Electronic apparatus

One embodiment of the present invention relates to a light-emitting device. In particular, the present invention relates to a light-emitting device utilizing an electroluminescence (EL) phenomenon. One embodiment of the present invention relates to a display device.

Note that one embodiment of the present invention is not limited to the above technical field. One embodiment of the invention disclosed in this specification and the like relates to a product, a method, or a manufacturing method. One aspect of the invention relates to a process, machine, manufacture, or composition of matter. Therefore, technical fields of one embodiment of the present invention disclosed in this specification more specifically include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, and input/output devices. , their driving method or their manufacturing method.

Note that in this specification and the like, a semiconductor device refers to all devices that can function by utilizing semiconductor characteristics. A semiconductor element such as a transistor, a semiconductor circuit, an arithmetic device, and a memory device are examples of semiconductor devices. Imaging devices, display devices, liquid crystal display devices, light-emitting devices, electro-optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices may include semiconductor devices.

In recent years, light-emitting devices and display devices are expected to be applied to various uses, and are required to be diversified.

For example, light-emitting devices and display devices for use in mobile devices are required to be thin, light-weight, and resistant to breakage.

A light-emitting device using the EL phenomenon (also referred to as an EL element) does not require a backlight, which is required in a liquid crystal display device, and thus can be easily made thinner and lighter. In addition, it has characteristics such as being able to respond to an input signal at high speed and being able to be driven using a DC low-voltage power supply, and its application to light-emitting devices and display devices is being studied.

For example, Patent Document 1 discloses a flexible active-matrix light-emitting device having switching elements such as transistors and organic EL elements on a film substrate.

<p><patcit num="1"><text>JP-A-2003-174153</text></patcit></p>

<p>2. Description of the Related Art In recent years, it has been considered to increase the amount of information to be displayed by enlarging the display area of a display device, thereby improving the visibility of the display. On the other hand, in applications such as mobile devices, increasing the size of the display area reduces portability, making it difficult to achieve both improved display visibility and high portability.</p><p>An object of one embodiment of the present invention is to provide a light-emitting device or the like with excellent portability. Another object is to provide a light-emitting device or the like with excellent visibility. Another object is to provide a light-emitting device or the like that is highly portable and easy to see. Another object is to provide a novel display device or the like.</p><p>The description of these problems does not preclude the existence of other problems. One aspect of the present invention does not need to solve all of these problems. Further, problems other than the above are naturally clarified from the description of the specification or the like, and it is possible to extract problems other than the above from the description of the specification or the like.</p>

<p>One aspect of the present invention includes a flexible light-emitting panel and a plurality of housings supporting the light-emitting panel and provided in parallel, each of the plurality of housings being spaced apart from each other, This is a light-emitting device in which two housings facing each other when the light-emitting panel is folded are magnetically fixed.</p><p>In addition, each of the plurality of housings has a ferromagnetic material, and the ferromagnetic material is arranged so that opposite magnetic poles are directed to the upper surface and the lower surface of the housing, and the upper surfaces of the two adjacent housings. Preferably, each housing is arranged with opposite magnetic poles facing each other.</p><p>Alternatively, each of the plurality of housings may be a first housing provided with a ferromagnetic material such that the magnetic poles face the top surface and the bottom surface of the housing, respectively, or a first housing provided with a soft magnetic material that can be magnetized by the ferromagnetic material. 2, wherein the first housing and the second housing are arranged alternately, and the first housing and the second housing are opposed to each other when the light-emitting panel is folded. , is preferably fixed by magnetism.</p><p>The soft magnetic material preferably contains one or more selected from Fe, Fe--Ni alloy, Fe--Si--Al alloy, and Fe--Co alloy.</p><p>The ferromagnetic material preferably contains one or more selected from isotropic ferrite magnets, anisotropic ferrite magnets, neodymium magnets, samarium-cobalt magnets, and alnico magnets.</p><p>Further, when the two housings facing each other when the light-emitting panel is folded are fixed, the attraction force between the two housings is preferably 0.1 kgf or more and 2.0 kgf or less.</p><p>Further, in any one of the above configurations, when the light-emitting panels are folded so that the adjacent housings are alternately stacked, a specific one of the two housings located at the extreme ends of the plurality of housings is positioned at the top. It is preferable to have a configuration that is reversibly deformable between a first state in which it is folded so that it is positioned at the bottom and a second state in which it is folded so that it is positioned at the lowest position.</p><p>Note that in this specification, a light-emitting device includes a display device using a light-emitting element, a light source (including a lighting device), and the like. In addition, a module in which a connector such as FPC (Flexible Printed Circuit) or TCP (Tape Carrier Package) is attached to the light emitting device, a module in which a printed wiring board is provided in front of the TCP, or a COG ( A module in which an IC (integrated circuit) is directly mounted by the Chip On Glass) method may be included in a light emitting device.</p>

<p>According to one embodiment of the present invention, a light-emitting device with excellent portability can be provided. Alternatively, a light-emitting device with excellent visibility can be provided. Alternatively, a light-emitting device with excellent portability and visibility can be provided.</p><p>Note that one embodiment of the present invention is not limited to these effects. For example, one aspect of the present invention may have effects other than these effects, depending on the circumstances or circumstances.</p>

<figref num="1">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="2">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="3">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="4">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="5">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="6">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="7">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="8">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="9">1A and 1B illustrate a light-emitting panel according to an embodiment;</figref><figref num="10">1A and 1B illustrate a light-emitting panel according to an embodiment;</figref><figref num="11">1A and 1B illustrate a light-emitting panel according to an embodiment;</figref><figref num="12">1A and 1B illustrate a light-emitting panel according to an embodiment;</figref><figref num="13">4A and 4B illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment;</figref><figref num="14">4A and 4B illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment;</figref><figref num="15">1A and 1B illustrate a light-emitting panel according to an embodiment;</figref><figref num="16">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="17">1A and 1B are diagrams each illustrating an example of an electronic device;</figref><figref num="18">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref><figref num="19">4A and 4B illustrate structural examples of a light-emitting device according to an embodiment;</figref>

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art will easily understand that various changes can be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the descriptions of the embodiments shown below.

In the configuration of the invention to be described below, the same reference numerals are used in common for the same parts or parts having similar functions in different drawings, and repeated description thereof will be omitted. Moreover, when referring to similar functions, the hatch patterns may be the same and no particular reference numerals may be attached.

In each drawing described in this specification, the size, layer thickness, or region of each configuration may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale.

Note that ordinal numbers such as "first" and "second" in this specification and the like are added to avoid confusion of constituent elements, and are not numerically limited.

Embodiment 1 In this embodiment, a light-emitting device of one embodiment of the present invention will be described with reference to drawings.

A light-emitting device of one embodiment of the present invention has a structure in which a flexible light-emitting panel is supported by a plurality of spaced housings. The light-emitting device can bend the light-emitting panel in the region between two adjacent housings. In addition, the light emitting device can be folded by bending the light emitting panel so that the surfaces of adjacent housings face each other. The light-emitting device of one embodiment of the present invention has excellent portability in the folded state, and has excellent display visibility in the unfolded state due to a wide seamless light-emitting region (display region).

Further, in the light-emitting device of one embodiment of the present invention, part or all of the housing is magnetized so that two adjacent housings can be fixed by magnetic force when the light-emitting device is folded and used. can be done. Therefore, since a mechanical jig for fixing the housings is not required, an increase in the number of parts can be suppressed and the design can be simplified.

In addition, since magnetic force is used to fix the two housings together, when the light-emitting device is transformed from the unfolded state to the folded state, an attractive force is generated simply by bending the light-emitting panels and bringing the adjacent housings closer together. , the light-emitting device can be semi-automatically transformed into a predetermined shape. Therefore, when the light emitting device is transformed from the unfolded state to the folded state, it is possible to prevent the light emitting panel from being bent or twisted in an unintended direction, thereby suppressing damage to the light emitting panel. On the other hand, for example, in the case of a configuration in which the user bends the light-emitting panel so that the two housings are in contact with each other and then fixes the housings with a fixing jig, the light-emitting panel that connects the two housings is below the specification limit. There is a risk that the light-emitting panel will be damaged due to bending with a radius of curvature of , or twisting the light-emitting panel in an unintended direction.

In addition, since the magnetic attraction force is inversely proportional to the square of the distance between the two bodies, when transforming from the folded state to the unfolded state, a slight amount of force such as inserting a finger etc. between the two fixed housings By creating a gap, the two housings can be easily pulled apart. Therefore, there is no need to separate the two fixed housings by pulling them to the opposite side. It is possible to suppress problems such as slipping.

The light-emitting panel of the light-emitting device of one embodiment of the present invention can be bent inward or outward.

In this specification, bending the light-emitting panel so that the light-emitting surface faces inward is referred to as "inward bending", and bending so that the light-emitting surface of the light-emitting panel faces outward is referred to as "outward bending". A light-emitting surface of a light-emitting panel or a light-emitting device refers to a surface from which light emitted from a light-emitting element is extracted.

When the light-emitting device of one embodiment of the present invention is folded, the light-emitting surface of the light-emitting panel is bent inward, so that the light-emitting surface can be prevented from being scratched or soiled during transportation. For example, it is suitable for carrying the light-emitting device in a pocket of clothes or a bag.

When the light-emitting device of one embodiment of the present invention is used, a wide seamless light-emitting region may be used by opening the light-emitting device, or the light-emitting panel may be bent so that the light-emitting surface faces outward to emit light. A portion of the region may be used. The power consumption of the light-emitting device can be suppressed by making a part of the light-emitting region invisible to the user by folding inward into a non-light-emitting region.

