Thermocouple
Abstract
Problem to be solved.To provide a thermoelectric thermometer capable of extending a wire arranged in a ceramic member in the longitudinal direction with respect to the elongation in the longitudinal direction of the ceramic member. A thermoelectric thermometer has a support tube configured to accommodate a pair of wires made of different metals. A pair of wires for a thermoelectric thermometer are connected to a connection adjacent to one end of a support tube. The thermoelectric thermometer further comprises a cap attached to the other end of the support tube, the cap accommodating the free ends of the pair of wires. The cap allows the pair of wires to move freely through the cap to accommodate the difference in thermal expansion and contraction of the pair of wires relative to the thermal expansion and contraction of the support tube. [Selection diagram] Fig. 4
Term
1.6 yearsto projected expiry
Projected expiry 16 May 2028, counted from filing; an application has no term until it is granted.
- Priority
- Filed
- Published
- Today
- Projected expiry
16 claims: 6 independent, 10 dependent
- 1第1の端部、第2の端部、及び長手方向軸を有する支持チューブであって、前記支持チューブは、前記第1の端部と前記第2の端部との間に伸びる一対の孔を備える支持チューブと、 前記支持チューブの少なくとも一部の周囲に配置される覆いと、 前記孔の一方の中に配置される第1のワイヤと、 前記孔の他方の中に配置される第2のワイヤであって、前記第2のワイヤは前記第1のワイヤと異なる金属で形成される第2のワイヤと、 前記第1のワイヤの端部と前記第2のワイヤの端部との間に形成される接続部であって、前記接続部は前記支持チューブの前記第1の端部に隣接して配置される接続部と、 前記支持チューブの前記第2の端部に動作可能に取り付けられるキャップであって、前記キャップは、前記支持チューブの前記第2の端部を収容するための第1の孔と、前記第1のワイヤ及び前記第2のワイヤが伸びる第2の孔とを有し、前記キャップはさらに、前記第1の孔と前記第2の孔との間に形成されるウェブを備え、前記ウェブは、前記第1のワイヤを収容するための第1のアパーチャと、前記第2のワイヤを収容するための第2のアパーチャとを備え、前記アパーチャは、前記第1のワイヤ及び前記第2のワイヤが、前記第1のワイヤ及び前記第2のワイヤの熱伸縮に応じて前記アパーチャを通して自由にスライドできる大きさである、キャップと、を備える熱電温度計。
- 2前記キャップから伸びる前記第1のワイヤ及び前記第2のワイヤの一部から形成されるループをさらに備える、請求項1に記載の熱電温度計。
- 3前記ループの一部の周りにバンドを適用して、前記ループの所定の曲率半径を維持する、請求項2に記載の熱電温度計。
- 4前記ループは約5mmの曲率半径を有する、請求項2に記載の熱電温度計。
- 5前記ループは約12mmの曲率半径を有する、請求項2記に載の熱電温度計。
- 6前記ループは約2mm~約25mmの曲率半径を有する、請求項2に記載の熱電温度計。
- 7前記ループは約2mm~12mmの間の曲率半径を有する、請求項2に記載の熱電温度計。
- 8前記ループは、前記第1のワイヤ及び前記第2のワイヤが熱膨張する場合に増加し、前記第1のワイヤ及び前記第2のワイヤが熱収縮する場合に減少する曲率半径を有する、請求項2に記載の熱電温度計。
- 9前記キャップは前記支持チューブに対して実質的に固定される、請求項1に記載の熱電温度計。
- 10前記ウェブを貫通して形成された前記第1のアパーチャ及び前記第2のアパーチャは所定の直径を有し、前記直径は前記第1のアパーチャ及び前記第2のアパーチャを通過する前記第1のワイヤ及び前記第2のワイヤのそれぞれの直径より大きい、請求項1に記載の熱電温度計。
- 11支持チューブを貫通して伸びる一対の孔を有する支持チューブと、 異なる金属から形成される一対のワイヤであって、前記ワイヤの各々は、前記支持チューブの前記孔の異なる1つの中に配置される、一対のワイヤと、 キャップを貫通して形成される一対のアパーチャを有するキャップであって、前記アパーチャの各々は前記一対のワイヤの1つを収容し、前記キャップは前記支持チューブに固定して取り付けられ、前記アパーチャは、前記ワイヤの熱伸縮の間、前記ワイヤが前記一対のアパーチャを通して自由にスライドできる大きさであり、前記一対のワイヤをそれらの間で離間状態に維持する、キャップと、を備える、熱電温度計。
- 12前記キャップを貫通して形成される前記一対のアパーチャが離間しており、これにより前記一対のワイヤを離間状態に維持する、請求項11に記載の熱電温度計。
- 13前記一対のワイヤが、前記キャップに形成された前記アパーチャを出る場合に露出され、前記一対のワイヤが前記キャップに形成された前記一対のアパーチャを出る場合に、保護チューブが、前記露出された一対のワイヤの一部を包む、請求項11に記載の熱電温度計。
- 14一対のワイヤを収容するための熱電温度計の支持チューブに接続可能なキャップであって、前記キャップは、 第1の端部及び第2の端部を有する胴部と、 前記第1の端部から前記胴部に伸びる第1の孔であって、前記支持チューブは前記第1の孔に収容可能である、第1の孔と、 前記第2の端部から前記胴部に伸びる第2の孔と、 前記第1の孔及び前記第2の孔を分離するウェブと、 前記ウェブを貫通して形成される第1のアパーチャであって、前記ワイヤの一方が前記第1のアパーチャに収容可能である、第1のアパーチャと、 前記ウェブを貫通して形成される第2のアパーチャであって、前記ワイヤの他方が前記第2のアパーチャに収容可能であり、前記第2のアパーチャが前記第1のアパーチャから離間して、前記ワイヤを離間状態に維持する、第2のアパーチャと、を備え、 前記アパーチャは、前記ワイヤの熱伸縮の結果として前記ワイヤが伸縮する場合、前記ワイヤが前記アパーチャを通して自由に移動できる大きさである、キャップ。
- 15基板を処理するための化学蒸着リアクタのための温度制御システムであって、前記温度制御システムは、 前記基板に隣接して配置される複数の温度センサと、 前記複数の温度センサの各々から温度データを受信する制御装置と、 前記基板に放射エネルギーを与えるための前記基板に隣接して配置される少なくとも1つの加熱素子と、 前記複数の温度センサの少なくとも1つによって与えられる温度データに応じて、前記少なくとも1つの加熱素子を選択的に調整する前記制御装置と、を備え、 前記複数の温度センサの少なくとも1つは熱電温度計であり、前記熱電温度計は、 異なる金属から形成される一対のワイヤと、 支持チューブを貫通して形成される2つの孔を有する支持チューブであって、前記孔の一方は前記ワイヤの一方を収容し、前記孔の他方は前記ワイヤの他方を収容する、支持チューブと、 前記支持チューブの端部に取り付けられるキャップであって、前記キャップは前記支持チューブから伸びる前記ワイヤを収容し、前記キャップは前記ワイヤを離間状態に維持し、また前記キャップは、前記ワイヤを離間状態に維持している間、前記ワイヤが前記支持チューブに対して自由に熱伸縮することを可能にする、キャップと、を備える、温度制御システム。
- 16支持チューブの中に形成される一対の孔を有する支持チューブであって、前記支持チューブは所定の熱膨張率を有する、支持チューブと、 異なる金属から形成される一対のワイヤであって、前記ワイヤは前記支持チューブ内に離間状態に配置され、前記一対のワイヤの各々は、前記支持チューブの前記熱膨張率と異なる熱膨張率を有し、それにより前記支持チューブ及び前記ワイヤが加熱又は冷却される場合、前記支持チューブに対して前記ワイヤが自由に熱伸縮する、一対のワイヤとを備える、熱電温度計。
Independent claims16
34 paragraphs, as filed
(Related application) This patent application claims the benefit of the filing date under 35 U.SC § 119 (e) for US Provisional Patent Application No. 60 / 940,012 filed May 24, 2007, and disclosure of that application. Incorporated herein by reference to the content.
