Liquid crystal device and electronic equipment

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Technical field to which the invention belongs]

The present invention relates to a liquid crystal device and an electronic device, and more particularly to a configuration of a liquid crystal display panel in which an area outside the display area is made as narrow as possible in order to reduce the size of the liquid crystal device.

【0002】

[Conventional technology]

In recent years, liquid crystal display panels have been widely used as means for displaying various types of information in portable electronic devices such as notebook computers, mobile phones, and wristwatches. In particular, in portable electronic devices, etc., the display area should be as wide as possible and the part outside the display area (hereinafter referred to as "the following") in order to accommodate the liquid crystal display panel in the limited space inside the housing and increase the amount of information that can be displayed. , In the present specification, it is desired that this portion is narrowed (referred to as a hidden area or a frame).

【0003】

Usually, in this type of liquid crystal display device, particularly a liquid crystal display device called a passive matrix (simple matrix) type, a liquid crystal is enclosed between two transparent substrates, and a striped transparent surface orthogonal to each other on the facing surface of each transparent substrate. The electrodes are formed. In this liquid crystal display device, a method is adopted in which the portion where the transparent electrodes on the two substrates intersect with each other becomes a pixel, and the liquid crystal is driven from the outside for each pixel. In order to drive the liquid crystal from the outside, for example, a driving IC in which non-display areas on each transparent substrate are projected to the outside of the substrates facing each other and a signal is supplied to the transparent electrodes of each substrate is provided in that region. A configuration was adopted in which each was mounted, and the terminals of each drive IC and each transparent electrode were routed and electrically connected using wiring.

【0004】

However, after that, for the purpose of narrowing the frame of the liquid crystal display panel and reducing the number of drive ICs used, in the case of a small panel with not so many pixels, all the electrodes on the two transparent substrates were used. A method has been proposed in which a large number of routing wires provided in a non-display area on one of the boards are made conductive and driven by one driving IC connected to these routing wirings. 27 and 28 show a configuration example of this type of liquid crystal display device.

【0005】

FIG. 27 shows a circuit board in the form of so-called COF (Chip On Film) mounting, in which chip components are mounted on a film (flexible) substrate, bonded to a liquid crystal display panel. One side of the lower board 100 projects to the outside of the upper board 101, and the flexible printed wiring board 103 (hereinafter abbreviated as FPC) on which one drive IC 102 is mounted is electrically used. It is joined to. A large number of striped electrodes 104 and 105 are formed on the facing surfaces of the lower substrate 100 and the upper substrate 101 in the directions orthogonal to each other.

【0006】

FIG. 28 shows a form of so-called COG (Chip On Glass) mounting in which chip components are mounted on a glass substrate, and one side of the lower substrate (glass substrate) 110 projects to the outside of the upper substrate 111. The drive IC 112 is directly mounted on this part, and the FPC 113 for supplying the drive signal to the drive IC 112 is electrically joined.

【0007】

In either form, the wiring for the electrodes on the lower board and the wiring for the electrodes on the upper board are all collected on one side of the lower board on which the FPC and drive IC are mounted. ..

【0008】

An example of the connection structure of the routing wiring of the upper substrate and the lower substrate constituting the liquid crystal display panel will be described in detail with reference to FIGS. 29 and 30. FIG. 29 is a plan view showing the arrangement of the electrodes and the routing wiring of the upper substrate 120, and FIG. 30 is a plan view showing the arrangement of the electrodes and the routing wiring of the lower substrate 130. As shown in FIG. 29, in the upper substrate 120, a large number of strip-shaped scanning electrodes 121 extending in the horizontal direction in the drawing are arranged in a stripe shape. Here, the region where a large number of scanning electrodes 121 are formed becomes the display region 122 as a liquid crystal display device. Then, in the non-display area outside the display area 122 (the right side and the left side of the display area 122 in the drawing), the scanning electrode routing wiring 123 for supplying a signal to each scanning electrode 121 is arranged. The routing wiring 123 is pulled out in the extending direction of the electrode, then bent and collected at both ends on one side (lower side in the drawing) of the upper substrate 120.

【0009】

On the other hand, as shown in FIG. 30, in the lower substrate 130, the strip-shaped signal electrodes 131 extending in the direction orthogonal to the scanning electrodes 121 formed on the upper substrate 120 (vertical direction in the figure) are striped. Many are arranged. A signal electrode routing wire 132 for supplying a signal to each signal electrode 131 is arranged in a non-display area outside the display area 122 (lower central portion of the display area 122 in the drawing). .. Further, on both sides of the region where the signal electrode routing wires 132 are arranged, the scanning electrode routing wiring 133 for electrically connecting to the scanning electrode routing wiring 123 of the upper substrate 120 is provided on the scanning electrode 121. The same number as the number of is arranged. Further, the pitch of the scanning electrode routing wiring 133 coincides with the pitch of the scanning electrode routing wiring 123 of the upper substrate 120. In this configuration example, all the routing wires 123 and 132 are integrally formed with the scanning electrode 121 or the signal electrode 131, and are transparent conductive such as indium tin oxide (hereinafter abbreviated as ITO). It is made of a film.

