Thin electronic component clean transfer device and thin electronic product manufacturing system

【0001】

[Technical field to which the invention belongs]

The present invention provides products such as semiconductor wafers, liquid crystal display devices, plasma display devices, organic and inorganic electroluminescence, field-emitting display devices, printed wiring boards, and thin plate-shaped electronic components used for them in a clean environment. It relates to a transfer device including a clean booth to be transferred between a cassette which is a cleaning container and various processing devices, and a manufacturing facility for thin plate-shaped electronic components using the transfer device.

【0002】

[Conventional technology]

A clean booth that is a conventional clean space, for example, a HEPA (High Efficiency Particulate Air) filter installed on the ceiling of a box-shaped body, or ULPA (Ultra Low Penetration Air) as seen in Japanese Patent Application Laid-Open No. 2-4145. A method has been adopted in which the clean air supplied from the filter blows foreign matter downward and is discharged to the outside from a grating floor made of a perforated plate. However, in recent years, in the manufacturing process of thin plate-shaped electronic components represented by semiconductor wafers with a line width of 1 μm or less, which needs to completely eliminate contamination by granular foreign substances and organic substances, it is highly cleaned called mini-environment. Clean booths are now in use. As an example of this, Japanese Patent Application Laid-Open No. 2001-244315 proposes a device in which an exhaust system is provided on the body of a transfer robot, which is a source of foreign matter, and the exhaust amount is controlled by a computer, but the quantitative effect thereof is not described. ..

【0003】

[Problems to be Solved by the Invention]

When a robot that may generate dust is not used, for example, in the device described in Japanese Patent Application Laid-Open No. 2000-161735, class 10 or less is achieved with 0.3 μm dust, but a semiconductor wafer with a line width of 0.5 μm or less is handled. In that case, the grace is insufficient. Further, in the case of the above-mentioned Japanese Patent Application Laid-Open No. 2001-244315, when the robot which is the source of foreign matter or the door which opens and closes moves in the clean booth, or when the foreign matter rides on the vortex generated on the back side of the thin plate-like object. In some cases, the cleanliness is insufficient, and if an expensive computer control system is installed, the equipment cost will increase, which is not preferable.

【0004】

[Means to solve problems]

As a result of diligent studies to solve the above problems, the inventor of the present application has a fan provided on the ceiling of a housing in which thin plate-shaped electronic parts are provided between predetermined locations such as a cassette and a load lock chamber such as a processing chamber. In the device that is automatically transferred by the transfer robot in the housing under clean air after passing through the filter unit, a filter that removes 99.999% or more of particles of 0.1 μm or more is used for the fan filter unit, and the transfer robot A floor (hereinafter referred to as the "first floor") that is located under the arm in the middle part and through which air flows is provided horizontally, and a first floor is provided between the fan filter unit and the first floor in the housing. By defining the chamber and defining the second chamber between the bottom of the housing that allows air to flow to the outside and the first floor, it is said to be class 1 for 0.1 μm particles even during operation. We have found that it is possible to maintain an extremely high degree of cleanliness.

【0005】

The fan filter unit in the present invention includes a ULPA filter capable of removing 99.999% or more of granular foreign substances of 0.1 μm or more, preferably 0.01 μm or more, or 99.9999% or more of granular foreign substances of 0.1 μm or more, and pushing air into the ULPA filter. An apparatus equipped with a blower can be used, and the filter may be a chemical filter provided with an adsorbent such as activated carbon or an activated carbon fiber filter in order to adsorb and remove suspended organic matter. Further, the fan filter unit in the present invention may be provided with a member that serves as the ceiling of the first chamber, which is formed of a plate-like object that is immediately below the ULPA filter and through which air flows. Examples of the ceiling member include a perforated plate made of metal or plastic called a grating or punching plate, and a lattice-like body called a louver.

【0006】

In addition to the first floor, the inventor of the present application horizontally arranges a second floor located near the base of the transfer robot and through which air flows to change the opening ratio of the bottom of the housing to the outside. We also found that it was even more effective, and developed a transfer device in which the space for transferring thin plate-shaped electronic components such as wafers was extremely clean.

