Semiconductor sealing device

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Industrial application field]

The present invention relates to a semiconductor encapsulation device for supplying a resin tablet to a mold and resin-molding a lead frame or the like.

【0002】

[Conventional technology]

Transfer mold devices are often used in the manufacture of resin-sealed semiconductor devices. In this device, a resin tablet and a lead frame are supplied to a mold, the molded product is clamped by the mold, and the molded product is filled with resin to obtain a molded product. The molded product is opened from the mold and taken out from the mold, but in the conventional transfer mold device, the loader is inserted into the mold from the side of the mold in the mold open state to take out the molded product, or a resin tablet or lead. The method of supplying a frame is common.

【0003】

However, there is a limit in shortening the cycle time of the resin molding work by allowing the loader to enter the mold in the mold open state and taking out the molded product. Therefore, as a method of shortening the cycle time of the resin mold, the applicant slides the lower mold of the mold die from the resin mold position to a side position that does not interfere with the press device after the resin mold, and molds at the slide-moved position. We proposed a method for taking out the product and setting the resin tablet and lead frame (Japanese Patent Application No. 4-196977).

【0004】

In this way, the method of sliding the mold to the side once to take out the molded product, etc., can secure a sufficient space at the delivery position, take out the molded product, and supply the resin tablet, etc. Since it can be controlled organically, it has the advantage that the cycle time can be shortened considerably as a whole as compared with the conventional method.

【0005】

[Problems to be Solved by the Invention]

By the way, in the case of resin sealing by the die slide method as described above, the loader is moved onto the mold at the side position of the press device to deliver the molded product, etc., so it is attached to this when designing the loader. If the chuck mechanism and the like are not properly designed, there are problems that the device becomes complicated and that the device cannot be configured compactly. Further, as another problem, since the resin tablet is handled, there is a problem that the resin powder generated from the resin tablet is scattered in the device and hinders the cleanliness of the device.

【0006】

The present invention has been made for the purpose of accurately supplying the resin tablet with the resin sealing device of the die slide method as described above, and the loader for supplying the resin tablet can be compactly formed with a rational configuration. Moreover, the present invention provides a semiconductor encapsulation apparatus capable of appropriately removing resin powder generated from a resin tablet.

【0007】

[Means for solving problems]

The present invention has the following configurations in order to achieve the above object. That is, the mold mold is provided so as to be slidable between the resin mold position and the work delivery position on the side of the resin mold position, and the molded product is taken out by the unloader and the resin tablet is supplied at the work delivery position. A semiconductor encapsulation device that supplies a product to be molded by a loader and molds the resin. The unloader is provided with a resin tablet holder that supplies a resin tablet to the pot according to the arrangement of the mold mold. A resin tablet supply holder is provided in which the unloader enters below the resin tablet holder at a position retracted from the work delivery position and the stored resin tablet is transferred to the resin tablet holder, and the unloader is provided with the mold metal. It is characterized by providing a dust absorbing mechanism that is commonly used for cleaning the mold surface of the mold and cleaning the inside of the holder of the resin tablet supply holder after the resin tablet is transferred to the resin tablet holder.

【0008】

[Action]

The resin tablet supply holder containing the resin tablet is inserted below the resin tablet holder of the unloader, the resin tablet is transferred from the resin tablet supply holder to the resin tablet holder, and then the resin tablet is supplied by the dust absorption mechanism provided in the unloader. Clean the inside of the holder by sucking dust. By cleaning the resin tablet supply holder with a dust absorbing mechanism, unnecessary resin powder is removed and a suitable resin mold is made possible. The dust suction mechanism provided in the unloader is also used for cleaning the mold surface of the mold.

【0009】

[Example]

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 show the configuration and operation of the loader on the supply side of the resin tablet in the semiconductor encapsulation device, and FIG. 3 shows the overall configuration of an embodiment of the semiconductor encapsulation device. First, the overall configuration of the semiconductor encapsulation device will be described with reference to FIG. At the center of the apparatus is a press-molded portion 10 that resin-seals a product to be molded such as a lead frame. A mold die 12 is set in the press molding section 10, and the product to be molded is clamped by the mold die to perform resin molding. The mold of the embodiment is a multi-pot type mold, and a plurality of pots for inserting resin tablets are provided.

