Multilayer electronic component

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Technical field to which the invention belongs]

The present invention relates to multilayer electronic components, in particular, multilayer electronic components such as laminated LC filters and multilayer substrates.

【0002】

[Conventional technology]

As a multilayer electronic component of this type, the LC filter 40 having the configuration shown in FIG. 6 has been conventionally known. This LC filter 40 has via holes 21a to 21e, 22a to 22e, 23a to 23e for inductors, capacitor electrodes 24,25,26 for resonance, capacitor electrodes 27,28 for coupling, capacitor electrodes 29 for damping electrode adjustment, input / output extractions. It is composed of insulating sheets 1 to 13 provided with electrodes 33 and 34, folded electrodes 14a to 17b, and shield electrodes 30 to 32, respectively.

【0003】

The insulating sheets 1 to 13 are stacked, then pressure-bonded and integrally fired to form the laminated body 55 shown in FIG. 7. An input terminal 56, an output terminal 57, and a ground terminal G are formed on the laminated body 55. The input extraction electrode 33 is connected to the input terminal 56, and the output extraction electrode 34 is connected to the output terminal 57. Shield electrodes 30 to 32 are connected to the ground terminal G.

【0004】

In the above LC filter 40, the inductor via holes 21a to 21e, 22a to 22e, and 23a to 23e are connected in the stacking direction of the insulating sheets 1 to 13, respectively, to form columnar via inductors L1, L2, and L3. The resonance capacitor electrodes 24, 25, and 26 form resonance capacitors C1, C2, and C3 by facing the shield electrodes 32 with the insulating sheets 8 to 11, respectively. The columnar via inductor L1 and the capacitor C1 form the LC resonator Q1, the columnar via inductor L2 and the capacitor C2 form the LC resonator Q2, and the columnar via inductor L3 and the capacitor C3 form the LC resonator Q3. ing. The coupling capacitor electrodes 27 and 28 face the resonance capacitor electrodes 24 to 26 with the insulating sheets 8 and 9 interposed therebetween to form the coupling capacitors Cs1 and Cs2. The LC resonators Q1 to Q3 are coupled via coupling capacitors Cs1 and Cs2 to form a three-stage bandpass filter circuit.

【0005】

[Problems to be Solved by the Invention]

By the way, when the insulating sheets 1 to 13 are stacked and crimped, an air pool may be formed inside the laminated body. When the laminate in which such an air pool is formed is fired, delamination is likely to occur at the portion of the air pool.

【0006】

Further, as the conductor material used for forming the via holes 21a to 21e, 22a to 22e, 23a to 23e for the inductor, a material having a high binder content is usually used. If the amount of the conductor material filled in the hole for the inductor is too large and overfilled, the laminate may crack due to expansion and contraction of the conductor material during firing, so this is to prevent overfilling. .. The binder is gasified during firing and scatters out of the laminate. However, when the temperature is rapidly raised in order to shorten the firing time, the gas rapidly generated from the conductor material of the inductor via holes 21a to 23e cannot be scattered to the outside of the laminate, and the inductor via holes 21a to 23e Gas pools are generated around the surface, causing problems such as interlayer peeling and electrode peeling. Therefore, it is necessary to suppress the rate of temperature rise, lengthen the firing time, and gradually generate gas, which has been one of the factors hindering mass production.

【0007】

As a countermeasure against this, a method has been proposed in which a laminated body obtained by stacking and crimping insulating sheets 1 to 13 is drilled with a gas vent hole by a laser or a press, and then fired. However, this method cannot prevent air accumulation that occurs when the insulating sheets 1 to 13 are stacked and crimped, requires advanced drilling technology and equipment, and is expensive to manufacture.

【0008】

Therefore, an object of the present invention is to provide a multilayer electronic component capable of efficiently scattering the gas inside the laminate to the outside during firing.

【0009】

[Means and Actions for Solving Problems]

In order to achieve the above object, the multilayer electronic component according to the present invention is a multilayer electronic component in which an electric functional element is formed in a laminated body formed by stacking insulating layers, and is a via conductor composed of via holes provided in the insulating layer. A degassing hole provided in the insulating layer is provided, the via conductor and the degassing hole are connected to each other, and an opening of the degassing hole is formed on the surface of the laminated body.

