Electronic device with a standoff member and method of manufacturing such an electronic device

The present invention relates to a method for manufacturing an electronic device, a standoff member, and an electronic device, and in particular, manufactures an electronic device, a standoff member, and an electronic device having a structure in which a semiconductor device is flip-chip bonded to a mounting substrate with a predetermined standoff. Regarding the method.

FIG. 1 shows an electronic device 1 which is a conventional example. The electronic device 1 shown in the figure is composed of a semiconductor device 2, a system board 3, a heat sink 4, and the like.

The semiconductor device 2 has a BGA type package structure, and is composed of a semiconductor chip 5, a package substrate 6, a lid 7, a bump 8, and the like. The semiconductor chip 5 is flip-chip bonded to the upper surface of the package substrate 6. Further, a plurality of bumps 8 are arranged on the lower surface of the package substrate 6. The package substrate 6 is a multilayer substrate and functions as an interposer that electrically connects the semiconductor chip 5 and the bump 8.

Further, a lid 7 is arranged on the upper surface of the package substrate 6 on which the semiconductor chip 5 is mounted in order to protect the semiconductor chip 5. Further, a bump 8 (consisting of a solder ball) is arranged on the lower surface of the package substrate 6, and the package substrate 6 is soldered to the system board 3 by the bump 8. As a result, the semiconductor device 2 is flip-chip bonded to the system board 3.

On the other hand, the heat sink 4 is provided to dissipate heat generated by the semiconductor chip 5. The semiconductor device 2 described above is arranged on the upper part of the base 13, and the heat sink 4 is arranged on the upper part of the lid 7 via a heat bonding material 9. The heat sink 4 is urged toward the base 13 by the spring 10, which causes the heat sink 4 to make strong contact with the lid 7, so that the heat generated by the semiconductor chip 5 is transferred to the heat sink 4 via the lid 7 and the heat bonding material 9. It conducts heat to the heat sink 4 and dissipates heat.

By the way, in recent years, as the performance of electronic devices on which electronic devices 1 are mounted has improved, the amount of heat generated by the semiconductor chip 5 has increased year by year, and in order to improve cooling performance, the size of the heat sink 4 has been increased and the material has been changed (for example, from aluminum). (Change to copper) and the like are being carried out, and along with this, the weight of the heat sink 4 is increasing, and the force of the spring 10 provided to securely fix the heat sink 4 to the semiconductor device 2 is also increasing.

It is difficult for the bump 8 (solder ball) to receive all the weight of the heat sink 4 and the load of the spring 10 which increase in this way, and the bump 8 is destroyed when all the weight and the load are applied. In addition, even if the bump 8 is not destroyed, the bump 8 is deformed, the separation distance between the system board 3 and the package board 6 (this separation distance is called a standoff) becomes narrow and non-uniform, and a short circuit occurs between the adjacent bumps 8. Resulting in.

For this reason, conventionally, the standoff member 11 (spacer) has been installed between the system board 3 and the package board 6. FIG. 2 is an enlarged view showing a joint portion between the system board 3 and the package board 6 of the electronic device 1 shown in FIG. In the example shown in the figure, the standoff member 11 is soldered to the package substrate 6 via the solder 12, and the standoff member 11 forms a predetermined standoff between the system board 3 and the package substrate 6. It was configured to be.

By providing the standoff member 11 in this way, the weight of the heat sink 4 and the load of the spring 10 can be mainly received by the standoff member 11 and the force applied to the bump 8 can be reduced. As a result, the bump 8 can be prevented from being deformed or destroyed, and thus the package board 6 and the system board 3 can be reliably and electrically connected to each other.

