Organic electroluminescent display device and method of fabricating the same

The present invention relates to an electroluminescent device, and more particularly to an organic electroluminescent device and a method for manufacturing the same.

[0002] Since the organic electroluminescent element, which is one of the new flat panel displays (FPDs), is a self-luminous type, it has an excellent viewing angle, contrast, and the like as compared with a liquid crystal display device, and requires a backlight. Since it does not exist, it can be lightweight and thin, which is advantageous in terms of power consumption. Further, it has the advantages of being capable of DC low voltage drive, having a fast response speed, being strong against external impacts because it is entirely solid, having a wide operating temperature range, and being particularly inexpensive in terms of manufacturing costs.

[0003] In particular, the manufacturing process of the organic electroluminescent element is very difficult because, unlike the liquid crystal display device and the PDP (Plasma Display Panel), the vapor deposition and capsule encapsulation equipment can be said to be almost all of the process equipment. It's simple.

[0004] Until now, a passive matrix type without a separate switching element has been mainly used as a driving method for such an organic electroluminescent element.

[0005] However, in the passive matrix method, the scan line and the signal line intersect with each other to form an element in a matrix, and the scan line is divided by time in order to drive each pixel. Since it is driven sequentially, it is necessary to obtain an instantaneous brightness obtained by multiplying the average brightness by the number of lines in order to indicate the required average brightness.

[0006] However, in the active matrix method, a thin film transistor (TFT), which is a switching element for turning pixels on / off, is arranged for each subpixel, and the first electrode connected to the thin film transistor is a subpixel. It is turned on / off in units, and the second electrode facing the first electrode becomes a common electrode.

[0007] Then, in the active matrix method, the voltage applied to the pixels is charged to the storage capacitance, and the number of scanning lines is increased by applying the power supply until the next frame signal is applied. It continues to drive for one screen regardless of.

[0008] Therefore, according to the active matrix method, the same brightness is exhibited even when a low current is applied, so that the active matrix method has the advantages of low power consumption, high definition, and large size.

[0009] Hereinafter, the basic structure and operating characteristics of such an active matrix type organic electroluminescent device will be described in detail with reference to the drawings.

[0010] FIG. 1 is a drawing showing a basic pixel structure of a general active matrix type organic electroluminescent device.

As shown in the figure, a scanning line 1 is formed in the first direction, and a signal line 2 and a power supply line 3 that are separated from each other for a certain period of time are formed in the second direction that intersects the first direction. Defines one subpixel area P.

[0012] A switching thin film transistor T, which is an addressing element, is located at the intersection fulcrum of the scanning line 1 and the signal line 2._SIs formed and this switching thin film transistor T_SAnd storage capacitor C connected to power supply line 3_STIs formed and this storage capacitor C_STAnd the drive thin film transistor T, which is connected to the power supply line 3 and is a current source element._DIs formed and this drive thin film transistor T_DOrganic electroluminescent diode D connected with_ELIs configured.

[0013] This organic electroluminescent diode D_ELWhen an electric current is supplied to the organic luminescent material in the forward direction, electrons and holes recombined with each other while moving through the PN junction between the anode which is the hole providing layer and the cathode which is the electron providing layer. Since electrons and holes have smaller energy when they are separated from each other, the principle of emitting light by the energy difference generated at this time is used.

The organic electroluminescent element is classified into a top emission type and a bottom emission type according to the traveling direction of the light emitted by the organic electroluminescent diode.

[0015] FIG. 2 is a schematic cross-sectional view of the lower light emitting type organic electroluminescent device so far, and is shown centering on one pixel region composed of red, green, and blue subpixels.

[0016] As shown in the drawing, the first substrate 10 and the second substrate 30 are arranged so as to face each other, and the edge portion between the first substrate 10 and the second substrate 30 is sealed by the seal pattern 40. In this structure, a thin film transistor T is formed for each subpixel Psub on the upper part of the first substrate 10, a first electrode 12 is formed by being connected to the thin film transistor T, and the thin film transistor T and the upper part of the first electrode 12 are formed. Is formed with an organic electroluminescent layer 14 containing luminescent substances having red (Red), green (Green), and blue (Blue) colors arranged so as to correspond to the first electrode 12. A second electrode 16 is formed on the upper part.

The first electrode 12 and the second electrode 16 have a role of applying an electric field to the organic electroluminescent layer 14.