【0010】

Here, the via hole means that the hole provided in the insulating layer is substantially filled with the conductor material by a method such as screen printing. The degassing hole is a hole provided in the insulating layer that is not filled with the conductor material, or an inner peripheral wall of the hole provided in the insulating layer is provided with the conductor material by a method such as plating. It means that the hole is not closed. Further, the via conductor is a via inductor that constitutes an inductor by connecting via holes, for example, and the via hole that constitutes the via conductor is, for example, an elongated hole.

【0011】

With the above configuration, the via conductor and the outside world are communicated with each other through the degassing hole. Therefore, the release property of the gas generated from the conductor material of the via conductor is improved, and the gas is less likely to be accumulated around the via conductor.

【0012】

Further, by setting the cross-sectional area of the gas vent hole to be smaller than the cross-sectional area of the via conductor, the plating solution for forming the external terminal is less likely to enter the gas vent hole, and deterioration of the internal electrode can be prevented. Further, if the via hole in contact with the gas vent hole is included in the shield electrode, even if the plating solution for forming the external terminal invades the gas vent hole, it is blocked by the shield electrode and the deterioration of the internal electrode is prevented. can do.

【0013】

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the multilayer electronic component according to the present invention will be described with reference to the accompanying drawings. In this embodiment, the present invention is applied to the conventional laminated LC filter 40 shown in FIGS. 6 and 7.

【0014】

FIG. 1 shows the configuration of the laminated LC filter 40A, and FIGS. 3 and 4 show an external perspective view and an electrical equivalent circuit diagram of the LC filter 40A, respectively. The LC filter 40A is a three-stage bandpass filter having LC resonators Q1, Q2, and Q3. As shown in FIG. 1, the laminated LC filter 40A is provided with holes 41a, 41b, 42a, 42b, 43a, and 43b in the insulating sheets 1 and 2 of the conventional laminated LC filter 40, respectively.

【0015】

The insulating sheets 1 to 13 are made by kneading a dielectric powder or a magnetic powder together with a binder into a sheet. The insulating sheet 5 has a thickness of 880 μm (dimensions after firing, the same applies hereinafter), and the insulating sheet 7 has a thickness of 720 μm. These sheets 5 and 7 may be composed of one sheet, or a plurality of sheets may be laminated (for example, 11 or 9 sheets having a thickness of 80 μm are laminated). Sheets 1 to 4, 6 and 8 to 12 have a thickness of 28 μm. Further, the sheet 13 is a dummy sheet for adjusting the height dimension of the laminated body 55, and its thickness is about 40 μm.

【0016】

The electrodes 14a to 17b and 24 to 32 are made of Ag, Pd, Cu, Ni, Au, Ag-Pd, etc., and are formed by a thin film forming method such as a sputtering method, a vapor deposition method, a photolithography method, or a pattern printing method. .. Inductor via holes 21a ~ 21e, 22a ~ 22e, 23a ~ 23e are made of insulating sheets 3 to 7 with elongated holes made of molds, lasers, etc., and conductors such as Ag, Pd, Cu, Ni, Au, Ag-Pd. It is formed by filling this slot with material. In the case of this embodiment, the length of the elongated hole is set to 1000 μm and the width is set to 167 μm.

【0017】

The inductor via holes 21a to 21e, 22a to 22e, and 23a to 23e are connected in the stacking direction of the insulating sheets 1 to 13, respectively, to form columnar via inductors L1, L2, and L3 having a substantially λ / 4 length. .. In the case of this embodiment, the lengths of the columnar via inductors L1 to L3 are set to 1712 μm. The axial direction of the columnar via inductors L1 to L3 is perpendicular to the surfaces of the sheets 1 to 13. The magnetic fields generated by the via inductors L1 to L3 orbit the surfaces parallel to the surfaces of the sheets 1 to 13. The upper ends (via holes 21a, 21b, 22a, 22b, 23a, 23b) of the via inductors L1 to L3 are connected to the shield electrodes 30 and 31 and are short-circuited. The input extraction electrode 33 and the output extraction electrode 34 are connected to the via holes 21d and 23d provided in the insulating sheet 6, respectively.

【0018】

On the other hand, the holes 41a, 41b, 42a, 42b, 43a, 43b are formed by making holes in the insulating sheets 1 and 2 with a mold, a laser, or the like. If necessary, apply a conductive material such as Ag, Pd, Cu, Ni, Au, Ag-Pd to the inner peripheral walls of the holes 41a to 43b by printing or plating (however, the holes are not closed). ). The holes 41a, 41b, 42a, 42b, 43a, and 43b are connected to each other in the stacking direction of the insulating sheets 1 to 13 to form the vent holes 41, 42, 43, respectively. The lower ends of the degassing holes 41, 42, 43 (vacant holes 41b, 42b, 43b) are connected to the via inductors L1, L2, L3.

