Substrate-related-operation performing apparatus

The present invention relates to a board-to-board work machine on which a work head that performs work on a circuit board is mounted.

A board-to-board work machine is a work machine that works on a circuit board that constitutes an electronic circuit, and is, for example, a solder printing machine, an adhesive coating machine, a component mounting machine, and an inspection work machine that inspects the results of those works. And so on. As a type of anti-board work machine, there is a type that has a work head that is the main work subject and moves the circuit board and its head relative to each other to perform work. Adhesive coating machine, component mounting machine, inspection work machine And many of them are in such a mode. For example, in a component mounting machine, a mounting head is adopted as a work head, and the mounting head has a suction nozzle as a component holding device, and the component is taken out from the component supply device by this suction nozzle to be taken out from the component supply device, and the surface of the circuit board. It is designed to be implemented in. As a technique related to the work head, for example, the following patent document discloses a technique for determining the suitability of the attached nozzle with respect to the attachment of the replaceable suction nozzle.

<p><patcit num="1"><text>Japanese Patent Application Laid-Open No. 6-104596</text></patcit></p>

<p> As described in the above patent documents, it is common practice to make the components constituting the work head, such as the suction nozzle, removable or replaceable. For example, regarding the replacement of suction nozzles, if various suction nozzles can be attached and detached according to the type of circuit board to be worked on and the circuit components to be mounted, the versatility of the board-to-board work machine will be enhanced. That is, if the components constituting the work head can be detached or replaced, the versatility required for the board-to-board work machine can be improved. However, so far, no effective technique for making the work head itself removable or replaceable has been disclosed. Therefore, the present invention has been made as an object to improve the versatility required for a substrate working machine.</p>

<p> In order to solve the above problems, the anti-board working machine of the present invention includes a mounting unit having a component holding device for holding components at the lower end so as to be replaceable, an elevating device for raising and lowering the mounting unit, and the mounting unit. A mounting head having a rotating device to rotate, a slide on which the mounting head is mounted, a slide moving device for moving the slide along a guide, and a control device for controlling the slide moving device and the mounted mounting head. It is a board-to-board working machine provided with and, and as the mounting head, one arbitrarily selected from a plurality of mounting heads having different configurations is interchangeably mounted, and the control device is provided. It is characterized in that it is configured to perform measurement processing regarding the tip position of the component holding device of the mounting unit of the mounted mounting head in the height direction.</p>

<p> The board-to-board working machine of the present invention is highly convenient because it is designed to perform measurement processing regarding the tip position of the component holding device of the mounting unit of the mounted mounting head in the height direction. Therefore, according to the present invention, the versatility of the substrate working machine is improved.</p>

Aspects of the invention

Hereinafter, some aspects of the invention for which a patent claim is recognized in the present application (hereinafter, may be referred to as a claimable invention) will be illustrated and described. As with the claims, each aspect is divided into terms, each section is numbered, and the numbers of other sections are cited as necessary. This is only for facilitating the understanding of claimable inventions, and does not mean that the combinations of the components constituting those inventions are limited to those described in the following sections. That is, the claimable invention should be interpreted in consideration of the description accompanying each section, the description of the examples, etc., and as long as the interpretation is followed, a mode in which other components are added to the mode of each paragraph. Also, the aspect in which the component is deleted from the aspect of each item can be one aspect of the claimable invention.

The invention according to the claim is constructed by combining the technical features of the following items and the technical features described in the examples.

(1) A board-to-board work machine including a removable work head, which performs preset work on a circuit board by operating the work head in a state where the work head is attached.

The board-to-board working machine of the present invention is a board-to-board working machine having a working head, and the working head is detachably configured. The type of the board-to-board working machine is not particularly limited, and any board-to-board work having a work head may be used. For example, the present invention can be applied to various anti-board working machines such as a component mounting machine having a mounting head, an adhesive coating machine having a coating head, and an inspection working machine having an inspection head. Here, the "working head" is a component that performs the main work on the board-to-board working machine, and means, for example, a component that can be relatively moved to and from the circuit board. When a relative moving device for relatively moving the work head and the circuit board is included, the work head in the present invention is detachably mounted from the relative moving device. In the present invention, the work head itself is removable, which is distinguished from the fact that the components constituting the work head are removable. Removable means that it can be easily attached / detached, and for example, it can be attached / detached without using a tool. To put it plainly, it means that it can be attached and detached with one touch. If the work head is removable, maintenance can be easily performed, and the convenience of the board-to-board work machine can be improved.

(2) The board-to-board working machine includes a board holding device for fixing and holding a circuit board and a component supply device for supplying circuit components, and the work head holds circuit components supplied from the component supply device. The circuit board is used as a mounting head to be taken out and mounted on the surface of the circuit board fixedly held by the board holding device, so that the board-to-board working machine functions as a component mounting machine (1). The anti-board working machine described in the section.

The aspect described in this section is an aspect as a component mounting machine. In the case of a component mounting machine, generally, a component holding device such as a suction nozzle is provided, and for example, a mechanism for raising and lowering the device, a mechanism for rotating the device, and the like are provided. The anti-board working machine of the present invention is particularly effective for a mounting head provided with such an elevating mechanism, a rotation mechanism, and the like so as to be removable. This is because the mounting head having such a mechanism has a great advantage in that it can be separated, such as often performing maintenance because it is precise. The component mounting machine is often provided with an XY robot type head moving device that moves the work head along one plane, and when the present invention is applied to such a component mounting machine, the working head can be removed from the head moving device. It becomes an aspect.

(3) The anti-board working machine according to item (1) or (2), wherein one arbitrarily selected from a plurality of working heads can be mounted as the working head.

Aspects that are interchangeable with other work heads are included in the embodiments described in this section. For example, considering performing maintenance, when one work head is being maintained, it is possible to attach another work head to perform work, which is advantageous not only in terms of convenience but also in terms of work efficiency. is there. This aspect includes a case where the work head has the same configuration and a case where the work head has a different configuration.

(4) The item (3), wherein the plurality of work heads include those having different configurations, and one arbitrarily selected from the work heads having different components can be mounted as the work head. Anti-board working machine.

The embodiment described in this section is an embodiment that can be replaced with a work head having a different configuration. For example, it is possible to replace work heads with different types of work, for example, between work heads such as a mounting head for performing component mounting work, a coating head for performing adhesive coating work, and an inspection head for performing inspection work. , Can be interchangeable with each other. In this way, if it is possible to replace the work head with a work head having a different configuration to the extent that the type of work to be performed is different, the board-to-board work machine can have a variety of target work, and the versatility of the board-to-board work machine Is greatly improved. Further, the embodiment described in this section includes a working head that performs the same type of work and can be replaced with a working head having a different configuration. For example, taking the mounting head as an example, the mounting head includes the number of component holding devices such as suction nozzles attached, the mechanism for raising and lowering the component holding device, the difference in the shape and size of the target circuit component, and the mounting speed. There are different configurations depending on the purpose, such as the difference between the two. That is, there are mounting heads in which the number, shape, operation, function, etc. of the components are different from each other. The embodiment described in this section can be exchanged between work heads of the same type of work having such different configurations, and the work form can be different even in the same type of work. The versatility of the work machine is improved.

(5) The work head is provided with a unique information recording medium on which unique information about the work head is recorded, and is information related to the work head mounted on the board-to-board work machine based on the unique information. The anti-board working machine according to any one of items (1) to (4), which includes a head-related information recognition unit that recognizes head-related information.

When the work head is removable, it is more convenient if the configuration, state, etc. of the work head can be grasped when the head is attached to the work. As will be described in detail later, if the configuration of the mounted work head can be automatically recognized, for example, a process for preparing to use the head (hereinafter, may be referred to as a "head use preparation process"). Can be done automatically. The head use preparation process includes, for example, change of software for driving the head, calibration, and determination of whether or not the work head is suitable for use. The embodiment described in this section is an embodiment suitable for automatically performing such a head use preparation process.

The head-related information in the embodiment of this section includes head configuration specification information, head status information, and the like, which will be described later. In the embodiment described in this section, the work head itself has its own unique information. That is, the unique information referred to in this section is information recorded in the head itself, and can be called head storage information. This unique information includes information for obtaining head-related information and the like. For example, information such as work head ID information representing the work head ID and head format information representing the work head format is applicable. The type of unique information recording medium on which unique information is recorded is not limited to that, for example, a memory element such as ROM or RAM or a DIP switch is electrically connected to acquire information to be recorded by the medium. It may be possible. Further, it may be a bar code, a 2D code (also called a QR code (registered trademark)) or the like that can be recognized and acquired by visual or optical means, or by wireless such as a tag chip. Various recording media such as a recording medium having a communication function and a recording medium using magnetism or the like can be adopted. Depending on the type of the unique information recording medium provided on the work head, a means capable of acquiring or recognizing information from the recording medium may be provided on the work machine main body side.

The head-related information recognition unit recognizes the head-related information based on the unique information. For example, the head-related information may be recognized by performing processing such as calculation by itself based on the unique information, and the unique information may be used as a key to generate something from the inside or the outside of the board working machine. Information may be acquired and the information may be recognized as head-related information. In addition, the unique information includes the head-related information as it is, and includes a mode in which the information is recognized only by acquiring the information. In this case, the work head has the head-related information itself.

(6) Item (5) includes a configuration specification information recognition unit in which the head-related information recognition unit recognizes head configuration specification information which is a specification related to the configuration of the mounted work head as the head-related information. Described anti-board working machine.

