Solid-state imaging device and its manufacturing method

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Technical field to which the invention belongs]

The present invention relates to a solid-state image sensor and a method for manufacturing the same, and more particularly to a small solid-state image sensor formed by using a semiconductor image sensor such as a surveillance camera, a medical camera, and an in-vehicle camera, and a method for manufacturing the same. ..

【0002】

[Conventional technology]

【0003】

In recent years, this type of imaging device outputs an image input via an optical system such as a lens as an electric signal. With the miniaturization and higher performance of this imaging device, the camera has also been miniaturized and used in various fields, expanding the market as a video input device.

【0004】

In an image pickup device using a conventional semiconductor image pickup element, parts such as an LSI equipped with a lens, a semiconductor image pickup element, a drive circuit thereof, a signal processing circuit, and the like are formed in a housing or a structure, and these are combined. Conventionally, a mounting structure based on such a combination has been formed by mounting each element on a printed circuit board on a flat plate.

【0005】

It was formed by mounting each element on a substrate.

【0006】

Therefore, in order to further reduce the size of the device, the applicant has adopted a rectangular trapezoidal leg 101A and a body 101B formed on the rectangular trapezoidal leg 101A as mounting members, as shown in FIGS. 10 and 11. We have proposed a resin-made three-dimensional printed circuit board 101 in which an opening 101C is formed at a boundary between a leg portion 101A and a body portion 101B (Japanese Patent Laid-Open No. 2001-245186). Then, a printed wiring pattern 122 is formed on the back surface side of the leg 101A of the three-dimensional printed circuit board 101, and a lens 102 is fitted on the inner circumference of the body 101B so that the optical axis 117 is the center. An optical filter 103 is arranged on the upper side of the opening 101C, and a semiconductor image sensor 104 and a chip component 108, which are one of the solid-state image sensors, are arranged on the lower side. Then, by connecting the solder paste 114 to the terminal pattern 122 arranged on the leg 101A, the solder paste 114 is connected to the main board 113 of various devices such as a mobile phone and a personal computer. FIG. 12 is an explanatory view of the main part thereof. The semiconductor image sensor 104 is connected to the terminal pattern 105 formed on the leg 101A via the bump 106 formed on the surface, and is sealed with the sealing resin 107. As a result, it is connected to the three-dimensional printed circuit board 101. The same parts are designated by the same reference numerals.

【0007】

Such a three-dimensional printed circuit board is obtained by injection molding, but is usually used to reduce the coefficient of linear expansion of the resin material in terms of molding accuracy and durability of the molding die. There was a problem that (filler) could not be added in a certain amount or more. Further, it has anisotropy that the filler is oriented in the molding flow direction and is large in the vertical direction.

【0008】

Further, since the thermoplastic resin generally used in injection molding has a linear molecular binding structure, it has anisotropy that the coefficient of linear expansion is small in the molecular binding direction and large in the vertical direction. .. Therefore, there is a problem that deformation is particularly likely to occur in a specific direction (direction perpendicular to the molecular binding direction).

【0009】

[Problems to be Solved by the Invention]

Therefore, in the heating process when the solid-state image sensor is mounted on the three-dimensional printed circuit board, the three-dimensional printed circuit board is greatly deformed, an extremely large stress is applied to the connection portion between the solid-state image sensor and the three-dimensional printed circuit board, and the connection due to cracks or the like is applied. Opening failure sometimes occurred. Normally, this connection portion is composed of a pad provided on a solid-state image sensor and a terminal electrode of a three-dimensional printed circuit board, and the connection between them is made by using a conductive adhesive such as silver paste. Sound bonding, thermocompression bonding, etc. are used.

【0010】

In either method, the solid-state image sensor is likely to be peeled off due to thermal deformation of the three-dimensional printed circuit board, which causes a decrease in yield. As described above, by making the printed circuit board a three-dimensional structure, the strain due to heat is three times that in the case of the normal planar structure, and the deformation due to the difference in the coefficient of linear expansion has become a big problem that hinders the improvement of the yield.

