Light emitting device and its manufacturing method, and lead frame used for manufacture the light emitting device

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Technical field to which the invention belongs]

The present invention relates to a light emitting device, a method for manufacturing the same, and a lead frame used for manufacturing the light emitting device, and more particularly to a technique effective when applied to a surface mount type light emitting device using a light emitting element such as a light emitting diode (LED). It is a thing.

【0002】

[Conventional technology]

Conventionally, light emitting devices using light emitting elements such as light emitting diodes have been widely used in various pilot lamps, display displays, backlights of liquid crystal displays, light sources for exposure of printer heads, optical communications, and the like. The light emitting device includes an insertion mounting type in which a first lead (cathode) and a second lead (anode) are inserted into a through hole of a mounting board and soldered, and a pad (terminal) provided on the surface of the mounting board. There is a surface mount type that is soldered to).

【0003】

In the insertion-mount type light emitting device, for example, as shown in FIG. 23 (a), a conductive adhesive such as silver paste is used at one end of the first lead (cathode) 2 to form the first light emitting element 1. An electrode (not shown) is adhered, a second electrode (not shown) of the light emitting element 1 and a second lead (anode) 3 are connected by a bonding wire 5, and the light emitting element 1 and the first electrode of the light emitting element 1 are connected. The adhesive portion of the first lead 2 and the connection portion between the second electrode of the light emitting element 1 and the second lead are sealed with a transparent insulator 4 such as an epoxy resin.

【0004】

Further, as shown in FIGS. 23 (a) and 23 (b), the tip portion of the first lead 2, in other words, the portion to which the light emitting element 1 is adhered, is a cup-shaped reflection having a flat bottom surface. The member 11 is provided, and the light output from the light emitting element 1 is reflected by the surface of the reflecting member 11 to improve the light collecting property, and high output light can be obtained.

【0005】

As shown in FIG. 23A, the through-hole mounting type light emitting device was mounted on a mounting substrate because the first lead 2 and the second lead 3 were pin-shaped and protruded from the insulator 4. The height T from the mounting surface becomes high, and it is difficult to miniaturize the electronic device using the light emitting device. Therefore, a surface mount type light emitting device has been proposed, in which the height from the mounting surface can be lowered and the electronic device using the light emitting device can be easily miniaturized.

【0006】

As the surface-mounted light emitting device, for example, as shown in FIG. 24A, a wiring board 12 having a cathode electrode pattern 1202 and an anode electrode pattern 1203 formed on the surface of the insulating substrate 1201 is used, and the cathode electrode pattern is used. A light emitting element (light emitting diode) 1 is adhered on 1202, an anode of the light emitting diode 1 (not shown) and an anode electrode pattern 1203 of the wiring board 12 are connected by a bonding wire 5, and transparent on the wiring board 12. There is a light emitting device provided with a simple insulator 4 (see Japanese Patent Application Laid-Open No. 10-242526).

【0007】

The wiring board 12 is an insulating substrate 1201 such as a polyimide resin or a glass cloth base material epoxy resin substrate impregnated with an epoxy resin using a glass cloth as a base material, such as a wiring board used in a tape carrier package or the like. A conductor pattern of the cathode electrode pattern 1202 and the anode electrode pattern 1203 is provided on the surface. At this time, the cathode electrode pattern 1202 and the anode electrode pattern 1203 are each drawn out to the surface on the back side of the surface to which the light emitting element (light emitting diode) 1 is adhered by, for example, end face through holes.

【0008】

Further, in the light emitting device as shown in FIG. 24A, a reflecting member 11 is provided so as to surround the light emitting diode 1 in order to improve the light collecting property of the light output from the light emitting diode 1. ing. Further, the insulator 4 is provided with a convex lens portion 41, for example, as shown in FIG. 24A, in order to control the light condensing property of the output light.

【0009】

Further, in the surface mount type light emitting device, in addition to the light emitting device using the wiring board 12 as shown in FIG. 24 (a), for example, as shown in FIG. 24 (b), for example, There is a light emitting device provided with a reflection cup portion 17 for accommodating the light emitting element (light emitting diode) 1 on the upper surface of the thin metal substrate 13 (see JP-A-2000-252524).

【0010】

In the light emitting device shown in FIG. 24 (b), for example, a thin metal substrate 13 such as copper or iron is press-molded into a predetermined shape, and slits 16 parallel to the stepped portions 14 and 15 provided on both sides 2 It is separated into two. Further, a third resin 21 for reinforcement is disposed on the back surface side of the thin metal substrate 13.

【0011】

To briefly explain the manufacturing method of the light emitting device shown in FIG. 24 (b), first, the thin metal substrate 13 is press-molded to form the stepped portions 14, 15 and the reflective cup portion 17, and the stepped portion 14 is formed. A slit 16 parallel to the 15th and 15th is formed to separate the thin metal substrate 13.

【0012】

Next, for example, after the slit 16 is covered with masking tape 18, the back side surface of the thin metal substrate 13 is filled with a third resin 21 such as an epoxy resin to reinforce it.

【0013】

Next, the light emitting diode 1 is arranged in the reflection cup portion 17, the lower electrode of the light emitting diode 1 is fixed to the bottom surface of the reflection cup portion 17 with a conductive adhesive, and the upper electrode of the light emitting diode 1 is bonded. The wire 5 is connected to the wire bond electrode provided at the step portion 14 on the opposite side of the slit 16.

【0014】

After that, the reflective cup portion 17 is filled with the first resin 19 mixed with the wavelength conversion material, and the whole is sealed with the second resin 20.

【0015】

[Problems to be Solved by the Invention]

However, among the conventional techniques, it is difficult to miniaturize the through-hole mounting type light emitting device as shown in FIGS. 23 (a) and 23 (b), and the electronic device using the light emitting device is used. There was a problem that it was difficult to miniaturize.

【0016】

Further, in the case of a surface mount type light emitting device using the wiring board 12 as shown in FIG. 24A, the light emitting diode 1 is adhered to the wiring board 12, and the light emitting diode 1 is attached to the light emitting diode 1. The generated heat is dissipated to the outside via the wiring board 12, but since the heat conductivity of the insulating substrate 1201 is low, the light emitting diode 1 has a high output and a large amount of heat generation, or is continuous for a long time. There is a problem that the heat generated from the light emitting diode 1 cannot be sufficiently dissipated and the inside of the light emitting device tends to become hot.

【0017】

When the light emitting diode 1 has heat and becomes high in temperature, there is a problem that the electrical characteristics of the light emitting diode 1 are changed and the luminous efficiency is lowered.

【0018】

Further, since the reflective member 11 formed in a process different from the process of forming the wiring board 12 is adhered, there is a problem that the manufacturing process and the number of parts are increased and the manufacturing cost is increased.

【0019】

Further, the wiring board 12 has a problem that it is difficult to reduce the thickness of the insulating substrate 1201 in order to secure the strength, and it is difficult to reduce the thickness and size of the device.

【0020】

Further, in the case of a surface mount type light emitting device using the thin metal substrate 13 as shown in FIG. 24 (b), the light emitting device is manufactured by using the masking tape 18 or the third resin 21. Since the number of parts (materials) used for this purpose is large and the manufacturing process is complicated, there is a problem that the manufacturing cost of the device increases.

【0021】

Further, in the case of the light emitting device using the thin metal substrate 13, since the third resin 21 is provided on the back side of the surface to which the light emitting diode 1 is adhered, the heat dissipation characteristic of the heat generated from the light emitting diode 1 is provided. There is a problem that the luminous efficiency of the device is lowered because the heat is easily accumulated in the device.

【0022】

Further, in the case of the light emitting device using the thin metal substrate 13, as shown in FIG. 24 (b), the thin metal substrate 13 is provided with the stepped portions 14 and 15, so that the device can be made thinner and smaller. There was a problem that it was difficult.

【0023】

An object of the present invention is to provide a technique capable of stabilizing the luminous efficiency of a light emitting element and preventing a decrease in operation reliability in a light emitting device using a light emitting element such as a light emitting diode.

【0024】

Another object of the present invention is to provide a technique capable of reducing the thickness and size of a light emitting device using a light emitting element such as a light emitting diode.

【0025】

Another object of the present invention is to provide a technique capable of reducing the number of parts used and reducing the manufacturing cost of the device in the method of manufacturing a light emitting device using a light emitting element such as a light emitting diode. ..

【0026】

The above and other objects and novel features of the present invention will become apparent in the description and accompanying drawings herein.

【0027】

[Means for solving problems]

The outline of the invention disclosed in the present application will be described as follows.

【0028】

(1) The light emitting element, the first lead electrically connected to the first electrode of the light emitting element, the second lead electrically connected to the second electrode of the light emitting element, the light emitting element, and the above. It is composed of a connecting portion between the first electrode of the light emitting element and the first lead, and a transparent insulator that seals the connecting portion between the second electrode of the light emitting element and the second lead. A surface-mounted light emitting device in which a connection terminal portion of the second lead to an external device is provided on the surface of the insulator, and the first lead has a cup shape having one end having a flat bottom surface. The light emitting element is molded and adhered to the bottom surface of the cup-shaped reflecting portion of the first lead, and the surface of the reflecting portion facing the surface to which the light emitting element is adhered is insulated. It is a light emitting device exposed on the surface of the body.