【0010】

When the upper board 120 and the lower board 130 having the above configuration are bonded together, the outer shape of the upper board 120 is smaller than the outer shape of the lower board 130, and the lower end and the lower end of the scanning electrode routing wiring 123 on the upper board 120. The upper end of the scanning electrode routing wiring 133 on the side substrate 130 is located so as to face each other at the vertical conductive portion indicated by reference numeral 134 in the drawing. For example, an anisotropic conductive film, a conductive paste, a conductive material containing conductive particles, and the like are provided in the vertical conductive portion 134, and the routing wiring 123 for the scanning electrode on the upper substrate 120 and the lower substrate are provided through the conductive material. The scanning electrode routing wiring 133 on the 130 is electrically connected. In this way, all the routing wires for the scanning electrodes 133 and all the routing wirings for the signal electrodes 132 are gathered on one side of the lower substrate 130. Therefore, for example, FIG. 27 is shown in this portion. By connecting to the COF-mounted substrate as described above, signals can be supplied from one drive IC on the COF-mounted substrate to all the scanning electrodes 121 and the signal electrodes 131.

【0011】

[Problems to be Solved by the Invention]

However, the liquid crystal display device having the above configuration has the following problems. That is, the substrate constituting the conventional liquid crystal display device always requires a region for forming wiring around the outside of the display region as described above. As described above, the display capacity of liquid crystal display devices in recent years tends to increase more and more, but as the display capacity (number of pixels) increases, the number of wiring wires increases and the area where the wiring wiring is formed. This becomes an obstacle to narrowing the frame because it becomes wide.

【0012】

In order to prevent the routing wiring formation area from becoming wide even if the display capacity is increased, it is possible to reduce the pitch of the routing wiring (wiring width + wiring interval), but in that case, the routing wiring resistance increases. There is a risk of adversely affecting the display quality. For example, when 100 routing wires are formed at a pitch of 50 μm, a routing wiring forming region of about 5 mm is required. At this time, the routing resistance reaches the order of several kΩ to MΩ, and problems such as signal waveform rounding may occur.

【0013】

In order to suppress the increase in the resistance of the routing wiring, there are methods such as lowering the resistance of the transparent conductive film constituting the routing wiring and adding a metal auxiliary wiring having a low resistance. However, in the case of the former method, it is important for the transparent conductive film to secure sufficient light transmittance at the electrode portion, and it is difficult to reduce the resistance while maintaining high transmittance. Further, in the latter method, there is a problem that the load on the manufacturing process increases. After all, until now, there has been no effective means for reducing the routing wiring forming region without increasing the resistance of the routing wiring.

【0014】

Further, as shown in FIGS. 27 and 28, since a conventional liquid crystal display device requires an area for mounting an FPC or a drive IC, one substrate must be greatly projected from the other substrate. When the liquid crystal display device is housed in the housing of the electronic device, this portion is wasted space. Therefore, it has led to the securing and expansion of the non-display (frame) area of the liquid crystal display device.

【0015】

A technique for mounting an electronic circuit and a driving IC on the back surface side of a substrate for the purpose of narrowing the frame of a liquid crystal display device is disclosed in Japanese Patent Application Laid-Open No. 5-323354. Similarly, Japanese Patent Application Laid-Open No. 7-159802 discloses a technique in which one of the substrates functions as both a pixel pattern wiring board and a drive circuit wiring board. However, this publication simply describes that the drive line on the front surface side of one of the substrates is conducted to the back surface side via a via hole (contact hole) and is connected to the drive circuit and the drive IC on the back surface side. However, the overall configuration of the liquid crystal display device is unknown.

【0016】

The present invention has been made to solve the above problems, and is a liquid crystal device capable of miniaturization by narrowing the frame without causing deterioration of display quality due to an increase in routing resistance or the like. It is an object of the present invention to provide an electronic device using this.

【0017】

[Means for solving problems]

In order to achieve the above object, the liquid crystal device of the present invention is a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates arranged to face each other, and the first substrate of the pair of substrates is used. A first conductive portion is provided on the inner surface facing the liquid crystal layer, and a first routing conductive portion electrically connected to the first conductive portion passes from the inner surface to the inside of the substrate and is opposite to the inner surface. In the second substrate which is provided over the outer surface of the above and has translucency, the second conductive portion is provided on the inner surface facing the liquid crystal layer, and the second conductive portion is electrically connected to the second conductive portion. A routing conductive portion is provided from the inner surface of the second substrate to the inner surface of the first substrate, and further from the inner surface of the first substrate through the inside of the substrate to the outer surface of the first substrate, and is provided on the inner surface side of the first substrate. A light reflecting portion is provided, a polarizing means is provided on the outer surface side of the second substrate, and the outer surface side of the first substrate is electrically connected to the first routing conductive portion and the second routing conductive portion. It is characterized in that the connected electronic components are mounted.