【0011】

The present invention has been made in view of the above circumstances, and suppresses thermal deformation of a resin structure such as a three-dimensional printed circuit board, ensures connection of a solid-state image sensor, and adheres to sealing glass such as an optical filter. The purpose is to improve.

【0012】

[Means for solving problems]

Therefore, in the present invention, a structure composed of an insulating resin made of a thermoplastic resin, having a through opening and having a wiring portion on the surface, and a structure connected to the wiring portion and having the through opening. A solid-state image sensor mounted on the structure so as to close the structure, and a translucent member mounted on the structure so as to close the through opening at a predetermined distance from the solid-state image sensor. , The structure has different molecular binding directions or filler arrangement directions in the vicinity of the solid-state image sensor mounting surface on which the solid-state image sensor is mounted and at a position parallel to the mounting surface of the solid-state image sensor. It is characterized by having a boundary surface.

【0013】

By the way, when the structure is made of a thermoplastic resin formed by injection molding, it is liable to be deformed especially when it is cured, and when it is used in a high temperature environment, it is deformed, and the solid-state image sensor and the structure There is a problem that a connection failure is likely to occur at the connection portion with (three-dimensional wiring board). In particular, this deformation tends to occur in the direction perpendicular to the injection direction. Therefore, according to the above configuration, since the boundary surfaces having different molecular bonding directions are provided in the vicinity of the solid-state image sensor mounting surface and at positions parallel to the solid-state image sensor mounting surface, this boundary is provided. By different directions of elongation on the surface, stress cancels each other out, expansion and contraction due to heat are reduced, deformation of the structure is suppressed both during mounting and use, and with a translucent member such as an optical filter. The position accuracy with the solid-state image sensor can be maintained with high accuracy, the connection failure between the solid-state image sensor and the wiring part of the structure is reduced, the reliability of the connection of the solid-state image sensor is improved, and the solid-state image sensor is highly reliable. Can be provided. In addition, the occurrence of connection defects such as peeling on the optical filter mounting surface is reduced. Furthermore, since the structure can be formed of the same material, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed. Here, the term "nearby" refers to a distance that can increase the certainty when the solid-state image sensor is mounted, including the case where the image sensor is in direct contact with the image sensor or is in the vicinity thereof.

【0014】

The boundary surface of the structure is characterized in that it is formed so as to have a deviation of 45 degrees to 90 degrees in the molecular binding direction or the filler arrangement direction.

【0015】

In particular, by forming the molecule so as to have a deviation of 45 to 90 degrees in the molecular binding direction, deformation of the boundary surface near the mounting surface can be efficiently suppressed due to the direction anisotropy of elongation depending on the molecular binding direction. .. Therefore, since poor connection can be prevented most efficiently, the certainty of connection of the solid-state image sensor can be improved.

【0016】

Desirably, the boundary surface of the structure is formed by attaching a fixing plate made of a thermoplastic resin molded so that the molecular binding directions are different on the mounting surface of the translucent member. It is characterized by that.

【0017】

According to such a configuration, since the translucent member is arranged in the through opening of the structure via a fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular bonding direction, the translucent member is translucent. Since the deformation of the structure is suppressed in and near the fixed portion of the sex member, the thermal deformation of the structure in the vicinity of the solid-state image sensor can be suppressed, and the certainty of the connection of the solid-state image sensor can be enhanced. Further, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

【0018】

Desirably, the fixing plate is characterized by being two plate-like bodies arranged in parallel with each other along the molecular arrangement direction or the filler arrangement direction of the thermoplastic resin.

【0019】

According to such a configuration, by forming the two plate-like bodies so as to be parallel to the molecular arrangement direction, it is possible to suppress the elongation in the direction perpendicular to the molecular binding direction.

【0020】

Desirably, the fixing plate is a ring-shaped plate-like body attached to the through opening.

【0021】

According to this configuration, since the fixing plate is a ring-shaped plate-like body, elongation in all directions is suppressed and deformation is significantly suppressed, so that thermal deformation of the structure in the vicinity of the solid-state image sensor is suppressed. However, the certainty of connection of the solid-state image sensor can be improved.

