Flexible board, optical transmission/reception module and optical transmission/reception device
Abstract
[Subject] The flexible substrate which makes it possible to control a characteristic impedance by high precision, and to make path loss of signal current small is offered. [Solution means] The flexible substrate 1 has micro strip line structure, and each wiring layer and each insulating layer are laminated up and down, and it is formed. The signal wire way 13 which has predetermined width is formed in the first wiring layer, and the grounding layer 14 is formed in the second wiring layer. The position which countered the signal wire way 13 through the second insulating layer of the grounding layer 14 formed in the second wiring layer is equipped with two or more grounding layer openings 14a by which the opening was carried out to the rectangle. Each grounding layer opening 14a -- the width of the signal wire way 13 -- predetermined quantity -- it being the position which has a long side and countered the signal wire way 13 through the second insulating layer, and, The wiring direction of the signal wire way 13 and a side longer than the width of the signal wire way 13 abbreviated-cross at right angles, and it is formed at the predetermined intervals so that the central part of the direction of the neighborhood longer than the width of the signal wire way 13 may be located at the abbreviated center of the signal wire way 13. [Selection figure] Fig. 1

Term
Term ended
Projected expiry passed 31 October 2025, 0.9 years ago.
- Priority and filed
- Published
- Projected expiry
- Today
14 claims: 5 independent, 9 dependent
- 1In a flexible substrate comprising one or a plurality of signal lines, a dielectric layer and a ground conductor layer, the signal line and the ground conductor layer are formed at positions facing each other via the dielectric layer, the ground conductor layer. Is an opening region in which the ground conductor portion is not formed, which is arranged at a position facing one or a plurality of the signal lines via the dielectric layer at a predetermined interval with respect to the wiring direction of the signal line. Each of the openings has a width that is a predetermined amount longer than between both ends of the signal line, and both ends in the width direction longer than between both ends of the signal line are each of the signal line. A flexible substrate formed so as to be located on both outer sides, and ground conductor portions having a width equal to or larger than a predetermined length are formed on both sides of the opening along the wiring direction of the signal line . 単数又は複数の信号線路、誘電体層及び接地導体層を備え、前記信号線路及び前記接地導体層は、前記誘電体層を介して互いに対向した位置に形成されるフレキシブル基板において、 前記接地導体層は、前記誘電体層を介して、単数又は複数の前記信号線路に対向した位置に、前記信号線路の配線方向に対して所定の間隔で配置された、接地導体部が非形成となる開口領域を有する複数の開口部を備え、 前記各開口部は、前記信号線路の両端間より所定量長い幅を有し、前記信号線路の両端間より長い幅方向の両端部が、それぞれ前記信号線路の両外部に位置するように形成され、 前記開口部の両側に、前記信号線路の配線方向に沿って、所定の長さ以上の幅で接地導体部が形成される ことを特徴とするフレキシブル基板。
- 11In an optical transmission module that converts an electric signal into an optical signal and outputs it, an optical reception module that converts an optical signal into an electric signal and outputs it, and an optical transmission / reception module provided with an optical transmission / reception circuit board, the optical transmission module and the optical Each receiving module is connected to the optical transmission / reception circuit board via a flexible substrate, and each flexible board includes one or more signal lines, a dielectric layer and a ground conductor layer, and the signal line and the ground conductor layer. Are formed at positions facing each other via the dielectric layer, and the ground conductor layer is placed at a position facing one or more of the signal lines via the dielectric layer in the wiring direction of the signal line. A plurality of openings having an opening region in which the ground conductor portion is not formed are provided at predetermined intervals with respect to the signal line, and each of the openings has a width that is a predetermined amount longer than that between both ends of the signal line. , Both ends in the width direction longer than between both ends of the signal line are formed so as to be located on both outer sides of the signal line, and predetermined on both sides of the opening along the wiring direction of the signal line. An optical transmission / reception module characterized in that a ground conductor is formed with a width greater than or equal to the length. 電気信号を光信号に変換して出力する光送信モジュール、光信号を電気信号に変換して出力する光受信モジュール、及び光送受信回路基板を備えた光送受信モジュールにおいて、 前記光送信モジュール及び前記光受信モジュールは、それぞれフレキシブル基板を介して前記光送受信回路基板に接続され、 前記各フレキシブル基板は、単数又は複数の信号線路、誘電体層及び接地導体層を備え、 前記信号線路及び前記接地導体層は、前記誘電体層を介して互いに対向した位置に形成され、 前記接地導体層は、前記誘電体層を介して、単数又は複数の前記信号線路に対向した位置に、前記信号線路の配線方向に対して所定の間隔で配置された、接地導体部が非形成となる開口領域を有する複数の開口部を備え、 前記各開口部は、前記信号線路の両端間より所定量長い幅を有し、前記信号線路の両端間より長い幅方向の両端部が、それぞれ前記信号線路の両外部に位置するように形成され、 前記開口部の両側に、前記信号線路の配線方向に沿って、所定の長さ以上の幅で接地導体部が形成される ことを特徴とする光送受信モジュール。
- 12The optical transmission / reception circuit board is composed of a rigid substrate, and each of the flexible substrate and the optical transmission / reception circuit board is configured as a flex rigid substrate in which a flexible substrate and a rigid substrate are integrally formed. Described optical transmitter / receiver module. 前記光送受信回路基板はリジット基板により構成され、 前記各フレキシブル基板及び前記光送受信回路基板は、フレキシブル基板とリジッド基板が一体に形成されたフレックスリジッド基板として構成される ことを特徴とする請求項11記載の光送受信モジュール。
- 13The optical transmission / reception module is connected to an optical transmission module that converts an electric signal into an optical signal and outputs it, an optical reception module that converts an optical signal into an electric signal and outputs it, and an optical transmission / reception module provided with an optical transmission / reception circuit board. In an optical transmission / reception device having a parent substrate, the optical transmission module and the optical reception module are each connected to the optical transmission / reception circuit board via a flexible substrate, and the optical transmission / reception circuit board is connected to the parent substrate via the flexible substrate. Each of the flexible substrates is provided with one or more signal lines, a dielectric layer and a ground conductor layer, and the signal line and the ground conductor layer are formed at positions facing each other via the dielectric layer. The ground conductor layer is provided with ground conductor portions arranged at positions facing one or a plurality of the signal lines at predetermined intervals with respect to the wiring direction of the signal lines via the dielectric layer. A plurality of openings having non-forming opening regions are provided, and each opening has a width that is a predetermined amount longer than between both ends of the signal line, and both ends in the width direction longer than between both ends of the signal line. , Each of which is formed so as to be located on both outer sides of the signal line. An optical transmission / reception device characterized in that grounding conductor portions are formed on both sides of the opening along the wiring direction of the signal line with a width of a predetermined length or more. 電気信号を光信号に変換して出力する光送信モジュール、光信号を電気信号に変換して出力する光受信モジュール、及び光送受信回路基板を備えた光送受信モジュールと、前記光送受信モジュールが接続される親基板を有する光送受信装置において、 前記光送信モジュール及び前記光受信モジュールは、それぞれフレキシブル基板を介して前記光送受信回路基板に接続され、 前記光送受信回路基板はフレキシブル基板を介して前記親基板に接続され、 前記各フレキシブル基板は、単数又は複数の信号線路、誘電体層及び接地導体層を備え、 前記信号線路及び前記接地導体層は、前記誘電体層を介して互いに対向した位置に形成され、 前記接地導体層は、前記誘電体層を介して、単数又は複数の前記信号線路に対向した位置に、前記信号線路の配線方向に対して所定の間隔で配置された、接地導体部が非形成となる開口領域を有する複数の開口部を備え、 前記各開口部は、前記信号線路の両端間より所定量長い幅を有し、前記信号線路の両端間より長い幅方向の両端部が、それぞれ前記信号線路の両外部に位置するように形成され、 前記開口部の両側に、前記信号線路の配線方向に沿って、所定の長さ以上の幅で接地導体部が形成される ことを特徴とする光送受信装置。
- 14The optical transmission / reception circuit board is composed of a rigid substrate, and each of the flexible substrate and the optical transmission / reception circuit board is configured as a flex rigid substrate in which a flexible substrate and a rigid substrate are integrally formed. The optical transmitter / receiver described. 前記光送受信回路基板はリジット基板により構成され、 前記各フレキシブル基板及び前記光送受信回路基板は、フレキシブル基板とリジッド基板が一体に形成されたフレックスリジッド基板として構成される ことを特徴とする請求項13記載の光送受信装置。
Independent claims5
150 paragraphs, as filed
The present invention relates to a flexible substrate having a microstrip line or a strip line structure, and an optical transmission / reception module and an optical transmission / reception device provided with the flexible substrate. Specifically, a plurality of openings are arranged at predetermined positions and intervals at positions facing the signal line via the dielectric layer of the ground conductor layer, and are arranged on both sides of the opening row along the wiring direction of the signal line. By forming the ground conductor portion with a width equal to or larger than a predetermined length, it is possible to reduce the transmission loss of the signal current and improve the transmission characteristics of the high frequency signal.
Generally, when transmitting a high frequency signal on a printed circuit board, a printed circuit board having a microstrip line or a strip line is used. FIG. 25 (a) shows the cross-sectional shape of the microstrip line formed on the printed circuit board, and FIG. 25 (b) shows the cross-sectional shape of the strip line formed on the printed circuit board. As shown in FIG. 25 (a), the microstrip line has a ground layer 14 via a dielectric layer 40 formed at a predetermined height H with respect to a signal line 13 formed with a predetermined pattern width W. Is formed. Further, as shown in FIG. 25 (b), in the strip line, a signal line 13 is formed inside the dielectric layer 40 formed at a predetermined height H with a predetermined pattern width W, and the strip line is formed on the dielectric layer 40. The ground layer 14 is formed on the upper part and the lower part, respectively.
In the microstrip line and the strip line, the characteristic impedance of the signal line 13 is adjusted by changing the pattern width W of the signal line 13 and the height H of the dielectric layer 40. In a general printed circuit board, the height of the dielectric layer 40 is 100 μm or more, the width W of the signal line is 100 μm, and the characteristic impedance is adjusted to 50 Ω to 100 Ω.
In addition to the above, a substrate for forming a ground layer in a mesh shape has been devised in a microstrip line or a strip line (see, for example, Patent Document 1). FIG. 26 is a plan view showing the substrate disclosed in Patent Document 1, and shows only the signal line 13 and the ground layer 42. The arrow j1 in FIG. 26 shows the current flow on the signal line 13, and the arrow j2 shows the feedback current flow on the ground layer 42.
As shown in FIG. 26, the substrate disclosed in Patent Document 1 is formed in a mesh shape by providing a large number of openings such as rhombuses and circles in the ground layer to reduce the capacitance between the signal line and the ground layer. It is changed to adjust the characteristic impedance of the signal line.