(Field of invention) The present invention relates to a temperature sensor, more specifically a temperature sensor configured to improve the accuracy of temperature control in a semiconductor processing apparatus.
High temperature semiconductor processing chambers are used to deposit various material layers on a substrate surface or multiple substrate surfaces. One or more substrates or workpieces, such as silicon wafers, are placed on a workpiece support in the processing chamber. Both the substrate and the workpiece support are heated to the desired temperature. In a typical processing step, the reaction gas is passed over each heating substrate, which causes CVD (chemical vapor deposition) to deposit a thin layer of reaction material in the reaction gas on the substrate surface. Through subsequent processes, these layers are machined into integrated circuits and tens to thousands or even millions of integrated devices, depending on substrate size and circuit complexity.
The parameters of the various processes must be carefully controlled to ensure a high quality final sedimentary layer. One such important parameter is the substrate temperature at each process stage. For example, during CVD, the deposited gas reacts at a particular temperature to deposit a thin layer on the substrate. If the temperature changes significantly over the substrate surface, the deposition layer may become non-uniform, creating unusable areas on the final substrate surface. Therefore, it is important that the substrate temperature is stable and uniform at the desired temperature before the reaction gas is introduced into the processing chamber.
Similarly, non-uniform or unstable temperatures across the substrate during other heat treatments can affect the uniformity of the final structure on the surface of the substrate. Other processes in which temperature control may be important include, but are not limited to, oxidation, nitriding, dopant diffusion, sputter deposition, photolithography, dry etching, plasma treatment, and high temperature annealing.
Methods and systems for measuring temperatures at various locations in close proximity and directly adjacent to the substrate being processed are known. Typically, thermoelectric thermometers are placed at various locations close to the substrate being processed, and these thermoelectric thermometers operate on the controller to help provide a more uniform temperature across the substrate surface. Can be connected. For example, Patent Document 1 published by Van Bilsen generally teaches multiple temperature sensors that measure temperature at various points around a substrate, near the front edge, near the rear edge, side edge, and substrate of the substrate. It is equipped with a thermoelectric thermometer located at the bottom of the substrate near the center.
However, it has been found that thermoelectric thermometers used for temperature measurement in high temperature processing chambers fail due to particle slip of wires used in thermoelectric thermometers. Thermoelectric thermometers typically include an elongated ceramic member with holes in the longitudinal axis therein. A pair of wires extends to the length of the hole, in which one end of the wire is fused together and placed adjacent to a substrate for temperature measurement purposes, the opposite end of the wire being connected to a controller. ing. Typically, the end of the wire opposite the temperature measurement end is bent out of the hole in the ceramic member or crimped and substantially fixed to a cover surrounding the ceramic member. When the deposition treatment step is performed, the treatment reactor is heated, which heats the ceramic members and wires of the thermoelectric thermometer. When heated, the wire stretches longitudinally at a different rate than ceramic, which creates stress in the longitudinal direction of the wire. Since both ends of the wire are substantially fixed, after repeated heating and cooling, longitudinal stress in the wire causes particle slip inside the wire, leading to failure of the thermoelectric thermometer.
