Light-emitting device

0001The present invention relates to a film containing an anode, a cathode, and an organic compound capable of emitting light by applying an electric field (hereinafter, Below, it is referred to as "organic thin film"), and relates to a display device using an organic light emitting element having.

0002An organic light emitting element is an element that emits light when an electric field is applied. The light emitting mechanism is between electrodes By applying a voltage across an organic thin film, electrons injected from the cathode and the anode The injected holes recombine in the organic thin film and are described as excited molecules (hereinafter referred to as "molecular excitons"). It is said that when the molecular excitons return to the ground state, they release energy and emit light. It has been

0003The types of molecular excitons formed by organic compounds are singlet excited state and triplet excited state. It is considered that the state is possible, but here, it includes the case where either excited state contributes to light emission. I will do it.

0004In such an organic light emitting device, the organic thin film is usually formed of a thin film of less than 1 μm. To. Further, since the organic light emitting element is a self-luminous element in which the organic thin film itself emits light. There is no need for a backlight as used in conventional liquid crystal displays. Therefore It is a great advantage that the organic light emitting element can be manufactured extremely thin and lightweight.

0005In addition, for example, in an organic thin film of about 100 to 200 nm, carriers are injected and then recombination occurs. Considering the carrier mobility of the organic thin film, the time required for the process is about several tens of nanoseconds. Even if the process from recombination to light emission is included, light emission is achieved in the order of microseconds or less. Followed One of the features is that the response speed is very fast.

0006Furthermore, since the organic light emitting element is a carrier injection type light emitting element, it can be driven by a DC voltage. Therefore, noise is less likely to occur. Regarding the drive voltage, first, the thickness of the organic thin film is about 100 nm. Electrode material that makes a uniform ultra-thin film and reduces the carrier injection barrier for organic thin films By selecting the agent and introducing a hetero structure (two-layer structure), 100 cd / m at 5.5 V²Sufficient brightness was achieved (see, for example, Non-Patent Document 1).

0007In the organic light emitting device in Non-Patent Document 1, holes are transported by the hole transport layer, and electrons are transported. It can be said that it is an idea of functional separation that the electron transporting light emitting layer performs the transmission and the light emission. this The concept of functional separation is further doubled by sandwiching a light emitting layer between the hole transport layer and the electron transport layer. (B) It has evolved into the concept of a structure (three-layer structure) (see, for example, Non-Patent Document 2).

0008The advantage of such functional separation is that the functional separation can be applied to one type of organic material. Must have various functions (luminescence, carrier transport, carrier injection from electrodes, etc.) at the same time The point is that it is no longer necessary and a wide range of degrees of freedom can be given to molecular design (for example, nothing). There is no need to search for bipolar materials). In other words, materials with good light emission characteristics and materials with excellent carrier transport properties should be combined. This means that high luminous efficiency can be easily achieved.

0009Among the function separations, the introduction of the carrier injection function includes the anode buffer layer and the cathode buffer. The concept of the fa layer has been proposed, allowing it to be driven at lower voltages. For example, shade At the interface with the pole, insert a material that relaxes the energy barrier and inject the carrier. There is a report that the driving voltage is reduced by improving the property (see, for example, Non-Patent Document 3). Non-patent In Reference 3, Li is used as the cathode buffer layer.₂By using O, we succeeded in reducing the drive voltage. There is.

0010In addition, among the buffer layers, a buffer layer using a polymer has been attracting attention in recent years ( For example, see Non-Patent Document 4. ). Non-Patent Document 4 uses a polymer anode buffer layer. It is reported that this is effective in lowering the voltage, extending the life, and improving heat resistance. Also, Po The anode buffer layer of the rimmer is thickened because the conductivity is improved by introducing an appropriate acceptor. Is possible. Therefore, it can contribute to flattening and is also effective in reducing short circuits. It is said that there is.

0011In this way, the organic light emitting element has characteristics such as thinness and light weight, high speed response, and DC low voltage drive. It is attracting attention as a next-generation flat panel display element. Also, self-luminous type Because of its wide viewing angle, it has relatively good visibility, especially for in-vehicle display screens and mobile phones. It is considered to be effective as an element used for the display screen of a device. In fact, an in-vehicle car audio In some cases, an organic light emitting element is used for the area color display screen.

0012Furthermore, one of the features of organic light emitting elements is that they have a wide variety of emission colors. .. The cause of such richness of color lies in the diversity of the organic compounds themselves. That is, it is possible to develop materials with various emission colors by molecular design (for example, introduction of substituents). This flexibility gives rise to the richness of color.

0013From these points of view, the largest application fields of organic light emitting devices are monocolor and area color. It is no exaggeration to say that it is a full-color display device as well as a display device. Organic In consideration of the characteristics of the light emitting element, various full-color methods have been devised. For example, the three of light Shadow mass is an organic light emitting element that exhibits each of the primary colors of red, green, and blue. A method of painting separately using the technique and using each as a pixel (hereinafter referred to as "painting method") Alternatively, a blue organic light emitting device is used as a light emitting source, and the blue light is emitted from an organic fluorescent material. A method of obtaining the three primary colors of light by converting to green and red with a color conversion layer (hereinafter referred to as (Described as "CCM method") or a white organic light emitting element is used as a light emitting source to display a liquid crystal display. A method of obtaining the three primary colors of light by providing a color filter used in the installation etc. (hereinafter referred to as , "CF method").

0014Further, in any of these configurations, the organic light emitting elements are arranged as each pixel in a matrix. Passive matrix drive (simple matrix) for the display device formed by Drive methods such as S-type) and active matrix drive (active matrix type) are used. Has been done. If the pixel density is high, a switch (for example, transition) is used for each pixel. The active matrix type, which is equipped with a non-linear element such as a star), is driven by a lower voltage. It is said to be advantageous because it can be done.

0015By the way, the buffer layer using a polymer as shown in Non-Patent Document 4 has a low drive voltage. -Although it was mentioned earlier that it is effective in extending the life and improving heat resistance, such a material is used as a buffer layer. (Mainly the anode buffer layer), organic light emitting elements are arranged as each pixel in a matrix. When attempted to apply to a display device formed by and, a problem arises. It's crost It's a problem.

0016The buffer layer using the polymer adds donors and acceptors to the polymer having a π-conjugated system. In most cases, the polymer is made conductive by doing so. And this Since these polymers are usually applied to the entire surface by spin coating etc., the polymer and wiring are sometimes applied. Leakage current occurs between and.

0017For example, polyethylene dioxythiophene, which is a conductive polymer with an acceptor added. Polystyrene sulfonic acid (hereinafter referred to as "PEDT / PSS") was used as the anode buffer layer. It has been reported that crosstalk occurs when a passive matrix type display device is manufactured. (See, for example, Non-Patent Document 5.). In Non-Patent Document 5, PEDT / P is intentionally used as a solution. Crosstalk is prevented by increasing the resistivity of SS.

0018However, if the resistivity is increased, the thickness of the buffer layer using the polymer is increased. It becomes impossible to make it thicker (that is, it becomes difficult for current to flow through the organic light emitting element). I will end up). Therefore, the thickening of the film flattens the electrode surface and prevents short circuits. Will be lost. Also, if the resistivity is high, the drive voltage will naturally be high, and the drive will be low. The feature of dynamic voltage also disappears.

<p num="0019"><nplcit num="1"><text>CW Tan et al., Applied Physics Letters, Vol.51, No.12,913-915 (1987).</text></nplcit><nplcit num="2"><text>Chihaya Adachi, 3 outsiders, Japanese Journal of Applied Physics, Vol.27, No.2, L269-L271 (1988).</text></nplcit><nplcit num="3"><text>Takeo Wakimoto, 5 outsiders, IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 44, NO.8, 1245-1248 (1997).</text></nplcit><nplcit num="4"><text>Yoshiharu Sato, "Issues for Practical Use: From the Viewpoint of Material Development", Journal of the Japan Society of Applied Physics / Organic Molecules / Bioelectronics Subcommittee, vol.11, No.1, 86-99 (2000).</text></nplcit><nplcit num="5"><text>A. Elschner, 3 outsiders, Asia Display / IDW '01, 1427-1430 (2001).</text></nplcit></p>

<p num="0020">Therefore, in the present invention, it is formed by arranging organic light emitting elements as each pixel in a matrix. A conductive backing using a polymer without causing crosstalk to the display device to be displayed. The purpose is to apply the fa layer. As a result, the drive voltage is low, and reliability and heat resistance It is an object of the present invention to provide a display device which is excellent in the above and has few defects such as short circuits.</p><p num="0021">Furthermore, by manufacturing an electric appliance using the display device, power consumption is low and the service life is reduced. The challenge is to provide long-term appliances.</p>