[Configuration example]

Structure examples of the light-emitting device of one embodiment of the present invention are described below. Below, we describe a light-emitting device that has flexible light-emitting panels supported by three housings and that can be transformed from an unfolded state to a three-folded state by bending the light-emitting panels at two points. An example will be described.

FIG. 1(A) shows the light emitting device 100 in an unfolded state. FIG. 1(B) shows the light-emitting device 100 in the middle of changing from one of the unfolded state and the folded state to the other. FIG. 1(C) shows the light emitting device 100 in a folded state. FIG. 2 is an exploded view showing each configuration of the light emitting device 100. As shown in FIG.

A light-emitting device 100 has a flexible light-emitting panel 101 . Further, the light emitting device 100 has a plurality of housings ( housings 111, 112, 113). A plurality of housings are spaced apart from each other and provided in parallel. In the following description, when common matters are described without distinguishing the housings 111, 112, and 113, they may simply be referred to as housings.

Each housing may support the light-emitting panel 101, and may be provided on at least one of the light-emitting surface side of the light-emitting panel and the side opposite to the light-emitting surface (also referred to as the lower surface side or the rear surface side). 1 and 2 show an example of a housing that supports the outer peripheral portion of the light emitting panel 101 on the side of the light emitting surface and the side opposite to the light emitting surface of the light emitting panel. In this way, by using a housing that supports both surfaces of the light-emitting panel 101, mechanical strength is increased, and breakage of the light-emitting device 100 can be prevented.

Each housing may have rigidity, or may use a member that is deformable against a force that causes the housing itself to twist or bend. For each housing, at least a material having lower flexibility than that of the light-emitting panel 101 may be used, and an elastic body such as hard rubber may be used for its skeleton. In addition, as materials that can constitute each housing, plastics, metals such as aluminum, alloys such as stainless steel and titanium alloys, rubbers such as silicone rubber, and the like can be used.

Moreover, as shown in FIGS. 1 and 2, it is preferable to provide a protective layer 102 that supports the outer periphery of the light emitting panel 101 on the side of the light emitting surface and the side opposite to the light emitting surface. Even if the mechanical strength of the light-emitting panel 101 itself is low, the protective layer 102 can increase the mechanical strength at the curved portion. Although the protective layer 102 is provided so as to cover the entire light-emitting panel 101 here, it may be provided at least in the area between the two housings, which is a curved area.

As shown in FIG. 2, the light-emitting panel 101 is sandwiched between two protective layers 102, and the light-emitting panel 101 is arranged so as to be positioned in the center of the protective layer 102 in the thickness direction. And when the protective layer 102 is curved inward or outward, the stress applied to the light-emitting panel 101 can be minimized.

Of the two protective layers 102, the one on the light-emitting surface side preferably has an opening at a position overlapping the light-emitting region of the light-emitting panel 101 and is provided so as to cover the periphery of the light-emitting panel 101. FIG. Alternatively, a protective layer 102 including a light-transmitting member at a position overlapping with the light-emitting region may be used. For example, if the protective layer 102 is provided to cover the wiring and driving circuits positioned at the end of the light-emitting panel 101, it is possible to physically protect them, and also to prevent deterioration by shielding the wiring and driving circuits from light. Furthermore, it is possible to prevent the wiring, the driving circuit, and the like from being visually recognized and spoiling the aesthetic appearance of the light emitting device itself.

Protective layer 102 can be made of, for example, plastic, rubber, metal, alloy, or the like.

It is preferable to use plastic, rubber, titanium alloy, or the like for the protective layer 102 and the housing because the light-emitting device is lightweight and hard to break.

Moreover, it is preferable to use a material having high toughness for the protective layer 102 and the housing. This makes it possible to realize a light-emitting device that has excellent impact resistance and is less likely to break. For example, by using an organic resin, a thin metal material, or an alloy material, it is possible to realize a light-emitting device that is lightweight and hard to break.

For the same reason, it is preferable to use a material having high toughness for the substrate constituting the light-emitting panel 101 as well.

The protective layer 102 and housing positioned on the light-emitting surface side do not matter if they do not overlap the light-emitting region of the light-emitting panel 101 . If the protective layer 102 or housing located on the light emitting surface side overlaps at least a part of the light emitting region, it is preferable to use a material that allows the light emitted from the light emitting panel 101 to pass therethrough. The protective layer 102 and the housing located on the opposite side of the light-emitting surface may or may not be translucent.

When any two of the protective layer 102, the housing, and the light-emitting panel 101 are adhered, various adhesives can be used. For example, resins such as curable resins that cure at room temperature such as two-liquid mixed resins, photocurable resins, and thermosetting resins can be used. Alternatively, a sheet-like adhesive may be used. Moreover, each component of the light-emitting device may be fixed using a screw that penetrates any two or more of the protective layer 102, the housing, and the light-emitting panel 101, or a pin or clip that clamps them.

In the light-emitting device of one embodiment of the present invention, one light-emitting panel 101 (one light-emitting region) can be used by dividing it into two or more at the bent portion. For example, a configuration may be adopted in which the region hidden by folding is made non-luminous, and only the exposed region emits light. As a result, it is possible to reduce the power consumed by the area that is not visually recognized by the user.

The light-emitting device of one embodiment of the present invention may include a sensor for determining whether the light-emitting panel 101 positioned between the housings is curved. For example, it can be configured using a switch, a MEMS pressure sensor, a pressure sensor, or the like.

In the light-emitting device of one embodiment of the present invention, a flexible touch sensor may be provided over the light-emitting panel 101 . Preferably, the touch sensor is provided so that the detection surface of the touch sensor is positioned on the display surface side of the light-emitting panel 101 . At this time, it is preferable that the detection surface of the touch sensor bends along the curved surface formed by the display surface of the light emitting panel 101 when the light emitting panel 101 is bent.

Note that a touch panel having a function as a touch sensor may be used as the light-emitting panel 101. FIG.

Light emitting device 100 can be reversibly deformed from the unfolded state of FIG. 1(A) to the folded state of FIG. 1(C) through the state of FIG. 1(B) by folding between the housings. can be done. At this time, housing 111 and housing 112 are in a state where their relative positions are fixed by magnetic force. Likewise, the relative positions of housing 112 and housing 113 are fixed by magnetic force.

[Method of Fixing Housings by Magnetic Force] Next, an example of a method of fixing the relative positions of the housings by magnetic force when the light emitting device is folded will be described.

FIG. 3A1 is a top view of the light emitting device, and FIG. 3A2 is a rear view of the light emitting device. 3(B1) is a schematic side view of range AB when viewed from the direction of the arrow in FIG. 3(A1), and (B2) is a cross section taken along cutting line CD in FIG. 3(A1). 1 is a schematic diagram; FIG. FIG. 3(C) is a schematic side view of the area AB when viewed from the direction of the arrow in FIG. 3(A1), with the light emitting device folded. In addition, in FIG. 3(B2), the thickness of the light-emitting panel 101 is shown thick for clarity.

The light-emitting device shown in FIG. 3 includes housings 111, 112, and 113 whose surfaces are magnetized. Each housing has a ferromagnetic material on its top and bottom surfaces, the ferromagnetic material being magnetized with opposite magnetic polarities facing the top and bottom surfaces of the housing, respectively. Furthermore, the ferromagnetic material is magnetized such that the top surfaces of two adjacent housings face opposite magnetic poles. Therefore, the lower surfaces of two adjacent housings are similarly magnetized so that the opposite magnetic poles face each other.

In the following description, of the surfaces of the housing, the surface on the side of the light emitting surface will be referred to as the upper surface, and the surface opposite to the light emitting surface will be referred to as the lower surface.

Here, as an example, the ferromagnetic bodies provided on the upper surface of the housing 111, the lower surface of the housing 112, and the upper surface of the housing 113 are magnetized so that the surface side becomes the N pole, and the lower surface of the housing 111, the housing The ferromagnetic material provided on the upper surface of 112 and the lower surface of housing 113 is magnetized so that the surface side becomes the S pole. Needless to say, the configuration may be such that the N pole and the S pole are interchanged.

With such a configuration, as shown in FIG. 3(C), the lower surface of the housing 111 and the lower surface of the housing 112 facing each other when the light emitting device is folded (in FIG. 3(C), ), the magnetic poles are opposite to each other, so the two housings are fixed by attracting each other. Similarly, the upper surface of housing 112 (the surface facing downward in FIG. 3C) and the upper surface of housing 113 are also in a state where the two housings are fixed by attraction.

Examples of ferromagnetic materials include isotropic ferrite magnets, anisotropic ferrite magnets, neodymium magnets (Nd-Fe-B), samarium-cobalt magnets (Sm-Co), alnico magnets (Fe-Al-Ni- Co) can be used. Also, as the ferromagnetic material, a rubber magnet in which a powdery magnet or the like is kneaded into rubber, or a plastic magnet in which plastic is kneaded may be used. These are also called bonded magnets or bonded magnets.

In particular, when the surface of the housing is magnetized and used, the use of the above-described bonded magnet is preferable because the weight can be reduced and the magnet can be easily processed into an arbitrary shape. After processing the housing using such a material, the surface of each housing may be magnetized so that the magnetic poles are oriented in the direction described above.

In this way, by fixing two adjacent housings by two ferromagnetic bodies facing each other, when the two housings are overlapped, the two ferromagnetic bodies will not be affected by each other's magnetic fields. Therefore, it may be possible to reduce the demagnetization of the ferromagnetic material due to the influence of the external magnetic field.