【0022】

More preferably, the structure is characterized by being a structure made of a thermoplastic resin formed by integral molding so as to have the boundary surface by injection molding the thermoplastic resin.

【0023】

According to such a configuration, only by changing the injection direction, by forming by integral molding at the boundary surface, bonding is not required, and manufacturing is easy.

【0024】

Further, preferably, the structure is composed of at least two divided structures made of a thermoplastic resin which is divided and molded so as to have a deviation in the molecular binding direction at the boundary surface, and by laminating the divided structures. It is characterized by being formed.

【0025】

According to this configuration, the mold is divided and formed so as to have a deviation in the molecular binding direction at the boundary surface, and the molds are bonded together. Therefore, the mold configuration can be simplified and the cavity of the normal mold is halved. It is sufficient to change the injection direction by using a thing, no adjustment is required, and the man-hours are increased, but the manufacturing process itself can be simplified.

【0026】

Desirably, the structure is integrally molded so as to enclose a fixing plate made of a thermoplastic resin, and the molecular binding direction is different at the interface with the fixing plate.

【0027】

According to such a configuration, a fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular bond direction is mounted in a mold for injection molding, and normal injection molding is performed, thereby easily performing normal injection molding. Since the fixing plate is sealed and the deformation of the structure is suppressed at the sealing location and its vicinity, the thermal deformation of the structure in the vicinity of the solid-state image sensor is suppressed and the reliability of the connection of the solid-state image sensor is enhanced. be able to. Further, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

【0028】

Desirably, the structure has a leg portion forming a wiring portion and a tubular body portion provided on the leg portion, and the penetrating portion between the body portion and the leg portion. It is characterized by having an opening.

【0029】

According to such a configuration, in particular, the structure of the entire device can be miniaturized, but there is a problem that connection failure is likely to occur due to deformation of the connection portion due to thermal deformation. However, according to the present invention, by changing the molecular arrangement direction, it is possible to suppress the thermal deformation of the structure made of the insulating resin very easily and increase the certainty of the connection of the solid-state image sensor.

【0030】

Further, in the method of the present invention, the through opening is closed at a predetermined distance from the through opening, the solid-state image sensor mounting surface on which the solid-state image sensor can be mounted, and the solid-state image sensor mounting surface. A structure forming step of forming a structure including a translucent member mounting surface for mounting the translucent member, a wiring portion forming step of forming a wiring portion on the structure, and the solid-state imaging The structure forming step includes a solid-state image sensor mounting step of mounting the solid-state image sensor on the element mounting surface and a translucent member mounting step of mounting the translucent member on the translucent member mounting surface. This is a structure molding step of forming a structure in the vicinity of the mounting surface of the solid-state image sensor and at a position parallel to the mounting surface of the solid-state image sensor so as to have boundary surfaces having different molecular bonding directions. It is characterized by that.

【0031】

According to such a method, the thermoplastic insulating resin is easily injected into the molding mold from different directions with the boundary surface as a boundary so that the molecular bond directions have different boundary surfaces. , A structure with little deformation of the solid-state image sensor mounting surface can be formed, and the positional accuracy between the translucent member such as an optical filter and the solid-state image sensor can be maintained with high accuracy. Poor connection with the wiring unit is also reduced, the reliability of the connection of the solid-state image sensor is improved, and it is possible to provide a highly reliable solid-state image sensor.

【0032】

Also, preferably, the boundary surface is formed so as to have a deviation of 45 degrees to 90 degrees.

【0033】

Desirably, in the structure molding step, thermoplastic resins are injected into the molding die from different directions with the boundary surface as a boundary, and the injection direction is displaced in the mold. It is characterized by including a step of injection molding so as to have.

【0034】

According to this configuration, deformation of the structure is easily suppressed by performing normal injection molding by changing the injection direction in the injection molding mold, so that the structure in the vicinity of the solid-state image sensor is formed. It is possible to suppress thermal deformation of the body and increase the certainty of connection of the solid-state image sensor. In addition, the structure is made of the same material, and there is no difference in the coefficient of thermal expansion, so that the occurrence of strain can be suppressed.

