Method and system for machining fragile material
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Expired 12 March 2023, 3.5 years ago.
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14 claims: 8 independent, 6 dependent
- 1レーザ光源からのレーザ光を脆性材料に照射することにより、前記脆性材料に熱歪みを発生させ、前記脆性材料の内部に亀裂を入れるとともに、その照射位置を前記脆性材料の所定のライン上に沿って移動させることにより、脆性材料を切断する切断方法において、 複数のレーザ光源から各レーザ光を脆性材料に導く複数の光ファイバを設け、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように前記複数の光ファイバを束ねた状態で、前記複数のレーザ光源を選択的に駆動することにより設定された形状をなすレーザ合成光を 、 前記脆性材料の表面に 同時に 照射するとともに、 この脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定し、これらの測定結果に基づいて 前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整することを特徴とする脆性材料の切断方法。
- 2レーザ光源からのレーザ光を脆性材料に照射することにより、前記脆性材料に熱歪みを発生させ、前記脆性材料の内部に亀裂を入れるとともに、その照射位置を前記脆性材料の所定のライン上に沿って移動させることにより、脆性材料を切断する切断方法において、 複数のレーザ光源から各レーザ光を脆性材料に導く複数の光ファイバを設け、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように 所定の束ね方が選定された 複数の光ファイバを束ねた状態で、前記複数のレーザ光源を駆動することによ り設定された形 状をなすレーザ合成光を 、 前記脆性材料の表面に 同時に照射するとともに、この脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定し、これらの測定結果に基づいて 前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整することを特徴とする脆性材料の切断方法。
- 3請求項1または請求項2記載の脆性材料の切断方法において、 前記複数のレーザ光源の出力強度を異なるようにしたことを特徴とす る脆 性材料の切断方法。
- 4請求項1または請求項2記載の脆性材料の切断方法において、 前記複数のレーザ光源の発光開始時刻を順次所定の時間差で制御することにより、前記レーザ合成光の形状を設定することを特徴とす る脆 性材料の切断方法。
- 5レーザ光源からのレーザ光を脆性材料に照射するとともに、その照射位置を所定のライン上に沿って移動させることにより脆性材料を加工する切断装置において、 複数のレーザ光源と、各レーザ光源からレーザ光を当該脆性材料の表面に導き、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように束ねられた複数の光ファイバと、当該脆性材料へのレーザ光の照射位置を移動させる走査手段と、 前記脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定する光強度測定手段 と、を備え、 前記複数の光ファイバが束ねられた状態で、前記複数のレーザ光源を選択的に駆動することにより設定された形状をなすレーザ合成光を、当該脆性材料の表面に照射するとともに、 前記光強度測定手段の測定結果に基づいて 前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整するよう構成されたことを特徴とする脆性材料の切断装置。
- 6レーザ光源からのレーザ光を脆性材料に照射するとともに、その照射位置を所定のライン上に沿って移動させることにより脆性材料を加工する切断装置において、 複数のレーザ光源と、各レーザ光源からレーザ光を当該脆性材料の表面に導き、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように 所定の束ね方が選定された 複数の光ファイバと、当該脆性材料へのレーザ光の照射位置を移動させる走査手段と、 前記脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定する光強度測定手段と、 を備え、 前記束ねられた複数の光ファイバにより、当該脆性材料の表面に所定形状をなすレーザ合成光を 同時に照射するとともに、前記光強度測定手段の測定結果に基づいて 前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整するよう構成されたことを特徴とする脆性材料の切断装置。
- 7請求項5または請求項6記載の脆性材料の切断装置において、前記光強度測定手段を当該脆性材料のレーザ光照射面に沿って移動させる移動手段を 具備することを特徴とす る脆 性材料の切断装置。