In the above, a ferromagnetic material is provided on the upper surface of the housing, and the upper surface of the housing itself is magnetized. A structure in which a ferromagnetic material is arranged near the upper surface or the lower surface of the body may be employed. Here, FIG. 4(A1) corresponds to FIGS. 3(A1) and (A2) and clearly shows a top view and a rear view of the light emitting device side by side, and FIG. 2 is a schematic cross-sectional view taken along the cutting line EF of FIG.

In addition, in FIG. 4(A2), for clarity, the ferromagnetic material arranged so that the N pole faces in the direction perpendicular to the surface of the housing is denoted as N, and the ferromagnetic body arranged so that the S pole faces The ferromagnetic material arranged in is denoted as S. It is sufficient for these to have different magnetic pole directions, and the same material may be used, or different materials may be used.

At this time, it is preferable to use a material with low magnetic permeability for the housing.

With such a configuration, it is possible to use plastic, glass, ceramic, rubber, or a metal or alloy with low magnetic permeability as the material of the housing, which increases the degree of freedom in selecting the material of the housing. preferable.

Further, as shown in FIGS. 4(B1) and 4(B2), a configuration may be adopted in which a ferromagnetic material is arranged not in the entire housing but in a part of the housing. At this time, it is preferable to dispose two or more ferromagnetic bodies apart from each other on one surface of one housing. When two housings are placed facing each other, the ferromagnetic materials provided in each housing attract each other at two or more points, causing the two housings to move in a plane parallel to the housing surface. The relative positional relationship between the two housings is fixed, and the two-dimensional positional deviation between these two housings can be effectively eliminated.

In addition, if the ferromagnetic material is placed on a part of the housing, the area where the two ferromagnetic bodies face each other when the light emitting device is folded becomes smaller. It is preferable to use a material with a relatively high magnetic flux density (or residual magnetic flux density) as the ferromagnetic material.

The ferromagnetic material to be used should be selected in consideration of the magnetic flux density of the material according to the area where the two ferromagnetic bodies face each other when the two housings are stacked and the distance between the two ferromagnetic bodies. Just do it. For example, the larger the facing area of the two ferromagnetic bodies or the shorter the distance between the two ferromagnetic bodies, the stronger the attractive force between the ferromagnetic bodies, so a material with a low magnetic flux density can be used.

In that case, the magnetic flux density of the ferromagnetic material may be less than 100 mT. Moreover, when it is necessary to use a ferromagnetic material with a large magnetic flux density, a ferromagnetic material with a magnetic flux density of 100 mT or more, 200 mT or more, or 500 mT or more can also be used.

For example, when two housings are placed one on top of the other, the force required to separate the two housings is determined according to the area where each ferromagnetic body faces each other and the magnetic flux density of each ferromagnetic body. be done. The force required to separate the two housings (also referred to as attraction force) is, for example, 0.1 kgf or more and 2.0 kgf or less, preferably 0.2 kgf or more and 1.0 kgf or less, so that the ferromagnetic material ( It is preferable to appropriately set the magnetic flux density) and the area where the two ferromagnetic bodies face each other. With such a range, the two housings can be reliably fixed when the light emitting device is folded, and the two housings can be easily separated when the light emitting device is unfolded. For example, if the attraction force between the two housings is less than 0.05 kgf, the two housings may not be securely fixed. On the other hand, if the distance is larger than the above range, the force of attracting the two housings becomes strong, and it may become difficult to separate the two housings easily.

Further, as shown in FIGS. 4(C1) and 4(C2), a recess may be provided on the housing surface, and a ferromagnetic material may be provided at the bottom of the recess. In this way, when the two housings are stacked, since there is no member constituting the housing between the two ferromagnetic bodies facing each other, the attractive force between the two ferromagnetic bodies can be strengthened. In addition, by making the position where the ferromagnetic bodies are provided visible to the user in this way, for example, by mistakenly inserting something with high magnetic permeability between two ferromagnetic bodies, two It is possible to prevent problems such as being unable to fix one housing. Note that the recess provided in the housing may be filled or covered with a material having a lower magnetic permeability or a higher translucency than the member of the housing.

[Modification 1] In the above description, a ferromagnetic body is provided in each of the adjacent housings, and the position of the two housings is fixed by the magnetic force between the two ferromagnetic bodies. can be replaced with

That is, each of the plurality of housings is provided with a ferromagnetic material so that the magnetic poles face the upper and lower surfaces of the housing, respectively, or is provided with a soft magnetic material that can be magnetized by the ferromagnetic material. Just do it. In addition, it is sufficient to alternately arrange the housings having the ferromagnetic material and the housings having the soft magnetic material.

5 (A1) and (A2) show a configuration in which the ferromagnetic material in housing 111 and housing 113 is replaced with soft magnetic material 122 in the configurations shown in FIGS. 4 (B1) and (B2). showing. Further, since the orientation of the magnetic poles of the ferromagnetic material provided in the housing 112 does not matter at this time, the same hatching pattern as that of the ferromagnetic material 121 is used.

As the material of the soft magnetic body 122, a material with a high magnetic permeability can be used. can be done.

Under ideal conditions, the attraction force between the ferromagnetic material and the soft magnetic material is approximately half the attraction force between two similar ferromagnetic materials. Therefore, as the ferromagnetic material, it is preferable to use a material having a higher magnetic flux density than in the case of using a pair of ferromagnetic materials as described above.

5 (A1) and (A2) are the configurations shown in FIGS. 4 (B1) and (B2), in which the ferromagnetic bodies in the housings 111 and 113 are replaced with the soft magnetic bodies 122. However, it is not limited to this. For example, as shown in FIGS. 5(B1) and 5(B2), the ferromagnetic material inside the housing 112 may be replaced with a soft magnetic material 122. FIG. Further, for example, in the configuration shown in FIG. 3 or another configuration shown in FIG. 4, one of the ferromagnetic bodies of the adjacent housings may be replaced with the soft magnetic body 122 as shown in FIG. good. In addition, the ferromagnetic material 121 and the soft magnetic material 122 are mixedly provided in one housing, and when two adjacent housings are stacked, the ferromagnetic material 121 and the soft magnetic material 122 are arranged so as to face each other. It is good also as a structure which carries out.

Further, instead of the soft magnetic material 122, a soft magnetic material may be used on the surface of the housing or a partial area near the surface.

[Modification 2] In the above description, the ferromagnetic material and the soft magnetic material are arranged along the upper surface or the lower surface of the housing.

FIG. 6 shows a configuration example of a light-emitting device described below. FIG. 6(A) is a schematic top view of the light emitting device in an unfolded state, FIG. 6(B) is a schematic cross-sectional view taken along the cutting line GH in FIG. 6(A), and FIG. 6(C) is a light emitting device. is a schematic cross-sectional view in a folded state.

In the configuration shown in FIG. 6, the ferromagnetic material 121 is arranged inside the housing 112 along the side surface of the housing 112 (the plane perpendicular to the light emitting surface of the light emitting panel 101).

In addition, a soft magnetic material 122 is arranged in housing 111 and housing 113 at a position overlapping ferromagnetic material 121 in housing 112 when the light emitting device is folded as shown in FIG. 6(C). there is

At least one of the ferromagnetic material 121 and the soft magnetic material 122 may be exposed to the outside of each housing.

At this time, the magnetic poles of ferromagnetic material 121 are preferably oriented in a direction perpendicular to the light emitting surface. It is preferable that the magnetic poles of the ferromagnetic material 121 are oriented perpendicular to the light-emitting surface because the force of attraction between the ferromagnetic material 121 and the soft magnetic material 122 increases. On the other hand, when the force of attraction between the ferromagnetic body 121 and the soft magnetic body 122 is too strong, the direction of the magnetic pole of the ferromagnetic body 121 is shifted from the direction perpendicular to the light emitting surface, thereby controlling the force in the direction of weakening it. be able to.

By arranging the ferromagnetic bodies 121 near the side surfaces of the housing in this way, the thickness of the housing can be significantly reduced compared to the case where two ferromagnetic bodies 121 are arranged along the upper and lower surfaces of the housing. can be reduced to In particular, since the light-emitting device of one embodiment of the present invention can be folded and used, the thickness of the housing in the folded state is reduced by reducing the thickness of the housing, which further improves the portability of the light-emitting device. can be made

Although a configuration in which ferromagnetic material 121 is provided in case 112 is shown here, a configuration in which case 111 and case 113 are provided with ferromagnetic material 121 and case 112 is provided with a soft magnetic material may be employed.

Also, ferromagnetic bodies 121 may be provided in the vicinity of the side surfaces of each of the three housings so that the magnetic poles face opposite to each other when folded.

The above is the description of the modification.

Common to any of the light-emitting devices of one embodiment of the present invention described above is that even if the light-emitting panel 101 positioned between the two housings is bent inward or outward, the two housings are can be fixed by magnetic force.

Therefore, as shown in FIG. 7, for example, starting from form X in which the light-emitting device is unfolded, the area between housing 111 and housing 112 is bent outward, and the area between housing 112 and housing 113 is bent inward. , the light-emitting device can be reversibly transformed through form Y1 into form Y2 in which housing 111 is positioned at the top and housing 113 is positioned at the bottom. On the other hand, with form X as a starting point, the section between housings 111 and 112 is bent inward, and the section between housings 112 and 113 is bent outward. is positioned at the bottom and the housing 113 is positioned at the top.

Here, in both the form Y2 and the form Z2 shown in FIG. 7, the relative positions of two adjacent housings are fixed by magnetic force.

That is, in the light-emitting device of one embodiment of the present invention, when the light-emitting panels are folded so that the adjacent housings are alternately stacked, a specific one of the two housings located at the extreme end of the plurality of housings is It can be said that the light emitting device is reversibly transformable between the folded state of being positioned at the top and the state of being folded to be positioned at the bottom.

