Projection aligner
Abstract
This record has no abstract on file.
Term
Term ended
Expired 10 January 2023, 3.7 years ago.
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8 claims: 2 independent, 6 dependent
- 1所定位置に固定された光源によってプリント配線基板上に所定のパターンが形成されたマスクの像を転写しながら、前記マスクと前記プリント配線基板とを主走査方向に駆動して走査を行い、前記プリント配線基板に前記所定のパターンを形成する、投影露光装置であって、 前記マスクの像を前記プリント配線基板上に結像させる投影光学系と、 前記プリント配線基板の伸縮率を主走査方向および該主走査方向と垂直な副走査方向別に計測可能な伸縮率計測手段と、 前記伸縮率計測手段の前記プリント配線基板の主走査方向および副走査方向の伸縮率に基づいて投影光学系の伸縮率を設定する伸縮率設定手段と、 前記マスクと前記プリント配線基板とを主走査方向に駆動する駆動機構と、 前記伸縮率設定手段と前記駆動機構とを制御し、 前記マスクに対する前記プリント配線基板の駆動速度比をSR、 前記投影光学系の伸縮率をMgn p 、 前記プリント配線基板に露光される線幅によって決まる許容値をA、 前記プリント配線基板の主走査方向および副走査方向の伸縮率をそれぞれR x ,R y とすると、(R x -R y ) Aの時は、前記駆動速度比SRと前記伸縮率Mgn p は式、SR=(R x +R y +A)/2、およびMgn p =(R x +R y -A)/2、を満たし、|R x -R y |≦Aの時は、前記駆動速度比SRと前記伸縮率Mgn p は式SR=R x、 Mgn p =R y を満たし(R x -R y ) -Aの時は、前記駆動速度比SRと前記伸縮率Mgn p は式、SR=(R x +R y -A)/2、およびMgn p =(R x +R y +A)/2、を満たすようにする制御手段と、 を有することを特徴とする投影露光装置。
- 2前記伸縮率計測手段が前記プリント配線基板上の前記主走査方向と前記副走査方向にそれぞれ少なくとも2つ形成されたマーク間の距離をそれぞれ計測する基板観察手段を有し、前記伸縮率計測手段は前記基板観察手段の計測結果を用いて前記プリント配線基板の伸縮率を計測することを特徴とする、請求項1に記載の投影露光装置。
- 3前記プリント配線基板はその長手方向が前記主走査方向と平行になり、かつその短手方向が前記副走査方向と平行になるよう設置されており、前記マークは、前記プリント配線基板の4隅を頂点とする長方形の4頂点の位置に形成されており、前記伸縮率計測手段は前記プリント基板の長手および短手方向長さを前記プリント配線基板上の前記長方形の各2辺の平均値により求め、前記長手および短手方向長さをもとに前記プリント配線基板の伸縮率を計測することを特徴とする、請求項2に記載の投影露光装置。
- 4前記基板観察手段は、前記プリント配線基板を撮影する第1のカメラ手段と、前記第1のカメラ手段によって撮影された画像を画像処理して前記プリント配線基板上に形成されたマーク間の距離を計測する、第1の画像処理手段と、を有することを特徴とする、請求項2または請求項3のいずれかに記載の投影露光装置。
- 5前記伸縮率計測手段は、前記マスク上の前記主走査方向と前記副走査方向にそれぞれ少なくとも2つ形成されたマーク間の距離をそれぞれ計測するマスク観察手段を有し、前記伸縮率計測手段は前記基板観察手段の計測結果と前記マスク観察手段の計測結果を比較することによって前記プリント配線基板の伸縮率を計測することを特徴とする、請求項2から請求項4のいずれかに記載の投影露光装置。
- 6前記マスクはその長手方向が主走査方向と平行になりかつその短手方向が副走査方向と平行になるよう設置されており、前記マークは、前記マスクの4隅を頂点とする長方形の4頂点の位置に形成されており、前記伸縮率計測手段は前記マスクの長方形の各2辺の平均値を前記マスクの長手および短手方向長さとすることを特徴とする、請求項5に記載の投影露光装置。
- 7前記マスク観察手段は、前記マスクを撮影する第2のカメラ手段と、前記第2のカメラ手段によって撮影された画像を画像処理して前記マスク上に形成された前記マークを計測する、第2の画像処理手段と、を有することを特徴とする、請求項5または請求項6に記載の投影露光装置。
- 8所定位置に固定された複数の光源によってプリント配線基板上に所定のパターンが形成されたマスクの像を転写しながら、前記マスクと前記プリント配線基板とを主走査方向に駆動して走査を行い、前記プリント配線基板に前記所定のパターンを形成する、投影露光装置であって、 前記投影露光装置が、前記マスクの像を前記プリント配線基板上に結像させる複数の投影光学系と、 前記投影光学系の伸縮率を設定する伸縮率設定手段と、前記マスクと前記プリント配線基板とを主走査方向に駆動する駆動機構と、 前記伸縮率設定手段と前記駆動機構とを制御し、 前記マスクに対する前記プリント配線基板の駆動速度比をSR、前記投影光学系の伸縮率をMgn p 、前記プリント配線基板に露光される線幅によって決まる許容値をA、前記プリント配線基板の主走査方向および副走査方向の伸縮率をそれぞれR x ,R y とすると、(R x -R y ) Aの時は、前記駆動速度比SRと前記伸縮率Mgn p は式、SR=(R x +R y +A)/2、およびMgn p =(R x +R y -A)/2、を満たし、|R x -R y |≦Aの時は、前記駆動速度比SRと前記伸縮率Mgn p は式SR=R x、 Mgn p =R y を満たし(R x -R y ) -Aの時は、前記駆動速度比SRと前記伸縮率Mgn p は式、SR=(R x +R y -A)/2、およびMgn p =(R x +R y +A)/2、を満たすよう にする制御手段と、を有し、 前記マスクの像は、前記複数の投影光学系の伸縮率計測手段の計測結果に基づいて設定された伸縮率で前記プリント配線基板上に結像されることを特徴とする投影露光装置。
Independent claims8
1 paragraph, as filed
[0001] [Technical field to which the invention belongs] In the present invention, the mask and the printed wiring board are driven in the main scanning direction to perform scanning while transferring an image of a mask having a predetermined pattern formed on the printed wiring board by a light source fixed at a predetermined position. The present invention relates to a projection exposure apparatus that forms the predetermined pattern on the printed wiring board. [0002] [Patent Document 1] JP 2000-187332 [Conventional technology] Conventionally, a projection exposure apparatus or the like has been used as a method for drawing a wiring pattern of a printed wiring board, a transparent thin film electrode of a liquid crystal panel, or the like. The projection exposure device projects the luminous flux emitted from a high-power light source such as an ultra-high pressure mercury lamp onto a mask with a predetermined pattern, and further projects this luminous flux on a printed wiring board or integrated with a photosensitizer applied by an imaging optical system. An image is formed on an exposed object such as a circuit or a liquid crystal panel, and a mask pattern is transferred to the exposed object. [0003] Further, in order to reduce the size of the projection exposure apparatus, a scanning type projection exposure apparatus is used in which the light source for exposure is fixed at a predetermined position and the mask and the printed wiring substrate are each driven in a predetermined direction (main scanning direction). There is. [0004] Generally, a printed wiring board is subjected to copper plating after perforating through holes, and then surface preparation is performed to remove the oxide film on the copper surface, and finally a photosensitive agent is applied. The printed wiring board expands and contracts by up to 0.2% due to this surface preparation process, temperature change, and laminating process. Since the position of the through hole changes as the printed wiring board expands and contracts, such a projection exposure apparatus makes it possible to set the expansion / contraction ratio of the image of the mask pattern formed on the printed wiring board. [0005] However, since the surface preparation is performed by means such as polishing the printed wiring board transported in the direction of a conveyor or the like with an abrasive such as a brush, the substrate depends on the polishing direction (usually the longitudinal direction of the printed wiring board). It is greatly stretched. That is, the expansion / contraction ratio of the printed wiring board differs between the longitudinal direction and the lateral direction. [0006] Therefore, for example, as in the projection exposure apparatus described in Patent Document 1, the expansion / contraction ratio of the imaging optical system is set as the expansion / contraction ratio in the sub-scanning direction of the printed wiring board, and the drive speed ratio of the printed wiring board to the mask is printed. It is the expansion / contraction rate of the wiring board in the main scanning direction. By using such a configuration, even when exposing a printed wiring board in which the expansion / contraction rate in the main scanning direction and the expansion / contraction rate in the sub-scanning direction are different, it is possible to perform exposure without misalignment. It has become. [0007] However, if the expansion / contraction ratio of the imaging optical system and the drive speed ratio of the printed wiring board to the mask are different, the edges of the exposed image become unclear and the size of the sufficiently exposed area is smaller than the design value. There is a problem of becoming. For example, when a linear image is exposed on a printed wiring board, there is a problem that the line width is extremely small and the image is exposed. [0008] [Problems to be Solved by the Invention] The present invention provides a projection exposure apparatus capable of exposing a mask image with different expansion / contraction rates in the main scanning direction and the sub-scanning direction, and further, without having a significant unclear area at the edge portion of the exposed linear image. The purpose is to do. [0009] [Means for solving problems] In order to achieve the above object, the projection exposure apparatus of the present invention controls the expansion / contraction ratio setting means and the drive mechanism, and the ratio of the expansion / contraction ratio of the projection optical system to the drive speed of the printed wiring board with respect to the drive speed of the mask. The control means is provided so that the difference is within an allowable value determined by the line width exposed on the printed wiring board. [0010] According to the present invention, the expansion / contraction rate