Further, the standoff members are not limited to the configurations shown in FIGS. 1 and 2, and standoff members having various configurations have been proposed. Specifically, Patent Document 1 discloses an example in which a resin spacer is used as a standoff member interposed between a semiconductor device and a system board (board). Further, in Patent Document 2, the semiconductor device is located substantially in the center of a positioning pin for positioning the semiconductor device and the wiring board by being inserted into both the positioning hole provided in the semiconductor device and the positioning hole provided in the wiring board. A configuration in which a spacer portion (standoff member) for determining the standoff of the wiring board is provided is disclosed.<patcit num="1"><text>Japanese Unexamined Patent Publication No. 10-013012</text></patcit><patcit num="2"><text>Japanese Unexamined Patent Publication No. 09-213743</text></patcit>

<p> In the prior art shown in FIGS. 1 and 2, since the stand-off member 11 is soldered and fixed to the package substrate 6 by the solder 12, it is necessary to improve the solder wettability of the soldered surface of the stand-off member 11. is there. For this reason, surface treatment such as Au plating is required on the surface of the standoff member 11 facing the solder 12, which has been a cause of cost increase. Further, since the material and shape of the standoff member 11 are different from those of the bump 8, special consideration is required for its alignment and handling, and there is a problem that the manufacturing efficiency of the electronic device 1 is lowered. ..</p><p> On the other hand, in the method disclosed in Patent Document 1, since a resin spacer is used as a standoff member, equipment for filling the resin is required, and the equipment cost is small. Further, there is a problem that a new heat treatment is required to cure the resin, and a leveling treatment is also required because the height of the resin spacer is not uniform just by filling the resin spacer, which complicates the manufacturing process. ..</p><p> Further, in the method disclosed in Patent Document 2, since the semiconductor device and the wiring board are positioned by the positioning pin provided with the spacer portion (standoff member), the positioning pin and the positioning hole through which the positioning pin is inserted are made high. There is a problem that it is necessary to process it with high precision, it is difficult and troublesome to manufacture it, and the manufacturing cost increases.</p><p> The present invention has been made in view of the above points, and provides an electronic device, a standoff member, and a method for manufacturing an electronic device capable of supporting a package substrate and a mounting substrate with a predetermined standoff with a simple and low-cost configuration. The purpose is to do.</p>