【0018】

That is, the liquid crystal device of the present invention is an electronic component that is electrically connected to the first conductive portion on the inner surface of the first substrate and the second conductive portion on the inner surface of the second substrate on the outer surface side of the first substrate. Is implemented. The "first conductive portion" and "second conductive portion" referred to here are specifically, a scanning electrode in a passive matrix type liquid crystal device, an electrode such as a signal electrode, or a scanning line in an active matrix type liquid crystal device. Refers to wiring such as data lines. Further, the electronic component specifically refers to a drive IC, a capacitor, or the like used in a drive circuit of a liquid crystal device.

【0019】

Specifically, the first conductive portion is electrically connected to the electronic component via a first routing conductive portion provided from the inner surface of the first substrate, through the inside of the substrate, and over the outer surface of the first substrate. ing. On the other hand, the second conductive portion is provided from the inner surface of the second substrate to the inner surface of the first substrate across the substrates, and further from the inner surface of the first substrate to the inner surface of the substrate and over the outer surface of the first substrate. It is electrically connected to the electronic component via the second routing conductive part.

【0020】

Therefore, in the conventional configuration, the routing wiring is routed to the region (non-display region) outside the electrode forming region (in other words, the display region) on the inner surface of the first substrate. In the basic configuration of the present invention, the routing wiring (wiring conductive portion) is routed from the inner surface side of the first substrate through the inside of the substrate to the outer surface side. Here, the present invention is a reflective liquid crystal device in which a light reflecting portion is provided on the inner surface side of the first substrate and a polarizing means is provided on the outer surface side of the second substrate. Even if the wiring is formed in the area corresponding to the display area in a plane after being routed to the outer surface side of the substrate, there is no problem in display. Further, the electronic components electrically connected to these wirings can also be arranged in the area corresponding to the display area on the outer surface of the first substrate.

【0021】

Moreover, in the configuration of the present invention, the basic configuration of the routing conductive portion sandwiches not only the first routing conductive portion on the first substrate, which is the substrate on the side on which the electronic component is mounted, but also the liquid crystal layer. The same applies to the second routing conductive portion from the second substrate facing in. That is, all the conductive portions of the pair of substrates are routed through the inside of the first substrate and finally routed to the outer surface side of the first substrate, and are connected to the electronic components.

【0022】

Therefore, according to the configuration of the present invention, in the conventional configuration, the routing area provided outside the display area on the inner surface of the first substrate, and the mounting area for the FPC and electronic components are not required. The frame part can be made much narrower than that of. In addition, the routing conductive portion can be laid out on the entire outer surface side of the first substrate including the inside of the display area, and the pitch between the routing conductive portions can be designed with a margin, so that the routing resistance can be obtained. There is no problem of increasing.

【0023】

Further, in the present invention, since the first substrate does not necessarily have to be a translucent substrate, as a choice of substrate material, in addition to a conventional transparent substrate such as a glass substrate or a quartz substrate, for example, polyimide or the like is used. A resin substrate, a ceramic substrate, or the like can also be used, which improves the degree of freedom in selecting the material of the first substrate. In other words, in the liquid crystal apparatus of the present invention, the first substrate functions as one of the substrates constituting the liquid crystal apparatus itself, and at the same time, functions as a mounting substrate for the drive circuit. Therefore, in some cases, it is possible to reduce the number of connecting parts such as flexible tape.

【0024】

Further, it is desirable to provide an external connection terminal electrically connected to an input terminal of an electronic component such as a drive IC on the outer peripheral edge of the first substrate.

【0025】

If an external connection terminal is provided on the peripheral edge, it is easy to align the external connection terminal and the FPC terminal when mounting an FPC for supplying a drive signal to the drive IC. It can be carried out. Further, stress may be generated in the joint portion during or after FPC joining, but if the position is the peripheral portion of the substrate outside the display region, the stress does not adversely affect the display.

【0026】

The specific configuration of the first routing conductive portion in the first substrate is provided inside a hole provided between the inner surface side and the outer surface side of the first substrate, and is electrically connected to the first conductive portion. A device having a first in-hole connection portion connected to the first hole and a first outer surface upper connection portion for electrically connecting the first in-hole connection portion and an electronic component on the outer surface of the first substrate. Can be used. Further, the hole can be a through hole penetrating the inner surface side and the outer surface side of the first substrate.