of the image of the mask actually transferred to the printed wiring board in the main scanning direction is the ratio of the driving speed of the printed wiring board to the driving speed of the mask, while the expansion / contraction rate in the sub-scanning direction is expansion / contraction. The expansion / contraction rate is set by the rate setting means. Therefore, the expansion / contraction ratios in the main scanning direction and the sub-scanning direction can be set to different values. Furthermore, the dimension in the main scanning direction of the unclear part of the edge of the exposed image is determined by the difference between the expansion / contraction ratio of the projection optical system and the ratio of the drive speed of the printed wiring substrate to the drive speed of the mask, so this difference is allowed. By keeping the value within the range, the size of the unclear portion of the edge of the exposed linear image can be sufficiently reduced. [0011] Further, preferably, the projection exposure apparatus has an expansion / contraction ratio measuring means capable of measuring the expansion / contraction ratio of the printed wiring substrate for each of the main scanning direction and the sub-scanning direction perpendicular to the main scanning direction, and the ratio and the predetermined expansion / contraction ratio can be measured. The tolerance of the difference is A, and the expansion / contraction ratio of the printed wiring board in the main scanning direction and the sub-scanning direction is R, respectively.<sub>x</sub>, R<sub>y</sub>Then (R<sub>x</sub>-R<sub>y</sub>)> A, the ratio SR and the predetermined expansion / contraction rate Mgn<sub>p</sub>Is an expression, SR = (R<sub>x</sub>+ R<sub>y</sub>+ A) / 2, and Mgn<sub>p</sub>= (R<sub>x</sub>+ R<sub>y</sub>-A) / 2, satisfy, | R<sub>x</sub>-R<sub>y</sub>When | A, the ratio SR and the predetermined expansion / contraction rate Mgn<sub>p</sub>Is an expression SR = R<sub>x,</sub>Mgn<sub>p</sub>= R<sub>y</sub>The filling (R<sub>x</sub>-R<sub>y</sub>) When <-A, the ratio SR and the specified expansion / contraction rate Mgn<sub>p</sub>Is an expression, SR = (R<sub>x</sub>+ R<sub>y</sub>-A) / 2, and Mgn<sub>p</sub>= (R<sub>x</sub>+ R<sub>y</sub>+ A) / 2, are satisfied. [0012] Ratio SR and predetermined stretch ratio Mgn so as to satisfy the above formula<sub>p</sub>By setting, the size of the unclear portion of the edge of the exposed linear image can be sufficiently reduced, and the amount of deviation in the main scanning direction and the amount of deviation in the sub-scanning direction can be minimized. [0013] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 schematically shows a projection exposure apparatus according to the present embodiment. In the following description, the main scanning direction (the direction in which the mask and the printed circuit board are driven) is defined as the X-axis, the sub-scanning direction is defined as the Y-axis, and the direction in which the luminous flux is incident on the printed circuit board is defined as the Z-axis. The X-axis is positive from the lower left to the upper right in Fig. 1, the Y-axis is from the lower right to the upper left in Fig. 1, and the Z-axis is from the lower middle to the upper in Fig. 1. [0014] The projection exposure apparatus 1 of the present embodiment has a plurality of light sources 2, a plurality of collimator lenses 3, a slit 40, a mask 4, a plurality of folded mirrors 5, a plurality of lens units 6, a plurality of roof mirrors 7, and a substrate holder 8. Although FIG. 1 shows only three sets of the optical system consisting of the collimator lens 3, the folding mirror 5, the lens unit 6, and the roof mirror 7 and the light source 2, the actual projection exposure device is in the Y-axis direction. A plurality of light sources and projection optical systems are arranged in the lens, and the entire surface of the printed substrate can be exposed without reciprocating the mask and the printed substrate. Further, the slit 40 is arranged between the collimator lens 3 and the mask 4, and makes the cross-sectional shape of the light flux incident on the mask 4 rectangular. By making the cross-sectional shape of the light flux rectangular, the light flux from each of the plurality of light sources 2 can be arranged in the Y-axis direction in the drawing without gaps and without overlapping. [0015] FIG. 2 shows a part of the projection exposure apparatus 1 shown in FIG. In FIG. 1, a plurality (3 sets) of an optical system composed of a collimator lens 3, a folding mirror 5, a lens unit 6, and a roof mirror 7 and a light source 2 are shown, but in FIG. 2, the drawing is simplified. Only one pair of each is shown for the sake of simplicity. Since the behavior of each optical system of the projection exposure apparatus 1 is the same, the following description is given with reference to a drawing showing only a single optical system and a light source as shown in FIG. [0016] The light source 2 is a light source having a wavelength and an output sufficient to expose a photosensitizer applied to a printed circuit board, such as an ultra-high pressure mercury lamp. The light flux emitted from the light source 2 in the negative Z-axis direction is illuminated by the collimator lens 3 and the slit 40 in a rectangular shape on the mask 4, and then incident on the folded mirror 5. [0017] The folded mirror 5 is a triangular prism-shaped member having a right-angled isosceles triangular cross section, and its height direction is parallel to the Y-axis. Further, the isosceles side surface of the folded mirror 5 is a reflecting surface, and the normals of the reflecting surface both form an angle of 45 degrees with the X axis. The folding mirror 5 reflects the light beam passing through the mask 4 and bends it toward the positive X-axis direction to enter the lens unit 6, and is projected from the lens unit 6 onto the folding mirror 5 in the negative direction of the X-axis. The light beam is reflected and bent in the negative direction of the Z axis so that it is incident on the printed substrate B fixed to the substrate holder 8. The luminous flux incident on the printed circuit board B forms an image on the printed circuit board B. That is, the image of the mask 4 is formed on the printed circuit board B, and this image is transferred onto the printed circuit board B by the photosensitizer applied on the printed circuit board B. [0018] The lens unit 6 is a unit in which a plurality of optical members are arranged in the X-axis direction, and has the same function as a convex lens as a whole. [0019] The roof mirror 7 is a mirror configured so that the two reflecting surfaces face inward at an angle of 90 degrees on the XY surface. The roof mirror 7 is arranged near the focal position of the lens unit 6. With this configuration, the pattern of the mask 4 is transferred on the substrate B in the same direction without being inverted in the XY directions. [0020] The mask 4 and the substrate holder 8 are driven by the mask drive mechanism 14 and the substrate holder drive mechanism 18, respectively, and can move in the X-axis direction. Similarly, the folding mirror 5 is driven by the folding mirror drive mechanism 15 and can move in the X-axis direction and the Z-axis direction. Further, the roof mirror 7 can be moved in the X-axis direction and the Y-axis direction by the roof mirror drive mechanism 17. [0021] [0021] Further, each projection optical system of the projection exposure apparatus 1 is provided with a mask position detecting means 24 