Method for manufacturing multilayer film
11 claims: 1 independent, 10 dependent
- 1支持フィルムと、前記支持フィルムの長手方向に沿って前記支持フィルム上に配された複数の接着フィルムと、を備える多層フィルムの製造方法において、 仮基材上に形成された接着剤層を、前記仮基材の長手方向に沿って所定の間隔を空けて又は間隔を空けずに配され前記接着フィルムとして用いられる複数の部分とそれ以外の部分とに区分されるようにカットする工程(A)と、 前記仮基材上の複数の前記接着フィルムを、前記支持フィルムの長手方向に沿って所定の間隔を空けて前記支持フィルム上に移動させる工程(B)と、を備え、 前記接着フィルムとして用いられる複数の部分が前記仮基材の長手方向に沿って所定の間隔を空けて配されるとき、前記仮基材上で隣り合う前記接着フィルムの間隔が、前記支持フィルム上で隣り合う前記接着フィルムの間隔とは異なる、製造方法。
- 2前記工程(A)と前記工程(B)の間に、前記仮基材上の前記接着剤層のうち前記接着フィルム以外の部分の一部又は全部を除去して、前記接着フィルムを前記仮基材上に残す工程(C)を更に備える、請求項1記載の製造方法。
- 3前記接着フィルムとして用いられる複数の部分が前記仮基材の長手方向に沿って所定の間隔を空けて配され、前記仮基材上で隣り合う前記接着フィルムの間隔が、前記支持フィルム上で隣り合う前記接着フィルムの間隔よりも狭い、請求項1記載の製造方法。
- 4前記支持フィルムが、前記接着フィルムの外周に沿うカット傷を実質的に有しない、請求項1記載の製造方法。
- 5前記多層フィルムが、前記接着フィルム上に設けられた、前記接着フィルムの外周から張り出した張り出し部を有する粘着フィルムを更に備え、 当該製造方法が、 前記接着フィルムと粘着剤層とを貼り合わせる工程(a)と、 前記接着フィルム上の前記粘着剤層を、前記粘着フィルムとして用いられる複数の部分とそれ以外の部分とに区分されるようにカットする工程(b)と、 前記粘着剤層のうち前記粘着フィルム以外の部分の一部又は全部を除去して、前記粘着フィルムを前記接着フィルム上に残す工程(c)と、を更に備える、請求項1記載の製造方法。
- 6前記工程(a)において、前記接着フィルムと前記粘着剤層とを貼り合わせることにより、前記粘着剤層の長手方向に沿って、前記仮基材上で隣り合う前記接着フィルムの間隔とは異なる所定の間隔を空けて、前記仮基材上の複数の前記接着フィルムを前記粘着剤層上に移動させ、 前記工程(B)が、前記工程(a)と、 前記粘着剤層上の前記接着フィルムと前記支持フィルムとを貼り合わせることにより、複数の前記接着フィルムを前記粘着剤層に貼り合わせた状態で、前記支持フィルムの長手方向に沿って所定の間隔を空けて前記支持フィルム上に移動させる工程(d)と、をこの順に含み、 当該製造方法が、前記工程(B)の後に前記工程(b)及び(c)を備える、請求項5記載の製造方法。
- 7前記工程(B)の後に前記工程(a)、(b)及び(c)を備え、 前記工程(a)において、前記工程(B)で前記支持フィルム上に移動した前記接着フィルムを、前記支持フィルムに貼り合わせた状態で、前記粘着剤層に貼り合わせる、請求項5記載の製造方法。
- 8前記工程(c)において、前記粘着剤層を、前記粘着フィルムとして用いられる複数の部分と該部分のそれぞれを囲む部分とそれら以外の部分とに区分されるようにカットし、前記粘着剤層のうち複数の前記粘着フィルムのそれぞれを囲む部分を除去する、請求項5記載の製造方法。
- 9前記接着フィルムがダイボンディング用の接着フィルムであり、 前記粘着フィルムがダイシング用の粘着フィルムである、請求項5記載の製造方法。
- 10前記仮基材上の前記接着フィルムの外観を検査する工程を更に備える、請求項1~9のいずれか一項に記載の製造方法。
- 11前記仮基材上の複数の前記接着フィルムのうち、前記接着フィルムの外観を検査する工程により良品と判定されたもののみ、前記支持フィルム上に移動させる、請求項10記載の製造方法。
Independent claims11
35 paragraphs, as filed
The present invention relates to a method for producing a multilayer film having a plurality of adhesive films provided on a support film, and further a multilayer film having a plurality of adhesive films and an adhesive film provided on the support film.