<patcit num="1"><text>Japanese Patent No. 3397707</text></patcit>
<p> However, the conventional microstrip line and the strip line configuration have the following problems. In a flexible substrate, in order to ensure the flexibility of the substrate, the height H of the dielectric layer 40 is formed to be lower than that of a general substrate such as 25 μm to 50 μm. As a result of lowering the height H of the dielectric layer 40, the width W of the signal line 13 needs to be formed as a narrow width such as 25 μm to 50 μm in order to make the characteristic impedance a predetermined value. However, with the current flexible substrate manufacturing technology, it is difficult to accurately form a signal line having such a narrow width, and as a result, there is a problem that the characteristic impedance of the signal line cannot be controlled correctly.</p><p> Here, as shown in Patent Document 1, when the height H of the dielectric layer 40 is low by changing the capacitance between the signal line and the ground layer by forming the ground layer in a mesh shape. Even if there is, it is possible to set the characteristic impedance to a predetermined value and widen the width W of the signal line 13. However, when the ground layer is formed in a mesh shape, as shown by arrows j1 and j2 in FIG. 26, the path of the feedback current on the ground layer 42 with respect to the signal current on the signal line 13 becomes long. As a result, the loss of the feedback current on the ground layer 42 becomes large, and the transmission loss of the signal current on the signal line 13 becomes large.</p><p> FIG. 27 is a diagram showing the measurement results of the transmission loss of the signal current on the signal line 13 at each frequency when the ground layer is formed in a mesh shape and when the ground layer is formed in a solid shape. k1 indicates the transmission loss when the ground layer is formed in a mesh shape, and k2 indicates the transmission loss when the ground layer is formed in a solid shape. In FIG. 27, when the ground layer is formed in a mesh shape, the signal line width is formed to 200 μm, and when the ground layer is formed in a solid shape, the signal line width is formed in a state of 100 μm. Is shown.</p><p> As shown in FIG. 27, when the frequency is up to about 15 GHz, the transmission loss is smaller when the ground layer is formed in a mesh shape than when the ground layer is formed in a solid shape. This is because when the ground layer is formed in a mesh shape, the width of the signal line is formed wider than when the ground layer is formed in a solid shape. However, when the frequency is higher than 16 GHz, when the ground layer is formed in a mesh shape, the loss of the feedback current on the ground layer 14 becomes large, so that the transmission loss becomes larger than when the ground layer is formed in a solid shape. It ends up.</p><p> The present invention has been made to solve such a problem, and a flexible substrate capable of reducing the transmission loss of a signal current and improving the transmission characteristics of a high-frequency signal, and this flexible substrate are provided. It is an object of the present invention to provide an optical transmission / reception module and an optical transmission / reception device provided.</p>
<p> In order to solve the above-mentioned problems, the flexible substrate according to the present invention includes one or more signal lines, a dielectric layer and a ground conductor layer, and the signal lines and the ground conductor layers face each other via the dielectric layer. In the flexible substrate formed at the position, the grounding conductor layer is arranged at a position facing one or a plurality of signal lines via the dielectric layer at a predetermined interval with respect to the wiring direction of the signal line, and is grounded. It has a plurality of openings having an opening region in which the conductor portion is not formed, and each opening has a width that is a predetermined amount longer than between both ends of the signal line, and both ends in the width direction longer than between both ends of the signal line. , Each is formed so as to be located on both outer sides of the signal line, and ground conductor portions are formed on both sides of the opening along the wiring direction of the signal line with a width of a predetermined length or more. It is a thing.</p><p> In the flexible substrate according to the present invention, a high frequency signal is transmitted to the signal line. When a signal current flows through the signal line, in the ground conductor layer, the ground conductor portions formed on both sides of the opening along the wiring direction of the signal line with a width of a predetermined length or more are opposite to the signal current. A feedback current flows in the direction. At this time, the ground conductor portions on both sides of the opening of the ground conductor layer have the same potential because they are connected by a portion other than the opening.</p><p> Further, in the flexible substrate according to the present invention, the value of the characteristic impedance of the signal line changes by changing each dimension of the microstrip line structure as follows. For example, by narrowing the width of the signal line, widening the area of each opening provided in the ground conductor layer, or narrowing the arrangement interval of each opening, the characteristic impedance of the signal line becomes a large value. Further, for example, by widening the width of the signal line, narrowing the area of each opening provided in the ground conductor layer, or widening the arrangement interval of each opening, the characteristic impedance of the signal line becomes a small value.</p><p> In order to solve the above-mentioned problems, the optical transmission / reception module according to the present invention includes an optical transmission module that converts an electric signal into an optical signal and outputs it, an optical reception module that converts an optical signal into an electric signal and outputs it, and an optical transmission / reception. In an optical transmission / reception module including a circuit board, the optical transmission module and the optical reception module are each connected to the optical transmission / reception circuit board via a flexible board, and each flexible board is connected to one or more signal lines, a dielectric layer, and a ground. The conductor layer is provided, and the signal line and the ground conductor layer are formed at positions facing each other via the dielectric layer, and the ground conductor layer is formed at a position facing one or more signal lines via the dielectric layer. , A plurality of openings arranged at predetermined intervals with respect to the wiring direction of the signal line and having an opening area in which the ground conductor portion is not formed, and each opening is a predetermined amount longer than between both ends of the signal line. Both ends in the width direction, which have a width and are longer than between both ends of the signal line, are formed so as to be located on both outer sides of the signal line, and are predetermined on both sides of the opening along the wiring direction of the signal line. It is characterized in that the ground conductor portion is formed with a width equal to or larger than the length.</p><p> In the optical transmission / reception module according to the present invention, when data is transmitted / received at high speed, a high frequency signal is transmitted to the signal line of each flexible substrate. When a signal current flows through the signal line, in the ground conductor layer, the ground conductor portions formed on both sides of the opening along the wiring direction of the signal line with a width of a predetermined length or more are opposite to the signal current. A feedback current flows in the direction. At this time, the ground conductor portions on both sides of the opening of the ground conductor layer have the same potential because they are connected by a portion other than the opening.</p><p> Further, in each flexible substrate of the optical transmission / reception module according to the present invention, the value of the characteristic impedance of the signal line changes by changing each dimension of the microstrip line structure as follows. For example, by narrowing the width of the signal line, widening the area of each opening provided in the ground conductor layer, or narrowing the arrangement interval of each opening, the characteristic impedance of the signal line becomes a large value. Further, for example, by widening the width of the signal line, narrowing the area of each opening provided in the ground conductor layer, or widening the arrangement interval of each opening, the characteristic impedance of the signal line becomes a small value.</p><p> In order to solve the above-mentioned problems, the optical transmission / reception device according to the present invention includes an optical transmission module that converts an electric signal into an optical signal and outputs it, an optical reception module that converts an optical signal into an electric signal and outputs it, and an optical transmission / reception. In an optical transmission / reception device having an optical transmission / reception module provided with a circuit board and a parent substrate to which the optical transmission / reception module is connected, the optical transmission module and the optical reception module are each connected to the optical transmission / reception circuit board via a flexible substrate, and the light is transmitted. The transmission / reception circuit board is connected to the parent board via a flexible board, each flexible board includes one or more signal lines, a dielectric layer and a ground conductor layer, and the signal line and the ground conductor layer are via a dielectric layer. The ground conductor layers are formed at positions facing each other, and the ground conductor layers are arranged at positions facing one or more signal lines via a dielectric layer at predetermined intervals with respect to the wiring direction of the signal lines. It has a plurality of openings having an opening region in which the conductor portion is not formed, and each opening has a width that is a predetermined amount longer than between both ends of the signal line, and both ends in the width direction longer than between both ends of the signal line. , Each is formed so as to be located on both outer sides of the signal line, and ground conductor portions are formed on both sides of the opening along the wiring direction of the signal line with a width of a predetermined length or more. It is a thing.</p><p> In the optical transmission / reception device according to the present invention, when data is transmitted / received at high speed, a high frequency signal is transmitted to the signal line of each flexible substrate. When a signal current flows through the signal line, in the ground conductor layer, the ground conductor portions formed on both sides of the opening along the wiring direction of the signal line with a width of a predetermined length or more are opposite to the signal current. A feedback current flows in the direction. At this time, the ground conductor portions on both sides of the opening of the ground conductor layer have the same potential because they are connected by a portion other than the opening.</p><p> Further, in each flexible substrate of the optical transmitter / receiver according to the present invention, the value of the characteristic impedance of the signal line changes by changing each dimension of the microstrip line structure as follows. For example, by narrowing the width of the signal line, widening the area of each opening provided in the ground conductor layer, or narrowing the arrangement interval of each opening, the characteristic impedance of the signal line becomes a large value. Further, for example, by widening the width of the signal line, narrowing the area of each opening provided in the ground conductor layer, or widening the arrangement interval of each opening, the characteristic impedance of the signal line becomes a small value.</p>
<p> According to the flexible substrate according to the present invention, when a high-frequency signal current flows through the signal line, the ground conductor layer has a width equal to or larger than a predetermined length located on both sides of the opening and becomes the same potential. A feedback current flows through the grounding conductor. Therefore, the length of the path of the signal current flowing through the signal line and the path of the feedback current flowing through the ground conductor layer are substantially the same, the transmission loss of the signal current can be reduced, and the transmission characteristics of the high frequency signal can be improved. Is possible.</p><p> According to the optical transmission / reception module according to the present invention, when a high-frequency signal current flows through the signal line of each flexible substrate, the ground conductor layer has a width equal to or larger than a predetermined length located on both sides of the opening. A feedback current flows through the ground conductor that has the same potential. Therefore, the length of the path of the signal current flowing through the signal line and the path of the feedback current flowing through the ground conductor layer are substantially the same, the transmission loss of the signal current can be reduced, and the transmission characteristics of the high frequency signal can be improved. Is possible. As a result, high-quality high-speed signals can be transmitted, and data can be transmitted and received stably at high speed.</p><p> According to the optical transmitter / receiver according to the present invention, when a high-frequency signal current flows through the signal line of each flexible substrate, the ground conductor layer has a width equal to or larger than a predetermined length located on both sides of the opening. A feedback current flows through the ground conductor that has the same potential. Therefore, the length of the path of the signal current flowing through the signal line and the path of the feedback current flowing through the ground conductor layer are substantially the same, the transmission loss of the signal current can be reduced, and the transmission characteristics of the high frequency signal can be improved. Is possible. As a result, high-quality high-speed signals can be transmitted, and data can be transmitted and received stably at high speed.</p>
Hereinafter, embodiments of the flexible substrate, the optical transmission / reception module, and the optical transmission / reception device of the present invention will be described with reference to the drawings. First, an embodiment of a flexible substrate will be described.
<Structure example of the flexible substrate of the first and second embodiments> FIG. 1 is a plan view showing the flexible substrate 1 of the first embodiment and the flexible substrate 2 of the second embodiment, and is a signal line. Only 13 and ground layer 14 are shown. FIG. 2 is an explanatory view showing a cross-sectional shape of the flexible substrate 1 according to the first embodiment. FIG. 2 (a) shows the AA cross section of FIG. 1, and FIG. 2 (b) shows the BB cross section of FIG. FIG. 3 is an explanatory view showing a cross-sectional shape of the flexible substrate 2 according to the second embodiment. FIG. 3 (a) shows the AA cross section of FIG. 1, and FIG. 3 (b) shows the BB cross section of FIG.
The flexible substrate 1 of the first embodiment has a microstrip line structure. As shown in FIG. 2, in the flexible substrate 1 of the first embodiment, the first insulating layer 15, the first wiring layer 16, the second insulating layer 17, the second wiring layer 18, and the third insulating layer 35 are above and below. It is formed by being laminated on. Each of the first insulating layer 15, the second insulating layer 17, and the third insulating layer 35 is formed of, for example, an epoxy resin. Each wiring layer of the first wiring layer 16 and the second wiring layer 18 is formed of, for example, a metal film such as CCL (Copper Clad Laminate).