【0029】

According to the means (1), the surface facing the bottom surface of the reflecting portion to which the light emitting element is adhered is exposed to the surface of the insulator, so that the heat generated from the light emitting element is transferred to the light emitting device. It is possible to efficiently dissipate heat to the outside. Therefore, as compared with the conventional surface mount type light emitting device, the heat dissipation characteristic can be improved, the change in the electrical characteristic of the light emitting element due to heat can be reduced, and the luminous efficiency can be stabilized. Further, since the reflecting portion is formed in a cup shape, the light output from the light emitting element has good light collecting property, and high output light can be obtained.

【0030】

Further, a reflective portion for adhering the light emitting element is provided by molding the first lead, and the bottom surface portion of the reflective portion is exposed on the surface of the insulator, whereby the light emitting element and the reflective component are placed on the wiring board. Compared to the bonded surface mount type light emitting device, the device can be made thinner.

【0031】

At this time, the heat dissipation characteristics can be further improved by making the thickness of the bottom surface of the reflecting portion of the first lead smaller than the thickness of the connecting terminal portion.

【0032】

Further, in the light emitting device of the means (1), by providing a protrusion bent toward the inside of the insulator at a position covered with the insulator of the first lead and the second lead. Since the protrusion is sealed in a state of being caught by the insulator, it is possible to prevent the first lead and the second lead from peeling off from the insulator and falling off.

【0033】

Further, in the light emitting device of the means of the above (1), the insulator is provided with a first insulator provided so as to cover the light emitting element in the reflecting portion, and a light emitting element covered with the first insulator. , The connection portion between the first electrode of the light emitting element and the first lead, and the second insulator that seals the connection portion between the second electrode of the light emitting element and the second lead may be formed. .. At this time, by mixing the wavelength conversion material into the first insulator, the wavelength of the light output from the light emitting element can be converted into an arbitrary wavelength and output to the outside of the apparatus.

【0034】

Further, in the light emitting device of the means (1), the connection terminal portion of the first lead is provided on the first surface of the insulator and the second surface in contact with the first surface, and the second lead is said. By providing the connection terminal portion on the first surface of the insulator and the third surface which is in contact with the first surface and is different from the second surface, the light emitting device is mounted when it is mounted on the mounting substrate. It can be mounted so as to output light in the normal direction of the surface, or can be mounted so as to output light in the in-plane direction of the mounting surface, and the degree of freedom in mounting the light emitting device is improved.

【0035】

(2) A lead frame forming step of opening a tape-shaped conductor plate into a predetermined shape to form a lead frame having a first lead and a second lead, and a predetermined position of the lead frame formed in the lead frame forming step. A light emitting element mounting step of adhering a light emitting element to the light emitting element and electrically connecting the first electrode and the first lead of the light emitting element, and the second electrode of the light emitting element and the second lead, and the light emitting element mounting step. Later, on the surface of the lead frame to which the light emitting element is adhered, the light emitting element, the connection portion between the first electrode of the light emitting element and the first lead, and the second electrode of the light emitting element and the second lead. After the sealing step of sealing the connection portion with a transparent insulator and the sealing step, the portions of the first lead and the second lead protruding from the insulator are cut and separated into individual pieces. A method for manufacturing a surface-mounted light emitting device including an individualization step, wherein the lead frame forming step includes a step of opening the conductor plate to form the first lead and the second lead, and the above-mentioned step of forming the first lead and the second lead. The process includes a step of molding the tip of the first lead to form a cup-shaped reflecting portion having a flat bottom surface, and the light emitting element mounting step adheres the light emitting element to the bottom surface of the lead frame in the reflecting portion. It is a method of manufacturing a light emitting device including a process.

【0036】

According to the means (2), in the lead frame forming step, a conventional wiring board is used by forming the tip of the first lead to form a cup-shaped reflecting portion having a flat bottom surface. It is possible to omit the step of adhering the reflective member formed in another step to the first lead, as was performed in the manufacture of the light emitting device. Therefore, the number of parts and manufacturing steps required to manufacture the surface mount type light emitting device can be reduced, and the manufacturing cost of the light emitting device can be reduced.

【0037】

At this time, only the surface of the lead frame on which the light emitting element is mounted is sealed with an insulator, and the surface of the reflecting portion facing the bottom surface on which the light emitting element is mounted is formed on the surface of the insulator. A light emitting device that can be exposed and has stable luminous efficiency can be easily manufactured.

【0038】

Further, in the step of forming the reflective portion, the thickness of the bottom surface portion of the reflective portion is formed to be thinner than the thickness of the region excluding the reflective portion of the first lead, so that the luminous efficiency is further improved. A stable light emitting device can be manufactured.

【0039】

Further, in the manufacturing method of the means (2), in the step of forming the first lead and the second lead, the first lead having a protrusion in the region sealed with the insulator and the second lead. By forming leads and bending the protrusions in the direction of the surface to which the light emitting element is adhered, only one side of the lead frame is sealed with an insulator and separated into individual pieces, and then the first lead and the first lead and The second lead can be prevented from peeling off from the insulator and falling off, and a highly reliable light emitting device can be manufactured.

【0040】

Further, in the manufacturing method of the means (2), in the sealing step, after filling the inside of the reflective portion of the lead frame with a first insulator containing a material for wavelength conversion, the light emission of the lead frame. By sealing the surface to which the element is adhered with a second insulator, a light emitting device that outputs light of an arbitrary wavelength can be easily manufactured.

【0041】

Further, in the manufacturing method of the means (2), in the individualizing step, the first lead and the second lead are cut so as to protrude from the insulator by a predetermined length, and the first lead is cut. By bending the portion of the lead and the second lead that protrudes from the insulator and bringing it into contact with the insulator, a light emitting device having a high degree of freedom in mounting can be manufactured.

【0042】

(3) For forming a light emitting device in which a tape-shaped conductor plate is opened in a predetermined shape, a first lead and the second lead are provided, and a cup-shaped reflecting portion is provided at one end of the first lead. A lead frame in which the tip end portion of the first lead is formed into a cup shape having a flat bottom surface.

【0043】

According to the means (3), the tip of the first reed is molded into a cup shape having a flat bottom surface, so that the light emitting element is mounted on the bottom surface of the cup-shaped molded portion. A light emitting device having high luminous efficiency can be obtained only by sealing with a transparent insulator.

【0044】

Further, in the lead frame of the means (3), the lead frame is bent in the same direction as the end of the cup-shaped reflecting portion at a position covered with the insulators of the first lead and the second lead. By providing the protruding portion, even when the light emitting element is mounted on the reflecting portion of the first lead and only the surface of the lead frame on which the light emitting element is mounted is sealed with an insulator, the first lead and the first lead and the light emitting element are sealed. It is possible to prevent the second lead from peeling off from the insulator and falling off.

【0045】

Further, in the lead frame of the means (3), the thickness of the bottom surface portion of the reflective portion of the first lead is made thinner than the thickness of the connection terminal portion of the first lead with the external device. , It is possible to further improve the luminous efficiency when a light emitting element is mounted and sealed with a transparent insulator.

【0046】

Hereinafter, the present invention will be described in detail together with embodiments (Examples) with reference to the drawings.

【0047】

In all the drawings for explaining the examples, those having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

【0048】

BEST MODE FOR CARRYING OUT THE INVENTION

(Example 1) FIGS. 1 and 2 are schematic views showing a schematic configuration of the light emitting device of the first embodiment according to the present invention, FIG. 1 (a) is a plan view of the entire light emitting device, and FIG. 1 (b) is a plan view. FIG. 1 (a) is a sectional view taken along the line A-A', FIG. 2 (a) is an enlarged sectional view of the first lead of FIG. 1 (b), and FIG. 2 (b) is B of FIG. 1 (a). It is a cross-sectional view along the -B'line.

【0049】

In FIGS. 1 (a) and 1 (b), 1 is a light emitting element, 2 is the first lead, 201 is the connection terminal of the first lead, 202 is the reflection part, 202A is the bottom surface of the reflection part, and 202B is the reflection part. Side (reflecting surface), 203 is the protrusion of the 1st lead, 3 is the 2nd lead, 301 is the connection terminal of the 2nd lead, 303 is the protrusion of the 2nd lead, 4 is the insulator, 4A is the insulator The first surface, 5 is a bonding wire, and 6 is a silver-plated film. Further, in FIG. 2A, θ is the angle formed by the normal of the bottom surface 202A of the reflection portion and the side surface 202B of the reflection portion, T1 is the thickness of the bottom surface portion of the reflection portion, and T2 is the connection terminal portion of the first lead. Is the thickness of.