【0027】

With this configuration, through holes can be easily formed by performing operations such as laser processing and chemical etching on the first substrate. Further, by filling the through hole with silver paste or the like, performing electrolytic plating, or the like, the first hole connection portion made of a conductive material can be formed in the through hole. On the other hand, the first outer surface connecting portion can be easily formed by a usual wiring forming technique such as film formation or patterning of a conductive film. It should be noted that the first in-hole connection portion only needs to be able to electrically connect the first conductive portion and the first outer surface connection portion, and may not necessarily be embedded in the entire inside of the hole. Absent. Further, the first hole connection portion may be provided directly under the seal, or the first hole connection portion may be arranged at a position away from the seal. When the first in-hole connection portion is provided directly under the seal, for example, a conductive member can be mixed in the seal material and polymerized to be electrically connected, so that the frame can be narrowed and the structure becomes simple. The part of the first hole connection part may have a slightly raised shape on the first substrate for manufacturing reasons, so if there is a problem with the display, the first hole connection will be made on the outside of the seal. There is no problem if the parts are arranged.

【0028】

Further, the first substrate includes a conductive layer forming a first conductive portion on the inner surface side, a conductive layer forming a first outer surface upper connection portion on the outer surface side, and one or more internal conductive layers inside the substrate. It may be composed of a substrate having a structure, that is, a substrate such as a so-called multilayer printed wiring board. In this case, the holes extending from the inner surface to the outer surface of the first substrate are between the inner surface and the inner conductive layer of the first substrate, between the outer surface and the inner conductive layer of the first substrate, or mutual internal conductivity. It is composed of a plurality of via holes provided between the layers.

【0029】

When this type of substrate is used, for example, when the number of routing conductive portions increases and it becomes difficult to arrange a large number of routing conductive portions only on the outer surface of the first substrate, some of the routing conductive portions are used. The part can be routed by using an internal conductive layer, and the degree of freedom of routing is improved, so that it is possible to cope with an increase in display capacity.

【0030】

In the case of the configuration having the first outer surface upper connection portion, the first conductive portion on the inner surface side and the first outer surface upper connection portion on the outer surface side can be made of the same conductive material.

【0031】

With this configuration, after forming conductive films on the inner and outer surfaces of the first substrate, photolithography and etching are performed on both the inner and outer surfaces, and the conductive films on both sides are simultaneously patterned for the first. Since the conductive portion of the above and the first outer surface connecting portion can be formed, the manufacturing process can be simplified.

【0032】

On the contrary, the first conductive portion on the inner surface side and the first upper connection portion on the outer surface side may be made of different conductive materials.

【0033】

In this configuration, as will be described later, when the first conductive portion, for example, the electrode in the passive matrix type liquid crystal apparatus also serves as the light reflecting portion, the first conductive portion contains silver (or silver) having a high light reflectance. A metal material such as alloy) or aluminum is used, and a metal material such as copper, which is a low resistance material, is used for the first outer surface connecting portion in order to reduce the routing resistance. It is possible to select the most suitable conductive material for each function of the connection portion on the outer surface of 1. As a result, the display quality can be improved at the cost of not obtaining the above-mentioned advantage of simplifying the manufacturing process.

【0034】

On the other hand, regarding the specific configuration of the second routing conductive portion, the second routing conductive portion is provided between the first substrate and the second substrate and is electrically connected to the second conductive portion. A second inter-hole connection portion provided inside a hole provided between the connected inter-board connection portion and the inner surface side and the outer surface side of the first substrate and electrically connected to the inter-board connection portion. And, on the outer surface of the first substrate, a second outer surface connecting portion for electrically connecting the second in-hole connection portion and the electronic component can be provided.

【0035】

Any means such as a conductive paste or conductive particles formed so as to extend between both substrates can be used for the inter-board connection portion. Alternatively, a conductive material mixed inside the sealing material that seals the liquid crystal layer may be used to make a conductive connection between the substrates.

【0036】

Regarding the positional relationship between the inter-board connection portion and the second intra-hole connection portion, a second intra-hole connection portion may be provided directly under the inter-board connection portion, or a position separated from the inter-board connection portion. A second in-hole connection may be arranged in the hole. In that case, it is desirable to provide a second inner surface connecting portion on the inner surface of the first substrate, which electrically connects the inter-board connecting portion and the second in-hole connection portion.

【0037】

When a second in-hole connection is provided directly under the board-to-board connection, for example, a conductive member is mixed in the sealing material and polymerized to electrically connect the connection, so that the frame can be narrowed and the structure can be increased. It will be easy. Similar to the first in-hole connection part, the second in-hole connection part may have a slightly raised shape on the first substrate for manufacturing reasons. If there is a problem in the relationship or display, there is no problem if the connection between the boards and the connection in the second hole are separated.