In the flexible substrate 1 of the first embodiment, as shown in FIGS. 1 and 2, a signal line 13 having a predetermined width is formed in the first wiring layer 16, and a ground layer 14 is formed in the second wiring layer 18. Is formed. Further, in the flexible substrate 1 of the first embodiment, the ground layer 14 formed in the second wiring layer 18 is rectangularly opened at a position facing the signal line 13 via the second insulating layer 17. It is provided with a plurality of ground layer openings 14a.
Each ground layer opening 14a has a side that is a predetermined amount longer than the width of the signal line 13. At a position facing the signal line 13 via the second insulating layer 17, the side longer than the width of the signal line 13 is substantially orthogonal to the wiring direction of the signal line 13, and the central portion in the side direction longer than the width of the signal line 13 is located. Each ground layer opening 14a is formed so as to be located substantially at the center of the signal line 13. Further, the ground layer openings 14a are formed in a state of being arranged at predetermined intervals in the wiring direction of the signal line 13.
In the flexible substrate 1 of the first embodiment, the second insulating layer 17 is an example of a dielectric layer, the second wiring layer 18 is an example of a ground conductor layer, and the ground layer opening 14a is an example of an opening. Is.
The flexible substrate 2 of the second embodiment has a stripline structure. As shown in FIG. 3, the flexible substrate 1 of the first embodiment has a first insulating layer 15, a first wiring layer 16, a second insulating layer 17, a second wiring layer 18, a third insulating layer 35, and a third. The three wiring layers 36 and the fourth insulating layer 37 are laminated one above the other. Each of the first insulating layer 15, the second insulating layer 17, the third insulating layer 35, and the fourth insulating layer 37 is formed of, for example, an epoxy resin. Each wiring layer of the first wiring layer 16, the second wiring layer, and the third wiring layer 36 is formed of, for example, a metal film such as CCL.
In the flexible substrate 2 of the second embodiment, as shown in FIGS. 1 and 3, a signal line 13 having a predetermined width is formed in the second wiring layer 18, and the first wiring layer 16 and the third wiring are formed. A ground layer 14 is formed on the layer 36. Further, in the flexible substrate 2 of the second embodiment, the ground layer 14 formed in the first wiring layer 16 is rectangularly opened at a position facing the signal line 13 via the second insulating layer 17. It is provided with a plurality of ground layer openings 14a. Further, similarly to the first wiring layer, the ground layer opening formed in the third wiring layer 36 is rectangularly opened at a position facing the signal line 13 via the third insulating layer 35. Equipped with multiple 14a.
Each ground layer opening 14a has a side that is a predetermined amount longer than the width of the signal line 13. At a position facing the signal line 13 via the second insulating layer 17 or the third insulating layer 35, a side longer than the width of the signal line 13 is substantially orthogonal to the wiring direction of the signal line 13 and longer than the width of the signal line 13. Each ground layer opening 14a is formed so that the central portion in the side direction is located substantially at the center of the signal line 13. Further, the ground layer openings 14a are formed in a state of being arranged at predetermined intervals in the wiring direction of the signal line 13.
In the flexible substrate 2 of the second embodiment, the second insulating layer 17 and the third insulating layer 35 are examples of the dielectric layer, and the first wiring layer 16 and the third wiring layer 36 are examples of the ground conductor layer. Yes, the ground layer opening 14a is an example of an opening.
Further, in the flexible substrate 1 of the first embodiment and the flexible substrate 2 of the second embodiment, the area of each ground layer opening 14a is widened, or the arrangement interval of each ground layer opening 14a is narrowed. As a result, the degree of coupling between the signal line 13 and the ground layer 14 is weakened, the capacitance is reduced, and the characteristic impedance value of the signal line 13 is increased. On the contrary, by narrowing the area of each ground layer opening 14a or widening the arrangement interval of each ground layer opening 14a, the degree of coupling between the signal line 13 and the ground layer 14 is strengthened and the capacitance is increased. , The value of the characteristic impedance of the signal line 13 becomes small.
Further, in the flexible substrate 1 of the first embodiment and the flexible substrate 2 of the second embodiment, the degree of coupling between the signal line 13 and the ground layer 14 is strengthened by widening the width of the signal line 13. As the capacitance increases, the characteristic impedance value of the signal line 13 decreases. On the contrary, by narrowing the width of the signal line 13, the degree of coupling between the signal line 13 and the ground layer 14 is weakened, the capacitance is reduced, and the characteristic impedance value of the signal line 13 is increased.
As described above, in the flexible substrate 1 of the first embodiment and the flexible substrate 2 of the second embodiment, the area of the ground layer opening 14a, the arrangement interval of the ground layer opening 14a, and the width of the signal line 13 are determined. By changing, the characteristic impedance of the signal line 13 is adjusted. As a result, the characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. Since the width of the signal line 13 can be increased, the width of the signal line 13 can be formed with high accuracy, and the characteristic impedance of the signal line 13 can be controlled with high accuracy.
4 (a) and 4 (b) show the flexible substrate 1 of the first embodiment and the flexible substrate 2 of the second embodiment via the second insulating layer 17 or the third insulating layer 35. , There is a plan view showing a state in which the central portion of the ground layer opening 14a is formed so as to be displaced to the left and right from the central portion of the signal line 13, and only the signal line 13 and the ground layer 14 are shown.
When the flexible substrate 1 of the first embodiment or the flexible substrate 2 of the second embodiment is actually manufactured, as shown in FIG. 4, the central portion of the ground layer opening 14a is the signal line 13. When formed so as to deviate from the central portion, the signal line 13 includes the second insulating layer 17 or the third insulating layer 35 as long as it is within the range of the side length longer than the width of the signal line 13 of the ground layer opening 14a. It is in a state of being located inside each ground layer opening 14a through the ground layer opening 14a.
When the central portion of the ground layer opening 14a is formed so as to be offset from the central portion of the signal line 13, the signal line is shown by arrows D1, D2, E1 and E2 in FIGS. 4 (a) and 4 (b). In No. 13, among the ground portions located on both sides of each ground layer opening 14a, the degree of coupling with the ground portion on one side is increased, and the degree of coupling with the ground portion on the other side is decreased. Therefore, even if the central portion of the ground layer opening 14a is formed so as to deviate from the central portion of the signal line 13, the length of the side longer than the width of the signal line 13 of the ground layer opening 14a is within the range. If so, the degree of overall coupling between the signal line 13 and the ground layer 14 can be kept within a certain range, and the characteristic impedance value of the signal line 13 can be kept within a certain range. ..
Further, the peripheral length of each ground layer opening 14a is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13.
<Operation Example of Flexible Substrate in First and Second Embodiments> Next, an operation example of the flexible substrate 1 in the first embodiment and the flexible substrate 2 in the second embodiment will be described. In the flexible substrate 1 of the first embodiment and the flexible substrate 2 of the second embodiment, when a high frequency signal is transmitted to the signal line 13, the signal line 13 is shown by the arrow C1 in FIG. Current flows through. At this time, as shown by the arrow C2, the feedback current flows in the vicinity of the ground layer opening 14a of the ground layer 14. Therefore, since the length of the path of the signal current flowing through the signal line 13 and the path of the feedback current flowing through the ground layer 14 are substantially the same, the transmission loss of the signal current flowing through the signal line 13 can be reduced.
Further, in the flexible substrate 1 of the first embodiment and the flexible substrate 2 of the second embodiment, as described above, the signal line 13 is formed by changing the area and the arrangement interval of the ground layer opening 14a. The characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. As a result, the transmission loss of the signal current flowing through the signal line 13 can be reduced. As a result of reducing the transmission loss of the signal current flowing through the signal line 13, it is possible to use the flexible board 1 and the flexible board 2 having the signal line 13 for wiring over a longer distance.
Further, the peripheral length of each ground layer opening 14a is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13. Therefore, it is possible to prevent the feedback current flowing through the ground layer 14 from causing resonance at each ground layer opening 14a and adversely affecting the signal or the like transmitted through the signal line 13.
<Structure example of the flexible substrate of the third and fourth embodiments> FIG. 5 is a plan view showing the flexible substrate 3 of the third embodiment and the flexible substrate 4 of the fourth embodiment, and is a signal line. Only 13 and ground layer 14 are shown. FIG. 6 is an explanatory view showing a cross-sectional shape of the flexible substrate 3 according to the third embodiment. FIG. 6 (a) shows the FF cross section of FIG. 5, and FIG. 6 (b) shows the GG cross section of FIG. FIG. 7 is an explanatory view showing a cross-sectional shape of the flexible substrate 4 according to the fourth embodiment. FIG. 7 (a) shows the FF cross section of FIG. 5, and FIG. 7 (b) shows the GG cross section of FIG.
The flexible substrate 3 of the third embodiment has a microstrip line structure. As shown in FIG. 6, the flexible substrate 3 of the third embodiment has the same as the flexible substrate 3 of the third embodiment, that is, the first insulating layer 15, the first wiring layer 16, and the second insulating layer 17. , The second wiring layer 18 and the third insulating layer 35 are vertically laminated and formed, each insulating layer is formed of, for example, an epoxy resin, and each wiring layer is formed of, for example, a metal film such as CCL.
In the flexible substrate 3 of the third embodiment, as shown in FIGS. 5 and 6, a signal line 13 having a predetermined width is formed in the first wiring layer 16, and a ground layer 14 is formed in the second wiring layer 18. Is formed. Further, in the flexible substrate 3 of the third embodiment, two rectangular portions of the ground layer 14 formed in the second wiring layer 18 are located at positions facing the signal line 13 via the second insulating layer 17. It is provided with a plurality of ground layer openings 14b opened in a shape in which the two are combined. The two rectangular portions are positioned so as to face the signal line 13 via the second insulating layer 17, and one side direction is substantially orthogonal to the wiring direction of the signal line 13 and is in the wiring direction of the signal line 13. The sides of the signal line 13 that are substantially orthogonal to each other are connected to each other at a position facing the substantially central portion of the signal line 13 and separated by a predetermined distance. Further, the ground layer openings 14b are formed in a state of being arranged at predetermined intervals in the wiring direction of the signal line 13.
In the flexible substrate 3 of the third embodiment, the second insulating layer 17 is an example of a dielectric layer, the second wiring layer 18 is an example of a ground conductor layer, and the ground layer opening 14b is an example of an opening. Is.
The flexible substrate 4 of the fourth embodiment has a stripline structure. As shown in FIG. 7, the flexible substrate 4 of the fourth embodiment has the same as the flexible substrate 2 of the second embodiment, that is, the first insulating layer 15, the first wiring layer 16, and the second insulating layer 17. , The second wiring layer 18, the third insulating layer 35, the third wiring layer 36, and the fourth insulating layer 37 are vertically laminated and formed, each insulating layer is formed of, for example, an epoxy resin, and each wiring layer is formed, for example. It is formed by a metal film such as CCL.
In the flexible substrate 4 of the fourth embodiment, as shown in FIGS. 5 and 7, a signal line 13 having a predetermined width is formed in the second wiring layer 18, and the first wiring layer 16 and the third wiring are formed. A ground layer 14 is formed on the layer 36. Further, in the flexible substrate 4 of the fourth embodiment, two rectangular portions of the ground layer 14 formed in the first wiring layer 16 are located at positions facing the signal line 13 via the second insulating layer 17. It is provided with a plurality of ground layer openings 14b opened in a shape in which the two are combined. Further, similarly to the first wiring layer, the ground layer 14 formed in the third wiring layer 36 has a shape in which two rectangular portions are coupled to each other at a position facing the signal line 13 via the third insulating layer 35. A plurality of opened ground layer openings 14b are provided.