As a multilayer film having a plurality of adhesive films and adhesive films formed on the support film, for example, a die bond dicing integrated film in which an adhesive layer for die bonding and an adhesive layer for dicing are formed on the support film. is there.
Such a multilayer film includes, for example, a support film and a die bonding film having an adhesive layer formed on the support film at predetermined intervals, and a base film and an adhesive formed on the base film. It is manufactured by a method of laminating a dicing film having an agent layer with the adhesive layer and the adhesive layer inside (Patent Document 1).<patcit num="1"><text>Japanese Unexamined Patent Publication No. 2004-221336</text></patcit>
<p> The plurality of adhesive layers arranged at predetermined intervals can be formed by forming an adhesive layer that covers the entire surface of one side of the support film once, and then leaving a part of the adhesive layer to remove unnecessary parts. Therefore, it is desirable to adopt such a method industrially from the viewpoint of production efficiency and the like.</p><p> However, when the multilayer film is manufactured by the conventional method, it is necessary to form the adhesive film on the support film at intervals required in the final product, so that the portion of the adhesive layer that is discarded as an unnecessary part is discarded. There was a problem that the amount of the film could be large. In particular, when an expensive material such as an adhesive film for die bonding is used, there is a strong industrial demand to reduce the amount of waste as unnecessary parts as much as possible.</p><p> Further, when the multilayer film is manufactured by the conventional method, it is necessary to cut the adhesive film on the support film, so that when the adhesive film is cut, cut scratches along the outer periphery of the adhesive film occur on the surface of the support film. There was a problem that it would end up. Since foreign matter such as film dust easily adheres to the cut scratches, it is strongly desired to suppress the occurrence of the cut scratches.</p><p> Therefore, according to the present invention, in the production of a multilayer film having a plurality of adhesive films provided on a support film, a plurality of adhesive films are formed at an arbitrarily set interval different from the interval in the final product or without an interval. It is an object of the present invention to provide a method capable of efficiently forming and suppressing the occurrence of cut scratches on the surface of a support film.</p>
<p> The present invention relates to a method for producing a multilayer film including a support film and a plurality of adhesive films arranged on the support film along the longitudinal direction of the support film. In the production method according to the present invention, a plurality of adhesive layers formed on a temporary base material are arranged along the longitudinal direction of the temporary base material at predetermined intervals or without intervals and used as an adhesive film. The step (A) of cutting so as to be divided into the portion of and the other portion, and the adhesive film on the temporary base material is moved onto the support film at a predetermined interval along the longitudinal direction of the support film. The step (B) of making the film is provided. When a plurality of portions used as an adhesive film are arranged at predetermined intervals along the longitudinal direction of the temporary base material, the distance between the adhesive films adjacent to each other on the temporary base material is the adhesive films adjacent to each other on the support film. Is different from the interval of.</p><p> In the above-mentioned manufacturing method according to the present invention, a plurality of adhesive films constituting the multilayer film are once formed on the temporary base material, and then the formed adhesive films are moved onto the support film. Therefore, the adhesive film can be formed so as to be arranged at an arbitrarily set interval different from the interval in the final product or at no interval.</p><p> Further, in the production method according to the present invention, since the adhesive layer is cut on the temporary base material and the formed adhesive film is moved onto the support film, it is possible to suppress the occurrence of cut scratches on the surface of the support film. ..</p><p> In the production method according to the present invention, a part or all of the adhesive layer on the temporary base material other than the adhesive film is removed between the steps (A) and (B) to temporarily obtain the adhesive film. It may further include a step (C) of leaving on the substrate. Thereby, the adhesive film on the temporary base material can be more easily moved to the support film.