【0038】

Further, in that case, it is desirable that the second inner surface connecting portion and the first conductive portion are formed of the same conductive material.

【0039】

With this configuration, the second inner surface connecting portion and the first conductive portion can be formed at the same time in one step, so that the manufacturing process is not complicated.

【0040】

As described above, in the liquid crystal apparatus of the present invention, there are many choices of substrate materials that can be used for the first substrate. Further, for both the first substrate and one or both substrates, for example. It may be composed of a flexible substrate such as a plastic film substrate.

【0041】

With this configuration, the liquid crystal device can be made thinner and lighter, damage such as cracking of the substrate is less likely to occur, and curved surface can be displayed by bending the substrate. It is suitable for electronic devices in Japan.

【0042】

Examples of the method of the liquid crystal device to which the present invention can be applied include the following three. One is a passive matrix type liquid crystal device, in which case the first conductive portion on the first substrate becomes a plurality of electrodes formed in a stripe shape, and the second conductive portion on the second substrate is described above. A plurality of electrodes are formed in a stripe shape so as to extend in a direction intersecting the electrodes. Of course, either the first conductive portion or the second conductive portion may be a scanning electrode or a signal electrode.

【0043】

When the present invention is applied to a passive matrix type liquid crystal apparatus, the first conductive portion on the first substrate is formed of a material having high light reflectivity, for example, a metal such as silver (or an alloy containing silver) or aluminum. For example, the first conductive portion itself can be a reflective electrode that also serves as the light reflecting portion. That is, the liquid crystal device of the present invention may be a reflective liquid crystal device having a reflective electrode, or a reflective liquid crystal device having a reflective layer and a display electrode separately.

【0044】

The other is an active matrix type liquid crystal device that uses a thin film diode (hereinafter abbreviated as TFD) as a switching element, in which case, a plurality of first conductive parts on the first substrate are used. It becomes a data line or a scanning line, and the second conductive portion on the second substrate becomes a plurality of scanning lines or data lines formed in a stripe shape so as to extend in a direction intersecting the data line or the scanning line.

【0045】

Yet another is an active matrix type liquid crystal apparatus using a thin film transistor (hereinafter abbreviated as TFT) as a switching element, in which case, a plurality of first conductive portions on the first substrate are used. It becomes at least one of a data line and a scanning line, and the second conductive portion on the second substrate serves as one common electrode.

【0046】

Further, in the liquid crystal apparatus of the present invention described above, a color filter may be provided on the inner surface of the first substrate or the second substrate.

【0047】

With this configuration, it is possible to realize a color liquid crystal display with a narrow frame and high display quality, which is suitable for various electronic devices that are expected to be further colored in the future.

【0048】

The electronic device of the present invention is characterized by including the above-mentioned liquid crystal device of the present invention. According to the present invention, by providing a small liquid crystal device with a narrow frame, it is possible to realize an electronic device having a wide display area and excellent portability in spite of the small size of the entire device.

【0049】

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] Hereinafter, the first embodiment of the present invention will be described with reference to FIGS. 1 to 13.

【0050】

The present embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, and is an example of a liquid crystal display device having a display electrode that also serves as a light reflecting unit, that is, a so-called reflecting electrode.

【0051】

FIG. 1 is a perspective view of the entire liquid crystal display device of the present embodiment as viewed from the upper surface side, FIG. 2 is a perspective view of the entire liquid crystal display device of the present embodiment as viewed from the lower surface side, FIG. 3 is an upper surface (electrode forming surface) view of the lower substrate, and FIG. A transmission plan view of the lower substrate viewed from the lower surface side (transmission plan view viewed from the mounting surface side of the electronic component), FIG. 5 is a lower surface (electrode forming surface) view of the upper substrate, and FIG. 6 is an upper substrate and a lower substrate. FIG. 7 is a cross-sectional view taken along the line AA'of FIG. 6, and FIG. 8 is a cross-sectional view taken along the line B-B'of FIG. In all the drawings below, the scale is different for each layer and each member in order to make each layer and each member recognizable in the drawing.

【0052】

In the liquid crystal display device 1 of the present embodiment, as shown in FIG. 1, a lower substrate 2 (first substrate) and an upper substrate 3 (second substrate) are arranged to face each other, and a liquid crystal layer is provided between these substrates. (Not shown in Fig. 1) is sandwiched. In the present embodiment, an opaque substrate made of polyimide or the like is used as the lower substrate 2, and a transparent substrate made of polycarbonate, polyether sulfone, acrylic resin or the like is used as the upper substrate 3. In the following description, the surface of both substrates facing the liquid crystal layer is referred to as an "inner surface", and the surface on the opposite side is referred to as an "outer surface". That is, the surface on both substrates on which the liquid crystal layer is arranged is referred to as an "inner surface", and the surface on the opposite side is referred to as an "outer surface". Further, a retardation plate 4 (λ / 4 plate) and a polarizing plate 5 (polarizing means) are sequentially attached to the outer surface side of the upper substrate 3. In the drawings after FIG. 2, the retardation plate 4 and the polarizing plate 5 are not shown.

