Grinder

【0001】

[Technical field to which the invention belongs]

The present invention relates to a grinder.

【0002】

[Conventional technology]

The crusher that adopts the mortar principle has two upper and lower grindstones that can adjust the mutual spacing, and generates strong centrifugal force, impact grinding force, and shear between the fixed grindstone and the high-speed rotating grindstone. It is pulverized by the combined action of them. Examples of such a rotary grindstone, a fixed grindstone, and a grindstone using the rotary grindstone and a grindstone using the rotary grindstone and a fixed grindstone include those shown in Patent Documents 1 to 5 below.

【0003】

[Patent Document 1]

Design Registration No. 655304 [0004]

[Patent Document 2]

Design Registration No. 845632 [0005]

[Patent Document 3]

Special Publication No. 62-51658 [0006]

[Patent Document 4]

Special Fairness No. 3-1061 [0007]

[Patent Document 5]

Special Fair 4-55830 Gazette [0008]

Here, the rotary grindstone and the fixed grindstone are generally called grinders, and the particle size thereof is usually about 16 #, 24 # to 120 #, 240 #. Although these grinders have different particle sizes, irregularities are formed on the surface, and when the hardness of the object to be crushed is high, the protrusions are peeled off or worn, and there is a problem of foreign matter being mixed.

【0009】

On the other hand, in the grinding device shown in Patent Document 6 below, it has been reported that injected fuel, soymilk soybean, etc. are ground into fine particles of about 1 to 5 μm, but at present, ultrafine particles of 1 μm or less are used. Cannot be obtained.

【0010】

[Patent Document 6]

Tokukousho 62-51658 [0011]

Further, in the following Patent Document 7, in the fine pulverization of substances containing a large amount of high lipids, high water content, high proteins, sugars and special enzymes, the peculiar physical properties of the substances to be pulverized are exhibited. Therefore, it was impossible to commercialize it as a powder due to changes in physical properties due to stickiness, stickiness, scorching, film formation, etc. due to frictional heat, but when the peripheral speed of the rotary grindstone exceeds a certain line, it suddenly becomes It has been reported that the crushing ability improves and the temperature rise due to frictional heat also decreases. However, at a peripheral speed of 3422 m / min, it is also reported that there are problems in mechanical cost and mechanical safety.

【0012】

[Patent Document 7]

Japanese Patent Application Laid-Open No. 7-185372 [0013]

Further, in the following Patent Document 8, a method for automatically controlling the clearance between the rotary grindstone and the fixed grindstone is reported. In this method, mechanical heat generation is generated due to high-speed rotation, and thermal expansion of the drive shaft and the core of the rotary grindstone are generated. Since there is no shock absorber such as runout, the minimum clearance is several tens of μm or more.

【0014】

[Patent Document 8]

Japanese Patent Application Laid-Open No. 8-1020 [0015]

Next, Patent Document 9 below reports an invention useful for wet (liquid) pulverization, dispersion, and emulsification of a fluid to be treated, which is a fluid that applies a predetermined pressure to the fluid to be treated. A pressure applying mechanism and head pressure are required.

【0016】

[Patent Document 9]

Japanese Patent Application No. 2002-207533 [0017]

After all, in each of the conventional devices described above, it is not possible to realize that the clearance between the upper and lower grindstones (polishing members) is 15 μm or less when the raw material to be pulverized is charged under atmospheric pressure. That is, it is not possible to secure the above-mentioned minute clearance suitable for fine grinding and crushing between the grindstones by the conventional mechanical means. On the other hand, in the case of grinding or crushing using a mill, foreign matter (foreign matter generated by scraping between mills or between the mill and others) is mixed, and for safety, high speed rotation is possible. There was no high-performance pulverizer.

【0018】

[Problems to be Solved by the Invention]

The present invention has been made based on the above circumstances, and provides a grinder that realizes ultrafine pulverization that is absolutely necessary for the recent development of nanotechnology. That is, a grinder that can perform ultra-fine crushing with high accuracy, does not contain foreign matter, has a simple structure, is highly safe, and can be manufactured at low cost, that is, a grindstone that grinds the object to be crushed between grindstones and keeps the particle size constant. We will solve the above problems by providing a grindstone that enables fine pulverization of micron or less and has a wide range of adaptability and physical properties of the object to be crushed.