[0018] The second electrode 16 and the second substrate 30 are separated from each other for a certain period of time by the seal pattern 40 described above, and although not shown in the drawing, moisture from the outside is applied to the inner surface of the second substrate 30. Includes a blocking hygroscopic agent and a semipermeable tape for adhesion between the hygroscopic agent and the second substrate 30.

[0019] As an example, when the first electrode 12 is used as an anode and the second electrode 16 is used as a cathode in the lower light emitting structure, the first electrode 12 is selected from transparent conductive materials, and the second electrode 16 is The organic electroluminescent layer 14 is selected from metal substances having a low work function, and under such conditions, the organic electric field light emitting layer 14 has a hole injection layer 14a and a hole transporting layer from the layer in contact with the first electrode 12. It has a structure in which 14b, an emission layer 14c, and an electron transporting layer 14d are laminated in this order.

At this time, the light emitting layer 14c has a structure in which luminescent substances embodying red, green, and blue colors are arranged in order for each subpixel.

[0021] FIG. 3 is an enlarged cross-sectional view of the lower light emitting type organic electroluminescent device of FIG. 2 with respect to one subpixel region.

As shown in the figure, a semiconductor layer 62, a gate electrode 68, a source electrode 80, and a drain electrode 82 are formed in order on the transparent substrate 10 to form a thin film transistor T. Source electrode 80 is storage capacitor C_STThe drain electrode 82 is connected to the organic electroluminescent diode D._ELIs connected with. Storage capacitor C_STConsists of a power electrode 72 and a capacitor electrode 64 facing each other with an insulating film in between, and the capacitor electrode 64 is made of the same substance as the semiconductor layer 62.

[0023] The organic electroluminescent diode D_ELAnd storage capacitor C_STIs referred to as array element A.

[0024] The organic electroluminescent diode D_ELIs composed of a first electrode 12 and a second electrode 16 facing each other with the organic electroluminescent layer 14 interposed therebetween. The organic electroluminescent diode D_ELIs located in the light emitting region where self-luminous light is emitted to the outside.

[0025] As described above, the existing organic electroluminescent elements include the array element A and the organic electroluminescent diode D._ELIs characterized by having a structure in which is laminated on the same substrate.

[0026] FIG. 4 is a process flow chart of a conventional manufacturing process of an organic electroluminescent device.

[0027] ST1 is a stage of forming an array element on the first substrate, the first substrate refers to a transparent substrate, and the scanning lines intersect with the scanning lines on the first substrate. Includes a signal line and a power supply line that are separated from each other for a certain period of time, a switching thin film transistor formed at a fulcrum that intersects the scanning line and the signal line, and a driving thin film transistor that is formed at a fulcrum that intersects the scanning line and the power supply line. Including the step of forming an array element.

[0028] ST2 is a stage of forming a first electrode which is a first component of an organic electric field light emitting diode, and the first electrode is connected to a driving thin film transistor and patterned for each subpixel.

[0029] ST3 is a step of forming an organic electroluminescent layer, which is a second component of the organic electroluminescent diode, on the upper part of the first electrode, and when the first electrode is configured as an anode, the organic electroluminescent voltage is formed. The light emitting layer is laminated in the order of a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer.

[0030] ST4 is a step of forming a second electrode, which is a third component of the organic electroluminescent diode, on the upper part of the organic electroluminescent layer, and the second electrode is formed on the entire surface of the substrate as a common electrode.

[0031] ST5 is a stage in which the first substrate is encapsulated by using the second substrate, which is the other substrate. At this stage, the ST5 is protected from the external impact of the first substrate and is organic due to the inflow of outside air. At the stage of encapsulating the outer shell of the first substrate with the second substrate in order to prevent damage to the electroluminescent layer, a hygroscopic agent can be contained in the inner surface of the second substrate.

[0032] As described above, in the existing lower light emitting type organic electroluminescent element, the element is manufactured by joining the substrate on which the array element and the organic electroluminescent diode are formed and a separate capsule encapsulation substrate. In such a case, the product of the yield of the array element and the yield of the organic electroluminescent diode determines the yield of the organic electroluminescent element. Therefore, in the existing organic electroluminescent element structure, the organic electroluminescent element corresponds to the latter half step. There is a problem that the yield of the whole process is significantly limited by the diode process. For example, even if the array element is well formed, if a defect occurs due to foreign matter or other elements when forming the organic electroluminescent layer using a thin film of about 1,000 Å, the organic electroluminescent element is determined to be defective. To.