</p><p> When a plurality of portions used as an adhesive film are arranged at predetermined intervals along the longitudinal direction of the temporary base material, the distance between the adhesive films adjacent to each other on the temporary base material is the adhesive film adjacent to each other on the support film. It is preferably narrower than the interval between. In this case, the adhesive film is formed on the temporary substrate so as to be arranged at a high density at intervals narrower than those required in the final product. As a result, the amount of the adhesive layer removed as an unnecessary portion is reduced.</p><p> The multilayer film may further include an adhesive film provided on the adhesive film and having an overhanging portion protruding from the outer periphery of the adhesive film. In this case, the manufacturing method according to the present invention preferably comprises the step (a) of bonding the adhesive film and the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer on the adhesive film is a plurality of parts used as the pressure-sensitive adhesive film and other parts. A step (b) of cutting so as to be divided into the parts of the adhesive layer, and a step (c) of removing a part or all of the adhesive layer other than the adhesive film and leaving the adhesive film on the adhesive film. , Are further provided.</p><p> For example, by adhering the adhesive film and the pressure-sensitive adhesive layer on the temporary base material, a predetermined space different from the distance between adjacent adhesive films on the temporary base material is provided along the longitudinal direction of the pressure-sensitive adhesive layer. By moving the plurality of adhesive films on the pressure-sensitive adhesive layer and then bonding the adhesive film on the pressure-sensitive adhesive layer and the support film, the support film is in a state where the plurality of adhesive films are bonded to the pressure-sensitive adhesive layer. It may be moved onto the support film at predetermined intervals along the longitudinal direction of the. In this case, step (a) is included in step (B), and steps (b) and (c) are post-steps of step (B). Further, for example, the adhesive film moved on the support film in the step (B) may be attached to the pressure-sensitive adhesive layer in a state of being attached to the support film. In this case, steps (a), (b) and (c) are post-steps of step (B).</p><p> In the case of the multilayer film having the adhesive film, it is necessary to greatly widen the distance between the adhesive films in order to secure the place of the overhanging portion of the adhesive film, but even in such a case, it is unnecessary according to the present invention. The amount of adhesive layer removed as a portion can be kept low.</p><p> In the step (c), the pressure-sensitive adhesive layer is cut so as to be divided into a plurality of parts used as the pressure-sensitive adhesive film, a part surrounding each of the parts, and a portion other than the parts, and a plurality of the pressure-sensitive adhesive layers are formed. It is preferable to remove the portions surrounding each of the adhesive films to leave the adhesive film on the adhesive film. In this case, in the obtained multilayer film, a portion where the support film is exposed is formed around the adhesive film. This improves the handleability of the multilayer film, such as facilitating peeling from the support film when using the adhesive film and the laminate having the adhesive film.</p><p> In the production method according to the present invention, for example, the adhesive film may be an adhesive film for die bonding, and the adhesive film may be an adhesive film for dicing.</p><p> The production method according to the present invention may further include a step of inspecting the appearance of the adhesive film on the temporary base material. In this case, for example, among a plurality of adhesive films on the temporary base material, only those judged to be non-defective by the process of inspecting the appearance of the adhesive films are moved onto the support film to be defective in the final product. Can be prevented from being mixed.</p>
<p> According to the present invention, in the production of a multilayer film having a plurality of adhesive films provided on a support film, a plurality of adhesive films are formed at an arbitrarily set interval different from the interval in the final product or at no interval. It becomes possible to form efficiently. As a result, for example, the amount of the adhesive layer removed as an unnecessary portion can be reduced, and the amount of waste and the manufacturing cost can be reduced. Further, according to the present invention, it is possible to suppress the occurrence of cut scratches on the surface of the support film and the residual foreign matter such as film dust caused by the cut scratches.</p>