and a substrate position detecting means 28. The mask position detecting means 24 and the substrate position detecting means 28 each include a lamp having a wavelength range and an intensity that does not react with the photosensitizer applied to the printed circuit board B, and a CCD camera. The mask position detecting means 24 irradiates the mask 4 with a lamp and acquires an entire image of the mask 4 with a CCD camera. Similarly, the substrate position detecting means 28 illuminates the printed circuit board B with a lamp, and acquires an entire image of the printed circuit board B with a CCD camera. There are alignment marks at each of the four corners of the mask 4 and the printed circuit board B, and the controller 10 is the mask 4 and the printed circuit board B acquired by the CCD cameras of the mask position detecting means 24 and the board position detecting means 28, respectively. By performing image processing on the entire image, it is possible to calculate the distance between each of the alignment marks and the incident position of the light beam emitted from the light source 2 for each of the mask 4 and the printed circuit board B. Further, the controller 10 can calculate the distance between the markings for alignment for each of the mask 4 and the printed circuit board B, and compares the distance between the marks on the mask 4 with the distance between the marks on the printed circuit board B. Thereby, the magnification when the image of the mask 4 is transferred onto the printed circuit board B is determined. [0022] If high-precision alignment and magnification correction are required, there is a method of arranging CCD cameras 24 and 28 at the mark positions at the four corners of the mask 4 and the printed circuit board B to increase the magnification for detection. In this case, each CCD camera position with respect to the incident position of the luminous flux can be recognized, and the distance between the CCD cameras can be calculated from this CCD camera position. Therefore, it is possible to more accurately measure the distance between each of the alignment marks and the incident position of the luminous flux emitted from the light source 2 from the distance between the CCD cameras and the coordinates of the marks in the captured image of each CCD camera. It is possible. [0023] Further, the projection exposure apparatus 1 has a substrate height detection mechanism 38. The controller 10 can control the substrate height detection mechanism 38 to detect the position of the exposed surface of the printed circuit board B in the Z-axis direction. The specific configuration of the substrate height detection mechanism 38 will be described later. [0024] A method of exposing the image of the mask 4 to the printed circuit board B by the projection exposure apparatus 1 configured as described above will be described below with reference to the drawings. [0025] First, the position of the exposed surface of the printed circuit board B (Z-axis direction) and the expansion / contraction ratio of the image of the mask 4 formed on the printed circuit board B are obtained. [0026] FIG. 3 is a schematic view of the mask 4 as viewed from the positive Z-axis direction. The mask 4 is a rectangular plate-shaped member whose four sides are parallel to the X-axis or the Y-axis. A mask portion 4a on which a printed wiring pattern is drawn is formed in the central portion of the mask 4, and a wiring pattern is not drawn on the peripheral portion 4b of the mask 4. [0027] Marks M1a, M1b, M1c, and M1d for position detection are patterned at the four corners of the peripheral portion 4b of the mask 4. The marks M1a, M1b, M1c, and M1d are located at the four vertices of a substantially rectangular quadrangle whose four sides are approximately parallel to the X-axis or Y-axis, and the mask portion 4a is now included in this quadrangle. ing. The controller 10 controls the mask position detecting means 24, and the distance between the marks M1a and M1b l<sub>11x</sub>And the distance between the marks M1c and M1d l<sub>12x</sub>And the distance between the marks M1b and M1c l<sub>11y</sub>And the distance between the marks M1a and M1d l<sub>12y</sub>And are calculated. Then l<sub>11x</sub>And l<sub>12x</sub>Average value l<sub>1x</sub>And l<sub>11y</sub>And l<sub>12y</sub>Average value l<sub>1y</sub>And ask. [0028] FIG. 4 is a schematic view of the printed circuit board B viewed from the positive Z-axis direction. Similar to the mask 4, there is a pattern portion B1 to which the printed wiring pattern is transferred in the central portion of the printed circuit board B. There are position detection marks or holes at the four corners of the peripheral edge B2 of the printed circuit board B, which are designated as M2a, M2b, M2c, and M2d, respectively. M2a, M2b, M2c, and M2d are located at the four vertices of a substantially rectangular quadrangle whose four sides are approximately parallel to the X-axis or Y-axis, and the pattern part B1 is now included in this quadrangle. ing. The controller 10 controls the board position detecting means 28, and the distance between the marks M2a and M2b l<sub>21x</sub>And the distance between the marks M2c and M2d l<sub>22x</sub>And the distance between the marks M2b and M2c l<sub>21y</sub>And the distance between the marks M2a and M2d l<sub>22y</sub>And are calculated. Then l<sub>21x</sub>And l<sub>22x</sub>Average value l<sub>2x</sub>And l<sub>21y</sub>And l<sub>22y</sub>Average value l<sub>2y</sub>And ask. [0029] As above, l<sub>1x</sub>, l<sub>2x</sub>, l<sub>1y</sub>, l<sub>2y</sub>By calculating, it is possible to calculate how much the printed circuit board B expands and contracts with respect to the mask 4 in each of the X-axis direction and the Y-axis direction. Since the printed circuit board B expands and contracts due to surface preparation, temperature change, and laminating process, the expansion and contraction ratio differs in the X and Y directions. [0030] The projection exposure apparatus 1 of the present embodiment can set the magnification when the image of the mask 4 is formed on the printed circuit board B. The magnification in the Y-axis direction is equal to the magnification of the projection optical system. On the other hand, the magnification in the X-axis direction is determined by the driving speed ratio of the printed circuit board B to the driving speed of the mask 4. The expansion / contraction ratio of the printed circuit board B in the X-axis direction and the Y-axis direction is R, respectively.<sub>x</sub>, R<sub>y</sub>Then, the magnification of the projection optical system is Mgn.<sub>p</sub>The drive speed ratio SR of the printed circuit board B to the drive speed of the mask 4 is R.<sub>x</sub>, R<sub>y</sub>Is calculated using. [0031] In this embodiment, l<sub>1x</sub>, l<sub>2x</sub>, l<sub>1y</sub>, l<sub>2y</sub>Is then calculated, then Equation R<sub>x</sub>= l<sub>2x</sub>/ l<sub>1x</sub>, R<sub>y</sub>= l<sub>2y</sub>/ l<sub>1y</sub>Using R<sub>x</sub>, R<sub>y</sub>Is calculated. [0032] Alternatively, as shown in FIG. 5, the mask 4 is a plurality of (two in the figure) part 4a.<sub>1</sub>, 4a<sub>2</sub>Multiple (two in the figure) part B1 that is divided into and corresponds to the printed circuit board B.