However, one aspect of the embodiment of the present invention is not limited to this. A plurality of housings may be fixed by bending all the display panels inwardly. For example, FIGS. 16(A) and 16(B) show an example in which a plurality of housings are fixed so that the display panel is bent inward with respect to FIG. 3(C). In this way, the direction of the polarities of the ferromagnetic bodies match both in the case of inward bending and in the case of outward bending, so that they can be properly fixed.

When the display device is not used (not displayed), as shown in FIG. 16, it is preferable to bend all the display panels inward and fix them. As a result, since the surface of the display device is not exposed, the display device can be protected from scratches. Therefore, even if it is put away in a bag or pocket, it can be stored compactly. Further, when a display device is used, it can be displayed even in a folded state by fixing as shown in FIG. 3(C). However, one aspect of the embodiment of the present invention is not limited to this.

In the above description, a light emitting device having three housings and capable of being folded in three has been described as an example, but the number of housings is not limited to this. For example, a light emitting device that includes two housings 110 and can be folded in two as shown in FIG. 8(A), a light emitting device that includes four housings 110 and can be folded in four as shown in FIG. 8(B), A light-emitting device that includes five housings 110 and can be folded in five, as shown in FIG. 8C, is also one embodiment of the present invention, and may have six or more housings 110.

In the above, the configuration in which the two housings are connected by the protective layer 102 has been described as an example, but the two housings may be mechanically connected using a hinge. By using the hinge, the relative movable range between the two housings can be restricted, so that the light-emitting panel 101 can be prevented from being damaged.

In addition, the housing of the light-emitting device of one embodiment of the present invention includes a battery, a printed wiring board on which various ICs such as an arithmetic device and a driver circuit are mounted, a wireless receiver, a wireless transmitter, a wireless power receiver, an acceleration sensor, and the like. By appropriately incorporating electronic components such as various sensors including , it is possible to function as an electronic device such as a mobile terminal, a mobile image reproducing device, and a mobile lighting device. At this time, each electronic component may be collectively provided in any one of a plurality of housings, or may be dispersedly provided in a plurality of housings, and wiring sandwiched between protective layers 102 or protective layers 102 may be provided. A plurality of electronic components in the housing may be electrically connected by wiring or the like provided inside the housing. In addition, a camera, a speaker, various input/output terminals including a power supply terminal, various sensors including an optical sensor, operation buttons, and the like may be incorporated in the housing of the light emitting device.

Further, in each of the drawings illustrated above, the thicknesses of the plurality of housings are shown to be the same, but the thickness is not limited to this, and the thicknesses of the respective housings may be made different. It is preferable to set the thickness of two or more housings, preferably the thickness of all housings to be approximately the same, because it is easy to maintain the horizontality of the light emitting surface when the light emitting device is unfolded. In addition, all or most of the various electronic components are integrated in one of a plurality of housings, and the housing is used as a relatively thick main body, and the thickness of the other housings is reduced. It can also be used as a member for simply supporting the light emitting panel 101 .

Note that although an example in which a light-emitting element is used as a display element is shown, one mode of the embodiment of the present invention is not limited to this.

For example, in this specification and the like, a display device, a display device that is a device having a display device, a light-emitting device, and a light-emitting device that is a device that has a light-emitting device may use various forms or include various elements. can be done. Examples of display elements, display devices, light-emitting elements, or light-emitting devices include EL (electroluminescence) elements (EL elements including organic and inorganic materials, organic EL elements, and inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, , blue LED, etc.), transistors (transistors that emit light depending on current), electron-emitting devices, liquid crystal devices, electronic ink, electrophoretic devices, grating light valves (GLV), plasma display panels (PDP), MEMS (micro-electroMechanical system), digital micromirror device (DMD), DMS (digital micro shutter), IMOD (interference modulation) element, electrowetting element, piezoelectric ceramic display, carbon nanotube, etc. Some have display media that vary in contrast, brightness, reflectance, transmittance, etc., depending on the action. An example of a display device using an EL element is an EL display. Examples of display devices using electron-emitting devices include a field emission display (FED) or an SED flat panel display (SED: Surface-conduction Electron-emitter Display). Examples of display devices using liquid crystal elements include liquid crystal displays (transmissive liquid crystal displays, transflective liquid crystal displays, reflective liquid crystal displays, direct-view liquid crystal displays, and projection liquid crystal displays). An example of a display device using electronic ink or an electrophoretic element is electronic paper.

For example, in this specification and the like, an active matrix system in which pixels have active elements or a passive matrix system in which pixels do not have active elements can be used.

In the active matrix system, not only transistors but also various active elements (active elements, nonlinear elements) can be used as active elements (active elements, nonlinear elements). For example, it is also possible to use MIM (Metal Insulator Metal) or TFD (Thin Film Diode). Since these elements require fewer manufacturing steps, the manufacturing cost can be reduced or the yield can be improved. Alternatively, since these elements are small in size, the aperture ratio can be improved, and low power consumption and high luminance can be achieved.

As a method other than the active matrix method, it is also possible to use a passive matrix method that does not use active elements (active elements, nonlinear elements). Since active elements (active elements, non-linear elements) are not used, the number of manufacturing steps is small, so that manufacturing costs can be reduced or yield can be improved. Alternatively, since an active element (active element, nonlinear element) is not used, the aperture ratio can be improved, and low power consumption or high luminance can be achieved.

This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.

(Embodiment 2) In this embodiment, a light-emitting panel will be described with reference to the drawings.

[Example 1]

FIG. 9(A) shows a plan view of light-emitting panel 101 illustrated in Embodiment 1, and FIG. 9(B) shows an example of a cross-sectional view taken along dashed-dotted line A1-A2 in FIG. 9(A).

The light-emitting panel shown in FIG. 9B has an element layer 501, an adhesive layer 505, and a substrate 503. FIG.

The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light emitting elements, an insulating layer 211, a sealing layer 213, an insulating layer 261, It has a colored layer 259 , a light shielding layer 257 and an insulating layer 255 .

Conductive layer 557 is electrically connected to FPC 508 via connector 215 .

Light emitting element 230 has lower electrode 231 , EL layer 233 and upper electrode 235 . Lower electrode 231 is electrically connected to the source or drain electrode of transistor 240 . An end portion of the lower electrode 231 is covered with an insulating layer 211 . The light emitting element 230 has a top emission structure. The upper electrode 235 is translucent and allows light emitted by the EL layer 233 to pass therethrough.

A colored layer 259 is provided at a position overlapping with the light emitting element 230 , and a light shielding layer 257 is provided at a position overlapping with the insulating layer 211 . The colored layer 259 and the light shielding layer 257 are covered with an insulating layer 261 . A sealing layer 213 is filled between the light emitting element 230 and the insulating layer 261 .

The light emitting panel has a plurality of transistors in the light extraction section 504 and the driving circuit section 506 . A transistor 240 is provided over the insulating layer 205 . The insulating layer 205 and the substrate 201 are bonded together by an adhesive layer 203 . Also, the insulating layer 255 and the substrate 503 are bonded together by an adhesive layer 505 . It is preferable to use a film with low water permeability for the insulating layer 205 and the insulating layer 255 because impurities such as water can be prevented from entering the light-emitting element 230 and the transistor 240, and the reliability of the light-emitting panel increases. The same material as the adhesive layer 505 can be used for the adhesive layer 203 .

In Specific Example 1, the insulating layer 205, the transistor 240, and the light-emitting element 230 are manufactured on a highly heat-resistant manufacturing substrate, the manufacturing substrate is peeled off, and the insulating layer 205 and the transistor 240 are formed on the substrate 201 using the adhesive layer 203. , shows a light-emitting panel that can be fabricated by transposing the light-emitting element 230. FIG. Further, in Specific Example 1, the insulating layer 255, the colored layer 259, and the light shielding layer 257 are produced on a production substrate having high heat resistance, the production substrate is separated, and the insulating layer 255 is formed on the substrate 503 using the adhesive layer 505. , shows a light-emitting panel that can be fabricated by transposing a colored layer 259 and a light-shielding layer 257. FIG.

When a material with high water permeability and low heat resistance (resin, etc.) is used for the substrate, the substrate cannot be subjected to high temperatures during the manufacturing process, so there are restrictions on the conditions for manufacturing transistors and insulating films on the substrate. According to the manufacturing method of this embodiment mode, a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance; therefore, a highly reliable transistor and an insulating film with sufficiently low water permeability can be formed. By transferring them to the substrate 503 or the substrate 201, a highly reliable light-emitting panel can be manufactured. Accordingly, in one embodiment of the present invention, a lightweight or thin light-emitting device with high reliability can be achieved. Details of the manufacturing method will be described later.

Materials with high toughness are preferably used for the substrates 503 and 201, respectively.

This makes it possible to realize a display device that has excellent impact resistance and is less likely to be damaged. For example, by using an organic resin substrate for the substrate 503 and using a thin metal material or alloy material for the substrate 201, the light emission is lighter and less likely to be damaged than when a glass substrate is used as the substrate. panel can be realized.

A metal material or an alloy material has high thermal conductivity and can easily conduct heat to the entire substrate, so that local temperature rise of the light-emitting panel can be suppressed, which is preferable. The thickness of the substrate using a metal material or alloy material is preferably 10 μm or more and 200 μm or less, more preferably 20 μm or more and 50 μm or less.

In addition, if a material with a high thermal emissivity is used for the substrate 201, it is possible to prevent the surface temperature of the light emitting panel from increasing, thereby preventing breakage of the light emitting panel and deterioration of reliability. For example, the substrate 201 may have a laminated structure of a metal substrate and a layer with high thermal emissivity (for example, metal oxide or ceramic material can be used).