- 8レーザ光源からのレーザ光を脆性材料に照射することにより、前記脆性材料に熱歪みを発生させ、その照射位置を前記脆性材料の所定のライン上に沿って移動させることにより、前記脆性材料の加工開始点に形成した亀裂を、進展させて前記脆性材料を割断する割断方法において、 複数のレーザ光源から各レーザ光を脆性材料に導く複数の光ファイバを設け、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように前記複数の光ファイバを束ねた状態で、前記複数のレーザ光源を選択的に駆動することにより設定された形状をなすレーザ合成光を、前記脆性材料の表面に同時に照射するとともに、この脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定し、これらの測定結果に基づいて前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整することを特徴とする脆性材料の割断方法。
- 9レーザ光源からのレーザ光を脆性材料に照射することにより、前記脆性材料に熱歪みを発生させ、その照射位置を前記脆性材料の所定のライン上に沿って移動させることにより、前記脆性材料の加工開始点に形成した亀裂を、進展させて前記脆性材料を割断する割断方法において、 複数のレーザ光源から各レーザ光を脆性材料に導く複数の光ファイバを設け、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように所定の束ね方が選定された前記複数の光ファイバを束ねた状態で、前記複数のレーザ光源を駆動することにより、設定された形状をなすレーザ合成光を、前記脆性材料の表面に同時に照射するとともに、この脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定し、これらの測定結果に基づいて 前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整することをことを特徴とする脆性材料の割断方法。
- 10請求項8または請求項9記載の脆性材料の割断方法において、前記複数のレーザ光源の出力強度を異なるようにした ことを特徴とする脆性材料の割断方法。
- 11請求項8または請求項9記載の脆性材料の割断方法において、前記複数のレーザ光源の発光開始時刻を順次所定の時間差で制御することにより、前記レーザ合成光の形状を設定する ことを特徴とする脆性材料の割断方法。
- 12レーザ光源からのレーザ光を脆性材料に照射するとともに、前記脆性材料に熱歪みを発生させ、その照射位置を前記脆性材料の所定のライン上に沿って移動させることにより前記脆性材料の加工開始点に形成した亀裂を、進展させて前記脆性材料を割断する脆性材料の割断装置において、 複数のレーザ光源と、各レーザ光源からレーザ光を当該脆性材料の表面に導き、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように束ねられた複数の光ファイバと、当該脆性材料へのレーザ光の照射位置を移動させる走査手段と、前記脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定する光強度測定手段と、を備え、 前記複数の光ファイバが束ねられた状態で、前記複数のレーザ光源を選択的に駆動することにより設定された形状をなすレーザ合成光を、当該脆性材料の表面に照射するとともに、前記光強度測定手段の測定結果に基づいて前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整するよう構成されたことを特徴とする脆性材料の割断装置。
- 13レーザ光源からのレーザ光を脆性材料に照射するとともに、前記脆性材料に熱歪みを発生させ、その照射位置を前記脆性材料の所定のライン上に沿って移動させることにより前記脆性材料の加工開始点に形成した亀裂を、進展させて前記脆性材料を割断する脆性材料の割断装置において、 複数のレーザ光源と、各レーザ光源からレーザ光を当該脆性材料の表面に導き、前記脆性材料に照射される前記各レーザ光の照射スポットが行列状に配置されるように 所定の束ね方が選定された 複数の光ファイバと、当該脆性材料へのレーザ光の照射位置を移動させる走査手段と、 前記脆性材料の表面に照射されたレーザ合成光の光強度および裏面側に透過した当該レーザ合成光の光強度をそれぞれ測定する光強度測定手段と、 を備え、 前記束ねられた複数の光ファイバにより、当該脆性材料の表面に所定形状をなすレーザ合成光を 同時に照射するとともに、前記光強度測定手段の測定結果に基づいて 前記複数のレーザ光源の光強度をそれぞれ制御することにより、このレーザ合成光の光強度分布を調整するよう構成されたことを特徴とする脆性材料の割断装置。
- 14請求項12または請求項13記載の脆性材料の割断装置において、前記光強度測定手段を当該脆性材料のレーザ光照射面に沿って移動させる移動手段を具備する ことを特徴とする脆性材料の割断装置。
Independent claims14
54 paragraphs, as filed
[Technical Field] The present invention relates to a method and a processing apparatus for processing a brittle material such as glass, ceramic or a semiconductor wafer.