<p num="0022">The present invention relates to a display device having a plurality of pixels arranged in a matrix. The arrangement is a plurality of first units corresponding to the substrate and the plurality of pixels provided on the insulating surface of the substrate. An insulator partition wall that surrounds the electrode and the first electrode and projects above the surface of the first electrode. And the organic conductor film provided on the insulator partition wall and the first electrode, and the organic conductor. An organic thin film containing an organic compound that is provided on the body and capable of electroluminescence, and the organic thin film It is characterized by having a second electrode provided on the top.</p><p num="0023">In particular, the film thickness T of the organic conductor film on the first electrode₁And the first electrode and the Film thickness T of the organic conductor film on the boundary with the insulator partition wall₂And on the insulator bulkhead Early term Organic conductor film thickness T₃And the relationship is T₂&gt; T₁&gt; T₃It is characterized by being.</p><p num="0024">In particular, the organic conductor membrane is a polymer compound to which an acceptor or a donor is added. It is characterized by being. Further, the organic conductor film is prepared by a wet method in consideration of flatness. It is preferably a film formed, and the wet method is a spin coating method or an in-film method. The quadrature method or the spray method is preferable. The conductivity of the organic conductor film is 1 0^-6S / cm or more, 10^-2It is preferably S / cm or less.</p><p num="0025">Further, the insulator partition wall has a tapered shape that gradually narrows toward the upward direction of the substrate. It is characterized by that. The taper angle of the taper shape at this time is 60 degrees or more and 80 degrees or less. It is preferable to have. Further, the insulator partition wall is on the substrate side with respect to the ridgeline of the insulator partition wall. In the case of a curved surface shape having at least one center of radius of curvature, or the ridgeline of the insulator partition wall Is a curved surface shape that does not have an inflection point, or the insulator partition wall is on the ridgeline of the insulator partition wall. On the other hand, it has at least one center of radius of curvature on the substrate side and at the same time on the ridgeline of the insulator partition wall. On the other hand, if the shape is a curved surface that has at least one center of radius of curvature on the side opposite to the substrate side, , If the ridgeline of the insulator bulkhead has a curved surface shape with at least one inflection point, It is particularly suitable for coating.</p><p num="0026">Further, in the present invention, the display device includes a data signal line, a scanning signal line, and a front. A non-linear element connected to the data signal line, the scanning signal line, and the first electrode. It is characterized by further including children. At this time, the nonlinear elements are thinly connected to each other. A combination of a film transistor and a capacitor, or a thin film transistor and the thin film transistor It is preferably composed of a combination with a parasitic capacitor of the engineer.</p><p num="0027">Further, as long as it is a display device, it is sufficient that any surface of the display device has visible light transmission. Obey The present invention is characterized in that the substrate and the first electrode have visible light transmission. Alternatively, the second electrode is characterized by having visible light transmission.</p><p num="0028">As a method for manufacturing a display device as described above, in the present invention, the display devices are arranged in a matrix. In the process of manufacturing a display device having a plurality of pixels, the plurality of pixels are paired on the insulating surface of the substrate. A pattern process for forming a plurality of corresponding first electrodes, and the first electrode surrounding the first electrode. The step of forming an insulator partition wall protruding above the surface of the electrode, the insulator partition wall, and the said A step of providing an organic conductor film on the first electrode and an organic substance capable of electroluminescence on the organic conductor. A step of forming an organic thin film containing a compound and a step of forming a second electrode on the organic thin film. , Is included.</p><p num="0029">Further, in the present invention, the step of providing the organic conductor film on the insulator partition wall and the first electrode is , It is a wet process. At this time, the wet process is performed on the organic conductor. The process of spray coating or spin coating of the raw material solution or raw material dispersion of the membrane, Alternatively, it is preferably a step of coating by an inkjet method.</p><p num="0030">Further, in the present invention, the pattern process includes a data signal line and a scanning signal line. , The data signal line, the scanning signal line, and the non-line connected to the first electrode. It is characterized by including a step of forming a shape element. At this time, the non-linear elements are attached to each other. A combination of a connected thin film transistor and a capacitor, or a thin film transistor It is preferably composed of a combination with a parasitic capacitor of the thin film transistor.</p><p num="0031">The organic thin film uses an organic compound as a light emitting compound, and has other configurations. Inorganic compounds may be included as elements. Further, the display device referred to in the present invention is a light emitting element. Refers to an image display device using an organic light emitting element. Also, a connector to the organic light emitting element For example, an anisotropic conductive film (FPC: Flexible printed circuit) or TAB (Tape Aut) omated Bonding) Mod with tape or TCP (Tape Carrier Package) attached Module, TAB tape, module with printed wiring board at the end of TCP, or organic luminescent material COG (Chip On Glass) for the child All modules in which ICs (integrated circuits) are directly mounted by the method shall be included in the display device. ..</p>

<p num="0032">By carrying out the invention as described above, the organic light emitting element can be combined with each matrix-shaped pixel. With respect to the display device formed by arranging the display device, without causing crosstalk. A conductive buffer layer using a rimmer can be applied. As a result, the drive voltage is low, reliability and heat resistance are excellent, and there are few defects such as short circuits. A display device can be provided.</p>

0033<figref num="1">The figure which shows the concept of this invention.</figref><figref num="2">The figure which shows the concept of the passive matrix type display device of this invention.</figref><figref num="3">The figure which shows the concept of the active matrix type display device of this invention.</figref><figref num="4">The figure which shows the manufacturing apparatus of an organic light emitting element.</figref><figref num="5">The figure which shows the Example of the passive matrix type display device.</figref><figref num="6">The figure which shows the Example of the active matrix type display device.</figref><figref num="7">The figure which shows the Example of the active matrix type display device.</figref><figref num="8">The figure which shows the Example of the driving method.</figref><figref num="9">The figure which shows the specific example of an electric appliance.</figref><figref num="10">The figure which shows the specific example of an electric appliance.</figref><figref num="11">The figure explaining the concept of continuously forming a conductive polymer by an inkjet method.</figref><figref num="12">The figure which shows the concept of this invention at the time of continuously forming a conductive polymer by an inkjet method.</figref><figref num="13">Figure showing cross-section TEM photograph</figref><figref num="14">The figure which shows the concept of this invention.</figref><figref num="15">The figure which shows the cross-section TEM photograph.</figref><figref num="16">The figure which shows the Example of the active matrix type display device.</figref>

0034A conceptual diagram of the present invention is shown in FIG. Fig. 1 (a) is a stripe on the substrate (vertical direction in the figure) In order to form the first electrode 102a of the above and to form the pixel portion 110a, the insulator partition is formed so as to surround the pixel portion 110a. A wall 103a is provided to form an organic conductor film 104a (not shown). Further, in FIG. 1B, an island-shaped first electrode 102b is formed on the substrate to form a pixel portion 110b. Therefore, an insulator partition wall 103b is provided so as to surround the pixel portion 110b, and an organic conductor film 104b (not shown) is provided. It is formed. In either case, the cross-sectional view at A-A'in the figure is as shown in Fig. 1 (c). .. 101 is a substrate, 102 is a first electrode, 103 is an insulator partition wall, and 104 is an organic conductor film.

0035At this time, the thickness shape of the organic conductor film 104 is T2&gt; T1&gt; T3 due to the influence of the insulator partition wall 103. .. Therefore, the lateral resistance in the T3 part becomes high, and crosstalk can be prevented. To. Furthermore, since the T2 portion becomes thicker, the electric field concentration around the pixel portion is relaxed, and the electric field concentration around the pixel portion is relaxed. It is possible to prevent deterioration of the organic light emitting element. Examples of the organic conductor film 104 include PEDOT / PSS. Such a conductive polymer may be wet-coated.

0036This shape can be effectively obtained when the organic conductor film is wet-coated, but it can be obtained by vacuum deposition. A similar shape can be obtained when the organic conductor film is formed by such a dry process. Shi Therefore, the process of forming the organic conductor film 104 is a dry process or a wet process. It is valid even in this case.

0037When such a concept is applied to the passive matrix type, it becomes as shown in Fig. 2. Figure 2 (a) is above The top view and FIG. 2 (b) are cross-sectional views of B-B'in FIG. 2 (a). That is, stripes on the substrate 201 The shape of the first electrode 202 is formed, and the pixel protrudes above the first electrode 202. The insulator partition wall 203 is formed so as to surround the portion P. And on it, the organic conductor film 204 (representative) A conductive polymer) is provided, and an organic thin film containing an organic compound capable of electroluminescence. 205 is formed. On top of that, the second electrode 206 is formed so as to be orthogonal to the first electrode. To.