<figref num="1">It is a top view which shows one Embodiment of a multilayer film.</figref><figref num="2">It is the end view along the line II-II of FIG.</figref><figref num="3">It is an end view which shows the process of dicing a semiconductor wafer.</figref><figref num="4">It is a schematic diagram which shows one Embodiment of the manufacturing method of a multilayer film.</figref><figref num="5">It is a schematic diagram which shows one Embodiment of the manufacturing method of a multilayer film.</figref><figref num="6">It is a schematic diagram which shows one Embodiment of the manufacturing method of a multilayer film.</figref><figref num="7">It is a schematic diagram which shows one Embodiment of the manufacturing method of a multilayer film.</figref><figref num="8">It is a schematic diagram which shows one Embodiment of the manufacturing method of a multilayer film.</figref>
Code description
1 ... multilayer film, 3 ... laminate (die bond dicing integrated film), 5 ... semiconductor wafer, 7 ... ring frame, 9 ... dicing film, 10 ... support film, 11 ... Temporary substrate, 12 ... Base film, 13 ... Cover film, 21 ... Adhesive layer, 21a ... Adhesive film, 22 ... Adhesive layer, 22A ... Overhang , 22a ... Adhesive film, 31,32 ... Cutter, 40 ... Release plate, 50,51 ... Adsorption pad, 80 ... Inspection part, 90 ... Exposed part.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings, if necessary. In the figure, the same or equivalent components are designated by the same reference numerals, and duplicate description will be omitted as appropriate.
FIG. 1 is a plan view showing an embodiment of a multilayer film, and FIG. 2 is an end view taken along line II-II of FIG. The multilayer film 1 shown in FIGS. 1 and 2 has a long support film 10, a plurality of adhesive films 21a having a circular main surface, and a plurality of adhesive films 21a on the surfaces opposite to the support films 10. It is composed of a laminated adhesive film 22a and a base film 12a that covers the adhesive film 22a.
The adhesive film 21a is arranged on the support film 10 at a predetermined interval D2 along the longitudinal direction of the support film 10. The adhesive film 21a is an adhesive film for die bonding used for adhering a semiconductor element to a substrate for mounting a semiconductor element. The adhesive film 22a and the base film 12a have a circular main surface having a larger area than the main surface of the adhesive film 21a, and the adhesive film 22a has a ring-shaped overhanging portion 22A protruding from the outer periphery of the main surface of the adhesive film 21a. have. The adhesive film 22a is an adhesive film for dicing used for fixing the semiconductor wafer when the semiconductor wafer is separated into pieces by dicing.
The laminated body 3 having a laminated structure in which the adhesive film 21a, the adhesive film 22a and the base film 12a are laminated in this order is peeled off from the support film 10 and used as a die bond dicing integrated film having both die bonding and dicing functions. Be done. In order to facilitate the peeling of the laminated body 3, a ring-shaped exposed portion 90 in which the support film 10 is exposed is provided around the laminated body 3. A part 22b of the pressure-sensitive adhesive layer and a base film 12b are laminated on the support film 10 in a portion further outside the exposed portion 90. In the figure, the overhanging portion 22A of the adhesive film 22a is shown in a state of being separated from the support film 10 for simplification, but the overhanging portion 22A is also usually in a state of being partially in contact with the support film 10. ..
FIG. 3 is an end view showing an embodiment of a step of dicing a semiconductor wafer using a laminate (die bond dicing integrated film) 3. The adhesive film 21a is attached to the semiconductor wafer 5, and the overhanging portion 22A of the adhesive film 22a is attached to the ring frame 7 provided so as to surround the semiconductor wafer 5. The die bond dicing integrated film 3 is fixed to the ring frame 7 by the adhesive force of the overhanging portion 22A. In this state, the semiconductor wafer 5 is diced in a grid pattern together with the adhesive film 21a along the broken line A in the drawing. After dicing, the adhesive strength of the adhesive film 22a is reduced by light irradiation if necessary, and the individualized semiconductor wafer (semiconductor chip) is picked up together with the adhesive film 21a attached to one side thereof. The picked-up semiconductor chip is adhered to the semiconductor mounting substrate via the adhesive film 21a.