<sub>a</sub>, B1<sub>b b</sub>When divided into, marks M1a, M1b, M1c, M1d are formed in each part of the mask 4, and marks M2a, M2b, M2c, M2d are formed in the four corners of the printed circuit board B. Further, a mask position detecting means 24 is arranged for each part of the mask 4, and a substrate position detecting means 28 is arranged for each part of the printed circuit board B. [0033] In such a configuration, l for each detection means<sub>1x</sub>, l<sub>2x</sub>, l<sub>1y</sub>, l<sub>2y</sub>Is calculated, and the average value of each l<sub>1xm</sub>, l<sub>2xm</sub>, l<sub>1ym</sub>, l<sub>2ym</sub>Is calculated and the formula R<sub>x</sub>= l<sub>2xm</sub>/ l<sub>1xm</sub>, R<sub>y</sub>= l<sub>2</sub><sub>y</sub><sub>m</sub>/ l<sub>1</sub><sub>y</sub><sub>m</sub>Using R<sub>x</sub>, R<sub>y</sub>Is calculated. With such a configuration, a more appropriate expansion / contraction rate R<sub>x</sub>, R<sub>y</sub>Can be obtained. [0034] Expansion and contraction rate R calculated above<sub>x</sub>, R<sub>y</sub>Appropriate magnification using Mgn<sub>p</sub>And the procedure for calculating the drive speed ratio SR will be described below. [0035] FIG. 6 shows the expansion / contraction ratio R of the printed circuit board B in the main scanning direction in the conventional projection exposure apparatus.<sub>x</sub>And expansion / contraction rate R in the sub-scanning direction<sub>y</sub>The exposure procedure when is equal is shown. The PO in FIGS. 6 and 7 is a projection optical system corresponding to the folded mirror 5, the lens unit 6, and the roof mirror 7 of the present embodiment. Further, the mask 4 and the printed circuit board B are driven from the left to the right in FIG. [0036] In the procedure shown in FIG. 6, patterns 50, 52, and 54 formed on the mask 4 at equal intervals in the main scanning direction from right to left in the figure are exposed on the printed circuit board B, respectively. .. The expansion / contraction rate of the printed circuit board B in the main scanning direction is R.<sub>x</sub>Therefore, the drive speed ratio SR is R.<sub>x</sub>be equivalent to. In addition, the magnification Mgn by the projection optical system PO<sub>p</sub>Is R<sub>y</sub>be equivalent to. Therefore, SR and Mgn<sub>p</sub>Are equal. Also, let the interval between patterns 50 and 52 be lpm. The size of the opening of the slit 40 is twice that of lpm. [0037] At the time of FIG. 6A, the pattern 50 is located at the center of the opening of the slit 40. The pattern 52 is located at the left end of the slit 40 in the figure. Further, the luminous flux passing through the center of the slit 40 is configured to pass through the optical axis of the projection optical system PO. At the time of FIG. 6A, the image of the pattern 50 is projected on the position 51 on the printed circuit board B located on the extension line of the optical axis of the projection optical system PO. The image of pattern 52 is the distance Mgn from position 51 to the left in the figure.<sub>p</sub>× lpm Projected at the offset position 53. [0038] Fig. 6 (b) shows the state when the mask 4 moves to the right in the figure by the distance lpm from the state of Fig. 6 (a). In the state of FIG. 6B, the pattern 52 is located at the center of the opening of the slit 40. The patterns 50 and 54 are located at the right and left ends of the slit 40 in the figure. [0039] At this time, the printed circuit board B is moved to the right in the figure by a distance SR × lpm from the state shown in FIG. 6 (a). In this example, SR = Mgn<sub>p</sub>Therefore, at the time of FIG. 6 (b), the distance SR × lpm (= Mgn) from position 51 to the left in the figure is on the extension line of the optical axis of the projection optical system PO.<sub>p</sub>× lpm) There is a shifted position 53. That is, at the time of FIG. 6B, the image of the pattern 52 is projected at the position 53. The image of pattern 50 is the distance Mgn from position 53 to the right in the figure.<sub>p</sub>× lpm Projected at position 51, which is a shifted position. The image of pattern 54 is the distance Mgn from position 53 to the left in the figure.<sub>p</sub>× lpm Projected at the offset position 55. [0040] Fig. 6 (c) shows the state when the mask 4 moves to the right in the figure by the distance lpm from the state of Fig. 6 (b). In the state of FIG. 6 (c), the pattern 54 is located at the center of the opening of the slit 40. The pattern 52 is located at the right end of the slit 40 in the figure. [0041] At this time, the printed circuit board B is moved to the right in the figure by a distance SR × lpm from the state shown in FIG. 6 (b). Therefore, at the time of FIG. 6 (c), it is located on the extension line of the optical axis of the projection optical system PO, and the distance SR × lpm (= Mgn) from position 53 to the left in the figure.<sub>p</sub>× lpm) The image of the pattern 54 is projected on the displaced position 55. The image of pattern 52 is the distance Mgn from position 55 to the right in the figure.<sub>p</sub>× lpm Projected at position 53, which is a shifted position. [0042] Therefore, the image of pattern 52 continues to be projected at position 53 at all points in FIGS. 6 (a), (b), and (c). In other words, R<sub>x</sub>= R<sub>y</sub>In the case of, the image of the pattern is exposed at a predetermined position on the printed circuit board only for the time when the pattern passes through the opening of the slit, and the image of the pattern is clearly transferred onto the substrate. [0043] On the other hand, FIG. 7 shows the expansion / contraction ratio R of the printed circuit board B in the main scanning direction in the conventional projection exposure apparatus.<sub>x</sub>And expansion / contraction rate R in the sub-scanning direction<sub>y</sub>Is different (R<sub>y</sub>> R<sub>x</sub>) The exposure procedure in the case is shown. Also in the example of FIG. 7, the mask 4 and the printed circuit board B are driven from the left to the right in FIG. [0044] In the procedure shown in FIG. 7, patterns 50, 52, and 54 formed on the mask 4 at equal intervals in the main scanning direction from right to left in the figure are exposed on the printed circuit board B, respectively. .. The expansion / contraction rate of the printed circuit board B in the main scanning direction is R.<sub>x</sub>Therefore, the drive speed ratio SR is R.<sub>x</sub>be equivalent to. In addition, the magnification Mgn by the projection optical system PO<sub>p</sub>Is R<sub>y</sub>be equivalent to. Therefore, SR <Mgn<sub>p</sub>Will be. Also, let the interval between patterns 50 and 52 be lpm. The size of the opening of the slit 40 is twice that of lpm. [0045] At the time of FIG. 7A, the pattern 50 is located at the center of the opening of the slit 40. The pattern 52 is located at the left end of the slit 40 in the figure. Further, the luminous flux passing through the center of the slit 40 is configured to pass through the optical axis of the projection optical system PO. At the time of FIG. 7A, the image of the pattern 50 is projected on the position 51 on the printed circuit board B located on the extension line of the optical axis of the projection optical system PO. The image of pattern 52 is the distance Mgn from position 51 to the left in the figure.<sub>p</sub>× lpm Projected at the offset position 53'. [0046] Fig. 7 (b) shows the state when the mask 4 moves to the right in the figure by the distance lpm from the state of Fig. 7 (a). In the state of FIG. 7B, the pattern 52 is located at the center of the opening of the slit 40. The patterns 50 and 54 are located at the right and left ends of the slit 40 in the figure. [0047] At this time, the printed circuit board B is moved to the right in the figure by a distance SR × lpm from the state shown in FIG. 7 (a). In this example, at the time of FIG. 7 (b), on the extension line of the optical axis of the projection optical system PO, there is a position 53 located at a position deviated from the position 51 to the left in the figure by a distance SR × lpm. That is, at the time of FIG. 7B, the image of the pattern 52 is projected at the position 53. The image of pattern 50 is the distance Mgn from position 53 to the right in the figure.