Jig with adhesive force for fixing wiring board adjusted by adhesive attached in mesh structure or in regularly arranged dot structure

The present invention is a production line for mounting components such as electronic components on a thin printed wiring board or a fine printed wiring board, for example, a wiring board such as an FPC (flexible printed wiring board), for fixing the wiring board. It relates to a jig or a carrier when carrying such a wiring board. In the present specification, the wiring board is used to include a non-plate-shaped wiring board, and is synonymous with the wiring board.

Japanese Patent Application Laid-Open No. 07-022795 (final disposal: decision of refusal) is a fixing jig used in the process of mounting electronic components on a thin substrate, including the cream solder printing process, electronic component mounting process, reflow soldering process, cutting process, etc. The jig is disclosed, and it is proposed to fix the FPC board by providing an adhesive silicone rubber layer on the flat plate instead of sticking the printed circuit board on the metal flat plate with heat-resistant tape. We are trying to solve the problem of adapting to mass production instead of production, and short-circuiting the circuit due to a bridge between the lead wires of the LSI during solder reflow. Preferred raw material compositions are addition-curable liquid silicone rubber compositions, among which A) an alkenyl group-containing organopolysiloxane containing an average of 0.5 or more alkenyl groups in one molecule, and B) a silicon atom in one molecule. Organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to, and a molar of C) a platinum group metal-based catalyst, B) a hydrosilyl group contained in the component, and A) an alkenyl group contained in the component. Those with a ratio of 0.1 / 1 to 1.5 / 1 are listed. Specifically, SUS A 5 wt% toluene solution of γ-glycidoxypropyltrimethoxysilane is applied as a primer on the surface of a metal plate, and after air-drying at room temperature for 30 minutes, the above silicone rubber composition is subjected to a bar coating method to a thickness of 250 μm. It is coated evenly and heated in a hot air dryer at 150 ° C for 30 minutes to cure the silicone rubber to create a fixing jig for thin substrates.

Japanese Patent Application Laid-Open No. 07-074497 (final disposal: withdrawal due to unrequested application examination) states that "the FPC is adhered to a group of flexible printed wiring boards (hereinafter referred to as FPCs) arranged on a slightly adhesive base sheet. "Temporary adhesive FPC, which is characterized by pre-drilling a predetermined position of the slightly adhesive base sheet to be formed." And "Using a pin jig having a convex portion corresponding to the perforation of the pre-drilled slightly adhesive base sheet." A method for handling an FPC, which comprises removing the FPC temporarily adhered to the slightly adhesive base sheet from the sheet.

Patent No. 3328248 (see also Japanese Patent Application Laid-Open No. 2001-144430) forms a counterbore portion in the center of the surface of a jig base made of a plate body, and an adhesive resin is applied to this counterbore portion to make it possible to peel off a printed wiring board. A jig for mounting a printed wiring board, which is characterized by forming a weakly adhesive adhesive layer for sticking, is disclosed.

<patcit num="1"><text>Japanese Patent Application Laid-Open No. 07-022795</text></patcit><patcit num="2"><text>Japanese Patent Application Laid-Open No. 07-074497</text></patcit><patcit num="3"><text>Patent No. 3328248</text></patcit>

<p> The adhesive strength of conventional jigs with a layer of adhesive cannot be adjusted, or the adhesive strength can only be adjusted by changing the type of adhesive, such as by finely adjusting the curing agent during the manufacture of the adhesive. could not.</p><p> However, in the case of a jig that fixes a substrate with an adhesive, a flat, thin and brittle substrate or a thin and weak substrate will be peeled off from the substrate if it is attached to the jig with too strong adhesive force. Things can be difficult. On the other hand, depending on the object, it may be required that the adhesive of the jig is hard to peel off, such as being exposed to a strong fluid flow or the like. By adjusting the amount of the curing agent for reducing the adhesive force in the pressure-sensitive adhesive, although rough adjustment is possible, it is extremely difficult to meet the above-mentioned wide variety of demands.</p>

