Cooling plate, baking apparatus and substrate treatment apparatus

The present invention relates to an apparatus used for manufacturing integrated circuits, and more particularly to a baking apparatus for heating or cooling a substrate.

Recently, the importance of the photolithography process for realizing a pattern on a substrate is increasing due to the fact that semiconductor elements are highly integrated, the chip unit area is narrowed, and the circuit line width is reduced. ..

The photolithography process comprises a coating process, an exposure process, a developing process, and a baking process. The baking step among these steps is a step of heating or cooling the substrate to a constant temperature, and is carried out before or after each of the coating step, the exposure step, and the developing step. The baking step comprises a heating step of raising the temperature of the substrate using a heating plate and a cooling step of lowering the temperature of the substrate using a cooling plate, and the cooling step is generally carried out after the progress of the heating step.

The baking apparatus that carries out the cooling process has a cooling plate that cools the substrate. The substrate is seated on the cooling plate by lift pins. When the substrate is cooled, the substrate curves upwardly convexly on the cooling plate. First, when the substrate heated by the heating plate is placed on the cooling plate, the temperature of the air existing in the space between the cooling plate and the substrate is high. However, as the cooling process progresses, the temperature of the air in the space decreases. As a result, the air in the space is compressed, and the pressure in the space becomes vacuum or lower than the outside of the space. Therefore, after the cooling process is complete, a large force must be applied to the substrate when it is picked up by the lift pin, which damages the substrate.

Further, when the lift pin is lowered when the substrate is seated on the cooling plate (or heating plate), the air remaining in the space between the substrate and the cooling plate is moved to the outside of the space. However, when the substrate is close to the cooling plate, the distance between passages through which the air remaining in the space can escape to the outside of the space becomes smaller. Therefore, the substrate may deviate from its position due to the pressure of the air in the space because the air in the space cannot sufficiently escape to the outside. The position of the substrate is displaced by air pressure. This problem becomes even more pronounced as the size of the substrate increases. For example, the above-mentioned problem can be solved by reducing the lowering speed of the lift pin, but in this case, there arises a problem that the time required for the process increases.

<p> A technical object of the present invention is to provide a baking apparatus capable of effectively performing a baking process.</p><p> Another technical subject of the present invention is to provide a cooling plate and a baking apparatus having a structure capable of preventing the pressure in the space between the cooling plate and the substrate from becoming a vacuum or a low pressure during the baking process. To provide.</p><p> Yet another technical subject of the present invention is to provide a substrate processing apparatus having a structure capable of seating the substrate in a normal position on the plate when the substrate is loaded onto the plate using a lift pin. There is.</p>

<p> The present invention for achieving the above-mentioned technical problems provides a baking device used for manufacturing integrated circuits. The baking apparatus includes a plate on which the substrate is placed, and a temperature control member provided on the plate for heating or cooling the substrate mounted on the plate. On the upper surface of the plate, when the substrate is placed on the plate, a guide passage for guiding the outside air is formed in the space formed between the substrate and the plate. The temperature control member may include a cooling member that cools the substrate.</p><p> The baking device is provided with a lift pin configured to seat the board on the plate by vertical movement or to pick up the board from the plate, and inside the plate is a pinhole provided as a passage for the lift pin. It is formed. The lift pin is a support surface that supports the bottom edge of the substrate and a guide surface that faces the side portion of the substrate mounted on the support surface so that the substrate mounted on the lift pin does not move in the lateral direction. And have.</p><p> According to one example, the upper surface of the plate has a central region on which the substrate is placed and an edge region surrounding the central region. Pinholes are formed at the boundary between the central region and the marginal region. The guide passage includes a guide groove connected to a pinhole to form a central region.</p><p> According to another example, the plate has a central region on which the substrate is placed and an edge region surrounding the central region, and a guide passage is formed from the central region to the edge region. Including grooves.</p><p> According to yet another example, the plate has a central region on which the substrate is placed and an edge region surrounding the central region, and the guide passage extends from the central region to the outer wall of the plate. Includes guide grooves.</p><p> According to yet another example, the upper surface of the plate has a central region on which the substrate is placed and an edge region surrounding the central region, and pinholes are formed between the central region and the edge region. Formed at the boundary, the guide passage includes a through hole formed in the central region of the plate and penetrating up and down.</p><p> The guide passage may further include a guide groove connected to a through hole on the upper surface of the plate.</p><p> The present invention further provides a plate for cooling the substrate. When the substrate is cooled by the cooling plate, in order to prevent the pressure in the space from becoming lower than the outside due to the compression of the air in the space existing between the substrate and the cooling plate, the outside of the space A guide groove is formed on the upper surface of the cooling plate, which is connected to the cooling plate and guides the air outside the space to the area inside the space.</p><p> The present invention further provides an apparatus for processing a substrate. This device is configured to mount a substrate and lift pins that are moved up and down through pinholes formed in the plate to seat the substrate on the plate or to pick up the substrate from the plate. And, including. The plate is formed with a guide passage that guides the air in the space between the plate and the substrate to the outside of the space when the substrate is moved downward by the lift pin. This guide passage is provided on the upper surface of the plate and includes a guide groove extending from the central region of the plate to the outer wall.</p>