<p> In order to solve the above problems, the present invention is characterized in that the following means are taken.</p><p> In the invention according to claim 1, the electrode is formed on the upper surface and the electrode is formed on the upper surface.<u style="single">plural</u>It is formed of a mounting substrate on which mounting holes are formed, a semiconductor circuit, a package substrate on which the semiconductor circuit is arranged on the upper surface, and solder that melts when heated, and is arranged on the lower surface of the package substrate. A semiconductor device including a terminal portion in which the package substrate is positioned with respect to the mounting substrate by a self-alignment action on the electrode due to the surface tension of the solder that is heated and melted after being placed on the electrode.<u style="single">plural</u>Mounting hole<u style="single">Any of</u>And the package substrate so that the package substrate maintains a predetermined height with respect to the mounting substrate.<u style="single">At the periphery of</u>It is provided with a support portion that abuts in a relative displaceable manner and supports the package substrate on the mounting substrate.<u style="single">plural</u>It is characterized by having a height maintaining member.</p><p> According to the above invention, the standoff between the package board and the mounting board is predetermined only by bringing the package board into contact with the standoff part in a state where the insertion part of the standoff member is inserted into the mounting hole of the mounting board. Can be maintained at height. Therefore, the conventionally required member for fixing the standoff member and the package substrate becomes unnecessary, and the number of parts can be reduced. Further, since it is not necessary to use the material of the standoff member as a material suitable for soldering, the degree of freedom in selecting the material of the standoff member can be increased.</p><p> Further, the invention according to claim 2 is<u style="single">In the electronic device</u><u style="single">The contact surface of the support portion that comes into contact with the package substrate is formed of a smooth surface.</u>It is a thing.</p><p> According to the above invention, by making the contact surface of the standoff portion in contact with the package substrate flat and smooth, the package substrate can be displaced with respect to the standoff member, and therefore the semiconductor with respect to the mounting substrate. The device is configured to be movable. Therefore, when the semiconductor device is flip-chip bonded to the mounting substrate, self-alignment due to the surface tension generated when the bumps are melted can be expected. Therefore, at the time of flip-chip bonding, the semiconductor device and the mounting substrate can be easily and highly accurately positioned without providing a positioning mechanism or the like.</p><p> Further, the invention according to claim 3 is<u style="single"> In the electronic device</u><u style="single">The tip of the insertion portion to be inserted into the mounting hole is formed in a truncated cone shape.</u>It is a thing.</p><p> According to the above invention, since the tapered surface is formed at the tip of the mounting portion, the standoff member can be easily inserted into the mounting hole formed in the mounting substrate.</p><p> Further, in the above invention, a BGA type semiconductor device can be used as the semiconductor device. Further, an urging member for urging the semiconductor device toward the mounting substrate may be arranged on the upper part of the semiconductor device.</p><p> Also,<u style="single">Claim 5</u>The described invention<u style="single"> plural</u>After the mounting substrate having the mounting holes and the electrodes formed on the upper surface and the semiconductor circuit are arranged on the lower surface of the package substrate arranged on the upper surface and formed of solder, the semiconductor circuit is placed on the electrodes. An electronic device having a semiconductor device having a terminal portion for positioning the package substrate with respect to the mounting substrate by a self-alignment action on the electrodes due to the surface tension of the solder that is heated and melted.<u style="single">Support</u>Height maintenance member<u style="single">group</u>In the above<u style="single">plural</u>Mounting hole<u style="single">Any of</u>And the package substrate so that the package substrate maintains a predetermined height with respect to the mounting substrate.<u style="single">At the periphery of</u>A support portion that abuts in a relative displaceable manner and supports the package substrate on the mounting substrate.<u style="single">Multiple height maintenance members with</u>Height maintenance member characterized by having<u style="single">group</u>Is.</p><p> According to the above invention, since the standoff member has an extremely simple structure including an insertion portion and a standoff portion, productivity is good and cost can be reduced. Further, since the standoff member has a simple structure, it is easy to automate when the standoff member is inserted into the mounting hole, and thus the productivity of the electronic device can be improved.</p><p> Further, the invention according to claim 8 is<u style="single"> plural</u>After the mounting substrate having the mounting holes and the electrodes formed on the upper surface and the semiconductor circuit are arranged on the lower surface of the package substrate arranged on the upper surface and formed of solder, the semiconductor circuit is placed on the electrodes. In the method for manufacturing an electronic device having a semiconductor device including a terminal portion for positioning the package substrate with respect to the mounting substrate by a self-alignment action on the electrodes due to the surface tension of the solder that is heated and melted.<u style="single">plural</u>Mounting hole<u style="single">Any of</u>And the package substrate so that the package substrate maintains a predetermined height with respect to the mounting substrate.<u style="single">At the periphery of</u>It is provided with a support portion that abuts in a relative displaceable manner and supports the package substrate on the mounting substrate.<u style="single">plural</u>A step of inserting the height maintaining member into a mounting hole formed on the mounting board, and a step of mounting the package board on the mounting board so as to face the support portion of the height maintaining member. It is characterized by having a step of heating with the height maintaining member interposed between the package substrate and the mounting substrate, and a step of joining the semiconductor device to the mounting substrate.</p><p> According to the above invention, the semiconductor device and the mounting board are flip-chip bonded by inserting the stand-off member into the mounting hole of the mounting board, placing the package board on the mounting hole, and then heat-treating the package board. It is possible to easily perform the process of flip-chip bonding the semiconductor device and the mounting board while keeping the stand-off between the mounting board and the mounting board constant. Further, since the soldering process for joining the standoff member and the package substrate, which has been conventionally required, is not required, the manufacturing process of the electronic device can be simplified.</p>

<p> As described above, according to the present invention, the standoff member<u style="single">(Height maintenance member)</u>Since the standoff between the package board and the mounting board can be set to a predetermined height without fixing the package board and the package board, the number of parts can be reduced and the material of the standoff member can be selected. You can increase the degree of freedom when doing this. In addition, positioning and bonding processing when flip-chip bonding the semiconductor device to the mounting substrate can be easily and reliably performed.</p>

Next, the best mode for carrying out the present invention will be described with reference to the drawings.