The two rectangular portions of each ground layer opening 14b are located facing the signal line 13 via the second insulating layer 17 or the third insulating layer 35, and one side direction is relative to the wiring direction of the signal line 13. Each side that is substantially orthogonal and substantially orthogonal to the wiring direction of the signal line 13 is formed by being connected at a position facing the substantially central portion of the signal line 13 and separated by a predetermined distance.
In the flexible substrate 4 of the fourth embodiment, the second insulating layer 17 and the third insulating layer 35 are examples of the dielectric layer, and the first wiring layer 16 and the third wiring layer 36 are examples of the ground conductor layer. Yes, the ground layer opening 14b is an example of an opening.
Further, in the flexible substrate 3 of the third embodiment and the flexible substrate 4 of the fourth embodiment, similarly to the flexible substrates 1 and 2 of the first and second embodiments, the ground layer opening 14b The characteristic impedance of the signal line 13 is adjusted by changing the area, the arrangement interval of the ground layer opening 14b, and the width of the signal line 13. As a result, the characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. Since the width of the signal line 13 can be increased, the width of the signal line 13 can be formed with high accuracy, and the characteristic impedance of the signal line 13 can be controlled with high accuracy.
8 (a) and 8 (b) show the flexible substrate 3 of the third embodiment and the flexible substrate 4 of the fourth embodiment via the second insulating layer 17 or the third insulating layer 35. , There is a plan view showing a state in which the joint portion of the two rectangular portions of the ground layer opening 14b is formed so as to be displaced from the center of the signal line 13 to the left and right, and only the signal line 13 and the ground layer 14 are shown. FIG. 8 (a) shows a state in which the signal line 13 is shifted to the left with respect to each ground layer opening 14b, and FIG. 8 (b) shows a state in which the signal line 13 is shifted to the right with respect to each ground layer opening 14b. Indicates the state.
As shown in FIG. 8A, when the signal line 13 is formed so as to be shifted to the left side with respect to each ground layer opening 14b, it is located on the right side of each ground layer opening 14b as shown by arrow I2. The distance between the ground and the ground becomes longer and the degree of coupling becomes smaller, but the area of the part overlapping the ground layer opening 14b shown in J2 decreases. Further, as shown by arrow I1, the distance between each ground layer opening 14b and the ground portion located on the left side becomes shorter and the degree of coupling increases, but the portion overlapping with the ground layer opening 14b shown in J1 The area increases.
Further, as shown in FIG. 8B, when the signal line 13 is formed so as to be shifted to the right with respect to each ground layer opening 14b, as shown by arrow K2, it is formed on the right side of each ground layer opening 14b. The distance between the ground portion and the ground portion where it is located becomes shorter and the degree of coupling increases, but the area of the portion overlapping the ground layer opening 14b shown in M2 increases. Further, as shown by the arrow K1, the distance between the ground layer opening 14b located on the left side of each ground layer opening 14b becomes longer and the degree of coupling becomes smaller, but the portion overlapping the ground layer opening 14b shown in M1 The area is reduced.
Therefore, in the flexible substrate 3 of the third embodiment and the flexible substrate 4 of the fourth embodiment, the signal line 13 and the ground layer opening 14b are formed so as to be displaced from each other to the left and right. However, the degree of overall coupling between the signal line 13 and the ground layer 14 can be kept within a certain range, and the characteristic impedance value of the signal line 13 can be kept within a certain range.
Further, in the flexible substrate 3 of the third embodiment and the flexible substrate 4 of the fourth embodiment, the length of each side of the two rectangular portions of each ground layer opening 14b and the wiring direction of the signal line 13 The distance between each side that is substantially orthogonal to each other and the arrangement interval of each ground layer opening 14b can be changed. As a result, when the signal line 13 and each ground layer opening 14b are formed so as to be offset from each other to the left and right, the degree of overall coupling between the signal line 13 and the ground layer 14 can be finely adjusted, and the signal line can be finely adjusted. It is possible to accurately set the value of the characteristic impedance of 13 within a certain range.
Further, the peripheral length of each ground layer opening 14b is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13.
<Operation Example of Flexible Substrate in Third and Fourth Embodiments> Next, an operation example of the flexible substrate 3 in the third embodiment and the flexible substrate 4 in the fourth embodiment will be described. In the flexible substrate 3 of the third embodiment and the flexible substrate 4 of the fourth embodiment, when a high frequency signal is transmitted to the signal line 13, the signal line 13 is shown by the arrow n1 in FIG. Current flows through. At this time, as shown by the arrow n2, the feedback current flows in the vicinity of the ground layer opening 14b of the ground layer 14. Therefore, since the length of the path of the signal current flowing through the signal line 13 and the path of the feedback current flowing through the ground layer 14 are substantially the same, the transmission loss of the signal current flowing through the signal line 13 can be reduced.
Further, in the flexible substrate 3 of the third embodiment and the flexible substrate 4 of the fourth embodiment, as described above, the signal line 13 is changed by changing the area and the arrangement interval of the ground layer opening 14b. The characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. As a result, the transmission loss of the signal current flowing through the signal line 13 can be reduced. As a result of reducing the transmission loss of the signal current flowing through the signal line 13, it is possible to use the flexible board 3 and the flexible board 4 having the signal line 13 for wiring over a longer distance.
Further, the peripheral length of each ground layer opening 14b is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13. Therefore, it is possible to prevent the feedback current flowing through the ground layer 14 from causing resonance at each ground layer opening 14b and adversely affecting the signal or the like transmitted through the signal line 13.
<Structure example of the flexible substrate of the fifth and sixth embodiments> FIG. 9 is a plan view showing the flexible substrate 5 of the fifth embodiment and the flexible substrate 6 of the sixth embodiment, and is a signal line. Only 13 and ground layer 14 are shown.
The flexible substrate 5 of the fifth embodiment has a microstrip line structure, and has the flexible substrate 1 of the first embodiment shown in FIG. 2 and the flexible substrate 3 of the third embodiment shown in FIG. It has a similar layer structure.
In the flexible substrate 5 of the fifth embodiment, as shown in FIG. 9, a signal line 13 having a predetermined width is formed in the first wiring layer 16, and a ground layer 14 is formed in the second wiring layer 18. To. Further, the ground layer opening 14c is opened in a shape in which two rectangular portions are combined at a position of the ground layer 14 formed in the second wiring layer 18 facing the signal line 13 via the second insulating layer 17. Is provided with a plurality of. The two rectangular portions are positioned so as to face the signal line 13 via the second insulating layer 17, and one side direction is substantially orthogonal to the wiring direction of the signal line 13 and is in the wiring direction of the signal line 13. The sides of the signal line 13 that are substantially orthogonal to each other are connected to each other at a position facing the substantially central portion of the signal line 13 and separated by a predetermined distance.
Further, the ground layer opening 14c is formed so that the rectangular portion located on one side is displaced forward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. Some of the rectangular portions located on the side of the signal line 13 are formed so as to be displaced rearward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. It is formed in a state where it is arranged at a predetermined interval. These two types of ground layer openings 14c are examples of the first second rectangular opening and the second second rectangular opening. The second insulating layer 17 is an example of a dielectric layer, and the second wiring layer 18 is an example of a ground conductor layer.
The flexible substrate 6 of the sixth embodiment has a stripline structure. The flexible substrate 6 of the sixth embodiment has the same layer structure as the flexible substrate 2 of the second embodiment and the flexible substrate 4 of the fourth embodiment.
In the flexible substrate 6 of the sixth embodiment, as shown in FIG. 9, a signal line 13 having a predetermined width is formed in the second wiring layer 18, and the first wiring layer 16 and the third wiring layer 36 are formed. The ground layer 14 is formed. Further, in the flexible substrate 6 of the sixth embodiment, two rectangular portions of the ground layer 14 formed in the first wiring layer 16 are located at positions facing the signal line 13 via the second insulating layer 17. A plurality of ground layer openings 14c opened in a shape in which the two are combined are provided. Further, similarly to the first wiring layer, the ground layer 14 formed in the third wiring layer 36 has a shape in which two rectangular portions are coupled to each other at a position facing the signal line 13 via the third insulating layer 35. A plurality of opened ground layer openings 14c are provided.
The two rectangular portions of each ground layer opening 14c are located facing the signal line 13 via the second insulating layer 17 or the third insulating layer 35, and one side direction is relative to the wiring direction of the signal line 13. Each side that is substantially orthogonal and substantially orthogonal to the wiring direction of the signal line 13 is formed by being connected at a position facing the substantially central portion of the signal line 13 and separated by a predetermined distance.
Further, the ground layer opening 14c is formed so that the rectangular portion located on one side is displaced forward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. Some of the rectangular portions located on the side of the signal line 13 are formed so as to be displaced rearward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. It is formed in a state where it is arranged at a predetermined interval. These two types of ground layer openings 14c are examples of the first second rectangular opening and the second second rectangular opening. The second insulating layer 17 and the third insulating layer 35 are examples of the dielectric layer, and the first wiring layer 16 and the third wiring layer 36 are examples of the ground conductor layer.
Further, in the flexible substrate 5 of the fifth embodiment and the flexible substrate 6 of the sixth embodiment, the area of the ground layer opening 14c and the arrangement interval of the ground layer opening 14c are the same as those of the flexible substrates 1 to 4. And by changing the width of the signal line 13, the characteristic impedance of the signal line 13 is adjusted. As a result, the characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. Since the width of the signal line 13 can be increased, the width of the signal line 13 can be formed with high accuracy, and the characteristic impedance of the signal line 13 can be controlled with high accuracy.
10 (a) and 10 (b) show the flexible substrate 5 of the fifth embodiment and the flexible substrate 6 of the sixth embodiment via the second insulating layer 17 or the third insulating layer 35. , There is a plan view showing a state in which the joint portion of the two rectangular portions of the ground layer opening 14c is formed so as to be displaced from the center of the signal line 13 to the left and right, and only the signal line 13 and the ground layer 14 are shown. FIG. 10 (a) shows a state in which the signal line 13 is shifted to the left with respect to each ground layer opening 14c, and FIG. 10 (b) shows a state in which the signal line 13 is shifted to the right with respect to each ground layer opening 14c. Indicates the state.
As shown in FIG. 10A, when the signal line 13 is formed so as to be shifted to the left side with respect to each ground layer opening 14c, it is located on the right side of each ground layer opening 14c as shown by arrow O2. The distance between the ground and the ground becomes longer and the degree of coupling becomes smaller, but the area of the part overlapping the ground layer opening 14c shown in P2 decreases. Further, as shown by arrow O1, the distance between each ground layer opening 14c and the ground located on the left side becomes shorter and the degree of coupling increases, but the portion overlapping with the ground layer opening 14c shown in P1 The area increases.
Further, as shown in FIG. 10B, when the signal line 13 is formed so as to be shifted to the right with respect to each ground layer opening 14c, as shown by arrow Q2, it is formed on the right side of each ground layer opening 14c. The distance between the ground and the ground portion is shortened and the degree of coupling is increased, but the area of the portion overlapping the ground layer opening 14c shown in R2 is increased. Further, as shown by arrow Q1, the distance between each ground layer opening 14c and the ground portion located on the left side becomes longer and the degree of coupling becomes smaller, but the portion overlapping with the ground layer opening 14c shown in R1 The area is reduced.