0038Here, the organic thin film 205 is painted separately for each pixel portion by a metal mask. , Shows a form suitable for full-color display. Of course, if it is a single color, paint it separately. It may be solid without.

0039Moreover, when such a concept is applied to the active matrix type, it becomes as shown in FIG. Figure 3 (a) is a top view, and FIG. 3 (b) is a cross-sectional view of C-C'in FIG. 3 (a). That is, the eye on the substrate 301 A land-shaped first electrode 302 is formed, and the land-shaped first electrode 302 protrudes above the first electrode 302. , The insulator partition wall 303 is formed so as to surround the pixel portion. And on top of that, the organic conductor film 304 Further, an organic thin film 305 containing an organic compound capable of electroluminescence is formed. So The second electrode 306 is formed on the top in a solid form.

0040In addition, data signal line 307, scanning signal line 308, data signal line 307 and running A non-linear element 309 connected to the inspection signal line 308 is provided, and the non-linear element is a contact. It is connected to the first electrode 302 by 310. As a result, each pixel can be switched independently. You can do it. The nonlinear element 309 is typically a thin film transistor connected to each other. And a capacitor, or a thin film transistor and the thin film transistor Consists of a combination with a capacitor.

0041In addition, in FIG. 2 and FIG. 3, as the composition of the organic thin film, the structure of a known organic light emitting element is used. You can use it. In addition, either the first electrode or the second electrode has visible light transmission. If the first electrode is an anode, the second electrode is the cathode, and if the first electrode is the cathode, the second electrode is sufficient. May be the anode.

0042As an organic conductor film, an organic semiconductor is doped with an acceptor or a donor to give dark conductivity. Method is suitable. As a film forming method, it is possible to form a film by a dry process such as a vacuum vapor deposition method. Some can be formed by a wet process such as spin coating.

0043Examples of organic conductor films that can be formed by a dry process include low-molecular-weight organic semiconductors and acces. A method of co-depositing with a septa or a donor is common. p-type organic semiconductors and acceptors The organic conductor film when co-deposited with is preferable as a hole injection layer, and is used with an n-type organic semiconductor. The organic conductor film when co-deposited with the donor is preferable as the electron injection layer.

0044As a low-molecular-weight p-type organic semiconductor, 4,4'-bis [N- (1-naphthyl) -N-fe Nyl-amino] -biphenyl (abbreviation; α-NPD) and 4,4', 4''-tris (N, N-di) Phenyl-amino) -triphenylamine (abbreviation; TDATA), 4,4', 4''-tris [N -(3-Methylphenyl) -N-Phenyl-Amino] -Triphenylamine (abbreviation; MTDA) Examples include aromatic amine compounds such as TA). In addition, as a low-molecular-weight n-type organic semiconductor , Tris (8-quinolinolato) aluminum (abbreviation; Alq₃), Bis [2- (2-Hydroxy) Siphenyl) -benzoxazolate] Zinc (abbreviation; Zn (BOX))₂) And other metal complexes and 2-( 4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazo Le (abbreviation; PBD), 1,3-bis [5- (p-tert-butylphenyl) -1,3,4-oki Oxadiazole-2-yl] Oxadiazole derivatives such as benzene (abbreviation; OXD-7), 5 -(4-Biphenylyl) -3- (4-tert-Butylphenyl) -4-phenyl-1,2, 4-Triazole (abbreviation; TAZ), 5- (4-biphenylyl) -3- (4-tert-butyl Phenyl) -4- (4-ethylphenyl) -1,2,4-triazole (abbreviation; p-EtTAZ) ) And other triazole derivatives, vasophenanthroline (abbreviation; BPhen), vasocuploy Phenanthroline derivatives such as (abbreviation; BCP)) can be mentioned.

0045Examples of TCNQ, TCE, DDQ, and Bee that function effectively as acceptors and can be deposited. Nzoquinone, 2,6-naphthoquinone, p-fluoranyl, tetrachlorodiphenoquinone, Typical examples are those that act as Lewis acids, such as nickel-bisdiphenylgluoxime. .. Examples of TTF, TTT, and methylfe that function effectively as donors and can be deposited. In addition to organic compounds such as nothiazine and N-isopropylcarbazole, alkali metals and alcohol Typical examples are those that act as Lewis bases, such as metals with strong donor properties such as potash earth metals. Is the target.

0046An example of an organic conductor film that can be formed by a wet process is represented by a conductive polymer compound. Wet coating a solution of a mixture of a polymer compound having a π-conjugated system and an acceptor or donor. The method of spreading is common. If the film forming property is good, it is not a polymer compound but a low molecular weight organic Compounds may be used. In this case as well, the organic conductor film when the acceptor is mixed is a hole. It is preferable as an injection layer, and an organic conductor membrane when a donor is mixed is preferable as an electron injection layer. I.

0047An example of a polymer compound having a π-conjugated system is poly (ethylenedioxythiophene) (omitted). Practical materials such as PEDOT), polyaniline (abbreviation; PAni), and polypyrrole. In addition to the charges, polyphenylene derivatives, polythiophene derivatives, poly (paraphenylene vinylene) ) There are derivatives and so on.

0048As the acceptor and donor, those listed above can be used, but polystyrene Wet in an aqueous solvent system by using acceptors of water-soluble polymers such as sulfonic acid (PSS) Formula coating is also possible. PEDOT / PSS and PAni / PSS are known, especially the hole injection layer. It is effective as.

0049By the way, in the drawings of FIGS. 1 to 3, the taper-shaped insulator partition wall is described as an example, but it is not possible. The same effect or a larger effect can be obtained even when the rim body partition has other shapes. To. A schematic diagram of the tapered insulator partition wall in FIG. 1 (c) having another shape is shown. Shown in 14.

0050In FIG. 14 (a), the end of the insulator partition wall 103 has a radius of curvature R1 inside the insulator partition wall 103. This is a case where the curved surface shape has one. That is, the insulator bulkhead is relative to the ridgeline of the insulator bulkhead. In the case where the substrate side has at least one center of radius of curvature, the ridgeline of the insulator partition wall is This is an example of a curved surface shape having no inflection point. In such a case, as shown in Fig. 14 (a), the end of the insulator bulkhead has an arc shape. Therefore, the state of T2&gt; T1&gt; T3 can be easily formed. Especially T3 is close to the upper end of the insulator bulkhead As it becomes thinner, it has a great effect on preventing crosstalk.

0051In FIG. 14 (b), the end of the insulator partition wall 103 has a radius of curvature R1 inside the insulator partition wall 103. A field that has a curved surface shape with one radius of curvature R2 on the outside of the insulator partition wall 103 at the same time. It is. That is, the insulator partition wall has the center of the radius of curvature on the substrate side with respect to the ridgeline of the insulator partition wall. It has at least one and has a radius of curvature on the side opposite to the substrate side with respect to the ridgeline of the insulator partition wall. In the case of having at least one heart, the ridgeline of the insulator bulkhead is at least one inflection point. This is an example of a curved surface shape having points. In such a case, as shown in Fig. 14 (b) Since the end of the insulator bulkhead has an S-shaped shape, it is easy to change the state of T2&gt; T1&gt; T3 as well. Can be formed. Again, T3 becomes thinner as it approaches the upper edge of the insulation bulkhead. Therefore, it has a great effect on preventing crosstalk.

0052The shape of the insulator partition wall as shown in FIG. 14 can be obtained by wet coating by the spin coating method. Especially effective. The edges of the insulator bulkhead are gentle, so when spin coating This is because the liquid tends to spread evenly over the entire surface.

0053In addition, hydrogen plasma or hydrogen ion dough is previously applied to the organic conductor membranes 104, 204, and 304. After the formation of organic thin films 205 and 305, hydrogen atoms or hydrogen molecules are allowed to exist by means of If it is diffused by heating etc., it will be unpaired in the organic thin films 205 and 305 during driving. If a radical) is generated, it can be repaired to prevent deterioration. Is.

0054Next, FIG. 4 shows a conceptual diagram of the device forming the display device of FIGS. 2 and 3. This device is organic thin This is an example of forming a film by vacuum deposition. A transport room that mainly transports substrates, a delivery chamber that delivers, each It is composed of a film forming chamber for producing a seed thin film and a sealing chamber for sealing. Required degree of vacuum in each room Exhaust system to achieve, or N₂Equipped with a device to generate a gas atmosphere such as In addition, each room is connected by a gate valve or the like. Substrate transfer is performed by a transfer robot It is done.