[0033] As a result, there is a problem that the production yield is lowered due to the loss of various costs and material costs required for manufacturing a non-defective array element.

[0034] The lower light emitting method has a high degree of safety and process freedom due to encapsulation, but has a problem that it is difficult to apply to a high resolution product due to a limitation of the aperture ratio, and the upper light emitting method has a problem. It is advantageous in terms of product life because the thin film transistor design is easy and the aperture ratio can be improved. However, in the existing upper light emitting method structure, the cathode is usually arranged on the upper part of the organic electroluminescent layer, so that the material selection range is wide. Since it is narrow, the transmittance is limited and the light efficiency is lowered, and when the thin film type protective film is formed in order to minimize the decrease in the light transmittance, there is a problem that the outside air cannot be sufficiently blocked.

[Problem to be Solved by the Invention] In order to solve the above problems, the present invention provides a high resolution / high aperture ratio structure active matrix type organic electroluminescent element having an improved production yield and a method for manufacturing the same. The purpose is to provide.

[0036] Therefore, in the present invention, the array element and the organic electroluminescent diode are formed on different substrates to reduce the product defect ratio through inspection steps for each substrate, and the array element is subjected to such a structure. We propose a dual panel type organic electroluminescent device that can improve the aperture ratio without being affected by the thin film transistor design.

[0037] The dual panel type organic electroluminescent device is characterized by including a columnar conductive spacer capable of connecting an array element and an organic electroluminescent diode between two substrates.

[0038] Further, in the present invention, as described above, in a structure in which the array element and the organic field light emitting diode are formed on different substrates and the array element and the organic field light emitting diode are connected through a conductive spacer, a large area thereof When applied to a product, in the bonding process of two substrates, the center of the substrate bulges toward both outer sides due to the difference in adhesive strength between the edge of the substrate where the bonding seal pattern is located and the center of the substrate. Since substrate deflection is likely to occur, in order to prevent poor contact between the conductive spacer and the organic field light emitting diode, a pressure difference is applied by applying the external pressure and internal pressure difference of the substrate in the bonding process. This improves the contact force between the conductive spacer and the organic field light emitting diode.

[Means for Solving the Problems] The organic electric field light emitting device according to the present invention for achieving the above object is separated from the first substrate and faces the first substrate to form a constant space inside. A second substrate, an array element formed on the inner surface of the first substrate, an organic electric field light emitting diode formed on the inner surface of the second substrate, and a seal formed along an edge between the first and second substrates. It includes a pattern and a connection pattern for electrically connecting the array element and an organic electric field light emitting diode, and is characterized in that the pressure in the space between the first and second substrates is lower than atmospheric pressure.

[0040] Here, the first and second substrates include a pixel region including red, green, and blue sub-pixel regions, and the array element can include a thin film transistor.

The organic electroluminescent diode may include a first electrode, an organic electroluminescent layer, and a second electrode.

[0042] The connection pattern connects the thin film transistor and the second electrode. On the other hand, the first electrode is a cathode and can be made of an opaque conductive substance, and the second electrode is an anode and can be made of a transparent conductive substance.

[0043] The connection pattern may also be composed of a metallic substance.

[0044] In the present invention, the connection pattern can have a pillar shape.

[0045] The method for manufacturing an organic electric field light emitting device according to the present invention includes a step of forming an array element on a first substrate, a step of forming a connection pattern electrically connected to the array element, and a step of forming a connection pattern on the second substrate. A step of forming an organic electric field light emitting diode, a step of forming a seal pattern in an edge region between the first substrate and the second substrate so that the array element and the organic electric field light emitting diode face each other, and the first substrate. By applying pressure to the seal pattern in a vacuum chamber so that the space between and the second substrate has a first pressure smaller than atmospheric pressure, the connection pattern and the organic electric field light emitting diode are electrically connected. In this way, the first substrate and the second substrate are first joined together, the seal pattern is first cured, and the first substrate and the second substrate are secondly bonded in a chamber under atmospheric pressure. It includes a step of coalescing and a step of second curing the seal pattern.

[0046] Here, the pressure inside the chamber can be adjusted by the amount of gas.

On the other hand, the first pressure can be about 0.3 torr to about 0.7 torr.

[0048] The organic electroluminescent diode includes a first electrode, an organic light emitting layer, and a second electrode, and the second electrode can be electrically connected to the connection pattern.