【0019】

The via inductors L1 to L3 and the degassing holes 41 to 43 are not limited to those in which via holes and holes for inductors are connected, respectively, but a thick insulating sheet provided with one via hole and holes for inductors. But it may be.

【0020】

Resonant capacitor electrodes 24, 25, and 26 arranged on the surface of the insulating sheet 8 face the shield electrodes 32 with the insulating sheets 8 to 11 sandwiched therein, and form resonance capacitors C1, C2, and C3, respectively. The resonance capacitor electrode 24 is connected to the lower end (via hole 21e) of the inductor L1, and the inductor L1 and the capacitor C1 form an LC resonator Q1. The resonance capacitor electrode 25 is connected to the lower end (via hole 22e) of the inductor L2, and the inductor L2 and the capacitor C2 form an LC resonator Q2. The resonance capacitor electrode 26 is connected to the lower end (via hole 23e) of the inductor L3, and the inductor L3 and the capacitor C3 form an LC resonator Q3. Mutual inductance M is formed between the inductors L1 and L2 and between the inductors L2 and L3, respectively, and magnetically couples the resonators Q1 and Q2 and the resonators Q2 and Q3, respectively.

【0021】

Further, the resonance capacitor electrodes 24 and 25 face the coupling capacitor electrode 27 with the insulating sheet 8 interposed therebetween, and form a coupling capacitor Cs1 for coupling between the LC resonators Q1 and Q2. The resonance capacitor electrodes 25 and 26 face the coupling capacitor electrode 28 with the insulating sheet 8 interposed therebetween, and form a coupling capacitor Cs2 for coupling between the LC resonators Q2 and Q3. Further, the attenuation electrode adjusting capacitor electrode 29 faces the coupling capacitor electrodes 27 and 28 with the insulating sheet 9 interposed therebetween, and forms the attenuation electrode adjusting capacitor Cs3.

【0022】

Folded electrodes 14a and 15a for ground terminals are formed on the front and back sides of the upper surface of the insulating sheet 1, respectively, and the folded electrodes 16a for input terminals and the folded electrodes 17a for output terminals are formed at the center of the left and right sides, respectively. Is formed. The folded electrodes 14a and 15a for the ground terminal have a substantially U-shaped pattern, and both ends are exposed on the left and right sides of the insulating sheet 1. Similarly, the folded electrodes 14b and 15b for the ground terminal are formed on the front side and the back side of the lower surface of the insulating sheet 13, respectively, and the folded electrodes 16b for the input terminal and the folded electrode for the output terminal are formed at the center of the left and right sides, respectively. The folded electrode 17b is formed.

【0023】

The shield electrodes 30 to 32 are formed over a wide area on the surfaces of the sheets 3, 4, 12 respectively, and the drawer portions are exposed on the four sides of the sheets 3, 4, 12. Capacitor electrodes 27 and 28 for coupling and capacitor electrodes 29 for adjusting the attenuation electrode are arranged between the shield electrode 32 and the resonance capacitor electrodes 24 to 26.

【0024】

The sheets 1 to 13 are stacked and crimped to form a laminated body 55 as shown in FIG. The openings (vacant holes 41a, 42a, 43a) of the degassing holes 41 to 43 are formed on the upper surface of the laminated body 55. That is, the via inductors L1 to L3 and the outside world are communicated with each other through the degassing holes 41 to 43. When the laminate 55 is fired, the gas generated from the conductor materials of the via inductors L1 to L3 efficiently scatters to the outside through the gas vent holes 41 to 43. Therefore, gas is less likely to accumulate around the via inductors L1 to L3.

【0025】

In this way, the laminate 55 shown in FIG. 3 (for example, length 5.0 mm, width 4.0 mm, height 2.0 mm) is obtained. Input terminals 56 and output terminals 57 are formed on the left and right end faces of the laminate 55 by a dip method, a thin film forming method, a photolithography method, a pattern printing method, a transfer printing method, or the like, respectively. A ground terminal G is formed on each side surface. The input extraction electrode 33 is connected to the input terminal 56, the output extraction electrode 34 is connected to the output terminal 57, and the shield electrodes 30 to 32 are connected to the ground terminal G.