【0035】

Desirably, the structure molding step includes a step of injection molding with a resin fixing plate formed in advance in a molding die having different molecular arrangement directions or filler arrangement directions. And.

【0036】

According to such a configuration, a fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular bond direction is mounted in a mold for injection molding, and normal injection molding is performed, thereby easily performing normal injection molding. Since the fixing plate is sealed and the deformation of the structure is suppressed at the sealing location and its vicinity, the thermal deformation of the structure in the vicinity of the solid-state image sensor is suppressed and the reliability of the connection of the solid-state image sensor is enhanced. be able to. Further, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

【0037】

Desirably, the through-opening, the solid-state image sensor mounting surface on which the solid-state image sensor can be mounted on the through-opening, and the light-transmitting so as to close the through-opening at a predetermined distance from the solid-state image sensor mounting surface. A structure molding step of forming a structure made of an insulating resin having a translucent member mounting surface for mounting a sex member, a wiring portion forming step of forming a wiring portion on the structure, and the solid The translucent member is provided through a solid-state image sensor mounting step of mounting the solid-state image sensor on the image sensor mounting surface and a fixing plate made of a thermoplastic resin having a different molecular arrangement direction or filler arrangement direction on the translucent member mounting surface. It is characterized by including a step of mounting a translucent member.

【0038】

According to this configuration, since the translucent member is mounted via a fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular binding direction, deformation of the structure is suppressed in the vicinity of the fixing plate. Therefore, it is possible to suppress thermal deformation of the structure in the vicinity of the solid-state image sensor and increase the certainty of connection of the solid-state image sensor. Further, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

【0039】

Also, preferably, the boundary surface is formed so as to have a deviation of 45 degrees to 90 degrees.

【0040】

More desirablely, the through-opening, the solid-state image sensor mounting surface on which the solid-state image sensor can be mounted on the through-opening, and the through-opening are closed at a predetermined distance from the solid-state image sensor mounting surface. A boundary provided with a translucent member mounting surface for mounting the optical member and having a structure made of an insulating resin in the vicinity of the solid-state image sensor mounting surface and parallel to the solid-state image sensor mounting surface. A split structure molding step of molding as at least two split structures made of thermoplastic resins that are split and molded so as to have a deviation in the molecular bond direction from each other on the surface, and a wiring portion that forms a wiring portion on the split structure. A forming step, a bonding step of bonding the divided structures to form a structure, a solid-state image sensor mounting step of mounting the solid-state image sensor on the solid-state image sensor mounting surface, and a translucent member mounting surface. It is characterized by including a step of mounting the translucent member via a fixing plate made of a thermoplastic resin having a different molecular arrangement direction or a filler arrangement direction.

【0041】

According to such a configuration, in the resin molding step, the two divided structures are separately molded so as to have a deviation in the molecular binding direction from each other, and these are bonded together to deform the vicinity of the solid-state image sensor mounting surface extremely easily and surely. Is suppressed, mounting is easy, and connection defects due to deformation during use are also reduced.

【0042】

Also, preferably, the boundary surface is formed so as to have a deviation of 45 degrees to 90 degrees.

【0043】

Further, preferably, in the structure forming step, thermoplastic insulating resins are injected into the molding die from different directions with the boundary surface as a boundary so as to have a deviation in the injection direction at the boundary surface. It is characterized by being an injection molding process.

【0044】

According to such a configuration, a structure that is injection-molded so as to have different injection directions may be formed as a divided structure and bonded to each other, which is extremely easy to manufacture.

【0045】

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

【0046】

First Embodiment [0047]

FIG. 1 shows an explanatory view of a main part of the solid-state image sensor according to the first embodiment of the present invention. In this solid-state image sensor, when the solid-state image sensor 4 is connected to the resin structure 1S provided with a wiring portion such as a terminal pattern 5, the optical filter mounting surface 8 on which the optical filter 3 of the resin structure is mounted is used. By attaching the fixing plate 1Q made of polyphthalamide resin, the mounting surface 8 is formed so that the molecular binding directions are different. Further, the boundary surface between the fixing plate 1Q and the resin structure 1S is arranged close to the optical filter mounting surface 8.