[Example 2]

FIG. 10(A) shows another example of the light extraction part 504 in the light emitting panel. The light-emitting panel in FIG. 10A is a light-emitting panel capable of touch operation. In addition, in each of the following specific examples, description of the same configuration as in specific example 1 will be omitted.

The light-emitting panel shown in FIG. 10A has an element layer 501, an adhesive layer 505, and a substrate 503. FIG. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 207, an insulating layer 209, a plurality of light emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer 213, an insulating layer 261, It has a colored layer 259 , a light shielding layer 257 , a plurality of light receiving elements, a conductive layer 281 , a conductive layer 283 , an insulating layer 291 , an insulating layer 293 , an insulating layer 295 , and an insulating layer 255 .

In Specific Example 2, insulating layer 217 is provided on insulating layer 211 . By providing the insulating layer 217, the distance between the substrate 503 and the substrate 201 can be adjusted.

FIG. 10A shows an example in which a light receiving element is provided between the insulating layer 255 and the sealing layer 213. FIG.

Since the light-receiving element can be arranged overlapping the non-light-emitting region (for example, the region where the transistor 240 and the wiring are provided) on the substrate 201 side, the touch sensor can be attached to the light-emitting panel without lowering the aperture ratio of the pixel (light-emitting element). can be provided.

For example, a pn-type or pin-type photodiode can be used as a light receiving element included in the light emitting panel. In this embodiment, a pin-type photodiode having a p-type semiconductor layer 271, an i-type semiconductor layer 273, and an n-type semiconductor layer 275 is used as a light receiving element.

Note that the i-type semiconductor layer 273 contains 1×10 impurities for imparting p-type and 1×10 impurities for imparting n-type.²⁰atoms/cm³The concentration is as follows, and the photoconductivity is 100 times higher than the dark conductivity. The i-type semiconductor layer 273 includes those having an impurity element of Group 13 or Group 15 of the periodic table. That is, the i-type semiconductor exhibits weak n-type electrical conductivity when no impurity element is intentionally added for the purpose of controlling valence electrons. is included in its category, which is intentionally or unintentionally added during or after film formation.

The light shielding layer 257 overlaps the light receiving element on the side closer to the substrate 503 . The light shielding layer 257 positioned between the light receiving element and the sealing layer 213 can suppress the light emitted by the light emitting element 230 from irradiating the light receiving element.

The conductive layers 281 and 283 are electrically connected to light receiving elements, respectively. The conductive layer 281 preferably uses a conductive layer that transmits light incident on the light receiving element. The conductive layer 283 is preferably a conductive layer that blocks light incident on the light receiving element.

It is preferable to provide the optical touch sensor between the substrate 503 and the sealing layer 213 because it is less susceptible to light emission from the light emitting element 230 and the S/N ratio can be improved.

[Example 3]

FIG. 10(B) shows another example of the light extraction part 504 in the light emitting panel. The light-emitting panel of FIG. 10B is a light-emitting panel capable of touch operation.

The light-emitting panel shown in FIG. 10B has an element layer 501, an adhesive layer 505, and a substrate 503. FIG. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 207, an insulating layer 209a, an insulating layer 209b, a plurality of light emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer 213, It has a colored layer 259 , a light shielding layer 257 , a plurality of light receiving elements, a conductive layer 280 , a conductive layer 281 , and an insulating layer 255 .

FIG. 10B shows an example in which a light receiving element is provided between the insulating layer 205 and the sealing layer 213. FIG.

By providing the light-receiving element between the insulating layer 205 and the sealing layer 213, the conductive layer and the light-receiving element electrically connected to the light-receiving element are formed using the same material and in the same process as the conductive layer and the semiconductor layer forming the transistor 240. A photoelectric conversion layer that constitutes an element can be produced. Therefore, a light-emitting panel capable of touch operation can be manufactured without greatly increasing the number of manufacturing steps.

[Example 4]

FIG. 11A shows another example of the light-emitting panel. The light-emitting panel in FIG. 11A is a light-emitting panel capable of touch operation.

The light-emitting panel shown in FIG. 11A has an element layer 501, an adhesive layer 505, and a substrate 503. FIG. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 556, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer, and a sealing layer. It has a blocking layer 213 , a colored layer 259 , a light shielding layer 257 , an insulating layer 255 , a conductive layer 272 , a conductive layer 274 , an insulating layer 276 , an insulating layer 278 , a conductive layer 294 and a conductive layer 296 .

FIG. 11A shows an example in which a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. FIG. A capacitive touch sensor has a conductive layer 272 and a conductive layer 274 .

Conductive layer 556 and conductive layer 557 are electrically connected to FPC 508 via connector 215 . Conductive layer 294 and conductive layer 296 are electrically connected to conductive layer 274 via conductive particles 292 . Therefore, a capacitive touch sensor can be driven through the FPC 508.

[Example 5]

FIG. 11B shows another example of the light-emitting panel. The light-emitting panel in FIG. 11B is a light-emitting panel capable of touch operation.

The light-emitting panel shown in FIG. 11B has an element layer 501, an adhesive layer 505, and a substrate 503. FIG. The element layer 501 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 556, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer, and a sealing layer. It has a blocking layer 213 , a colored layer 259 , a light shielding layer 257 , an insulating layer 255 , a conductive layer 270 , a conductive layer 272 , a conductive layer 274 , an insulating layer 276 and an insulating layer 278 .

FIG. 11B shows an example in which a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. FIG. A capacitive touch sensor has a conductive layer 272 and a conductive layer 274 .

Conductive layer 556 and conductive layer 557 are electrically connected to FPC 508a through connector 215a. Conductive layer 270 is electrically connected to FPC 508b via connector 215b. Therefore, the light-emitting element 230 and the transistor 240 can be driven through the FPC 508a, and the capacitive touch sensor can be driven through the FPC 508b.

[Example 6]

FIG. 12(A) shows another example of the light extraction part 504 in the light emitting panel.

The light extraction portion 504 shown in FIG. 12A includes a substrate 503, an adhesive layer 505, a substrate 202, an insulating layer 205, a plurality of transistors, an insulating layer 207, a conductive layer 208, an insulating layer 209a, an insulating layer 209b, and a plurality of light emitting elements. It has an element, an insulating layer 211 , a sealing layer 213 and a colored layer 259 .

Light emitting element 230 has lower electrode 231 , EL layer 233 and upper electrode 235 . Lower electrode 231 is electrically connected to the source or drain electrode of transistor 240 through conductive layer 208 . An end portion of the lower electrode 231 is covered with an insulating layer 211 . The light emitting element 230 has a bottom emission structure. The lower electrode 231 is translucent and allows light emitted by the EL layer 233 to pass therethrough.

A colored layer 259 is provided at a position overlapping with the light emitting element 230 , and the light emitted by the light emitting element 230 is extracted to the substrate 503 side through the colored layer 259 . A sealing layer 213 is filled between the light emitting element 230 and the substrate 202 . Substrate 202 can be made using the same material as substrate 201 described above.

Note that the touch sensor may be provided on a substrate different from the substrate 503 and the substrate 201. FIG. As an example, an example in which a touch panel 999 is provided over the substrate 503 is shown in FIG. An example in which a touch panel 999 is provided under the substrate 201 is shown in FIG. 19(B). A plurality of electrodes are formed on the touch panel 999 and can be operated as a capacitive touch sensor.

[Example 7]

FIG. 12B shows another example of the light-emitting panel.

The light-emitting panel shown in FIG. 12B has an element layer 501, an adhesive layer 505, and a substrate 503. FIG. The element layer 501 includes a substrate 202, an insulating layer 205, a conductive layer 310a, a conductive layer 310b, a plurality of light emitting elements, an insulating layer 211, a conductive layer 212, and a sealing layer 213.

The conductive layer 310a and the conductive layer 310b are external connection electrodes of the light-emitting panel and can be electrically connected to an FPC or the like.

Light emitting element 230 has lower electrode 231 , EL layer 233 and upper electrode 235 . An end portion of the lower electrode 231 is covered with an insulating layer 211 . The light emitting element 230 has a bottom emission structure. The lower electrode 231 is translucent and allows light emitted by the EL layer 233 to pass therethrough.

Conductive layer 212 is electrically connected to lower electrode 231 .

The substrate 503 may have a hemispherical lens, a microlens array, a film having an uneven structure, a light diffusion film, or the like as a light extraction structure. For example, the light extraction structure can be formed by bonding the lens or film onto a resin substrate using an adhesive or the like having a refractive index similar to that of the substrate or the lens or film.

Although the conductive layer 212 is not necessarily provided, it is preferable to provide it because the voltage drop caused by the resistance of the lower electrode 231 can be suppressed. A conductive layer electrically connected to the upper electrode 235 may be provided over the insulating layer 211 for the same purpose.

The conductive layer 212 is formed of a single layer or a laminate using a material selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, and aluminum, or an alloy material containing these as main components. can do. The film thickness of the conductive layer 212 can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.5 μm or less.

When a paste (such as silver paste) is used as the material of the conductive layer electrically connected to the upper electrode 235, the metal forming the conductive layer aggregates in particles. Therefore, the surface of the conductive layer is rough and has many gaps, and it is difficult for the EL layer 233 to completely cover the conductive layer, which facilitates electrical connection between the upper electrode and the conductive layer, which is preferable. .

[Example of material]

Next, materials and the like that can be used for the light-emitting panel will be described. In addition, description is abbreviate|omitted about the structure previously demonstrated in this Embodiment.

The device layer 501 has at least light emitting devices. As the light emitting element, an element capable of emitting light by itself can be used, and an element whose brightness is controlled by current or voltage is included in its category. For example, a light-emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

The element layer 501 may further include transistors for driving light-emitting elements, touch sensors, and the like.