The mode described in this section is a mode in which specifications relating to the configuration of the head are recognized as head-related information information. The head configuration specifications are various factors related to the configuration of the work head, and include, for example, format information of the work head, information on the deployed position of various components provided in the work head, and the like. Taking a mounting head as an example, the type information of the working head includes, for example, the name representing the type, the number of suction nozzles that can be attached, the shape and type of the suction nozzles that can be attached, the mounting speed, and the type of the mounting head. Information that can identify. Further, the information regarding the component placement position includes, for example, the height direction of the member holding the suction nozzle in the mounting head, the placement position in the horizontal plane, and the like. As will be described later, this information includes information for selecting a driver for operating the mounted work head, information for determining whether the mounted head is suitable for use, and mounting head. It can be information or the like for determining a reference position for operating.

(7) The device-to-board work machine recognizes the configuration specification information in a driver storage unit in which a work head driver, which is software for enabling the mounted work head, is stored, and in the driver storage unit. The anti-board working machine according to item (6), which includes a head-corresponding part that stores a work head driver corresponding to the mounted work head based on the head configuration specification information recognized by the unit.

Generally, the operation of the anti-board working machine is controlled by a control device mainly composed of a computer. Devices and devices such as work heads and feeders require special software called drivers in order to drive them. The driver that operates the work head can be called a work head driver, and there is a driver suitable for the work head for each type of work head. If the work head is not replaced, that is, in the case of a conventional anti-board work machine provided in a fixed manner, this is not a problem, but in a work machine with a replaceable work head, it depends on the mounted work head. Specifically, it becomes necessary to select a driver according to the configuration of the work head. The mode described in this section is a mode in which the driver can be automatically selected according to the work head in such a case, and the work head can be easily replaced. When preparing multiple types of work drivers, various drivers are stored inside the anti-board work machine or outside the anti-board work machine, and based on the selection result, they are stored. It suffices to send to the board working machine. The embodiment described in this section is an embodiment in which the head use preparation process can be automated in a board-to-board working machine in which the working head can be replaced.

(8) The head configuration specification information that the board-to-board work machine recognizes the component position information, which is the position information related to the work operation of the component of the mounted work head, by the configuration specification information recognition unit. The anti-board working machine according to paragraph (6) or (7), which includes a position information acquisition unit to be acquired based on.

Although the work head is a precision instrument, it may include manufacturing errors and the like. In a board-to-board work machine in which the work head is not attached or detached, the position of the work head and each component thereof is adjusted after the work head is assembled so that the above error does not affect the work accuracy. However, in a board-to-board work machine in which the work head is removable, in particular, in a board-to-board work machine in which various work heads are exchanged and mounted, manufacturing errors of the work head itself and deviation of the mounting position of the work head work. Affects accuracy. The aspect described in this section is an aspect that enables automation of so-called calibration processing, that is, position adjustment regarding a work head, which is performed in order to eliminate the influence of such errors. For example, based on the information on the recognized component specifications, in particular, the information on the component deployment position, the information on the mounted work head, the position of the component in the board working machine, etc. is acquired and acquired. Based on the information obtained, the position adjustment corresponding to the mounted work head is performed. The work head and the circuit board are moved relative to each other in the work with the board, and the position adjustment includes correcting the command position in the relative movement. Taking the mounting head as an example, the relative suction nozzles are based on information such as the height direction of the member holding the suction nozzle, which is a component of the mounting head, and the arrangement position in the horizontal plane. It is possible to perform processing for adjusting the movement command position, the relative movement command position of the mounting head, and the like.

(9) Item (5) to (8), wherein the head-related information recognition unit includes a status information recognition unit that recognizes head status information, which is information related to the status of the mounted work head as the head-related information. The anti-board working machine described in either.

The aspect described in this section is an aspect of recognizing information regarding the state of the attached work head based on the above-mentioned unique information possessed by the work head. The status information includes, for example, a usage state of the work head, a state related to work accuracy, and the like. Not only the state of the work head itself, but also the state in relation to the board-to-board work machine to be mounted, for example, compatibility. Specifically, for example, how long the work head has been in operation, the date and time that has passed since the maintenance was performed, what the defect rate of the work head is, and the board work machine. It is the degree of defect rate when it is attached. The status information can be used for determining the suitability of use, which will be described later. The status information can be recognized by accessing and acquiring a database such as a production history and a maintenance history related to the work head based on the unique information possessed by the work head.

(10) The pair according to item (9), wherein the board working machine includes a head suitability determination unit that determines the suitability of the mounted work head based on the head status information recognized by the status information recognition unit. Board work machine.

The mode described in this section is a mode for determining the suitability of the work head according to the state of the work head. The suitability of the work head means whether or not it is appropriate to perform work using the mounted work head, and in the embodiment described in this section, for example, the work head itself is used in a bad condition. This includes cases where the work head is not compatible with the board-to-board work machine to be mounted and it is inappropriate to use it in the board-to-board work machine. The determination of whether or not the attached work head can be used is also included in the head use preparation process, and the embodiment described in this section is an embodiment in which the head use preparation process can be automated. Although it is not the embodiment described in this section, the anti-board working machine of the present invention can be implemented in a mode in which the determination is made based on the head configuration specification information, not based on the head status information. Further, as one aspect of the aspect described in this section, it can be carried out in an embodiment determined based on both the head status information and the head configuration specification information.

(11) An X-direction moving device that includes a work head-mounted member to which the work head is mounted and moves the work head-mounted member in the X direction, which is one direction, and an X direction thereof. Item (1) includes a work head moving device including a Y-direction moving device that moves the moving device in the Y direction, which is one direction perpendicular to the X direction, and moving the work head in a plane parallel to the circuit board. Or the anti-board working machine according to any one of (10).

(12) The anti-board work machine according to item (11), wherein the work head and the work head mounted member have a total length of 60 mm or less in the X direction when the work head is mounted.

(13) The anti-board working machine according to item (11) or (12), wherein the weight of the work head and the member to be mounted on the work head is 5 kg or less.

(14) Item (11) A substrate imaging device capable of imaging a reference mark attached to the surface of a circuit board is provided on the work head mounted member at a position aligned with the mounted work head in the Y direction. Or the anti-board working machine according to any one of (13).

According to the aspects described in the above four sections, a compact anti-board work machine and a work machine with a small load on the work head moving device can be realized. It should be noted that the embodiments described in the above four items can be applied to a board-to-board working machine in which the working head is not detachably provided, that is, the working head is fixedly provided.

(21) A work head for a board-to-board work machine, which is detachably provided on the board-to-board work machine and is operated to perform a preset work on a circuit board.

(22) The circuit board working machine includes a board holding device for fixing and holding a circuit board and a component supply device for supplying circuit components, and the work head is supplied from the component supply device. The work head for a board-to-board work machine according to item (21), which is a mounting head for holding and taking out parts and mounting the held circuit parts on the surface of a circuit board fixedly held by a board holding device.

(23) The work head for a board-to-board work machine according to item (21) or (22), wherein the work head includes a unique information recording medium on which unique information about the work head is recorded.

The various aspects of the work head for a substrate working machine of the present invention are suitable working heads for the various aspects of the working machine for a substrate of the present invention. Since these explanations overlap with the above-mentioned explanations, the description thereof is omitted here.

(31) In a board-to-board work system including a board-to-board work machine that is equipped with a removable work head and operates the work head in a state where the work head is attached to perform preset work on a circuit board. Therefore, the mounted work head includes a unique information recording medium on which unique information about itself is recorded, and the system performs head-related information, which is information related to the head for each work head, on the board. A head-related information external storage unit stored outside the machine, and a head-related information recognition unit that acquires and recognizes head-related information about the mounted work head from the head-related information external storage unit based on the unique information. A board-to-board work system characterized by being equipped with.

The board-to-board work system of the present invention acquires the above-mentioned head-related information from an external device of the board-to-board work machine in a system including a board-to-board work machine in which a work head is detachably provided. The description of the system described in this section omits the part that overlaps with the above description. The head-related information external storage unit corresponds to, for example, a computer-based device that functions like a database. As described above, the head-related information includes head configuration specification information, head status information, and the like, and a database can be used properly according to the type of the information and the like. For example, a database for storing the production history of the board-to-board work machine and the work head, a device device database for storing various information about the devices and devices constituting the board-to-board work machine, and the like are used properly. Therefore, the number of head-related information external storage units is not limited to one, and may be plural. Further, the head-related information recognition unit may be provided on the board-to-board work machine, or may be provided on a device separate from the board-to-board work machine. When it is provided as a separate device, for example, when a computer-based management device that plays a host-like role of managing a plurality of board-to-board work machines is arranged in the system, the management thereof is performed. The device may function as the separate device, or the device that fulfills the database-like function may function as the separate device.

The board-related work system of the present invention can be implemented in such a manner that the head-related information recognition unit includes at least one of the configuration specification information recognition unit and the status information unit as described above. Further, it can also be carried out in a mode in which any one or more of the head suitability determination unit, the head correspondence unit, and the position information acquisition unit described above is provided. In that case, each of these parts may be provided in the anti-board working machine, or may be provided in the above-mentioned separate device. The system described in this section may be implemented in a mode in which the above-mentioned work heads can be exchanged, a mode in which work heads having different configurations can be exchanged, and a mode in which the board-to-board work machine is limited to a component mounting machine. it can.

(41) Preparation for use of the work head for the board work machine, which is detachably attached to the board work machine and is operated to perform the preset work on the circuit board. This is a program executed by a computer to perform processing for the work head, and has a unique information read step of reading unique information about the work head from a unique information recording medium provided in the mounted work head, and a read unique information. A work head use preparation processing program for a work head for a board-to-board work machine, which comprises a head-related information recognition step for recognizing head-related information which is information related to the work head based on the information.