【0007】

In the clean transfer device of the present invention, thin plate-shaped electronic components are put in and out of the wall of the clean space (first chamber) defined above the first floor where the housing receives the blown clean air from the fan filter unit. In the present invention, a gap having a width of 1 mm or more and 30 mm or less is provided between the door frame provided on the wall and the outer side of the door when the door is closed. Similarly, preferably, after the door is opened, a gap having a width of 1 mm or more and 30 mm or less is provided on all four sides between the outer circumference of the installed cassette and the door frame provided on the wall. Further, preferably, a gap having a width of 1 mm or more and 30 mm or less is maintained while the cassette moves toward the door frame for installation near the door frame or when the door opens and closes. Further, preferably, a gap having a width of 1 mm or more and 30 mm or less is provided between the body of the robot placed in the clean transfer device and the first floor. The clean transfer device of the present invention is generally connected to the processing chamber airtightly to the outside, but like the cassette, it may be connected to the processing chamber with a gap of 1 mm or more and 30 mm or less in width.

【0008】

With this gap, it is possible to minimize the atmospheric pressure fluctuation in the space where the thin plate-shaped electronic component exists, minimize the turbulence of the air flow, and prevent the foreign matter from flying up. If there is no gap, the exhaust air depends only on the opening degree of the first floor through which air flows, so the internal pressure of the first room rises to reach a maximum of 25 Pa, and when the door opens, the internal pressure rises to 1.3 to 2 at once. Not only is the airflow turbulent due to sudden exhaust around the door, but also the airflow is turbulent around the arm and wafer of the transfer robot in the room, causing vortex flow, and foreign matter there. There are problems such as getting caught in the air and making it impossible to discharge the foreign matter there. If the gap is as narrow as 1 mm or less, the large internal pressure difference as described above cannot be eliminated, and conversely, if the gap is too large, foreign matter easily diffuses and invades from the outside. The inventor of the present application has experimentally and empirically found that the maximum gap is 30 mm.

【0009】

Further, the air pressure in the first chamber above the first floor in the housing is made higher than the air pressure in the second chamber below the first floor in the housing, and the two chambers are set. By making both the air pressure in the space higher than the outside of the housing, stable cleanliness can be maintained in the first room. Here, it is preferable that the second chamber keeps at least 0.1 Pa from the outside of the housing.

【0010】

As for the air volume of clean air from the fan filter unit, it is preferable that the ventilation frequency in the first chamber in the housing is 5 times or more and 45 times or less per minute. If the ventilation rate is less than 5 times per minute, foreign matter will flow back into the housing and the cleanliness cannot be maintained. If the ventilation rate is about 20 times per minute, the cleanliness can be sufficiently maintained even if the internal transfer robot is moving, but ventilation is performed to deal with an emergency situation such as an accident in which the wafer entrance / exit door is stopped while it is open. The number of times is preferably up to 45 times. If the ventilation rate exceeds 45 times, the flow velocity of the air in the first chamber becomes too fast, and a vortex is generated under the arm of the transport robot, which is not preferable because the air is retained while entraining foreign matter.

【0011】

In order to achieve the ventilation frequency in the above range, the clean air blowing speed of the fan filter unit is controlled. If the wind speed is less than 0.1 m / sec, it is not possible to achieve a ventilation rate of 5 times / minute due to insufficient air volume, and external foreign particles diffuse and invade through the gap around the door, which is a feature of the present invention, and the number of particles. Is abnormally high, which is fatal for a clean transfer machine. On the contrary, if the wind speed is too high, static electricity is generated, which is not preferable because the semiconductor circuit is cut or the transistor circuit on the liquid crystal glass substrate is destroyed. In addition, a high wind speed requires a high blowing pressure, and the foreign matter particles accumulated in the filter by filtering the air are pushed out by the pressure, and there is a risk of polluting the first chamber, which is a clean space. If the ULPA filter used in the present invention exceeds 0.65 m / sec, there is a risk as described above, and this value is the upper limit.

【0012】

Next, in the transfer device of the present invention, it is preferable to move the door up and down and to cover the door passage provided on the second chamber side under the first floor with a partition wall for the movement. Thus, the clean air flowing into the second chamber from the first chamber is directly discharged to the outside of the housing through the passage, and the door is prevented from being contaminated. The door is FOUP (Front Opening Unified). The front lid of the wafer cassette such as Pod) may be adsorbed and fixed to the door and moved up and down together with the door. Here, a device including the door, the door passage, and a table for moving the cassette back and forth with respect to the door is called a load port, and the load port is attached to the wall of the transfer device of the present invention. Can be incorporated in 1 or 2 or more. Further, if the first floor is provided and the ventilation frequency of the first room is maintained at 10 times or more and 45 times or less per minute, the first room is replaced when the load port is replaced due to a failure or the like. One load port can be removed while maintaining high cleanliness. When one load port is removed, about 10% to 20% of the total area of one wall of the housing, and about 10% to 20% of the wall area of the first room of the above one wall for the first room. However, if the difference pressure between the air pressure in the first chamber and the external air pressure is 0.1 Pa or more, the inventor of the present application should keep one foreign particle of 0.1 μm or more / cubic foot or less. I found that I could do it.