Therefore, in the flexible substrate 5 of the fifth embodiment and the flexible substrate 6 of the sixth embodiment, the signal line 13 and the ground layer opening 14c are formed so as to be offset from each other to the left and right. However, the degree of overall coupling between the signal line 13 and the ground layer 14 can be kept within a certain range, and the characteristic impedance value of the signal line 13 can be kept within a certain range.
Further, in the flexible substrate 5 of the fifth embodiment and the flexible substrate 6 of the sixth embodiment, the length of each side of the two rectangular portions of each ground layer opening 14c and the wiring direction of the signal line 13 The distance between each side that is substantially orthogonal to each other and the arrangement interval of each ground layer opening 14c can be changed. As a result, when the signal line 13 and each ground layer opening 14c are formed so as to be offset from each other to the left and right, the degree of overall coupling between the signal line 13 and the ground layer 14 can be finely adjusted, and the signal line can be finely adjusted. It is possible to accurately set the value of the characteristic impedance of 13 within a certain range.
Further, the peripheral length of each ground layer opening 14c is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13.
<Operation Examples of Flexible Substrate in the 5th and 6th Embodiments> Next, operation examples of the flexible substrate 5 of the 5th embodiment and the flexible substrate 6 of the 6th embodiment will be described. In the flexible substrate 5 of the fifth embodiment and the flexible substrate 6 of the sixth embodiment, when a high frequency signal is transmitted to the signal line 13, the signal line 13 is shown by the arrow N1 in FIG. Current flows through. At this time, as shown by the arrow N2, the feedback current flows in the vicinity of the ground layer opening 14c of the ground layer 14. Therefore, since the length of the path of the signal current flowing through the signal line 13 and the path of the feedback current flowing through the ground layer 14 are substantially the same, the transmission loss of the signal current flowing through the signal line 13 can be reduced.
Further, in the flexible substrate 5 of the fifth embodiment and the flexible substrate 6 of the sixth embodiment, as described above, the signal line 13 is formed by changing the area and the arrangement interval of the ground layer opening 14c. The characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. As a result, the transmission loss of the signal current flowing through the signal line 13 can be reduced. As a result of reducing the transmission loss of the signal current flowing through the signal line 13, it is possible to use the flexible board 5 and the flexible board 6 having the signal line 13 for wiring over a longer distance.
Further, the peripheral length of each ground layer opening 14c is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13. Therefore, it is possible to prevent the feedback current flowing through the ground layer 14 from causing resonance at each ground layer opening 14c and adversely affecting the signal or the like transmitted through the signal line 13.
<Structure example of the flexible substrate of the 7th and 8th embodiments> FIG. 11 is a plan view showing the flexible substrate 7 of the 7th embodiment and the flexible substrate 8 of the 8th embodiment, and is a signal line. Only 13 and ground layer 14 are shown.
The flexible substrate 7 of the seventh embodiment has a microstrip line structure and has the same layer structure as each of the flexible substrates of the first, third, and fifth embodiments.
In the flexible substrate 7 of the seventh embodiment, as shown in FIG. 11, a signal line 13 having a predetermined width is formed in the first wiring layer 16, and a ground layer 14 is formed in the second wiring layer 18. To. Further, a plurality of ground layer openings 14d opened in a parallel quadrilateral shape are provided at positions of the ground layer 14 formed in the second wiring layer 18 facing the signal line 13 via the second insulating layer 17.
The ground layer opening 14d has a width wider than the line width of the signal line 13, and a substantially central portion having a width wider than the line width of the signal line 13 is located on the signal line 13 via the second insulating layer 17. It is formed at a position facing substantially the center. The ground layer openings 14d are formed at predetermined intervals in the wiring direction of the signal line 13. The ground layer opening 14d is an example of an opening. The second insulating layer 17 is an example of a dielectric layer, and the second wiring layer 18 is an example of a ground conductor layer.
The flexible substrate 8 of the eighth embodiment has a stripline structure and has the same layer structure as each of the flexible substrates of the second, fourth, and sixth embodiments.
In the flexible substrate 8 of the eighth embodiment, as shown in FIG. 11, a signal line 13 having a predetermined width is formed in the second wiring layer 18, and the first wiring layer 16 and the third wiring layer 36 are formed. The ground layer 14 is formed. Further, in the flexible substrate 8 of the eighth embodiment, the position of the ground layer 14 formed in the first wiring layer 16 facing the signal line 13 via the second insulating layer 17 and the third wiring. A plurality of ground layer openings 14d opened in a parallel quadrilateral shape are provided at positions of the ground layer 14 formed in the layer 36 facing the signal line 13 via the third insulating layer 35.
The ground layer opening 14d has a width wider than the line width of the signal line 13, and a substantially central portion having a width wider than the line width of the signal line 13 forms the second insulating layer 17 and the third insulating layer 35. It is formed at a position facing substantially the center of the signal line 13 via the signal line 13. The ground layer openings 14d are formed at predetermined intervals in the wiring direction of the signal line 13. The ground layer opening 14d is an example of an opening. The second insulating layer 17 and the third insulating layer 35 are examples of the dielectric layer, and the first wiring layer 16 and the third wiring layer 36 are examples of the ground conductor layer.
Further, in the flexible substrate 7 of the seventh embodiment and the flexible substrate 8 of the eighth embodiment, the area of the ground layer opening 14d and the arrangement interval of the ground layer opening 14d are the same as those of the flexible substrates 1 to 6. And by changing the width of the signal line 13, the characteristic impedance of the signal line 13 is adjusted. As a result, the characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. Since the width of the signal line 13 can be increased, the width of the signal line 13 can be formed with high accuracy, and the characteristic impedance of the signal line 13 can be controlled with high accuracy.
12 (a) and 12 (b) show the flexible substrate 7 of the seventh embodiment and the flexible substrate 8 of the eighth embodiment via the second insulating layer 17 or the third insulating layer 35. , There is a plan view showing a state in which the ground layer opening 14d is formed so as to be displaced from the center of the signal line 13 to the left and right, and only the signal line 13 and the ground layer 14 are shown. FIG. 12 (a) shows a state in which the signal line 13 is shifted to the left with respect to each ground layer opening 14d, and FIG. 12 (b) shows a state in which the signal line 13 is shifted to the right with respect to each ground layer opening 14d. Indicates the state.
As shown in FIG. 12A, when the signal line 13 is formed so as to be shifted to the left side with respect to each ground layer opening 14d, it is located on the right side of each ground layer opening 14d as shown by arrow T2. The distance from the ground portion becomes longer and the degree of coupling becomes smaller, but the area of the portion overlapping the ground layer opening 14d shown in U2 decreases. Further, as shown by the arrow T1, the distance between the ground layer opening 14d located on the left side of each ground layer opening 14d becomes shorter and the degree of coupling increases, but the portion overlapping the ground layer opening 14d shown in U1 The area increases.
Further, as shown in FIG. 12B, when the signal line 13 is formed so as to be shifted to the right with respect to each ground layer opening 14d, as shown by arrow V2, it is formed on the right side of each ground layer opening 14d. The distance from the located ground portion becomes shorter and the degree of coupling increases, but the area of the portion overlapping the ground layer opening 14d shown in m2 increases. Further, as shown by the arrow V1, the distance between the ground layer opening 14d located on the left side of each ground layer opening 14d becomes longer and the degree of coupling becomes smaller, but the portion overlapping the ground layer opening 14d shown in m1 The area is reduced.
Therefore, in the flexible substrate 7 of the seventh embodiment and the flexible substrate 8 of the eighth embodiment, the signal line 13 and the ground layer opening 14d are formed so as to be offset from each other to the left and right. However, the degree of overall coupling between the signal line 13 and the ground layer 14 can be kept within a certain range, and the characteristic impedance value of the signal line 13 can be kept within a certain range.
Further, in the flexible substrate 7 of the seventh embodiment and the flexible substrate 8 of the eighth embodiment, the signal line 13 and each ground are changed by changing the shape of the parallelogram of each ground layer opening 14d. When the layer openings 14d are formed so as to be offset from each other to the left and right, the degree of overall coupling between the signal line 13 and the ground layer 14 can be finely adjusted, and the characteristic impedance value of the signal line 13 can be kept constant. It is possible to accurately keep the range within the range.
Further, the peripheral length of each ground layer opening 14d is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13.
In the flexible substrate 7 of the seventh embodiment and the flexible substrate 8 of the eighth embodiment shown in FIGS. 11 and 12, parallelogram ground layer openings 14d having the same shape are predetermined in the same orientation. It was configured to be arranged at intervals of. However, the parallelogram ground layer openings 14d having different left-right or vertical directions in FIGS. 11 and 12 may be alternately arranged at predetermined intervals.
<Operation Examples of Flexible Substrate in the 7th and 8th Embodiments> Next, operation examples of the flexible substrate 7 in the 7th embodiment and the flexible substrate 8 in the 8th embodiment will be described. In the flexible substrate 7 of the seventh embodiment and the flexible substrate 8 of the eighth embodiment, when a high frequency signal is transmitted to the signal line 13, the signal line 13 is shown by the arrow S1 in FIG. Current flows through. At this time, as shown by the arrow S2, the feedback current flows in the vicinity of the ground layer opening 14d of the ground layer 14. Therefore, since the length of the path of the signal current flowing through the signal line 13 and the path of the feedback current flowing through the ground layer 14 are substantially the same, the transmission loss of the signal current flowing through the signal line 13 can be reduced.
Further, in the flexible substrate 7 of the seventh embodiment and the flexible substrate 8 of the eighth embodiment, as described above, the signal line 13 is formed by changing the area and the arrangement interval of the ground layer opening 14d. The characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. As a result, the transmission loss of the signal current flowing through the signal line 13 can be reduced. As a result of reducing the transmission loss of the signal current flowing through the signal line 13, it is possible to use the flexible board 7 and the flexible board 8 having the signal line 13 for wiring over a longer distance.
Further, the peripheral length of each ground layer opening 14d is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13. Therefore, it is possible to prevent the feedback current flowing through the ground layer 14 from causing resonance at each ground layer opening 14d and adversely affecting the signal or the like transmitted through the signal line 13.
<Structure example of the flexible substrate of the 9th and 10th embodiments> FIG. 13 is a plan view showing the flexible substrate 9 of the 9th embodiment and the flexible substrate 10 of the 10th embodiment, and is a signal line. Only 13 and ground layer 14 are shown. In the flexible substrate 9 of the ninth embodiment and the flexible substrate 10 of the tenth embodiment, a differential signal is transmitted by two signal lines 13.
The cross-sectional shape of the flexible substrate 9 of the ninth embodiment around each signal line 13 in YY and ZZ of FIG. 13 is the same as that of the flexible substrate 3 of the third embodiment shown in FIG. The flexible substrate 9 of the ninth embodiment has a microstrip line structure, has the same layer structure as each of the flexible substrates of the first, third, fifth, and seventh embodiments, and has the same layer structure as the first wiring. A signal line 13 having a predetermined width is formed on the layer 16, and a ground layer 14 is formed on the second wiring layer 18.
