided between the evaporator flow path 15 and the high temperature liquid flow path 47, between the high temperature liquid flow path 47 and the low temperature liquid flow path 48, and between the heating flow path 15a and the non-heating flow path 15b. You may just have it in either.
In FIG. 19, the heat insulating portion 37 is a linear groove formed so as to penetrate the evaporation portion 14, but the heat insulating portion 37 is not particularly limited to this structure. The heat insulating portion 37 may be a groove that does not penetrate, a hole with a cut end, or a heat insulating material such as resin embedded in the heat insulating portion 37, and may have a shape, size, structure, or material that hinders heat conduction between each flow path. Just do it.
Embodiment 6. FIG. 20 is a cross-sectional view showing the configuration of the cooling device according to the sixth embodiment of the present invention. FIG. 20 (b) is a cross-sectional view of the AA cross section shown in FIG. 20 (a).
In the cooling device according to the sixth embodiment, when a plurality of heating elements 16 are provided in the evaporator 14 and the amount of heat generated from each heating element 16 is different, the amount of heat generated is weaker than that of the other heating elements 16. It suppresses the movement of the circulating fluid to the heating flow path 15a adjacent to the body 16b.
In FIG. 20, a strong heating element 16a having a large calorific value and a weak heating element 16b having a small calorific value are attached to the evaporator 14 and obstruct the flow of circulating fluid in the heating flow path 15a adjacent to the weak heating element 16b. The flow inhibitor 38 is provided. When the calorific value is so small that the weak heating element 16b cannot boil the circulating fluid in the heating flow path 15a, if the flow inhibitor 38 is not provided, the circulating fluid will move from the accommodating portion 3 to the two-phase fluid inlet 6. After flowing into the heating flow path 15a adjacent to the weak heating element 16b via the diversion header 15c, it is sent to the heating flow path 15a adjacent to the strong heating element 16a via the diversion header 15c, and the temperature is raised to boil. A short path is generated that returns to the accommodating portion 3 as a phase fluid. Therefore, since the circulating liquid does not circulate in the circulation flow path, heat cannot be dissipated from the radiator 18 to the surroundings, and the heat dissipation characteristics are significantly deteriorated. Therefore, by providing the flow inhibitor 38 in the heating flow path 15a adjacent to the weak heating element 16b, a short path of the circulating fluid does not occur, proper operation is ensured, and heat can be dissipated efficiently. Other configurations and functions are the same as those of the cooling device shown in FIG.
The flow inhibitor 38 may be a plug that obstructs the flow of circulating fluid, and may be a plug that does not allow passage at all. The plug is provided with a hole having a smaller flow cross-sectional area than the heating flow path 15a. It may be a wire mesh, a sintered metal, a foamed metal, a non-woven fabric, or the like.
21 and 22 are cross-sectional views showing another configuration of the cooling device according to the sixth embodiment of the present invention. 21 (b) is a cross-sectional view of the AA cross section shown in FIG. 21 (a), and FIG. 22 (b) is a cross-sectional view of the AA cross section shown in FIG. 22 (a). In FIG. 21, a strong heating element 16a having a large calorific value and a weak heating element 16b having a small calorific value are attached to the evaporator 14, and the outlet of the heating flow path 15a adjacent to the weak heating element 16b (two-phase fluid delivery port 42). ) Is provided with a flow inhibitor 38. Therefore, the same effect as that of the cooling device shown in FIG. 20 can be obtained. Other configurations and functions are the same as those of the cooling device shown in FIG. In FIG. 21, the flow inhibitor 38 is provided at the outlet of the heating channel 15a adjacent to the weak heating element 16b, but may be provided at the inlet of the heating channel 15a adjacent to the weak heating element 16b. Although the flow inhibitor 38 is provided in each heating flow path 15a in FIG. 20, an integrated flow inhibitor 38 may be provided as shown in FIG. 21.
In FIG. 22, a strong heating element 16a having a large calorific value and a weak heating element 16b having a small calorific value are attached to the evaporator 14, and a heating flow path 15a is provided in the vicinity of the strong heating element 16a to form a weak heating element 16b. No heating channel 15a is provided in the vicinity. That is, a heating flow path 15a is provided adjacent to the strong heating element 16a. Therefore, the same effect as that of the cooling device shown in FIG. 20 can be obtained. Further, it is not necessary to provide the flow inhibitor 38, and the number of heating channels 15a to be formed can be reduced, so that the manufacturability is improved. Other configurations and functions are the same as those of the cooling device shown in FIG.