FIG. 3 shows an electronic device 20 which is an embodiment of the present invention. The electronic device 20 shown in the figure includes a semiconductor device 22, a system board 23 (corresponding to the mounting board according to claim), a heat sink 24, and a heat sink 24.<u style="single">Standoff mechanism</u>It is composed of 40 mag.

The semiconductor device 22 has a BGA (Ball Grid Array) type package structure, and is composed of a semiconductor chip 25, a package substrate 26, a lid 27, bumps 28, and the like. The semiconductor chip 25 is a high-speed chip, and therefore a large amount of heat is generated during operation. The semiconductor chip 25 is flip-chip bonded to the upper surface of the package substrate 26. Further, an underfill resin 34 is disposed between the flip-chip-bonded semiconductor chip 25 and the package substrate 26 in order to enhance the bonding reliability.

Further, a lid 27 is arranged on the surface of the package substrate 26 on which the semiconductor chip 25 is mounted in order to protect the semiconductor chip 25. The lid 27 is made of a metal having high thermal conductivity and is solder-bonded to the package substrate 26. A thermal bonding material 35 is arranged between the top plate of the lid 27 and the upper surface of the semiconductor chip 25. Therefore, the semiconductor chip 25 and the lid 27 are thermally connected.

Bumps 28 made of solder balls are arranged on the lower surface of the package substrate 26 (the surface facing the system board 23). The package substrate 26 is a multilayer substrate and functions as an interposer that electrically connects the semiconductor chip 25 and the bump 28.

The bumps 28 are arranged in a matrix on the lower surface of the package substrate 26, which will be described later.<u style="single">Standoff mechanism</u>It is not arranged at the arrangement position of 40. That is, of the package substrate 26<u style="single">Standoff mechanism</u>As for the lower surface corresponding to the arrangement position of 40, the lower surface of the package substrate 26 is a smooth surface.

On the other hand, the heat sink 24 is provided to dissipate heat generated by the semiconductor chip 25. The heat sink 24 is attached to the semiconductor device 22 by an attachment mechanism including a spring 30, a base 31, a shaft 32, and a fixing nut 33. A plurality of shafts 32 are erected on the base 31, and a through hole through which the shaft 32 is inserted is formed in the heat sink 24.

To attach the heat sink 24 to the semiconductor device 22, the semiconductor device 22 is placed on the base 31, and then the heat sink 24 is inserted through the shaft 32. At this time, the thermal bonding material 29 is arranged in advance on the upper surface of the lid 27 constituting the semiconductor device 22. Then, when the heat sink 24 comes into contact with the semiconductor device 22 (lid 27) via the heat bonding material 29, the spring 30 is attached to the shaft 32 extending above the heat sink 24, and the tip of the shaft 32 (the screw portion is previously screwed). Screw the fixing nut 33 into (formed).

As a result, the heat sink 24 is urged toward the base 31 by the spring 30, which causes the heat sink 24 to make strong contact with the semiconductor device 22 (lid 27) via the thermal bonding material 29, and thus the heat generated by the semiconductor chip 25. Conducts heat to the heat sink 24 via the lid 27 and the heat bonding material 29, and dissipates heat in the heat sink 24.

By the way, as described above, in recent years, the calorific value of the semiconductor chip 25 has tended to increase, and along with this, the size of the heat sink 24 has been increased and the material has been changed (for example, from aluminum to copper). Therefore, also in this embodiment, the weight of the heat sink 24 is increased, and the spring force of the spring 30 provided to securely fix the heat sink 24 to the semiconductor device 20 is also set large.

Therefore, it is impossible for the bump 28 (solder ball) to receive all the weight of the heat sink 24 and the load of the spring 30.<u style="single">Standoff mechanism</u>By using 40, the package board 26 is supported with respect to the system board 23.

next,<u style="single">Standoff mechanism</u>The specific configuration of 40 will be described.