【0013】

Further, the present invention also provides a thin plate-shaped electronic component manufacturing facility using the above-mentioned transfer device for preventing the invasion of foreign substances and contamination by organic substances and the like. This equipment performs various processes such as resist coater, pre-baking, exposure, development, post-baking, etching, and cleaning, as well as a cassette station for cassettes that store and transport thin plate-shaped electronic components via the transfer device. It is a facility connected to the processing chamber to be used.

【0014】

The floor through which air can flow as referred to in the present invention refers to a floor made of a porous stainless steel plate, a porous plastic plate, a grid-like body having a plurality of rectangular or strip-shaped holes, or the like. The opening ratio of the first floor is preferably 5% or more and about 50% or less of the floor area of the housing. If it is less than 5%, there is little chance of discharging foreign matter generated in the clean room to the outside, which is not preferable. On the other hand, if it exceeds 50%, foreign matter is likely to be caught from the outside, which is not preferable.

【0015】

The opening ratio of the bottom of the housing is preferably larger than the opening ratio of the first floor described above. As a result, the air pressure in the first chamber is kept higher than the air pressure in the second chamber, and the degree of cleanliness can be kept high. That is, the opening ratio of the bottom of the housing to the outside is adjusted in the range of 5% or more and 70% or less of the floor area of the housing by providing a second floor or the like. In order to maintain a stable and clean environment, it is more preferable that the opening ratio is within the range of 5% or more and 30% or less for the first floor and 10% or more and 60% or less for the bottom of the housing.

【0016】

The housing referred to in the present invention is an important member for isolating it from the outside world and keeping the inside clean, and is manufactured by using a material such as stainless steel, aluminum, or antistatic plastic. Inside this housing, there is a first room where thin plate-shaped electronic components such as wafers are transported by the arm of the transfer robot by the first floor, and a second room where the lower part of the main body of the transfer robot, control devices, and other equipment are stored. Is defined. Even if a second floor made of a grating plate or the like is not particularly provided, these devices are distributed and arranged on the bottom of the housing, and as a result, the opening ratio of the bottom of the housing to the outside is 70% when it is 5% or more. It may be as follows.

【0017】

The transfer robot referred to in the present invention is a machine in which a thin plate-shaped electronic component such as a wafer is placed or sucked on its finger and transferred from a cassette to various processing chambers, and is a 1-arm or 2-arm scalar type robot. It is an articulated robot, etc., and is a transport machine with clean room specifications. A magnetic fluid seal that stops the magnetic fluid with a magnet ring is provided in the cover gap near the bearing at the joint portion of the arm of the transfer robot to block dust generation from the belt, pulley, or gear in the arm to the outside of the arm. In addition, when the body of this transfer robot moves up and down (hereinafter referred to as "Z-axis movement") to raise and lower the arm of this transfer robot, the air inside the body moves in and out. Intake and exhaust from the opening as a vent provided in the robot, or attach a fuselage cover that covers the fuselage to the side of the fuselage, and in addition, leave a gap inside the fuselage cover to cover the robot base. It is preferable to have a structure in which the robot is attached and intakes upward from the downward cover gap as a vent at the lower side surface of the robot and exhausts downward. In this way, air containing foreign particles in the body of the robot can be discharged downward from the lower part of the robot without providing an exhaust fan in the lower part of the robot. In order to keep the opening ratio of the first floor low to some extent, it is desirable that the main body (body) of the transfer robot only rotates without moving left and right (hereinafter referred to as X-axis movement).