PROBLEM TO BE SOLVED: To process a brittle material by irradiating a surface of a brittle material to be processed with a laser beam from a laser light source and utilizing thermal strain due to a change in heating and cooling generated at that time. There is.
[0003] For example, in Japanese Patent Publication No. 3-13040, a process of cutting a brittle material by inducing a crack formed at a processing start point of the brittle material along a processing line by thermal stress due to laser irradiation. The method is disclosed. In addition, in Japanese Patent Publication No. 8-509947 (Patent No. 3027768), cracks that reach a predetermined depth from the surface of the material are formed by the thermal stress generated by irradiating the brittle material with laser light, and the cracks are used. A processing method for dividing a brittle material is disclosed.
[0004] Typical laser light sources used in this type of processing are an HF laser with an oscillation wavelength of 2.9 μm, a CO laser with an oscillation wavelength of 5.5 μm, and a CO with an oscillation wavelength of around 10 μm.<sub>2 </sub>-A gas laser such as a laser can be mentioned. Further, as a solid-state laser, a ruby laser, a semiconductor laser, etc. that oscillate various wavelengths are commercially available.
[0005] Among commercially available laser light sources, laser light having a wavelength of about 1 to 3 μm is used for processing semiconductor wafers such as silicon, and laser light having a wavelength of about 5 to 10.6 μm is glass or the like. It is used in the processing of brittle materials. Further, various ceramic materials are processed by using a laser beam having a wavelength of about 1 to 10.6 μm.
[Disclosure of the Invention] [0007] [Problems to be Solved by the Invention] By the way, according to the processing method using a laser beam, the light absorption rate of the processed material changes greatly depending on the wavelength of the irradiation laser beam. When the absorption rate is large, most of the irradiation laser light is absorbed near the surface of the material, and the direct heating of the irradiation laser light without heat conduction is up to a depth of several μm from the material surface. Only reach.
[0008] As shown in FIG. 6, the heating region heated by the irradiation of the laser beam L is a very local region near the surface as compared with the thickness of the brittle material W, and is inside the material. Heat propagates in heat conduction (heat conduction region). For this reason, it takes a lot of time for the inside of the material to be heated over a wide range, which has been an obstacle to speeding up the processing time.
[0009] According to the processing method disclosed in Japanese Patent Publication No. 3-13040 and Japanese Patent Publication No. 8-509947 (Patent No. 3027768), the selection of the wavelength of the laser beam should be considered so strictly. In many cases, the laser beam to be irradiated is not the optimum absorption wavelength. Therefore, since it takes a lot of time to raise the temperature inside the material, it is necessary to take a long irradiation time of the laser beam, and the processing speed cannot be increased.
[0010] Another problem when the irradiation time is lengthened is that the temperature near the surface of the irradiated portion is close to the melting temperature of the material or before the temperature inside the material reaches the temperature required for processing (formation of cracks). If the material surface is heated more than that and the vicinity of the material surface is melted, there is a problem that it becomes difficult to obtain a scrib line with good accuracy. In the processing method disclosed in Japanese Patent Publication No. 8-509947 (Patent No. 3027768), it takes a long time for the inside of the material to be sufficiently heated. There is also the problem that cracks cannot be formed deep inside the material.
[0011] In order to obtain a practically effective processing speed, the spread of the laser beam emitted from the laser oscillating unit is spread along the scanning direction with the intention that the irradiation area of the laser light used for processing is as wide as possible. An example is disclosed in which various lenses and optical components are combined and the optical system is devised so as to have an elliptical shape or an oval shape.
[0012] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a processing method and a processing apparatus for a brittle material having a high processing speed.