【0048】

That is, as shown in FIG. 2, this fixing plate 1Q has a thickness of about t = t = 0.1 to 0.2 mm and forms a square ring with a coefficient of thermal expansion of about 10 ppm / ° C, and is an insulating polyphthal. It is composed of an amide resin. A resin made of polyphthalamide resin, which is composed of a rectangular trapezoidal leg portion 1A and a body portion 1B formed on the leg portion 1A, and has a through opening 1C formed at a boundary between the leg portion 1A and the body portion 1B. A resin structure 1 composed of a structure 1, having a through opening 1C, and having a wiring portion including a terminal pattern 5 on a part of the surface, and a resin structure 1 connected to the wiring portion and the through opening. It is attached to the solid-state image sensor 4 mounted on 1C and electrically connected to the terminal pattern 5 via a fixing plate 1Q so as to close the through opening at a predetermined distance from the solid-state image sensor 4. It is provided with an optical filter 3 made of a translucent resin.

【0049】

Next, a method of manufacturing this solid-state image sensor will be described. First, as shown in FIG. 4A, it is composed of a rectangular trapezoidal leg 1A and a body 1B formed on the leg 1A, and a through opening 1C is provided at the boundary between the leg 1A and the body 1B. The formed resin structure 1 made of polyphthalamide resin is formed by injection molding. Then, a wiring portion including the terminal pattern 5 formed on the back surface side of the leg portion 1A by a thin film process such as a plating process or a sputtering method is formed in a predetermined region of the resin structure 1.

【0050】

Then, as shown in FIG. 4 (b), the fixing plate 1Q made of polyphthalamide resin as shown in FIG. 2 is applied to the optical filter mounting surface 8 of the resin structure 1 by using an adhesive resin (not shown). Stick it on.

【0051】

Subsequently, as shown in FIG. 4 (c), the solid-state image sensor (chip) 4 is mounted on one surface of the through opening 1C of the resin structure 1. Here, a bump 6 is formed on the connection electrode of the solid-state image sensor 4, and is connected to one end of the terminal pattern 5 formed on the leg portion 1A of the resin structure via thermocompression bonding or a conductive adhesive. Then, the resin is sealed so that the surface of the solid-state image sensor 4 is covered with the sealing resin 7.

【0052】

After that, as shown in FIG. 4 (d), the optical filter 3 is attached onto the fixing plate 1Q using an adhesive resin. The fixing plate 1Q and the optical filter 3 may be attached to each other using the same adhesive resin at the same time.

【0053】

Here, the optical filter 3 is formed by depositing a dielectric thin film having a multilayer structure having a desired refractive index on the surface of a translucent substrate made of a flat glass material to form a dielectric interference filter.

【0054】

In the solid-state image sensor formed in this way, the thermoplastic resin is molded so as to have a deviation in the molecular bonding direction at or near the optical filter mounting surface 8 near the solid-state image sensor mounting surface 9 of the resin structure. Since the optical filter 3 is mounted via the fixing plate 1Q made of, the fixing plate 1Q suppresses thermal deformation of the resin structure, thereby increasing the certainty of connecting the solid-state image sensor to the resin structure. be able to. Further, since the fixing plate 1Q can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

【0055】

This resin structure is obtained by injection molding, but since this polyphthalamide resin has a linear molecular binding structure, the coefficient of thermal expansion is small in the molecular binding direction and large in the vertical direction. It has anisotropy.

【0056】

Therefore, in the first embodiment, a ceramic plate formed in a square ring shape was used as shown in FIG. 2, but as shown in FIG. 3, along the injection direction of the thermoplastic resin or the arrangement direction of the filler. , Two strip-shaped fixing plates 1QA and 1QB may be mounted so as to be parallel to each other and parallel to the mounting surface.