<p><patcit num="1"><text>U.S. Pat. No. 6,121,061</text></patcit></p>
<p> Therefore, it is necessary to design a thermoelectric thermometer that allows the wire arranged in the ceramic member to extend further in the longitudinal direction with respect to the longitudinal extension of the ceramic member.</p>
<p> A temperature-sensing thermoelectric thermometer that matches the difference in the amount of thermal expansion of the support member with respect to the wires housed inside is required. One aspect of the present invention is to provide a thermoelectric thermometer. The thermoelectric thermometer comprises a support tube having a pair of holes extending through the support tube. Thermoelectric thermometers also include a pair of wires made of dissimilar metals. Each of the wires is placed in a different hole in the support tube. The thermoelectric thermometer further comprises a cap having a pair of apertures formed through the cap, each of which houses one of the wires. The cap is attached to the support tube so that the aperture aligns with the hole, and the aperture is sized to allow the wire to slide freely through the aperture during thermal expansion and contraction of the wire.</p><p> In another aspect of the invention, a cap is provided that connects to the support tube of the thermoelectric thermometer. The thermoelectric thermometer comprises a support tube having a pair of wires of dissimilar metals extending along the length of the support tube. The cap comprises a body having a first end and a second end. A first hole extends from the first end into the body and a second hole extends from the second end into the body. The first hole is configured to accommodate the support tube. The web separates the first and second holes. A first aperture and a second aperture are formed through the web, and each aperture is configured to accommodate one of the wires. The first aperture and the second aperture are separated by a predetermined distance so as to keep the wires separated from each other. The aperture is sized so that it can move freely through the aperture if the wire expands or contracts as a result of thermal expansion and contraction of the wire.</p><p> The advantages of the present invention will be further apparent to those skilled in the art by the description of the embodiments of the invention described below, set forth by way of illustration. It will be appreciated that the present invention allows for other and different embodiments, the details of which can be modified in various respects. Therefore, the figures and detailed description are taken as examples and are not limiting.</p>
<figref num="1">It is sectional drawing of an exemplary chemical vapor deposition deposition reactor.</figref><figref num="2">It is the schematic of the candidate position of a temperature sensor and a temperature control system.</figref><figref num="3">It is an embodiment of a thermoelectric thermometer.</figref><figref num="4">It is an enlarged exploded view of the thermoelectric thermometer of FIG.</figref><figref num="5">It is an enlarged view of the contact point of a wire forming a thermoelectric thermometer.</figref><figref num="6">It is a side view of the embodiment of a support tube.</figref><figref num="7">It is an end view of the support tube of FIG.</figref><figref num="8">It is a partial sectional view of the side surface of the cover embodiment for a thermoelectric thermometer.</figref><figref num="9">It is an enlarged sectional view of the thermoelectric thermometer of FIG.</figref><figref num="10">An enlarged cross-sectional view of an embodiment of a cap for a thermoelectric thermometer, FIG. 10A is a side view of the embodiment of the cap, FIG. 10B is another side view of the cap of FIG. 10A, and FIG. 10C is FIG. 10A. 10D is a cross-sectional view of the cap of FIG. 10A, FIG. 10D is an end view of the cap of FIG. 10A, and FIG. 10E is an end view of the opposite side of the cap shown in FIG. 10D.</figref><figref num="11">It is an enlarged sectional view of a part of the thermoelectric thermometer of FIG.</figref><figref num="12">It is an enlarged sectional view of a part of the thermoelectric thermometer of FIG.</figref><figref num="13">It is an enlarged sectional view of a part of the thermoelectric thermometer of FIG.</figref><figref num="14">It is an enlarged sectional view of a part of the thermoelectric thermometer of FIG.</figref>
An exemplary embodiment of a chemical vapor deposition (CVD) reactor 10 is shown with reference to FIG. The illustrated embodiment is a single substrate, horizontal flow, cold water wall type reactor, and the thermoelectric thermometer techniques described herein require other types of semiconductor processing reactors and accurate temperature sensors. Those skilled in the art will understand that it can be used in other devices. The reactor 10 includes a reaction chamber 12 that defines the reaction space 14, a heating element 16 located on the opposite side of the reaction chamber 12, and a substrate support mechanism 18. The reaction chamber 12 is an elongated member having an inflow port 20 for allowing the reaction gas to flow into the reaction space 14 and an outlet 22 for discharging the reaction gas and process by-products from the reaction space 14. In one embodiment, the reaction chamber 12 is made of clear quartz. Those skilled in the art will appreciate that the reaction chamber 12 may be formed from any other material that does not substantially react to the deposition process within it.
As shown in FIG. 1, the heating element 16 forms an upper bank and a lower bank. The heating elements 16 are arranged so as to be separated from the adjacent heating elements 16 in the same bank. In one embodiment, the heating element 16 in the upper bank is arranged so as to be substantially perpendicular to the heating element 16 in the lower bank. The heating element 16 imparts radiant energy to the reaction chamber 12 without being largely absorbed by the walls of the reaction chamber 12. The heating element 16 is configured to provide radiant heat of a wavelength absorbed by the substrate being processed and a part of the substrate support mechanism 18. In one embodiment, the plurality of spot lamps 26 concentrate heat on the underside of the wafer support mechanism 18 to weaken the heat sink effect due to the cold support structure extending upward through the bottom wall of the reaction chamber 12. ..