<p> According to the present invention, when the substrate is cooled by the baking device, the pressure in the space between the substrate and the cooling plate can be maintained the same as the external pressure. As a result, when the substrate is unloaded from the cooling plate by the lift pin, it is possible to prevent the substrate from being damaged by the lift pin.</p><p> Further, according to the present invention, when the substrate is loaded onto the plate using the lift pin, it is possible to prevent the position of the substrate from being displaced by the air pressure under the substrate when the substrate is lowered.</p>

The advantages and features of the present invention and the methods for achieving them will be clarified by referring to the embodiments described in detail later together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but is embodied in various different forms, and the present embodiment is fully disclosed to those skilled in the art. It is provided to fully inform the scope of the invention and the invention must be established on the basis of the claims. Therefore, the shape of each element in the drawing is exaggerated for a clearer explanation. In addition, it is assumed that the same reference numeral indicates the same component throughout the specification.

Further, in the present embodiment, a wafer (W) will be described as an example of a substrate used in the process progress. However, in the present invention, the substrate is not limited to the wafer (W), and may be a substrate used for manufacturing a flat plate display panel such as a glass substrate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a drawing schematically showing an example of the baking device 1 of the present invention, FIG. 2 is a drawing showing the cooling plate 200 and the lift pin assembly 400 of FIG. 1, and FIG. 3 is a perspective view of the cooling plate 200. It is a figure. Referring to FIGS. 1 to 3, the baking device 1 includes a chamber 100, a cooling plate 200, a cooling member 300, and a lift pin assembly 400.

The chamber 100 is sealed from the outside to provide a space in which the process is carried out. An opening (not shown) through which a wafer (W) is taken in and out is formed on one side wall of the chamber 100, and this opening can be opened and closed by a door (not shown).

The cooling plate 200 supports the wafer (W) as the process progresses. The cooling plate 200 generally has a disk shape and has a diameter wider than that of the wafer (W). The cooling plate 200 has a central region 282 and an edge region 284. The central region 282 is a region located vertically below the wafer (W) and on which the wafer (W) is placed during the process progress, and the edge region 284 is a region surrounding the central region 282. is there. A hemispherical ceramic ball (not shown) having a fine diameter can be provided in the central region 282 of the cooling plate 200. A guide member 202 can be provided in the edge region 284 of the cooling plate 200. The guide member 202 places the wafer (W) in the normal position on the cooling plate 200 and prevents the wafer (W) from coming off the normal position during the progress of the process. Approximately 3 to 6 guide members 202 are provided, and these can be arranged at equal intervals so as to surround the wafer (W) mounted on the cooling plate 200.

The cooling member 300 cools the wafer (W) placed on the cooling plate 200. The cooling member 300 includes a cooling line formed in the cooling plate 200, and can cool the wafer (W) by supplying a cooling fluid such as cooling water to the cooling line.

The lift pin assembly 400 works to seat the wafer (W) on which the process is performed on the cooling plate 200 and to remove the wafer (W) for which the process is completed from the cooling plate 200. The lift pin assembly 400 has a lift pin 420 that is brought into contact with the wafer (W) and a strut 440 that is coupled to the lower end of the lift pin 420, which strut 440 is moved up and down by the driver 460. Three lift pins 420 can be provided.