<sub>p</sub>It is projected at position 51'', which is a position shifted by × lpm. The image of pattern 54 is the distance Mgn from position 53 to the left in the figure.<sub>p</sub>× lpm Projected at the offset position 55'. [0048] Fig. 7 (c) shows the state when the mask 4 moves to the right in the figure by the distance lpm from the state of Fig. 7 (b). In the state of FIG. 7 (c), the pattern 54 is located at the center of the opening of the slit 40. The pattern 52 is located at the right end of the slit 40 in the figure. [0049] At this time, the printed circuit board B is moved to the right in the figure by a distance SR × lpm from the state shown in FIG. 7 (b). Therefore, at the time of FIG. 7 (c), the pattern 54 is located on the extension line of the optical axis of the projection optical system PO, and on the position 55 located at a position deviated from the position 53 to the left by the distance SR × lpm. The image is projected. The image of pattern 52 is the distance Mgn from position 55 to the right in the figure.<sub>p</sub>It is projected at position 53'', which is a position shifted by × lpm. [0050] Therefore, the image of pattern 52 is projected at position 53'at the time of FIG. 7 (a), projected at position 53 at the time of FIG. 7 (b), and at position 53'' at the time of FIG. 7 (c). It is projected. Position 53'is the distance from position 53 to the left in the figure (Mgn)<sub>p</sub>-SR) × lpm is the position shifted, and position 53'' is the distance (Mgn) from position 53 to the right in the figure.<sub>p</sub>-SR) × The position is shifted by lpm. In other words, R<sub>x</sub><R<sub>y</sub>If, the projected position of the image of this pattern continues to move while the pattern passes through the slit opening. Therefore, the image of the pattern exposed on the printed circuit board becomes unclear. [0051] For example, assume that the pattern is a linear pattern having a constant width w extending from the front to the back in FIG. 7. FIG. 8 shows an exposure state when such a pattern is exposed on the printed circuit board B. When the mask pattern is a straight line as described above, it is desired that the printed circuit board B is exposed to a straight line having a width (SR × w) for a time when the pattern passes through the opening of the slit. However, what is actually exposed is as shown in FIG. 8, and it is a straight line whose width is smaller than (SR × w) that the pattern continues to be exposed for the time when it passes through the opening of the slit. Only part 60a. Width b = (ls × | Mgm) before and after this straight line<sub>p</sub>Section 60b of -SR |) is an unclear area where the pattern is exposed for less time than it has passed through the slit opening. In addition, ls is the opening dimension of the slit 40. [0052] As mentioned above, SR and Mgn<sub>p</sub>The size of the unclear area that occurs when is different is the opening size ls of slit 40, SR and Mgn.<sub>p</sub>It can be seen that it is determined by the difference between. In the present embodiment, SR and Mgn are used so as to sufficiently reduce the size of this unclear area.<sub>p</sub>Is to set. [0053] In this embodiment, SR and Mgn<sub>p</sub>SR and Mgn so that the difference between<sub>p</sub>To set. The predetermined value A is the allowable value b of the size b of the unclear area b.<sub>max</sub>Is divided by the opening size ls of the slit 40, and is a parameter determined by the specifications of the printed circuit board B and the like. [0054] In this embodiment, (R<sub>x</sub>-R<sub>y</sub>)> A, SR and Mgn<sub>p</sub>Is set to satisfy the number 1. [0055] [Number 1]<img file="JP4204331B2_D0001.tif" />[0056] SR and Mgn<sub>p</sub>Is set based on the number 1, the size of the unclear area b is b<sub>max</sub>Will be. Also, SR and R<sub>x</sub>Difference, and Mgn<sub>p</sub>And R<sub>y</sub>The larger of the differences between the two is the smallest. The image of the pattern located dx in the X-axis direction and dy in the Y-axis direction from the center of the mask 4 is R in the X-axis direction from the center of the printed circuit board B.<sub>x</sub>× dx, R in the Y-axis direction<sub>y</sub>× dy It is desirable to be projected at a distant position. SR and Mgn<sub>p</sub>Is set based on the number 1, the size of the unclear area b is the allowable value b<sub>max</sub>It is possible to minimize the amount of deviation of the position where the pattern is projected from the desired position while keeping it within the range. [0057] Also | R<sub>x</sub>-R<sub>y</sub>| When A, SR and Mgn<sub>p</sub>Is set to satisfy the number 2. [0058] [0058] [Number 2]<img file="JP4204331B2_D0002.tif" />[0059] SR and Mgn<sub>p</sub>If is set based on the number 2, the size b of the unclear area is the allowable value b<sub>max</sub>It becomes as follows. The image of the pattern located dx in the X-axis direction and dy in the Y-axis direction from the center of the mask 4 is R in the X-axis direction from the center of the printed circuit board B.<sub>x</sub>× dx, R in the Y-axis direction<sub>y</sub>× dy Projected at a distant position. Therefore, SR and Mgn<sub>p</sub>Is set based on the number 2, the size of the unclear area b is the allowable value b<sub>max</sub>It is possible to reduce the amount of deviation of the position where the pattern is projected from the desired position to 0 while keeping it within the range. [0060] Also, (R<sub>x</sub>-Ry) <-A, SR and Mgn<sub>p</sub>Is set to satisfy the number 3. [0061] [Number 3]<img file="JP4204331B2_D0003.tif" />[0062] SR and Mgn<sub>p</sub>Is set based on the number 3, the size of the unclear area b is b<sub>max</sub>Will be. Also, SR and R<sub>x</sub>Difference, and Mgn<sub>p</sub>And R<sub>y</sub>The larger of the differences between the two is the smallest. The image of the pattern located dx in the X-axis direction and dy in the Y-axis direction from the center of the mask 4 is R in the X-axis direction from the center of the printed circuit board B.<sub>x</sub>× dx, R in the Y-axis direction<sub>y</sub>× dy It is desirable to be projected at a distant position. SR and Mgn<sub>p</sub>Is set based on the number 3, and the size b of the unclear area is the allowable value b.