In the flexible substrate 9 of the ninth embodiment, two rectangular portions are coupled to the ground layer 14 formed in the second wiring layer 18 at a position facing the signal line 13 via the second insulating layer 17. A plurality of ground layer openings 14e opened in a rectangular shape are provided. The two rectangular portions are located at positions facing each signal line 13 via the second insulating layer 17, one side direction of which is substantially orthogonal to the wiring direction of the signal line 13, and the wiring direction of the signal line 13. Each side substantially orthogonal to the signal line 13 is formed by being connected at a position facing the substantially central portion of the signal line 13 at a predetermined distance.
Further, the ground layer opening 14e is formed so that the rectangular portion located on one side is displaced forward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. Some of the rectangular portions located on the side of the signal line 13 are formed so as to be displaced rearward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. It is formed in a state where it is arranged at a predetermined interval. These two types of ground layer openings 14e are examples of a first second rectangular opening and a second second rectangular opening. The second insulating layer 17 is an example of a dielectric layer, and the second wiring layer 18 is an example of a ground conductor layer.
The cross-sectional shape of the flexible substrate 10 of the tenth embodiment around each signal line 13 in YY and ZZ of FIG. 13 is the same as that of the flexible substrate 4 of the fourth embodiment shown in FIG. The flexible substrate 10 of the tenth embodiment has a stripline structure, has the same layer structure as each of the flexible substrates of the second, fourth, sixth, and eighth embodiments, and has a second wiring layer. A signal line 13 having a predetermined width is formed in 18, and a ground layer 14 is formed in the first wiring layer 16 and the third wiring layer 36.
In the flexible substrate 10 of the tenth embodiment, the signal line 13 of the ground layer 14 formed in the first wiring layer 16 and the third wiring layer 36 is passed through the second insulating layer 17 and the third insulating layer 35. A plurality of ground layer openings 14e opened in a shape in which two rectangular portions are combined are provided at positions facing the above. The two rectangular portions are located at positions facing each signal line 13 via the second insulating layer 17, one side direction of which is substantially orthogonal to the wiring direction of the signal line 13, and the wiring direction of the signal line 13. Each side substantially orthogonal to the signal line 13 is formed by being connected at a position facing the substantially central portion of the signal line 13 at a predetermined distance.
Further, the ground layer opening 14e is formed so that the rectangular portion located on one side is displaced forward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. Some of the rectangular portions located on the side of the signal line 13 are formed so as to be displaced rearward along the wiring direction of the signal line 13 with respect to the rectangular portion located on the other side. It is formed in a state where it is arranged at a predetermined interval. These two types of ground layer openings 14e are examples of a first second rectangular opening and a second second rectangular opening. The second insulating layer 17 and the third insulating layer 35 are examples of the dielectric layer, and the first wiring layer 16 and the third wiring layer 36 are examples of the ground conductor layer.
Further, in the flexible substrate 9 of the ninth embodiment and the flexible substrate 10 of the tenth embodiment, the area of the ground layer opening 14e is the same as that of the flexible substrate of each of the first to eighth embodiments. The characteristic impedance of the signal line 13 is adjusted by changing the arrangement interval of the ground layer opening 14e and the width of the signal line 13. As a result, the characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. Since the width of the signal line 13 can be increased, the width of the signal line 13 can be formed with high accuracy, and the characteristic impedance of the signal line 13 can be controlled with high accuracy.
Further, in the flexible substrate 9 of the ninth embodiment and the flexible substrate 10 of the tenth embodiment, when the signal line 13 and the ground layer opening 14e are formed so as to be displaced from each other to the left and right, FIG. The state is the same as that of the flexible substrates 5 and 6 of the fifth and sixth embodiments shown.
Therefore, in the flexible substrate 9 of the ninth embodiment and the flexible substrate 10 of the tenth embodiment, the signal line 13 and each ground layer opening 16 are formed so as to be displaced from each other to the left and right. However, the degree of overall coupling between the signal line 13 and the ground layer 14 can be kept within a certain range, and the characteristic impedance value of the signal line 13 can be kept within a certain range.
Further, in the flexible substrate 9 and the flexible substrate 10, the length and signal of each side of the two rectangular portions of the ground layer opening 14e are the same as those of the flexible substrates 5 and 6 of the fifth and sixth embodiments. By changing the distance between each side that is substantially orthogonal to the wiring direction of the line 13 and the arrangement interval of each ground layer opening 14e, the signal line 13 and each ground layer opening 14e are displaced from each other to the left and right. The degree of overall coupling between the signal line 13 and the ground layer 14 when formed can be finely adjusted. Therefore, it is possible to accurately set the value of the characteristic impedance of the signal line 13 within a certain range.
Further, the peripheral length of each ground layer opening 14e is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13.
<Operation Example of Flexible Substrate in 9th and 10th Embodiments> Next, an operation example of the flexible substrate 9 in the 9th embodiment and the flexible substrate 10 in the 10th embodiment will be described. In the flexible substrate 9 and the flexible substrate 10, when a high-frequency signal is transmitted to the signal line 13, a current flows through the signal line 13 as shown by arrow a1 in FIG. At this time, as shown by the arrow a2, the feedback current flows in the vicinity of the ground layer opening 14e of the ground layer 14. Therefore, since the length of the path of the signal current flowing through the signal line 13 and the path of the feedback current flowing through the ground layer 14 are substantially the same, the transmission loss of the signal current flowing through the signal line 13 can be reduced.
Further, in the flexible substrate 9 and the flexible substrate 10, as described above, the characteristic impedance of the signal line 13 is set to a predetermined value by changing the area and the arrangement interval of the ground layer opening 14e, and the signal line 13 is set. Can be increased in width. As a result, the transmission loss of the signal current flowing through the signal line 13 can be reduced. As a result of reducing the transmission loss of the signal current flowing through the signal line 13, it is possible to use the flexible board 9 and the flexible board 10 having the signal line 13 for wiring over a longer distance.
Further, the peripheral length of each ground layer opening 14e is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13. Therefore, it is possible to prevent the feedback current flowing through the ground layer 14 from causing resonance at each ground layer opening 14e and adversely affecting the signal or the like transmitted through the signal line 13.
<Structure example of the flexible substrate of the eleventh and twelfth embodiments> FIG. 14 is a plan view showing the flexible substrate 11 of the eleventh embodiment and the flexible substrate 12 of the twelfth embodiment, and is a signal line. Only 13 and ground layer 14 are shown. FIG. 15 is an explanatory view showing a cross-sectional shape of the flexible substrate 11 according to the eleventh embodiment. FIG. 15 (a) shows a cross section b-b of FIG. 14, and FIG. 15 (b) shows a cross section of cc of FIG. FIG. 16 is an explanatory view showing a cross-sectional shape of the flexible substrate 10 according to the tenth embodiment. FIG. 16 (a) shows a cross section b-b of FIG. 14, and FIG. 16 (b) shows a cross section of cc of FIG.
In the flexible substrate 11 of the eleventh embodiment and the flexible substrate 12 of the twelfth embodiment, a differential signal is transmitted by two signal lines 13.
The flexible substrate 11 of the eleventh embodiment has a microstrip line structure. As shown in FIG. 15, the flexible substrate 11 of the eleventh embodiment has the first insulating layer 15 and the first wiring, similarly to the flexible substrates of the first, third, fifth, seventh, and ninth embodiments. The layer 16, the second insulating layer 17, the second wiring layer 18, and the third insulating layer 35 are formed by being laminated on the upper and lower sides, each insulating layer is formed of, for example, an epoxy resin, and each wiring layer is made of a metal such as CCL. Formed by a membrane.
In the flexible substrate 11 of the eleventh embodiment, as shown in FIGS. 14 and 15, a signal line 13 having a predetermined width is formed in the first wiring layer 16, and a ground layer 14 is formed in the second wiring layer 18. Is formed. Further, in the flexible substrate 11 of the eleventh embodiment, three rectangles of the ground layer 14 formed in the second wiring layer 18 are located at positions facing each signal line 13 via the second insulating layer 17. A plurality of ground layer openings 14f opened in a shape in which the portions are combined are provided.
The three rectangular portions are located at positions facing each signal line 13 via the second insulating layer 17, one side direction of which is substantially orthogonal to the wiring direction of each signal line 13, and the three rectangular portions of each signal line 13. At a position facing the substantially central portion, each side substantially orthogonal to the wiring direction of each signal line 13 is formed by being connected in a state of being separated by a predetermined distance.
Further, the ground layer opening 14f is formed so that each rectangular portion located at both ends is displaced forward by a predetermined distance along the wiring direction of the signal line 13 with respect to the rectangular portion located at the center, and both ends. The rectangular portions located in the above are alternately arranged so as to be displaced rearward by a predetermined distance along the wiring direction of the signal line 13 with respect to the rectangular portion located in the center. The ground layer opening 14f of each shape is an example of the first third rectangular opening and the second third rectangular opening. The second insulating layer 17 is an example of a dielectric layer, and the second wiring layer 18 is an example of a ground conductor layer.
The flexible substrate 12 of the twelfth embodiment has a stripline structure. As shown in FIG. 16, the flexible substrate 12 of the twelfth embodiment has the first insulating layer 15 and the first wiring, similarly to the flexible substrates of the second, fourth, sixth, eighth, and tenth embodiments. The layer 16, the second insulating layer 17, the second wiring layer 18, the third insulating layer 35, the third wiring layer 36, and the fourth insulating layer 37 are laminated on the upper and lower sides, and each insulating layer is made of, for example, an epoxy resin. It is formed, and each wiring layer is formed of a metal film such as CCL.
In the flexible substrate 12 of the twelfth embodiment, as shown in FIGS. 14 and 16, a signal line 13 having a predetermined width is formed in the second wiring layer 18, and the first wiring layer 16 and the third wiring are formed. A ground layer 14 is formed on the layer 36. Further, in the flexible substrate 12 of the twelfth embodiment, each of the ground layers 14 formed in the first wiring layer 16 and the third wiring layer 36 is passed through the second insulating layer 17 and the third insulating layer 35. A plurality of ground layer openings 14f opened in a shape in which three rectangular portions are combined are provided at positions facing the signal line 13.
The three rectangular portions are located at positions facing each signal line 13 via the second insulating layer 17 and the third insulating layer 35, and one side direction is substantially orthogonal to the wiring direction of each signal line 13 and At a position facing the substantially central portion of each signal line 13, each side substantially orthogonal to the wiring direction of each signal line 13 is formed by being connected in a state of being separated by a predetermined distance.
Further, the ground layer opening 14f is formed so that each rectangular portion located at both ends is displaced forward by a predetermined distance along the wiring direction of the signal line 13 with respect to the rectangular portion located at the center, and both ends. The rectangular portions located in the above are alternately arranged so as to be displaced rearward by a predetermined distance along the wiring direction of the signal line 13 with respect to the rectangular portion located in the center. The ground layer opening 14f of each shape is an example of the first third rectangular opening and the second third rectangular opening. The second insulating layer 17 and the third insulating layer 35 are examples of the dielectric layer, and the first wiring layer 16 and the third wiring layer 36 are examples of the ground conductor layer.
Further, in the flexible substrate 11 of the eleventh embodiment and the flexible substrate 12 of the twelfth embodiment, the area of the ground layer opening 14f is the same as that of each of the flexible substrates of the first to tenth embodiments. The characteristic impedance of the signal line 13 is adjusted by changing the arrangement interval of the ground layer opening 14f and the width of the signal line 13. As a result, the characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. Since the width of the signal line 13 can be increased, the width of the signal line 13 can be formed with high accuracy, and the characteristic impedance of the signal line 13 can be controlled with high accuracy.