【0057】

According to this configuration, the elongation in the direction of large elongation is suppressed and the deformation is significantly suppressed. Therefore, the thermal deformation of the resin structure in the vicinity of the solid-state image sensor is suppressed, and the connection reliability of the solid-state image sensor is improved. Can be enhanced.

【0058】

Second embodiment Next, a second embodiment of the present invention will be described with reference to FIG. This solid-state imaging device was integrally molded with a fixing plate 1Q made of PPS resin whose molecular arrangement direction differs from that of this resin structure 1 by 90 degrees in a resin structure 1 made of PPS resin. It is a feature. Here, the back surface of the optical filter 3 is integrally molded with the fixing plate 1Q sandwiched at a position where the back surface of the optical filter 3 comes into contact with the surface of the fixing plate 1Q sandwiched in the resin structure 1. Here, the molecular arrangement direction changes at the interface between both sides of the fixing plate 1Q and the resin structure 1, and the elongation at the interface between the two is suppressed.

【0059】

As shown in FIG. 5, this solid-state image sensor is parallel to the optical filter mounting surface of the resin structure 1 made of a thermoplastic resin provided with a wiring portion and the solid-state image sensor mounting surface. By integrally molding the square ring-shaped fixing plate 1Q, deformation of the solid-state image sensor mounting surface is suppressed.

【0060】

Other parts are formed in the same manner as in the first embodiment. The same parts are designated by the same reference numerals.

【0061】

Next, a method of manufacturing this solid-state image sensor will be described. First, as shown in Fig. 6 (a), with the square ring-shaped fixing plate 1Q mounted in the cavity of the injection molding mold (not shown), the molecular arrangement direction is the fixing plate 1Q made of PPS resin. The injection direction is set so as to be 90 degrees different, and the PPS resin is injected and cured to form the resin structure 1 made of PPS resin integrally molded with the fixing plate. Then, a wiring portion including the terminal pattern 5 formed on the back surface side of the leg portion 1A is formed in a predetermined region of the resin structure by a thin film process such as a plating process or a sputtering method.

【0062】

Then, as shown in FIG. 6 (b), the fixing plate 1Q is enclosed to prevent deformation, and a solid-state image sensor (chip) is formed on one surface of the through opening of the resin structure 1 to which the optical filter 3 is mounted. ) Install 4. Here, a bump 6 is formed on the connection electrode of the solid-state image sensor, and is connected to one end of the terminal pattern 5 formed on the leg portion 1A of the resin structure 1 by thermocompression bonding. After that, the surface of the solid-state image sensor 4 is resin-sealed.

【0063】

Subsequently, as shown in FIG. 6 (c), the optical filter 3 is attached to the filter mounting surface 8 of this resin structure using an adhesive resin.

【0064】

Here, the optical filter 3 deposits a dielectric thin film having a multilayer structure having a desired refractive index on the surface of a translucent substrate made of a flat glass material and interferes with the dielectric, as in the case of the first embodiment. It is assumed that a filter is formed.

【0065】

In the solid-state image sensor formed in this way, a fixing plate made of PPS resin whose molecular arrangement direction differs from that of the resin structure 1 by 90 degrees on the optical filter mounting surface close to the solid-state image sensor mounting surface 9 of the resin structure. Since the solid-state image sensor is mounted in the state where the 1Q is sealed, the fixing plate 1Q suppresses thermal deformation of the resin structure, and the reliability of the connection of the solid-state image sensor can be improved.

【0066】

Further, according to this configuration, in the resin molding process, the fixing plate 1Q made of PPS resin whose molecular arrangement direction differs from that of the main body of the resin structure by 90 degrees is embedded so as to be embedded, so that the fixing plate is extremely easy and reliable. Is formed and is easy to implement. Further, since the fixing plate and the resin structure main body are made of the same resin, there is no difference in the coefficient of thermal expansion at the interface and there is no possibility of peeling. In the injection molding process, the boundary surface with the fixing plate is in a fused state, and the adhesion is extremely good.