【0050】

As shown in FIGS. 1 (a) and 1 (b), the light emitting device of the first embodiment is electrically connected to the light emitting element 1 and the first electrode (not shown) of the light emitting element 1. 1 lead 2, a second lead 3 electrically connected to a second electrode (not shown) of the light emitting element 1, the light emitting element 1, the first electrode of the light emitting element 1 and the first lead 2 It is composed of a connection portion and a transparent insulator 4 that seals the connection portion between the second electrode of the light emitting element 1 and the connection portion of the second lead 3, and is a connection terminal of the first lead 2 to an external device. The connection terminal portion 301 of the portion 201 and the second lead 3 to the external device is a surface-mounted light emitting device provided so as to be exposed on the first surface 4A of the insulator 4.

【0051】

The light emitting element 1 is an element that emits light by passing a current or applying a voltage to the element, such as a light emitting diode (LED) or a semiconductor laser (laser diode; LD). In the light emitting device of No. 1, for example, a red light emitting diode using an AlGaAs-based compound semiconductor is used as the light emitting element 1.

【0052】

Further, as shown in FIGS. 1 (b) and 2 (a), the first lead 2 is formed in a cup shape having one end thereof having a flat bottom surface 202A, and the light emitting element 1 is the above-mentioned light emitting element 1. It is adhered to the bottom surface 202A of the cup-shaped portion (hereinafter referred to as a reflective portion) 202 of the first lead 2. At this time, the surface of the reflecting portion 202 facing the bottom surface 202A to which the light emitting element 1 is adhered is exposed on the first surface 4A of the insulator 4, as shown in FIG. 1 (b). .. Therefore, the heat generated when the light emitting element 1 is operated can be dissipated to the outside of the light emitting device via the bottom surface 202A of the reflecting portion, as shown in FIGS. 24 (a) and 24 (b). Compared with the conventional surface mount type light emitting device as shown, the heat dissipation efficiency can be improved, the change in the electrical characteristics due to the heat generation of the light emitting element 1 can be reduced, and the light emitting efficiency can be stabilized. ..

【0053】

Further, as shown in FIG. 2A, the reflective portion 202 of the first lead 2 is tilted around the bottom surface 202A to which the light emitting element 1 is adhered by an angle θ from the normal direction of the bottom surface 202A. A side surface (reflecting surface) 202B is provided, and among the light output from the light emitting element 1, the light output in the horizontal direction of the paper surface is reflected by the reflecting surface 202B, and the traveling direction is changed in the vertical direction of the paper surface. Can be done. Therefore, it is possible to improve the light condensing property of the light output from the light emitting element 1 and obtain bright light. At this time, it is preferable that the reflecting surface 202B has an angle θ formed with the normal of the bottom surface 202A of, for example, 45 degrees. At this time, in order to increase the reflection efficiency on the reflection surface 202B, it is preferable that the reflection surface 202B is mirror-finished. In the light emitting device of the first embodiment, the bottom surface 202A of the reflection portion and the reflection As shown in FIG. 2A, a glossy silver-plated film 6 is provided on the surface 202B.

【0054】

Further, at this time, as shown in FIG. 2A, the thickness T1 of the bottom surface portion of the reflective portion is made thinner than the thickness T2 of the connection terminal portion 201 of the first lead 2. As a result, the heat generated by the light emitting element 1 can be efficiently dissipated to the outside of the device.

【0055】

Although not shown, the first electrode (cathode electrode) of the light emitting element (light emitting diode) 1 is provided on the adhesive surface side of the reflecting portion with the bottom surface 202A, and is conductive such as silver paste. By adhering with a sex adhesive, the light emitting element 1 and the bottom surface 202A of the reflecting portion, that is, the first electrode of the light emitting element 1 and the first lead 2 are electrically connected.

【0056】

Although not shown, the second electrode (anode electrode) of the light emitting element 1 is provided on a surface facing the first electrode (cathode electrode), and is provided in FIGS. 1 (a) and 1 (b). ), The bonding wire 5 is electrically connected to the second lead 3.

【0057】

Further, as shown in FIGS. 1 (a) and 1 (b), the connection terminal portion 201 of the first lead 2 and the connection terminal portion 301 of the second lead 3 have protrusions 203 and 303 at their respective predetermined positions. Is provided. The protrusion 203 of the first lead and the protrusion 303 of the second lead are provided to prevent the first lead 2 and the second lead 3 from peeling off from the insulator 4 and falling off. , As shown in FIG. 2 (b), the insulator 4 is bent in the internal direction.

【0058】

The method for manufacturing the light emitting device of the first embodiment can be roughly divided into a lead frame forming step of opening a tape-shaped conductor plate to form a lead frame having the first lead 2 and the second lead 3. The light emitting element mounting step of mounting the light emitting element 1 at a predetermined position of the lead frame formed in the lead frame forming step and the light emitting element 1 mounted in the light emitting element mounting step are sealed with a transparent insulator 4. It comprises a sealing step of stopping, and after the sealing step, an individualizing step of cutting and individualizing the portions of the first lead 2 and the second lead 3 protruding from the insulator 4. Hereinafter, each step for manufacturing the light emitting device of the first embodiment will be described step by step.

【0059】

3 to 6 are schematic views for explaining the manufacturing method of the light emitting device of the first embodiment, FIG. 3 is a plan view of a lead frame used for manufacturing the light emitting device, and FIG. 4 (a) is the first A plan view of the process of forming the lead and the second lead, FIG. 4 (b) is a cross-sectional view taken along the line C-C'of FIG. 4 (a), and FIG. 4 (c) is D-D of FIG. 4 (a). 'Cross section in line, FIG. 5 (a) is a plan view of the process of forming the reflective part, FIG. 5 (b) is a sectional view in line E-E' in FIG. 5 (a), FIG. 6 (a). Is a plan view of the process of forming the protrusion, FIG. 6 (b) is a cross-sectional view taken along the line F-F'of FIG. 6 (a), and FIG. 6 (c) is a line G-G'of FIG. 6 (a). It is a cross-sectional view in. The plan views of FIGS. 4 (a), 5 (a), and 6 (a) are enlarged plan views of the lead frame region L1 shown in FIG. 3, respectively.

【0060】

The light emitting device of the first embodiment is manufactured by using a lead frame in which a conductor plate such as a copper plate is opened in a predetermined shape to form the first lead 2 and the second lead 3. Therefore, first, the lead frame forming step for forming the lead frame will be described.

【0061】

In the lead frame forming step, first, as shown in FIGS. 3, 4 (a), 4 (b), and 4 (c), the first position is placed at a predetermined position on the conductor plate used as the lead frame LF. An opening having one lead 2 and the second lead 3 is formed.

【0062】

At this time, the lead frame LF has a long tape shape in one direction, and a positioning opening (sprocket hole) is provided at the end portion of the lead frame LF in the longitudinal direction as shown in FIG. SH is formed.

【0063】

Further, the opening having the sprocket hole SH, the first reed 2 and the second reed 3 is formed by, for example, punching using a die. At this time, as shown in FIG. 4A, the first lead 2 is provided with the reflection portion 202 at the tip of the connection terminal portion 201 for connecting to an external device, and the first lead 2 is provided at a predetermined position of the connection terminal portion 201. In other words, the protrusion 203 is formed so as to be provided at a position covered with the insulator. Further, as shown in FIG. 4A, the second lead 3 is provided with a protrusion 303 at a predetermined position of the connection terminal portion 301 for connecting to an external device, that is, at a position covered with an insulator. Form. At this time, the reflecting portion 202, the protruding portion 203 of the first lead, and the protruding portion 303 of the second lead are bent as shown in FIGS. 4 (b) and 4 (c). It is assumed that it is not flat and is flat.

【0064】

Further, as shown in FIGS. 4 (b) and 4 (c), for example, a glossy silver-plated film 6 is formed on the surface of the lead frame LF. At this time, the silver-plated film 6 may be formed on one surface of the lead frame LF, or may be formed on both sides or the entire surface.

【0065】

Further, the lead frame LF used for manufacturing the light emitting device of the first embodiment has, for example, a thickness of about 0.1 mm, and the step of forming the first lead 2 and the second lead 3 has conventionally been a tape. Like the wiring board (tape carrier) used in the manufacture of carrier packages, it is performed in a reel-to-reel system, and while transporting the tape-shaped lead frame LF, FIGS. 3 and 4 (a) The opening of the pattern as shown in is continuously formed.

【0066】

Next, as shown in FIGS. 5A and 5B, the tip end portion of the first reed 2, that is, the reflection portion 202 is formed into a cup shape having a flat bottom surface 202A. In the step of molding the reflective portion 202, for example, the outer peripheral portion of the reflective portion 202 is molded so as to be inclined at a predetermined angle by press molding using a mold to provide a side surface (reflecting surface) 202B. At this time, when the silver-plated film 6 is formed on only one surface of the lead frame LF, the reflective portion 202 is formed so that the surface on which the silver-plated film 6 is formed is on the inside. As shown in FIG. 2A, it is preferable to mold the reflecting portion so that the angle θ formed by the normal direction of the bottom surface 202A of the reflecting portion and the reflecting surface 202B is 45 degrees. At this time, the bottom surface 202A of the reflecting portion is flattened by, for example, pressing using a mold, and as shown in FIG. 2, the thickness T1 of the bottom surface 202A of the reflecting portion is the connection terminal. It is preferable to mold the portion 201 so as to be thinner than the thickness of the lead frame LF, that is, the thickness T2 of the lead frame LF.