There is no particular limitation on the structure of the transistor included in the light-emitting panel. For example, a staggered transistor or an inverted staggered transistor may be used. Further, either a top-gate transistor structure or a bottom-gate transistor structure may be used. A semiconductor material used for a transistor is not particularly limited, and examples thereof include silicon and germanium. Alternatively, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In--Ga--Zn-based metal oxide, may be used.

The crystallinity of the semiconductor material used for the transistor is not particularly limited, either an amorphous semiconductor or a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially having a crystal region). may be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.

A light-emitting element included in the light-emitting panel has a pair of electrodes (a lower electrode 231 and an upper electrode 235) and an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes functions as an anode and the other functions as a cathode.

The light emitting element may have any of top emission structure, bottom emission structure, and dual emission structure. A conductive film that transmits visible light is used for the electrode on the light extraction side. A conductive film that reflects visible light is preferably used for the electrode on the side from which light is not extracted.

The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide, gallium-added zinc oxide, or the like. In addition, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metal materials, or nitrides of these metal materials (for example, Titanium nitride) or the like can also be used by forming it thin enough to have translucency. Alternatively, a stacked film of any of the above materials can be used as the conductive layer. For example, it is preferable to use a laminated film of a silver-magnesium alloy and ITO because the conductivity can be increased.

Alternatively, graphene or the like may be used.

For the conductive film that reflects visible light, metal materials such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or alloys containing these metal materials are used. can be done. Moreover, lanthanum, neodymium, germanium, or the like may be added to the metal material or alloy. In addition, alloys containing aluminum such as aluminum and titanium alloys, aluminum and nickel alloys, aluminum and neodymium alloys (aluminum alloys), silver and copper alloys, silver and palladium and copper alloys, and silver and magnesium alloys It can be formed using an alloy containing silver such as. An alloy containing silver and copper is preferred because of its high heat resistance. Furthermore, by stacking a metal film or a metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Materials for the metal film and metal oxide film include titanium and titanium oxide. Alternatively, a conductive film that transmits visible light and a film made of a metal material may be stacked. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, and the like can be used.

The electrodes may be formed using a vapor deposition method or a sputtering method. In addition, it can be formed using an ejection method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

When a voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 231 and the upper electrode 235, holes are injected into the EL layer 233 from the anode side and electrons are injected from the cathode side. The injected electrons and holes recombine in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light.

EL layer 233 has at least a light-emitting layer. The EL layer 233 is a layer other than the light-emitting layer, which includes a substance with a high hole-injection property, a substance with a high hole-transport property, a hole-blocking material, a substance with a high electron-transport property, a substance with a high electron-injection property, or a bipolar layer. (substances with high electron-transporting and hole-transporting properties) and the like.

Either a low-molecular-weight compound or a high-molecular-weight compound can be used for the EL layer 233, and an inorganic compound may be included. Each of the layers constituting the EL layer 233 can be formed by a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an inkjet method, a coating method, or the like.

In the element layer 501, the light-emitting element is preferably provided between a pair of insulating films with low water permeability. As a result, it is possible to prevent impurities such as water from entering the light-emitting element, and to prevent deterioration in the reliability of the light-emitting device.

Examples of the insulating film with low water permeability include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride oxide film, a film containing nitrogen and aluminum such as an aluminum nitride film, and the like. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

For example, the water vapor permeation rate of an insulating film with low water permeability is 1×10^-5[g/m² day] or less, preferably 1 × 10^-6[g/m² day] or less, more preferably 1 × 10^-7[g/m² day] or less, more preferably 1 × 10^-8[g/m² day] or less.

The substrate 503 has a light-transmitting property and transmits at least light emitted from the light-emitting elements included in the element layer 501 . Substrate 503 may be flexible. Also, the refractive index of the substrate 503 is higher than that of the air.

Organic resins are lighter in weight than glass. Therefore, it is preferable to use organic resins for the substrate 503 because the weight of the light-emitting device can be reduced as compared with the case where glass is used.

Materials having flexibility and transparency to visible light include, for example, glass having a thickness sufficient to have flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and polyacrylonitrile resins. , polyimide resin, polymethylmethacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin, and the like. In particular, it is preferable to use a material with a low coefficient of thermal expansion, and for example, polyamideimide resin, polyimide resin, PET, etc. can be preferably used. A substrate obtained by impregnating glass fibers with an organic resin, or a substrate obtained by mixing an inorganic filler with an organic resin to reduce the coefficient of thermal expansion can also be used.

As the substrate 503, a layer using the above material may be a hard coat layer (for example, a silicon nitride layer) that protects the surface of the light emitting device from scratches or the like, or a layer made of a material that can disperse pressure (for example, an aramid resin layer). etc.). In addition, in order to suppress deterioration in the life of the light emitting element due to moisture or the like, the above insulating film having low water permeability may be provided.

The adhesive layer 505 is translucent and transmits at least light emitted from the light emitting elements included in the element layer 501 . Also, the refractive index of the adhesive layer 505 is higher than the refractive index of the air.

For the adhesive layer 505, resins such as curable resins such as two-liquid mixed resins that are cured at room temperature, photocurable resins, and thermosetting resins can be used. Examples thereof include epoxy resins, acrylic resins, silicone resins, phenol resins, and the like. In particular, a material with low moisture permeability such as epoxy resin is preferable.

Moreover, the resin may contain a desiccant. For example, a substance that adsorbs moisture by chemisorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.) can be used. Alternatively, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. It is preferable to include a desiccant because it is possible to prevent impurities such as moisture from entering the light-emitting element and improve the reliability of the light-emitting device.

In addition, by mixing a filler having a high refractive index (titanium oxide, etc.) into the above resin, the light extraction efficiency from the light emitting element can be improved, which is preferable.

Further, the adhesive layer 505 may have a scattering member that scatters light. For example, the adhesive layer 505 may use a mixture of the resin and particles having a different refractive index from the resin. The particles function as light scattering members.

The difference in refractive index between the resin and the particles having a refractive index different from that of the resin is preferably 0.1 or more, more preferably 0.3 or more. Specifically, epoxy resin, acrylic resin, imide resin, silicone, or the like can be used as the resin. As the particles, titanium oxide, barium oxide, zeolite, and the like can be used.

Titanium oxide and barium oxide particles are preferred due to their strong light scattering properties. Further, when zeolite is used, water contained in resin or the like can be adsorbed, and the reliability of the light-emitting element can be improved.

An inorganic insulating material can be used for the insulating layers 205 and 255 . In particular, it is preferable to use the above-described insulating film with low water permeability because a highly reliable light-emitting panel can be realized.

The insulating layer 207 has the effect of suppressing the diffusion of impurities into the semiconductor forming the transistor. As the insulating layer 207, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film can be used.

As the insulating layer 209, the insulating layer 209a, and the insulating layer 209b, an insulating film having a planarization function is preferably selected in order to reduce surface unevenness caused by a transistor or the like. For example, organic materials such as polyimide, acryl, and benzocyclobutene-based resins can be used. In addition to the above organic materials, low dielectric constant materials (low-k materials) and the like can be used. Note that a plurality of insulating films or inorganic insulating films formed of these materials may be stacked.

The insulating layer 211 is provided to cover the edge of the lower electrode 231 . In order to improve the coverage of the EL layer 233 and the upper electrode 235 formed on the insulating layer 211, it is preferable that the side wall of the insulating layer 211 be an inclined surface formed with a continuous curvature.

As a material for the insulating layer 211, a resin or an inorganic insulating material can be used. As the resin, for example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, phenol resin, or the like can be used. In particular, it is preferable to use a negative photosensitive resin or a positive photosensitive resin because the insulating layer 211 can be easily manufactured.

A method for forming the insulating layer 211 is not particularly limited, but a photolithography method, a sputtering method, a vapor deposition method, a droplet discharge method (inkjet method, etc.), a printing method (screen printing, offset printing, etc.), or the like may be used.

The insulating layer 217 can be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, as the organic insulating material, a negative-type or positive-type photosensitive resin, a non-photosensitive resin, or the like can be used. Moreover, titanium, aluminum, or the like can be used as the metal material. By using a conductive material for the insulating layer 217 and electrically connecting the insulating layer 217 and the upper electrode 235, a potential drop due to the resistance of the upper electrode 235 can be suppressed. Also, the insulating layer 217 may have a forward tapered shape or a reverse tapered shape.

The insulating layer 276, the insulating layer 278, the insulating layer 291, the insulating layer 293, and the insulating layer 295 can each be formed using an inorganic insulating material or an organic insulating material. In particular, insulating layers 278 and 295 are preferably insulating layers having a flattening function in order to reduce surface unevenness caused by the sensor element.

For the sealing layer 213, a resin such as a two-liquid mixed resin that cures at room temperature, a photocurable resin, or a thermosetting resin can be used. For example, PVC (polyvinyl chloride) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB (polyvinyl butyral) resin, EVA (ethylene vinyl acetate) resin, and the like can be used. The sealing layer 213 may contain a desiccant. Further, when the light from the light-emitting element 230 passes through the sealing layer 213 and is extracted to the outside of the light-emitting panel, the sealing layer 213 preferably contains a filler with a high refractive index or a scattering member. Materials similar to those that can be used for the adhesive layer 505 can be used for the desiccant, filler with a high refractive index, and scattering member.

The conductive layer 556, the conductive layer 557, the conductive layer 294, and the conductive layer 296 can be formed using the same material and in the same process as the conductive layers forming the transistor or the light-emitting element. In addition, the conductive layer 280 can be formed using the same material and in the same process as the conductive layers forming the transistor.