(42) Item (41), wherein the head-related information recognition step has a configuration specification information recognition step that recognizes head configuration specification information which is a specification related to the configuration of the mounted work head as the head-related information. The work head use preparation processing program for the work board for the board described.

(43) The head use preparation processing program is based on the recognized head configuration specification information in the driver storage unit in which the work head driver, which is software for enabling the mounted work head, is stored. The work head use preparation processing program for a board-to-board work machine according to item (42), which includes a head correspondence step for storing the work head driver corresponding to the mounted work head.

(44) A position at which the head use preparation processing program acquires component position information, which is position information related to the work operation of the mounted work head component, based on the recognized head component specification information. The work head use preparation processing program for a board-to-board work machine according to paragraph (42) or (43), which includes an information acquisition step.

(45) Item (41) to (44), wherein the head-related information recognition step has a status information recognition step for recognizing head status information which is information on the status of the mounted work head as the head-related information. The work head use preparation processing program for a board-to-board work machine described in any one of them.

(46) The board-to-board work machine according to item (45), wherein the head use preparation processing program includes a head suitability determination step of determining the suitability of the mounted work head based on the recognized head status information. Work head use preparation processing program.

Various aspects of the work head use preparatory processing program for a work head for a board-to-board work machine of the present invention include preparatory processing for performing work using the mounted work head in a work head-to-board work machine to which the work head is removable. This is an aspect relating to a program for automation. Since these explanations overlap with the above-mentioned explanations, the description thereof is omitted here. In addition, each of the above-described aspects is carried out in a mode in which the above-mentioned work heads can be exchanged, a mode in which the work heads having different configurations can be exchanged, and a mode in which the substrate working machine is limited to a component mounting machine. You can also do it.

(51) Circuit boards are arranged side by side in the direction of transportation, and each of them serves as a work head for performing board-to-board work, (a) a coating head for performing adhesive coating work, and (b) component mounting work. (C) One of the coating heads, mounting heads, and inspection heads that can be mounted on any one of the inspection heads for performing inspection work. A plurality of anti-board work machines configured to be exchangeable with others are provided, and each of the plurality of anti-board work machines is sequentially mounted on each of the plurality of board-to-board work machines to be transported. A board-to-board work system configured to perform board-to-board work according to the work head.

(52) Circuit boards are arranged side by side in the direction of transportation, and each of them serves as a work head for performing board-to-board work, (a) a coating head for performing adhesive coating work, and (b) component mounting work. (C) One of the coating heads, mounting heads, and inspection heads that can be mounted on any one of the inspection heads for performing inspection work. A plurality of anti-board working machines configured to be exchangeable with other ones are used, and one circuit board to be transported is sequentially mounted on each of the plurality of anti-board working machines. A board-to-board work method, characterized in that the board-to-board work is executed according to the work head.

<figref num="1">It is a perspective view which shows the whole structure of the anti-board working machine which is an embodiment of this invention.</figref><figref num="2">It is a perspective view which shows the structure of the work module which constitutes the board-to-board work machine.</figref><figref num="3">It is a perspective view which shows the conveyor unit deployed in the work module.</figref><figref num="4">It is a perspective view which shows the anti-board work apparatus deployed in the work module.</figref><figref num="5">It is a perspective view which shows some of the mounting heads which can be equipped with a board work apparatus.</figref><figref num="6">It is a perspective view which shows one of the mountable heads which can be equipped.</figref><figref num="7">It is a perspective view for demonstrating the mechanism of mounting of a mounting head on a head moving device.</figref><figref num="8">It is sectional drawing which shows the head fixing device for fixing a mounting head.</figref><figref num="9">The block diagram regarding the control of the module control device deployed in each work module is shown.</figref><figref num="10">It is a schematic diagram which shows the state that the anti-board working machine is arranged in a factory.</figref><figref num="11">It is a flowchart which shows the head use preparation processing program which is executed when a work head is attached.</figref><figref num="12">It is a flowchart which shows the head-related information recognition processing routine in a head use preparation processing program.</figref><figref num="13">It is a flowchart which shows the head suitability judgment processing routine in a head use preparation processing program.</figref><figref num="14">It is a flowchart which shows the calibration processing routine in the head use preparation processing program.</figref><figref num="15">It is a conceptual diagram for demonstrating the method of calculating the height position of the mounted mounting head.</figref><figref num="16">It is a conceptual diagram for demonstrating the method of measuring the rotation center of a mounting unit.</figref><figref num="17">It is a conceptual diagram for demonstrating the method of calculating the index rotation center of a mounting unit.</figref><figref num="18">It is a functional block diagram for demonstrating the function of the module control device with respect to the head use preparation process.</figref>

Hereinafter, examples of the claimable invention will be described in detail with reference to the drawings. In addition to the following examples, the present claimable invention may be made in various embodiments which have been modified or improved based on the knowledge of those skilled in the art, including the embodiments described in the above [Aspects of the Invention]. Can be carried out.