FIG. 4 is an enlarged view showing a joint portion between the system board 23 and the package board 26 of the electronic device 20 shown in FIG. As shown in the figure, the package substrate 26 (semiconductor device 22) is attached to the system board 23.<u style="single">Standoff mechanism</u>It is said to be a configuration supported by 40. And this<u style="single">Standoff mechanism</u>A predetermined standoff (distance indicated by arrow H in the figure) is formed between the system board 23 and the package board 26 by 40.

in this way,<u style="single">Standoff mechanism</u>By providing 40, the weight of the heat sink 24 and the load of the spring 30 can be reduced.<u style="single">Standoff mechanism</u>The force mainly received at 40 and applied to the bump 28 can be reduced. As a result, the bump 28 can be prevented from being deformed or destroyed, and thus the system board 23 and the package board 26 can be reliably and electrically connected.

Perform the above functions<u style="single">Standoff mechanism</u>40 is a standoff member<u style="single">(Height maintenance member)</u>It is composed of 41 and a mounting hole 42 formed in the system board 23. The standoff member 41 is not particularly limited as long as it is a material that can receive the weight of the heat sink 24 and the load of the spring 30, and may be made of metal (for example, aluminum or copper), resin, ceramic, or the like. Can be used.

The standoff member 41 has a configuration in which the standoff portion 43 and the insertion portion 44 are integrally formed. The standoff portion 43 has a disk shape, and its height is set to the standoff H and the copper height described above. The contact surface 50 formed on the upper surface of the standoff portion 43 is a surface on which the lower surface of the package substrate 26 is in contact, and is a flat smooth surface.

Further, the insertion portion 44 has a cylindrical shape, and is formed so as to extend downward from the lower surface of the standoff portion 43 coaxially with the standoff portion 43. The diameter D3 of the insertion portion 44 is set to be smaller than the diameter D1 of the standoff portion 43 and the diameter D2 of the mounting hole 42. Further, the diameter D1 of the standoff portion 43 is set to be larger than the diameter D2 of the mounting hole 42 (D1&gt; D2&gt; D3).

The standoff portion 43 having the above configuration is mounted on the system board 23 by inserting the insertion portion 44 into the mounting hole 42. At this time, as in the standoff member 41 shown in FIG. 5, the standoff member 41 is inserted into the mounting hole 42 by forming the tapered portion 45 at the tip (lower end) of the insertion portion 44. Can be easily performed.

Further, since the standoff member 41 has a simple structure in which the columnar insertion portion 44 extends from the lower surface of the disk-shaped standoff portion 43, the standoff member 41 is stored and conveyed in the embossed tape 47 as shown in FIG. It is possible. FIG. 6 (A) is a plan view of the embossed tape 47, and FIG. 6 (B) is a cross-sectional view taken along the line AA in FIG. 6 (A).

As shown in FIG. 6B, the embossed tape 47 is formed with a storage recess 49, and the standoff member 41 can be stored in the storage recess 49. In FIG. 6B, the left side shows the state in which the standoff member 41 is stored, and the right side shows the state in which the standoff member 41 is not stored.

Normally, a cover tape (not shown) for preventing the standoff member 41 from coming off is attached to the upper surface of the embossed tape 47. The standoff member 41 according to this embodiment has a simple configuration in which a columnar insertion portion 44 extends from the lower surface of the disk-shaped standoff portion 43 as described above. Therefore, the cover tape can be attached after the standoff member 41 is stored in the embossed tape 47, which makes it possible to use the embossed tape 47 for the transport process of the standoff member 41.

Embossed tape is widely used for automatic mounting in which electronic components are automatically mounted on a substrate in a semiconductor manufacturing process. Therefore, since the standoff member 41 can be stored in the embossed tape 47, the process of inserting the standoff member 41 into the mounting hole 42 of the system board 23 can be automated, and the manufacturing efficiency of the electronic device 20 can be improved. Can be enhanced.