【0067】

Desirably, the melting point of the resin constituting the fixing plate is set to be slightly higher than the melting point of the resin constituting the resin structure, whereby the fixing plate is surely not melted during injection molding. It is possible to maintain a good shape as a fixing plate and thus to maintain the molecular arrangement direction, and it is possible to increase the strength at the interface.

【0068】

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. 7. In the second embodiment, the fixing plate 1Q made of PPS resin having a different molecular arrangement direction by 90 degrees is a resin structure so that the back surface of the optical filter 3 comes into contact with the front surface of the fixing plate 1Q. The one integrally molded in the state of being sealed in 1 was used, but in this embodiment, as shown in FIG. 7, the fixing plate 1Q is completely sealed in the resin structure 1. It is a feature.

【0069】

Other parts are formed in the same manner as in the second embodiment. The same parts are designated by the same reference numerals.

【0070】

According to such a configuration, the mold design becomes a little complicated, but the adhesion between the resin structure and the fixing plate is further improved, and it is possible to provide a highly reliable mounting structure.

【0071】

Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIG. In the first to third forms, the resin fixing plates 1Q having different molecular arrangement directions are attached or integrally formed to form a boundary surface having different molecular arrangement directions. In this example, FIG. As shown in, it is composed of at least two divided structures 1PA and 1PB made of polyphthalamide resin which are divided and molded so as to have a deviation in the molecular binding direction at the boundary surface Ba, and by laminating these divided structures. It is characterized by being formed.

【0072】

The other parts are formed in the same manner as in the first to third embodiments. The same parts are designated by the same reference numerals.

【0073】

Next, a method of manufacturing this solid-state image sensor will be described. First, as shown in FIGS. 9A and 9B, it consists of a rectangular trapezoidal leg 1A and a body 1B formed on the leg 1A, and penetrates the boundary between the leg 1A and the body 1B. A polyphthalamide resin composed of a first structure 1PA and a second structure 1PB, respectively, so as to form an opening 1C and form a shape divided into two at an intermediate portion of the through opening 1C. The resin structure 1 is formed by injection molding. The first structure 1PA and the second structure 1PB have different molecular arrangement directions by 90 degrees on their bonding surfaces, and a thin film process such as a plating process or a sputtering method is applied to a predetermined region of this resin structure. Therefore, a wiring portion including the terminal pattern 5 formed on the back surface side of the leg portion 1A is formed.

【0074】

Then, as shown in FIG. 9 (c), these first and second structures are bonded together to form a resin structure 1 having a molecular arrangement direction different by 90 degrees at the interface. At this time, an adhesive may be used for bonding, but after cleaning the interface, only the vicinity of the interface may be heated and pressurized under vacuum to directly bond them.

【0075】

Then, as shown in FIG. 9D, the solid-state image sensor (chip) 4 is mounted on one surface of the through opening of the resin structure 1. Here, a bump 6 is formed on the connection electrode of the solid-state image sensor 4, and is connected to one end of the terminal pattern formed on the leg portion 1A of the resin structure by thermocompression bonding. Then, the resin is sealed so that the surface of the solid-state image sensor 4 is covered with the sealing resin 7.

【0076】

After that, as shown in FIG. 9 (e), the optical filter 3 is attached using an adhesive resin.

【0077】

According to this configuration, the particles are divided and formed so as to have a deviation in the molecular binding direction at the boundary surface, and these are bonded together. Therefore, if the injection direction is changed using a mold having a half cavity. Well, no adjustment is required, and the man-hours increase, but the manufacturing process itself can be simplified. In addition, the structure of the mold can be simplified and the manufacturing is easy.

【0078】

In the first to fourth embodiments, an optical filter is used as the translucent member, but the present invention is not limited to the optical filter, and the translucent sealing member, the lens, and the like can be appropriately deformed.

【0079】

Further, as the resin forming the resin structure, a thermosetting resin such as an epoxy resin can be applied in addition to a thermoplastic resin such as a polyphthalamide resin and a PPS resin.

【0080】

Further, in the first to fourth embodiments, an optical filter is used as the translucent member, but the present invention is not limited to the optical filter, and the translucent sealing member, the lens, and the like can be appropriately deformed.