4 and 5 are schematic views showing an embodiment of a method for manufacturing the multilayer film 1. In the manufacturing method according to the embodiment shown in FIG. 4, the adhesive layer 21 formed by covering the entire surface of one side of the temporary base material 11 is arranged along the longitudinal direction of the temporary base material 11 at a predetermined interval D1. A step of cutting so as to be divided into a plurality of parts used as the adhesive film 21a and other parts, and a step of removing the part of the adhesive layer 21 on the temporary base material 11 other than the adhesive film 21a. The step of moving the adhesive film 21a on the temporary base material 11 onto the pressure-sensitive adhesive layer 22 at intervals D2 along the longitudinal direction of the pressure-sensitive adhesive layer 22, and on the adhesive film 21a moved onto the pressure-sensitive adhesive layer 22. It is provided with a step of adhering the support film 10 to the surface. The distance D1 between the adhesive films 21a adjacent to each other on the temporary base film 11 is narrower than the distance D2 between the adhesive films 21a adjacent to each other on the support film 10. In the manufacturing method according to the embodiment shown in FIG. 5, the pressure-sensitive adhesive layer 22 and the base film 12 on the adhesive film 21a are further divided into a plurality of portions used as the adhesive film 22a, a ring-shaped portion 22c surrounding the portions, and the like. A step of cutting so that the pressure-sensitive adhesive layer 22 is separated from a portion other than the portion other than the above, and a step of removing the ring-shaped portion 22c of the pressure-sensitive adhesive layer 22 together with the base film 12c of the portion on the ring-shaped portion 22c. To be equipped.
The adhesive layer 21 applies, for example, an adhesive solution containing an adhesive and a solvent in which the adhesive is dissolved or dispersed onto the temporary base material 11 and removes the solvent from the applied adhesive solution. It is formed on the temporary substrate 11 by the method. A resin film is preferably used as the temporary base material 11, and a polyethylene terephthalate film that has been subjected to a mold release treatment with a silicone-based mold release agent is particularly preferable. The adhesive layer 21 is usually supplied in a state of being covered with the cover film 13.
After the cover film 13 is run on the outer peripheral surface of the roll 61 to be peeled from the adhesive layer 21, the adhesive layer 21 is cut into a circle using a cutter 31 having a circular blade. At this time, only the adhesive layer 21 is cut so that the temporary base material 11 is not completely cut. A part 21b of the adhesive layer, which is a part other than the circular part left as the adhesive film 21a, is removed through the outer peripheral surface of the roll 63 provided on the downstream side of the cutter 31. After removing a part 21b of the adhesive layer, an adhesive film 21a arranged at a predetermined interval D1 is left on the temporary base material 11.
The interval D1 can be arbitrarily set without depending on the interval D2 between adjacent adhesive films 21a in the multilayer film 1 as a final product. In the case of this embodiment, the interval D1 is set smaller than the interval D2.
By reducing the interval D1 and forming the adhesive film 21a at a high density, the amount of a part 21b of the adhesive layer removed as an unnecessary portion is greatly reduced. In particular, the adhesive used for die bonding as in the present embodiment is generally expensive, and there is a great merit in reducing unnecessary parts. Further, as described above, in order to secure the space of the overhanging portion 22A used for sticking to the ring frame during dicing, it is necessary to take a relatively large distance D2 between the adhesive films 21a in the multilayer film 1. , The merit of the present invention is extremely large.
Preferably, the spacing D1 (the shortest distance between adjacent adhesive films) is set in the range of 0-60 mm. Adhesive films 21a adjacent to each other on the temporary base material 11 may be arranged without a gap, that is, at a distance D1 = 0. If the interval D1 is larger than this range, the amount of the part 21b of the adhesive layer removed as an unnecessary portion increases, and the effect of the present invention decreases.
The interval D2 can be adjusted independently of the interval D1, and the plurality of intervals D2 can be individually different.