The first electrode may be an anode, the second electrode may be a cathode, and the organic electroluminescent layer comprises a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. Can include.

[Embodiments of the Invention] Hereinafter, desirable embodiments according to the present invention will be described in detail with reference to the drawings.

[0051] FIG. 5 is a schematic cross-sectional view of the organic electroluminescent device according to the first embodiment of the present invention, and relates to an upper light emitting type organic electroluminescent device.

As shown in the figure, the first substrate 110 and the second substrate 130 are arranged so as to be separated from each other for a certain period of time, and the seal pattern 140 has an edge between the first substrate 110 and the second substrate 130. It is formed along. An array element 120 is formed on the inner surface of the first substrate 110, and an organic electroluminescent diode D is formed on the inner surface of the second substrate 130._ELIs formed.

[0053] The organic electroluminescent diode D_ELConsists of a first electrode 132, an organic electroluminescent layer 136, and a second electrode 138. The first electrode 132 is formed on the inner surface of the second substrate 130 and is used as a common electrode, and a partition wall 134 located at a sub-pixel Psub boundary is formed on the first electrode 132, and the second electrode 138. Is separated by sub-pixel Psub. Further, the organic electroluminescent layer 136 is formed between the partition walls 134 above the first electrode 132, and the second electrode 138 is formed on the partition wall 134 for each subpixel Psub.

[0054] The organic electroluminescent layer 136 has a structure in which a first organic layer 136a, a light emitting layer 136b, and a second organic layer 136c are laminated in order, and the light emitting layer 136b has red, green, and blue colors for each subpixel Psub. It is composed of substances that emit color. The first and second organic layers 136a and 136c have a role of injecting and transporting electrons or holes into the light emitting layer 136b, and the substances of the first and second organic layers 136a and 136c are determined by the positions of the anode and the cathode. To. As an example, when the light emitting layer 136b is selected from a polymer material and the first electrode 132 is composed of a cathode and the second electrode 138 is composed of an anode, the first organic layer 136a connected to the first electrode 132 is electron-injected. The second organic layer 136c connected to the second electrode 138 has a structure in which the hole injection layer and the hole transport layer are laminated in order.

[0055] The array element 120 includes a thin film transistor T formed on the first substrate 110 for each subpixel Psub. Further, the organic electroluminescent diode D_ELA columnar conductive spacer 114 is arranged in subpixel units to connect the second electrode 138 and the thin film transistor T in order to supply an electric current to the second electrode 138.

[0056] The conductive spacer 114 is a connection pattern whose main purpose is to electrically connect the elements formed on the two substrates 110 and 130, but it is columnar and has a constant height. Since it has the property of maintaining a constant distance between the substrates 110 and 130, it is referred to as a spacer for convenience of explanation.

The thin film transistor T is covered with a protective layer 124, which has a drain contact hole 122 that partially exposes the drain electrode 112. The conductive spacer 114 is connected to the drain electrode 112 of the thin film transistor T through the drain contact hole 122.

[0058] The conductive spacer 114 can be connected to the source electrode of the thin film transistor T, or can be connected to the thin film transistor T by another metallic material patterning.

The thin film transistor T described above is the organic electroluminescent diode D._ELCorresponds to the driving thin film transistor connected with.

[0060] The conductive spacer 114 is preferably selected from a conductive material, preferably from a metal material that is ductile and has a low resistivity value.

[0061] It is desirable that the conductive spacer 114 is formed in the manufacturing process of the array element 120 of the first substrate 110.

[0062] The organic electroluminescent device of the present invention is characterized in that it is an upper light emitting system in which the light emitted from the organic electroluminescent layer 134 is emitted toward the second substrate 130.

[0063] Thereby, the first electrode 132 is characterized in that it is selected from a conductive substance having translucent or antitransparent properties, and the second electrode 136 is selected from an opaque metal substance. Is desirable.

[0064] Further, the space B between the array element 120 and the second electrode 138 is a nitrogen gas (N).₂) Can be filled with an inert gas.

Although not shown in the drawings, the array element 120 is located at a scanning line, a signal line that intersects the scanning line and is isolated from each other for a certain period of time, a power supply line, and a fulcrum at which the scanning line and the signal line intersect. It further includes a switching thin film transistor located, and a storage capacitor.