<p> In order to solve this problem, the present inventors have made various ingenuity and conducted research. As a result, the present inventor has discovered that the above problems can be solved by the following configuration, and has completed the present invention. 1. In a jig or transport carrier that fixes a certain number of wiring substrates of 1 or more by the adhesive force of the fixing surface of the jig or transport carrier, on the fixing surface of the jig or transport carrier. In order to adjust the abundance of adhesive per unit area of a certain thickness to adjust the adhesive strength, the adhesive is applied in a mesh pattern or regularly arranged dots to give a specific adhesive part / non-adhesive part ratio. A jig or a carrier for carrying, which is characterized by being attached. 2. The mesh-like or regularly arranged dot-like adhesive is applied only to the position of the fixing surface that should be in contact with the bottom of the wiring substrate, and is applied to the position other than the fixing surface position on one surface of the jig or the transport carrier. The jig or transport carrier according to 1 above, which is not attached. 3. The mesh-like or regularly arranged dot-like adhesive is applied to the entire surface of the jig or the transport carrier, and the fixed surface position to be in contact with the bottom of the wiring substrate on one surface of the jig or the transport carrier. The jig or transport carrier according to 1 above, which is covered with a plate other than the above. 4. The mesh-like or regularly arranged dot-like adhesive is applied to the entire surface of the jig or transport carrier, and is fixed to be in contact with the bottom of the wiring substrate on one surface of the jig or transport carrier. The jig or transport carrier according to 1 above, wherein the anti-adhesion paint is applied to at least a part of the jig or the carrier other than the surface position. Five. In the method of adjusting the adhesive force when the object to be fixed is fixed to a jig or a carrier by the adhesive force of the surface in contact with the object to be fixed, a mesh having various hole / non-hole area ratios. A mesh-like mask having a specific hole / non-hole area ratio is selected from the group of masks, and an adhesive is applied to the fixing surface of a jig or a transport carrier through the selected mask. A method for adjusting adhesive strength, which comprises providing an adhesive portion and a non-adhesive portion having the specific area ratio in a mesh-like or regularly arranged dot-like shape on a surface. In this specification, the "jig or / or carrier for transport" may be simply referred to as a jig.</p><p> The adhesive used in the jig for holding the wiring substrate by adhesive force may be any known adhesive, and examples thereof include a weakly adhesive adhesive, for example, a silicone resin. Examples of silicone resins include GE Toshiba Silicone (trade name) YR3286 and TSE1512.</p><p> On the other hand, the method of applying the adhesive in a mesh or regularly arranged dots is carried out by various printing methods such as extruding the adhesive through a mesh mask that gives a desired adhesive / non-adhesive ratio. Can be done.</p><p> The wiring board can be a flexible printed wiring board, a thin printed wiring board, a wiring board in the shape of a fine cube, or the like.</p><p> When the wiring substrate is set on the jig, it can be performed by using any known positioning means such as using pins, holes, or the like for matching. For example, as shown in FIG. 3, the support plate 5 is set through the reference pin 8 and the positioning pin 7 provided in the position setting pin jig 6 through the support plate 5 having the reference hole 9 and the positioning hole 10. The substrate 4 is overlapped with 6 through the positioning hole 11 of the substrate 4 with the mounting surface down, and the substrate 4 is overlapped with them, and further adhered through the positioning hole 12 of the jig or the transport carrier 1 of the present invention with the adhesive surface down. The adhesive surface of the agent layer 2 is attached to the back surface of the substrate 4 facing upward. Next, remove only the setting pin jig 6, flip the support plate 5, the substrate 4, the jig of the present invention or the transport carrier 1, and peel off the support plate 4 to set the wiring board 4 on the jig 1. it can.</p>

<p> The effects of the present invention are as follows. 1. If you prepare masks that give several different adhesive / non-adhesive ratios, you can use one of them to apply the adhesive to the jig to create a jig with the desired adhesive strength. I'm ready. 2. It is possible to finely adjust the adhesive strength according to the type of substrate. 3. Since only a specific adhesive needs to be used, there is no need to worry about inventory adjustment of various adhesives. 4. Since it is not necessary to add a component that reduces the adhesive force to the adhesive, the adhesive can be used efficiently by utilizing its maximum adhesive force. In addition, the amount of adhesive used can be small. Therefore, the cost can be suppressed.</p>

The present invention will be described below with reference to the drawings. FIG. 1 shows a jig 1 on which a substrate 4 fixed by a regularly arranged dot-shaped adhesive 2 is placed. The amount of adhesive present per unit area is different between (A) and (B) in Fig. 1, and the number of adhesive points in (B) is doubled as shown in the figure in both the vertical and horizontal directions. If it appears, the adhesive strength of (A) is 1/4 of the adhesive strength of (B) if the same type of adhesive having the same thickness is used. FIG. 2 shows a perspective view of the jig 1 having the adhesive 2 fixing the substrate 4. In addition, in FIG. 4, an example in which the fixing surface other than the position of the fixing surface to be in contact with the bottom of the wiring substrate is covered with a plate, the fixing surface other than the position of the fixing surface to be in contact with the bottom of the wiring substrate is at least one. Figure 5 shows an example in which the anti-adhesion paint is applied to the part.

The present invention has industrial applicability as a jig or as a carrier for transportation. The jig is useful when fixing the substrate, for example, when soldering an electronic component to a flexible printed wiring board, when placing cream solder on the substrate through a metal mask, and the like.

<figref num="1">FIG. 5 is a cross-sectional view showing the jig of the present invention in which the substrate is fixed at a small number of points (A) with a small amount of adhesive and a large number of points (B) with a large amount of adhesive.</figref><figref num="2">A perspective view of a jig having a regularly arranged dot-shaped adhesive that fixes a substrate.</figref><figref num="3">FIG. 3 is an explanatory view showing the process of the method of aligning the substrate with the jig of the present invention in a perspective view.</figref><figref num="4">FIG. 4 is a cross-sectional view showing an example in which the fixing surface is covered with a plate other than the position of the fixing surface to be in contact with the bottom of the wiring substrate.</figref><figref num="5">FIG. 5 is a cross-sectional view showing an example in which at least a part of the fixing surface other than the position of the fixing surface to be in contact with the bottom of the wiring substrate is coated with the anti-adhesion paint.</figref>

Code description

1 Jig or transport carrier 2 Adhesive 4 Substrate