【0053】

A large number of signal electrodes 6 (first conductive portions) are provided in a stripe shape on the inner surface of the lower substrate 2, and extend on the inner surface of the upper substrate 3 facing the signal electrodes 6 in a direction orthogonal to the signal electrodes 6. A large number of scanning electrodes 7 (second conductive portions) are provided in a striped shape. The portion where the signal electrode 6 and the scanning electrode 7 intersect is the individual pixel 8, and the region in which a large number of pixels 8 are arranged in a matrix is the display region 9. In the present embodiment, the electrode on the lower substrate 2 side will be described as a signal electrode, and the electrode on the upper substrate 3 side will be described as a scanning electrode, but the opposite may be true. Further, in the present embodiment, the shapes of the signal electrode 6 and the scanning electrode 7 are striped, but the shape is not limited to this shape, and can be applied to any electrode shape such as a multiple matrix configuration or an icon. Is.

【0054】

As shown in FIG. 2, a drive IC 10 (electronic component) is mounted in a region corresponding to the display region 9 in a plane on the outer surface of the lower substrate 2. This drive IC 10 receives a signal input from an external circuit (not shown) through an external connection terminal 26 and supplies an image signal to the signal electrode 6 and a scanning signal to the scanning electrode 7. Is. Further, on the outer surface of the lower substrate 2, the signal electrode connection wiring 12 (first outer surface upper connection portion) forming a part of the signal electrode routing wiring (first routing conductive portion) described later. , And the scanning electrode connection wiring 14 (second outer surface connecting portion) that forms part of the scanning electrode routing wiring (second routing conductive portion) are arranged, respectively, of the driving IC 10. It is electrically connected to a terminal (Fig. 2 and Fig. 4 are not shown).

【0055】

As shown in FIG. 3, a large number of signal electrodes 6 made of a metal thin film having high light reflectance such as aluminum or silver (or an alloy containing silver) are striped (striped) on the inner surface of the lower substrate 2. It is provided. These signal electrodes 6 also serve as a reflective layer, and at the time of display, they are incident from the outside of the upper substrate 3 via the polarizing plate 5 and the retardation plate 4, and the light transmitted through the liquid crystal layer reaches the inner surface of the lower substrate. It is reflected on the surface of these signal electrodes 6 to display an image. One end of the signal electrode 6 extends as it is in the extending direction of the electrode, and the tip thereof is formed in a circular shape, and serves as a land 16 for connecting to the in-hole connection portion (first in-hole connection portion) described later. .. The land 16 is arranged at the end of the lower substrate 2 along the substrate side in the extending direction of the signal electrode 6. A through hole penetrating between the inner and outer surfaces of the lower substrate 2 is formed in the center of the land 16. This portion of the end of the signal electrode 6 becomes the signal electrode connection wiring 18 that forms a part of the signal electrode routing wiring that electrically connects the signal electrode 6 and the drive IC 10.

【0056】

In the case of the present embodiment, the signal electrode connection wiring 18 is alternately arranged in the opposite regions such as the left side, the right side, the left side, and so on of the signal electrode 6 in order from the uppermost signal electrode 6 in FIG. Since it is pulled out, the distance between the connecting wirings adjacent to each other in the vertical direction is wide, and the connecting wirings are less likely to be short-circuited to ensure reliability. However, if there is no problem with the spacing between the connection wirings, all the connection wirings can be pulled out in the same direction, for example, the upper half connection wiring can be pulled out separately from the left side, and the lower half connection wiring can be pulled out separately from the right side. The wiring pull-out direction may be arbitrary. In addition, by arranging the through holes in a zigzag (staggered arrangement) instead of arranging them linearly, it becomes possible to cope with a narrow pitch. Further, it is not necessary to form a portion thinner than the signal electrode 6 as the connection wiring, and a through hole may be simply provided at the end of the signal electrode 6.

【0057】

Further, in the lower substrate 2, at the end of the other substrate side adjacent to the substrate side on which the land 16 is arranged at the end, a vertical conductive portion (inter-board connection portion) and an in-hole connection portion (described later) are formed. A large number of scanning electrode connection wirings 21 (second inner surface upper connection portions) that are electrically connected to the second hole connection portion) are formed. These scanning electrode connection wirings 21 are electrically connected to each of the scanning electrodes 7 and the land 22 of the upper substrate 3 by vertical conduction between the upper and lower substrates. In the case of the present embodiment, one end of the connection wiring 21 for each scanning electrode is a rectangular land 22 in contact with the vertical conductive portion, and the other end is a circular land 23 in contact with the in-hole connection portion. A through hole penetrating between the inner and outer surfaces of the lower substrate 2 is formed in the center. These scanning electrode connection wirings 21 are also made of the same material as the signal electrodes 6, such as aluminum.