【0081】

Further, the solid-state imaging device of the present invention is not limited to the field of optical communication as a camera, and can be applied to various optical devices such as reading elements for CDs and DVDs, reading elements for copiers, medical devices and doorphones. Is possible.

【0082】

[Effect of the invention]

As described above, according to the present invention, the boundary surfaces having different molecular bonding directions are provided in the vicinity of the solid-state image sensor mounting surface and at positions parallel to the solid-state image sensor mounting surface. Since the directions of elongation are different from each other at this interface, stresses cancel each other out, expansion and contraction due to heat are reduced, deformation of the structure is suppressed during both mounting and use, and translucency of optical filters and the like is suppressed. The positional accuracy between the member and the solid-state image sensor can be maintained with high accuracy, the connection failure between the solid-state image sensor and the wiring part of the structure is reduced, the reliability of the solid-state image sensor connection is improved, and the solid is highly reliable. It becomes possible to provide an image pickup device. In addition, the occurrence of connection defects such as peeling at the optical filter mounting portion is reduced. Furthermore, since the structure can be formed of the same material, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

【0083】

Further, according to the present invention, since the structure is divided and formed so as to have a deviation in the molecular binding direction at the boundary surface and these are bonded together, the structure of the mold can be simplified and the structure of the mold can be simplified. It suffices to change the injection direction using a cavity with half, no adjustment is required, the man-hours increase, but the manufacturing process itself can be simplified, and a method for manufacturing a solid-state imaging device that is easy to manufacture can be provided. Is.

【0084】

Further, according to the present invention, if the thermoplastic resin is injection-molded by integral molding so as to have a boundary surface having different molecular arrangement directions, it is attached by integrally molding at the boundary surface only by changing the injection direction. No matching is required, and manufacturing is easy.

【0085】

Further, according to the present invention, a fixing plate made of a thermoplastic resin molded so as to have a deviation in the molecular bonding direction is mounted in a mold for injection molding, and normal injection molding is performed. Since the fixing plate can be easily sealed and the deformation of the structure is suppressed at the sealing location and its vicinity, the thermal deformation of the structure in the vicinity of the solid-state image sensor is suppressed, and the connection reliability of the solid-state image sensor is suppressed. Can be enhanced. Further, since the fixing plate can be formed of the same material as the structure, there is no difference in the coefficient of thermal expansion, and the occurrence of strain can be suppressed.

[Simple explanation of drawings]

[Figure 1]

It is sectional drawing which shows the solid-state image sensor in 1st Embodiment of this invention.

[Figure 2]

It is a figure which shows the fixing plate used in the 1st Embodiment of this invention.

[Fig. 3]

It is a figure which shows the modification of the fixing plate used in the 1st Embodiment of this invention.

[Fig. 4]

It is a figure which shows the mounting process of the solid-state image sensor in 1st Embodiment of this invention.

[Fig. 5]

It is sectional drawing which shows the solid-state image sensor in the 2nd Embodiment of this invention.

[Fig. 6]

It is a figure which shows the mounting process of the solid-state image sensor in the 2nd Embodiment of this invention.

[Fig. 7]

It is a figure which shows the solid-state image sensor in the 3rd Embodiment of this invention.

[Fig. 8]

It is sectional drawing which shows the solid-state image sensor in 4th Embodiment of this invention.

[Fig. 9]

It is a figure which shows the mounting process of the solid-state image sensor in 4th Embodiment of this invention.

[Fig. 10]

It is a perspective view which shows the solid-state image sensor of the conventional example.

[Fig. 11]

It is sectional drawing which shows the solid-state image sensor of the conventional example.

[Fig. 12]

It is explanatory drawing of the main part which shows the solid-state image sensor of the conventional example.

[Explanation of symbols]

1 Resin structure 1Q fixing plate 1A legs 1B body 1C through opening 1QA 1st structure 1QB second structure 3 Optical filter 4 Solid-state image sensor 5 terminal pattern 6 bumps 7 Encapsulating resin 8 Optical filter mounting surface 9 Solid-state image sensor mounting surface