【0019】

[Means for solving problems]

The grinder according to the first invention of the present application is arranged so as to face each other, and at least one of them rotates with respect to the other to grind and grind, and at least two polishing members, the first and the second. Regarding those provided with 1 and 2, a fluid is supplied between the two polishing members 1 and 2 from the center side of the rotation, and the fluid is discharged to the outside of the first and second polishing members 1 and 2, as follows. Take the composition of. That is, at least one of the first and second polishing members 1 and 2 is arranged so as to be close to and separated from the other. Then, this grinder includes an urging mechanism 3 that acts in a direction in which both polishing members 1 and 2 are brought close to each other at least. The first and second polishing members 1 and 2 described above have a dynamic pressure generating mechanism 4 in which a force for a fluid to pass between the two polishing members 1 and 2 acts in a direction in which the two polishing members 1 and 2 are separated from each other. To be equipped. Here, the fluid includes a liquid containing a solid and a gas containing a solid, in addition to a liquid and a gas. Further, this fluid includes both an object to be treated and a non-object to be treated. The grinder includes an apparatus for performing emulsification and dispersion processing and an atomizer (atomizer) in addition to an apparatus for performing grinding and crushing processing.

【0020】

The grinder according to the second invention of the present application is arranged so as to face each other, and at least one of them rotates with respect to the other to grind and grind, and at least two polishing members, the first and the second. Regarding those provided with 1 and 2, a fluid is supplied between the two polishing members 1 and 2 from the center side of the rotation, and the fluid is discharged to the outside of the first and second polishing members 1 and 2, as follows. Take the composition of. That is, at least one of the first and second polishing members 1 and 2 is arranged so as to be close to and separated from the other. Then, this grinder is provided with an urging mechanism 3 that acts in a direction in which both polishing members 1 and 2 are brought close to each other at least. Both of the polishing members 1 and 2 have a flat portion that has been mirror-polished, and one of the polishing members 1 and 2 has a groove in the flat portion. The groove extends from the center side of the polishing member toward the outside of the polishing member, and limits the flow path of the fluid passing through the groove from the center of the polishing member to the outside of the polishing member. It is provided with a flow path limiting unit.

【0021】

In the grinder according to the third invention of the present application, in the grinder according to the second invention of the present application, the flow path limiting portion has a cross-sectional area of a gradual groove from the center side of rotation toward the outside of the polishing member. It was formed by making the size smaller.

【0022】

In the grinder according to the fourth invention of the present application, at least one of the first and second polishing members 1 and 2 is floating in the grinder according to any one of the first to third inventions of the present application. Equipped with a mechanism. This floating mechanism enables the above-mentioned proximity and separation between the two polishing members 1 and 2, and at least the eccentric behavior generated in at least one of the two polishing members 1 and 2 due to rotation is caused by at least the other of the two polishing members 1 and 2. Is characterized by being absorbed by.

【0023】

The grinder according to the fifth invention of the present application is arranged so as to face each other, and at least one of them rotates with respect to the other to grind and grind, and at least two polishing members, the first and the second. 1,2 is provided, and a fluid that conveys the object to be processed or becomes the object to be processed itself is supplied between the two polishing members 1 and 2 from the center side of the rotation, and the fluid is supplied to the first and second members. It is discharged to the outside of the polishing members 1 and 2, and has the following configuration. That is, this grinder includes a floating mechanism, an urging mechanism, and a dynamic pressure generating mechanism. The floating mechanism makes it possible to arrange one of the first and second polishing members 1 and 2 so as to be close to and apart from the other, and to change the direction of the rotation axes of both polishing members. Is what you do. The urging mechanism urges both of the above-mentioned polishing members in a direction of at least bringing them close to each other. The dynamic pressure generation mechanism makes the distance between the two polishing members a minute distance of 0.1 to 10 μm by applying a force that the fluid tries to pass between the two polishing members in the direction in which the two polishing members separate from each other. Is.

【0024】

By adopting the above configuration, the grinder according to the first to fifth inventions of the present application has the dynamic pressure generating mechanism 4 between the fluid polishing members 1 and 2 against the urging of the urging mechanism 3. A separation force is generated between the two polishing members 1 and 2 by using the force to pass through, and at least the balance between the urging of the urging mechanism 3 and the separation force causes the separation force between the two polishing members 1 and 2 to be generated. It has made it possible to secure a minute interval required for processing, which was not possible with conventional mechanical methods.