As shown in FIG. 1, the board support mechanism 18 includes a board holder 28 on which the board 24 is placed and a support member 30. The support member 30 is connected to a shaft 32 that extends downward through a tube 34 that descends from the lower wall of the reaction chamber 12. A motor (not shown) is configured to rotate the shaft 32, thereby rotating the substrate holder 28 and the substrate 24 in the same way during the deposition process.
As shown in FIGS. 1 and 2, a plurality of temperature sensors are arranged adjacent to the substrate 24 and the substrate holder 28 in order to measure the temperature at various positions near the substrate 24. In the illustrated embodiment, the temperature sensors are a central temperature sensor 36, a front end temperature sensor 38, a rear end temperature sensor 40 and at least one side end temperature sensor 42 arranged adjacent to the lower surface of the substrate holder 28. including. The front end temperature sensor 38 and the rear end temperature sensor 40 are arranged in the reaction space 14 adjacent to the front end portion and the rear end portion of the substrate 24 with respect to the flow A direction of the reaction gas. The temperature sensor is configured to measure temperature in a specific area immediately around the chip. The temperature control system 45 for the chemical vapor deposition reactor 10 comprises a plurality of temperature sensors 36,38,40,42 arranged adjacent to the substrate 24 during processing, which temperature sensors are as shown in FIG. It is operably connected to the temperature control device 44 and gives the temperature data at a specific position to the control device 44. The control device 44 is operably connected to at least one heating element 16 arranged adjacent to the substrate 24. The temperature controller 44 is configured to selectively adjust the energy emitted from the heating elements 16 and 26 in response to the data provided by the temperature sensor, effectively distributing the temperature distribution throughout the substrate 24 being processed. Maintain uniform. Those skilled in the art will appreciate that the temperature control system 45 may be equipped with a required number of temperature sensors located at different positions to provide data to the control device 44.
In one embodiment, at least one of the temperature sensors 36, 38, 40, 42 is a thermoelectric thermometer 46 as illustrated in FIGS. 3-14. Other temperature sensors 36,38,40,42 shall consist of an optical thermometer, a thermoelectric thermometer, or any other temperature detector capable of withstanding the conditions in the reaction chamber, or a combination thereof. Any person skilled in the art can understand what can be done. In one embodiment, as shown in FIGS. 3-4, the thermoelectric thermometer 46 has a cover 48, a support tube 50, a collar 51, a first wire 52, a second wire 54, a spring 56, a holder 58, and Equipped with plug 60. In one embodiment, the support tube 50 is an elongated member that is substantially cylindrical and has a longitudinal axis B, as illustrated in FIG. 6-7. In another embodiment, the cross-sectional shape of the support tube 50 is square. In yet another embodiment, the cross-sectional shape of the support tube 50 is elliptical. Those skilled in the art can understand that the cross-sectional shape of the support tube 50 may be formed as any shape. The support tube 50 may be made of ceramic or any kind of material sufficient to withstand periodic temperature changes and the temperature range to which the thermoelectric thermometer 46 is exposed. It will be appreciated by those skilled in the art that the thermoelectric thermometer 46 illustrated is substantially linear and may be configured in any shape sufficient to allow the thermoelectric thermometer 46's measuring tip 68 to be placed in the desired position. I can understand if.
As shown in FIG. 6, the support tube 50 of the thermoelectric thermometer 46 includes a first end 62 and a second end 64 on the opposite side. In one embodiment, the support tube 50 comprises a pair of holes 66 that extend longitudinally from the first end 62 to the second end 64, as shown in the end view of FIG. In another embodiment, the support tube 50 comprises more than two holes 66 extending at least some distance between the first end 62 and the second end 64 of the support tube 50. Any number of holes or holes formed in the support tube 50 either in the longitudinal direction of the ceramic member or at any other angle with respect to the longitudinal axis. It can be understood by those skilled in the art that it may be provided. One of the holes 66 accommodates the first wire 52 and the other accommodates the second wire 54. The holes 66 are spaced apart to separate the first wire 52 and the second wire 54 to avoid short circuits. The hole 66 has a size for accommodating the first wire 52 and the second wire 54 in the hole 66, and provides a small gap between the outer surface of the wires 52 and 54 and the inner surface of the hole 66. In one embodiment, each hole 66 has a diameter of about 0.16 inches (about 4.1 mm). In another embodiment, each hole 66 has a diameter of about 0.14 inches (about 3.6 mm). The hole 66 can have any diameter sufficient to accommodate the first wire 52 and the second wire 54, while the wires 52, 54 extend radially and longitudinally as a result of thermal expansion. A gap is provided between the wire and the surface of the corresponding hole so that it can be used.
The support tube 50 is at least partially located within the protective cover 48, as shown in FIGS. 4 and 8. In one embodiment, the cover 48 is made of a clear quartz material. The clear quartz material allows substantially all of the radiant energy emitted from the heating element 16 and the spot lamp 26 to pass through the material without significantly increasing the temperature of the cover 48. .. In one embodiment, the cover 48 has the same general cross-sectional shape as the support tube 50 placed therein, but with a small gap between the inner surface of the cover 48 and the outer surface of the support tube 50. , Slightly larger. The cover 48 is provided with a measuring tip 68 at one end thereof and an opening 70 at the opposite end. In another embodiment, the cover 48 may be coated with silicon nitride (SiN) or another surface to extend the life of the cover during chemical vapor deposition (CVD) treatment in the reaction chamber 12. Treatment may be applied. In yet another embodiment, a cap (not shown), such as a silicon carbide (SiC) cap, covers the measuring tip so that more sufficient heat transfer occurs between the ambient environment and the wires 52,54. It is given to 68.