17 (a) and 17 (b) show the flexible substrate 11 of the eleventh embodiment and the flexible substrate 12 of the twelfth embodiment via the second insulating layer 17 or the third insulating layer 35. , There is a plan view showing a state in which the joint portion of the two rectangular portions of the ground layer opening 14f is formed so as to be displaced from the center of the signal line 13 to the left and right, and only each signal line 13 and the ground layer 14 are shown. .. FIG. 17 (a) shows a state in which each signal line 13 is shifted to the left side with respect to each ground layer opening 14f, and FIG. 17 (b) shows a state in which each signal line 13 is shifted to the right side with respect to each ground layer opening 14f. It shows a shifted state.
As shown in FIG. 17A, when each signal line 13 is formed so as to be shifted to the left side with respect to each ground layer opening 14f, in the signal line A13a located on the left side, as shown by arrow e2, The distance between each ground layer opening 14f and the ground located on the right side becomes longer and the degree of coupling decreases, but the area of the portion overlapping the ground layer opening 14f shown in f2 decreases. Further, as shown by the arrow e1, the distance between the ground layer opening 14f and the ground portion located on the left side is shortened and the degree of coupling is increased, but the portion overlapping with the ground layer opening 14f shown in f1 is formed. The area increases.
In the signal line B13b located on the right side, as shown by arrow e3, the distance between each ground layer opening 14f and the ground portion located on the left side becomes shorter and the degree of coupling becomes smaller, but the ground shown in f3 The area of the part overlapping the layer opening 14f increases. Further, as shown by the arrow e4, the distance between the ground layer opening 14f located on the right side of each ground layer opening 14f becomes longer and the degree of coupling becomes smaller, but the portion overlapping the ground layer opening 14f shown in f4 The area is reduced.
As shown in FIG. 17 (b), even when each signal line 13 is formed so as to be shifted to the left side with respect to each ground layer opening 14f, the arrows g1 to g4 and h1 are formed in the signal line A13a and the signal line B13b. As shown in the portion overlapping the ground layer opening 14f of h4, the degree of coupling with the ground portion and the area of the portion overlapping the ground layer opening 14f increase or decrease.
Therefore, in the flexible substrate 11 and the flexible substrate 12, even when the signal line 13 and each ground layer opening 14f are formed so as to be displaced from each other to the left and right, the signal line 13 and the ground layer 14 as a whole are formed. The degree of coupling can be kept within a certain range, and the value of the characteristic impedance of the signal line 13 can be kept within a certain range.
Further, in the flexible substrate 11 and the flexible substrate 12, the length of each side of the three rectangular portions of each ground layer opening 14f, the distance between each side substantially orthogonal to the wiring direction of the signal line 13, and the distance between each side. The arrangement interval of each ground layer opening 14f can be changed. As a result, when the signal line 13 and each ground layer opening 14f are formed so as to be offset from each other to the left and right, the degree of overall coupling between the signal line 13 and the ground layer 14 can be finely adjusted, and the signal line can be finely adjusted. It is possible to accurately set the value of the characteristic impedance of 13 within a certain range.
Further, the flexible substrate 11 and the flexible substrate 12 need to be arranged so that the two signal lines 13 capable of transmitting the differential signal are closer to each other as compared with the flexible substrates of the ninth and tenth embodiments. It can be applied in some cases.
Further, the peripheral length of each ground layer opening 14f is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13.
<Operation Example of Flexible Substrate in 11th and 12th Embodiments> Next, an operation example of the flexible substrate 11 in the 11th embodiment and the flexible substrate 12 in the 12th embodiment will be described. In the flexible substrate 11 of the eleventh embodiment and the flexible substrate 12 of the twelfth embodiment, when a high frequency signal is transmitted to the signal line 13, each signal line is shown by arrow d1 in FIG. Current flows through 13. At this time, as shown by the arrow d2, the feedback current flows in the vicinity of the ground layer opening 14f of the ground layer 14. Therefore, since the length of the path of the signal current flowing through the signal line 13 and the path of the feedback current flowing through the ground layer 14 are substantially the same, the transmission loss of the signal current flowing through the signal line 13 can be reduced.
Further, in the flexible substrate 11 of the eleventh embodiment and the flexible substrate 12 of the twelfth embodiment, as described above, the signal line 13 is formed by changing the area and the arrangement interval of the ground layer opening 14f. The characteristic impedance of the signal line 13 can be set to a predetermined value, and the width of the signal line 13 can be increased. As a result, the transmission loss of the signal current flowing through the signal line 13 can be reduced. As a result of reducing the transmission loss of the signal current flowing through the signal line 13, it is possible to use the flexible board 11 and the flexible board 12 having the signal line 13 for wiring over a longer distance.
Further, the peripheral length of each ground layer opening 14f is formed to be shorter than 1/2 wavelength of the maximum frequency of the signal transmitted on the signal line 13. Therefore, it is possible to prevent the feedback current flowing through the ground layer 14 from causing resonance at each ground layer opening 14f and adversely affecting the signal or the like transmitted through the signal line 13.
FIG. 18 shows, when the flexible substrate 11 of the eleventh embodiment is applied, when the ground layer is formed in a mesh shape as shown in FIG. 26 and when the ground layer is formed in a solid shape, at each frequency. It is a figure which shows the measurement result of the transmission loss of the signal current on a signal line 13. i1 shows the case where the flexible substrate 11 of the eleventh embodiment is applied, i2 shows the transmission loss when the ground layer is formed in a mesh shape, and i3 shows the transmission loss when the ground layer is formed in a solid shape. Is shown.
The dimensions of each part of the microstrip line structure in each measurement result are as follows. The height of the first wiring layer 16 and the second wiring layer 18 is 18 μm, the height of the first insulating layer 15 and the third insulating layer is 20 μm, and the height of the second insulating layer 17 is 50 μm. The width of the signal line when the flexible substrate 11 of the eleventh embodiment is applied is 200 μm, the width of the signal line when the ground layer is formed in a mesh shape is 200 μm, and the ground layer is formed in a solid shape. The width of the signal line is 100 μm. Further, when the flexible substrate 11 of the eleventh embodiment is applied, the length of L1 shown in FIG. 14 is 700 μm, the length of L2 is 75 μm, the length of L3 is 250 μm, and the length of L4 is 1 mm. is there.
Further, in each measurement result, the value of the relative permittivity of the first insulating layer 15, the second insulating layer 17 and the third insulating layer 35 is 3.3, and the value of tan δ is 0.005. Moreover, in each measurement result, the length of the signal line is formed to be 20 mm, and the value of the characteristic impedance is controlled to 100 Ω.
As shown in FIG. 18, when the flexible substrate 11 of the eleventh embodiment is applied, the ground layer is formed in a mesh shape and the ground layer is formed in a solid shape even in a high frequency region. It can be confirmed that the transmission loss is small in comparison.
Further, in each of the flexible substrates of the first to twelfth embodiments, more metal portions of each ground layer can be formed as compared with the case where the ground layer is formed in a mesh shape, so that the bending strength can be increased. Can be strengthened.
Next, as an embodiment of the optical transmission / reception module and the optical transmission / reception device according to the present invention, an optical transmission / reception module and a network card using each flexible substrate of the first to eighth embodiments will be described.
<Example of Configuration of Optical Transmission / Transmission Module and Network Card of the Present Embodiment> FIGS. 19 to 24 are explanatory views showing the configuration of the optical transmission / reception module 19 and the network card 20 of the present embodiment. FIG. 19 is a plan view showing an outline of a first example of the optical transmission / reception module 19 and the network card 20 of the present embodiment, and FIG. 20 is a first view of the optical transmission / reception module 19 and the network card 20 of the present embodiment. It is sectional drawing which shows the outline of an example. FIG. 21 is a plan view showing an outline of a second example of the optical transmission / reception module 19 and the network card 20, and FIG. 22 is a cross-sectional view showing an outline of the second example of the optical transmission / reception module 19 and the network card 20. FIG. 23 is a plan view showing an outline of a third example of the optical transmission / reception module 19 and the network card 20, and FIG. 24 is a cross-sectional view showing an outline of the third example of the optical transmission / reception module 19 and the network card 20. In FIGS. 20, 22 and 24, the bezel 24 described later is not shown.
The network card 20 of the present embodiment includes an optical transmission / reception module 19, is mounted in an expansion slot of a personal computer or the like, and communicates with an external information communication device or the like through an optical cable connected to an optical cable connection connector 33 described later. It enables the transmission and reception of data. The optical transmission / reception module 19 and the network card 20 have the following configurations, for example.
As shown in FIGS. 19 to 24, the network card 20 includes an optical transmission / reception module 19 having an optical cable connection connector 33, an FPC (Flexible Printed Circuit) 21 for connecting an optical transmission / reception board, a host board 23 having an optical transmission / reception circuit unit B22, and the like. It is configured with a bezel 24 attached to the end of the host board 23. The optical transmission / reception module 19 is attached to the host board 23 so that the optical cable connection connector 33 protrudes from the bezel 24. Further, the host board 23 has a card edge portion 25, and the network card 20 can be mounted in an expansion slot of a personal computer or the like at the card edge portion 25.
The optical transmission / reception module 19 includes an optical transmission / reception module housing 26, TOSA27, ROSA28, a TOSA connection FPC30, a ROSA connection FPC29, and an optical transmission / reception board 32 having an optical transmission / reception circuit unit A31.
The TOSA 27 and ROSA 28 are arranged side by side at positions corresponding to the optical cable connection connector 33 of the optical transmission / reception module housing 26. The TOSA (Transmitter Optical Sub-Assembly) 27 is an optical device for transmission equipped with a laser diode or the like, and has an interface to the connector of the optical cable connected to the optical cable connection connector 33. TOSA27 is an example of an optical transmission module. The ROSA (Receiver Optical Sub-Assembly) 28 is an optical device for reception equipped with a photodiode or the like, and has an interface to the connector of the optical cable connected to the optical cable connection connector 33. ROSA28 is an example of an optical receiver module.
The TOSA 27 and ROSA 28 are connected to the optical transmission / reception board 32 by the TOSA connection FPC30 and the ROSA connection FPC29, respectively. To the TOSA connection FPC30 and the ROSA connection FPC29, the flexible substrates of the first to twelfth embodiments described with reference to FIGS. 1 to 17, respectively, are applied.
The optical transmission / reception board 32 is composed of a rigid board, and includes an optical transmission / reception circuit unit A31 connected to TOSA27 and ROSA28 via a TOSA connection FPC30 and a ROSA connection FPC29. The optical transmission / reception circuit unit A31 is provided with, for example, a drive circuit for a laser diode of TOSA27, a post-amplifier circuit for a signal received by a photodiode of ROSA28, and the like.
The optical transmission / reception board 32 is connected to the host board 23 via the optical transmission / reception board connection FPC 21. As a result, each circuit of the optical transmission / reception circuit unit A31 is connected to each circuit of the optical transmission / reception circuit unit B22 via the optical transmission / reception board connection FPC21. As the FPC21 for connecting the optical transmission / reception board, the flexible substrates of the first to twelfth embodiments described with reference to FIGS. 1 to 17 are applied. The optical transmission / reception circuit unit B22 is provided with, for example, a chip for PHY (Physical layer), a chip for MAC (Media Access Control), and the like. The optical transmission / reception board 32 is an example of an optical transmission / reception circuit board, and the host board 23 is an example of a parent board.