<p> &lt;Structure of anti-board working machine, etc.&gt; Fig. 1 shows an overall perspective view of the anti-board working machine according to the embodiment of the present invention. The anti-board work machine 1 is a separate body from the base module 10, a plurality of (8) work modules 12 arranged adjacent to each other and aligned on the base module 10, and the base module 10 and the work module 12. It is configured to include a control module 13 as a work equipment control device. The work modules 12 have substantially the same configuration in terms of hardware, except for the work heads described later, and the directions in which they are lined up are the directions in which the circuit boards are conveyed. In the description of the board working machine 1, the direction in which the work modules 12 are lined up is referred to as the left-right direction, and the direction orthogonal to the left-right direction is referred to as the front-rear direction. That is, the left front in the figure is the front side, that is, the front side of the board working machine 1, and the right rear side is the rear side, that is, the back side. Further, the left side of the board working machine 1 is the upstream side and the right side is the downstream side, and the circuit board is transported from the work module 12 located on the left toward the work module 12 located on the right. Then, the work on the board in each work module 12 is sequentially executed.</p><p> It is assumed that each of the work modules 12 arranged on the board-to-board work machine 1 has a function as a board-to-board work machine, and in relation to the present invention, each of the work modules 12 1 One can be considered as a board-to-board work machine, but in the present embodiment, the board-to-board work machine is treated as an aggregate of work modules 12. Further, each work module 12 can also be equipped with a work head such as an adhesive coating head and an inspection head. However, in order to simplify the explanation, in the present embodiment, a circuit component such as an electronic component is used as the work head. It is assumed that only the mounting head for mounting is mounted. Therefore, the work module 12 is a mounting module, and the board-to-board work machine 1 is a component mounting machine. In the following description, when focusing on component mounting, the board-to-board work machine 1 is referred to as a component mounting machine 1 and the work module 12 is referred to as a mounting module 12, and the names may be used properly.</p><p> FIG. 2 is an enlarged view of the portion where the two mounting modules 12 are arranged, and the mounting module 12 on the right side is shown with the exterior plate and the like removed. As shown in this figure, each mounting module 12 includes a frame 14 that functions as a module frame, and various devices and the like arranged on the frame 14. For example, a plurality of tape feeders (hereinafter, may be abbreviated as "feeder") 16 and a circuit board, each of which is arranged side by side as a component supply device and supplies circuit components one by one at a predetermined component supply position. It has a conveyor unit 20 and a work head 21 as a board holding device that has a function of transporting a circuit board and holds a circuit board fixedly at a predetermined work position, and moves the work head 21 within the work area to perform the work. It is a board-to-board work device 20 or the like that causes the head 21 to perform board-to-board work. In the present embodiment, the work head 21 is a mounting head that holds and takes out the circuit components supplied from the feeder 16 and mounts the circuit components on the circuit board fixed to the conveyor unit 20. 22 functions as a mounting device. In the following description, when focusing on component mounting, the work head 21 is referred to as a mounting head 21 and the board-to-board working device 22 is referred to as a mounting device 22, and the names may be used properly.</p><p> In addition, the mounting module 12 has a component camera 24 (CCD) that mainly functions as a component image pickup device between a group of a plurality of feeders 16 (hereinafter, may be referred to as a feeder group) 18 and a conveyor unit 20. A camera), a nozzle stocker 25 as a component holding device storage device for storing a suction nozzle, which is a component holding device described later, and a nozzle tip height detector 27 described later are provided. Further, each mounting module 12 has a module control device 26 (see FIG. 9) that controls itself, and each of the above devices and the like is controlled and operated by the module control device 26. Further, each of the mounting modules 12 is provided with an operation / display panel 28 as an input / output device at the upper part, and the operation / display panel 28 is connected to the module control device 26 to input operators for various commands, information, and the like. And display information about the status of the implementation module 12 and its components.</p><p> Each of the plurality of feeders 16 is roughly divided into a feed mechanism portion 40 and a reel holding portion 42. The reel holding portion 42 holds a reel 46 around which taping (sometimes called electronic component taping in the case of electronic components), which is a taped circuit component, is wound. The feed mechanism unit 40 has a drive source inside, and the taping extending from the reel 46 is sent by the feed mechanism unit 40 by the component holding pitch according to the operation of the mounting device 22, and the cover tape is peeled off. The circuit components are supplied one by one at the component supply position. Since the feeder 16 and taping have a well-known mechanism and configuration, the explanation here is about this level.</p><p> As shown in FIG. 3, the conveyor unit 20 is mainly composed of a conveyor device, and includes two conveyor devices, a front conveyor 72 and a rear conveyor 74. The front conveyor 72 and the rear conveyor 74 each have two opposing conveyor rails 76,78,80,82, and the respective conveyor rails 76,78,80,82 have conveyor belts (not shown). The structure is such that the motor 84 circulates around the circuit board 86, and the circuit board 86 is supported by the conveyor belt and transferred. The conveyor unit 20 is provided in each of the plurality of mounting modules 12, and each of the conveyor units 20 is arranged to be located in a straight line in the component mounting machine 1. The conveyor units 20 of each mounting module 12 are capable of transporting circuit boards in cooperation with each other. That is, these conveyor units 20 constitute a substrate transfer device in the component mounting machine 1. The conveyor rails 78, 80, 82 other than the conveyor rail 76 can be moved in the front-rear direction by the conveyor width adjusting motor 88, and the conveyor width can be freely adjusted, and the front conveyor 72 and the rear conveyor 74 By using only one of them, it is possible to transport a circuit board having a large width.</p><p> The circuit board 86 transferred into the work area by controlling and driving the conveyor motor 84 is stopped at the work position which is the set stop position. The conveyor unit 20 has a circuit board support plate (hereinafter, may be abbreviated as support plate) 90 that can be raised and lowered by an elevating device (not shown) at the bottom, and is shown on the upper surface of the support plate 90. The support pin is provided so that it can be changed to any position, and when the support plate 90 is raised, the circuit board 86 is raised by being supported by the support pin, and the engagement with the conveyor belt is disengaged. At the same time, the circuit board 86 is fixed at the above working position by being sandwiched between a part of the conveyor rails 76,78,80,82 and the support pin 90. To release the fixing, the support plate 90 may be lowered. From such a configuration, the conveyor unit 20 functions as a substrate holding device in the mounting module 12.</p><p> As shown in FIG. 4, the mounting device 22 includes a mounting head 21 and a head moving device 102 (which functions as a mounting head moving device) that moves the mounting head 21 along a substantially one plane in a work area. It is composed. The head moving device is a kind of relative moving device that relatively moves the mounting head 21 and the circuit board held by the conveyor unit 20. The mounting head 21 will be described in detail later. The head moving device 102 is an XY robot type moving device, and has a Y slide device 112 as a Y direction moving device that moves the mounting head 21 in the front-rear direction (Y direction) and an X that moves the mounting head 21 in the left-right direction (X direction). It includes an X slide device 114 as a directional movement device. The Y slide device 112 is provided on the beam 116 which forms a part of the frame 14, and is driven by the Y axis motor 118 to move the Y slide 120 along the Y guide 122 via a ball screw mechanism. The X-slide device 114 is provided on the Y-slide 120, and is driven by the X-axis motor 126 to move the X-slide 128 along the X-guide 130 via a ball screw mechanism. The mounting head 21 has a structure to be mounted on the X slide 128 as a member to be mounted on the work head. The mechanism related to this mounting will also be described later. The mounting head 21 is moved by the head moving device 102 between the feeder group 18 and the circuit board fixed in the conveyor unit 20. The X slide 128 is provided with a mark camera 132 (which is a CCD camera) below the X slide 128. The mark camera 132 functions as a substrate imaging device and images a reference mark or the like attached to the surface of the circuit board. The mark camera 132 is moved by the head moving device 102 together with the mounting head 21.</p><p> &lt;Work head configuration, attachment / detachment method, etc.&gt; In the present embodiment, the mounting head 21 which is a working head is detachable from the head moving device 102, and can be selected and mounted from a plurality of devices having different configurations from each other. That is, the mounting device 22 can replace the mounting head 21 with a different type. FIG. 5 shows three mounting heads 21a, 21b, and 21c as an example of the work head 21 that can be mounted. To briefly explain each of them, the mounting head 21a shown in FIG. 5A is a mounting head 21 having a plurality (8) mounting units 140 generally forming an axial shape and rotating them by index. Briefly explaining the operation of the mounting head 21a, the mounting unit 140 has a suction nozzle 142 at its lower end as a component holding device for sucking and holding the component. With the mounting head 21a located above the feeder group 18, one of the mounting units 140 is lowered, and the suction nozzle 142 of the mounting unit 140 holds the circuit components supplied at the component supply position of the feeder 16. By letting it take out the circuit component. The mounting units 140 are intermittently rotated, and each mounting unit 142 sequentially takes out circuit components. With each mounting unit 140 holding the circuit components, the mounting head 21a is moved above the circuit board fixedly held by the conveyor unit 20. Above the circuit board, one mounting unit 140 located at the lowered position when the component is taken out is lowered, and the circuit component held by the mounting unit 140 is placed on the surface of the circuit board. The mounting units 140 are intermittently rotated, and the circuit components held by each mounting unit 140 are sequentially mounted on the circuit board. The mounting head 21a is a mounting head 21 that performs such an operation, and is a mounting head 21 suitable for high-speed mounting of relatively small circuit components. Although not shown, some mounting heads 21 having the same type as the mounting head 21a have different numbers of mounting units 140 to be mounted.</p><p> The mounting head 21c shown in FIG. 5 (c) is a mounting head 21 equipped with one mounting unit 140, and the mounting unit 140 is lowered above the feeder 16 and above the circuit board to form the feeder 16 and the circuit board. One circuit component is mounted in one round trip. Although the mounting speed of the mounting head 21c is relatively slow, it can also be equipped with a relatively large suction nozzle 142, and it is possible to mount large circuit parts and specially shaped circuit parts, and the mounting head has excellent versatility. 21. The mounting head 21b shown in FIG. 5B is a mounting head having two mounting units 140, and is a mounting head 21 having moderate characteristics between the mounting head 21a and the mounting head 21c. Of the two mounting units 140, the mounting unit 140 on the front side has a plurality of suction nozzles 142 arranged radially around the axis perpendicular to the axis of the mounting unit 140, and the suction nozzles 142 have a plurality of suction nozzles 142. , The structure is such that the nozzle to be used is selected by being rotated around its axis. The mounting module 12 can be mounted with one arbitrarily selected from the mounting heads 21 and the like described above according to the mode of mounting work. The mounting head 21 mounted in FIGS. 2 and 4 is a mounting head 21a.</p><p> A more detailed configuration of the mounting head 21 will be described with reference to FIG. 6 by taking the mounting head 21a as an example. The mounting head 21a includes a head body 280 that is the frame of the head, various components and components arranged in various parts of the head body 280, and a head cover 282 (see FIG. 5) that covers the components and the like. It is configured to include. FIG. 6 shows the head cover 282 excluding the head cover 282.</p><p> The mounting head 21a includes a plurality of mounting units 140, specifically eight mounting units 140, and each mounting unit 140 holds a suction nozzle 142, which is a circuit component holding device, at its tip. Although not shown, each of the suction nozzles 142 is subjected to negative pressure air, via a positive / negative pressure selective supply device 292 (see FIG. 9). It is connected to a positive pressure air passage, and has a structure in which an electronic component is attracted and held at the tip by a negative pressure, and the held electronic component is released when a slight positive pressure is supplied. The mounting unit 140, which has a generally axial shape, is held on the outer peripheral portion of the unit holder 294, which rotates intermittently, in a state where the axial direction is in the vertical direction at an equal angle pitch. Further, each mounting unit 140 is rotatable and movable in the axial direction. The unit holder 294 is driven by a unit holder rotation device 298 having a holder rotation motor 296 as a drive source, which is an electric motor (servo motor with an encoder), and intermittently rotates by an angle equal to the arrangement angle pitch of the mounting unit 140. The mounting unit 140 is intermittently rotated by being rotated (sometimes called index rotation). In the unit elevating station (the station located at the frontmost position), which is one stop position of the mounting unit 140 in intermittent rotation, the mounting unit 140 located at that station is the unit elevating motor 300, which is an electric motor (servo motor with encoder). It is raised and lowered by the unit raising and lowering device 302 having The operation of taking out the electronic components from the feeder 16 and the operation of the electronic components on the circuit board held by the conveyor unit 20 are performed by the mounting unit 140 located at this elevating station, and the mounting unit 140 is at a predetermined distance at that time. It is lowered. Further, each mounting unit 140 is rotated by a unit rotation device 306 having a unit rotation motor 304 as a drive source, which is an electric motor (servo motor with an encoder), for the purpose of adjusting the mounting orientation of circuit parts that are attracted and held. Be forced to. The plurality of mounting units 140 have a structure that allows them to rotate at the same time. The above is the main configuration of the mounting head 21a.