【0010】

Reference numeral 12a indicates a mold die slid from the press molding portion 10 to the lateral position thereof. The position of the mold mold 12a is the transfer position of the work. Only the lower die of the mold die 12a is pulled out to a position where the movement of the loader and the press molding portion 10 do not interfere with each other. The loader consists of a loader 14 that supplies a lead frame for molding and an unloader 16 that takes out a molded product and supplies a resin tablet. The loader 14 and the unloader 16 are located at opposite positions with the mold mold 12a at the work delivery position sandwiched between them, and both move back and forth between the work delivery position and the retracted position.

【0011】

Reference numeral 18 denotes a lead frame alignment unit for aligning and transferring the lead frame to the loader 14, and reference numeral 20 denotes a lead frame supply unit for supplying the lead frame to the lead frame alignment unit 18. The unloader 16 has a degate portion 22 for removing unnecessary resin such as a gate from the lead frame after molding, a die cleaner 24 for cleaning the mold surface of the mold mold 12, and a resin for supplying a resin tablet. It has a tablet holder 26. 28 is a pickup unit for storing the lead frame after degate in the magazine, and 30 is a storage magazine.

【0012】

The resin tablets are provided in a stackable manner in the tablet magazine 32. The resin tablet is transferred from the tablet magazine 32 to the resin tablet supply holder 34, and then transferred from the resin tablet supply holder 34 to the resin tablet holder 26. The resin tablet supply holder 34 reciprocates between the horizontal position of the tablet magazine 32 and the lower position of the resin tablet holder 26 on the unloader 16 as shown in the figure. That is, after the resin tablet is transferred from the tablet magazine 32 to the resin tablet supply holder 34, the resin tablet is advanced to a position directly below the resin tablet holder 26, and the resin tablet is delivered to the resin tablet holder 26 at the advanced position.

【0013】

Next, the configuration of the unloader 16 will be described with reference to FIG. The figure is a side view of the unloader 16 in the retracted position, and the right direction of the figure is the work delivery position. In FIG. 1, 40 is a support frame for the unloader 16, and the degate portion 22 includes a chuck portion 42 attached to the support frame 40 and a processing stage 44 for a gate break located below the chuck portion 42. The processing stage 44 is fixed to the apparatus, and the chuck portion 42 is supported by the support frame 40 and moves together. Since the apparatus of the embodiment molds two lead frames at a time, two chuck portions 42 are provided.

【0014】

At the bottom of the front side of the support frame 40, a cleaning brush 46 and a dust suction duct 48 for brushing the mold surface of the mold mold are provided as a die cleaner 24. The dust suction duct 48 is narrowly opened in the width direction of the unloader 16 and sucks resin residue or the like on the mold surface when reciprocating on the mold surface of the mold mold 12 for cleaning. 50 is a hose that connects to the dust collector. The resin tablet holder 26 is fixed to the front side position of the support frame 40. 52 is an air cylinder that drives a pusher that pokes the resin tablet from above and drops it from inside the holder, and 54 is a guide for the pusher. Reference numeral 56 denotes a shutter plate for holding the resin tablet in the resin tablet holder 26, and reference numeral 58 denotes a motor for opening and closing the shutter plate 56.

【0015】

The resin tablet supply holder 34 containing the resin tablet is conveyed to a position directly below the resin tablet holder 26 with the unloader 16 at the position shown in FIG. Then, a push-up pin is inserted from below at a position directly below the resin tablet holder 26, and the resin tablet is pushed up into the resin tablet holder 26. A small hole into which a push-up pin is inserted is transparently formed at the bottom of the resin tablet supply holder 34. When the resin tablet is completely pushed up into the resin tablet holder 26, the shutter plate 56 is inserted into the lower surface of the resin tablet by the drive of the motor 58, whereby the resin tablet is supported so as not to fall.