【0025】

In particular, the grinder according to the second invention of the present application has been able to provide a more preferable means for the above-mentioned dynamic pressure generation mechanism 4. That is, in the grinder according to the second invention of the present application, both polishing members 1 and 2 are provided with a flat portion by mirror polishing, and one of the flat portions is provided from the center side of the polishing member to the outside of the polishing member. A groove is provided to provide a path for the fluid to move, and the groove is surrounded by both mirror-polished flat portions and a flow path limiting portion. For this reason, the fluid trying to pass through the groove loses its place due to the flow path limiting portion, and at least enters between the two flat portions pressed by the urging mechanism 3, and between the two flat portions (between the two polishing members 1 and 2). ), Secure a minute interval suitable for polishing and crushing, which was not possible with conventional mechanical methods.

【0026】

Further, in the grinder according to the third invention of the present application, the flow path limiting portion exerts a force for passing through the fluid by gradually reducing the cross-sectional area of the groove from the center side of rotation toward the outside of the polishing member. It is received gradually, and it is possible to secure the above-mentioned minute interval more smoothly.

【0027】

Further, in the grinder according to the fourth invention of the present application, the polishing members 1 and 2 are generated not only by the above-mentioned proximity and separation between the two polishing members but also by rotation on at least one of the two polishing members 1 and 2 by the floating mechanism. At least the other of both polishing members 1 and 2 absorbs the eccentric behavior. Therefore, due to the deformation of the polishing member due to rotation and generated heat, the imbalance of the interval between both flat parts (between both polishing members 1 and 2) is corrected, and the imbalance between both flat parts (both polishing members 1, 2) is corrected. By making the gap at each position of (2) constant, more reliable and uniform processing is possible. That is, the floating mechanism can absorb the runout of the rotating shaft, the shaft expansion, the surface runout of the first polishing member 1, and the vibration in the above rotation, and can exert the above-mentioned action.

【0028】

In the grinder according to the fifth invention of the present application, the distance between the two polishing members is set to a minute distance of 0.1 to 10 μm due to the balance of the forces generated in the urging mechanism and the dynamic pressure generation mechanism under the floating mechanism, which is not conventionally possible. Achieved the minute grinding and crushing that was possible.

【0029】

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 4 show an embodiment of the present invention. FIG. 1 is a schematic vertical sectional view of a grinder according to an embodiment of the present invention. FIG. 2 is a schematic vertical cross-sectional view of a part of the notch. FIG. 3 is a plan view of the first polishing member 1 included in the grinder shown in FIG. FIG. 4 is a schematic vertical cross-sectional view of a part of the notch main part of the first and second polishing members 1 and 2 of the grinder. For convenience of explanation, U is shown above and S is shown below.

【0030】

In the grinders shown in FIGS. 1 to 4, a fluid to be crushed or crushed or a fluid for transporting an object to be treated is charged under atmospheric pressure. As shown in FIG. 1, this grindstone includes a first polishing member 1 which is a rotary grindstone, a first holder 11 which holds the polishing member 1, a second polishing member 2 which is a fixed grindstone, and the second polishing. A second holder 21 to which the member 2 is fixed, an urging mechanism 3, a dynamic pressure generating mechanism 4, a drive unit 5 that rotates the first polishing member 1 together with the first holder 11, a housing 6, and a fluid are supplied. It is provided with an introduction unit 7 (injection) and an discharge unit 8 for discharging the fluid to the outside of the grinder. Hereinafter, the configuration of each part will be described in detail.