【0067】

Next, as shown in FIGS. 6 (a), 6 (b), and 6 (c), for example, by press molding using a mold, the protrusion 203 of the first lead 2 and the second The protrusion 303 of the lead 3 is bent in the same direction as the inclination direction of the reflection surface 202B of the reflection portion.

【0068】

Further, the step of forming the reflective portion 202 and the step of bending the protruding portion 203 of the first lead and the protruding portion 303 of the second lead are performed by, for example, a reel-to-reel method. At this time, the steps of forming the reflective portion 202 and the step of bending the protruding portion 203 of the first lead and the protruding portion 303 of the second lead may be in the reverse order, or one step. It may be carried out at the same time as a process.

【0069】

After forming the lead frame LF used for manufacturing the light emitting device of the first embodiment by the above procedure, the next step is to mount the light emitting element 1 on the lead frame LF.

【0070】

7 and 8 are schematic views for explaining the manufacturing method of the light emitting device of the first embodiment, FIG. 7 (a) is a plan view of a process of bonding the light emitting element, and FIG. 7 (b) is a view. 7 (a) is a cross-sectional view taken along the HH'line, FIG. 8 (a) is a plan view of the wire bonding process, and FIG. 8 (b) is a cross-sectional view taken along the line I-I'of FIG. 8 (a). ,. The plan view of FIG. 7A and FIG. 8A is an enlarged plan view of a region corresponding to the region L1 of the lead frame LF shown in FIG.

【0071】

In the light emitting element mounting step, first, as shown in FIGS. 7 (a) and 7 (b), the light emitting element 1 is attached to the bottom surface 202A of the reflecting portion of the lead frame LF by using the conductive adhesive 7. Glue. In the light emitting device of the first embodiment, for example, a red light emitting diode made of an AlGaAs-based compound semiconductor is used for the light emitting element 1, and the light emitting diode 1 is as shown in FIG. 7 (b). A first electrode (cathode electrode) 102 and a second electrode (anode electrode) 103 are provided at both ends of a semiconductor layer 101 having a laminate of an n-type clad layer, an active layer, and a p-type clad layer made of the compound semiconductor. There is.

【0072】

Further, as the conductive adhesive 7 for adhering the light emitting element 1 to the bottom surface 202A of the reflective portion, for example, silver paste or refractory solder is used, and as shown in FIG. 7B, the conductive adhesive 7 is used. The adhesive 7 electrically connects the first electrode 102 of the light emitting element and the bottom surface 202A of the reflecting portion, that is, the first lead 2. At this time, when the light emitting element 1 and the bottom surface 202A of the reflecting portion are adhesively fixed by using, for example, high melting point solder as the conductive adhesive 7, the subsequent heating step or the light emitting element 1 Even if the temperature rises due to heat generation, the conductive adhesive 7 is unlikely to soften. Therefore, the position shift of the light emitting element 1 is unlikely to occur, and the deterioration of the operation reliability due to the shift of the optical axis can be prevented.

【0073】

Next, as shown in FIGS. 8 (a) and 8 (b), the second electrode (anode electrode) 103 of the light emitting diode 1 and the connection terminal portion 301 of the second lead of the lead frame are bonded to the bonding wire 5. Connect electrically with. For the bonding wire 5, for example, a gold wire having a diameter of about 18 μm is used, and bonding is performed by ordinary thermocompression bonding or thermocompression bonding using ultrasonic waves.

【0074】

Further, the step of adhering the light emitting diode 1 and the step of connecting with the bonding wire 5 are also performed by the reel-to-reel method, and the alignment of the lead frame LF to be conveyed is aligned by using the sprocket hole SH. Then, the light emitting diode 1 is sequentially adhered to the bottom surface 202A of each reflecting portion, and the light emitting diode 1 is sequentially connected by the bonding wire 5.

【0075】

After mounting the light emitting element 1 on the lead frame LF by the above procedure, the light emitting element 1, the connection portion between the first electrode 102 of the light emitting element and the first lead 2, and the second electrode 103 of the light emitting element. A sealing step is performed in which the connection portion of the second lead 3 is sealed with the transparent insulator 4.

【0076】

9A and 9B are schematic views for explaining the manufacturing method of the light emitting device of the first embodiment, FIG. 9A is a plan view of a process of sealing the light emitting element, and FIG. 9B is FIG. 9 (B). It is sectional drawing on the J-J'line of a). The plan view of FIG. 9A is an enlarged plan view of a region corresponding to the region L1 of the lead frame LF shown in FIG.

【0077】

The sealing step is performed by, for example, a transfer mold using a mold, and as shown in FIGS. 9 (a) and 9 (b), for example, a flat lower mold 8 and a recess (cavity) having a predetermined shape. A lead frame LF on which the light emitting element 1 is mounted is placed between the upper mold 9 on which the 901 is formed, and the lead frame LF is sandwiched and fixed between the lower mold 8 and the upper mold 9, and then transparent. Insulator 4 is poured into the cavity 901 and sealed. At this time, since the lower mold 8 is in close contact with one surface of the lead frame LF, in other words, the surface facing the surface on which the light emitting element 1 is mounted, the first lead in the cavity 901. One surface of the connection terminal portion 201 and the connection terminal portion 301 of the second lead, and the back surface of the bottom surface 202A of the reflection portion can be sealed so as to be exposed on the surface of the insulator 4.

【0078】

Further, as the transparent insulator 4, for example, a thermosetting epoxy resin is used, and an uncured resin (A stage resin) or a resin in which the curing reaction is advanced to an intermediate stage (B stage resin) is used. It is heated to about 150 ° C to increase its fluidity, poured into the cavity 901, molded, and then heated (after-cured) at about 150 ° C to 160 ° C for 2 to 3 hours, for example. The resin is completely cured. Further, the sealing step is also performed by the reel-to-reel method as in the other steps, and when sealing with the transfer mold as shown in FIGS. 9 (a) and 9 (b), the lower mold is used. It is preferable to use a resin that can be easily removed from the mold 8 and the upper mold 9 without providing a mold release agent.

【0079】

After sealing the light emitting element 1 by the sealing step, as shown in FIG. 9A, the portions of the first lead 2 and the second lead 3 protruding from the insulator 4 are cut. When the pieces are separated into pieces, a light emitting device as shown in FIGS. 1 (a) and 1 (b) can be obtained.

【0080】

As described above, according to the light emitting device of the first embodiment, the bottom surface 202A of the reflecting portion to which the light emitting element 1 is adhered can be exposed to the surface (first surface 4A) of the insulator 4. Compared with the conventional surface mount type light emitting device as shown in FIGS. 24 (a) and 24 (b), the heat generated from the light emitting element 1 can be efficiently released to the outside of the light emitting device. Therefore, the change in electrical characteristics due to the heat generated from the light emitting element 1 is less likely to occur, and the luminous efficiency can be stabilized.

【0081】

Further, in order to form the reflective portion 202 by forming the tip portion of the first lead 2 into a cup shape, for example, a surface mount type using the wiring board 12 as shown in FIG. 24 (a). Compared with the light emitting device, the number of steps and parts required for manufacturing the light emitting device can be reduced, and the manufacturing cost of the light emitting device can be reduced.

【0082】

Further, as shown in FIG. 3, an opening having the first lead 2 and the second lead 3 is formed in the lead frame LF, and the tip of the first lead 1 is formed into a cup shape to reflect the reflection. Since the insulator 4 seals only one side of the lead frame LF, that is, the side on which the light emitting element 1 is mounted by forming the portion 202, a surface mount type light emitting as shown in FIG. 24 (b) is emitted. Compared with the device, the lead frame LF can be easily molded, the third resin 21 is not required, the number of steps and parts (materials) required for manufacturing the light emitting device is reduced, and the manufacturing cost is reduced. Can be reduced. Further, since the third resin 21 is unnecessary and the bottom surface 202A of the reflecting portion is exposed, the heat dissipation characteristics are good and the luminous efficiency can be stabilized.

【0083】

Further, in the light emitting device of the first embodiment, the bottom surface portion of the reflecting portion 202 may be lifted from the lower mold 8 during the sealing step, and the bottom surface portion of the reflecting portion 202 may not be exposed. Even in such a case, since the distance from the bottom surface of the reflecting portion 202 to the surface of the insulator 4 (first surface 4A) is short, it is possible to suppress a decrease in heat dissipation characteristics and prevent a decrease in luminous efficiency. be able to.

【0084】

Further, the reflecting portion 202 may be provided on the same plane as the first lead 2 and the second lead 3 by forming the tip portion of the first lead 2 to form the cup-shaped reflecting portion 202. It can be used in a light emitting device using the wiring plate 12 as shown in FIG. 24 (a) or a light emitting device in which steps 14 and 15 are provided on the thin metal substrate 13 as shown in FIG. 24 (b). In comparison, the device can be made thinner.