In the optical transmission / reception module 19 and the network card 20 of the first example shown in FIGS. 19 and 20, the TOSA connection FPC30, the ROSA connection FPC29, the optical transmission / reception board connection FPC21 and the optical transmission / reception board 32 are composed of a flex rigid board. ing. This eliminates the need for soldering work during manufacturing, as compared with a configuration in which each flexible board of the TOSA connection FPC30, the ROSA connection FPC29, and the optical transmission / reception board connection FPC21 is soldered to the optical transmission / reception board 32. Therefore, the manufacturing work time can be shortened, and further, it is possible to prevent the occurrence of manufacturing defects due to adverse effects on the surrounding parts due to the soldering work defects and the heat during the soldering operations.
As shown in u of FIGS. 21 and 22, the optical transmission / reception module 19 and the network card 20 of the second example shown in FIGS. 21 and 22 are FPC30 for TOSA connection, FPC29 for ROSA connection, and FPC21 for optical transmission / reception board connection. Each flexible board is soldered to the optical transmission / reception board 32. As a result, as shown in FIGS. 19 and 20, each board is compared with the case where the TOSA connection FPC30, the ROSA connection FPC29, the optical transmission / reception board connection FPC21 and the optical transmission / reception board 32 are composed of a flex rigid board. Can be manufactured separately. Therefore, each substrate can be manufactured at low cost. Further, since each board is manufactured separately, for example, even if the design change occurs only in the FPC21 for connecting the optical transmission / reception board, only the manufacturing process of the FPC21 for connecting the optical transmission / reception board needs to be changed, and the influence of the design change. Can be suppressed to a small range.
Further, in the optical transmission / reception module 19 and the network card 20 of the first and second examples shown in FIGS. 19 to 22, the optical transmission / reception board connection FPC21 is soldered to the host board 23 as shown in t. As a result, the number of parts can be reduced and the cost can be reduced as compared with the case where the FPC 21 for connecting the optical transmission / reception board and the host board 23 are connected by a connector.
Further, in the optical transmission / reception module 19 and the network card 20 of the third example shown in FIGS. 23 and 24, the optical transmission / reception board connection FPC 21 is connected by the FPC connector 34 provided on the host board 23. As a result, as shown in FIGS. 19 to 22, the FPC21 for connecting the optical transmission / reception board can be easily attached to the host board 23 as compared with the configuration in which the FPC21 for connecting the optical transmission / reception board is soldered to the host board 23. It becomes possible to do.
Further, in the optical transmission / reception module 19 and the network card 20 of the present embodiment described with reference to FIGS. 19 to 24, the TOSA27, ROSA28, the optical transmission / reception board 32 and the host board 23 are connected by a flexible board. Thereby, the arrangement of each member can be changed within the length range of each flexible substrate. For example, the optical transmission / reception module housing to which the optical transmission / reception board 32 is attached after each member is connected by the flexible substrate. It is possible to adjust the position so that the end face of the bezel 24 is aligned with the position of the bezel 24.
Further, in the optical transmission / reception module 19 and the network card 20 of the present embodiment described with reference to FIGS. 19 to 24, a part of each module and circuit for performing optical transmission / reception is configured as an optical transmission / reception module. This makes it possible to standardize the specifications of the optical transmission / reception module with the optical transmission / reception device such as another network card, and to use the optical transmission / reception module having the same specifications as the optical transmission / reception device such as another network card. This makes it possible to reduce design and manufacturing costs.
<Operation Example of Optical Transmission / Transmission Module and Network Card of the Present Embodiment> Next, an operation example of the optical transmission / reception module 19 and the network card 20 described with reference to FIGS. 19 to 24 will be described. The optical transmission / reception module 19 and the network card 20 are mounted in an expansion slot of a personal computer or the like, and data is transmitted / received to / from an external information / communication device or the like through an optical cable connected to the optical cable connection connector 33 as shown below. ..
Data is transmitted to an external information communication device or the like as follows. Information necessary for data transmission is input to the optical transmission / reception circuit unit B22 as an electric signal via the card edge unit 25 connected to an expansion slot of a personal computer or the like. The information required for data transmission input to the optical transmission / reception circuit unit B22 is processed by the MAC chip, PHY chip, etc., and is processed by the optical transmission / reception circuit unit on the optical transmission / reception board 32 via the optical transmission / reception board connection FPC21. It is input to A31 as an electric signal. After that, based on the information input to the optical transmission / reception circuit unit A31, the laser diode of TOSA27 is driven via the FPC30 for TOSA connection, and data is transmitted as an optical signal to an external information communication device through an optical cable. ..
Data is received from an external information communication device or the like as follows. Data from an external information communication device is input to the photodiode of ROSA28 as an optical signal through an optical cable. The optical signal input to the photodiode of ROSA28 is converted into an electric signal and input to the optical transmission / reception circuit unit A31 on the optical transmission / reception board 32 via the ROSA connection FPC29. The signal input to the optical transmission / reception circuit unit A31 is processed by a post-amplifier circuit or the like, and then input as an electric signal to the optical transmission / reception circuit unit B22 on the host board 23 via the optical transmission / reception board connection FPC21. The signal input to the optical transmission / reception circuit unit B22 is processed by the PHY chip, the MAC chip, and the like, and is output as received data to the personal computer and the like via the card edge unit 25.
Further, as described above, when data is transmitted / received to / from an external information / communication device through an optical cable, the signal lines of the flexible boards of the TOSA connection FPC30, the ROSA connection FPC29, and the optical transmission / reception board connection FPC21 are used. High frequency signals are transmitted. For example, when high-speed serial data transmission such as 10 Gbit / s is performed, it is necessary to support high-frequency signals exceeding 10 GHz.
In the optical transmission / reception module 19 and the network card 20 of the present embodiment, the first to first flexible boards shown in FIGS. 1 to 17 are attached to the flexible boards of the TOSA connection FPC30, the ROSA connection FPC29, and the optical transmission / reception board connection FPC21. The flexible substrate of 12 embodiments is applied. This enables high-quality signal transmission even when high-frequency signals are transmitted to each signal line of the flexible board by transmitting and receiving high-speed data, enabling stable data transmission and reception. Become.
Further, in the flexible substrate of the first to twelfth embodiments, the transmission loss of the signal current can be reduced, and the signal line of the wiring of a longer distance can be used. Therefore, in the optical transmission / reception module 19 and the network card 20 of the present embodiment, it is possible to use longer flexible boards of the TOSA connection FPC30, the ROSA connection FPC29, and the optical transmission / reception board connection FPC21. Become. As a result, the TOSA27, ROSA28, optical transmission / reception board 32, and host board 23 can be arranged more freely.
The present invention is applied to a flexible substrate having a microstrip line or a strip line structure, and an optical transmission / reception module and an optical transmission / reception device provided with this flexible substrate.
<figref num="1">It is a top view of the flexible substrate of the 1st and 2nd embodiments.</figref><figref num="2">It is sectional drawing of the microstrip line structure of 1st Embodiment.</figref><figref num="3">It is sectional drawing of the stripline structure of 2nd Embodiment.</figref><figref num="4">It is a top view of the flexible substrate of the 1st and 2nd embodiments.</figref><figref num="5">It is a top view of the flexible substrate of the 3rd and 4th embodiments.</figref><figref num="6">It is sectional drawing of the microstrip line structure of 3rd Embodiment.</figref><figref num="7">It is sectional drawing of the stripline structure of 4th Embodiment.</figref><figref num="8">It is a top view of the flexible substrate of the 3rd and 4th embodiments.</figref><figref num="9">It is a top view of the flexible substrate of the 5th and 6th embodiments.</figref><figref num="10">It is a top view of the flexible substrate of the 5th and 6th embodiments.</figref><figref num="11">It is a top view of the flexible substrate of the 7th and 8th embodiments.</figref><figref num="12">It is a top view of the flexible substrate of the 7th and 8th embodiments.</figref><figref num="13">It is a top view of the flexible substrate of the 9th and 10th embodiments.</figref><figref num="14">It is a top view of the flexible substrate of the eleventh and twelfth embodiments.</figref><figref num="15">It is sectional drawing of the microstrip line structure of 11th Embodiment.</figref><figref num="16">It is sectional drawing of the stripline structure of the twelfth embodiment.</figref><figref num="17">It is a top view of the flexible substrate of the eleventh and twelfth embodiments.</figref><figref num="18">This is the measurement result of transmission loss.</figref><figref num="19">It is a top view of the optical transmission / reception module and the network card of the first example.</figref><figref num="20">It is sectional drawing of the optical transmission / reception module and the network card of the 1st example.</figref><figref num="21">It is a top view of the optical transmission / reception module and the network card of the 2nd example.</figref><figref num="22">It is sectional drawing of the optical transmission / reception module and the network card of the 2nd example.</figref><figref num="23">It is a top view of the optical transmission / reception module and the network card of the 3rd example.</figref><figref num="24">It is sectional drawing of the optical transmission / reception module and the network card of the 3rd example.</figref><figref num="25">It is a block diagram of a microstrip line / strip line.</figref><figref num="26">It is a top view when the ground layer is formed in a mesh shape.</figref><figref num="27">This is the measurement result of transmission loss.</figref>
Code description
1 ... Flexible board, 2 ... Flexible board, 3 ... Flexible board, 4 ... Flexible board, 5 ... Flexible board, 6 ... Flexible board, 7 ... Flexible board, 8 Flexible board, 9 Flexible board, 10 Flexible board, 11 Flexible board, 12 Flexible board, 13 Signal line, 14 Ground layer, 14a Grand layer opening, 14b ground layer opening, 14c ground layer opening, 14d ground layer opening, 14e ground layer opening, 14f ground layer opening Department, 19 ... Optical transmission / reception module, 21 ... Optical transmission / reception board connection FPC, 23 ... Host board, 27 ... TOSA, 28 ... ROSA, 29 ... ROSA connection FPC, 30 FPC for TOSA connection, 32 Optical transmission / reception board
28 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13 Sheet 14 Sheet 15 Sheet 16 Sheet 17 Sheet 18 Sheet 19 Sheet 20 Sheet 21 Sheet 22 Sheet 23 Sheet 24 Sheet 25 Sheet 26 Sheet 27 Sheet 28
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2 priority claims, no other members on record
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 2005317100 | Japan | A | |
| JP20050317100 | – | – | – |
Numbers
- Publication
- 2007123740
- Publication, DOCDB
- 2007123740
- Publication, EPODOC
- JP2007123740
- Application
- 317100
- Application, DOCDB
- 2005317100
- Application, EPODOC
- JP20050317100
Titles3
- English
- FLEXIBLE BOARD, OPTICAL TRANSMISSION/RECEPTION MODULE AND OPTICAL TRANSMISSION/RECEPTION DEVICE
- Japanese
- フレキシブル基板、光送受信モジュール及び光送受信装置
- English
- Flexible board, optical transmitter / receiver module and optical transmitter / receiver
Classification
- CPC, 4
- H05K1/0225
- H05K1/0221
- H05K1/0393
- H05K2201/09681
- IPC, 12
- H05K1 02
- H01P3 08
- H04B10 40
- H04B10 50
- H04B10 60
- H04B10 66
- H05K1 14
- H04B10 04
- H04B10 06
- H04B10 14
- H04B10 26
- H04B10 28