[0013] In the processing method of the present invention, the brittle material is irradiated with a laser beam from a laser light source to generate thermal strain in the brittle material, cracks are formed inside the brittle material, and the irradiation position thereof is formed. In a cutting method for cutting a brittle material by moving the brittle material along a predetermined line, a plurality of optical fibers for guiding each laser beam from a plurality of laser light sources to the brittle material are provided, and the brittle material is provided. The plurality of optical fibers are bundled so that the irradiation spots of the laser beams to be irradiated to the laser beam are arranged in a matrix, and the plurality of laser light sources are selectively driven to form a set shape. Laser composite light<u style="single">、</u>On the surface of the brittle material<u style="single">at the same time</u>With irradiation<u style="single">The light intensity of the laser synthetic light applied to the front surface of the brittle material and the light intensity of the laser synthetic light transmitted to the back surface side are measured, respectively, and based on these measurement results.</u>It is characterized by adjusting the light intensity distribution of the combined laser light by controlling the light intensity of each of the plurality of laser light sources.
[0014] In this method, the shape of the combined laser light may be set by selectively driving the plurality of laser light sources.<u style="single">Or before</u>The shape of the laser composite light may be set by selecting a method of bundling a plurality of optical fibers.
[0015] Further, the output intensities of the plurality of laser light sources may be different.
[0016] Further, the shape of the combined laser light may be set by sequentially controlling the emission start times of the plurality of laser light sources with a predetermined time difference.
The operation of the processing method of the present invention will be described.
When the brittle material is irradiated with laser light from a plurality of laser light sources at the same time, the irradiation area irradiated with the laser light increases, and the irradiation area of the laser light on the surface of the brittle material to be processed is significantly expanded. The internal heating volume to be heated increases per irradiation time. As a result, thermal strain is generated over a wide range, and when the laser beam is scanned while making a relative motion along a predetermined direction on the surface of the brittle material, cracks extending to a deep region can be developed at high speed. , The processing speed can be improved.
Moreover, by simultaneously irradiating the brittle material with low laser light from a large number of laser light sources, it becomes possible to use a low output semiconductor laser as the laser light source.
That is, compared to gas lasers, semiconductor lasers usually have lower output intensity and the output intensity per unit is not sufficient, but a large number of semiconductor lasers are used to simultaneously apply laser light to the surface of the brittle material to be processed. By irradiating, it becomes possible to simultaneously exert the required thermal effect on a wide surface area of the brittle material to generate thermal strain over a wide range.
[0021] The operation of the processing method of the present invention will be described in more detail.
[0022] First, the output of the laser light source can be approximated by a Gaussian function.
[0023] Now, in order to make it easier to understand, the distribution shape of the light output intensity of one laser light source in two dimensions is approximated by a quadratic function. As shown in Fig. 2, it is assumed that the laser beams from the three laser light sources are simultaneously irradiated to three slightly deviated locations. The graph shape of the output intensity distribution shown by a, b, and c is y1 = a (x + b) using appropriate constants a, b, c, and d, respectively.<sup>2 </sup>+ c y2 = ax<sup>2 </sup>+ c y3 = a (xd)<sup>2 </sup>Expressed by + c, the light intensity distribution in which the three light outputs are combined is also in the form of a quadratic function, Y = A (xB).<sup>2 </sup>It can be expressed as + C. Here, A, B, and C are appropriate constants. Therefore, the result is as if the laser beam from one laser light source irradiates a wide area. In the actual case, since the array of laser light sources (laser light irradiation spots) is a three-dimensional array, the above-mentioned two-dimensional change becomes a three-dimensional distribution change. Such examples are schematically shown in FIGS. 3A and 3B. FIG. 3A schematically shows the situation where the peak positions of the beam are located at the grid points arranged at equal intervals in a two-dimensional plane. Each peak position is represented using three-dimensional coordinates. On the other hand, FIG. 3B schematically shows a situation in which the peak position of the central beam is shifted downward by one step from the position of the grid points arranged at equal intervals in a two-dimensional plane from the peak position of the other row. ing. This situation corresponds to the case where the output of the lasers corresponding to the beams in the center row is shifted downward when the outputs of the respective beams are approximately equal. This also applies when the mounting positions of the output portions of each beam are lattice points arranged in a two-dimensional plane and at equal intervals, and the output of the laser corresponding to the beam in the central row is large.