【0026】

Since the laminated LC filter 40A having the above configuration has gas vent holes 41 to 43 connected to the via inductors L1 to L3, it is difficult for gas to collect around the via inductors L1 to L3. Therefore, even if the temperature is rapidly raised during firing and gas is suddenly generated from the insulating sheets 1 to 13, the electrodes 24 to 32, and the conductor materials of the via inductors L1 to L3, this gas is a degassing hole. It is efficiently scattered out of the laminate 55 through 41 to 43. In particular, the conductive material of the via inductors L1 to L3 is a conductive paste having a metal component to a binder component (including a solvent) ratio of, for example, 50:50, and is a conductive paste used for forming the electrodes 24 to 32. The proportion of binder component is higher than that. Therefore, the amount of gas generated from the via inductors L1 to L3 is relatively large compared to the amount of gas generated from the electrodes 24 to 32, and the via inductors L1 to L3 are provided with degassing holes 41 to 43. The effect of connecting is great. As a result, the firing time can be shortened without causing problems such as delamination and electrode peeling.

【0027】

Further, in the conventional laminated LC filter 40, if the amount of the conductor material filled in the hole for the inductor is too large and the conductor material is overfilled, the via inductors L1 to L3 are raised after firing and the insulating sheet 1, 2 was pushed up, and cracks may occur on the surface of the laminate 55. However, in the laminated LC filter 40A of the present embodiment, since the degassing holes 41 to 43 are formed, excess conductor material may wrap around the degassing holes 41 to 43, or the degassing holes 41 to 43 may be used. Excess conductor material protrudes. Therefore, cracks on the surface of the laminated body 55 can be suppressed.

【0028】

Further, in the case of an LC filter provided with via inductors L1 to L3, variations in the positions of via inductors L1 to L3 have a great influence on electrical characteristics. For example, when cutting out an LC filter from a mother board provided with many LC filters, if the cut position shifts to the left or right, the distance between the via inductor L1 and the input terminal 56 becomes the distance between the via inductor L3 and the output terminal 57. Is different, and the inductance value changes (same before and after). However, since the laminated body LC filter 40A of the present embodiment has gas vent holes 41 to 43 formed, the positions of the via inductors L1 to L3 inside the laminated body 55 can be confirmed through the gas vent holes 41 to 43. Therefore, the position of the degassing holes 41 to 43, that is, the via inductors L1 to L3 can be detected by an image sensor or the like, and the LC filter 40A can be cut out from the mother substrate according to the positions of the via inductors L1 to L3. The positions of inductors L1 to L3 are stable, and variations in electrical characteristics are reduced.

【0029】

Further, since the degassing holes 41 to 43 are formed on the upper surface of the laminated body 55, the upper surface of the laminated body 55 can be confirmed, and the degassing holes 41 to 43 also function as a direction identification mark.

【0030】

Further, when the insulating sheets 1 to 13 are stacked and crimped, the air accumulated inside the laminated body 55 can also be discharged to the outside of the laminated body 55 through the degassing holes 41 to 43, resulting in delamination and electrodes. Problems such as peeling can be further suppressed.

【0031】

Further, by setting the cross-sectional area of the degassing holes 41 to 43 to be smaller than the cross-sectional area of the via inductors L1 to L3, it becomes difficult for the plating solution for forming the external terminal to enter the degassing holes 41 to 43, and the internal electrodes 30 and the like are prevented. Deterioration can be prevented. By making the degassing holes 41 to 43 smaller than the via inductors L1 to L3, it is possible to reduce the partial pressure reduction during press crimping of the insulating sheets 1 to 13. The exposed surfaces of the via inductors L1 to L3 can be made smaller, and short circuits to the external terminals 56, 57, etc. due to migration of the conductor material can be prevented. Further, it is possible to prevent the conductor material from coming off and falling from the via inductors L1 to L3.

【0032】

Further, if the via holes 21a and 21b in contact with the degassing holes 41 to 43 are included in the shield electrodes 30 and 31, even if the plating solution for forming an external terminal invades the degassing holes 41 to 43, the shield electrode It is blocked by 30,31 and can prevent deterioration of the internal electrode 30 and the like.