0055First, in the preparation chamber 400, the substrate 401c (pixel part, drive circuit part, wiring, electrodes, protective film, etc.) It is assumed that it is built in advance, but here it is simply referred to as the "board"). Enter. Typically, a TFT is used for the pixel unit and the drive circuit unit.

0056The substrate 401c introduced into the preparation chamber 400 is transferred by the transfer robot 401b to the transfer chamber 401. It is carried into a and further carried to the pretreatment chamber 402. Typically, the substrate 4 in the pretreatment chamber 402 Heat or O for 01c₂Pretreatment such as plasma treatment is performed. This pretreatment The purpose is to improve various characteristics of OLED. In addition, water-soluble conductive polymers are organically conductive. When applied as a body film, it also plays a role in improving the wettability by making the coated surface of the substrate hydrophilic. Add.

0057The substrate after the pretreatment is returned to the charging chamber and subjected to nitrogen purging. And under normal pressure ( It is carried to the transport chamber 420 in the nitrogen atmosphere), and the substrate is inverted face up in the inversion chamber 422. .. Then, in the coating chamber 421, an organic conductor film (specifically, a conductive poly such as PEDOT / PSS) Apply Mar). The application method includes spin coating and dip coating, but here A film is formed by the spray method. After coating, reverse and vacuum bake via transport chamber 420 It is carried into room 423. Here, inversion and vacuum baking are performed.

0058Thus, here the vacuum bake is inverted (ie, the substrate surface is facing down). It is done in the state of down), but the relationship of T2&gt; T1&gt; T3 as described in Fig. 1 and Fig. 14 is It has been found that it is retained without problems even when baking in the down state (Example 8). See below).

0059After vacuum baking, it is transported to the transport chamber 404 via the transport chamber 401a and the delivery chamber 403. .. The transport robot is also mounted in the transport chamber 404, and each part connected to the transport chamber 404. It plays a role of transporting the board to the shop. A film forming chamber for forming an organic layer is in contact with the transport chamber 404. It is being continued. Keeping in mind to make a full-color display OLED display device, RG B The film formation chambers 406R, 406G, and 406B for forming the light emitting layer of each color are further added to each color. A film formation chamber 405 is installed to create a common layer, that is, a carrier transport layer, a carrier injection layer, etc. Has been done. The vacuum deposition method is generally used in these film formation chambers. Get full color emission In order to do so, the light emitting layer that emits light of each color of R, G, and B is striped, mosaic, or de. The vapor deposition may be performed using a shadow mask for separate painting so that the particles are arranged in a rut shape. Na Oh, when the organic conductor film is applied to the entire surface by the spin coating method or the dip coating method, each is available. Before film formation of the machine layer, O in the pretreatment chamber 402₂Combination of plasma processing and mask By doing so, unnecessary parts of the organic conductor film (such as the part to which the sealant is applied and the top of the wiring) can be removed. It can also be removed.

0060The substrate on which the organic layer has been formed is transported to the transport chamber 408 via the delivery chamber 407. Carrying A transfer robot is also installed in the transfer room 408 to each room connected to the transfer room 408. It plays a role of transporting the substrate. For the purpose of forming back electrode and protective film in the transport chamber 408 The film formation chamber is connected. In the film forming chambers 409 and 410, electrodes are used by the vacuum deposition method or the EB method. Metals (eg, AlLi alloy, MgAg alloy, etc.) are formed. In the film forming chamber 411, the base The transparent conductive film (eg ITO, IZO, etc.) required to obtain light emission from the top surface of the plate is generally used. Filmed by sputtering or chemical vapor deposition (CVD) To. In the film formation chamber 412, a passivation film (for example, SiN, S) for protecting the surface (iOx film, etc.) is generally formed by a sputtering method or a CVD method.

0061The substrate on which the film formation is completed is transported to the transport chamber 414 via the delivery chamber 413. Transport room 41 Multiple rooms required for sealing are connected to 4. Transport robot to transport room 414 The board or sealing board is carried to each room connected to the transport room 414. It plays a role in sending.

0062First, it is necessary to prepare a substrate for sealing. The room for that is a sealed glass substrate The equipment chamber 415a and the sealed plastic substrate preparation chamber 418.

0063In the sealing glass substrate preparation room 415a, there is an opposing glass for glass-sealing the created OLED. Introduce from the outside. If necessary, introduce a desiccant that protects the OLED from water into the facing glass. Can be For example, a sheet-shaped desiccant that has been counterbored in advance is opposed. It may be attached to the counterbore part of the glass with double-sided tape or the like.

0064On the other hand, in the sealed plastic substrate preparation room 418, the created OLED is plastic-sealed. Make preparations for. These tasks may be fully automated or gloved It may be placed and partly performed manually.

0065The prepared encapsulating glass substrate or encapsulating plastic substrate is carried to the dispenser chamber 416. , An adhesive (not shown) for later bonding to the substrate is applied. In this embodiment, an ultraviolet curable adhesive is used. Also, if necessary, OLED A desiccant (not shown) that prevents water from being introduced into the glass guide in the sealed glass substrate preparation chamber 415a. It may be charged in the dispenser room 416 instead of at the time of entering. For example, a sheet of desiccant , Attach with double-sided tape etc. to the counterbored part of the facing glass that has been counterbored in advance. Can be This eliminates the need to handle the desiccant in the air. These tasks As for, it may be fully automated, or it may be partially manually installed with gloves installed. Apply adhesive in a bent state, especially if the sealed plastic substrate has curvature and elasticity. It may be applied in a straightened state.

0066Substrate that has been film-formed, and encapsulating glass substrate or encapsulating plastic group coated with adhesive The plates are carried to the sealing chamber 417 and bonded together. Appropriate jig for bonding (not shown) ) Need to be pressurized. True for sealed plastic substrates with curvature and elasticity You can paste it in a straightened state. Even if these tasks are fully automated Alternatively, gloves may be installed and some may be performed manually.

0067Next, the substrate and the sealing substrate bonded in the sealing chamber 417 are transported to the ultraviolet light irradiation chamber 419. It is irradiated with ultraviolet rays to cure the adhesive.

0068The substrate and the sealing substrate adhered in the ultraviolet light irradiation chamber 419 are moved from the delivery chamber (not shown) to the outside. Just take it out.

<p num="0069">In this embodiment, as an example of the display device disclosed in the present invention, a passive matrix type display device is used. Illustrate. Fig. 5 (a) shows the top view, and Fig. 5 (b) shows the disconnection when Fig. 5 (a) is cut by P-P'. The top view is shown.</p><p num="0070">In FIG. 5 (a), 501 is a substrate, and glass or plastic material is used. Plastic Polyimide, polyamide, acrylic resin, epoxy resin, PES (Polyei) Telsulfone), PC (polycarbonate), PET (polyethylene terephthalate) or Can be used as a plate of PEN (polyester nitrile) or on a film.</p><p num="0071">Reference numeral 502 is a scanning line (anode) made of an oxide conductive film, which has visible light transmittance in this embodiment. Use ndium tin oxide (ITO). In addition, 506 is a data line (cathode) containing a metal film, CaF in this example₂It is patterned in stripes using \ Al electrodes. Also, 503 is It is an insulator partition wall made of acrylic resin. Both scan line 502 and data line 506 are strikes It is formed in a plurality of shapes and is provided so as to be orthogonal to each other. In Fig. 5 (a), Although not shown, the conductive polymer PEDOT / PSS504 and between scan line 502 and data line 506 The organic thin film 505 is sandwiched, and the intersection 507 becomes a pixel.</p><p num="0072">Then, the scanning line 502 and the data line 506 are connected to an external drive circuit via the TAB tape 508. To. Note that 509 represents a wiring group consisting of a collection of scanning lines 502, and 510 is connected to the data line 506. Represents a wiring group consisting of a set of connected wirings 511. Also, although not shown, TAB tape 50 Instead of 8, TCP with an IC on the TAB tape may be connected.</p><p num="0073">Further, in FIG. 5B, 512 is bonded to the substrate 501 by the sealing material and 513 is bonded to the substrate 501 by the sealing material 512. It is a cover material. For example, a photocurable resin may be used as the sealing material 512, and the sealing material 512 may be removed. A material with less waste and low hygroscopicity is desirable. The same material as the substrate 501 is preferable as the cover material. Furthermore, glass (including quartz glass) or plastic can be used. here Let's use glass.</p><p num="0074">In the display device of the present invention having the above configuration, the pixel unit 514 has a scanning line 502, a data line 506, and the like. Very easy as it is made of insulator bulkhead 503, conductive polymer 504, and organic thin film 505 It can be produced by various processes.</p><p num="0075">Further, a polarizing plate may be provided on the display surface (the surface for observing the image) of the display device shown in this embodiment. I. This polarizing plate suppresses the reflection of light incident from the outside, and the observer reflects it on the display surface. Has the effect of preventing. Generally, a circular polarizing plate is used. However, in order to prevent the light emitted from the organic compound film from being reflected by the polarizing plate and returning to the inside. , It is preferable to adjust the refractive index to form a structure with less internal reflection. </p>