</p><p> The structures of the mounting heads 21b and 21c, which are the other mounting heads 21, are the same, but there are differences in the structures depending on the configuration. Explaining only the difference, the mounting head 21c has a configuration in which only one mounting unit 140 is provided, and does not have the unit holder rotating device 298 provided by the mounting head 21a. Further, since the mounting head 21b has two mounting units 140 and can be raised and lowered independently, the mounting head 21b has two unit raising and lowering devices, and further, in one mounting unit 140, a suction nozzle. A nozzle selection device for selecting 142 is provided.</p><p> As described above, the mounting head 21 is detachably attached to the X slide 128 and attached to the head moving device 102. The mechanism for mounting the mounting head 21 will be described below. FIG. 7 shows a perspective view from the back side of the mounting head 21 (FIG. 7 (a)) and a perspective view from the front side of the X slide 128 (FIG. 7 (b)).</p><p> In the mounting head 21, the back portion 330 of the head body 280 constitutes the mounting portion, and the front portion 332 of the X slide 128 constitutes the mounting portion. The back portion 330 of the head body has two leg portions 334 at the lower portion and an engaging block 336 at the upper portion. On the other hand, the front portion 332 of the X slide 128 has a leg bearing portion 338 that supports the leg portion 334 at the lower portion, and has two lower engaging rollers 340 slightly above the leg bearing portion 338. There is. Further, a head fixing device 342 (see FIG. 4) for hooking and fixing a part of the engaging block 336 is provided on the upper portion of the front portion 332 of the X slide 128, and slightly below the head fixing device 342. Has two upper engaging rollers 344 and is provided with an engaging hole 346 for inserting the engaging block 336. With the mounting head 21 mounted, the back portion 330 of the head body 280 and the front portion 332 of the X slide 128 are designed to fit substantially exactly.</p><p> The leg portion 334 has a wedge-shaped tip and is fitted to the V-shaped leg support portion 338. As a result, the vertical position of the mounting head 21 is defined. Also, the opposing sides of the reduced spacing of the upper part of the leg 334 are designed to engage the outer peripheral surfaces of each of the two lower engaging rollers 340, and both sides of the engaging block 336. Is designed to fit snugly between the two upper engaging rollers 344, which defines the lateral position of the mounting head 21.</p><p> FIG. 8 shows a cross section of the head fixing device 342. FIG. 8 (a) is a cross section cut at the center of the X slide 128 in the left-right direction, and FIG. 8 (b) is a cross section on the AA plane in FIG. 8 (a). The head fixing device 342 has a structure in which the hook pin 362 is engaged with the hook roller 360 (see FIG. 7) provided on the upper part of the engagement block 336. More specifically, the head fixing device 342 includes a hook pin 362 that is vertically movablely supported in a pin hole 364 provided in the upper part of the front portion 332, and a hook pin actuating device 366 that moves the hook pin 362 up and down. It is composed including and. The hook pin actuating device 336 includes a slightly flexible rod 368, a disc-shaped cam plate 370 fixedly provided at one end of the rod 368 in an eccentric state with respect to the rod 368, and a rod. It includes a rod-shaped rod support member 372 that rotatably supports the 368, and a grip 374 that is fixedly provided at the other end of the rod 368 to rotate the rod 368. The hook pin actuator 336 is mounted on the rod support member 372 above the front portion 332 of the X-slide 128 (see Figure 7). A groove 376 having a width slightly larger than the outer diameter of the cam plate 370 is formed on the upper portion of the hook pin 362 so that the cam plate 370 engages with the groove 376. When the grip 374 is rotated, the hook pin 362 operates up and down. The hook pin operating device 366 has a rod support member 372 bent so as to position the grip 374 downward in order to facilitate the operation of the grip 374.</p><p> When mounting the mounting head 21, the grip 374 is rotated in one direction (counterclockwise when viewed from the front in this embodiment), and the hook pin 362 is moved upward, and the back portion 330 of the mounting head 21 is mounted. Is snugly engaged with the front portion of the X slide 128, and in that state, the grip 374 is rotated in the opposite direction (clockwise when viewed from the front in this embodiment). By the operation of the grip 374, the hook pin 362 is lowered, and the inclined surface 378 formed at the lower end portion of the hook pin 362 comes into contact with the outer circumference of the hook roller 360 in front of the lowermost lower end. Further, by rotating the grip 374, the hooking pin 362 hooks the hooking roller 360 in a state where the mounting head 21 is pushed downward and backward by the action of the inclined surface 378. The state is maintained by the frictional force generated between the outer circumference of the cam plate 370 and the lower surface of the groove 376, but in order to make the state maintenance more reliable, the hook pin actuating device 336 is a torsion spring 380. The structure is such that the torsion spring 380 urges the rod 368 in the downward direction of the hook pin 362. To detach the mounting head 21, the grip 374 may be rotated in the opposite direction.</p><p> In the present embodiment, the work module 12 can be equipped with various work heads 21, but all the work heads 21 have the same structure related to the mounting mechanism, and the mounted work heads 21 are mounted. Can be detached with one touch, and any work head 21 can be attached with one touch. Further, the work head 21 can be controlled by the module control device 26 in the mounted state. Therefore, the power supply line, control line, etc. for driving each component of the work head 21 are connected to the head moving device 102, but these wirings can also be connected with one touch by a connector (not shown). Will be. Further, the work head 21 is provided with a memory chip 400 (see FIG. 5) as a unique information recording medium for recording its own unique information, and this memory chip 400 can also be connected to the module control device 26. .. The memory chip 400 is a RAM chip backed up by a battery, and various information can be rewritten. The information recorded on the memory chip 400 and the use of the information will be described later.</p><p> &lt;Specifications of work head, etc.&gt; The mounting head 21 of this embodiment is a miniaturized work head. In particular, the width dimension (the length in the substrate transport direction (the length in the X direction) in the mounted state is called the width of the mounting head 21. X in FIG. 4) is small, and is set to 60 mm or less. Among the three types of mounting heads 21, the mounting head 21a, which is an index rotation type mounting head, is used for mounting relatively small circuit components. In the mounting head 21a, the suction nozzle 142 is arranged so that the center of the suction nozzle 142 is located on one circumference, and the diameter of the circle is 40 mm or less. Further, the width dimension of the X slide 128 on which the mounting head 21 is mounted is also the same as the width dimension of the mounting head 21. In the present embodiment, the mark camera 132, which is a substrate imaging device, is provided not on the mounting head 21 but on the X slide 128, but is provided in a direction perpendicular to the width direction (Y direction, that is, movement of the X slide 128). It is positioned so as to line up with the mounting head 21 in the direction perpendicular to the direction.). This also contributes to reducing the width of the X slide 128. The mounting module 12 of this embodiment has a relatively narrow length, that is, a width in the substrate transport direction, but circuit components can be mounted by reducing the width dimensions of the mounting head 21 and the X slide. The range in the width direction is relatively large.</p><p> Further, even the index rotation type mounting head 21a, which is the heaviest of the three types of mounting heads 21a, 21b, and 21c, is said to weigh about 2 kg. As described above, the fact that the mark camera 132 is separated from the mounting head 21 also contributes to the weight reduction of the mounting head 21. On the other hand, the total weight of the X slide 128 including the mark camera 132 is also about 2 kg. Therefore, in the head moving device 102 which is an XY robot type moving device, the X slide device 114 is an object to be moved. The combined weight of the mounting head 21 and the X slide 128 is 5 kg or less, and the load on the head moving device 102 is relatively small. As a result, the mounting head 21 can be moved at high speed, and the productivity of the mounting module 12 is high. Further, by reducing the weight of the mounting head 21 and the like, the mounting device 22 is realized to have low vibration and energy saving.</p><p> &lt;Control device, etc.&gt; The board work machine 1 is a module control device 26 deployed in each work module 12 to control each work module 12, and a work machine control device that controls each work module 12 in an integrated manner. Although it is controlled by the control module 13 of the above, the central part of the control of the work exists in each module control device 26. FIG. 9 shows a block diagram relating to the control of the module control device 26, focusing on the parts closely related to the present invention.</p><p> The module control device 26 is a control device mainly composed of a computer 410, and the computer 410 has a PU (processing unit) 412, a ROM 414, a RAM 416, an input / output interface 418, and a bus 420 connecting them to each other. Have. Each of the feeders 16, the conveyor unit 20, and the head moving device 102 arranged as the feeder group 18 are connected to the input / output interface 418 via the respective drive circuits 422. Further, the module control device 26 has a head drive circuit 424 for driving the work head 21, and the work head 21 is connected to the input / output interface 418 via the head drive circuit 424. Further, the component camera 24 and the mark camera 132 are connected to the input / output interface 418 via the control circuit 426, and are captured via the image processing unit 428 that performs image processing on the image pickup data obtained by them. .. The operation / display panel 28 and the external storage device 430, which mainly consists of a hard disk, are also connected to the input / output interface 418. Since each of the plurality of work modules 12 of the board-to-board work machine 1 is configured to exchange various signals to perform operations, the input / output interface 418 is connected to the other work modules 12 via the communication circuit 432. Is connected. Further, the control module 13 that plays the role of a host of the module control device 26 is also connected via the communication circuit 432, and signals, information, and the like can be communicated with the control module 13 as well. That is, each work module 12 and the control module 13 are connected to each other by LAN434. The external storage device 430 includes a basic operation program of the work module 12, an application program such as a mounting program corresponding to the circuit board, and a circuit board.</p><p> Explaining the work head 12 in detail, the block diagram of FIG. 9 shows a state in which the mounting head 21a is attached as the work head 12, and the head drive circuit 424 includes a positive / negative pressure selective supply device 292 and a holding body rotation. The motor 296, the unit elevating motor 300, the unit rotation motor 304, etc. will be connected. The actuator, drive source, etc. connected to the head drive circuit 424 differ depending on the type of work head 12 to be mounted. As with the feeder 16, the conveyor unit 20, etc., devices, devices, etc. such as the work head 12 are driven by a driver, which is software for operating them. Dedicated drivers are prepared according to the configuration of devices, devices, etc. The driver of the work head 12 is a work head driver, and there is a dedicated driver for the mounting head 12a. Various drivers are stored in a driver storage unit that is a part of the external storage device 430. For example, when the mounting head 12a is mounted, a dedicated head driver is read and the driver is transferred to the RAM 416. , The operation program corresponding to the mounting head 12a is constructed. Further, the memory chip 400 included in the work head 12 is also connected to the input / output interface 418, and information can be exchanged with the computer 410.</p><p> Although the block diagram is omitted, the control module 13 which is a work equipment control device is mainly composed of a computer including a PU, ROM, RAM, an input / output interface, etc., an external storage device, an input device such as a keyboard, and an output device such as a display. It is a device that includes, etc., has a communication function for exchanging various signals and data with each work module 12, plays a role of centrally managing each work module 12, and is required for the board work machine 1. It also plays a role as a database of various data. Implementation programs and the like for each work module 12 are distributed from this control module 13. Further, as will be described next, the control module 13 also has a function of communicating with the board working machine 1 and the outside.</p><p> FIG. 10 schematically shows how the anti-board working machine 1 is arranged in the factory. In the figure, three anti-board working machines 1 of the same type are arranged. Each board-to-board work machine 1 is connected to each other so that information can be exchanged with each other, and is also connected to various management computers having various database functions (two of 440 and 442 are shown in the figure) so that information can be exchanged with each other. Has been done. These anti-board work machines 1 and management computers 440, 442 and the like are also connected by LAN444. There are various types of management computers, such as those that have a database function related to work programs according to the circuit board, and those that store data related to the specifications of various circuit parts and have a database function for them. The other is a production history management computer 440 having a database function related to the production history of each board work machine 1, and a device device management having a function as a database of information related to devices such as work heads and feeders. Computer 442. From the viewpoint of exchanging the work head 21, these two management computers 440 and 442 store the head-related information, which is the information related to the head of each work head 21, outside the board work machine 1. It functions as a storage unit. The production information of the board-to-board work machine 1 is sent to the production history management computer 440, which includes the work using which work head 21. In addition, the inspection result information of the worked circuit board is also sent to the production history management computer 440, and the defect rate for each work head 21 is managed as one of the production history. The production history management computer 440 and the device device management computer 442 will be described in detail later.</p><p> &lt;Parts mounting work&gt; The parts mounting work by one mounting module 12 to which the mounting head 21a is mounted will be briefly described. The circuit board transferred from the upstream side is stopped by the conveyor unit 20 at a set working position in the work area. The stopped circuit board is fixedly held by the conveyor unit 20 at that position by raising the circuit board support plate 90 by the elevating device. Next, the head moving device 102 moves the mark camera 132 above the reference mark attached to the circuit board to image the reference mark. From the imaged data, the deviation of the holding position of the held circuit board is detected.</p><p> Next, the mounting head 21a is moved above the feeder group 18, and the circuit components are sucked and held by the suction nozzle 142 according to the set take-out order. Specifically, the mounting unit 140 located at the elevating station is positioned above the component take-out position of the feeder 16 that supplies the circuit components to be held, and the mounting unit 140 is lowered at that position. Negative pressure is supplied to the suction nozzle 142 held at the tip to suck and hold the circuit component. Then, the mounting unit 140 is intermittently rotated, and the same component taking-out operation for the next mounting unit 140 is performed. In this way, the component taking-out operation (in many cases, eight times) is sequentially performed on the mounting unit 140 included in the mounting head 21a.