【0033】

The multilayer electronic component according to the present invention is not limited to the above embodiment, and can be variously changed within the scope of the gist thereof. Although the embodiment has been described by taking a three-stage bandpass filter as an example, it may be a two-stage or four-stage or more-stage bandpass filter, or a low-pass filter or a high-pass filter. Further, for example, a multilayer board, a transmission / reception device such as an RF diode switch, a duplexer, a triplexer, and a diplexer, and a high frequency composite component such as an RF module are also included. Further, the shield electrodes may be arranged only on either the upper part or the lower part of the laminated body.

【0034】

Further, the cross-sectional shape of the beer hole for the inductor is arbitrary, and may be circular, elliptical, rectangular, or the like in addition to the oval shape as in the above embodiment. For example, in the case of a three-stage bandpass filter such as the LC filter 40A, the resonance frequency of the LC resonators Q1 and Q3 at the input / output ends may be lower than the resonance frequency of the remaining (center) LC resonator Q2. is there. Therefore, as shown in FIG. 5, the cross-sectional area of the inductor via holes 21a to 21e and 23a to 23e may be smaller than the cross-sectional area of the inductor via holes 22a to 22e. The cross-sectional lengths D1 and D3 of the inductor via holes 21a to 21e and 23a to 23e are shorter than the cross-sectional lengths D2 of the inductor via holes 22a to 22e. Alternatively, the width W2 of the cross section of the inductor via holes 22a to 22e may be wider than the width W1 and W3 of the cross section of the inductor via holes 21a to 21e and 23a to 23e.

【0035】

Further, the gas vent hole has an arbitrary cross-sectional shape, hole depth, number, position, and the like. Not all vent holes need to be the same shape. Further, the opening of the degassing hole may be formed on any surface of the upper surface, the mounting surface (bottom surface) or the side surface of the multilayer electronic component, or may be formed on both the upper surface and the mounting surface. .. Further, the degassing hole may be bent in an arbitrary direction inside the component, or the shape of the hole may change in the middle. Degassing holes may be connected to both the upper and lower ends of the via inductor.

【0036】

Further, in the above embodiment, insulating sheets on which electrodes and via holes are formed are stacked and then fired integrally, but the present embodiment is not necessarily limited to this. As the insulating sheet, one that has been fired in advance may be used. Further, the multilayer electronic component may be manufactured by the manufacturing method described below. After forming an insulating layer with a paste-like insulating material by a method such as printing, a paste-like conductive material is applied to the surface of the insulating layer to form electrodes and via holes. Next, a paste-like insulating material is applied from above to form an insulating layer. Similarly, a multi-layer electronic component having a laminated structure can be obtained by applying the layers in order.

【0037】

[Effect of the invention]

As is clear from the above description, according to the present invention, the via conductor and the outside world are communicated with each other through the degassing hole. Therefore, the release property of the gas generated from the conductor material of the via conductor is improved, and the gas is less likely to be accumulated around the via conductor. As a result, the firing time can be shortened without causing problems such as delamination and electrode peeling.

【0038】

Further, by setting the cross-sectional area of the gas vent hole to be smaller than the cross-sectional area of the via conductor, the plating solution for forming the external terminal is less likely to enter the gas vent hole, and deterioration of the internal electrode can be prevented. Further, if the via hole in contact with the gas vent hole is included in the shield electrode, even if the plating solution for forming the external terminal invades the gas vent hole, it is blocked by the shield electrode and the deterioration of the internal electrode is prevented. can do.

[Simple explanation of drawings]

[Figure 1]

The exploded perspective view which shows one Embodiment of the multilayer electronic component which concerns on this invention.

[Figure 2]

II-II sectional view of FIG.

[Fig. 3]

The external perspective view of the multilayer electronic component shown in FIG.

[Fig. 4]

The electrical equivalent circuit diagram of the multilayer electronic component shown in FIG.

[Fig. 5]

The cross-sectional view which shows the deformation example of a via hole.

[Fig. 6]

An exploded perspective view showing a conventional multi-layer electronic component.

[Fig. 7]

The external perspective view of the multilayer electronic component shown in FIG.

[Explanation of symbols]

40A ... Stacked LC filter 1 ~ 13 ... Insulation sheet 21a ~ 21e, 22a ~ 22e, 23a ~ 23e ... Via holes for inductors 24,25,26 ... Resonant capacitor electrode 30,31,32 ... Shield electrode 41,42,43 ... Degassing holes 41a, 41b, 42a, 42b, 43a, 43b ... Holes L1 ~ L3 ... Via inductor C1 ~ C3 ... Resonant capacitor Q1 ~ Q3 ... LC resonator