【0085】

Further, by manufacturing the light emitting device by the reel-to-reel method using the lead frame LF as shown in FIG. 3, it is possible to mass-produce the light emitting device having the same configuration at one time, and the manufacturing cost of the light emitting device can be reduced. Can be reduced.

【0086】

Further, when the light emitting element 1 is bonded to the bottom surface 202A of the reflecting portion, the light emitting element 1 is bonded and fixed by using a conductive adhesive 7 made of a metal material having a high melting point such as high melting point solder. Since it is possible to further reduce the displacement of the optical axis and the displacement of the optical axis due to the heat generated by the solder, when the light emitting device is used as a component for short-distance optical communication, for example, the operational reliability of the device is lowered. Can be prevented.

【0087】

Further, in the light emitting device of the first embodiment, the red light emitting diode is used as the light emitting element 1, but the light emitting diode is not limited to this, and various light emitting diodes such as green light emitting, blue light emitting, and infrared light emitting are used. , Laser diode (semiconductor laser) and the like can be used.

【0088】

FIG. 10 is a schematic view showing a modified example of the light emitting device of the first embodiment, FIG. 10 (a) is a plan view showing a schematic configuration of the light emitting device, and FIG. 10 (b) is K of FIG. 10 (a). -It is a cross-sectional view along the K'line. Further, in FIGS. 10 (a) and 10 (b), 401 is the first insulator and 402 is the second insulator.

【0089】

In the light emitting device of the first embodiment, the light emitting element 1, the connecting portion between the first electrode 102 of the light emitting element and the first lead 2, and the connecting portion between the second electrode 103 of the light emitting element and the second lead 3 are connected. , But not limited to this, as shown in FIGS. 10A and 10B, for example, in the reflecting portion 202 to which the light emitting element 1 is adhered. May be filled with the first insulator 401 and then the periphery thereof may be sealed with the second insulator 402. In this case, for example, by mixing a wavelength conversion material made of a fluorescent dye, a fluorescent pigment, or the like into the first insulator 401, the wavelength of the light output from the light emitting element 1 is converted to an arbitrary wavelength. Can be output to the outside of the light emitting device.

【0090】

To give an example of converting the wavelength of light by using the first insulator 401, when the light emitting diode of blue light emission is used as the light emitting element 1, the wavelength conversion material is, for example, fluorescein, rhodamine, or the like. By mixing an organic phosphor or an inorganic phosphor such as calcium tungstate into the first insulator 401, the blue light output from the light emitting diode 1 is converted into white light and output to the outside of the device. (Refer to JP-A-2000-252524).

【0091】

11 and 12 are schematic views showing another modification of the light emitting device of the first embodiment, FIG. 11 is a plan view showing an example in which the shape of the reflecting portion is changed, and FIG. 12 is an insulator. It is sectional drawing which shows the example which provided the lens part. Further, in FIG. 11, 202A'is an oval (elliptical) bottom surface, and in FIG. 12, 41 is a lens portion.

【0092】

In the light emitting device of the first embodiment, as shown in FIG. 1A, the bottom surface 202A of the reflecting portion is circular, but the present invention is not limited to this, and for example, as shown in FIG. 11, the reflecting portion. It may be molded so that the bottom surface 202A'of the surface is oval. In this case, since the light output from the light emitting element 1 reflects the shape (oval) of the bottom surface 202A'of the reflecting portion, it is wider than the light rays obtained by the light emitting device of the first embodiment. You can get a ray. Further, the shape of the bottom surface of the reflecting portion is not limited to a circle or an oval shape, and may be any shape.

【0093】

Further, the outer shape of the insulator 4 is not limited to the square shape shown in FIGS. 1 (a) and 1 (b), and for example, as shown in FIG. 12, a lens is formed in a portion where a light beam is output. The insulator 4 may be molded and sealed so that the portion 41 is provided. In this case, the light output from the light emitting element 1 is focused on the upper surface of the paper by the reflecting unit 202, then converged or diffused by the lens unit 41, and is output to the outside of the light emitting device. By changing the shape of the lens portion 41 and the refractive index of the insulator 4, light rays having an arbitrary shape can be output. Further, it goes without saying that the lens portion 41 is not limited to the convex shape as shown in FIG. 12, but may be concave.

【0094】

(Example 2) FIG. 13 is a schematic view showing a schematic configuration of the light emitting device of the second embodiment according to the present invention, FIG. 13 (a) is a plan view of the entire light emitting device, and FIG. 13 (b) is FIG. 13 ( It is a cross-sectional view of a) along the L-L'line.

【0095】

In FIGS. 13 (a) and 13 (b), 1 is a light emitting element, 2 is the first lead, 201 is the connection terminal of the first lead, 202 is the reflection part, 202A is the bottom surface of the reflection part, and 202B is the reflection part. Side surface (reflective surface), 203 is the protrusion of the first lead, 204 is the bent part of the first lead, 3 is the second lead, 301 is the connection terminal part of the second lead, 303 is the protrusion of the second lead, 304 is the bent part of the second lead, 4 is the insulator, 4A is the first surface of the insulator, 4B is the second surface of the insulator, 4C is the third surface of the insulator, and 5 is the bonding wire.

【0096】

The light emitting device of the second embodiment has substantially the same configuration as the light emitting device of the first embodiment, and as shown in FIGS. 13 (a) and 13 (b), the light emitting element 1 and the light emitting element 1 The first lead 2 electrically connected to the first electrode (not shown), the second lead 3 electrically connected to the second electrode (not shown) of the light emitting element 1, and the light emitting element 1, It is composed of a connecting portion between the first electrode of the light emitting element 1 and the first lead 2, and a transparent insulator 4 that seals the connecting portion between the second electrode of the light emitting element 1 and the second lead 3. The connection terminal portion 201 of the first lead with the external device and the connection terminal portion 301 of the second lead with the external device are provided so as to be exposed on the first surface 4A of the insulator 4. ..

【0097】

The light emitting device of the second embodiment differs from the light emitting device of the first embodiment of the first lead 2 and the second lead 3 as shown in FIGS. 13 (a) and 13 (b). The point is that the bent portions 204 and 304 protruding from the insulator 4 are provided in each of them. At this time, the bent portion 204 of the first lead 2 is bent so as to be in contact with the second surface 4B in contact with the first surface 4A, and the connection terminal portion 201 and the bent portion 204 are connected to an external device. Can be used as a terminal for. Further, the bent portion 304 of the second lead 3 is bent so as to be in contact with the first surface 4A and the third surface 4C different from the second surface 4B, and the connection terminal portion 301 and the said connection terminal portion 301. The bent portion 304 can be used as a terminal for connecting to an external device.

【0098】

The light emitting element 1 is an element that emits light by passing a current or applying a voltage to the element, such as a light emitting diode (LED) or a semiconductor laser (LD).

【0099】

Further, the first lead 2 is the same as the light emitting device of the first embodiment, and as shown in FIG. 13 (b), one end thereof is molded into a cup shape having a flat bottom surface 202A, and the light emitting. The element 1 is adhered to the bottom surface 202A of the cup-shaped portion (reflecting portion) 202 of the first lead with a conductive adhesive (not shown) such as silver paste. At this time, the surface of the reflecting portion 202 facing the bottom surface 202A to which the light emitting element 1 is adhered is on the surface (first surface 4A) of the insulator 4 as shown in FIG. 13 (b). It is exposed. Therefore, the heat generated when the light emitting element 1 is operated can be dissipated to the outside of the device via the reflecting unit 202, as shown in FIGS. 23 (a) and 23 (b). Since the heat dissipation efficiency is improved as compared with the conventional surface mount type light emitting device, the change in electrical characteristics due to heat can be reduced and the light emitting efficiency can be stabilized.

【0100】

Although not shown, the first electrode (cathode electrode) of the light emitting element 1 is provided on the adhesive surface side of the reflecting portion with the bottom surface 202A, and a conductive adhesive such as silver paste is applied. The light emitting element 1 and the bottom surface 202A of the reflecting portion, that is, the first electrode of the light emitting element 1 and the first lead 2 are electrically connected by using and adhering.

【0101】

Although not shown, the second electrode (anode electrode) of the light emitting element 1 is provided on a surface facing the first electrode (cathode electrode), and is provided in FIGS. 13 (a) and 13 (b). ), The bonding wire 5 is electrically connected to the second lead 2.

【0102】

Further, as shown in FIGS. 13 (a) and 13 (b), the first lead 2 and the second lead 3 are provided with protrusions 203 and 303 at positions covered with an insulator. The protrusion 203 of the first lead and the protrusion 303 of the second lead are provided to prevent the first lead 2 and the second lead 3 from peeling off from the insulator 4 and falling off. , Similar to the light emitting device described in the first embodiment, the insulator 4 is bent in the internal direction.