In the embodiments shown in FIGS. 4 and 5, the step of moving the adhesive film 21a onto the support film 10 is performed simultaneously with the step of bonding the adhesive film 21a and the pressure-sensitive adhesive layer 22. The adhesive film 21a is replaced from the temporary base material 11 to the pressure-sensitive adhesive layer 22, and the support film 10 is attached to the adhesive film 21a on the pressure-sensitive adhesive layer 22. Through the series of processes, the adhesive film 21a moves from the temporary base material 11 onto the support film 10. Here, the order in which the adhesive film 21a is bonded to the support film 10 and the pressure-sensitive adhesive layer 22 may be whichever comes first, or both may be bonded at the same time. That is, as in the embodiment of FIG. 4, the adhesive film 21a on the temporary base material 11 is bonded to the pressure-sensitive adhesive layer 22 and moved onto the pressure-sensitive adhesive layer 22, and then supported by the adhesive film 21a on the pressure-sensitive adhesive layer 22. Instead of sticking the film 10, for example, the adhesive film 21a on the temporary base material 11 is stuck to the support film 10 and moved onto the support film 10, and then the adhesive is applied to the adhesive film 21a on the support film 10. Layers 22 may be bonded together.
The pressure-sensitive adhesive layer 22 is supplied in the form of a base film 12 and a dicing film 9 having the pressure-sensitive adhesive layer 22. The pressure-sensitive adhesive layer 22 is appropriately selected from those usually used as a film-like pressure-sensitive adhesive for dicing. The long dicing film 9 unwound from the original fabric runs on the outer peripheral surface of the roll 66. The roll 65 is arranged so as to face the roll 66, and the roll 66 is movably installed along the direction of the arrow B. The temporary base material 11 on which the adhesive layer 21a is placed runs on the outer peripheral surface of the roll 65, and when the adhesive film 21a reaches between the rolls 65 and 66, the roll 66 is pressed toward the roll 65. As a result, the adhesive film 21a is transferred to the adhesive layer 22. After the adhesive film 21a passes between the rolls 65 and 66, the roll 66 moves away from the roll 65 in the direction of arrow B and waits in place until the next adhesive film 21a arrives. The temporary base material 11 peeled off from the adhesive film 21a is discharged through the outer peripheral surface of the roll 65.
An inspection unit 80 such as a CCD camera capable of detecting the appearance state of the adhesive film 21a is installed on the upstream side of the rolls 65 and 66, and the inspection unit 80 inspects the appearance of the adhesive film 21a. When the adhesive film 21a determined to be defective as a result of the inspection passes between the transfer rolls 65 and 66, the roll 66 maintains a position away from the roll 65, and the defective adhesive film 21a is the adhesive layer 22. It is discharged together with the temporary base material 11 without being transferred to. In other words, of the plurality of adhesive films 21a on the temporary base material 11, only those determined to be non-defective by the step of inspecting the appearance of the adhesive film 21a are moved onto the support film 10. The quality of the adhesive film 21a is determined based on preset criteria according to desired product specifications and the like. This makes it possible to obtain a multilayer film 1 that is substantially free of the defective adhesive film 21a.
The support film 10 supplied via the outer peripheral surface of the roll 68 is attached to the adhesive film 21a bonded to the pressure-sensitive adhesive layer 22. The support film 10 is pressed against the pressure-sensitive adhesive layer 22 by the roll 68. After that, as shown in FIG. 5, the adhesive layer 22 and the base film 12 are cut (cut) along the shape of the ring-shaped exposed portion 90 by the cutter 32 having the blade provided in the ring shape. A part 22c of the ring-shaped pressure-sensitive adhesive layer and a part 12c of the base film are removed via the outer peripheral surface of the roll 69 to form the pressure-sensitive adhesive film 22a. By the above steps, the multilayer film 1 shown in FIGS. 1 and 2 can be obtained.