[0066] In the organic electric field light emitting device according to the present invention, in order to form the array element and the organic electric field light emitting diode on different substrates, the array element and the organic electric field light emitting diode are compared with the existing structure formed on the same substrate. In this case, since the organic electric field light emitting diode is not affected by the yield of the array element in the structure according to the present invention, good characteristics can be exhibited in terms of production control of each element, and the upper light emitting method can be used under the above-mentioned conditions. If a screen is embodied, a thin film transistor can be designed without considering the aperture ratio, and the array process efficiency can be improved. Therefore, a high aperture ratio / high resolution product can be provided, and a dual panel type organic electric field light emission can be provided. Since the diode is formed, the outside air can be effectively blocked as compared with the existing upper light emitting method, and the safety of the product can be enhanced.

[0067] Further, even for the thin film transistor design generated in the conventional lower light emitting type products, by configuring the thin film transistor design on a substrate separate from the organic field light emitting diode, a sufficient degree of freedom for the thin film transistor arrangement can be obtained, and the organic material can be obtained. When compared with the structure in which the first electrode of the field light emitting diode is formed on the transparent substrate, the structure according to the present invention has more freedom with respect to the first electrode when compared with the structure in which the first electrode is formed on the upper part of the existing array element. Has the advantage of being able to enhance.

[0068] As the thin film transistor applied to the organic electroluminescent device according to the present invention, a thin film transistor having various structures other than the top gate type shown in the drawing can be applied.

[0069] Next, an example of poor contact that may occur in a method of connecting an array element and an organic electroluminescent diode through a conductive spacer, such as the dual panel type organic electroluminescent element described above, will be described with reference to the drawings. To do.

[0070] FIG. 6 is a drawing showing poor contact between the conductive spacer and the organic electroluminescent diode during the bonding step in the dual panel type organic electroluminescent device according to the present invention, and is a main component for convenience of explanation. Only shown briefly.

As shown in the drawing, the first substrate 150 and the second substrate 160 are arranged so as to face each other, and the array element 170 is formed on the inner surface of the first substrate 150. An organic field light emitting diode 172 is formed on the inner surface of the second substrate 160, and the electrical connection between the array element 170 and the organic field light emitting diode 172 is a section between the array element 170 and the organic field light emitting diode 172. It is made by a plurality of conductive spacers 180 arranged in.

A seal pattern 182 for joining the first substrate 150 and the second substrate 160 is formed at the edge between the first substrate 150 and the second substrate 160.

[0073] The seal pattern 182 is characterized in that it is composed of a closed pattern having no separate opening.

[0074] When such a dual panel type organic electroluminescent element is applied to a large-area panel, a bonding pressure is applied at a position corresponding to the sealing pattern 182 in the bonding process. In the substrate region at a distance from 182, the substrate tends to swell in both outer directions due to the drop in coalescence pressure, and if the conductive spacer 180 is a pattern included in the first substrate 150, the conductive spacer 180 and There is a problem that a separation section C is generated between the organic electroluminescent LEDs 172 and poor contact occurs locally.

[0075] As described above, if a poor contact occurs between the organic electroluminescent diode 172 and the conductive spacer 180, the current supply to the organic electroluminescent diode 172 is cut off, so that the subpixel cannot emit light. Screen defects are triggered.

[0076] Further, when a contact failure occurs, the state appears as a pixel defect, and when the connection is very weak, the organic electroluminescent element is locally deteriorated due to local heat generation due to an electric current or the like. Occurs, and on the display, it appears as screen unevenness when driven for a long time. Therefore, it can be used as a means for further strengthening the above-mentioned conductive spacer by first bonding the substrates using a pressure lower than the external pressure and then secondary bonding using the pressure difference. it can. That is, in the present invention, the contact characteristics of all the contact portions can be effectively improved by applying a pressure capable of compensating for the degree of bending of the substrate itself.

FIG. 7 is a process flow chart showing the bonding process of the organic electroluminescent device according to the present invention step by step.

[0078] ST11 is a stage in which the first substrate including the array element and the conductive spacer and the second substrate including the organic field light emitting diode are primarily bonded in a vacuum state.

At this time, a seal pattern is formed on the edge of any one of the first substrate and the second substrate, and the first substrate and the second substrate are primarily bonded and fixed by the seal pattern. To.

[0080] The step of maintaining the vacuum state includes a step of providing a vacuum chamber having a gas inlet and an exhaust port, and a step of maintaining the vacuum chamber in a vacuum state which is a pressure state lower than the atmospheric pressure.