【0031】

Each of the first polishing member 1 and the second polishing member 2 is an annular body having a hollowed-out center of a cylinder. Both polishing members 1 and 2 are grindstones having one bottom surface of a cylinder presented by both polishing members 1 and 2 as polishing surfaces 10 and 20. The polishing surfaces 10 and 20 have a mirror-polished flat portion. In this embodiment, the polishing surface 20 of the second polishing member 2 is a flat surface on which the entire surface is mirror-polished. Further, the polishing surface 10 of the first polishing member 1 has the same flat surface as the second polishing member 2, but as shown in FIG. 3, a plurality of grooves 12 ... 12 are formed in the flat surface. Has. The grooves 12 ... 12 extend radially in the outer peripheral direction of the cylinder with the center of the cylinder presented by the first polishing member 1 as the center side. The surface roughness Ra of the polishing surfaces 10 and 20 of the first and second polishing members 1 and 2 is preferably Ra 0.01 to 1.0 μm. For this mirror polishing, Ra 0.03 to 0.3 μm is more preferable. As the material of the polishing members 1 and 2, a hard material that can be mirror-polished is used. The hardness of the polishing members 1 and 2 is at least a Vickers hardness of 1500 or more, preferably a Vickers hardness of 1800 or more. Further, it is preferable to use a material having a small coefficient of linear expansion. This is because if the difference in expansion coefficient is large between the portion that generates heat in the grinding process and the other portion, distortion occurs, which affects the securing of an appropriate clearance. Materials for such polishing members 1 and 2 include SIC (silicon carbide / Vickers hardness 2000-2500) and SIC with DLC (diamond-like carbon / Vickers hardness 3000-4000) coating on the surface. It is preferable to use WC (tungsten carbide / Vickers hardness 1800), WC with DLC coating on the surface, boron-based ceramics such as ZrB2, BTC, and B4 C (Vickers hardness 4000 to 5000). ..

【0032】

The housing 6 is a bottomed tubular body, and the upper part is covered with the second holder 21 described above. The second polishing portion 2 is fixed to the lower surface of the second holder 21, and the introduction portion 7 is provided above the second holder 21. The introduction unit 7 includes a hopper 70 for charging a fluid or an object to be processed from the outside. The drive unit 5 includes a power source (not shown) such as an electric motor, and a shaft 50 that rotates by receiving power supplied from the power source. The above rotation is 20,000 rotations per minute when the diameter of the first polishing member 1 is 100 mm, 10,000 rotations per minute when the diameter of the first polishing member 1 is 200 mm, and the diameter of the first polishing member 1 is 400 mm. If this is done, it will be 5,000 rpm. That is, from the viewpoint of the peripheral speed of the first polishing member 1 during rotation, it is about 6300 meters per minute, which is possible because dry contact between the polishing surface 10 and the polishing surface 20 can be prevented. is there. As shown in FIG. 1, the shaft 50 is arranged inside the housing 6 and extends up and down. The first holder 11 is provided at the upper end of the shaft 50. The first holder 11 holds the first polishing member 1, and by being provided on the shaft 50 as described above, the polishing surface 10 of the first polishing member 1 becomes the polishing surface 20 of the second polishing member 2. Correspond to.

【0033】

The first holder 11 is a columnar body, and the first polishing member 1 is fixed to the center of the upper surface. The first polishing member 1 is fixed so as to be integrated with the first holder 11 and does not change its position with respect to the first holder 11. On the other hand, a receiving recess 24 for receiving the second polishing member 2 is formed in the center of the upper surface of the second holder 21. The receiving recess 24 has an annular cross section. The second polishing member 2 is housed in the cylindrical receiving recess 24 so as to be concentric with the receiving recess 24.

【0034】

Specifically, the annular body 23, which is separate from the second polishing member 2, is housed in the receiving recess 24. A protrusion 27 (pin) is provided on the bottom surface (top 24a) of the receiving recess 24. A recess 26 capable of accommodating the protrusion 27 is provided on the surface (upper surface) of the annular body 23 facing the top portion 24a. The protrusion 27 is a detent for the second holder 21 of the annular body 23. The protrusion 27 is housed in the recess 26 so as to have a margin (play). The second polishing member 2 is housed on the opposite side (lower side) of the annular body 23 from the top portion 24a of the receiving recess 24. A protrusion 25 (pin) is provided on the surface (lower surface) of the annular body 23 opposite to the top portion 24a. A recess 22 for accommodating the protrusion 25 is provided on the surface of the second polishing member 2 opposite to the polishing surface 20. The protrusion 25 is a detent for the second polishing member 2 with respect to the annular body 23. The protrusion 25 is housed in the recess 22 so as to have a margin (play).