【0016】

After transferring the resin tablet from the resin tablet supply holder 34 to the resin tablet holder 26, the resin tablet supply holder 34 is cleaned. FIG. 2 shows a state in which the resin tablet supply holder 34 is being cleaned. Since the unloader 16 moves in the direction of the work delivery position, when the dust suction duct 48 comes to the upper position of the resin tablet supply holder 26 during the movement, the unloader 16 is temporarily stopped and the dust collector is operated to operate the resin tablet supply holder. Clean 34. This method is useful in that it is not necessary to provide a special cleaning mechanism by using the cleaning mechanism of the mold mold, and the mechanism of the loader can be simplified.

【0017】

After the cleaning is completed, the resin tablet supply holder 34 returns to the horizontal position of the tablet magazine 32, and the resin tablet for the next supply of the resin tablet is transferred. In the apparatus of the embodiment, after the resin tablet is delivered to the resin tablet holder 26, the resin tablet supply holder 34 is cleaned, and the unloader 16 advances to the work delivery position.

【0018】

At the work transfer position, the unloader 16 initially advances to the end position of the mold surface of the mold mold 12a, chucks the molded product from the mold surface with the chuck portion 42, and when returning, the brush 46 and The mold surface is cleaned by the dust suction duct 48, the shutter plate 56 is opened when the pot position is reached, the air cylinder 52 is operated, and the resin tablet is put into the pot by the tablet pusher. The unloader 16 returns to its original position and is degated. In this way, during the round trip of the unloader 16, the molded product is picked up, the resin tablet is supplied, the mold surface is cleaned, and the degate is performed.

【0019】

In the semiconductor encapsulation device of the embodiment, the unloader 16 is provided with the above-mentioned resin tablet supply mechanism and molded product take-out mechanism, so that the mold die 12a drawn out to the side of the press molding machine 10 is efficiently used. It is possible to take out the molded product and supply the resin tablet, which is effective in shortening the cycle time of the resin mold operation. In addition, by cleaning the resin tablet supply holder 34 using the mold cleaning mechanism, it is possible to rationally clean the resin tablet supply holder 34 without providing a special cleaning mechanism, and the device can be effectively cleaned. At the same time, it has become possible to form the device compactly. Cleaning the equipment is extremely important in practice because more accurate resin encapsulation is required. In the device of the embodiment, since the dust suction duct 48 is located above the resin tablet supply holder, dust can be sucked from the opening side of the holder, and there is an advantage that unnecessary resin powder in the holder can be effectively sucked and removed.

【0020】

In the above embodiment, the timing for cleaning the resin tablet supply holder 34 is that the resin tablet is transferred to the resin tablet holder 26 and is emptied, but the resin tablet is cleaned while being stored in the holder. It is also possible to do. This can be done by appropriately controlling the transport position when the resin tablet supply holder 34 is transported to the unloader 16 side or the moving position of the unloader 16. The resin tablet holder 26 and the resin tablet supply holder 34 are set at positions for storing the resin tablet according to the pot arrangement in the mold. Therefore, in the case of different products, the resin tablet supply holder 34 and the resin tablet holder 26 are exchanged and set.

【0021】

[Effect of the invention]

According to the resin sealing device according to the present invention, as described above, the unloader configuration can be made compact by using the dust absorbing mechanism of the mold provided in the unloader for cleaning the resin tablet supply holder. The space of the device can be saved. Further, since the resin tablet supply holder can be effectively cleaned, the device can be cleaned and good resin sealing can be performed.

[Simple explanation of drawings]

[Figure 1]

It is explanatory drawing which shows the structure of the unloader of the semiconductor sealing apparatus.

[Figure 2]

It is explanatory drawing of the state which the resin tablet supply holder is cleaning.

[Fig. 3]

It is explanatory drawing which shows the planar structure of each part of a semiconductor sealing apparatus.

[Explanation of symbols]

10 Press molding section 12, 12a mold mold 14 Loader 16 Unloader 20 Lead frame supply 22 Degate section 24 Die cleaner 26 Resin tablet holder 30 storage magazine 32 Tablet Magazine 34 Resin tablet supply holder 46 brush 48 Dust collection duct 50 hose 56 Shutter plate