As the support film 10, a resin film such as a polyethylene terephthalate film is preferably used. When the adhesive film is formed on the support film through the step of applying the adhesive solution on the support film, it is generally difficult to secure sufficient releasability of the adhesive film from the support film. If the releasability is insufficient, the adhesive film and the adhesive film may be peeled off when the laminate containing the adhesive film is peeled off from the support film. Therefore, it is usually required that the surface of the support film is subjected to a mold release treatment. However, if a layer of a release agent such as a silicone-based release agent is formed on the surface of the support film on the adhesive film side, the release agent is formed on the surface of the overhanging portion of the adhesive film that is in contact with the support film. It may be transferred and the adhesive strength of the overhanging portion may be reduced. Further, there is a possibility that the characteristics of the adhesive film may be deteriorated due to the mixing of the release agent, or the semiconductor element or the like may be contaminated by the release agent.
On the other hand, in the case of the present embodiment, the adhesive solution is not applied to the support film 10, and the adhesive film 21a formed on the temporary base film 11 is transferred to the support film 10. Therefore, the support film 10 Even if the surface of the adhesive film 21a on the side of the adhesive film 21a is not subjected to a mold release treatment, it is possible to improve the peelability of the adhesive film 21a from the support film 10. Therefore, according to the present embodiment, the support film 10 in which the release agent is not substantially adhered to the surface on the adhesive film 21a side while maintaining sufficient releasability from the support film 10 of the adhesive film 21a. It is possible to adopt. Since the mold release process of the support film 10 is not required, the above-mentioned problems can be avoided according to the present embodiment. Even if the adhesive film 10 and the temporary base material 11 have a certain degree of adhesion, the adhesive film 10 can be replaced, so that the temporary base material 11 is not necessarily removed from the mold.
Further, when the adhesive film is formed on the support film through the step of applying the adhesive solution on the support film, a part of the adhesive layer remains on the support film around the adhesive film left on the support film. In some cases. In particular, if the support film is not die-released, the adhesive layer tends to remain. The remaining adhesive may be transferred to the overhanging portion of the adhesive film, and the adhesiveness of the overhanging portion may decrease. According to this embodiment, such a problem is also solved.
Further, when the adhesive film is formed on the support film through the step of applying the adhesive solution on the support film, it is necessary to cut the adhesive film on the support film. Therefore, when the adhesive film is cut, the surface of the support film is cut. Cut scratches are likely to occur. If there is such a cut scratch, foreign matter such as film dust may remain on the surface of the support film around the adhesive film. According to this embodiment, it is possible to suppress the occurrence of such cut scratches and the residual foreign matter.
FIGS. 6, 7 and 8 are schematic views showing another embodiment of the method for producing the multilayer film 1. In the embodiment shown in FIG. 6, the temporary base material 11 is removed by lining the release plate 40 having an acute-angled cross section instead of the roll 63 in FIG. Along with the removal of the temporary base material 11, the adhesive film 21a is inserted between the pair of rolls 70 and 71 arranged so as to face each other. A dicing film 9 is supplied to the outer peripheral surface of the roll 70, and a support film 10 is supplied to the outer peripheral surface of the roll 71. The adhesive film 21a is inserted between the pressure-sensitive adhesive layer 22 and the support film 10 between the pair of rolls 70 and 71.
In the embodiment shown in FIG. 7, the adhesive layer 21 on the temporary base material 11 is cut into a circle together with the cover film 13 by cutting with a cutter 31. A part 21b of the adhesive layer and a part 13b of the cover film, which are unnecessary portions, are removed via the outer peripheral surface of the roll 72, leaving the adhesive film 21a and the cover film 13a on the adhesive film 21a. After that, the temporary base material 11 is removed by aligning it with the acute-angled portion of the release plate 40 having an acute-angled cross section. Along with the removal of the temporary base material 11, the adhesive film 21a and the cover film 13a are attached to the pressure-sensitive adhesive layer 22 of the dicing film 9 supplied via the roll 74. On the downstream side of the release plate 40, a suction pad 50 is provided at a position opposite to the adhesive film 21a with the dicing film 9 sandwiched between them, and the dicing film 9 is sucked onto the suction pad 50 by the action of the suction pad 50. .. The suction pad 50 sucks the dicing film 9 by the action of static electricity, vacuum pressure, or the like. The adhesive film 21a is pressure-bonded by the roll 75 onto the dicing film 9 adsorbed on the suction pad 50. After that, the cover film 13a is removed, and the support film 10 is laminated on the exposed adhesive film 21a by the roll 76.