As shown in FIGS. 3 and 8, the measuring tip 68 is located at the end of the cover 48. When the thermoelectric thermometer 46 is used as the central temperature sensor 36 (FIG. 1), the measuring chip 68 is placed in direct contact with the underside of the substrate holder 28. At this position, the measuring chip 68 of the thermoelectric thermometer 46 is configured to measure the temperature of the substrate holder 28 that is in direct contact with it. At the end of the cover 48, within the measuring tip 68, the first wire 52 and the second wire 54 extend beyond the first end 62 of the support tube 50, as shown in FIG. The exposed ends of the first wire 52 and the second wire 54 are fused together to form beads of the connection 72, thereby providing an electrical connection between the first wire 52 and the second wire 54. Will be done. In one embodiment, the first wire 52 and the second wire 54 are melted together to form a connection 72. In another embodiment, the first wire 52 and the second wire 54 are fused together by solder joining. Those skilled in the art will appreciate that the first wire 52 and the second wire 54 may be fused together in any manner sufficient to electrically connect their ends. The free ends of the wires 52, 54 on the opposite side of the connection 72 extend from the second end 64 of the support tube 50. The wires 52, 54 are formed from dissimilar metals to form a thermoelectric thermometer between them. In one embodiment, the first wire 52 is made of platinum and the second wire 54 is made of a platinum alloy containing 13% rhodium. Those skilled in the art will appreciate that the wires 52, 54 may be formed from any dissimilar metal sufficient to form a thermoelectric thermometer between them. In one embodiment, the wires 52,54 have a diameter of about 0.10 inches (2.5 mm). In one embodiment, the wires 52,54 have a diameter of about 0.14 inches (3. 6mm). Those skilled in the art will appreciate that the wires may be of any diameter sufficient to withstand the periodic temperature changes during the CVD process and the temperature range in which the thermoelectric thermometer 46 is exposed. Those skilled in the art will appreciate that the diameters of the first wire 52 and the second wire 54 do not have to be the same.
As shown in FIG. 10, the first wire 52 and the second wire 54 extend from the connection 72 through the separating holes 66 formed in the support tube 50 and are holed in the second end 64 of the support tube 50. Get out of 66. The second end 64 of the support tube 50 extends outward beyond the opening 70 of the cover 48. As shown in FIG. 4, the collar 51 is operably connected to the outer surface of the support tube 50 at a distance from the second end 64 of the support tube 50. In one embodiment, the collar 51 is formed separately from the support tube 50 and may later be fixed and attached to the support tube 50. In another embodiment, the support tube 50 and the collar 51 can be formed of a single member. The collar 51 has a contact surface on which one end of the spring 56 is held.
The retainer 58 is arranged within the opening 70 of the cover 48, as shown in FIGS. 4 and 9. The holder 58 includes a ring 74, a body portion 76, and an aperture 78 that penetrates the ring 74 and the body portion 76 in the longitudinal direction. The retainer 58 is located adjacent to the end of the cover 48 and is configured to house the support tube 50 within the aperture 78. In one embodiment, the retainer 58 is secured within the opening 70 of the cover 48 by a tight fit or friction fit. Those skilled in the art will appreciate that the retainer 58 can be secured to the cover 48 by any other means capable of maintaining a substantially fixed state to the cover 48. The retainer 58 forms an outlet from the cover 48 through the narrowed diameter, thereby holding the support tube 50 away from the inner surface of the cover 48. The support tube 50 is arranged in the aperture 78 of the holder 58 so that it can move freely in the aperture 78 in a direction substantially parallel to its longitudinal axis B.
Referring to FIG. 4, the spring 56 is located around the outer surface of the support tube 50 between the collar 51 and the holder 58. The spring 56 provides a spring force or urging force to the collar 51 so as to cover the support tube 50 and urge the collar 51 in the direction of the measuring tip 68 of the 48. In one embodiment, the spring 56 is configured to keep the connection 72 formed by the first wire 52 and the second wire 54 in contact with the measuring tip 68 of the cover 48. If the connection 72 moves away from the measuring chip 68, the measurement temperature will be less accurate because the connection 72 will be farther away from the position being measured. Therefore, the spring 56 can be configured to contact the measuring tip 68 to urge the connecting portion 72, whereby the connecting portion 72 is in contact with or immediately adjacent to the inner surface of the measuring tip 68. Make sure it is placed.
As shown in FIGS. 4 and 9-10, the second end 64 of the support tube 50 penetrates the retainer 58 and extends beyond the cover 48. In the illustrated embodiment, the cap 100 is substantially fixed to the support tube 50 so that it does not rotate and is operably attached to the second end 64 of the support tube 50. In one embodiment, the cap 100 is made of Delrin® plastic. In another embodiment, the cap 100 is made of polyetheretherketone (PEEK). In another embodiment, the cap 100 is made of polyetherimide (PEI). Due to the high temperature equipment, PEEK and PEI give greater durability. Those skilled in the art will appreciate that the cap 100 may be formed of any material sufficient to withstand a large temperature range and resist twisting motion against the cover 48.