【0035】

The second holder 21 includes the above-mentioned urging mechanism 3. The urging mechanism 3 preferably uses an elastic body such as a rubber O-ring or a spring. Specifically, in this embodiment, a plurality of through holes 31 ... 31 are provided between the (upper and lower) both end faces of the above-mentioned annular body 23, and the through holes 31 ... 31 are provided. , Multiple springs 30 ... 30 that serve as the urging mechanism 3 are accommodated. With this, the second polishing member 2 is placed between the upper surface of the second polishing member 2 (the surface opposite to the polishing surface 20) and the bottom (top surface 24a) of the receiving recess 24, and the first polishing member 1 is placed. The urging mechanism 3 that urges toward is mediated. That is, the springs 30 ... 30 press the surface (bottom surface) of the second polishing member 2 opposite to the polishing surface 20 and urge the second polishing member 2 on the first polishing member 1 side (lower side). To do. The springs 30 ... 30 are evenly distributed on the bottom 24a of the receiving recess 24. When a spring is used for the urging mechanism 3, instead of preparing a plurality of springs as described above, it is larger than the inner diameter of the inner peripheral surface of the second polishing member 2 and smaller than the outer diameter of the second polishing member 2. It can also be carried out by preparing one spring having a diameter. The urging mechanism 3 can apply an even and uniform urging force to each part of the surface of the second polishing member 2 opposite to the polishing surface 20 (the upper surface of the second polishing member 2 in FIGS. 1 and 2). It may be possible, and is not limited to the above-mentioned spring. That is, in the above, the urging mechanism 3 is composed of only the spring 31, but in addition to this, the urging mechanism 3 replaces the above spring 31, or together with the spring 31, fluid pressure such as air. It is also possible to carry out by using the urging means using. Specifically, as shown in FIG. 1, it is also possible to provide a high-pressure air introduction port 32 as a part of the urging mechanism 3 to adjust the urging force. In this case, the urging mechanism 3 may be composed of only the high-pressure air inlet 32, or as shown in FIG. 1, the urging mechanism 3 is composed of the spring 31 and the high-pressure air inlet 32. May be good.

【0036】

On the other hand, the inner diameter of the receiving recess 24 is larger than the outer diameter of the second polishing member 2, so that when arranged concentrically as described above, the outer peripheral surface 2b of the second polishing member 2 and the inside of the receiving recess 24 As shown in FIG. 2, a gap t1 is set between the peripheral surface and the peripheral surface. Similarly, as shown in FIG. 2, a gap t2 is set between the inner peripheral surface 2a of the second polishing member 2 and the outer peripheral surface of the central portion of the receiving recess 24. Each of the above-mentioned gaps t1 and t2 is for absorbing vibration and eccentric behavior, and is set to a size that can be secured at least the operating dimension and can be sealed. For example, when the diameter of the first polishing member 1 is 100 mm to 400 mm, the gaps t1 and t2 are preferably 0.1 to 0.3 mm, respectively. The first holder 11 is integrally fixed to the shaft 50 together with the inner holder 15, and rotates together with the shaft 50. Further, due to the above-mentioned protrusions 25 and 27, the second polishing member 2 does not rotate with respect to the second holder 21 even through the annular body 23. However, in order to secure a minute interval t (clearance / see Fig. 4 (B)) of 0.1 to 10 microns required for processing such as grinding between the surfaces 10 and 20 for both polishing, the bottom surface of the receiving recess 24 (see Fig. 4 (B)). A gap t3 is provided between the top portion 24a) and the surface (upper surface) of the annular body 23 facing the top portion 24a. This gap t3 is set in consideration of the runout and elongation of the shaft 50 as well as the above clearance.

【0037】

As described above, by setting the gaps t1 to t3, the first polishing member 1 is not only variable in the direction of approaching and separating from the second polishing member 1, but also the center and orientation of the polishing surface 10. (For directions z1 and z2) is also variable. That is, in this embodiment, the urging mechanism 3 and the gaps t1 to t3 form a floating mechanism, and the floating mechanism causes at least the center and inclination of the second polishing member 2 to be several microns to several millimeters. It is variable by a small amount of. As a result, the runout of the rotating shaft, the shaft expansion, the surface runout of the first polishing member 1 and the vibration are absorbed. The operation of the floating mechanism of the second polishing member 2 is ensured by the play between the protrusion 25 and the recess 22 and between the protrusion 27 and the recess 26, and these detent mechanisms are used. The operation is not hindered.