【0103】

Further, the light emitting device of the second embodiment is also the same as the light emitting device of the first embodiment, and the reflecting portion 202 of the first lead 2 adheres the light emitting element 1 as shown in FIG. A side surface (reflection surface) 202B inclined by an angle θ from the normal direction of the bottom surface 202A is provided around the bottom surface 202A, and the light output from the light emitting element 1 is output in the horizontal direction of the paper surface. The light can be reflected by the reflecting surface 202B, and the traveling direction can be changed in the vertical direction of the paper surface. Therefore, the light output from the light emitting element 1 has directivity, and bright light can be obtained. At this time, it is preferable that the reflection surface 202B has, for example, an angle θ formed by the normal line of the bottom surface 202A and the reflection surface 202B of 45 degrees. At this time, in order to increase the reflection efficiency on the reflecting surface, it is preferable that the reflecting surface 202B is mirror-finished. In the light emitting device of the second embodiment, the light emitting element 1 of the first lead 2 is used. As shown in FIG. 2, a glossy silver-plated film 6 is provided on the bottom surface 202A and the reflective surface 202B to which the above-mentioned material is adhered.

【0104】

Further, the light emitting device of the second embodiment is also the same as the light emitting device of the first embodiment, and as shown in FIG. 2, the thickness T1 of the bottom surface of the reflecting portion 202 is the first lead 2. By making the thickness T2 of the connection terminal portion 201 thinner than that of T2, the heat generated by the light emitting element 1 can be efficiently dissipated to the outside of the apparatus.

【0105】

The manufacturing method of the light emitting device of the second embodiment is almost the same as the manufacturing method of the light emitting device of the first embodiment, and can be roughly divided into the first lead and the second lead by opening a tape-shaped conductor plate. It was mounted in the lead frame forming step of forming the lead frame having the above, the light emitting element mounting step of mounting the light emitting element at a predetermined position of the lead frame formed in the lead frame forming step, and the light emitting element mounting step. After the sealing step of sealing the light emitting element with a transparent insulator and the sealing step, the portions of the first lead and the second lead protruding from the insulator are cut and separated into individual pieces. It consists of an individualization process. Hereinafter, each step for manufacturing the light emitting device of the second embodiment will be described step by step, but detailed description of the same parts as the step of the first embodiment will be omitted.

【0106】

14 to 17 are schematic views for explaining the manufacturing method of the light emitting device of the second embodiment, FIG. 14 is a plan view of a lead frame used for manufacturing the light emitting device, and FIG. 15 is shown in FIG. An enlarged plan view of the region L2 of the lead frame, FIG. 16 (a) is a plan view of the process of forming the reflective portion, FIG. 16 (b) is a cross-sectional view taken along the line M-M'of FIG. 16 (a), and FIG. 17 (a) is a plan view of the process of forming the protrusion, FIG. 17 (b) is a cross-sectional view taken along the line N-N'of FIG. 17 (a), and FIG. 17 (c) is an O- of FIG. 17 (a). It is a cross-sectional view along the O'line. The plan views of FIGS. 16 (a) and 17 (a) are enlarged plan views of the regions corresponding to the region L2 of the lead frame shown in FIG. 14, respectively.

【0107】

The light emitting device of the second embodiment is also the same as the manufacturing method of the light emitting device of the first embodiment, and is a lead in which a conductor plate such as a copper plate is opened in a predetermined shape to form the first lead 2 and the second lead 3. Manufactured using frame LF. Therefore, first, the lead frame forming step for forming the lead frame will be described.

【0108】

In the lead frame forming step, first, as shown in FIGS. 14 and 15, an opening having the first lead 2 and the second lead 3 is formed at a predetermined position of the conductor plate used as the lead frame LF. To do.

【0109】

At this time, the lead frame LF has a long tape shape in one direction, and a positioning opening (sprocket hole) is provided at the end portion of the lead frame LF in the longitudinal direction as shown in FIG. SH is formed.

【0110】

Further, the opening having the sprocket hole SH, the first reed 2 and the second reed 3 is formed by, for example, punching using a die. At this time, as shown in FIG. 15, the first lead 2 is provided with the reflection portion 202 at the tip of the connection terminal portion 201 for connecting to an external device, and is insulated at a predetermined position of the connection terminal portion 201, in other words, insulation. The protrusion 203 is formed so as to be provided at a position covered by the body. Further, the bent portion 204 is provided between the connection terminal portion 201 and the frame portion of the lead frame LF. Similarly, as shown in FIG. 15, the second lead 3 is provided with a protrusion 303 at a position covered with an insulator of the connection terminal portion 301 for connecting to an external device, and the connection terminal portion 301 and the connection terminal portion 301 are described. A bent portion 304 is provided between the frame portions of the lead frame LF. At this time, the width W1 of each of the bent portions 204 and 304 is larger than the width W2 of the connection terminal portion 201 and the width W3 of the reflecting portion 202 so as to match the width of the insulator 4 to be sealed. Widen.

【0111】

At this time, the reflecting portion 202, the protruding portion 203 and the bent portion 204 of the first lead, and the protruding portion 303 and the bent portion 304 of the second lead are shown in FIGS. 4 (b) and 4 (c). As shown, it is assumed that it is not bent and is flat.

【0112】

Further, as shown in FIGS. 4 (b) and 4 (c), for example, a glossy silver-plated film 6 is formed on the surface of the lead frame LF. At this time, the silver-plated film 6 may be formed on one surface of the lead frame LF, or may be formed on both sides or the entire surface.

【0113】

Further, the lead frame LF used for manufacturing the light emitting device of the second embodiment also has a thickness of, for example, about 0.1 mm, and the step of forming the first lead 2 and the second lead 3 has conventionally been a tape. Like the wiring board (tape carrier) used in the manufacture of carrier packages, it is performed in a reel-to-reel system, and while transporting the tape-shaped conductor plate, as shown in FIGS. 14 and 15. A pattern of openings is continuously formed.

【0114】

Next, as shown in FIGS. 16A and 16B, the tip end portion of the first reed 2, that is, the reflection portion 202 is formed into a cup shape having a flat bottom surface 202A. In the step of molding the reflective portion 202, for example, press molding using a mold is performed so that the outer peripheral portion of the reflective portion 202 becomes a side surface (reflecting surface) inclined at a predetermined angle. At this time, when the silver-plated film 6 is formed on only one surface of the lead frame LF, the side surface 202B of the reflective portion is such that the surface on which the silver-plated film 6 is formed is on the inside. As shown in FIG. 2, it is preferable to mold the reflection portion so that the angle θ formed by the normal direction of the bottom surface 202A of the reflection portion and the reflection surface 202B of the reflection portion is 45 degrees. Further, at this time, as shown in FIG. 2, the bottom surface portion of the reflecting portion is formed by, for example, pressing using a mold, so that the thickness T1 of the bottom surface portion of the reflecting portion is the connection terminal portion 201. It is preferable to mold the lead frame so as to be thinner than the thickness T2 of the lead frame.

【0115】

Next, as shown in FIGS. 17 (a), 17 (b), and 17 (c), for example, by press molding using a mold, the protrusion 203 of the first lead and the second lead The protrusion 303 is bent in the same direction as the inclination direction of the side surface 202B of the reflection portion.

【0116】

Further, the step of forming the reflective portion 202 and the step of bending the protruding portions 203 and 303 are performed by a reel-to-reel method. At this time, the step of forming the reflective portion and the step of bending the protruding portion may be performed in the reverse order or may be performed simultaneously as one step.

【0117】

After forming the lead frame LF used for manufacturing the light emitting device of the second embodiment by the above procedure, the next step is to mount the light emitting element on the lead frame.

【0118】

FIG. 18 is a schematic view for explaining the manufacturing method of the light emitting device of the second embodiment, and is a plan view of a process of mounting the light emitting device. The plan view of FIG. 18 is an enlarged plan view of a region corresponding to the region L2 of the lead frame LF shown in FIG.

【0119】

The light emitting element mounting step is the same as the light emitting element mounting step described in the first embodiment, and as shown in FIG. 18, the conductive adhesive 7 is used on the bottom surface 202A of the reflecting portion of the lead frame LF. After the light emitting element 1 is adhered to electrically connect the first electrode 102 of the light emitting element 1 and the first lead 2, the second electrode 103 of the light emitting element 1 and the second lead 3 are connected by a bonding wire 5. Connect electrically. The light emitting device of the second embodiment also uses, for example, a red light emitting diode made of an AlGaAs-based compound semiconductor as the light emitting element 1, and the light emitting diode 1 is as shown in FIG. 7 (b). A first electrode (cathode electrode) 102 and a second electrode (anode electrode) 103 are provided on both sides of a semiconductor layer 101 having a laminate of an n-type clad layer, an active layer, and a p-type clad layer made of the compound semiconductor. ing.

【0120】

Further, the step of adhering the light emitting diode 1 and the step of connecting with the bonding wire 5 are also performed by the reel-to-reel method, and the alignment of the lead frame LF conveyed by using the sprocket hole SH is performed. The light emitting diode 1 is sequentially adhered to the bottom surface 202A of each reflecting portion, and the light emitting diode 1 is sequentially connected by the bonding wire 5.

【0121】

After mounting the light emitting element on the lead frame by the above procedure, the next steps are the light emitting element 1, the connection portion between the first electrode 102 of the light emitting element and the first lead 2, and the second electrode 103 of the light emitting element. A sealing step is performed in which the connection portion of the second lead 3 is sealed with a transparent insulator.