<p num="0076">In this embodiment, a display device including the organic light emitting element disclosed in the present invention will be described. In Figure 6 Indicates the active matrix type display device of the present invention. A top view is shown in FIG. 6 (a). , FIG. 6 (b) shows a cross-sectional view of FIG. 6 (a) cut by P-P'.</p><p num="0077">A thin film transistor (hereinafter referred to as "TFT") is used as an active element. However, a MOS transistor may be used. In addition, as a TFT, a top gate type TFT (specifically, A planar type TFT) is illustrated, but a bottom gate type TFT (typically an inverted stagger type TFT) is used. You can also.</p><p num="0078">In FIG. 6, 601 is a substrate, and here, since light is extracted from the substrate side, visible light is transmitted. Use a substrate to be used. Specifically, glass substrate, quartz substrate, crystallized glass substrate or plastic A stick substrate (including a plastic film) may be used. The board 601 is a table. The insulating film provided on the surface shall also be included.</p><p num="0079">A pixel unit 621 and a drive circuit 622 are provided on the substrate 601. First, about the pixel part 621 I will explain.</p><p num="0080">The pixel unit 621 is an area for displaying an image. There are multiple pixels on the board, and each pixel has TFT for controlling the current flowing through the light emitting element of the machine (hereinafter referred to as "current control TFT") 611, image A base electrode (anode) 602, a conductive polymer film 604, an organic thin film 605, and a cathode 606 are provided. .. Each pixel is surrounded by an insulator bulkhead 603. The 612 is used as the gate of the current control TFT. It is a TFT (hereinafter referred to as "switching TFT") for controlling the applied voltage.</p><p num="0081">As the current control TFT 611, it is preferable to use a p-channel type TFT here. With n-channel TFT However, as shown in Fig. 6, the current control TFT is connected to the anode of the organic light emitting device. In that case, the p-channel TFT can reduce power consumption. However, switching TF T may be an n-channel type TFT or a p-channel type TFT.</p><p num="0082">Further, the pixel electrode 602 is electrically connected to the drain of the current control TFT 611. In this embodiment, a conductive material having a work function of 4.5 to 5.5 eV is used as the material of the pixel electrode 602. Therefore, the pixel electrode 602 functions as an anode of the organic light emitting element. As a typical pixel electrode 602, Translucent, such as indium oxide, tin oxide, zinc oxide or compounds thereof (ITO, etc.) A transient material may be used. A conductive polymer film 604 and an organic thin film 605 are placed on the pixel electrode 602. It is provided.</p><p num="0083">Further, a cathode 606 is provided on the organic thin film 605. As a material for cathode 606, work It is desirable to use a conductive material with a function of 2.5 to 3.5 eV. As a typical cathode 606, a Conductive film containing Lucari metal element or alkalinity metal element, conductive film containing aluminum Or, a conductive film obtained by laminating aluminum, silver, or the like may be used.</p><p num="0084">The layer composed of the cathode 606 is covered with the protective film 607. The protective film 607 is an organic light emitting element. It is provided to protect against oxygen and water. The material of the protective film 607 is silicon nitride. , Silicon nitride oxide, aluminum oxide, tantalum oxide, or carbon (specifically, diamond) Use diamond-like carbon). Especially when using diamond-like carbon, protection Since the film 607 contains hydrogen atoms, it is diffused by heating or the like as described above. And, when an unpaired bond (or radical) is generated in the organic thin film 605 during driving In that case, it is possible to repair it to prevent deterioration.</p><p num="0085">Next, the drive circuit 622 will be described. The drive circuit 622 is a signal (game) transmitted to the pixel unit 621. This is the area that controls the timing of the signal and data signals, and is the shift register and buff. A, latch, analog switch (transfer gate) or level shifter is provided ing. In Figure 6, the basic units of these circuits are the n-channel type TFT613 and the p-channel type. A CMOS circuit consisting of TFT614 is shown.</p><p num="0086">The shift register, buffer, latch, and analog switch (transfer gate) are also available. Alternatively, the circuit configuration of the level shifter may be a known one. Also, in Fig. 6, images are drawn on the same substrate. Although the base unit 621 and the drive circuit 622 are provided, the IC and LSI are electrically connected without the drive circuit 622. You can also continue.</p><p num="0087">Further, 623 is a gate signal side drive circuit, and 622 is a data signal side drive circuit. Also, Gate Shin The signals transmitted to the No. side drive circuit 623 and the data signal side drive circuit 622 are the data signal and The scan signal is input from the TAB (Tape Automated Bonding) tape 616 via the input wiring 615. To. Although not shown, an IC (integrated circuit) is provided on the TAB tape instead of the TAB tape 616. You may connect TCP (Tape Carrier Package).</p><p num="0088">608 is a cover material provided above the display device, and is adhered by a sealing material 609 made of resin. Has been done. Use any cover material 608 that does not allow oxygen and water to pass through. You may. In this embodiment, the cover material 608 is made from dented glass 608a and desiccant 608b. Become. Therefore, the sealing material 609 completely encloses the organic light emitting element in the enclosed space 610. Sea urchin. The enclosed space 610 is an inert gas (typically nitrogen gas or rare gas), resin or Is filled with an inert liquid (for example, liquid fluorinated carbon represented by perfluoroalkane). You can leave it. Further, it is also effective to provide a hygroscopic agent or an oxygen scavenger.</p><p num="0089">In FIG. 6, the pixel electrode (anode) 602 is electrically connected to the current control TFT 611, but it is hidden. It is also possible to take a structure in which the poles are connected to a current control TFT. In that case, the pixel electrode is the cathode 606. It may be formed of the same material, and the cathode may be formed of the same material as the pixel electrode (anode) 602. That In this case, the current control TFT is preferably an n-channel type TFT.</p><p num="0090">Further, a polarizing plate may be provided on the display surface (the surface for observing the image) of the display device shown in this embodiment. I. This polarizing plate suppresses the reflection of light incident from the outside, and the observer reflects it on the display surface. Has the effect of preventing. Generally, a circular polarizing plate is used. However, in order to prevent the light emitted from the organic compound film from being reflected by the polarizing plate and returning to the inside. , It is preferable to adjust the refractive index to form a structure with less internal reflection. </p>

<p num="0091">In this embodiment, an active matrix type display device is shown as an example of the display device of the present invention. However, unlike Example 2, light is extracted from the side opposite to the substrate on which the active element is formed. A display device having a structure (hereinafter referred to as upward emission) is shown. FIG. 7 shows a cross-sectional view thereof.</p><p num="0092">A thin film transistor (hereinafter referred to as "TFT") is used as an active element. However, a MOS transistor may be used. In addition, as a TFT, a top gate type TFT (specifically, A planar type TFT) is illustrated, but a bottom gate type TFT (typically an inverted stagger type TFT) is used. You can also.</p><p num="0093">In this embodiment, the configurations other than the first electrode, the second electrode, the protective film, and the cover material are the same as those in the second embodiment. It's fine.</p><p num="0094">The first electrode 602 is connected to the drain of the current control TFT 611, but in this embodiment, it is the anode. It is preferable to use a conductive material having a larger work function. A typical example Examples include metals such as nickel, palladium, tungsten, gold and silver. This implementation In the example, the first electrode 602 preferably does not transmit light, but in addition it is light reflective. It is more preferred to use expensive materials.</p><p num="0095">Further, since this embodiment emits upward light, it is a major premise that the second electrode 606 is light transmissive. To. Therefore, when these metals are used, it is preferable that they are ultrathin films of about 20 nm. ..</p><p num="0096">Further, the protective film 607 is provided to protect the organic light emitting element from oxygen and water. In this embodiment, any material that transmits light may be used.</p><p num="0097">Further, 608 is a cover material, which is adhered by a sealing material 609 made of resin. cover Material 608 is any material that does not transmit oxygen and water and that transmits light. May be used. In this embodiment, glass is used. The enclosed space 610 is an inert gas (typically Is represented by nitrogen gas or rare gas), resin or inert liquid (eg perfluoroalkane) Liquid fluorinated carbon) may be filled. In addition, provide a hygroscopic agent or oxygen scavenger. Is also valid.</p><p num="0098">In FIG. 7, the first electrode (anode) 602 is electrically connected to the current control TFT 611, but it is hidden. It is also possible to take a structure in which the poles are connected to a current control TFT. In that case, the first electrode is the material of the cathode. It may be formed of a material, and the second electrode may be formed of an anode material. At this time, the current control TFT has n channels. It is preferable to use a Le-type TFT. </p>