【0018】

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is a partially cutaway perspective view showing a thin plate-shaped electronic component manufacturing facility provided with a clean transfer device as an embodiment of the present invention, in which reference numeral 1 is the thin plate-shaped electronic component manufacturing facility, 2 Indicates a clean transfer device 2 as an embodiment of the present invention. The clean transfer device 2 of this embodiment is a fan consisting of a blower 4 consisting of a sirocco fan, a ULPA filter (for example, Daikin Neurofine (boron-free type) LMH6051050 type) 5 and a clean air outlet 6 on the ceiling of the housing 2a. It is equipped with a filter unit 3, a load port 20 on which a cassette 7 for storing a semiconductor wafer is placed on one wall of the housing 2a, and a door 33 of a load lock chamber 32 on the opposite wall. , All other walls are airtight to the outside. Inside the housing 2a, there is a transport robot 10 which is a single-arm scalar robot that transports the wafer 15, a first floor 11 located just below the arm 17 of the transport robot 10, and a housing. It has a second floor 13 located at the bottom of 2a and above the bottom frame 2b of the housing 2a. The clean air outlet 6 and the first floor 11 and the second floor 13 both use a punched metal plate made of polished stainless steel, and the wall material and pillars of the housing 2a are made of aluminum.

【0019】

Further, the clean transfer device 2 of this embodiment includes a wafer positioning device 14 and a robot control device 12 inside the housing 2a, and also has a control data input / output device 16 outside the housing 2a. The transfer robot 10, the wafer positioning device 14, and the control device 12 for the robot are installed on the bottom frame 2b of the housing 2a having an opening that allows air to flow to the outside. Further, the clean transfer device 2 is airtightly connected to the semiconductor processing device 30 to the outside through the door 33 of the load lock chamber 32. In the semiconductor processing device 30, the load lock chamber 32 and various processing chambers are connected. The processing apparatus conveyor 31 conveys the wafer to and from 34.

【0020】

FIG. 2 is a partially cutaway perspective view showing a clean transfer device as another embodiment of the present invention. In the clean transfer device 2 of this embodiment, the ceiling of the housing 2a is provided with the same fan filter unit 3 as in the previous embodiment, and there are two doors 21 for the cassette 7, each of which slides up and down. Each aisle is separated from the rest of the second chamber by a partition 19 and the first floor 11 is made of a stainless steel punching plate placed horizontally in the middle of the transfer robot 10 just below the arm 17. ing. The transfer robot 10 is a so-called double-armed scalar robot, which is installed on the bottom frame 2b of the housing 2a, which allows air to flow to the outside, together with the power supply device 18 and the control device 12, through the first floor. There is. The second floor 13 is composed of a plurality of strip-shaped punching plates, and is detachably fixed on the bottom frame 2b as needed.

【0021】

FIG. 3 is a view of the load port 20 having the door 21 shown in FIG. 2 as viewed from the outside of the transfer device 2. A gap L is provided between the door frame 23 provided in the wall 24 and the door 21, and in this embodiment, the size (width) of the gap L is set to 2 mm, and clean air is transferred to the transfer device 2. It is designed to flow from the inside to the outside of the housing 2a. Similarly, a gap is provided between the first floor 11 in FIG. 2 and the body of the transfer robot 10, and the size (width) of the gap is 5 mm. The door 21 opens vertically on the other side of the wall 24, that is, inside the housing 2a of the transfer device 2, downward from the position shown in FIG. The cassette containing the wafer is placed on the stage 22 and moves back and forth according to the opening and closing of the door 21, and the size (width) of the gap between the outer edge of the front end of the cassette and the door frame 23 during this movement is at most. It can be suppressed to 25 mm.

【0022】

The arm joint 26 of the transfer robot 4 here is provided with a magnetic fluid seal that stops the magnetic fluid with a magnet ring in the cover gap near the bearing, and dust is generated from the belt, pulley, or gear in the arm to the outside of the arm. Is blocked. Further, when the body of the transfer robot 4 moves up and down in the Z-axis to raise and lower the arm 17 of the transfer robot 4, the air inside the body moves in and out, but here, the air is sent to the side surface of the body. Attach the fuselage cover 27 that covers the fuselage, and in addition, leave a gap inside the fuselage cover 27, attach the base cover 28 that covers the robot base, and from the downward cover gap as a vent on the lower side of the robot. The structure is such that the air is taken in upward and exhausted downward.

【0023】

[Example]

Hereinafter, examples of the present invention will be described. [Experimental device] A cleanliness measurement experiment was conducted using the clean transfer device (RACS300-2A type manufactured by Lhotse Co., Ltd.) 2 shown in Fig. 2. The fan filter unit 3 provided on the ceiling is equipped with two sirocco fans 4 in parallel, the ULPA filter 5 has the ability to remove 99.9999% of 0.1 μm silica particles, and the blowout part to the first chamber has a diameter of 5 mm. Almost the entire surface of the ceiling 6 made of punched metal plate with many holes has an area of 590 mm x 1080 mm, and the maximum wind speed is 0.65 m / sec at a position 200 mm below the blowout part. The volume of the first room is 1150 mm wide x 685 mm deep x 940 mm high, and the volume of the second room is 1150 mm wide x 685 mm deep x 605 mm high. A scalar-type transfer robot (RR713 type manufactured by Lhotse Co., Ltd.) 10 having a body diameter of 260 mm is installed on the bottom frame 2b in the center of the bottom of the second chamber through the first floor 11. The first floor 11 is made of a punching metal plate having a large number of holes having a diameter of 4 mm, and a gap having a width of 0.5 mm is provided around the transfer robot 10 so that the transfer robot 10 can move up and down and rotate.