【0058】

FIG. 4 shows a state in which the lower substrate 2 shown in FIG. 3 is turned upside down. On the outer surface of the lower substrate 2, a through hole formed in the land 16 of the signal electrode connection wiring 18 shown in FIG. 3 and a through hole formed in the land 23 of the scanning electrode connection wiring 21 are formed. Circular lands 24 and 25 are provided corresponding to the positions of. Further, on the outer surface of the lower substrate 2, the signal electrode connection wiring 12 is directed from each land 24 corresponding to the through hole formed in the land 16 of the signal electrode connection wiring 18 toward the mounting area of the drive IC 10. , And similarly, the scanning electrode connection wiring 14 is provided from each land 25 corresponding to the through hole formed in the land 23 of the scanning electrode connection wiring 21 toward the mounting area of the drive IC 10. There is.

【0059】

Of the four sides (four board sides) of the peripheral edge of the lower board 2, many of the above lands 24 and 25 are arranged along three sides (three board sides) and are formed on the inner surface of the upper board 3. A large number of external connection terminals 26 are formed along the remaining one side facing the substrate side (the substrate side on which the land 25 is arranged) in which electrical connection (vertical conduction) is made with the scanning electrode 7. .. That is, the external connection terminal 26 formed on the outer surface of the lower substrate 2 has an end portion along the substrate side of the lower substrate 2 located in the extending direction of the scanning electrode 7 formed on the inner surface of the upper substrate 3. Is arranged in. The external connection terminal 26 is used to connect the liquid crystal display device 1 and the drive external circuit or the like to the terminal of the FPC when it is connected using a connection component such as an FPC or an anisotropic conductive connector (or rubber connector). It is a terminal of. A signal input wiring 41 for supplying a drive signal to the drive IC 10 is provided from each of the external connection terminals 26 toward the mounting area of the drive IC 10. In the case of this embodiment, the signal electrode connection wiring 12, the scanning electrode connection wiring 14, the external connection terminal 26, the signal input wiring 41, etc. formed on the outer surface of the lower substrate 2 are all signal electrodes on the inner surface side. 6. Like each connection wiring 18, 21, etc., it is made of a material such as aluminum or silver (or an alloy containing silver). That is, the wiring other than the scanning electrode 7 formed on the inner surface of the upper substrate 3 and the electrode are made of the same material.

【0060】

It is desirable that the outer surface of the lower substrate 2 is covered with a resin such as polyimide or resist in the area where the wiring is exposed, excluding the mounting area of the driving IC 10 and the forming area of the external connection terminal 26. By forming such a coating layer, it is possible to prevent defects such as corrosion, disconnection, and short circuit of wiring such as signal electrode connection wiring 12, scanning electrode connection wiring 14, and signal input wiring 41.

【0061】

As shown in FIG. 5, a large number of scanning electrodes 7 made of a transparent conductive thin film such as ITO are provided in a stripe shape (strip shape) on the inner surface of the upper substrate 3. The end portion of each scanning electrode 7 in FIG. 5 in the length direction (wiring formation direction) is a portion connected to the vertical conduction portion. The outer surface side of the upper substrate 3 (not shown) is a flat surface on which nothing is formed.

【0062】

When the lower substrate 2 and the upper substrate 3 having the above configuration are overlapped with each other, the result is as shown in FIG. In FIG. 6, the member of reference numeral 27 indicated by the alternate long and short dash line is a sealing material for adhering both substrates and sealing the liquid crystal layer between the substrates. The portion where the signal electrode 6 and the scanning electrode 7 intersect is the individual pixel 8, and the region in which a large number of pixels 8 are arranged in a matrix is the display region 9. In the case of the present embodiment, the outer shape of the upper substrate 3 is smaller than the outer shape of the lower substrate 2, and the peripheral edge portion of the lower substrate 2 protrudes to the outside of the upper substrate 3. The land 16 portion at the tip of each signal electrode connection wiring 18 on the inner surface of the lower substrate 2 is located so as to protrude to the outside of the upper substrate 3, respectively. That is, the connection wiring 18 for each signal electrode derived from each signal electrode 6 penetrates the forming portion of the sealing material, and is further formed so as to extend outward from the outer shape (outer circumference) of the upper substrate 3, and is formed at the tip portion thereof. Land 16 is located. On the other hand, regarding the connection wiring 21 for each scanning electrode on the inner surface of the lower substrate 2, the rectangular land 22 in contact with the vertical conductive portion is located in the sealing material 27, and a circular land provided with a through hole. The portion 23 is located so as to protrude to the outside of the upper substrate 3.