【0038】

The groove 12 included in the polishing surface 10 of the first polishing member 1 will be described in more detail. The rear end of the groove 12 reaches the inner peripheral surface 1a of the first polishing member 1, and the tip thereof extends toward the outer side y (outer peripheral surface side) of the first polishing member 1. As shown in FIG. 3A, the groove 12 increases its cross-sectional area from the center x side of the annular first polishing member 1 toward the outer side y (outer peripheral surface side) of the first polishing member 1. It is supposed to decrease gradually. The distance w1 between the left and right side surfaces 12a and 12b of the groove 12 decreases from the center x side of the first polishing member 1 toward the outside y (outer peripheral surface side) of the first polishing member 1. Further, as shown in FIG. 3B, the depth w2 of the groove 12 becomes smaller from the center x side of the first polishing member 1 toward the outer side y (outer peripheral surface side) of the first polishing member 1. .. That is, the bottom 12c of the groove 12 becomes shallower from the center x side of the first polishing member 1 toward the outer side y (outer peripheral surface side) of the first polishing member 1. As described above, the groove 12 gradually decreases its cross-sectional area toward the outer side y, assuming that both the width and the depth thereof gradually decrease toward the outer side y (outer peripheral surface side). The tip (y side) of the groove 12 is a dead end. That is, the tip (y side) of the groove 12 does not reach the outer peripheral surface 1b of the first polishing member 1, and the outer flat surface 13 is interposed between the tip of the groove 12 and the outer peripheral surface 1b (this). The outer flat surface 13 is a part of the polishing surface 10). In this embodiment, the left and right side surfaces 12a and 12b of such a groove 12 and the bottom 12c form a flow path limiting portion. The flow path limiting portion, the flat portion around the groove 12 of the first polishing member 1, and the flat portion of the second polishing member 2 constitute the dynamic pressure generation mechanism 4. However, the cross-sectional area may be reduced by adopting the above configuration only for either the width or the depth of the groove 12. In that case, the left and right side surfaces 12a, 12b or the bottom 12c, which do not adopt the above configuration, do not serve as a flow path limiting portion and do not serve as a component of the dynamic pressure generating mechanism 4. The above-mentioned dynamic pressure generation mechanism 4 has both polishing members 1 and 1 when the first polishing member 1 is rotating. The fluid trying to pass between the two generates a force acting in the direction of separating the two polishing members 1 and 2, which makes it possible to secure a desired minute distance between the two polishing members 1 and 2. By generating such dynamic pressure, a minute interval of 0.1 to 10 μm can be generated between the surfaces 10 and 20 for both polishing. Such a minute interval may be adjusted and selected depending on the treatment target, but is preferably 1 to 6 μm, more preferably 1 to 2 μm. In this grinder, it is possible to perform unprecedented grinding and crushing treatment with the above-mentioned minute intervals.

【0039】

Each of the grooves 12 ... 12 can be implemented even if it extends straight from the center x side to the outer y. However, in this embodiment, as shown in FIG. 3A, the center x side of the groove 12 is ahead of the outer side y of the groove 12 in the rotation direction r of the first polishing member 1 (forward). It is supposed to be curved and extend the groove 12 (so that it is located in). By bending and extending the grooves 12 ... 12 in this way, it is possible to more effectively generate the separation force by the dynamic pressure generating mechanism 4.

【0040】

Next, the operation of this grinder will be described. The fluid R, which is the object to be processed, introduced from the introduction portion 7 (hopper 70) passed through the hollow portion (center) of the annular second polishing member 2 and received the centrifugal force due to the rotation of the first polishing member 1. The fluid enters between the two polishing members 1 and 2, and is subjected to grinding and crushing processing between the rotating surface 10 of the first polishing member 1 and the polishing surface 20 of the second polishing member 2. After that, it goes out to the outside of both polishing members 1 and 2, and is discharged from the discharge unit 8. In the above, the fluid R that has entered the hollow portion of the annular second polishing member 2 first enters the groove 12 of the rotating first polishing member 1 as shown in FIG. 4 (A). On the other hand, the mirror-polished (flat portions) surfaces 10 and 20 for both polishing are kept airtight even through gases such as air and nitrogen. Therefore, even if the centrifugal force due to the rotation is received, the fluid cannot enter from the groove 12 between the two polishing surfaces 10 and 20 pressed by the urging mechanism 3 as it is. However, the fluid R gradually abuts on both side surfaces 12a and 12b and the bottom 12c of the groove 12 formed as the flow path limiting portion, and generates a dynamic pressure acting in a direction in which both polishing surfaces 10 and 20 are separated from each other. As a result, the fluid R seeps out from the groove 12 to the flat surface, and a minute gap (clearance) can be secured between the polishing surfaces 10 and 20. Then, minute grinding and crushing treatments are performed between such mirror-polished flat surfaces. Further, the curvature of the groove 12 described above causes centrifugal force to act on the fluid more reliably, and makes the generation of the dynamic pressure more effective. In this way, this grinder can secure a fine clearance between both mirror surfaces (polishing surfaces 10, 20) by balancing the dynamic pressure and the urging force by the urging mechanism 3. And said. With the above configuration, the fine spacing can be made ultrafine of 1 μm or less. In addition, by adopting the above floating mechanism, it is possible to automatically adjust the alignment between the polishing surfaces 10 and 20, and the polishing surface 10 and 20 are resistant to physical deformation of each part due to rotation and generated heat.