【0024】

Two load ports 20 for placing 300 mm wafer storage cassettes (hereinafter referred to as "FOUP") were installed on one wall surface in the lateral direction, and the port doors were used as the door 21 of the wall surface. The door area is 360 mm x 335 mm, and there is a 6 mm wide gap around it when the door is closed. When the door 21 opens and the FOUP moves forward by the wall thickness, a maximum 20 mm wide gap is temporarily created, but it stops. Then, the gap between the FOUP and the door frame 23 fits in a width of 6 mm. The other surrounding walls were sealed.

【0025】

The bottom frame 2b has an aperture ratio of 53% at the maximum when equipment such as a robot stand or control equipment is installed and the second floor 13 of the punching metal plate is not used, and the bottom frame 2b is attached to the outside. Punching metal plates were lined up in the open area to change the aperture ratio of the bottom frame 2b. In this experiment, the aperture ratios of the first floor 11 and the second floor 13 were changed by attaching a plastic tape having a plate width of 40 mm to the punched metal floor.

【0026】

[Measurement] The wind speed was measured using a wind speed meter AM-09S manufactured by Rion Co., Ltd. at a position 200 mm below the ceiling in the center of the first room. The differential pressure was measured about 600 mm below the ceiling and about 300 mm inside from the center of the depth side wall. For foreign particles, use a particle counter, laser dust monitor TS3700 manufactured by Hitachi Electronics Engineering Co., Ltd., and for particles of 0.1 μm or more, suck air at 28.3 L / min (= 1 Cubic Feet / min.) For 1 minute to collect data. It was taken, measured 3 times and averaged. When measuring while transferring the wafer with the transfer robot 10, a sampling point was selected at a height of approximately 450 mm below the ceiling without touching the arm 17 and as close to the center as possible. Further, sampling under the wafer was stopped while the 300 mm wafer was placed on the finger at the tip of the arm 17 of the transfer robot 10 in the first chamber, and sampling was performed directly under the finger.

【0027】

[Example 1] As the first floor 11, a punching plate (perforated plate) having a 4 mmφ hole drilled at each apex of an equilateral triangle having a side of 8 mm is used, and the opening ratio is 5 mm on the periphery of the body of the transport robot 10. The total of all the openings of the width gap, the 6 mm width gap around the door 21, and the elevating passage portion of the door 21 was 20%. A transfer robot 10, a power supply device 18, a control device 12, and the like were installed on the bottom frame 2b, and the second floor 13 of the punching plate was not particularly placed, and the opening ratio of the bottom frame 2b was 53%.

【0028】

The blowing speed from the fan filter unit 3 is changed from 0.05 m / sec to 0.65 m / sec, and the transfer robot 10 is operated to transfer the wafer between the two FOUPs while moving the wafer directly above the wafer and again. Clean air was sampled immediately below the wafer that was stopped while being placed on the finger of the transfer robot 10, and the number of foreign matter particles of 0.1 μm or more was measured and entered in Table 1. The differential pressure between the first room and the outside and the differential pressure between the second room and the outside were measured each time the wind speed was changed, and are also shown in Table 1. The ventilation rate was calculated by dividing the volume of the blown air by the volume of the first room. From the results shown in Table 1, the number of foreign particles on the wafer is 0 at 0.1 m / sec (ventilation rate 6.4 times / min) or higher, and there is no problem at all. On the other hand, under the wafer, 0.3 m / sec (ventilation frequency 19.1 times / minute) is not a problem, but 0.1 m / sec, 0.5 m / sec, 0.6 m / sec (ventilation frequency 38.3 times / min) is 0.3 pieces. , Class 1 is satisfied in this range.