This cooling device utilizes the boiling phenomenon, and normal heat transport cannot be performed unless boiling occurs. Boiling does not occur unless the temperature difference between the inner wall of the heating flow path 15a and the circulating fluid in the heating flow path 15a is large to some extent. While the above temperature difference varies greatly depending on the physical properties of the circulating fluid, the heat flux (heat transfer amount per unit area) passes through the surface (heat transfer surface) where the inner wall of the heating flow path 15a and the circulating fluid in the heating flow path 15a are in contact with each other. ) Also depends heavily. Therefore, the heat transfer area may be changed according to the heat generation amount of the heating element 16, and when the heat transfer amount of the heating element 16 is small, the heat transfer surface temperature starts to boil by reducing the heat transfer area. Can be above temperature. That is, by reducing the heat transfer area of the heating flow path 15a adjacent to the weak heating element 16b (for example, reducing the number or diameter of the heating flow paths 15a), stable boiling occurs and the main cooling occurs. The device can operate stably. As an extreme example, FIG. 22 shows a form in which the heating flow path 15a is not provided in the vicinity of the weak heating element 16b. However, even if the number of heating flow paths 15a in the vicinity of the weak heating element 16b is reduced, the above The same effect as that can be obtained. Not only is the number of heating channels 15a changed for each heating element 16, but even if one heating element 16 is attached to the evaporator 14, the heating channels are located in the heating element 16 where the amount of heat generated is large. The same effect can be obtained even if the 15a is provided more densely and the heating flow path 15a is provided coarser in the portion where the amount of heat generated is small.
Embodiment 7. The power conversion device according to the seventh embodiment is a power conversion device having at least one of an inverter or a converter as the heating element 16 and including the cooling device shown in any one of the first to sixth embodiments. The power conversion device converts direct current to alternating current or alternating current to direct current, and is used in various devices. Each inverter or converter is cooled by air cooling or water cooling. Since the power conversion device according to the seventh embodiment includes a cooling device having at least one of an inverter or a converter as the heating element 16, it has very high heat dissipation characteristics and needs to supply electric power to the cooling device. It is energy saving (high overall efficiency). In addition, since there is no need for a pump or the like, there is no need to perform wiring or control, and the assembly is good. A high power converter can be provided.
22 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13 Sheet 14 Sheet 15 Sheet 16 Sheet 17 Sheet 18 Sheet 19 Sheet 20 Sheet 21 Sheet 22
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| JP2004245566A | Cites | Japan | Search report |
| JP2005195226A | Cites | Japan | Search report |
| JP2004245566A | Cites | Japan | – |
| JP2005195226A | Cites | Japan | – |
13 members in 7 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 2006111238 | Japan | – | |
| 2006111238 | Japan | A | |
| 2007058063 | Japan | W |
Members13
| Document | Office | Kind | |
|---|---|---|---|
| AU2007239597A1 | Australia | A1 | |
| WO2007119783A1 | World Intellectual Property Organization (WIPO) | A1 | |
| KR20080102297A | Republic of Korea | A | |
| MX2008012650A | Mexico | A | |
| CN101421576A | China | A | |
| JPWO2007119783A1 | Japan | A1 | |
| AU2007239597B2 | Australia | B2 | |
| CN101421576B | China | B | |
| US2010232110A1 | United States of America | A1 | |
| JP4578552B2This record | Japan | B2 | |
| AU2007239597B9 | Australia | B9 | |
| KR101007488B1 | Republic of Korea | B1 | |
| US7907408B2 | United States of America | B2 |
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Numbers
- Publication
- 4578552
- Application
- 2008510982
Titles2
- Japanese
- 冷却装置および電力変換装置
- English
- Cooling device and power conversion device
Classification
- CPC, 6
- F25B39/02
- F28D15/02
- F28D15/0266
- H10W40/73
- F25D17/00
- F25D9/00
- IPC, 3
- F28D15 02
- H01L23 427
- H10W40 73