【0041】

In the above embodiment, the floating mechanism is a mechanism provided only in the second holder 21. In addition, it is also possible to implement a floating mechanism in place of the second holder 21 or together with the second holder 21 so as to be provided in the second holder 21 as well.

【0042】

5 to 7 show other embodiments of the groove 12 described above. As shown in FIGS. 5 (A) and 5 (B), the groove 12 can be implemented as having a flat wall surface 12d at the tip as a part of the flow path limiting portion. Further, in the embodiment shown in FIG. 5, a step 12e is provided between the first wall surface 12d and the inner peripheral surface 1a at the bottom 12c, and this step 12e also forms a part of the flow path limiting portion. Configure. As shown in FIGS. 6A and 6B, the groove 12 is provided with a plurality of branch portions 12f ... 12f, and each branch portion 12f is provided with a flow path limiting portion by narrowing its width. It can also be implemented as a thing. Also in the embodiments shown in FIGS. 5 and 6, the configurations other than those shown in particular are the same as those of the embodiments shown in FIGS. 1 to 4.

【0043】

Further, in each of the above embodiments, at least one of the width and the depth of the groove 12 is gradually reduced in size from the inside to the outside of the first polishing member 1, so that the flow path limiting portion is formed. Was assumed to constitute. In addition, as shown in FIGS. 7 (A) and 7 (B), the end surface of such a groove 12 is provided by providing the end surface 12f in the groove 12 without changing the width and depth of the groove 12. 12f can be used as the flow path limiting part. As shown in the embodiments shown in FIGS. 3, 5 and 6, the dynamic pressure generation causes the bottom and both side surfaces of the groove 12 to be inclined surfaces by changing the width and depth of the groove 12 as described above. As a result, this inclined surface became a pressure receiving part for the fluid and generated dynamic pressure. On the other hand, in the embodiment shown in FIGS. 7 (A) and 7 (B), the end surface of the groove 12 serves as a pressure receiving portion for the fluid to generate dynamic pressure. Further, in the case shown in FIGS. 7A and 7B, it is also possible to gradually reduce at least one of the width and the depth of the groove 12. The structure of the groove 12 is not limited to the one shown in FIGS. 3, 5 to 7 above, and can be implemented as having a flow path limiting portion having another shape. For example, in those shown in FIGS. 3, 5 to 7, the groove 12 did not penetrate to the outside of the first polishing member 1. That is, an outer flat surface 13 existed between the outer peripheral surface of the first polishing member 1 and the groove 12. However, the present invention is not limited to such an embodiment, and if the above-mentioned dynamic pressure can be generated, the groove 12 may reach the outer peripheral surface side of the first polishing member 1. It is feasible. For example, in the case of the first polishing member 1 shown in FIG. 7 (B), as shown by the dotted line, a portion having a cross-sectional area smaller than that of the other portions of the groove 12 can be formed on the outer flat surface 13 for implementation. it can. Further, the groove 12 is formed so as to gradually reduce the cross-sectional area from the inside to the outside as described above, and the portion (termination) of the groove 12 that reaches the outer periphery of the first polishing member 1 has the smallest cross-sectional area. (Not shown). However, in order to effectively generate dynamic pressure, as shown in FIGS. 3, 5 to 7, the groove 12 is the first laboratory.