<sub>m</sub><sub>ax</sub>It is possible to minimize the amount of deviation of the position where the pattern is projected from the desired position while keeping it within the range. [0063] FIG. 9 is a schematic view of the substrate holder 8 and the printed circuit board B as viewed from the negative Y-axis direction. The substrate height detection mechanism 38 emits laser light LB having a wavelength and intensity that does not react with the photosensitizer applied on the printed substrate B from the laser light source 38a and 38a that incident the laser beam LB diagonally on the XZ plane toward the printed substrate B. It has a convex lens 38d that collects the generated light on the printed substrate B, a light receiving portion 38b that receives the laser beam LB reflected on the printed substrate B, and a convex lens 38c. The convex lens 38c is arranged in front of the light receiving surface of the light receiving portion 38b so that its optical axis is parallel to the optical axis of the reflected laser light LB, and refracts the laser light LB reflected on the printed substrate B to receive light. Place it in the light receiving surface of part 38b. The reflection position on the printed circuit board B and the light receiving portion 38b are at the conjugate position of the convex lens 38c, and have a magnification of μ. The magnification μ is approximately the ratio Λ2 / Λ1 of the length Λ2 in the optical axis direction between the convex lens 38c and the light receiving portion 38b and the length Λ1 in the optical axis direction between the reflective surface on the printed circuit board B and the convex lens 38c. When the laser beam LB at the time of reflection on the printed substrate B is closer to the negative Z-axis direction than the optical axis of the convex lens 38c (that is, closer to the printed substrate B), the laser beam LB is closer to the optical axis of the convex lens 38c. It is incident at a position closer to the positive direction of the Z axis. [0064] The light receiving unit 38b can detect at which position on the light receiving surface of the light receiving unit 38b the laser beam LB is incident, and can detect the height of the printed circuit board B from this incident position. [0065] The method of detecting the height of the printed circuit board B using the board height detection mechanism 38 will be described in detail below. The substrate height BH when the laser beam LB is incident on the center of the light receiving surface of the light receiving portion 38b (the point where the light receiving surface and the optical axis of the convex lens 38c intersect).<sub>0</sub>Is calculated in advance by experiment. [0066] Here, the incident position of the laser beam LB is ΔL from the intersection of the optical axis of the convex lens 38c and the light receiving surface of the light receiving portion 38b.<sub>D</sub>If there is a deviation, the board height BH at that time is calculated by the equation 4. If the incident position of the laser beam LB moves away from the printed circuit board B, ΔL<sub>D</sub>> 0, ΔL if moving closer to printed circuit board B<sub>D</sub><0. Further, θ is the incident angle of the laser beam LB. [0067] [Number 4]<img file="JP4204331B2_D0004.tif" />[0068] Here, in order to detect BH more accurately, ΔL with respect to the change in BH is conducted in advance by experiments or the like.<sub>D</sub>There is also a method to measure. [0069] From the height BH of the printed circuit board B calculated by the above method and the position of the folded mirror 5, the optical path length from the mask 4 to the lens unit 6 and the optical path length from the lens unit 6 to the exposed surface of the printed circuit board B Sum D<sub>L</sub>Can be calculated. [0070] In order for the pattern formed on the mask 4 to be imaged on the printed circuit board B in a focused state, the relationship between the mask 4 and the exposed surface of the printed circuit board B is conjugated with respect to the lens unit 6. Must be arranged so that In this embodiment, the lens unit 6 is fixed, and the mask 4 and the substrate holder 8 do not move in the Z-axis direction. [0071] In the exposure apparatus 1 having the above configuration, by moving the folding mirror 5 in the X-axis direction, focusing is performed so that the mask 4 and the exposed surface of the printed circuit board B have a conjugate relationship. When the distance DL is twice the focal length of the lens unit 6, the mask 4 and the exposed surface of the printed circuit board B have a conjugate relationship. Hereinafter, a procedure for forming a pattern formed on the mask 4 on the printed circuit board B by moving the folding mirror 5 will be described with reference to FIG. [0072] FIG. 10 is a side view of the projection exposure apparatus 1 of FIG. 1 projected in the Y-axis direction. In FIG. 7, the lens unit 6 is described as one convex lens and the roof mirror 7 is described as one plane mirror for the sake of simplification of the drawing. Controller 10 is distance D<sub>L</sub>Compared with the focal length f of the lens unit 6, the difference in distance between the exposed surface of the printed circuit board B and the imaged surface of the mask lens unit 6 ΔD<sub>L</sub>= D<sub>L</sub>Find -2f. Then ΔD<sub>L</sub>If> 0, the X-axis is positive, and ΔD<sub>L</sub>If <0, fold back mirror 5 in the negative direction of the X axis and distance | ΔD<sub>L</sub>| Move only / 2. Here, in FIG. 7, ΔD<sub>L</sub>> 0, and the position of the image plane by the lens unit 6 is in the positive Z-axis direction from the exposed surface of the printed circuit board B | ΔD<sub>L</sub>It is the position moved by | (the position shown by the alternate long and short dash line in Fig. 10). Distance of the folding mirror 5 in the positive direction of the X-axis | ΔD<sub>L</sub>The folded mirror 5 when moved by | / 2 is shown by a broken line, and the optical path at that time is shown by a dashed line. At this time, the sum of the optical path length from the mask 4 to the lens unit 6 and the optical path length from the lens unit 6 to the exposed surface of the printed circuit board B D<sub>L</sub>Is the distance D before moving the folding mirror 5<sub>L</sub>Than | ΔD<sub>L</sub>| Is shorter, D<sub>L</sub>= 2f. Therefore, the mask 4 and the exposed surface of the printed circuit board B have a conjugate relationship, and the pattern formed on the mask 4 is formed on the printed circuit board B. Therefore, by measuring the height of the printed circuit board B and adjusting the imaging position in the previous step as described above, the projection exposure apparatus 1 can handle printed circuit boards having different thicknesses. [0073] Next, the magnification Mgn obtained by the above calculation is the magnification when the image of the mask 4 is formed on the printed circuit board B.<sub>p</sub>Set to. To set the magnification, the controller 10 controls the roof mirror drive mechanism 17 to drive the roof mirror 7 in the X-axis direction, and the controller 10 controls the folding mirror drive mechanism 15 to drive the folded mirror 5 in the Z-axis direction. Is done by. [0074] The principle of setting the magnification will be described with reference to FIGS. 11 and 12. FIG. 11 is a schematic view of the lens unit 6 and the roof mirror 7 as viewed from the positive Z-axis direction. For the sake of brevity, the lens unit 6 and the roof mirror 7 are each depicted as a single surface. The luminous flux toward the roof mirror 7 is indicated by a two-dot chain line, and the luminous flux reflected by the roof mirror 7 is indicated by a broken line. [0075] To set the magnification, first place the roof mirror 7 in the positive direction of the X-axis from the focal position 7a of the lens unit 6.<sub>1</sub>Move. When the roof mirror 7 is moved in this way, the pupil position when the lens unit 6 is emitted is 2ΔL in the positive direction of the X-axis.