</p><p> Next, the mounting head 21a holding the circuit component is moved above the component camera 24. At that position, the component camera 24 captures the held circuit component within one field of view. From the obtained imaging data, the deviation of the holding position of each circuit component is detected. Subsequently, the mounting head 21a is moved to the upper part of the circuit board, and the circuit components held on the surface of the circuit board are placed according to the set mounting order. Specifically, first, the mounting unit 140 located at the unit elevating station is positioned above the proper mounting position. At this time, the moving position of the mounting head 26 is optimized based on the detected holding position deviation amount of the circuit board and the holding position deviation amount of the circuit components. At that position, the mounting unit 140 is lowered by a predetermined distance, positive pressure is supplied to the suction nozzle 142, and the held circuit component is placed on the surface of the circuit board. Subsequently, the mounting unit 140 is intermittently rotated, and the same mounting operation for the next mounting unit 140 is performed. In this way, the component mounting operation is sequentially performed on the mounting unit 140 that holds the circuit components. Prior to the lowering of the mounting unit 140 in the mounting operation of each mounting unit 140, the mounting orientation set for the circuit component to be held by the mounting unit 140 and the detected circuit board holding position deviation amount. Based on the amount of deviation in the holding position of the circuit component, the circuit component is rotated to an appropriate rotation position, whereby the mounting orientation of the circuit component is optimized.</p><p> The mounting head 21a is reciprocated between the feeder group 18 and the circuit board until the mounting of all the planned circuit components is completed, and the component taking-out operation and the component mounting operation are repeated. After the mounting of all the circuit components is completed, the support plate 90 of the conveyor unit is lowered by the elevating device, and the fixed holding of the circuit board is released. The circuit board is transferred to the downstream side by the conveyor unit 20. In this way, the component mounting work scheduled for the circuit board by the mounting module 12 is completed.</p><p> In the component mounting machine 1 in which a plurality of such mounting modules 12 are arranged, the component mounting work by all the arranged mounting modules 12 is completed, and the component mounting by the component mounting machine 1 on one circuit board is completed. In this way, in the component mounting machine 1, the circuit boards are sequentially conveyed from the upstream side to the downstream side over each of the plurality of mounting modules 12, and the mounting specified for each of the plurality of mounting modules 12 is carried out sequentially. Parts are mounted by executing the work. Then, by carrying a plurality of circuit boards into the mounting module 12 on the upstream side one after another, the circuit boards are mounted on each circuit board one after another, and the circuit boards that have been mounted from the mounting module 12 on the downstream side are mounted one after another. Will be carried out to. For loading and unloading the circuit board to the component mounting machine 1, a loading machine and a unloading machine mainly composed of a conveyor device are arranged beside the mounting modules 12 on the most upstream side and the most downstream side, respectively. You can do it by them.</p><p> &lt;Preparatory process associated with mounting the work head&gt; As described above, the work module 12 has a work head 21 that can be replaced. When the work head 21 is newly attached, the work module 12 prepares for using the work head 21. Hereinafter, the preparatory processing associated with the mounting of the work head 21 will be described by taking the case where the mounting head 21a is mounted as an example.</p><p> The preparatory work accompanying the mounting is performed by the module control device 26 of the work module 12 to which the work head 21 is mounted. Specifically, the head use preparation processing program stored in the ROM 414 of the module control device 26 is the computer 410. It is done by being executed by. FIG. 11 shows a flowchart of the head use preparation processing program. To explain the preparatory process according to this flowchart, when the mounting head 21a is mounted, the mounting head 21a is first recognized in step 1 (hereinafter, abbreviated as S1; the same applies to other steps). Specifically, what kind of configuration is the mounting head 21a by recognizing head-related information such as head configuration specification information regarding the configuration specifications of the mounting head 21a and head status information regarding the status? , What kind of state is recognized. Next, in S2, the suitability of using the mounting head 21a is determined based on the recognized head-related information. If it is determined that it is inappropriate to use, the operator is notified to that effect and the preparatory process is terminated. If it is determined to be appropriate, in S3, a work head driver suitable for the mounting head 21a is selected, and the mounting head 21a is made operable. Subsequently, in S4, the index rotation of the mounting unit 140 is adjusted based on the recognized head specification information. Then, in S5, a predetermined suction nozzle 142 is attached to the tip of each mounting unit 140. After mounting the suction nozzle 142, calibration is performed in S6. To put it plainly, the calibration is a process for adjusting and determining the position of the mounting head 21a in the working operation, specifically, the position command value in order to deal with the mounting error of the mounting head 21a. The head use preparation process is performed according to the flow described above. The details of each process will be described below for each process.</p><p> i) Head-related information recognition The head-related information recognition process of S1 is performed according to the head-related information recognition processing routine shown in the flowchart in FIG. First, in S11, the head storage information stored in the memory chip 400 provided in the mounting head 21a is read out. That is, this step is a unique information reading step. The head storage information is unique information about the mounting head 21a. Specifically, in addition to the head ID data indicating the ID of the head, the head format data indicating the type of the head, and each mounting unit 140 possessed by the head. Arrangement angle pitch data (hereinafter, may be referred to as "unit arrangement angle data"), height data with respect to the reference position of the suction nozzle mounting portion of each mounting unit 140 (hereinafter, referred to as "unit height data"). It contains data related to the constituent specifications such as). The unit arrangement angle data and the unit height data are a kind of information regarding the arrangement positions of the components included in the mounting head 21a.</p><p> Next, in S12, the data related to the mounting head 12a is read from the device device management computer 442 described above based on the head ID data read in S11. Equipment The device management computer stores various information about various equipment, devices, etc. existing in the factory as a database. The read head ID data is transmitted to the device device management computer 442 via the control module 13. The device device management computer 442 searches for the head ID as a key, and transmits necessary information regarding the mounting head 21a to the module control device 26 via the control module 13. In this way, the necessary information is read out. The information acquired from the device device management computer 442 includes unit arrangement angle data, unit height data, and the like, which are head configuration specification information. In addition, the device device management computer 442 also stores information related to maintenance of various devices and devices in association with the head ID. Specifically, it includes data on the date and time when the last maintenance was performed, data on the operating time of the device and device from the last maintenance (hereinafter, may be referred to as post-maintenance operating time), and the like. In S12, the post-maintenance operating time information for the mounted mounting head 12a is read out as one of the head status information.</p><p> Next, in S13, the data related to the mounting head 12a is read from the production history management computer 440 described above based on the head ID data read in S11. The production history management computer 440 stores the production history information of various anti-board working machines existing in the factory as a database. This production history information also includes data on the defective rate. In S13, the module control device 26 transmits the head ID data and the module ID data of the mounting module 12 to which the mounting head 21a is mounted to the production history management computer 440 via the control module 13. The production control computer 440 uses the head ID as a key from the information stored in the production control computer 440, and refers to the defect rate of the mounting head 21a for a period retroactively from the present (hereinafter, referred to as "predetermined period defect rate"). (May be), and using the head ID and module ID as keys, data on the module predetermined period defect rate, which is the predetermined period defect rate when mounted on the mounting module 12, is created. Then, the production history computer 440 transmits the predetermined period defect rate data and the module predetermined period defect rate data for the created mounting head 21a to the module control device 26 via the control module 13. In S13, in this way, the predetermined period defect rate information and the module predetermined period defect rate information, which are a kind of head status information, are read out.</p><p> In the following S14, among the information read in S11 and S12, the information regarding the head configuration specifications is recognized. Specifically, first, the unit arrangement angle data and unit height data stored in the memory chip 400 are compared with those data stored in the device device management computer 442, and both are matched. It is confirmed that it is. This is a measure to worry that the data is not updated when adjustments, maintenance, etc. are performed while the mounting head 12a is not mounted, and if it is inconsistent, , The data of the device device management computer 442 is rewritten by the data stored in the memory chip 400. The confirmed unit arrangement angle data, unit height data, etc. are stored in the head configuration specification information storage unit, which is a predetermined area of the RAM 416, together with the head format data, etc., thereby ending the recognition of the head configuration specification information. To do. Subsequently, among the information read in S11 to S13, the information related to the head status is recognized. Specifically, the post-maintenance operating time data read in S12, the predetermined period defect rate data read in S13, and the module predetermined period defect rate data are the head status information storage which is a predetermined area of the RAM416. It is memorized in the department. This ends the recognition of the head status information.</p><p> ii) Head suitability determination The head suitability determination process of S2 is performed by executing the head suitability determination processing routine shown in the flowchart in FIG. First, in S21, a determination based on the head type is performed. In the module control device 26, the mounting program related to the component mounting work performed by the mounting module 12 is already stored in the mounting program storage unit which is a predetermined area of the RAM 416. In S21, by comparing the stored head format data with the contents of the mounting program, it is determined whether or not the mounted mounting head 21a is in a format suitable for executing this mounting program. .. If it is determined that the format is suitable, the next S22 is executed. In S22, the mounting head 21a is determined based on the operating time after maintenance. Specifically, if the stored post-maintenance operating time exceeds the predetermined usage limit time, it is judged that maintenance is necessary and it is inappropriate to stop using the mounting head 21a. It is determined that there is. If it is within the usage limit time, it is judged to be suitable to allow the use.</p><p> If it is determined in S22 that the use is permitted, then in S23, a determination is made based on the defective rate for a predetermined period. Specifically, when the stored defect rate for a predetermined period exceeds the limit defect rate set for the circuit board to be mounted, it is determined to be unsuitable. If it is determined to be suitable in S22, a determination is made in S24 based on the defect rate for a predetermined period for the module. This determination can be said to determine the compatibility between the work module 12 and the work head 21. As in the case of S23, when the stored defect rate for a predetermined period of time exceeds the limit defect rate set for the circuit board used for mounting, it is determined to be unsuitable. Here, the determination of S23 and S24 is determined based on the limit defect rate set for the circuit board on which the mounting work is performed, and the value is a value peculiar to the circuit board. For example, when highly accurate work is required, the critical defect rate is set low. This critical defect rate is described in a part of the mounting program and is read from the mounting program data.</p><p> If it is determined that it is suitable in S24, the following S3 is executed, but if it is determined that it is not suitable in any of S21 to S24, the mounting head is executed in S25. The operator is notified that 21a is inappropriate. Specifically, the notification is made by displaying on the operation / display panel 28 that it is inappropriate and its cause. After the notification is made, the execution of the head use preparation processing program ends. Based on the notification, the operator can take measures such as removing the mounting head 12a, preparing a new mounting head 12, and mounting the mounting head 12.</p><p> iii) Driver selection, index rotation adjustment and nozzle installation In S3, the driver is selected. As described above, the external storage device 430 stores various drivers corresponding to the various work heads 21, and in S3, the type of the mounted mounting head 12a, which was recognized earlier. Based on the data, the driver corresponding to the format is selected, it is transferred to RAM416 and stored in the driver storage, and the operation program corresponding to the mounting head 12a is placed in the operation program area which is a predetermined area of RAM416. It will be built. This makes it possible to control the operation of the mounting head 12a.</p><p> After the driver is selected, adjustments are made to the index rotation of mounting unit 140 in S4. First, one mounting unit 140, which is preset as a reference unit, is positioned at the design elevating station position. The rotation stop position of the unit holder 294 in this state is the stop position for positioning the reference unit at the elevating station. Next, the unit holder 294 is rotated based on the recognized unit arrangement angle data, and the other mounting units 140 are sequentially positioned at the elevating station. The rotation stop position of the unit holder 294 is detected when each mounting unit 140 is located at the elevating station, and this rotation stop position is stored in the holder rotation stop position storage unit which is a predetermined area of the RAM 416. When each mounting unit 140 is positioned at the elevating station, the unit holder 294 is operated so as to stop the rotation at the stored rotation stop position. This adjustment is a measure to prevent the manufacturing error that occurs for each mounting head 21 from affecting the accuracy in the mounting work, and adjusts the operating position of the mounting head 21a based on the head configuration specification information. Is one of. Further, it can be said that this index rotation position adjustment is also a kind of calibration process.