【0044】

In each of the above embodiments, it is assumed that only the first polishing member 1 rotates and the second polishing member 2 does not rotate. In addition, not only the first polishing member 1 but also the second polishing member 2 can be rotated. In this case, the second polishing member 2 is assumed to rotate in the direction opposite to the rotation direction r of the first polishing member 1. As such a grinder, for example, as shown in FIG. 8, a second drive unit 5a provided with a shaft 50a, which is separate from the drive unit 5 described above, is provided and is formed independently of the housing 6. The holder 21 may be rotated. In this case, the shaft 50a of the drive unit 5a is hollow, and the inside of the shaft 50 is the introduction unit 7. In the grinder shown in FIG. 8, the floating mechanism is provided in the second holder 21 as in the grinders shown in FIGS. 1 and 2. In addition, it can be implemented in place of the second holder 21 or as the first holder 11 also has a floating mechanism together with the second holder 21.

【0045】

Finally, the invention of the present application will be summarized. In the grindstone according to the present invention, a rotary grindstone having a flat grindstone on the outer peripheral portion and a fixed grindstone having a flat grindstone on the outer peripheral portion are concentrically opposed to each other on the flat grindstones. While supplying the raw material to be crushed from the opening of the fixed grindstone under the rotation of the rotary grindstone, mechanical clearance is provided in the grindstone that grinds and crushes the raw material to be crushed from between the facing flat grinding surfaces of both grindstones. Instead of adjusting, a pressure boosting mechanism is provided on the rotating grindstone to maintain the clearance by generating the pressure, and it is possible to achieve a minute clearance of 1 to 6 μm, which was not possible with mechanical clearance adjustment, and the grinding and crushing ability is high. It was a remarkable improvement. That is, in the present invention, the rotary grindstone and the fixed grindstone have a flat grinding surface on the outer peripheral portion thereof, and the flat grinding surface has a sealing function on the surface. It is intended to provide a high-speed rotary grinder that generates a hydrostatic force or an aerostatic-aerodynamic force. The above-mentioned force can generate a slight gap between the sealing surfaces, and can provide a non-contact, mechanically safe, and highly functional grinding apparatus. One of the factors that may form this slight gap is the rotation speed of the rotary grindstone, and the other is the pressure difference between the input side and the discharge side of the raw material to be pulverized. When a pressure applying mechanism is attached to the input side, the applicant of the present application reported a useful invention in Japanese Patent Application No. 2002-207533, but the pressure applying mechanism is not attached to the input side. In this case, that is, when the raw material to be pulverized is charged under atmospheric pressure, it is necessary to cause separation between the sealed surfaces only by the rotation speed of the rotary grindstone because there is no pressure difference. This is known as hydrodynamic or aerodynamic force.

【0046】

[Effect of the invention]

By implementing the first to fifth inventions of the present application, when the raw material to be crushed is made into a fluid or the raw material to be crushed is put into the fluid, the clearance between the upper and lower grindstones (polishing members) is set to 15 μm or less. It was realized. That is, we have realized the ultra-fine pulverization that is absolutely necessary for the recent development of nanotechnology. We also provided a high-performance pulverizer (grinder) that can rotate at high speed by eliminating foreign matter. Made possible.

[Simple explanation of drawings]

FIG. 1 is a partially cutaway vertical sectional view of a grinder according to an embodiment of the present invention.

FIG. 2 is a schematic vertical cross-sectional view of a main part of the above-mentioned grinder centering on a first polishing member 1 and a first holder 11.

FIG. 3A is a plan view of the first polishing member 1 of the grinder, and FIG. 3B is a vertical sectional view of a main part thereof.

FIG. 4A is a vertical cross-sectional view of a main part of the first and second polishing members 1 and 2 of the grinder, and FIG. 4B is a minute-spaced first and second polishing member 1 It is a vertical cross-sectional view of the main part of, 2.

FIG. 5 (A) is a plan view of another embodiment of the first polishing member 1, and FIG. 5 (B) is a schematic vertical sectional view of a main part thereof.

FIG. 6A is a plan view of still another embodiment of the first polishing member 1, and FIG. 6B is a schematic vertical sectional view of a main part thereof.

FIG. 7 (A) is a plan view of still another embodiment of the first polishing member 1, and FIG. 7 (B) is a plan view of still another embodiment of the first polishing member 1.

FIG. 8 is a partially cutaway schematic vertical cross-sectional view showing another embodiment of the grinder.

[Explanation of symbols]

1 1st polishing member 2 2nd polishing member 3 Biasing mechanism 4 Dynamic pressure generation mechanism