【0122】

FIG. 19 is a schematic view for explaining the manufacturing method of the light emitting device of the second embodiment, FIG. 19 (a) is a plan view of a process of sealing the light emitting element, and FIG. 19 (b) is FIG. 19 ( It is sectional drawing in P-P'line of a). The plan view of FIG. 19A is an enlarged plan view of a region corresponding to the region L2 of the lead frame LF shown in FIG.

【0123】

The sealing step is performed by, for example, a transfer mold using a mold, and as shown in FIGS. 19 (a) and 19 (b), for example, a flat lower mold 8 and a recess (cavity) having a predetermined shape. 901 shape between the upper mold 9 was made, the lead frame LF the light emitting element 1 is mounted is arranged, after fixing across the lead frame LF by the upper die 9 and the lower die 8, The transparent insulator 4 is poured into the cavity 901 and sealed. At this time, since the lower mold 8 is in close contact with one surface of the lead frame LF, in other words, the surface facing the surface on which the light emitting element 1 is mounted, the first lead in the cavity 901. One surface of the connection terminal portion 201 and the connection terminal portion 301 of the second lead, and the back surface of the bottom surface 202A of the reflection portion can be sealed so as to be exposed on the surface of the insulator 4. At this time, as shown in FIG. 19A, the cavity 901 of the upper die 9 is prevented from engaging with the bent portion 204 of the first lead 2 and the bent portion 304 of the second lead, and each of the bends is made. The parts 204 and 304 are sealed so as to protrude from the insulator 4.

【0124】

Further, as the transparent insulator 4, for example, a thermosetting epoxy resin is used, and an uncured resin (A stage resin) or a resin in which the curing reaction is advanced to an intermediate stage (B stage resin) is used. The resin is heated to 150 ° C to increase its fluidity, poured into the cavity 901, molded, and then heated (after-cured) at about 150 ° C to 160 ° C for about 2 to 3 hours. Is completely cured. Further, the sealing step is also performed by the reel-to-reel method as in the other steps, and when sealing with the transfer mold as shown in FIGS. 19 (a) and 19 (b), the lower mold is used. It is preferable to use a resin that can be easily taken out without providing a mold release agent on the 8 and the upper mold 9.

【0125】

FIG. 20 is a schematic plan view for explaining the manufacturing method of the light emitting device of the second embodiment.

【0126】

After sealing the light emitting element 1 by the sealing step, the portions of the first lead 2 and the second lead 3 protruding from the insulator 4 are cut and separated into individual pieces. As shown in FIG. 20, the first lead 2 is cut so that the bent portion 204 and the second lead 3 bent portion 304 remain, and the bent portions 204 and 304 are bent to bend the first lead. When the portion 204 is brought into contact with the second surface 4B of the insulator 4 and the bent portion 304 of the second lead is brought into contact with the third surface 4C of the insulator 4, FIGS. 13 (a) and 13 (b) are shown. A light emitting device as shown in is obtained.

【0127】

21 and 22 are schematic views showing a mounting example of the light emitting device of the second embodiment on the mounting board, and FIG. 21 is a cross-sectional view and a view showing a mounting example in which light is output in the normal direction of the mounting board. 22 (a) is a cross-sectional view showing a mounting example in which light is output inward to the mounting surface of the mounting board, and FIG. 22 (b) is a view of FIG. 22 (a) from the side view.

【0128】

When the surface mount type light emitting device is mounted on the mounting board, the light output from the light emitting device is mounted so as to be output in the normal direction of the mounting surface of the mounting board, and the mounting board. It is conceivable to mount the product so that it is output in the in-plane direction.

【0129】

When the light emitting device of the second embodiment is mounted so as to output light in the normal direction of the mounting surface, for example, it is provided on the first surface 4A of the insulator 4 as shown in FIG. The connection terminal portion 201 of the first lead and the connection terminal portion 301 of the second lead are mounted facing the wiring board (mounting board) provided with the connection terminals 1002 and 1003 on the surface of the insulating board 1001. At this time, the connection terminal portion 201 of the first lead and the connection terminal portion 301 of the second lead are each connected using a bonding agent 11 such as Sn-Pb-based solder. At this time, for example, the bottom surface of the reflective portion 202 exposed on the surface of the insulator 4 is formed with the connection terminal 1002 on the surface of the mounting substrate 10 and the bonding agent 11 in the same manner as the connection terminal portion 201 of the first lead. By connecting, the heat generated from the light emitting element 1 can be efficiently dissipated by conducting the heat generated from the light emitting element 1 through the connection terminal 1002 on the surface of the reflecting portion 202 and the mounting board 10, and the light emitting device and the mounting board can be efficiently dissipated. It is possible to prevent heat from being trapped during 10 and to prevent a decrease in luminous efficiency due to a temperature rise.

【0130】

Further, when the light emitting device is mounted so as to output light in the in-plane direction of the mounting surface, that is, in a direction orthogonal to the normal direction of the mounting substrate 10, FIG. 22A and FIG. As shown in FIG. 22 (b), the bent portion 204 of the first lead provided on the second surface 4B of the insulator 4 and the bent portion 304 of the second lead provided on the third surface 4C are used. , Sn-Pb-based solder or other bonding agent 11 is used to connect to the connection terminals 1002 and 1003 on the surface of the mounting board 10.

【0131】

As described above, according to the light emitting device of the second embodiment, the bottom surface of the reflecting portion to which the light emitting element 1 is adhered is exposed to the surface of the insulator 4 as in the light emitting device of the first embodiment. As compared with the conventional surface mount type light emitting device as shown in FIGS. 24 (a) and 24 (b), the heat generated from the light emitting element 1 is efficiently released to the outside of the light emitting device. be able to. Therefore, the change in electrical characteristics due to the heat generated from the light emitting element 1 is less likely to occur, and the luminous efficiency can be stabilized.

【0132】

Further, in order to form the reflective portion 202 by forming the tip portion of the first lead 2 into a cup shape, for example, a surface mount type using the wiring board 12 as shown in FIG. 24 (a). Compared with the method for manufacturing a light emitting device, the number of steps and parts required for manufacturing the light emitting device can be reduced, and the manufacturing cost of the light emitting device can be reduced.

【0133】

Further, as shown in FIG. 14, an opening having the first lead 2 and the second lead 3 is formed in the lead frame LF, and the tip portion of the first lead 2 is formed into a cup shape. A surface mount type light emitting device shown in FIG. 24 (b) for forming the reflecting portion 202 and sealing only one side of the lead frame LF, that is, the side on which the light emitting element 1 is mounted, with the insulator 4. In addition to facilitating the molding of the lead frame LF, the third resin 21 and the masking tape 18 are not required, and the number of steps and parts (materials) required for manufacturing the light emitting device is reduced. It is possible to reduce the manufacturing cost. Further, since the third resin 21 is unnecessary and the bottom surface of the reflecting portion 202 is exposed, the heat dissipation characteristics are good and the luminous efficiency can be stabilized.

【0134】

Further, by molding the tip portion of the first lead to form the reflection portion 202, the bottom surface of the reflection portion is formed on the same plane as the connection terminal portion 201 of the first lead and the connection terminal portion 301 of the second lead. 202A can be provided, and the light emitting device using the wiring plate 12 as shown in FIG. 24 (a) and the stepped portions 14, 15 on the thin metal substrate 13 as shown in FIG. 24 (b). The device can be made thinner than the light emitting device provided with the above.

【0135】

Further, by manufacturing the light emitting device by the reel-to-reel method using the lead frame as shown in FIG. 14, it is possible to mass-produce the light emitting devices having the same configuration at one time, and the manufacturing cost of the light emitting device can be reduced. Can be reduced.

【0136】

Further, when the light emitting element 1 is adhered to the bottom surface 202A of the reflecting portion, the light emitting element 1 generates heat by adhering and fixing the light emitting element 1 with a conductive adhesive 7 made of a metal material having a high melting point such as high melting point solder. Due to the misalignment, in other words, the misalignment of the optical axis is unlikely to occur, and it is possible to prevent the operation reliability from being lowered when the light emitting device is used, for example, as a component for short-distance optical communication.

【0137】

Further, the light emitting device may use not only the red light emitting diode but also various light emitting diodes such as green light emitting, blue light emitting, infrared light emitting, and a laser diode (semiconductor laser) as the light emitting element 1. it can.

【0138】

Further, as in the light emitting device of the second embodiment, the connection terminal portion 201 of the first lead and the connection terminal portion 301 of the second lead are provided on the first surface 4A of the insulator 4, and the insulator 4 is provided with the connection terminal portion 301. By providing the bent portion 204 of the first lead on the second surface 4B and providing the bent portion 304 of the second lead on the third surface 4C of the insulator 4, as shown in FIG. It can be mounted so as to output light in the linear direction, or it can output light in the in-plane direction of the mounting surface as shown in FIGS. 22 (a) and 22 (b), and the light emitting device is mounted. The degree of freedom when doing this is improved.