In the embodiment shown in FIG. 8, the temporary base material 11 is peeled off by the roll 77 from the laminate composed of the adhesive film 21a and the cover film 13a. At the position where the temporary base material 11 is peeled off, the laminated body is adsorbed on the suction pad 51 that stands by on the side opposite to the temporary base material 11 of the laminated body. The suction pad 51 on which the laminate composed of the adhesive film 21a and the cover film 13a is placed moves to the downstream side, and the adhesive film 21a is attached to the adhesive layer 22 of the dicing film 9 supplied by the roll 78. After that, the cover film 13a is removed, and the support film 10 is laminated on the exposed adhesive film 21a by the roll 76.
After the steps shown by FIGS. 6-8, the adhesive film 22a is formed in the same manner as in the embodiment of FIG.
The present invention is not limited to the embodiments described above, and can be appropriately modified as long as it does not deviate from the gist of the present invention. For example, the width of the temporary base material may be smaller than the width of the support film. This makes it possible to reduce unnecessary portions of the adhesive layer even in the width direction. Further, as long as it is a series of processes in which the adhesive film moves from the temporary base material to the support film and the adhesive film is formed on the adhesive film, it can be adopted without particular limitation, and each component can be attached or attached. The order of replacement may be changed as appropriate.
According to the present invention, in the production of a multilayer film having a plurality of adhesive films provided on a support film, a plurality of adhesive films are formed at an arbitrarily set interval different from the interval in the final product or at no interval. It becomes possible to form efficiently. As a result, for example, the amount of the adhesive layer removed as an unnecessary portion can be reduced, and the amount of waste and the manufacturing cost can be reduced. Further, according to the present invention, it is possible to suppress the occurrence of cut scratches on the surface of the support film and the residual foreign matter such as film dust caused by the cut scratches.
8 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8
Every citation, both ways
| Document | Relation | Office |
|---|---|---|
| JP457871A | Cites | Japan |
| JP5991176A | Cites | Japan |
| JP5519276B2 | Cites | Japan |
14 members in 8 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 2007117423 | Japan | – | |
| 2007117423 | Japan | A | |
| 2008057606 | Japan | W |
Members14
| Document | Office | Kind | |
|---|---|---|---|
| WO2008136284A1 | World Intellectual Property Organization (WIPO) | A1 | |
| EP2033997A1 | European Patent Office (EPO) | A1 | |
| KR20090028685A | Republic of Korea | A | |
| TW200919559A | Taiwan Province of China | A | |
| JP4270331B2This record | Japan | B2 | |
| CN101541906A | China | A | |
| US2009236026A1 | United States of America | A1 | |
| JPWO2008136284A1 | Japan | A1 | |
| EP2033997A4 | European Patent Office (EPO) | A4 | |
| KR101121365B1 | Republic of Korea | B1 | |
| CN101541906B | China | B | |
| MY147133A | Malaysia | A | |
| TWI446421B | Taiwan Province of China | B | |
| US8801879B2 | United States of America | B2 |
20 legal events, as the office reported them to INPADOC
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Numbers
- Publication
- 4270331
- Application
- 543814
Titles2
- Japanese
- 多層フィルムの製造方法
- English
- Multilayer film manufacturing method
Classification
- CPC, 18
- H10P72/74
- C09J7/35
- H10P72/0442
- H10P72/7402
- H10P72/7444
- H10P72/7446
- H10P72/7416
- H10W72/01331
- H10W72/073
- H10W72/07337
- H10W72/30
- Y10T156/10
- Y10T156/1052
- Y10T156/1085
- Y10T156/1056
- Y10T156/1059
- Y10T156/1084
- Y10T156/16
- IPC, 4
- C09J7 02
- H01L21 301
- H01L21 52
- H10P72 00