<sub>1</sub>It will be shifted. As a result, the reflected light becomes a luminous flux in which the telecentricity is fan-shaped with respect to the incident light which is a parallel luminous flux. [0076] However, the size of the image at the focal position on the substrate side does not change just by breaking the telecentricity. Therefore, the relative positions of the mask 4 and the exposed surface of the printed circuit board B with respect to the lens unit 6 are optically moved so that the mask 4 and the exposed surface of the printed circuit board B maintain a conjugated state with respect to the lens unit 6. That is, when the exposed surface of the printed circuit board B approaches the lens unit 6, the image of the mask formed on the exposed surface of the printed circuit board B is enlarged. On the contrary, when the exposed surface of the printed circuit board B is moved away from the lens unit 6, the image of the mask formed on the exposed surface of the printed circuit board B is reduced. [0077] Folded back to optically move the relative positions of the exposed surfaces of the mask 4 and the printed circuit board B with respect to the lens unit 6 so that the mask 4 and the exposed surface of the printed circuit board B remain conjugated with respect to the lens unit 6. Mirror 5 ΔD in the Z-axis direction<sub>1</sub>Move. When the roof mirror 7 is moved in the positive X-axis direction, the folded mirror 5 is moved in the negative Z-axis direction when enlarging the image, and the folded mirror 5 is moved in the positive Z-axis direction when the image is reduced. Move in the direction. Also, when the roof mirror 7 is moved in the negative X-axis direction, the folded mirror 5 is moved in the positive Z-axis direction when enlarging the image, and the folded mirror 5 is moved in the negative Z-axis direction when the image is reduced. Move in the direction. [0078] FIG. 12 shows the mask 4, the folded mirror 5, the lens unit 6, the roof mirror 7, and the printed circuit board B viewed from the negative Y-axis direction. In FIG. 12, the luminous flux before setting the magnification is shown by a chain double-dashed line, and the luminous flux after moving the roof mirror 7 and the folding mirror 5 to set the magnification is shown by a broken line. In the example shown in FIG. 12, the magnification Mgn<sub>p</sub>With <1, the folding mirror 5 moves in the positive direction of the Z axis. [0079] As shown in FIGS. 11 and 12, ΔL of the roof mirror 7 from position 7a to 7b in the positive X-axis direction.<sub>1</sub>Move the folded mirror 5 further in the positive direction of the Z axis ΔD<sub>1</sub>By moving, the luminous flux passing through the mask 4 contracts and an image is formed on the printed circuit board B. At this time, ΔL<sub>1</sub>And ΔD<sub>1</sub>Is set to a value that satisfies the number 5. In this magnification correction, the center position of the optical axis does not change. [0080] [0080] [Number 5]<img file="JP4204331B2_D0005.tif" />[0081] FIG. 13 shows the light source 2, the mask 4, and the printed circuit board B viewed from the positive X-axis direction after the image enlargement processing is performed according to the magnification setting principle. In the actual projection exposure apparatus, the pattern of the mask 4 is formed on the printed circuit board B via the collimator lens 3, the folding mirror 5, the lens unit 6, and the roof mirror 7, but in FIG. 13, the pattern is formed. Only the light source 2, the mask 4, and the printed circuit board B are described in order to clearly show the image state. As shown in FIG. 13, when the image enlargement processing is performed, each of the images by the individual light sources 2 is enlarged, but the imaging position of each image in the Y-axis direction does not change. Therefore, the images from each light source overlap on the printed circuit board B, and the pattern of the mask 4 is not accurately transferred on the printed circuit board B. Therefore, a Y shift process is performed in which the imaging position of each image in the Y-axis direction is shifted in the Y-axis direction so that the images do not overlap each other. [0082] 14 and 15 are schematic views of the mask 4, the printed circuit board B, the lens unit 6, and the roof mirror 7 as viewed from the positive Z-axis direction. For the sake of brevity, each lens unit 6 is depicted as a single surface, and the positions of the substrate surface and the mask surface are projected on the XY plane by omitting the folded mirror 5. [0083] FIG. 14 shows the states of the mask 4, the printed circuit board B, the lens unit 6, and the roof mirror 7 before the Y shift processing is performed. At this time, both the mask 4 and the printed circuit board B are separated from the lens unit 6 by the focal length f of the lens unit 6. In addition, the roof mirror 7 has the focal position O of the lens unit 6.<sub>M</sub>Is located in. The luminous flux is indicated by a two-dot chain line. [0084] As for the luminous flux at this time, in the figure in which the mask 4 and the printed circuit board B are projected on the XY plane as shown in FIG. 14, the optical paths of the incident light and the reflected light are equal. [0085] In the Y shift process, the controller 10 controls the roof mirror drive mechanism 17 to drive the roof mirror 7 in the Y-axis direction, and the controller 10 controls the folding mirror drive mechanism 15 to drive the folded mirror 5 in the Z-axis direction. Is done by. [0086] FIG. 15 shows the states of the mask 4, the printed circuit board B, the lens unit 6, and the roof mirror 7 when the imaging position on the printed circuit board B is moved by ΔY in the negative direction of the Y axis by performing the Y shift process. Is. In FIG. 15, the luminous flux before being reflected by the roof mirror 7 is indicated by a chain double-dashed line, and the luminous flux after reflection is indicated by a broken line. As shown in Figure 14, the roof mirror 7 is O<sub>M</sub>When it is in the position of, the pupil position of the luminous flux from the lens unit 6 toward the roof mirror 7 is O.<sub>M</sub>Is. Meanwhile, the roof mirror 7 is O<sub>M</sub>Distance ΔL from to Y-axis in the positive direction<sub>2</sub>As shown in Fig. 15, the above pupil position is O.<sub>M</sub>Distance from 2ΔL in the positive direction of the Y axis<sub>2</sub>Just move. In addition, the roof mirror 7 is O<sub>M</sub>If you move it in the negative direction of the Y axis, the above pupil position will also be O.<sub>M</sub>Moves in the negative direction of the Y-axis by twice the moving distance of the roof mirror 7. [0087] As a result, the telecentricity is obliquely broken, but the imaging position on the printed circuit board B does not shift when both the mask 4 and the printed circuit board B are separated from the lens unit 6 by the focal length f of the lens unit 6. Therefore, the folding mirror 5 is set to ΔD in the negative direction of the Z axis.<sub>2</sub>By moving the mask 4, the optical path lengths from the lens units 6 of both are changed so that the mask 4 and the printed circuit board B maintain a conjugated state. Folded mirror 5 in the negative direction of the Z axis ΔD<sub>2</sub>By moving, the optical path length from the mask 4 to the lens unit 6 is ΔD.<sub>2</sub>The optical path length from the lens unit 6 to the printed circuit board B is ΔD.<sub>2</sub>Decrease. At this time, ΔL<sub>2</sub>And ΔD<sub>2</sub>Is set to a value that satisfies the number 6. [0088] [Number 6]<img file="JP4204331B2_D0006.tif" />[0089] Here, ΔD of the number 5<sub>1</sub>, ΔD of number 6<sub>2</sub>Both indicate the amount of movement of the folded mirror 5 in the Z-axis direction, and "ΔD"<sub>1</sub>= ΔD<sub>2</sub>The amount of movement of the other axes of Eq. 5 and Eq. 6 is obtained while satisfying. [0090] The number of light sources and projection optical systems used in the projection exposure device 1 is n.