[0024] From the above, by simultaneously irradiating the brittle material with laser light from a larger number of laser light sources, it is possible to simultaneously irradiate a surface area having a large area. As a result, a large volume inside the brittle material can be heated at the same time, and the processing speed can be increased.
[0025] The processing apparatus of the present invention is an apparatus suitable for carrying out a processing method for a brittle material having the above characteristics, and irradiates the brittle material with a laser beam from a laser light source and determines the irradiation position thereof. In a cutting device that processes a brittle material by moving along a line, a plurality of laser light sources and each laser light that guides laser light from each laser light source to the surface of the brittle material and irradiates the brittle material. A plurality of optical fibers bundled so that the irradiation spots of the above are arranged in a matrix, a scanning means for moving the irradiation position of the laser beam to the brittle material, and a scanning means.<u style="single">Light intensity measuring means for measuring the light intensity of the laser synthetic light applied to the front surface of the brittle material and the light intensity of the laser synthetic light transmitted to the back surface side, respectively.</u>The surface of the brittle material is irradiated with laser synthetic light having a shape set by selectively driving the plurality of laser light sources in a state in which the plurality of optical fibers are bundled.<u style="single">Based on the measurement result of the light intensity measuring means</u>It is characterized in that the light intensity distribution of the combined laser light is adjusted by controlling the light intensity of each of the plurality of laser light sources.
【0026】<u style="single">The shape of the combined laser light may be set by selecting a method of bundling the plurality of optical fibers instead of selectively driving the plurality of laser light sources.</u>【0027】<u style="single">More than</u>In the configuration, it is preferable to provide a light intensity measuring means for measuring the light intensity distribution of the irradiation surface of the laser synthesized light of the brittle material. Further, in this configuration, it is preferable to provide a moving means for moving the light intensity measuring means along the laser beam irradiation surface of the brittle material.
[0028] According to the processing apparatus of the present invention, it is confirmed whether or not the combined intensity distribution of the laser beam irradiating the brittle material is the target intensity distribution based on the output of the light intensity measuring means. be able to. It is also possible to confirm what kind of intensity distribution the combined intensity distribution will be when a plurality of laser light sources having different output intensities are used.
[0029] In the present invention, the brittle material is completely cut to the left and right of the processing line (scribe line) only by cutting the brittle material by irradiating the brittle material with the laser light from the laser light source or by irradiating the brittle material with the laser light. It can be applied to any of the splitting processes to be separated.
[0030] In the processing method and processing apparatus of the present invention, the brittle material is irradiated with a laser beam from a laser light source to irradiate the brittle material.<u style="single">Heat</u>A cutting method in which a crack formed at a processing start point of the brittle material is propagated and the brittle material is cut by generating strain and moving the irradiation position along a predetermined line of the brittle material. The cutting device is also applied with the same configuration as the cutting method and the cutting device.
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
[0032] FIG. 1 is a diagram schematically showing a configuration of an embodiment of the present invention.
The processing apparatus of FIG. 1 includes a plurality of laser light sources 11, 12, ..., m1, m2, ..., mn. Semiconductor lasers are used for these laser light sources 11, 12, ..., m1, m2, ..., mn.
[0034] The plurality of laser light sources 11, 12, ..., m1, m2, ..., mn are arranged in a matrix above the brittle material W to be processed. The laser light from each of the laser light sources 11, 12, ..., m1, m2, ..., mn is guided to the surface of the brittle material W via the hollow optical fiber 10 ... 10, and the brittle material W The surface is irradiated at the same time.