【0139】

Further, in the light emitting device of the second embodiment, the same as the light emitting device of the first embodiment, for example, as shown in FIGS. 10 (a) and 10 (b), the light emitting element 1 is mounted. The first insulator 401 may be filled in the reflective portion 202, and then the periphery thereof may be sealed with the second insulator 402. In this case, for example, by mixing a wavelength conversion material such as a fluorescent dye or a fluorescent pigment into the first insulator, the wavelength of the light output from the light emitting element is converted to an arbitrary wavelength and outside the apparatus. Can be output to.

【0140】

Further, the shape of the bottom surface 202A of the reflecting portion is not limited to a circular shape as described in the first embodiment. For example, as shown in FIG. 11, the bottom surface 202A'of the reflecting portion has an oval shape. It may be molded so as to become. In this case, since the light output from the light emitting element 1 reflects the shape (oval) of the bottom surface 202A'of the reflecting portion, it is wider than the light rays obtained by the light emitting device of the first embodiment. You can get a ray. Further, the shape of the bottom surface of the reflecting portion is not limited to a circle or an oval shape, and may be any shape.

【0141】

Further, the outer shape of the insulator 4 is not limited to the square shape shown in FIGS. 13 (a) and 13 (b), and for example, as shown in FIG. 12, a portion where a light beam is output. The insulator 4 may be molded and sealed so that the lens portion 41 is provided. In this case, since the light rays output from the device to the outside are converged or diffused by the lens unit 41, the light rays having an arbitrary shape are output by changing the shape of the lens unit 41 and the refractive index of the insulator 4. can do. Further, it goes without saying that the lens portion 41 is not limited to the convex shape as shown in FIG. 12, but may be concave.

【0142】

Although the present invention has been specifically described above based on the above-described embodiment, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the gist thereof. ..

【0143】

[Effect of the invention]

The effects obtained by representative of the inventions disclosed in the present application will be briefly described as follows.

【0144】

(1) In a light emitting device using a light emitting element such as a light emitting diode, it is possible to stabilize the light emitting efficiency of the light emitting element and prevent a decrease in operation reliability.

【0145】

(2) A light emitting device using a light emitting element such as a light emitting diode can be made thinner and smaller.

【0146】

(3) In the method of manufacturing a light emitting device using a light emitting element such as a light emitting diode, the number of parts used can be reduced and the manufacturing cost of the device can be reduced.

[Simple explanation of drawings]

[Figure 1]

It is a schematic diagram which shows the schematic structure of the light emitting device of Example 1 by this invention, FIG. 1 (a) is a plan view of the whole light emitting device, and FIG. 1 (b) is the line AA'in FIG. 1 (a). 1 (c) is a cross-sectional view taken along the line B-B'of FIG. 1 (a).

[Figure 2]

It is a schematic diagram which shows the schematic structure of the light emitting device of this Example 1, and is the enlarged sectional view of the 1st lead of FIG. 1 (b).

[Fig. 3]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 1, and is the top view of the lead frame used for manufacturing a light emitting device.

[Fig. 4]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 1, FIG. 4 (a) is an enlarged plan view of region L1 of FIG. 3, and FIG. 4 (b) is C- of FIG. 4 (a). A cross-sectional view taken along the line C', FIG. 4 (c) is a cross-sectional view taken along the line D-D'of FIG. 4 (a).

[Fig. 5]

FIG. 5 (a) is a schematic view for explaining the manufacturing method of the light emitting device of the first embodiment, FIG. 5 (a) is a plan view of a process of forming a reflective portion, and FIG. 5 (b) is E- of FIG. 5 (a). It is a cross-sectional view along the E'line.

[Fig. 6]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 1, FIG. 6 (a) is a plan view of the process of bending a protrusion, and FIG. 6 (b) is F-F of FIG. 6 (a). A cross-sectional view taken along the line, FIG. 6 (c) is a cross-sectional view taken along the line G-G of FIG. 6 (a).

[Fig. 7]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 1, FIG. 7 (a) is a plan view of the process of adhering a light emitting element, and FIG. 7 (b) is H- of FIG. 7 (a). It is a cross-sectional view along the H'line.

[Fig. 8]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 1, FIG. 8 (a) is a plan view of the wire bonding process, and FIG. 8 (b) is I-I'of FIG. 8 (a). It is a cross-sectional view by a line.

[Fig. 9]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 1, FIG. 9 (a) is a plan view of the sealing process, and FIG. 9 (b) is the J-J'line of FIG. 9 (a). It is a cross-sectional view in.

[Fig. 10]

FIG. 10 (a) is a schematic view showing a modified example of the light emitting device of the first embodiment, FIG. 10 (a) is a plan view of the entire light emitting device, and FIG. It is a figure.

[Fig. 11]

It is a schematic diagram which shows the other modification of the light emitting device of Example 1, and is the top view which shows the example which changed the shape of the reflection part.

[Fig. 12]

It is a schematic diagram which shows the other modification of the light emitting device of Example 1, and is the cross-sectional view which shows the example which changed the outer shape of the insulator.

[Fig. 13]

It is a schematic diagram which shows the schematic structure of the light emitting device of Example 2 by this invention, FIG. 13 (a) is a plan view of the whole light emitting device, and FIG. 13 (b) is the L-L'line of FIG. 13 (a). It is a cross-sectional view of.

[Fig. 14]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 2, and is the top view of the lead frame used for manufacturing a light emitting device.

[Fig. 15]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 2, and is the enlarged plan view of the region L2 of the lead frame shown in FIG.

[Fig. 16]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of Example 2, FIG. 16 (a) is a plan view of the process of forming a reflective part, and FIG. 16 (b) is M- of FIG. 16 (a). It is a cross-sectional view along the M'line.

[Fig. 17]

FIG. 17 (a) is a schematic view for explaining the manufacturing method of the light emitting device of the second embodiment, FIG. 17 (a) is a plan view of a process of bending a protrusion, and FIG. 17 (b) is an N-N of FIG. 17 (a). A cross-sectional view taken along the line, FIG. 17 (c) is a cross-sectional view taken along the line O-O of FIG. 17 (a).

[Fig. 18]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 2, and is the top view of the light emitting element mounting process.

[Fig. 19]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of Example 2, FIG. 19 (a) is a plan view of the sealing process, and FIG. 19 (b) is the P-P'line of FIG. 19 (a). It is a cross-sectional view in.

[Fig. 20]

It is a schematic diagram for demonstrating the manufacturing method of the light emitting device of this Example 2, and is the top view of the individualization process.

[Fig. 21]

It is a schematic diagram which shows the mounting example of the light emitting device of this Example 2, and is the cross-sectional view of the mounting example at the time of outputting light in the normal direction of the mounting surface of a mounting board.

[Fig. 22]

FIG. 22 (a) is a schematic view showing a mounting example of the light emitting device of the second embodiment, and FIG. 22 (a) is a cross-sectional view showing a mounting example in the case of outputting light in the in-plane direction of the mounting surface of the mounting board, FIG. 22 (b). ) Is a view seen from the right side of FIG. 22 (a).

[Fig. 23]

It is a schematic diagram which shows the schematic structure of the conventional light emitting device, FIG. 23 (a) is the sectional view of the through-hole mounting type light emitting diode, and FIG. 23 (b) is the enlarged plan view of the reflection part of FIG. 23 (a). ..

[Fig. 24]

It is a schematic diagram which shows the schematic structure of the conventional light emitting device, FIG. 24 (a) is a cross-sectional view of a surface mount type light emitting diode using a wiring board, and FIG. 24 (b) is a surface mount type using a thin metal substrate. It is sectional drawing of the light emitting diode of.

[Explanation of symbols]

1 ... light emitting element (light emitting diode), 101 ... semiconductor layer, 102 ... 1st electrode (cathode electrode), 103 ... 2nd electrode (anode electrode), 2 ... 1st lead, 201 ... 1st lead connection terminal, 202 ... Reflector, 202A ... Reflector bottom, 202B ... Reflector side (reflector), 203 ... 1st lead protrusion , 204 ... 1st lead bent part, 3 ... 2nd lead, 301 ... 2nd lead connection terminal part, 303 ... 2nd lead protrusion, 304 ... 2nd Bent part of LED, 4 ... Sealing insulator, 4A ... 1st surface of insulator, 4B ... 2nd surface of insulator, 4C ... 3rd surface of insulator, 401 ... 1st insulator, 402 ... 2nd insulator, 41 ... Lens part, 5 ... Bonding wire, 6 ... Silver plating film, 7 ... Conductive adhesive, 8. .. Lower mold, 9 ... Upper mold, 901 ... Upper mold recess (cavity), 10 ... Mounting board, 1001 ... Insulated board, 1002, 1003 ... Mounting board connection terminal, 11 ... Reflective member, 12 ... Wiring board, 1201 ... Insulated substrate, 1202 ... Cathode electrode pattern, 1203 ... Anodic electrode pattern, 13 ... Thin metal substrate, 14,15 .. .Steps, 16 ... slits, 17 ... reflective cups, 18 ... masking tape, 19 ... 1st resin, 20 ... 2nd resin, 21 ... 3rd Resin, LF ... lead frame, SH ... sprocket hole.