[0081] As an example, it is desirable to maintain the vacuum state at 0.3 torr to 0.7 torr, and the pressure inside the vacuum chamber can be adjusted by the amount of gas inflow.

[0082] ST12 is a stage in which the seal pattern of the substrate primaryly bonded in the vacuum state is first cured, and in this stage, the seal pattern is formed in the subsequent bonding step through the fixing of the seal pattern. This is a stage to improve the alignment characteristics of the substrate by preventing it from being sucked into the substrate.

[0083] ST13 is a stage in which the substrates are secondarily bonded in an atmospheric pressure state. At this stage, the pressure difference between the inside and the outside of the substrate is maintained while the inside of the vacuum chamber is maintained in the atmospheric pressure state by exhausting the vacuum chamber. Includes the stage of secondary bonding of substrates using as a bonding force.

That is, at this stage, since the pressure outside the substrate is larger than the pressure inside the substrate, the external pressure presses the substrate inward due to the pressure difference even in regions other than both sides of the substrate fixed by the seal pattern. Therefore, it is possible to prevent the bending phenomenon of the substrate.

[0085] Thereby, the contact characteristics between the conductive spacer in the organic electroluminescent device and the organic electroluminescent device can be improved.

[0086] ST14 is a stage in which the seal pattern of the substrate that has undergone the secondary bonding step is secondarily cured, and ST15 is a stage in which the organic electroluminescent device panel is completed through the secondary curing treatment step of the seal pattern. It is a stage.

[0087] FIG. 8 is a drawing showing a joining process of the organic electroluminescent device according to the present invention.

As shown in the figure, a first substrate 210 on which the array element 220 and the conductive spacer 222 are formed, and an organic electric field light emitting diode 240 connected to the array element 220 through the conductive spacer 222 are formed. In the organic electric field light emitting device panel 290 including the substrate 230 and the seal pattern 270 located at the edge between the first substrate 210 and the second substrate 230, in the present invention, the first substrate 210 and the second substrate 230 are subjected to the external pressure. By reducing the pressure in the region D between the 1st substrate 210 and the 2nd substrate 230, the adhesion characteristics between the conductive spacer 222 and the organic electric field light emitting diode 240 can be improved on the entire surface of the substrate.

[0089] As an example, if the "D" region has a pressure lower than the atmospheric pressure and the pressure around the substrate has an atmospheric pressure state, the pressure difference between the inside and the outside of the substrate causes the substrate from the outside of the substrate. The coalescence pressure that holds down the pressure will work.

Although not shown in detail in the drawings, the array element includes a thin film transistor and a conductive spacer connected to the thin film transistor in subpixel units, and the organic field light emitting diode is a light emitting layer patterned in subpixel units. And has a second electrode.

[0091] However, the present invention is not limited to the above-described embodiment, and can be variously modified and implemented within the limits not deviating from the gist of the present invention.

[Effects of the Invention] As described above, the dual panel type organic electroluminescent device according to the present invention and the joining step thereof have the following effects.

[0093] First, the production yield and the production control efficiency can be improved, and the product life can be extended.

[0094] Secondly, since the upper light emitting method is used, the thin film transistor design is facilitated and a high aperture ratio / high resolution can be realized.

[0095] Third, in order to form the electrode for the organic electroluminescent diode on the substrate, the material selection range can be widened.

[0096] Fourth, since it is a dual panel type while having an upper light emitting system, it is possible to provide a stable product from the outside air.

[0097] Fifth, it is possible to prevent poor electrical contact between the array element and the organic electroluminescent diode even when applied to a large-area product.

BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] An equivalent circuit diagram showing a basic pixel structure of a general active matrix type organic electroluminescent device.

FIG. 2 is a schematic cross-sectional view of a related technology for a lower light emitting type organic electroluminescent device.

FIG. 3 is an enlarged cross-sectional view of an organic electroluminescent device of a related technique with respect to one subpixel region.

FIG. 4 is a process flow chart for a manufacturing process of an organic electroluminescent device of a related technology.

FIG. 5 is a schematic cross-sectional view of an active matrix organic electroluminescent device according to a first embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of an active matrix organic electroluminescent device according to a second embodiment of the present invention.

FIG. 7 is a process flow chart showing a step-by-step bonding process of the organic electroluminescent device according to the present invention.

FIG. 8 is a cross-sectional view of a bonding process of an organic electroluminescent device according to the present invention.