The tip sides of a plurality of hollow optical fibers 10 ... 10 are bundled, and the laser beams L from the laser light sources 11, 12, ..., m1, m2, ..., mn are bundled. The brittle material W is irradiated in this state. The irradiation spots of these laser beams L are arranged in a matrix in the XY directions, and by irradiating the brittle material W with the laser beam, a three-dimensional light intensity distribution as shown in the schematic diagram in FIG. 3A or FIG. 3B is formed. Will be done.
[0036] The brittle material W to be processed is moved in the XY direction by a scanning mechanism 2 such as an XY table. A light intensity measuring instrument 3 is arranged below the plurality of laser light sources 11, 12, ..., m1, m2, ..., mn.
[0037] The light intensity measuring instrument 3 is selectively arranged near the surface of the brittle material W to be processed. The light intensity measuring instrument 3 is moved in a direction parallel to the surface of the brittle material W (horizontal direction) by the moving mechanism 4, and the movement causes the combined light intensity distribution of the laser beam L irradiated on the surface of the brittle material W. Can be measured.
[0038] The output of the light intensity measuring device 3 is input to the monitor device 6 after being subjected to predetermined signal processing by the signal processing circuit 5, and the light intensity distribution image is displayed on the monitor screen. When processing the brittle material W, the light intensity measuring instrument 3 is moved to a position where it does not interfere with the processing. Each laser light source 11 ... mn is electrically connected so that the power required for operation is supplied from the power source 8 via the controller 7. Further, the intensity distribution data obtained on the surface of the light intensity measuring device 3 is electrically signal-processed by the signal processing circuit 5. That is, a large number of irradiated positions on the surface of the light intensity measuring device 3 and the irradiation intensity with respect to the irradiated positions are processed in a corresponding manner, and the corresponding data is sent to the controller 7. In order to change the intensity distribution of the required location while checking the light intensity distribution on the monitor device, the laser light source 11 ... mn is applicable by inputting the data of the position and intensity that need to be changed to the controller. By changing the power supplied to the laser light source, the beam intensity output from the laser light source is controlled to be changed.
[0039] Further, if a detector 3'equivalent to the light intensity measuring instrument 3 is provided on the back side of the brittle material W and a moving mechanism 4'is provided so as to move in the horizontal direction parallel to the back surface of the material, the brittle material. It is also possible to check the transmitted light intensity on the back surface side together with the front surface side of W.
[0040] For example, when the brittle material W is thin, the light intensity on the back surface side is more than necessary, and the leaked light energy corresponds to wasteful energy consumption that does not contribute to the formation of cracks. To reduce such waste, measure the transmitted light intensity on the back side before cutting work, and if the value is locally or overall large, each laser light source 11, 12, ..., m1, m2, ..., the same processing performance can be obtained even if the cutting work is executed after reducing the light output from mn.
[0041] According to the above embodiment, a plurality of laser light sources (semiconductor lasers) 11, 12, ..., m1, m2, ..., mn are used on the surface of the brittle material W to be processed. Since the laser beam L of the above is simultaneously irradiated, the required thermal effect can be simultaneously acted on a wide surface region of the brittle material W to generate thermal strain over a wide range. As a result, when the laser beam L is scanned while making a relative motion along a predetermined direction on the surface of the brittle material W, cracks extending to a deep region can be developed at high speed.
[0042] In the present embodiment, the brittle material W is cut by irradiating the laser light L from the laser light sources 11, 12, ..., m1, m2, ..., mn to deeply crack the inside of the brittle material W. Alternatively, any processing of split processing is possible in which the crack formed at the processing start point of the brittle material W is propagated by laser light irradiation to completely separate the brittle material W.
[0043] According to the present embodiment, the light intensity measuring device 3 is moved horizontally near the surface of the brittle material W, the output signal from the light intensity measuring device 3 is processed, and the combined intensity distribution is projected on the monitor screen. Therefore, it is displayed on the monitor screen whether or not the combined intensity distribution of a plurality of laser beams has the required intensity distribution (for example, whether a predetermined intensity value can be obtained at a predetermined position). For example, it can be confirmed by the irradiation position and the intensity data value.