<p num="0099">In this embodiment, the display device as shown in the second and third embodiments is displayed in a digital time gradation table. An example of driving by the following is shown.</p><p num="0100">The circuit configuration of the pixel using the organic light emitting element is shown in FIG. 8 (a). Tr is a transistor, Cs is a strike Represents a rage capacitor. In the circuit configuration shown in Fig. 8 (a), the source line is the saw of transistor Tr1. On the side, the gate wire is connected to the gate of transistor Tr1. In addition, the power supply line is It is connected to the source side of the storage capacitor Cs and the transistor Tr2. Transi Since the anode of the organic light emitting element of the present invention is connected to the drain side of the star Tr2, organic light emission The opposite side of the transistor Tr2 across the element is a cathode.</p><p num="0101">In this circuit, when the gate line is selected, current flows from the source line to Tr1 and its signal The voltage corresponding to the number is accumulated in Cs. And the voltage between the gate and source of Tr2 (V)_gs) The current controlled by the above will flow to Tr2 and the organic light emitting element.</p><p num="0102">After Tr1 is selected, Tr1 is turned off and the voltage of Cs (V)._gs) Is retained. But What, V_gsIt is possible to keep flowing the current as much as it depends on.</p><p num="0103">A chart in which such a circuit is driven by a digital time gradation display is shown in FIG. 8 (b). Su That is, one frame is divided into multiple subframes, but in Fig. 8 (b), one frame The 6-bit gradation is used to divide the screen into 6 subframes (SF1 to SF6). TA is the writing time Is. In this case, the ratio of each subframe emission period is 32: as shown in the figure. It becomes 16: 8: 4: 2: 1.</p><p num="0104">The outline of the drive circuit of the TFT board in this embodiment is shown in FIG. 8 (c). In the board configuration shown in Fig. 8 (c) , Power supply as shown in FIG. 8A to the pixel portion in which the organic light emitting element of the present invention is used as each pixel. The wire and cathode are connected. The shift register is shift register latch 1 It is connected to the pixel part in the order of latch 2 pixel part. A digital signal is input to latch 1, and an image is obtained by the latch pulse input to latch 2. Data can be sent to the pixel section.</p><p num="0105">The gate driver and the source driver are provided on the same board. In this embodiment, the image Since the circuit and driver are designed to be digitally driven, the TFT characteristics are different. A uniform image can be obtained without being affected by sticking. </p>

<p num="0106">The display device of the present invention described in the above embodiment has the advantages of low power consumption and long life. Therefore, the electric appliance including the display device as a display unit or the like consumes less power than before. It is an electric appliance that can be operated by force and that can be maintained for a long time. Especially the battery as a power source For electric appliances such as mobile devices to be used, low power consumption is directly linked to convenience (batteries). It is extremely useful because it is less likely to break.</p><p num="0107">Further, since the display device is a self-luminous type, a backlight like a liquid crystal display device is indispensable. Since the thickness of the organic compound film is less than 1 μm, it is possible to reduce the thickness and weight. But Therefore, the electric appliance including the display device as a display unit or the like is thinner and lighter than the conventional one. It becomes an ingredient. This is also convenient (when carrying), especially for appliances such as mobile devices. It is extremely useful because it is directly linked to its lightness and compactness. In addition, for all appliances Even so, being thin (not bulky) means that it has a transportation surface (mass transportation is possible) and an installation surface (room). There is no doubt that it is useful in terms of securing any space.</p><p num="0108">Since the display device is a self-luminous type, it can be visually recognized in a brighter place than a liquid crystal display device. It has excellent characteristics and a wide viewing angle. Therefore, the display device is used as a display unit. There is also a great merit in terms of easy-to-read display.</p><p num="0109">That is, the electric appliance using the display device of the present invention has conventional features such as thinness, light weight, and high visibility. In addition to the advantages of machine light emitting elements, it also has the features of low power consumption and long life, which is extremely useful. is there.</p><p num="0110">In this embodiment, an electric appliance including the display device of the present invention as a display unit is illustrated. A concrete example It is shown in FIGS. 9 and 10. In addition, the organic light emitting element included in the electric appliance of this embodiment includes the present invention. Any of the elements disclosed in the statement may be used. In addition, the display device included in the electric appliance of this embodiment Any of the forms shown in FIGS. 2, 3, and 5 to 8 may be used as the placement form.</p><p num="0111">FIG. 9A shows a display using an organic light emitting element, which includes a housing 901a, a support base 902a, and a display unit 903. Including a. By producing a display using the display device of the present invention as the display unit 903a. It is possible to realize a thin, lightweight and long-lasting display. Therefore, transportation becomes easy and installation In addition to being able to save space when placed, it has a long life.</p><p num="0112">Figure 9 (b) shows a video camera, which includes the main unit 901b, display unit 902b, audio input unit 903b, and operation switch 9. Includes 04b, battery 905b, and image receiving section 906b. The display device of the present invention was used as the display unit 902b. By making a video camera, it is possible to realize a lightweight video camera with low power consumption. To. Therefore, the consumption of the battery is reduced and it is easy to carry.</p><p num="0113">Fig. 9 (c) shows a digital camera, which is a main body 901c, a display unit 902c, an eyepiece 903c, and an operation switch 904. Including c. To manufacture a digital camera using the display device of the present invention as the display unit 902c. Therefore, it is possible to realize a lightweight digital camera with less power consumption. Therefore, the battery consumption It will be less and easier to carry.</p><p num="0114">Figure 9 (d) shows an image playback device equipped with a recording medium, which is the main body 901d, a recording medium (CD, LD, or D). Includes (VD, etc.) 902d, operation switch 903d, display unit (A) 904d, display unit (B) 905d. Display (A) 904 d mainly displays image information, and display unit (B) 905d mainly displays character information. Of the present invention The image reproduction device using the display device as these display units (A) 904d and display unit (B) 905d is manufactured. As a result, it is possible to realize the image reproduction device that consumes less power, is lightweight, and maintains a long life. .. The image playback device provided with this recording medium also includes a CD playback device, a game device, and the like.</p><p num="0115">FIG. 9 (e) shows a portable (mobile) computer, which is a main body 901e, a display unit 902e, and an image receiving unit 903e. , Includes operation switch 904e, memory slot 905e. The display device of the present invention is used as the display unit 902e. By making a portable computer that uses it, it consumes less power and is thin and lightweight. A computer can be realized. Therefore, the battery consumption is reduced and it is easy to carry. .. In addition, this portable computer is a recording that integrates flash memory and non-volatile memory. Information can be recorded on media and played back.</p><p num="0116">Figure 9 (f) shows a personal computer, which includes the main body 901f, housing 902f, display unit 903f, and keyboard. Including de 904f. Create a personal computer using the display device of the present invention as the display unit 903f. By manufacturing, it is possible to realize a thin and lightweight personal computer with low power consumption. .. Especially when you need to carry it around like a laptop computer, in terms of battery consumption and lightness It will be a big advantage.</p><p num="0117">The above electric appliances are used through electronic communication lines such as the Internet and wireless communication such as radio waves. It is becoming more common to display distributed information, especially the opportunity to display video information. I have. The response speed of the organic light emitting element is very fast, and it is suitable for such moving image display.</p><p num="0118">Next, Fig. 10 (a) shows a mobile phone, which includes the main body 1001a, audio output unit 1002a, audio input unit 1003a, and table. Includes indicator 1004a, operation switch 1005a, and antenna 1006a. Display unit 1004a for the display device of the present invention By making a mobile phone that was used as a mobile phone, a thin and lightweight mobile phone with low power consumption can be created. realizable. Therefore, it consumes less battery, is easier to carry, and is compact. Can be the main body.</p><p num="0119">Figure 10 (b) shows audio equipment (specifically, in-vehicle audio), which is the main body 1001b and the display unit 1002b. , Includes operation switches 1003b, 1004b. Acoustics using the display device of the present invention as the display unit 1002b By manufacturing the device, it is possible to realize a lightweight audio device with low power consumption. Also a book In the embodiment, in-vehicle audio is shown as an example, but it may be used for home audio.</p><p num="0120">In addition, in the electric appliances as shown in FIGS. 9 to 10, an optical sensor is further incorporated and used. By providing a means to detect the brightness of the environment, the emission brightness is modulated according to the brightness of the usage environment. It is effective to have a function to make it. Compared to the brightness of the usage environment, the user If the brightness of 100 to 150 can be secured in the contrast ratio, the image or text information can be recognized without any problem. it can. That is, when the usage environment is bright, the brightness of the image is increased to make it easier to see, and the usage environment is When it is dark, it is possible to suppress the brightness of the image and reduce the power consumption. </p>