Subsequently, with reference to FIGS. 7 to 9, the above configuration was adopted.<u style="single">Standoff mechanism</u>A method of manufacturing the electronic device 20 using the 40 will be described. The method of manufacturing the electronic device 20 according to this embodiment is described on the system board 23.<u style="single">Standoff mechanism</u>It is characterized by a process of flip-chip joining the package substrate 26 so as to have a predetermined standoff using the 40, and other manufacturing methods are the same as those of the conventional one. Therefore, in the following explanation<u style="single">Standoff mechanism</u>Only the assembly method using 40 will be described, and the description of other steps will be omitted.

<u style="single">Standoff mechanism</u>To dispose of the package board 26 on the system board 23 using the 40, first, as shown in FIG.<u style="single">Standoff mechanism</u>The standoff members 41 constituting the 40 are mounted in the mounting holes 42 formed in advance in the system board 23. Specifically, the standoff member 41 is mounted on the system board 23 by inserting the insertion portion 44 of the standoff member 41 into the mounting hole 42.

At this time, the insertion portion 44 is only inserted into the mounting hole 42, and is not bonded or the like. Therefore, the number of parts does not increase, and the insertion process is easy, so that the manufacturing cost can be reduced. Further, as described above, by using the embossed tape 47, it is possible to automate the process of inserting the standoff member 41 into the mounting hole 42, and in this case, the manufacturing efficiency can be further improved.

Further, the standoff member 41 does not need to be positioned with respect to the system board 23. Therefore, the insertion portion 44 may be loosely fitted to the mounting hole 42, and therefore the dimensional accuracy of the diameter D2 of the mounting hole 42 and the diameter D3 of the insertion portion 44 may be relatively low. Therefore, the mounting hole 42 and the insertion portion 44 can be easily machined, which also makes it possible to improve the manufacturing efficiency and reduce the cost.

When the standoff member 41 is mounted on the system board 23, the package substrate 26 (semiconductor device 22) is subsequently mounted on the system board 23. FIG. 8 shows a state in which the package board 26 is mounted on the system board 23.

Subsequently, the reflow process is performed with the standoff member 41 interposed between the package substrate 26 and the system board 23, and the package substrate 26 is flip-chip bonded to the system board 23 by melting the bumps 28. For the standoff member 41, a material that is not deformed by heat due to the reflow process is selected.

When the bump 28 melts during the above reflow, the package substrate 26 comes into contact with the contact surface 50 of the standoff member 41 due to the weight of the semiconductor device 22. Since the contact surface 50 is a flat and smooth surface as described above, the package substrate 26 is displaced on the contact surface 50 (standoff portion 43) when the package substrate 26 is in contact with the contact surface 50. It will be in a possible state.

On the other hand, surface tension is generated on the bump 28 by melting, and the action of trying to move itself to the center of the electrode (not shown) formed on the system board 23 corresponding to the bump 28 (called self-alignment). Occurs. Therefore, the package board 26 moves with respect to the system board 23 by this self-alignment action, and the system board 23 and the package board 26 are positioned without particularly providing a positioning mechanism or the like. That is, by using the manufacturing method according to this embodiment, the positioning process of the system board 23 and the package board 26 can be easily and highly accurately performed. Note that FIG. 9 shows a state in which the reflow process is completed.

As described above, according to the manufacturing method of the present embodiment, the package substrate 26 is formed by inserting the standoff member 41 into the mounting hole 42 of the system board 23, placing the package substrate 26 on the mounting hole 42, and then reflowing the package substrate 26. Flip-chip bonded to the system board 23. Therefore, the package substrate 26 (semiconductor device 22) can be flip-chip bonded in a state of being positioned on the system board 23 with high accuracy while keeping the standoff H of the system board 23 and the package substrate 26 constant.

Further, when the package substrate 26 is joined to the system board 23, the soldering process that has been conventionally required becomes unnecessary, so that the manufacturing process of the electronic device 20 can be simplified. Further, since it is not necessary to use the material of the standoff member 41 as a material suitable for soldering, the degree of freedom in selecting the material of the standoff member 41 can be increased.