In one embodiment, as shown in FIGS. 10A-10E, the cap 100 is an elongated, integral cylindrical member having a body 101, a first end 102 and a second end 104. In another embodiment, the body 101 of the cap 100 has a square cross-sectional shape. Those skilled in the art will understand that the body 101 of the cap 100 may have any cross-sectional shape. At the first end 102, a first hole 106 is formed in the body 101. The first hole 106 extends from the first end 102 along at least a portion of the longitudinal length of the body 101. In one embodiment, the first hole 106 is circular. The first hole 106 is configured to accommodate the second end of the support tube 50. Therefore, the shape of the first hole 106 is substantially the same size and shape as the outer surface of the support tube 50. The second hole 108 is formed in the second end 104 of the body 101. In one embodiment, the second hole 108 extends from the second end 104 along at least a portion of the longitudinal length of the cap 100. The cross-sectional shape of the second hole 108 is circular, oval, square, or any other as long as the first wire 52 and the second wire 54 can cover them as they exit the support tube 50. It may be in the shape of. In one embodiment, the cross-sectional shape of the second hole 108 is the same as that of the first hole 106. In another embodiment, the cross-sectional shape of the second hole 108 is different from that of the first hole 106.
In one embodiment, the first hole 106 and the second hole 108 extend at substantially the same distance from the first end 102 and the second end 104 of the cap 100, respectively, as shown in FIG. 10C. ing. The lengths of the first hole 106 and the second hole 108 may be the same, the first hole 106 may be longer than the second hole 108, or the second hole may be longer than the first hole 106. Those skilled in the art can understand that it is good. In one embodiment, the size and shape of the first hole 106 and the second hole 108 are substantially the same so that either hole can accommodate the second end 64 of the support tube 50. Ensures that the cap 100 is correctly assembled to the thermoelectric thermometer 46. In another embodiment, the size and shape of the first hole 106 and the second hole 108 are such that the first hole 106 is the only hole that can accommodate the second end 64 of the support tube 50. It's different.
As shown in FIG. 10C, the first hole 106 and the second hole 108 are separated by a web 110. The web 110 forms the base of both holes 106,108 in the cap 100. Since the surface of the web 110 at the base of the first hole 106 can have substantially the same shape as the end face of the second end 64 of the support tube 50, the end face of the second end 64 is the web 110. Placed adjacent to the corresponding surface of. The first aperture 112 and the second aperture 114 are formed through the web 110. The first aperture 112 is configured to accommodate the first wire 52 extending from the second end 64 of the support tube 50, and the second aperture 114 is similarly configured from the second end 64 of the support tube 50. It is configured to accommodate a second wire 54 that extends. In one embodiment, the diameters of the first aperture 112 and the second aperture 114 are substantially the same as the diameter of the hole 66 of the support tube 50. In another embodiment, the diameters of the first aperture 112 and the second aperture 114 are slightly larger than the diameter of the corresponding hole 66 of the support tube 50. The gap between the inner surface of the aperture 112,114 and the wires 52,54 housed therein allows the wires 52,54 to expand and contract in the radial direction, as well as to move longitudinally within the aperture 112,114 by thermal expansion and contraction. To. In one embodiment, the first aperture 112 and the second aperture 114 have a diameter of about 0.10 inch (about 2.5 mm) or more. In another embodiment, the first aperture 112 and the second aperture 114 have a diameter of about 0.14 inches (about 3.6 mm) or more. In yet another embodiment, the first aperture 112 and the second aperture 114 have a diameter of about 0.16 inches (about 4.1 mm). The diameter of the apertures 112,114 is such that the diameters of the wires 52,54 are housed therein so that the diameters of the wires 52, 54 can freely expand and contract or move radially within the aperture according to thermal expansion and contraction. Those skilled in the art should understand that it should be slightly larger than the diameter of 54. In one embodiment, the diameter of the first aperture 112 is substantially the same as the diameter of the second aperture 114. In another embodiment, the diameter of the first aperture 112 is different from the diameter of the second aperture 114.
As shown in FIG. 10, when the first aperture 112 and the second aperture 114 are aligned with the holes 66 of the support tube 50 during assembly, the first wire 52 and the second wire 54 of the support tube 50 It extends from the second end 64 and penetrates the web 110 of the cap 100 in a substantially straight line. Supporting Chu a part of the wire 52, 54 extending from the second end of the probe 50 is drawn through the web 110, the second end 64 of the support tube 50 in contact with the corresponding surface of the web 110, whereby Securely position the support tube 50 within the cap 100. During assembly, there shall be no gap between the second end 64 of the support tube 50 and the web 110 of the cap 100. By aligning the apertures 112, 114 of the web 110 with the holes 66 of the support tube 50, the possibility of shear stress due to the mismatch of the cap 100 with respect to the support tube 50 can be greatly reduced or eliminated. In addition, the precisely aligned cap 100 keeps the wires 52,54 apart, which ensures that the possibility of short circuits when the wires 52,54 come into contact with each other is eliminated. Since the wires 52, 54 extend through the apertures 112, 114 in the holes 66 of the support tube 50 and the web 110 of the cap 100, they remain separated and exposed without a protective cover. The separated holes and apertures keep the separated and separated wires 52,54 safe.