<sub>L</sub>Then, the value of ΔY can be obtained by using the equation 7. [0091] [Number 7]<img file="JP4204331B2_D0007.tif" />[0092] Here, a is a natural number, a = 1 for the light source on the negative side of the Y-axis, a = 2 for the light source next to it, and a = 3 for the light source next to it. Thus, the value of a of the light source adjacent to the light source with a = am on the positive side of the Y axis is set so that a = am + 1. [0093] Further, the constant W is the exposure width of one projection optical system when the magnification correction is not performed. [0094] FIG. 16 shows the light source 2, the mask 4, and the printed circuit board B after the Y shift processing is viewed from the positive X-axis direction. As shown in FIG. 16, when the Y shift is performed by the above procedure, the image by the central light source 2 and the projection optical system is not shifted, and the image by the adjacent light source 2 and the projection optical system is W (Mgn), respectively.<sub>p</sub>-1) shifts outward, and the images from the light source 2 adjacent to the outside are 2W (Mgn) respectively.<sub>p</sub>Shift outward by -1). Therefore, the imaging positions of the images in the Y-axis direction are arranged so that the images do not overlap each other, and the pattern of the mask 4 is accurately transferred onto the printed circuit board B. [0095] Next, the drive speed of the substrate holder 8 is set. In the present embodiment, the drive speed of the mask 4 is a predetermined value V.<sub>M</sub>It is fixed to. Also drive speed V<sub>B</sub>, V<sub>B</sub>= SR × V<sub>M</sub>Set to be. [0096] Next, the mask 4 and the printed circuit board B are aligned in the X-axis direction. By this alignment, the luminous flux that has passed through the center of the mask portion 4a of the mask 4 at the time of exposure is incident on the center of the pattern portion B1 of the printed circuit board B. By performing the alignment in this way, it is possible to minimize the variation in the deviation when the pattern of the mask 4 is transferred to the printed circuit board B. [0097] After aligning the mask 4 and the printed circuit board B in this way, the light source 2 is turned on, the mask 4 and the printed circuit board B are moved in the X-axis direction, and the pattern drawn on the mask 4 is transferred to the printed circuit board B. Transfer. [0098] Even after the movement between the mask 4 and the printed circuit board B is started, the optical path length from the mask 4 to the lens unit 6 and the exposed surface from the lens unit 6 to the printed circuit board B are reached by using the substrate height detection mechanism 38. Sum with optical path length D<sub>L</sub>Has been calculated. D<sub>L</sub>By driving the folding mirror 5 in the X direction so that = 2f is always established, the pattern formed on the mask 4 is connected on the printed circuit board B even if the thickness of the printed circuit board differs depending on the part. It can be imaged. [0099] [Effect of the invention] As described above, according to the projection exposure apparatus of the present invention, the image of the mask can be exposed at different expansion / contraction rates in the main scanning direction and the sub-scanning direction, and the edge portion of the exposed linear image is remarkably unclear. There is nothing to do. [Simple explanation of drawings] FIG. 1 is a schematic view schematically showing a projection exposure apparatus according to an embodiment of the present invention. FIG. 2 shows a part of the projection exposure apparatus shown in FIG. FIG. 3 is a schematic view of a mask according to an embodiment of the present invention. FIG. 4 is a schematic view of a printed circuit board according to an embodiment of the present invention. FIG. 5 is a schematic view of a mask and a printed circuit board according to another example of the embodiment of the present invention. FIG. 6 shows the expansion / contraction ratio R of the printed circuit board B in the main scanning direction in the conventional projection exposure apparatus.<sub>x</sub>And expansion / contraction rate R in the sub-scanning direction<sub>y</sub>The exposure procedure when is equal is shown. FIG. 7 shows the expansion / contraction ratio R of the printed circuit board B in the main scanning direction in the conventional projection exposure apparatus.<sub>x</sub>And expansion / contraction rate R in the sub-scanning direction<sub>y</sub>The exposure procedure when is different is shown. FIG. 8 shows a state of a printed circuit board exposed by the procedure shown in FIG. 7. FIG. 9 is a schematic view of a printed circuit board substrate height detection mechanism according to an embodiment of the present invention. FIG. 10 is a schematic view schematically showing a focusing mechanism of the projection exposure apparatus according to the embodiment of the present invention. FIG. 11 is a schematic view of a lens unit and a roof mirror of the projection exposure apparatus according to the embodiment of the present invention as viewed from the positive Z-axis direction. FIG. 12 is a view of a mask, a folding mirror, a lens unit, a roof mirror, and a printed circuit board of the projection exposure apparatus according to the embodiment of the present invention from a negative Y-axis direction. FIG. 13 schematically shows an imaging state before performing a Y shift operation in the embodiment of the present invention. FIG. 14 is a view of a mask, a folded mirror, a lens unit, a roof mirror, and a printed circuit board of the projection exposure apparatus according to the embodiment of the present invention from a positive Z-axis direction. FIG. 15 is a view of the mask, the folding mirror, the lens unit, the roof mirror, and the printed circuit board of the projection exposure apparatus after performing the Y shift operation in the embodiment of the present invention from the positive Z-axis direction. .. FIG. 16 schematically shows an imaging state after performing a Y shift operation in the embodiment of the present invention. [Explanation of sign] 1 Projection exposure equipment 2 light source 3 Collimator lens 4 mask 5 Folded mirror 6 lens unit 7 Dach Miller 8 board holder 10 controller 14 Mask drive mechanism 15 Folded mirror drive mechanism 17 Dach mirror drive mechanism 18 Board holder drive mechanism 24 Mask position detection means 28 Board position detecting means 38 Board height detection mechanism B printed circuit board
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| CN109696793A | Cited by | China | Search report |
| JP07183212A | Cites | Japan | – |
| JP07130632A | Cites | Japan | – |
| JP2000187332A | Cites | Japan | – |
| JP05081840U | Cites | Japan | – |
| JP2001154371A | Cites | Japan | – |
8 members in 4 offices
Priority claims7
| Document | Office | Kind | Date |
|---|---|---|---|
| 2002005409 | Japan | A | |
| 2002005409 | Japan | A | |
| 2002005409 | Japan | – | |
| 2003005118 | Japan | A | |
| 200220025409 | – | – | – |
| JP20020005409 | – | – | – |
| JP20030005118 | – | – | – |
Members8
| Document | Office | Kind | |
|---|---|---|---|
| US2003133089A1 | United States of America | A1 | |
| KR20030061341A | Republic of Korea | A | |
| JP2003270794A | Japan | A | |
| TW200305053A | Taiwan Province of China | A | |
| US6727979B2 | United States of America | B2 | |
| TWI228636B | Taiwan Province of China | B | |
| KR100596712B1 | Republic of Korea | B1 | |
| JP4204331B2This record | Japan | B2 |
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Numbers
- Publication
- 4204331
- Publication, DOCDB
- 4204331
- Publication, EPODOC
- JP4204331B
- Application
- 5118
- Application, DOCDB
- 2003005118
- Application, EPODOC
- JP20030005118
Titles2
- Japanese
- 投影露光装置
- English
- Projection exposure equipment
Classification
- IPC, 2
- G03F7 20
- H05K3 00