With respect to the above description, the following sections will be further disclosed. (Appendix 1) A semiconductor device having a package substrate having bumps, a mounting substrate to which the semiconductor device is flip-chip bonded, and the package substrate so that the package substrate has a predetermined standoff with respect to the mounting substrate. In an electronic device having a stand-off mechanism supported on the mounting board, the stand-off mechanism corresponds to a mounting hole formed in the mounting board, an insertion portion inserted into the mounting hole, and the stand-off. An electronic device comprising a stand-off member having a height of the above-mentioned height and having a stand-off portion that abuts on the package substrate so as to be relatively displaceable and supports the package substrate. (1) (Appendix 2) In the electronic device according to Appendix 1, the contact surface of the standoff portion that comes into contact with the package substrate is a flat and smooth surface. (2) (Appendix 3) The electronic device according to Appendix 1 or 2, wherein a tapered surface is formed at the tip of the mounting portion. (3) (Appendix 4) In the electronic device according to any one of Appendix 1 to 3. The semiconductor device is an electronic device characterized by being a BGA type. (Appendix 5) In the electronic device according to any one of Supplementary notes 1 to 4, an urging member for urging the semiconductor device toward the mounting substrate is disposed above the semiconductor device. An electronic device characterized by. (Appendix 6) A standoff member interposed between the package substrate and the mounting substrate so that the package substrate constituting the semiconductor device has a predetermined standoff with respect to the mounting substrate. It is characterized by having an insertion portion to be inserted into the mounting hole formed in the above, and a standoff portion having a height corresponding to the standoff and abutting and supporting the package substrate so as to be relatively displaceable. Standoff member to do. (4) (Appendix 7) In the standoff member described in Appendix 6, the standoff member having a contact surface of the standoff portion that comes into contact with the package substrate is a flat and smooth surface. (Appendix 8) The standoff member according to Appendix 6 or 7, wherein a tapered surface is formed at the tip of the mounting portion. (Appendix 9) An electron that flip-chips a semiconductor device to a mounting substrate by using the stand-off member according to any one of Supplementary note 6 to 8 so that the package substrate of the semiconductor device and the mounting substrate have a predetermined stand-off. In the method of manufacturing the device, the step of inserting the stand-off member into the mounting hole formed in the mounting board and the package board mounted on the mounting board so as to face the stand-off portion of the stand-off member. It is characterized by having a step of placing the semiconductor device and a step of flip-chip joining the semiconductor device to the mounting substrate by performing heat treatment with the standoff member interposed between the package substrate and the mounting substrate. A method of manufacturing an electronic device. (Five)

<figref num="1">FIG. 1 is an overall configuration diagram of an electronic device which is a conventional example.</figref><figref num="2">FIG. 2 is an enlarged view showing the vicinity of the standoff member of the electronic device, which is an example of the conventional case.</figref><figref num="3">FIG. 3 is an overall configuration diagram of an electronic device according to an embodiment of the present invention.</figref><figref num="4">FIG. 4 is an enlarged view showing the vicinity of the standoff mechanism of the electronic device according to the embodiment of the present invention.</figref><figref num="5">FIG. 5 is an enlarged view of a standoff member according to an embodiment of the present invention.</figref><figref num="6">FIG. 6 is a diagram for explaining a state in which the standoff member is housed in the embossed tape.</figref><figref num="7">FIG. 7 is a diagram for explaining a method of manufacturing an electronic device according to an embodiment of the present invention, and is a diagram for explaining a process of mounting a standoff member on a system board.</figref><figref num="8">FIG. 8 is a diagram for explaining a manufacturing method of an electronic device according to an embodiment of the present invention, and is a diagram for explaining a process of placing a package substrate on a standoff member mounted on a system board. Is.</figref><figref num="9">FIG. 9 is a diagram for explaining a method of manufacturing an electronic device according to an embodiment of the present invention, and is a diagram for explaining a process of performing a reflow process.</figref>

Code description

20 Electronic device 22 Semiconductor device 23 System board 24 Heat sink 25 Semiconductor chip 26 Package board 28 Bump 40 Standoff mechanism 41 Standoff member 42 Mounting hole 43 Standoff part 44 Insertion part 45 Tapered part 47 Embossed tape 50 Contact surface