As shown in FIG. 10, in one embodiment, the first wire 52 and the second wire 54 extending from the support tube 50 through the apertures 112, 114 in the cap 100 are covered with a Teflon® tube 116 and the wires are It contacts each other and further prevents short circuits. The second hole 108 formed in the cap 100 is sized to accommodate both the first wire 52 and the second wire 54 having a Teflon® tube 116 that encloses each wire. Since each of the wires 52, 54 is inserted into the tube 116, the end of each tube 116 is located in the second hole 108 of the cap 100. In one embodiment, the ends of both tubes 116 covering the wires 52, 54 are in contact with the web 110 before the thermoelectric thermometer 46 is attached to the appliance. In another embodiment, the ends of both tubes 116 are slightly separated from the web 110 to prevent the first wire 52 and the second wire 54 from extending during assembly. The tube 116 covers each wire 52,54 between the cap 100 and the plug 60, to which the wire 52,54 is attached. In the embodiments shown in FIGS. 10A and 10E, the second hole 108 has an elliptical shape, so that the opening of the second hole 108 is of the tube 116 surrounding the first wire 52 and the second wire 54. Large enough to accommodate the pair, the wires 52,54 prevent them from twisting together as they exit the web 110.
Figures 9-14 show an exemplary assembly process for assembling the thermoelectric thermometer 46. FIGS. 9 to 10 show a support tube 50 inserted into the first hole 106 of the cap 100, in which the first aperture 112 and the second aperture 114 penetrating the web 110 of the cap 100 are the support tubes. Aligned with the holes 66 of 50, the wires 52, 54 maintain a substantially linear arrangement and separation. Wires 52, 54 extending from the first aperture 112 and the second aperture 114 within the cap 100 are covered with a Teflon® tube 116. FIG. 11 shows the covered wires 52, 54 forming a loop 118 extending from the second hole 108 of the cap 100. In one embodiment, the radius of curvature of the loop 118 is about 12 mm. In one embodiment, the radius of curvature of the loop 118 is about 2 mm to 25 mm. In another embodiment, the radius of curvature of the loop 118 is from about 2 mm to about 12 mm. Further in the embodiment, the radius of curvature of the loop 118 is about 5 mm. The loop 118 formed by the first wire 52 and the second wire 54 is in the corresponding hole 66 of the support tube 50 without causing tension or pressure in the first wire 52 and the second wire 54. It will be appreciated by those skilled in the art that the first wire 52 and the second wire 54 may have any radius of curvature sufficient to allow them to move freely in the longitudinal direction.
In one embodiment, the first shrink sleeve 119 is placed around the support tube 50 as shown in FIGS. 9-11. If the support tube 50 is inserted into the first hole 106 of the cap 100 and is properly aligned, the first shrink sleeve 119 is placed adjacent to the first end 102 of the cap 100. FIG. 12 shows an embodiment in which a second shrink sleeve 120 is placed around the first end 102 of the cap 100 and the first shrink sleeve 119. The first shrink sleeve 119 increases the diameter around the support tube 50 in the area adjacent to the first end 102 of the cap 100, the second shrink sleeve 120 and the first shrink sleeve 119 and the cap 100. The connection between and is stronger. The second shrink sleeve 120 is applied to maintain alignment between the hole 66 in the support tube 50 and the first and second aperture 114 in the web 110 of the cap 100. The second shrink sleeve 120 is also configured to prevent the cap 100 from rotating with respect to the support tube 50. In another embodiment, the cap 100 is provided with an alignment detent (not shown) and the support tube 50 is provided with an alignment protrusion (not shown), which protrusion is the cap 100 relative to the support tube 50. It is accepted by this alignment detent so that it can be firmly positioned to prevent rotation. In yet another embodiment, the second end 64 of the support tube 50 is flattened (rather than a circle) and the first hole 106 in the cap has a corresponding cross-sectional area, whereby the cap 100 It prevents rotation with respect to the support tube 50. As shown in FIG. 13, after the second shrink sleeve 120 is connected, the protective sleeve 122 is placed around the cap 100 and the support tube 50. FIG. 14 shows a state in which the band 124 is operably connected around the protective sleeve 122 and a part of the loop 118 is fixed to the protective sleeve 122. Band 124 has a predetermined radius of curvature of loop 118 A part of loop 118 is fixed to maintain it. The assembled thermoelectric thermometer 46 is then incorporated into a device or instrument that requires a temperature sensor.
During operation, the measuring chip 68 of the cover 48 is arranged at a position where temperature measurement is required. As the ambient temperature of the thermoelectric thermometer increases or decreases, the support tube 50 and the wires 52, 54 expand and contract, especially along the longitudinal axis B of the support tube 50. In one embodiment, the coefficient of thermal expansion of the wires 52,54 is substantially different from the coefficient of thermal expansion of the support tube 50, and the amount of thermal expansion of the longitudinal wires 52,54 is the heat of the support tube 50 in the same direction. Greater than expansion. In another embodiment, the coefficient of thermal expansion of the wires 52, 54 is similar to the coefficient of thermal expansion of the support tube 50. In a further embodiment, the coefficient of thermal expansion of the wires 52, 54 is substantially the same as the coefficient of thermal expansion of the support tube 50. When the support tube 50 expands in the longitudinal direction, the cap 100 attached to the second end 64 of the support tube 50 moves in the same manner. The cap 100 does not prevent the support tube 50 from freely expanding and contracting along the longitudinal axis B, unless the second end 64 of the support tube 50 is secured against the cover 48. Eliminate any longitudinal load that would occur. The cap 100 also maintains the alignment of the wires 52, 54 exiting the support tube 50, so that the wires 52, 54 are held apart to prevent short circuits.