For example, each of the conductive layers is formed as a single layer or as a laminate using metal materials such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, and scandium, or alloy materials containing these elements. can do. Further, each of the conductive layers may be formed using a conductive metal oxide. Indium oxide (In₂O₃etc.), tin oxide (SnO₂etc.), zinc oxide (ZnO), ITO, indium zinc oxide (In₂O₃-ZnO, etc.) or these metal oxide materials containing silicon oxide can be used.

The conductive layer 208, the conductive layer 212, the conductive layer 310a, and the conductive layer 310b can also be formed using the above metal material, alloy material, conductive metal oxide, or the like.

The conductive layers 272 and 274, and the conductive layers 281 and 283 are light-transmitting conductive layers. For example, indium oxide, ITO, indium zinc oxide, zinc oxide, gallium-added zinc oxide, or the like can be used. In addition, the conductive layer 270 can be formed using the same material and the same process as the conductive layer 272 .

As the conductive particles 292, particles such as organic resin or silica coated with a metal material are used. It is preferable to use nickel or gold as the metal material because the contact resistance can be reduced. In addition, it is preferable to use particles coated with two or more kinds of metal materials in layers, such as coating nickel with gold.

As the connector 215, a paste-like or sheet-like material obtained by mixing metal particles or particles similar to the conductive particles described above with a thermosetting resin is used, and the material exhibits anisotropic conductivity by thermocompression bonding. can be used. As the metal particles, it is preferable to use particles in which two or more kinds of metals are layered, such as nickel particles coated with gold.

The colored layer 259 is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, and a blue (B) color filter that transmits light in the blue wavelength band. A color filter or the like can be used. Each colored layer is formed at a desired position using various materials by a printing method, an inkjet method, an etching method using photolithography, or the like.

A light shielding layer 257 is provided between adjacent colored layers 259 . The light shielding layer 257 shields the light from the adjacent light emitting elements and suppresses color mixture between adjacent pixels. Here, by providing an end portion of the colored layer 259 so as to overlap with the light shielding layer 257, light leakage can be suppressed. The light shielding layer 257 can use a material that shields light emitted from the light emitting element, and can be formed using a metal material, a resin material containing a pigment or a dye, or the like. As shown in FIG. 9A, it is preferable to provide the light shielding layer 257 in a region other than the light extraction portion 504, such as the drive circuit portion 506, because unintended light leakage due to guided light or the like can be suppressed.

In addition, it is preferable to provide an insulating layer 261 that covers the colored layer 259 and the light shielding layer 257 because it is possible to prevent impurities such as pigments contained in the colored layer 259 and the light shielding layer 257 from diffusing into the light emitting element or the like. The insulating layer 261 uses a translucent material, and an inorganic insulating material or an organic insulating material can be used. The insulating film with low water permeability described above may be used for the insulating layer 261 .

The above is the description of an example of the material.

[Example of manufacturing method]

Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 13 and 14. FIG. Here, the light-emitting panel having the configuration of Specific Example 1 (FIG. 9(B)) will be described as an example.

First, the separation layer 303 is formed over the formation substrate 301 and the insulating layer 205 is formed over the separation layer 303 . Next, over the insulating layer 205, a plurality of transistors, a conductive layer 557, an insulating layer 207, an insulating layer 209, a plurality of light emitting elements, and an insulating layer 211 are formed. Note that the insulating layer 211, the insulating layer 209, and the insulating layer 207 are opened so that the conductive layer 557 is exposed (FIG. 13A).

A separation layer 307 is formed over the formation substrate 305 and an insulating layer 255 is formed over the separation layer 307 . Next, a light-shielding layer 257, a colored layer 259, and an insulating layer 261 are formed over the insulating layer 255 (FIG. 13B).

As the production substrate 301 and the production substrate 305, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, or the like can be used, respectively.

Glass materials such as aluminosilicate glass, aluminoborosilicate glass, and barium borosilicate glass can be used for the glass substrate. When the temperature of the subsequent heat treatment is high, it is preferable to use a material with a strain point of 730°C or higher. By containing a large amount of barium oxide (BaO), more practical heat-resistant glass can be obtained. In addition, crystallized glass or the like can be used.

When a glass substrate is used as the production substrate, contamination from the glass substrate can be prevented by forming an insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film between the production substrate and the separation layer. It is preventable and desirable.

The separation layer 303 and the separation layer 307 are each an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, and silicon. It is a single layer or laminated layer made of an alloy material containing the element or a compound material containing the element. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. Note that the coating method includes a spin coating method, a droplet discharge method, and a dispensing method.

When the separation layer has a single-layer structure, it is preferable to form a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum. Alternatively, a layer containing an oxide or oxynitride of tungsten, a layer containing an oxide or oxynitride of molybdenum, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

In the case where a layer containing tungsten and a layer containing oxide of tungsten are formed as the separation layer, the layer containing tungsten is formed and an insulating film formed using oxide is formed thereover. , the fact that a layer containing a tungsten oxide is formed at the interface between the tungsten layer and the insulating film may be utilized. In addition, the surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N₂O) A layer containing an oxide of tungsten may be formed by plasma treatment, treatment with a strong oxidizing solution such as ozone water, or the like. Plasma treatment and heat treatment may be performed in an atmosphere of oxygen, nitrogen, nitrous oxide alone, or in a mixed gas atmosphere of these gases and other gases. By changing the surface state of the peeling layer by the above plasma treatment or heat treatment, it is possible to control the adhesion between the peeling layer and an insulating film to be formed later.

Each insulating layer can be formed using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is formed by a plasma CVD method at a film formation temperature of 250 ° C or higher and 400 ° C or lower. As a result, a dense membrane with very low water permeability can be obtained.

After that, a material to be the sealing layer 213 is applied to the surface of the production substrate 305 provided with the colored layer 259 or the like or the surface of the production substrate 301 provided with the light emitting element 230 or the like, and the surface is coated with the sealing layer 213 interposed therebetween. Stick them together (Fig. 13(C)).

Then, the manufacturing substrate 301 is peeled off, and the exposed insulating layer 205 and the substrate 201 are bonded together using the adhesive layer 203 . In addition, the manufacturing substrate 305 is peeled off, and the exposed insulating layer 255 and the substrate 503 are bonded together using the adhesive layer 505 . Although the substrate 503 does not overlap the conductive layer 557 in FIG. 14A, the conductive layer 557 and the substrate 503 may overlap.

Various methods can be used as appropriate for the peeling step. For example, when a layer containing a metal oxide film is formed as the separation layer on the side in contact with the layer to be separated, the metal oxide film is weakened by crystallization, so that the layer to be separated can be separated from the formation substrate. Further, in the case where an amorphous silicon film containing hydrogen is formed as a separation layer between the formation substrate with high heat resistance and the layer to be separated, the amorphous silicon film can be removed by laser light irradiation or etching. , the layer to be peeled can be peeled off from the production substrate. In addition, as the peeling layer, a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled, the metal oxide film is weakened by crystallization, and a part of the peeling layer is removed with a solution or NF.₃, BrF₃, ClF₃After being removed by etching using a fluoride gas such as fluorinated gas, the weakened metal oxide film can be peeled off. Further, a film containing nitrogen, oxygen, hydrogen, or the like (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, or the like) is used as the peeling layer, and the peeling layer is irradiated with laser light. A method may be used in which nitrogen, oxygen, or hydrogen contained in the peeling layer is released as gas to accelerate the peeling between the layer to be peeled and the substrate. In addition, the production substrate on which the layer to be peeled is formed is mechanically removed or a solution or NF is used.₃, BrF₃, ClF₃It is possible to use a method of removing by etching with a fluoride gas such as. In this case, the release layer may not be provided.

Moreover, the peeling process can be performed more easily by combining a plurality of the above peeling methods. In other words, laser light irradiation, etching of the peeling layer with a gas or solution, mechanical removal with a sharp knife or scalpel, etc. are performed to make the peeling layer and the layer to be peeled off easily, and then physical Peeling can also be accomplished by force (such as by a machine).

Alternatively, the layer to be separated may be separated from the production substrate by infiltrating liquid into the interface between the separation layer and the layer to be separated. Alternatively, the peeling may be performed while spraying a liquid such as water.

As another peeling method, when the peeling layer is formed of tungsten, the peeling may be performed while etching the peeling layer with a mixed solution of ammonia water and hydrogen peroxide solution.

Note that the separation layer may not be provided when separation can be performed at the interface between the formation substrate and the layer to be separated. For example, glass is used as a manufacturing substrate, an organic resin such as polyimide is formed in contact with the glass, and an insulating film, a transistor, and the like are formed over the organic resin. In this case, the organic resin can be separated at the interface between the production substrate and the organic resin by heating the organic resin. Alternatively, a metal layer may be provided between the formation substrate and the organic resin, and the metal layer may be heated by passing an electric current through the metal layer, so that the separation may be performed at the interface between the metal layer and the organic resin.

Finally, the insulating layer 255 and the sealing layer 213 are opened to expose the conductive layer 557 (FIG. 14(B)). When the substrate 503 overlaps with the conductive layer 557, the substrate 503 and the adhesive layer 505 are also opened (FIG. 14(C)). The means for opening is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, or the like may be used. Alternatively, the film over the conductive layer 557 may be cut with a sharp knife or the like, and part of the film may be peeled off by physical force.

Through the above steps, a light-emitting panel can be manufactured.

As described above, the light-emitting panel of this embodiment is composed of two substrates, substrate 503 and substrate 201 or substrate 202 . Furthermore, even a configuration including a touch sensor can be configured with two substrates. Minimizing the number of substrates facilitates light extraction efficiency and display clarity.

[Variation]

A light-emitting panel that is partially different from the above will be described below with reference to FIG.