</p><p> In the next S5, the suction nozzle 142 is attached to each mounting unit 140 of the mounting head 12a. The nozzle to be used is described in a part of the mounting program, and the suction nozzle 142 to be mounted is determined according to the description content. After this determination, the mounting head 21a is moved above the nozzle stocker 25 described above, and the mounting unit 140 is sequentially lowered while rotating the index, so that the suction nozzle 142 is housed in the preset storage position. Is held and attached to the specified mounting unit 140. The suction nozzle 142 is also managed by ID, and in this S5, which suction nozzle 142 is mounted on each mounting unit 140, that is, in the mounting nozzle information storage unit where the nozzle ID data is a predetermined area of RAM416. It will be remembered. In connection with this, the length data (described later) of each of the attached suction nozzles 142 is also stored.</p><p> iv) Calibration S6 is calibrated by executing the calibration processing routine shown in the flowchart shown in FIG. First, in S61, the position of the tip of the suction nozzle 142 attached to the reference unit, which is one of the mounting units 140, is detected. As for the nozzle tip position, the mounting head 21a can be moved to a position where the reference unit is located above the nozzle height detector 27 while the reference unit is located at the elevating station. At this position, the reference unit is slowly lowered. The upper surface of the nozzle height detector 27 is the reference height position in the mounting module 12, and the detector 27 has a structure for detecting that the suction nozzle 142 has come into contact with the upper surface. The reference unit is lowered until the tip of the suction nozzle 142 is located at the reference height position, and the descending stroke from the rising end of the reference unit is measured. That is, in this step, the descending stroke of the reference unit is substituted as the detection value of the nozzle tip position.</p><p> Next, in S62, the head height position, which is the height position where the mounting head 21a is mounted, is calculated. FIG. 15 shows a conceptual diagram for calculating the head height position. The above-mentioned reference height position is H₀The mounting height position of the mounting head 21a in the design is H.₁It is shown by. As described above, the unit height data of each mounting unit 140 is already stored in the RAM 416. The unit height data is based on the design mounting height position H of the mounting head 21a.₁Virtual reference nozzle (nozzle length l)₀: The nozzle length is the length from the suction nozzle mounting part of the mounting unit to the nozzle tip), and the tip of the reference nozzle is at the reference height position H.₀It is stored as the descending stroke L of the mounting unit 140 when it is located at. As shown in Fig. 15 (a), in the case of the reference unit, L₁Is. Further, the actual nozzle length l of the suction nozzle 142 attached is already stored in the RAM 416 as described above, and the length of the suction nozzle 142 attached to the reference unit is l.₁Is. As shown in FIG. 15 (b), when the mounting head 21a is mounted at the design mounting height position, the descending stroke of the reference unit measured is L.₁'= L₁-(l₁-l₀) Should be. However, the actually measured descending stroke is L₁If, it can be seen that the mounting height position of the mounting head 21a deviates from the design position. According to FIG. 15 (b), the actual mounting height position of the mounting head 21a is H.₂And ΔH = H₂-H₁= L₁-L₁It can be seen that there is a mounting error of'. In S62, the height position of the mounted head is calculated by calculating the mounting error ΔH. The calculated mounting error ΔH is stored in the head mounting height error storage unit, which is a predetermined area of the RAM 416.</p><p> In the subsequent S63, the elevating position of each mounting unit 140 is adjusted. Unit height data L of each mounting unit 140 already stored₁~ L₈(Subscripts 1 to 8 indicate the number of the mounting unit, the same shall apply hereinafter) and the nozzle length l of the suction nozzle 142 attached to each.₁~ l₈Then, based on the mounting error ΔH calculated earlier, the command position for the subsequent raising and lowering of each mounting unit 140 is determined.</p><p> Next, in S64, the rotation center of each mounting unit 140 is measured from the image data taken by the component camera 24. It is expected that the suction nozzle 142 is not coaxial with the rotation center of the mounting unit 140 due to bending or the like. Therefore, as conceptually shown in FIG. 16, the tip position N1 of the suction nozzle 142 at the reference rotation position of the mounting unit 140 and the mounting unit 140 are 180 from the reference rotation position, which are obtained as a result of imaging. The rotation center R of the mounting unit 140 can be obtained from the tip position N2 of the suction nozzle 142 at the rotated position. Specifically, the midpoint of the line segment connecting N1 and N2 is recognized as the rotation center R. In S64, first, in order to fit all of the mounting unit 140 within one field of view of the component camera 24, the mounting head is located at the position where the center of the index rotation of the design mounting unit 140 is located on the optical axis of the component camera 24. Move 21a. At that position, the mounting unit 140 located at the elevating station is rotated, and its rotation center R is measured by the method described above. While the position of the mounting head 21a is fixed, the mounting units 140 are sequentially index-rotated, and the rotation center of each mounting unit 140 is measured. At this time, the elevating position of each mounting unit 140 at the time of imaging is adjusted so that the height of the tip of the suction nozzle 142 of each mounting unit 140 is adjusted to the lowest position, and imaging is performed. It is said. Incidentally, the component camera 24 is arranged so that the height of the tip of the suction nozzle 142 at this time is near the deepest position within the depth of field range of the component camera 24.</p><p> Next, in S65, the position of the mounted mounting head 21a in the horizontal plane is calculated based on the measurement result of the rotation center R obtained in S64. Specifically, the center of index rotation of the mounting unit 140 is calculated. FIG. 17 shows a conceptual diagram for explaining the calculation of index rotation. As explained earlier, the unit arrangement angle data θ₁~ θ₈Is already stored, and each data θ of its arrangement₁~ θ₈Based on, it is possible to expand the measured rotation center R on one plane. R shown in FIG.₁~ R₈Is the rotation center of each mounting unit 140 deployed on one plane, and these rotation centers R₁~ R₈Therefore, the index rotation center O'is approximately calculated by geometric calculation. Next, the calculated position of the index rotation center O'is compared with the position of the index rotation center O when the mounting head 21a is mounted at the design position. In FIG. 17, the deviation is ΔX in the left-right direction and ΔY in the front-rear direction. The mounting error (ΔX, ΔY), which is the amount of deviation, is stored in the index rotation center position error storage unit of the RAM 416.</p><p> If the index rotation center O'is calculated, the rotation center of each mounting unit 140 based on the center O'can be calculated. Deviation of the actual rotation center of each mounting unit 140 from its calculated rotation center (Δx₁, Δy₁) ~ (Δx₈, Δy₈) Is required. As will be described later, this deviation is also used to adjust the moving position of the mounting head 21a.</p><p> Next, in S66, as in S64, another rotation center of each mounting unit 140 is measured by imaging the component camera 24. The rotation center measured by this S66 is a rotation center obtained based on the data captured by making the height position of the tip of the suction nozzle 142 different from that in S64. In S64, the suction nozzle 142 is positioned near the deepest part within the depth of field range of the component camera 24 for imaging, but in S66, the suction nozzle 142 is positioned near the shallowest portion for imaging. That is, the image is taken at a position where the tip position of the suction nozzle 142 is lower than the previous position. Since the specific measurement method is the same as in the case of S64, the description is omitted, but the rotation center of each mounting unit 140 having a different elevating position can be obtained by the two measurements. As a result, the deviation (Δx) ahead of each mounting unit 140₁, Δy₁) ~ (Δx₈, Δy₈), And another deviation (Δx) in different elevating positions.₁', Δy₁') ~ (Δx₈', Δy₈') Is required.</p><p> In S67, based on the error (ΔX, ΔY) of the index rotation center of the mounting unit 140 and the above two deviations (Δx, Δy), (Δx', Δy') of each mounting unit 140 (subscripts are omitted). The moving position of the mounting head 21a is adjusted. Specifically, the deviations at each of the different elevating positions have already been obtained, and in combination with the deviations obtained here, the inclination of each mounting unit 140 can be estimated from those deviations. That is, even when each mounting unit 140 is moved up and down to an arbitrary elevating position, the deviation from the theoretical position of the rotation center at the elevating position can be estimated by a geometric method. Then, by taking into account the mounting error (ΔX, ΔY), which is the amount of deviation of the index rotation center position, the mounting head 21a can be moved to an accurate moving position according to the elevating position of the mounting unit 140, and the mounting work can be performed. Can be performed accurately. The two deviations (Δx, Δy), (Δx', Δy') of each mounting unit 140 are stored in the unit deviation storage unit, which is a predetermined area of the RAM 416, and the subsequent movement position command of the mounting head 21a is based on them. The value is determined.</p><p> &lt;Functional Block of Module Control Device&gt; In the present embodiment, the preparatory process associated with the mounting of the work head 21 is performed by executing the head use preparatory process program in the module control device 26 as described above. .. The configuration of the module control device 26 regarding this process will be described from the functional aspect. FIG. 18 shows a functional block diagram of the module control device 26. In addition, in order to correspond to the above description, the following description will be given assuming that the mounting head 21a is mounted.</p><p> The module control device 26 mainly has four processing units for head use preparation processing. One of them is the head-related information recognition unit 500, and the head-related information recognition unit 500 is configured to include a portion that performs the head-related information recognition process of S1. Unique information provided in the mounting head 21a The head-related information is recognized based on the information possessed by the memory chip 400 as a recording medium, that is, the unique information of the mounting head 21a as the head storage information. The head-related information recognition unit 500 includes a configuration specification information recognition unit 502 and a status information recognition unit 504. The configuration specification information recognition unit 502 is a portion that recognizes head configuration specification information such as head format data, unit arrangement angle data, and unit height data, and corresponds to a portion that executes the S12, S14, and the like. Further, the status information recognition unit 504 is a part that recognizes head status information such as post-maintenance operating time data, predetermined period defect rate data, and module predetermined period defect rate data, and executes the S12, S13, S15, and the like. The part corresponds. In the recognition of head-related information, necessary information is acquired from the information possessed by the device device management computer 440 and the production history management computer 442 as the head-related information external storage unit, and as a result, the head-related information is obtained. It will be recognized. A head configuration specification information storage unit 508 and a head status information storage unit 510 for storing such information are provided in the head-related information area of the RAM 416 corresponding to the head-related information recognition unit 500.</p><p> The module control device 26 has a head suitability determination unit 512 as one of the other four processing units. The head suitability determination unit 512 is a portion for determining whether or not the mounted mounting head 21a is suitable for use, and corresponds to a portion for executing S2. Based on the recognition result of the head-related information recognition unit 500, the suitability of using the mounting head 21a is determined. The head suitability determination unit 512 can be roughly divided into two. One is the part that makes a judgment based on the head format data that is the head configuration specification information and the contents of the mounting program stored in the mounting program storage unit 514 of the RAM 416, and the other is the head. This is the part that makes a judgment based on the status information such as post-maintenance operating time data, predetermined period defect rate data, and module predetermined period defect rate data.</p><p> The module control device 26 has a head corresponding unit 516 as another of the four processing units. To put it plainly, the head-corresponding portion 516 is a part that performs preparatory processing for making the mounting head 21a controllable in response to the mounted mounting head 21a, and the head-corresponding processing depends on the mounting head 21a. This is performed by storing the work head driver in the driver storage unit 520 provided in the operation program area 518 of the RAM 416. The head corresponding portion 516 corresponds to the portion that executes the S3 or the like.</p><p> The module control device 26 further has a position information acquisition unit 522 as one of the four processing units. The position information acquisition unit 522 is a part that acquires component position information, which is position information related to the work operation of the component of the mounting head 21a, based on the recognized head component specification information, and is a so-called calibration or the like. Is the part to do. The position information acquisition unit 522 corresponds to a portion that executes S4, S6, etc. in the above-mentioned head use preparation process. Configured based on nozzle length data, previously recognized unit placement angle data, unit height data, etc. for the mounted suction nozzle 142 stored in the mounting nozzle information storage unit 524 of RAM416. Element position information is acquired. At that time, the measurement results such as the image pickup result by the component camera 24 and the detection result by the nozzle tip height detector 27 are used at any time. In the head use preparation process, the component position information includes the holding body rotation stop position with respect to the index rotation of each mounting unit 140, the head mounting height error ΔH of the mounting head 21a, and the index rotation center position error (ΔX, ΔY). , Data such as unit deviation (Δx, Δy) of each mounting unit 140 is acquired as component position information. These acquired data are stored in the holder rotation stop position storage unit 528, the head mounting height error storage unit 530, the index rotation center position error storage unit 532, and the unit deviation memory provided in the component position information area 526 of the RAM 416. It is stored in each unit 534 and the like, and is used in the operation control of the mounting head 21a.</p>