The cooling plate 200 is formed with a pinhole 220 that penetrates the cooling plate 200 in the vertical direction. The pinhole 220 is provided at the boundary between the central region 282 and the edge region 284 of the cooling plate 200. Lift pins 420 are inserted into each pinhole 220. Three pinholes 220 are formed, which can be placed 120 degrees apart from each other.

Referring to FIG. 4, the lift pin 420 generally has a rod shape formed long in the vertical direction. The lift pin 420 has a support surface 422 and a guide surface 424 at the upper end. The support surface 422 contacts one end of the bottom edge of the wafer (W) to support the wafer (W). The guide surface 424 extends upward from the outer end of the support surface 422 as a starting point. The guide surface 424 is provided so as to be perpendicular or inclined with respect to the support surface 422. The guide surface 424 is provided so as to be adjacent to the side surface of the wafer (W) mounted on the support surface 422, and prevents the wafer (W) from moving laterally when the lift pin 420 is displaced.

Referring again to FIG. 3, a guide passage is formed in the central region 282 of the cooling plate 200. According to one example, the guide passage has a guide groove 240 provided on the upper surface of the cooling plate 200. The guide groove 240 is provided so that the space provided between the wafer (W) and the cooling plate 200 can be connected to the outside. While the wafer (W) is cooled by the cooling plate 200, external air flows into the space between the wafer (W) and the cooling plate 200 through the guide groove 240.

5A and 5B show the space 204 provided between the cooling plate 200 and the wafer (W), respectively, when the cooling plate 200 is not provided with the guide groove 240 and when the guide groove 240 is provided. Indicates the pressure inside. The arrows in FIG. 5B indicate the path of air inflow into the space 204 provided between the cooling plate 200 and the wafer (W).

As shown in FIG. 5A, when the wafer (W) is placed on the cooling plate 200 ́ and cooled, the wafer (W) is generally curved upward in a convex shape, and the wafer (W) and the cooling plate 200 Space 204 is formed between the two. As the cooling process progresses, the temperature of the air in the space 504 decreases, and as the temperature decreases, the air is compressed, which causes the pressure P in the space.₁Is the external pressure P₂Will be lower or vacuum. Later, when the wafer (W) is removed from the cooling plate 200, the lift pin 420 must exert a large force on the wafer (W), so that the wafer (W) can be damaged by the lift pin 420.

However, as shown in FIG. 5B, when the guide groove 240 is provided in the cooling plate 200, the external air flows into the space 204, so that the pressure P inside the space continues even after the cooling process has progressed.₁Is the external pressure P₂Is the same as. Therefore, the lift pin 420 can remove the wafer (W) from the cooling plate 200 without applying a large force to the wafer (W).

According to one example, the guide groove 240 has three linear guide portions 242 and one ring-shaped guide portion 244. The ring-shaped guide portion 244 is provided in a circular ring shape at the center of the cooling plate 200. The linear guide portion 242 extends along the radial direction of the wafer in the direction from the ring-shaped guide portion 244 toward the edge region of the cooling plate. A plurality of linear guides 242 are provided at equal intervals from each other.

According to one example, as shown in FIG. 3, the pinhole 220 is provided at the boundary between the central region 282 and the edge region 284, and one end of the guide groove 240 extends to the pinhole 220. In this case, the diameter of the pinhole 220 is dimensionally designed to be sufficiently large so that external air can flow into the space 204 even when the lift pin 420 is inserted.

6 and 7 show another example of the guide groove 240a formed in the cooling plate 200a. As shown in FIG. 6, the guide groove 240a extends to the edge region 284 of the cooling plate 200a. Optionally, as shown in FIG. 7, the guide groove 240b can extend to the peripheral wall of the cooling plate 200b.

Further, FIG. 8 is a drawing showing another example of the guide passage. Referring to FIG. 8, the guide passage has a through hole 260 formed in the central region of the cooling plate 200 so as to penetrate the cooling plate 200 up and down. Further, as shown in FIG. 9, a guide groove 240 connected to the through hole 260 can be formed on the upper surface of the cooling plate 200.

In the above-described example, the case where the guide groove 240 has a linear guide portion 242 and a ring-shaped guide portion 244 has been described. However, this is only an example, and the shape of the guide groove 240 can be changed in various ways.