【0029】

[Example 2] In Example 1, a punching plate was laid on a part of the bottom frame 2b as a second floor 13 and the opening ratio of the bottom frame 2b was set to 25%. The results are summarized in Table 1. Shown. With a wind speed of 0.65 m / sec, only 0.3 wafers can be seen directly under the wafer, and there are no other problems. Ventilation was insufficient at a ventilation rate of 4.8 times / minute or less, but class 1 was maintained up to 41.5 times / minute, and it was found that the effect of the second floor was effective.

【0030】

[Example 3] In Example 2, the same was true except that the opening ratio of the first floor was narrowed down to 5%, and the results are summarized in Table 1. At a wind speed of 0.6 m / sec, 0.3 wafers can be seen directly under the wafer, and at a wind speed of 0.65 m / sec (ventilation frequency 41.5 times), 2.3 wafers can be seen directly under the wafer, but there are no other problems. That is, class 1 is satisfied in the range of 0.1 m / sec to 0.6 m / sec.

【0031】

[Example 4] In Example 1, a punching plate was laid on a part of the bottom frame 2b as a second floor 13 and the opening ratio of the bottom frame 2b was set to 12%. The results are summarized in Table 1. Shown. The range of 0.1 m / sec to 0.65 m / sec and the ventilation rate of 6.4 times / minute to the range of 41.5 ventilation times Class 1 is satisfied, suggesting that even higher ventilation rate is good.

【0032】

[Example 5] In Example 4, one load port having a width of 470 mm and a height of 1577 mm is removed, and the opening ratio of the first chamber and the second chamber is 12.7% on the wall on the load port side of the housing 2a. An opening was provided. The opening ratio of this opening to the portion of the wall facing the first chamber was 13%. The data on the number of foreign particles and the differential pressure are summarized in Table 1. As a result, if the differential pressure in the first chamber is kept at 0.1 Pa or more in the range of ventilation frequency of 12.8 to 41,5 times / minute, even if the differential pressure in the second chamber is less than 0.1 Pa, it will be at the bottom of the wafer. The number of foreign particles in the above was less than 1, and it was found that class 1 was achieved. Therefore, even if the load port 20 of the clean transfer device of the present embodiment fails, if the load port 20 is replaced without stopping the fan filter unit 3, the clean transfer device will not be contaminated at all and the clean transfer device will not be contaminated. It has been found that the failure can be dealt with without stopping the operation or by stopping for a short time.

[table 1]<img file="JP2004014635A_D0001.tif" /> 【0033】

[Effect of the invention]

A second floor such as a punching plate that controls air flow is provided at the bottom of the housing by providing a first floor through which air flows, which is located in the middle of the clean transfer device and just below the arm of the transfer robot. It was found that class 1 can be maintained for at least 0.1 μm foreign particles in the range of ventilation frequency of 5 to 38 times / minute without providing a floor. This is more than 10 times more clean than a conventional clean booth. Here, if a punching plate is used as a second floor at the bottom of the housing, 0 foreign particles can be realized even on the back side of the wafer where an air vortex is generated, and the opening between the first floor and the bottom of the housing can be realized. By satisfying the predetermined conditions, all the data will be 0 at a ventilation rate of 5 to 42 times / minute or more and a wind speed of 0.1 to 0.65 m / sec or more, and class 0 will be applied to 0.1 μm foreign particles. This has made it possible to manufacture semiconductors with a line width of 0.1 μm. Further, by satisfying the predetermined conditions for the opening ratio of the wall and the differential pressure of the first chamber with respect to the outside, it is possible to replace the load port without contaminating the wafer at all.

[Simple explanation of drawings]

FIG. 1 is a partially cutaway perspective view showing a thin plate-shaped electronic component manufacturing facility including a thin plate-shaped electronic component clean transfer device according to an embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view showing a thin plate-shaped electronic component clean transfer device according to another embodiment of the present invention.

FIG. 3 is a perspective view showing a load port on which a cassette is placed in the clean transfer device shown in FIG.

[Explanation of symbols]

1 Thin plate electronic product manufacturing system 2 Clean transfer device 2a Housing 2b Bottom frame 3 Fan filter unit 4 Sirocco fan 5 ULPA filter 6 Clean air outlet 7 Cassette 10 Transfer robot 11 First floor 12 Control device 13 Second floor 14 Wafer positioning device 15 Wafer 16 Input / output device 17 Robot arm 18 Power supply device 19 Partition 20 Load port 21 Door 22 Stage 23 Door frame 24 Wall 26 Arm joint 27 Body cover 28 Base cover 30 Semiconductor processing device 31 Transfer in processing device Machine 32 Load lock chamber 33 Load lock chamber Door 34 Processing chamber