<p num="0121">The conductive polymer does not need to be applied to the entire surface by the spin coating method, etc. It may be formed in a striped shape by using the T method. Figure 11 shows the data line drive circuit on the board 1101. A state in which 1104 is formed and a conductive polymer 1106 is formed on the pixel portion 1102 by an inkjet method. Shown. The pixel portion 1102 is provided with partition walls 1105 in a striped shape, and conductive points are provided between the partition walls. Form the limmer 1106. The partition wall 1105 is adjacent to the partition wall 1105 when the organic compound layer is formed by the inkjet method. It is provided to prevent the organic compound layers in contact from mixing with each other.</p><p num="0122">The conductive polymer 1106 is formed by ejecting a composition containing the conductive polymer from the ink head 1107. To be done. This composition is continuously ejected from the ink head to form a linear pattern. ..</p><p num="0123">In FIG. 12A, a striped (vertical direction in the figure) first electrode 102a is formed on the substrate, and the pixel portion 110a is formed. In order to form the above, the insulator partition wall 103a is provided so as to surround the pixel portion 110a. Also Figure 1 In 2 (b), an island-shaped first electrode 102b is formed on the substrate to form a pixel portion 110b. The insulator partition wall 103b is provided so as to surround the pixel portion 110b. In either case, AA in the figure The cross-sectional view in'is as shown in FIG. 12 (c). That is, the conductive polymer 104 can be formed between the partition walls and is not necessarily formed on the partition walls 103. It can be separated without being. Formed on this conductive polymer layer with a low molecular weight organic compound material A light emitting layer, an electron injection transport layer, or the like may be formed.</p><p num="0124">Even in that case, the thickness shape of the conductive polymer 104 is T2 due to the influence of the insulator partition wall 103. &gt; T1&gt; T3. Therefore, the lateral resistance at the T3 part becomes high, causing crosstalk. Can be prevented. Furthermore, since the T2 part becomes thicker, the electric field concentration around the pixel part is relaxed and the image is displayed. It is possible to prevent deterioration of the organic light emitting element from the periphery of the element portion. </p>

<p num="0125">In this embodiment, an example of manufacturing an active matrix type display device is shown.</p><p num="0126"> First, multiple TFTs on the insulating surface (including switching TFTs and current control TFTs) Covers the first electrode (anode) connected to the holding capacity, current control TFT, and the end of the first electrode. Form a septum. The materials for the first electrode are Ti, TiN, and TiSi._XN_Y, Ni, W , WSi_X, WN_X, WSi_XN_Y, NbN, Mo, Cr, Pt, or Ti, Si, Ni , W, Nb, Cr, Zn, Sn, In, Mo as the main component of the alloy material Alternatively, a compound material may be used. In addition, the first electrode is a film made of these materials or a laminated film thereof with a total film thickness of 100 nm. It may be used in the range of ~ 800 nm. Also, in order to improve the coverage, the partition wall A curved surface having a curvature is formed at the upper end or the lower end. For example, with partition material When positive photosensitive acrylic is used, the radius of curvature (0) is applied only to the upper end of the insulator 1114. It is preferable to have a curved surface having .2 μm to 3 μm). Also, as a partition wall, it is photosensitive Negative type that becomes insoluble in the etchant by the light of, or dissolves in the etchant by the light Any positive type that is decomposable can be used.</p><p num="0127">Next, a hole injection layer by a coating method is formed on the surface of the first electrode that is not covered with a partition wall. For example, poly (ethylenedioxythiophene) / poly (styrene) that acts as a hole injection layer. An aqueous solution of sulfonic acid) (PEDOT / PSS) is applied to the entire surface by a spin coating method and fired. Hole injection After the inner layer is formed by the coating method, vacuum heating (100 to 200 ° C) is performed immediately before the film formation by the thin film deposition method. It is preferable. For example, after cleaning the surface of the first electrode (anode) with a sponge, Poly (ethylenedioxythiophene) / poly (styrene sulfonic acid) water by spin coating method Set the solution (PEDOT / PSS) on the entire surface Film thickness 60 nm, 80 ° C, temporary firing in 10 minutes, 200 ° C, Main firing in 1 hour, and vacuum heating (170 ° C, heating 30 minutes, cooling 30 minutes) just before vapor deposition. An organic thin film containing a light emitting layer is formed by a thin film deposition method without touching the atmosphere. Especially the ITO film PEDOT / PSS when used as the material for the first electrode and has irregularities or fine particles on the surface By setting the film thickness to 30 nm or more, these effects can be reduced, and as a result, Reduce point defects.</p><p num="0128"> In addition, PEDOT / PSS does not have very good wettability when applied on the ITO film, so PEDOT / PSS After applying the solution for the first time by the spin coating method, it gets wet by washing it with pure water once. After improving the properties, the PEDOT / PSS solution is applied again by the spin coating method for the second time and fired. It is preferable to form a film with good uniformity. After the first application, wash with pure water once. By purifying, the surface can be modified and the effect of removing fine particles can be obtained. To.</p><p num="0129"> In addition, when PEDOT / PSS is formed by the spin coating method, it is formed on the entire surface, so that the substrate is formed. It is preferable to selectively remove the end face, peripheral edge, terminal part, connection area between the cathode and the lower wiring, etc. Moreover, O₂It is preferable to remove it by ashing or the like.</p><p num="0130">Next, a second electrode (cathode) is formed on the organic thin film. As the second electrode, the work function Small materials (Al, Ag, Li, Ca, or alloys of these MgAg, MgIn, AlL i, CaF₂, Or CaN) may be used. The second electrode damages the TFT. It is preferable to carry out the vapor deposition by a resistance heating method with less.</p><p num="0131"> Further, FIG. 13 (A) is a TEM photograph obtained by cutting and observing the element after the formation of the second electrode. .. Note that FIG. 13 (B) is a schematic diagram corresponding to FIG. 13 (A). In addition, in Fig. 13 (A) PEDOT / PSS is formed on the first electrode at about 90 nm.</p><p num="0132"> In this embodiment, by forming a curved surface having a curvature at the upper end or the lower end of the partition wall, the speed is increased. Even with the coating method, as the distance from the first electrode increases on the gentle side wall of the partition wall. The film thickness is reduced, preferably a structure in which there is no conductive polymer which is a hole injection layer on the upper part of the partition wall. It is characterized by doing.</p><p num="0133"> As shown in Fig. 13 (A), the gentle side wall of the partition wall is thin, but the upper part of the partition wall is positive. PEDOT / PSS, which is a pore injection layer, could not be confirmed, and it is effective to use the structure shown in Fig. 13 (A). The occurrence of crosstalk can be suppressed.</p><p num="0134"> In addition, this embodiment can be freely combined with any one of the embodiments and Examples 1 to 6. Can be done. </p>

<p num="0135">When the organic light emitting device of the present invention is manufactured using the device as shown in FIG. 4, it is a conductive polymer. When baking after applying any organic conductor film, the coated surface is below, that is, face-down. It will be a situation to bake in a state. In this example, even with such a baking method, in Example 7. An experiment was conducted to confirm that such a shape could be obtained.</p><p num="0136">First, spin PEDOT / PSS on a substrate with an insulator bulkhead of the same shape as shown in FIG. Apply by the coating method, then bake at 200 ° C with the coated surface facing down, and cross section TE The shape was observed with M. The situation is shown in FIG. 1501 is ITO, 1502 is PEDOT / P The SS layer and the slightly whitish layer 1503 above it are protective layers (carbon layers).</p><p num="0137">As shown in Fig. 15, even when the organic conductor film is wet-coated and then face-down baked, Fig. 1 It was confirmed that exactly the same shape as in 3 can be obtained. Therefore, the shape characteristic of the present invention Can be formed regardless of the orientation of the substrate at the time of baking. </p>