10A and 10B are drawings showing yet other advantages of the cooling plate of the present invention. In FIGS. 10A and 10B, the arrows indicate the air flow during descent of lift pin 420.

When the lift pin 420 is lowered with the wafer (W) mounted on the lift pin 420, when the wafer (W) is close to the cooling plate 200 as shown in FIG. 10A, the lower region of the wafer (W) is located. Air cannot sufficiently escape from the space between the wafer (W) and the cooling plate 200 to the outside. Since the air in the space cannot escape from the space, the wafer (W) may deviate from the normal position due to the air pressure in the lower region thereof.

However, if the cooling plates 200b and 200c in which the guide groove extends to the outer wall as shown in FIG. 7 are used, the wafer (W) can be brought close to the cooling plate 200 as shown in FIG. 10B. Air in the lower region of the can escape laterally through the guide groove 240. Therefore, the influence of air pressure when the wafer (W) is moved downward can be reduced.

In the above-described embodiment, the baking device 1 for cooling the substrate has been described as an example. However, the technical idea of the present invention is applicable to various types of devices having a structure in which the substrate is seated on the plate by using the lift pin 420, in addition to the baking device 1 for cooling the substrate.

Next, a process in which the process is performed by the baking apparatus according to the present invention will be described.

The wafer (W) is transferred to the upper part of the cooling plate 200 by a transfer arm (not shown). By raising and lowering the lift pin 420, the wafer (W) is delivered from the transfer arm to the lift pin 420. The wafer (W) can be transferred to the cooling plate 200 in a state of being heated to a high temperature. The wafer (W) heated to a high temperature generally has a downwardly protruding shape. By lowering the lift pin 420, the wafer (W) is seated on the cooling plate 200. As the lift pin 420 descends, some of the air in the space between the wafer (W) and the cooling plate 200 is moved out of space along the guide groove 240.

When the wafer (W) is seated on the cooling plate 200, the wafer (W) is cooled. As the cooling process progresses, the wafer (W) is curved upward in a convex shape. The air remaining in the space 204 between the wafer (W) and the cooling plate 200 is cooled, and the pressure in the space 204 is reduced. External air flows into the space 204 through the guide groove 240 due to the pressure difference, and the pressure in the space 204 is maintained the same as the external pressure. When the process is complete, the lift pin 420 is raised and lowered, after which the wafer (W) is delivered to the transfer arm.

Although a preferred embodiment of the present invention has been described above with reference to the attached drawings, those skilled in the art will be able to use other specific embodiments without changing the technical idea and essential features of the present invention. Understand what can be done. Therefore, it should be understood that the preferred embodiments described above are exemplary and not limiting.

<figref num="1">It is a drawing which shows typically the baking apparatus by one Embodiment of this invention.</figref><figref num="2">It is a drawing which shows the lift pin assembly and the cooling plate of FIG.</figref><figref num="3">It is a perspective view of the cooling plate of FIG.</figref><figref num="4">It is a drawing which shows the shape of a lift pin.</figref><figref num="5A">It is a drawing which shows the advantage in use of the apparatus by this invention.</figref><figref num="5B">It is a drawing which shows the advantage in use of the apparatus by this invention.</figref><figref num="6">It is a drawing which shows another example of the cooling plate of FIG.</figref><figref num="7">It is a drawing which shows still another example of the cooling plate of FIG.</figref><figref num="8">It is a drawing which shows still another example of the cooling plate of FIG.</figref><figref num="9">It is a drawing which shows still another example of the cooling plate of FIG.</figref><figref num="10A">It is a drawing which shows the advantage in use of the apparatus by this invention.</figref><figref num="10B">It is a drawing which shows the advantage in use of the apparatus by this invention.</figref>

Code description

Baking device 100 Chamber 200 Cooling plate 200'Cooling plate 200a Cooling plate 200b Cooling plate 202 Guide member 204 Space 220 Pinhole 240 Guide groove 240b Guide groove 242 Linear guide part 244 Ring type guide part 260 Through hole 282 Central area 284 Edge area 300 Cooling member 400 Lift pin assembly 420 Lift pin 422 Support surface 424 Guide surface 440 Strut 460 Drive