[0044] Further, using laser light sources 11, 12, ..., m1, m2, ..., mn having different output intensities, for example, the laser light sources 11, 12, ..., m1, m2 in FIG. 1 are used. In the arrangement of, ..., mn, as shown in Fig. 3B, when the light intensity of the laser light source located in the center is made stronger than the light intensity of the laser light sources in the rows on both sides, the combined light The form of the intensity distribution can be confirmed by analyzing the output signal from the light intensity measuring device 3. In such a case, if the combined light intensity distribution does not have a predetermined shape, the current values of each laser light source 11, 12, ..., m1, m2, ..., mn are sent to the controller 7 as necessary data. The desired synthetic light intensity distribution can be obtained by controlling by inputting.
[0045] In the embodiment of the present invention, the laser light source to be driven is selected from the plurality of laser light sources 11, 12, ..., m1, m2, ..., mn, or the hollow optical fiber 10 ... 10. The beam shape of the laser beam irradiating the brittle material W can be arbitrarily set by appropriately selecting the arrangement (bundle method) on the tip side of the brittle material W.
[0046] For example, the elliptical ring mode beam schematically shown in FIGS. 4 (A) to 4 (D), or the outer shape of the elliptical ring mode as shown in FIGS. 4 (E) (F) (G). In the light intensity distribution, it is possible to configure each ring-shaped light intensity distribution region to have a region having a higher light intensity than the peripheral regions near the right end, the center, and the left end. In order to schematically show such a situation, the region where the light intensity is particularly strong is hatched and displayed. Various beams such as the V-shaped beam shown in FIG. 5 (A), the U-shaped beam shown in FIG. 5 (B), the triangular beam shown in FIG. 5 (C), and the slit-shaped beam shown in FIG. 5 (D). The shape can be formed by using an optical element such as a special lens or a diffraction grating without modifying the optical system. In this case, the narrower the vertical width of the beam, the more effective for speed and accuracy. Also, the longer the beam width, the more effective the speed and accuracy.
Therefore, the optimum beam shape for the brittle material W to be processed can be obtained in advance from applied analysis analysis using a computer and temperature distribution analysis by heat conduction to correspond to the processing target conditions (glass material, thickness, etc.). It is possible to irradiate the brittle material W with a beam-shaped laser beam in which the number, intensity, and arrangement required for the combination are appropriately set according to the expected optimum light intensity distribution shape.
[0048] Moreover, by using a plurality of laser light sources having different output intensities, the combined light intensity distribution of the laser light irradiating the surface of the brittle material can be arbitrarily set, so that the mechanical calculation considering the intensity distribution. By performing the above, it is possible to irradiate the brittle material W with a laser beam having an optimum beam shape and an optimum light intensity distribution, and it is possible to further increase the speed of processing. In addition, although it is necessary to consider the economic efficiency when the unit price and quantity of the laser light source to be used are taken into consideration, the laser light synthesized so as to be irradiated over the entire surface area of the material to be processed is arranged. Then, by controlling the generation time of the beam output of each laser light source so that the laser light is sequentially emitted from the laser light source toward the end, the laser light source performed in the case of a normal single laser light source It is also possible to guide crack formation from one end to the other of the material without moving or mechanically moving the table. Such an irradiation method can also be applied to the case of irradiating a laser along a curved surface to cut the material or the case of cutting a material in a circular shape.
[0049] In the above embodiments, an example using a semiconductor laser has been shown, but the present invention is not limited to this, and CO<sub>2 </sub>-Various other laser devices such as lasers and YAG lasers may be applied. In addition, CO<sub>2 </sub>-When using a high-power laser device such as a laser, as an optical waveguide that guides the laser light to the surface of the brittle material, a hollow optical fiber and a hollow waveguide capable of low-loss transmission, etc. (Yuji Matsuura, Mitsunobu Miyagi: Application Physics, Vol. 68, pp.41-43 1993 and Vol. 62, pp.44-46 1993) can be used.