If the wires 52,54 extend and contract in the longitudinal direction greater than the support tube 50, the wires 52,54 slide or move freely through the corresponding apertures 112, 114 of the cap 100. Apertures 112,114 allow the wires 52,54 to expand and contract freely with respect to the support tube 50, so that if the free end of the wire is wrapped or substantially fixed to the support tube 50. Reduce or eliminate tension or pressure on wires 52,54 that would otherwise result. The wires 52,54 move freely through the aperture 112, 114 without the large resistance of the aperture itself, such as the resistance that would occur if the aperture 112, 114 slips or fits around the wire 52, 54. Apertures 112,114 should be sized to create a small gap between the inner surface of the aperture and the outer surface of the corresponding wire. When the wire 52,54 expands and contracts through the corresponding aperture 112,114, the Teflon tube 116 remains substantially fixed to the wire 52,54, so that when the wire 52,54 extends, it is inside the cap 100. Will expose some of the wires 52 and 54. Since the distance between the apertures 112, 114 formed through the web 110 of the cap 100 is sufficiently large, the wires 52, 54 thermally expand in the longitudinal direction as a result of their temperature increase. Those skilled in the art will appreciate that if some of them are exposed, they will be kept sufficiently separated so that the exposed parts of the wires 52, 54 do not come into contact with each other and cause a short circuit. Further, the loop 118 expands and contracts in response to the thermal expansion and contraction of the wires 52 and 54 due to the thermal expansion and contraction. Therefore, the radius of curvature of the loop 118 should be sufficient to allow the wires 52,54 to expand and contract freely without any additional axial load on them. Wire 52,
As discussed above, the coefficient of thermal expansion of the support tube 50 may differ from the coefficient of thermal expansion of the wires 52,54. In addition, the support tube 50 dissipates energy to the surrounding environment through the outer and end faces of the support tube, while the energy dissipated from the wires 52, 54 is transferred to the support tube 50. It should be noted that the support tube 50 expands at a different rate due to the temperature difference between the first wire 52 and the second wire 54. While the temperature changes dynamically within the reaction chamber 12, the support tube 50 is subjected to differences in thermal conductivity and specific heat, as well as the rate at which energy dissipates between the support tube 50 and the wires 52,54. It will generally have a different temperature than the wires 52,54 housed inside. Therefore, the improved thermoelectric thermometer 42 is additional to the wires 52, 54 when they expand and contract with respect to the support tube 50, as the wires 52, 54 can be thermally expanded and contracted independently of the support tube 50. No pressure or tension is applied.
Although preferred embodiments of the present invention have been described, it should be understood that the present invention is not so limited and can be modified without departing from the present invention. The scope of the present invention is defined by the appended claims, and all devices, processes and methods appearing in the meaning of the claims are herein by either literally or equivalents. Intended to be included in.
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| JP2014067766A | Cited by | Japan | Search report |
| JP2013036977A | Cited by | Japan | Examiner |
| US11049742B2 | Cited by | United States of America | Applicant |
| US10418293B2 | Cited by | United States of America | Applicant |
| KR20170138003A | Cited by | Republic of Korea | Search report |
| JP2007078433A | Cites | Japan | Search report |
| US4749416A | Cites | United States of America | Search report |
| JPH0979914A | Cites | Japan | Search report |
| JPH10170347A | Cites | Japan | Search report |
| JPH11258061A | Cites | Japan | Search report |
14 members in 8 offices
Priority claims9
| Document | Office | Kind | Date |
|---|---|---|---|
| 60940012 | United States of America | – | |
| 94001207 | United States of America | P | |
| 94001207 | United States of America | P | |
| 2008063919 | United States of America | W | |
| 2008063919 | United States of America | W | |
| 2007940012 | – | – | – |
| 2008063919 | – | – | – |
| US20070940012P | – | – | – |
| WO2008US63919 | – | – | – |
Members14
| Document | Office | Kind | |
|---|---|---|---|
| US2008289574A1 | United States of America | A1 | |
| WO2008147731A1 | World Intellectual Property Organization (WIPO) | A1 | |
| TW200907310A | Taiwan Province of China | A | |
| EP2156155A1 | European Patent Office (EPO) | A1 | |
| CN101663569A | China | A | |
| JP2010528291AThis record | Japan | A | |
| US7874726B2 | United States of America | B2 | |
| EP2156155B1 | European Patent Office (EPO) | B1 | |
| AT498119T | Austria | T | |
| ATE498119T1 | Austria | T1 | |
| DE602008004911D1 | Germany | D1 | |
| CN101663569B | China | B | |
| JP5255054B2 | Japan | B2 | |
| TWI439680B | Taiwan Province of China | B |
18 legal events, as the office reported them to INPADOC
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Numbers
- Publication
- 2010528291
- Publication, DOCDB
- 2010528291
- Publication, EPODOC
- JP2010528291
- Application
- 2010509478
- Application, DOCDB
- 2010509478
- Application, EPODOC
- JP20100509478
Titles2
- Japanese
- 熱電温度計
- English
- Thermoelectric thermometer
Classification
- CPC, 3
- G01K1/08
- G01K7/02
- G01K7/04
- IPC, 4
- G01K7 02
- C23C16 46
- C23C16 52
- H01L21 31
Designated states4
- Regional, 4
- Zimbabwe
- Turkmenistan
- Türkiye
- Togo