The light emitting panel shown in FIG. 15 includes a substrate 401, a transistor 240, a light emitting element 230, an insulating layer 207, an insulating layer 209, an insulating layer 211, an insulating layer 217, a space 405, an insulating layer 261, a light shielding layer 257, a colored layer 259, a light It has an element (having a p-type semiconductor layer 271, an i-type semiconductor layer 273, and an n-type semiconductor layer 275), a conductive layer 281, a conductive layer 283, an insulating layer 291, an insulating layer 293, an insulating layer 295, and a substrate 403.

The light-emitting panel has an adhesive layer (not shown) arranged in a frame shape between the substrates 401 and 403 so as to surround the light-emitting element 230 and the light-receiving element. The light emitting element 230 is sealed by the adhesive layer, substrate 401 and substrate 403 .

In the light-emitting panel of this embodiment, the substrate 403 has translucency. The light emitted by the light emitting element 230 is taken out to the atmosphere through the colored layer 259, the substrate 403, and the like.

The light-emitting panel of this embodiment is a light-emitting panel capable of touch operation. Specifically, the light-receiving element can be used to detect the proximity or contact of an object to be detected with the surface of the substrate 403 .

The optical touch sensor is preferable because of its high durability, because the detection accuracy is not affected even if the surface with which the object to be detected contacts is scratched. In addition, the optical touch sensor has advantages such as the ability to perform non-contact sensing, the sharpness of the image does not deteriorate even when applied to display devices, and the ability to be applied to large light-emitting panels and display devices. be.

It is preferable to have the optical touch sensor between the substrate 403 and the space 405 because it is less susceptible to the light emission of the light emitting element 230 and the S/N ratio can be improved.

The light shielding layer 257 overlaps the light receiving element on the side closer to the substrate 403 . The light shielding layer 257 can prevent the light emitted from the light emitting element 230 from being applied to the light receiving element.

Materials used for the substrates 401 and 403 are not particularly limited. A material that transmits the light is used for the substrate on the side from which the light from the light-emitting element is extracted. For example, materials such as glass, quartz, ceramic, sapphire, and organic resin that are thin enough to have flexibility can be used. Since the substrate on the side from which emitted light is not extracted does not have to be translucent, a metal substrate using a metal material or an alloy material, or the like can be used in addition to the substrates listed above. For the substrates 401 and 403, the substrate materials exemplified in the previous embodiments can also be used.

The sealing method of the light-emitting panel is not limited, and may be, for example, solid sealing or hollow sealing. For example, it is possible to use a glass material such as glass frit, a resin material such as a curable resin that cures at room temperature such as a two-liquid mixed resin, a photocurable resin, or a thermosetting resin.

The space 405 may be filled with an inert gas such as nitrogen or argon, or may be filled with the same resin as the sealing layer 213 or the like. Further, the resin may contain the aforementioned desiccant, high refractive index filler, or scattering member.

This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.

Embodiment 3 In this embodiment, examples of electronic devices and lighting devices to which the display device of one embodiment of the present invention is applied will be described with reference to drawings.

Examples of electronic devices to which a display device having a flexible shape is applied include television devices (also called televisions or television receivers), monitors for computers, digital cameras, digital video cameras, digital photo frames, and mobile phones. (Also referred to as a mobile phone or a mobile phone device), portable game machines, personal digital assistants, sound reproducing devices, large game machines such as pachinko machines, and the like.

It is also possible to incorporate the illumination device and the display device along the inner or outer wall of a house or building, or along the curved surface of the interior or exterior of an automobile.

17(A) and 17(B) illustrate a tablet terminal 9600 that can be folded in half. Although an example of folding in two is shown here, it can also be applied to folds with a large number of folds, such as folding in three or four. FIG. 17A shows a state in which the tablet terminal 9600 is opened, and the tablet terminal 9600 includes a housing 9630, a display unit 9631, a display mode switching switch 9626, a power switch 9627, a power saving mode switching switch 9625, and a clasp. It has a tool 9629 and an operation switch 9628 .

The housing 9630 has a housing 9630a and a housing 9630b. In addition, the housing 9630 can be folded in two by the hinge portion 9639 .

In addition, the display portion 9631 is formed over the housing 9630a, the housing 9630b, and the hinge portion 9639. FIG. By using the display device disclosed in this specification and the like for the display portion 9631, the display portion 9631 can be bent, and a highly reliable tablet terminal can be obtained.

A part of the display portion 9631 can be a touch panel region 9632, and data can be input by touching displayed operation keys 9638. FIG. Note that the display portion 9631 can have, for example, a structure in which a half region has only a display function and the other half region has a structure in which a touch panel function is provided. Further, the entire area of the display portion 9631 may have a touch panel function. For example, a keyboard button can be displayed on the entire surface of the display portion 9631 so that it can be used as a data input terminal.

Also, the display mode switching switch 9626 can switch the orientation of display such as vertical display or horizontal display, and can select switching between monochrome display and color display. The power saving mode switch 9625 can optimize display brightness according to the amount of external light during use detected by an optical sensor built into the tablet terminal. The tablet terminal may incorporate not only the optical sensor but also other detection devices such as a sensor for detecting inclination such as a gyro and an acceleration sensor.

FIG. 17B shows a state in which the tablet terminal 9600 is closed, and the tablet terminal 9600 includes a housing 9630, a solar cell 9633, and a charge/discharge control circuit 9634. FIG. Note that FIG. 17B shows a structure including a battery 9635 and a DCDC converter 9636 as an example of the charge/discharge control circuit 9634. FIG.

By using the display device disclosed in this specification and the like for the display portion 9631, the display portion 9631 can be folded. For example, since the tablet terminal 9600 can be folded in half, the housing 9630 can be closed when not in use. Therefore, since the display portion 9631 can be protected by closing the housing 9630, the tablet terminal can have excellent durability, portability, and reliability from the viewpoint of long-term use.

In addition, the tablet terminals shown in FIGS. 17(A) and 17(B) have functions to display various information (still images, moving images, text images, etc.), calendars, date or time, etc. It can have a function of displaying on the display unit, a touch input function of performing a touch input operation or editing information displayed on the display unit, a function of controlling processing by various software (programs), and the like.

A solar cell 9633 attached to the surface of the tablet terminal can supply power to a touch panel, a display portion, a video signal processing portion, or the like. Note that the solar cell 9633 can be provided on one or two surfaces of the housing 9630 and can be configured to charge the battery 9635, which is preferable. Note that using a lithium ion battery as the battery 9635 has advantages such as miniaturization.

The structure and operation of the charge/discharge control circuit 9634 shown in FIG. 17(B) will be described with reference to a block diagram in FIG. 17(C). FIG. 17C shows a solar cell 9633, a battery 9635, a DCDC converter 9636, a converter 9637, switches SW1 to SW3, and a display portion 9631. A battery 9635, a DCDC converter 9636, a converter 9637, and switches SW1 to SW3 are shown. , corresponding to the charge/discharge control circuit 9634 shown in FIG. 17(B).

First, an example of operation in the case where the solar cell 9633 generates power by outside light will be described. The power generated by the solar cell is stepped up or stepped down by a DCDC converter 9636 so as to have a voltage for charging the battery 9635 . Then, when the power from the solar battery 9633 is used for the operation of the display unit 9631, the switch SW1 is turned on, and the converter 9637 steps up or down the voltage necessary for the display unit 9631. In addition, when the display portion 9631 does not perform display, SW1 may be turned off and SW2 may be turned on to charge the battery 9635 .

Although the solar cell 9633 is shown as an example of power generation means, it is not particularly limited, and the battery 9635 is charged by other power generation means such as a piezoelectric element (piezo element) or a thermoelectric conversion element (Peltier element). There may be. For example, a non-contact power transmission module that transmits and receives power wirelessly (non-contact) for charging, or a combination of other charging means may be used.

Note that the electronic devices and the lighting devices are not particularly limited as long as they include the display device of one embodiment of the present invention.

This embodiment can be implemented by appropriately combining at least part of it with other embodiments described herein.

100 light emitting device

101 luminous panel

102 protective layer

110 housing

111 housing

112 housing

113 housing

121 ferromagnet

122 soft magnetic material

201 substrate

202 substrate

203 adhesive layer

205 insulating layer

207 insulating layer

208 conductive layer

209 insulating layer

209a insulating layer

209b insulating layer

211 insulating layer

212 conductive layer

213 sealing layer

215 connector

215a Connectors

215b Connectors

217 insulating layer

230 light emitting element

231 bottom electrode

233 EL layer

235 upper electrode

240 transistor

255 insulating layer

257 light shielding layer

259 colored layer

261 insulating layer

270 conductive layer

271 p-type semiconductor layer

272 conductive layer

273 i-type semiconductor layer

274 conductive layer

275 n-type semiconductor layer

276 insulating layer

278 insulating layer

280 conductive layer

281 conductive layer

283 conductive layer

291 insulating layer

292 conductive particles

293 insulating layer

294 conductive layer

295 insulating layer

296 conductive layer

301 Fabrication substrate

303 release layer

305 Fabrication substrate

307 release layer

310a conductive layer

310b conductive layer

401 substrate

403 substrate

405 space

501 element layer

503 substrate

504 Light extraction part

505 adhesive layer

506 drive circuit

508 FPCs

508a FPC

508b FPCs

556 conductive layer

557 conductive layer

999 touch panel

9600 tablet terminal

9625 switch

9626 switch

9627 power switch

9628 operation switch

9629 Fastener

9630 housing

9631 display

9632 region

9633 solar cell

9634 Charge/discharge control circuit

9635 battery

9636 DC DC converter

9637 converter

9638 Operation key

9639 Hinge part

9630a housing

9630b housing