1: Board-to-board work machine (parts mounting machine) 12: Work module (mounting module) 21: Work head (mounting head) 21a, 21b, 21c: Mounting head 22: Board-to-board work equipment (mounting equipment) 24: Parts camera 26 : Module control device 27: Nozzle height detector 28: Operation / display panel 102: Head movement device 112: Y slide device (Y direction movement device) 114: X slide device (X direction movement device) 128: X slide (work) Head mounting member) 132: Mark camera (board imaging device) 140: Mounting unit 142: Suction nozzle 294: Unit holder 298: Unit holder Rotating motor 302: Unit lifting device 306: Unit rotation device 330: Rear part (head) (Main body) 332: Front (of X slide) 334: Leg 336: Engagement block 338: Leg support 340: Lower engagement roller 342: Head fixing device 344: Upper engagement roller 360: Hook roller 362 : Hook pin 366: Hook pin actuator 400: Memory chip 410: Computer 416: RAM 424: Head drive circuit 440: Production history management computer (head-related information external storage unit) 442: Device device management computer (head-related information external storage unit) 500: Head-related information recognition unit 502: Configuration specification information recognition Part 504: Status information recognition part 506: Head-related information external storage part 512: Head suitability judgment part 516: Head correspondence part 520: Driver storage part 522: Position information acquisition part 526: Component position information area