<p num="0138"> In this embodiment, an example of a light emitting device having a top emitting structure will be illustrated. The schematic diagram is shown in FIG. ..</p><p num="0139"> FIG. 16 (A) is a top view showing the light emitting device, and FIG. 16 (B) is obtained by cutting FIG. 16 (A) at A-A'. It is a cut-out sectional view. 1601 shown by the dotted line is the source signal line drive circuit, and 1602 is the pixel. The part, 1603, is a gate signal line drive circuit. In addition, 1604 is a transparent sealing substrate, 160 5 is the first sealing material, and the inside surrounded by the first sealing material 1605 is a transparent second sheet. It is filled with 1607. In addition, the substrate spacing is maintained in the first sealing material 1605. Contains a gap material for.</p><p num="0140"> In addition, 1608 is used for the source signal line drive circuit 1601 and the gate signal line drive circuit 1603. FPC (Flexible) that is the wiring for transmitting the input signal and serves as the external input terminal. Print circuit) Receives video and clock signals from 1609. In addition, here Is only shown on the FPC, but this FPC has a printed circuit board (PWB) attached. It may be kicked.</p><p num="0141"> Next, the cross-sectional structure will be described with reference to FIG. 16 (B). Drive circuit on board 1610 And the pixel part is formed, but here, the source signal line drive circuit 160 is used as the drive circuit. 1 and pixel section 1602 are shown.</p><p num="0142"> The source signal line drive circuit 1601 is an n-channel type TFT1623 and a p-channel type T. A CMOS circuit combined with the FT1624 is formed. Also, the T that forms the drive circuit The FT may be formed of a known CMOS circuit, MOSFET circuit, or NMOS circuit. Ma Further, in this embodiment, a driver-integrated type in which a drive circuit is formed on a substrate is shown, but it is not always the case. It is not necessary, and it can be formed on the outside instead of on the substrate.</p><p num="0143"> In addition, the pixel unit 1602 has a switching TFT 1611 and a current control TFT 1612. With multiple pixels including the first electrode (anode) 1613 electrically connected to and its drain Is formed. The current control TFT 1612 may be an n-channel TFT. , P-channel type TFT may be used, but when connecting to an anode, p-channel type TFT It is preferable to do. Further, it is preferable to appropriately provide a holding capacity (not shown). It should be noted that , Here, of the innumerable pixels arranged, only the cross-sectional structure of one pixel is shown, and one of them is shown. An example of using two TFTs for pixels is shown, but three or more TFTs are used as appropriate. You may.</p><p num="0144"> Here, the first electrode 1613 is in direct contact with the drain of the TFT. Therefore, the lower layer of the first electrode 1613 is a drain made of silicon and an ohmic contact. The top layer in contact with the layer containing the organic compound shall be the material layer with a large work function. Is desirable. For example, a titanium nitride film, a film containing aluminum as a main component, and a titanium nitride film. With the three-layer structure of, the resistance as wiring is low and good ohmic contact is achieved. And it can function as an anode. Further, the first electrode 1613 is a nitrider. It may be a single layer such as a zinc film, a chromium film, a tungsten film, a Zn film, a Pt film, or three or more layers. May be used.</p><p num="0145">In addition, insulator bulkheads (banks, bulkheads, barriers, banks) are located at both ends of the first electrode (anode) 1613. 1614 (called throat) is formed. Insulation partition wall 1614 is made of organic resin film or silicon. It may be formed of a containing insulating film. Here, as the insulator partition wall 1614, a positive photosensitive a. An insulator partition wall having the shape shown in FIG. 16 is formed using a krill resin film.</p><p num="0146"> For good coverage and uniform application of the organic conductor film 930 Therefore, a curved surface having a curvature is formed at the upper end or the lower end of the insulator partition wall 1614. To. For example, when positive photosensitive acrylic is used as the material for the insulator partition wall 1614, A curved surface having a radius of curvature (0.2 μm to 3 μm) is provided only at the upper end of the frame partition wall 1614. Is preferable. Also, as an insulator partition wall 1614, it is etched by photosensitive light. Negative type that becomes insoluble in light, or positive type that becomes soluble in etchant by light Can also be used.</p><p num="0147"> In addition, the insulator partition wall 1614 is mainly composed of aluminum nitride film, aluminum nitride film, and carbon. It may be covered with a thin film as a component or a protective film made of a silicon nitride film.</p><p num="0148"> Here, on the first electrode (anode) 1613 and the insulator partition wall 1614, an organic conductor film Form 1630. In this example, a conductive polymer is applied by a spin coating method. However, other wet methods may be used. Also, organic matter and acceptors or donors It may be formed by a dry method such as co-depositing. In addition, PEDOT / PSS as a conductive polymer When spin-coating with an aqueous solvent system such as, UV ozone is applied to the coated surface in advance. Processing or O₂There is a method of applying hydrophilic treatment such as plasma treatment and then spin coating. It is effective.</p><p num="0149">In this embodiment, since the organic conductor film 1630 is formed by the spin coating method, the base is immediately after coating. It is applied to the entire surface of the board. Therefore, the end face and peripheral edge of the substrate, the terminal portion, and the second electrode 161 It is preferable to selectively remove the connection area between 6 and the connection wiring 1608, and O₂Assi It is preferable to remove it by shaving or laser ablation.</p><p num="0150">On the organic conductor film 1630, a thin-film deposition method using a thin-film deposition mask or an inkjet method is used. Therefore, the organic thin film 1615 is selectively formed. In addition, with the organic thin film 1615 in this example Is a film that emits white light.</p><p num="0151"> Further, a second electrode (cathode) 1616 is formed on the organic thin film 1615. As the cathode, a material with a small work function (Al, Ag, Li, Ca, or an alloy of these M gAg, MgIn, AlLi, CaF₂, Or Ca₃N₂) May be used. here, As a second electrode (cathode) 1616 so that light emission can be transmitted, a thin metal thin film is used. , Transparent conductive film (ITO (indium tin oxide alloy), indium zinc oxide alloy ( In₂O₃-Use lamination with (ZnO), zinc oxide (ZnO), etc.). Thus, the first electrode (Anode) 1613, organic conductor film 1630, organic thin film 1615, and second electrode (cathode) An organic light emitting device 1618 composed of 1616 is formed. Here, the organic light emitting element 1618 Since it is an example of emitting white light, a color consisting of a colored layer 1631 and a light-shielding layer (BM) 1632. By providing a filter (for simplicity, the overcoat layer is not shown here) Therefore, full color is possible.</p><p num="0152"> In addition, if layers containing organic compounds that can emit light of R, G, and B are selectively formed, respectively. , A full-color display can be obtained without using a color filter.</p><p num="0153"> In addition, a transparent protective layer 1617 is formed to seal the organic light emitting element 1618. This transparent The bright protective layer 1617 can be obtained by the sputtering method (DC method or RF method) or the PCVD method. Silicon nitride or silicon nitride-based insulating film, carbon-based thin film (diamond) Mondolike carbon: DLC film, carbon nitride: CN film, etc.), or a laminate of these Is preferable. Form in an atmosphere containing nitrogen and argon using a silicon target For example, a silicon nitride film having a high blocking effect against impurities such as water and alkali metals can be obtained. Is done. Moreover, you may use the silicon nitride target. In addition, the transparent protective layer is remote It may be formed by using a film forming apparatus using Razuma. Also, let the transparent protective layer pass light emission. Therefore, the film thickness of the transparent protective layer is preferably as thin as possible.</p><p num="0154"> Further, in order to seal the organic light emitting element 1618, the first sealing material 16 is used in an inert gas atmosphere. 05, the sealing substrate 1604 is bonded with the second sealing material 1607. Epoxy resin is used as the first sealing material 1605 and the second sealing material 1607. Is preferable. In addition, the first sealing material 1605 and the second sealing material 1607 contain as much water and acid as possible. It is desirable that the material is impermeable to elements.</p><p num="0155"> Further, in this embodiment, the material constituting the sealing substrate 1604 is other than the glass substrate and the quartz substrate. , FRP (Fiberglass-Reinforced Plastics), PVF (Polyvinyl Fluoride), My A plastic substrate made of ra, polyester, acrylic or the like can be used. Further, the sealing substrate 1604 is adhered using the first sealing material 1605 and the second sealing material 1607. After that, it is also possible to further seal with a third sealing material so as to cover the side surface (exposed surface).</p><p num="0156"> As described above, the organic light emitting element is enclosed in the first sealing material 1605 and the second sealing material 1607. By doing so, the organic light emitting element can be completely blocked from the outside, and moisture and acid can be blocked from the outside. It is possible to prevent the invasion of substances that promote the deterioration of the organic compound layer such as element. Therefore, A highly reliable light emitting device can be obtained.</p><p num="0157"> If a transparent conductive film is used as the first electrode 1613, a double-sided light emitting device is manufactured. Can be</p>