[Industrial Applicability] As described above, according to the present invention, the irradiation area to be simultaneously irradiated with the laser beam is increased, and the irradiation area of the laser beam on the surface of the brittle material to be processed is significantly increased. As a result of increasing the heating volume inside which is heated per irradiation time, the processing speed can be improved. It is also advantageous in that it is possible to process a brittle material to be processed under optimum conditions, such as being able to use a low-power semiconductor laser for processing the brittle material.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram schematically showing a configuration of an embodiment of the present invention.
FIG. 2 is a diagram schematically showing a two-dimensional light intensity distribution when a brittle material is irradiated with laser light from a plurality of laser light sources.
FIG. 3 is a diagram schematically showing a three-dimensional light intensity distribution when a brittle material is irradiated with laser light from a plurality of laser light sources.
FIG. 4 is a diagram showing an example of a beam shape (planar shape) that can be set when a plurality of laser light sources are used.
FIG. 5 is a diagram showing another example of a beam shape (planar shape) that can be set when a plurality of laser light sources are used.
FIG. 6 is a diagram schematically showing a situation in which only the vicinity of the surface of a brittle material is heated by laser light irradiation.
Every citation, both ways
| Document | Relation | Office |
|---|---|---|
| JP11160667A | Cites | Japan |
| JP11254160A | Cites | Japan |
| JP2000153379A | Cites | Japan |
| JP2000141071A | Cites | Japan |
19 members in 9 offices
Priority claims9
| Document | Office | Kind | Date |
|---|---|---|---|
| 2002066941 | Japan | A | |
| 2002066941 | Japan | A | |
| 2002066941 | Japan | – | |
| 0302941 | Japan | W | |
| 0302941 | Japan | W | |
| 2002200266941 | – | – | – |
| 2003002941 | – | – | – |
| JP20020066941 | – | – | – |
| WO2003JP02941 | – | – | – |
Members19
| Document | Office | Kind | |
|---|---|---|---|
| WO03076150A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2003220835A1 | Australia | A1 | |
| TW200306899A | Taiwan Province of China | A | |
| KR20040081448A | Republic of Korea | A | |
| EP1500484A1 | European Patent Office (EPO) | A1 | |
| US2005109953A1 | United States of America | A1 | |
| JPWO2003076150A1 | Japan | A1 | |
| CN1692005A | China | A | |
| KR100614108B1 | Republic of Korea | B1 | |
| TWI277477B | Taiwan Province of China | B | |
| CN100335259C | China | C | |
| US7304265B2 | United States of America | B2 | |
| US2008053972A1 | United States of America | A1 | |
| EP1500484A4 | European Patent Office (EPO) | A4 | |
| JP4182001B2This record | Japan | B2 | |
| US7816623B2 | United States of America | B2 | |
| EP1500484B1 | European Patent Office (EPO) | B1 | |
| AT516126T | Austria | T | |
| ATE516126T1 | Austria | T1 |
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Numbers
- Publication
- 4182001
- Publication, DOCDB
- 4182001
- Publication, EPODOC
- JP4182001B
- Application
- 574401
- Application, DOCDB
- 2003574401
- Application, EPODOC
- JP20030574401
Titles2
- Japanese
- 脆性材料の加工方法及び加工装置
- English
- Processing method and processing equipment for brittle materials
Classification
- CPC, 10
- B23K26/0736
- B28D5/00
- B23K26/0604
- B23K26/0608
- C03B33/093
- B23K26/40
- B23K26/53
- B23K2101/40
- B23K2103/50
- B28D5/04
- IPC, 6
- B23K26 40
- B23K26 073
- B28D5 00
- C03B33 09
- B23K26 06
- B23K26 38