【0063】

FIG. 7 is a cross-sectional view taken along the line AA'of FIG. 6, that is, a cross-sectional view cut in the direction along the signal electrode 6. As shown in this figure, the sealing material 27 is sandwiched between the lower substrate 2 and the upper substrate 3, and the liquid crystal layer 28 is sandwiched in the space sealed by the lower substrate 2, the upper substrate 3, and the sealing material 27. Has been done. Here, as the liquid crystal layer 28, a general liquid crystal such as STN (Super Twisted Nematic) liquid crystal can be used.

【0064】

The signal electrode 6 and the signal electrode connection wiring 18 integrally formed with the signal electrode 6 are formed on the inner surface of the lower substrate 2, and the signal electrode connection wiring 12 is formed on the outer surface of the lower substrate 2. , Through holes 17 penetrating the substrate are formed in the land portion at the tip of the connection wirings 12 and 18 for both signal electrodes. The inside of the through hole 17 is filled with a conductive material such as silver paste, and this conductive material electrically connects the signal electrode connection wiring 18 on the inner surface side and the signal electrode connection wiring 12 on the outer surface side. It constitutes an in-hole connection portion 15 to be connected.

【0065】

Here, as a more detailed configuration of the in-hole connection portion 15, for example, as shown in FIG. 11A, a conductive material such as silver paste is embedded inside the through hole 17 to form the in-hole connection portion 15. After that, if the coating layer 29 is formed by coating the surface of the conductive material with an insulating resin or the like, corrosion of the conductive material can be prevented. Alternatively, as shown in FIG. 11 (b), a conductive material is embedded inside the through hole 17 to form the intra-hole connection portion 15 first, and then the lower surface and the lower surface of the intra-hole connection portion 15 are covered. Signal electrode connection wirings 18 and 12 may be formed on the inner surface and the outer surface of the side substrate 2, respectively.

【0066】

Alternatively, the in-hole connection portion need only be able to electrically connect the signal electrode connection wirings on the inner surface side and the outer surface side, and does not necessarily have to be embedded in the entire inside of the hole. Therefore, as shown in FIG. 12, the conductive material may be attached only to the inner wall of the through hole 17 by using the electrolytic plating method to form the in-hole connection portion 30.

【0067】

Further, as shown in FIG. 7, the terminal 31 of the drive IC 10 is located at the end opposite to the side where the through hole 17 of the signal electrode connection wiring 12 formed on the outer surface of the lower substrate 2 is provided. It is connected. By adopting the above wiring structure, the image signal output from the drive IC 10 is on the signal electrode connection wiring 12 on the outer surface of the lower substrate 2, the hole connection portion 15, and the inner surface of the lower substrate 2. It is supplied to each signal electrode 6 via the signal electrode connection wiring 18 of the above. Therefore, the signal electrode connection wiring 12 on the outer surface of the lower substrate 2, the hole connection portion 15, and the signal electrode connection wiring 18 on the inner surface of the lower substrate 2 constitute the signal electrode routing wiring 11. become.

【0068】

The mounting form of the drive IC 10 shown in FIG. 7 is so-called face-down mounting (or ILB (Inner Lead Bonding) mounting) in which the surface (terminal forming surface) side of the IC faces the substrate side, for example, a matrix. BGA (Ball Grid Array) type semiconductor elements in which solder balls arranged in a shape form terminals 31, semiconductor elements in which bump electrodes are arranged along the outer peripheral portion of an IC, and the like are used.

【0069】

Alternatively, as shown in FIG. 10, the back surface side of the drive IC 32 is fixed on the lower substrate 2, and the electrode pad 33 on the IC front surface side and the signal electrode connection wiring 12 are bonded by a wire 34, so-called face-up. The drive IC may be mounted by a mounting form called mounting (or OLB (Outer Lead Bonding) mounting).

【0070】

Further, as shown in FIG. 7, a large number of scanning electrodes 7 are formed on the inner surface of the upper substrate 3. The alignment films 35 and 36 are formed on the uppermost layer on the side in contact with the liquid crystal layer 28 of both the lower substrate 2 and the upper substrate 3, respectively. The alignment films 35 and 36 are made of a film such as polyimide and have been subjected to alignment treatment such as rubbing. Further, a spacer 37 for keeping a constant distance between the substrates (hereinafter referred to as a cell gap) is sprayed between the lower substrate 2 and the upper substrate 3.

【0071】

On the other hand, FIG. 8 is a cross-sectional view taken along the line B-B'of FIG. 6, that is, a cross-sectional view cut in the direction along the scanning electrode 7, and shows the configuration of the routing wiring 13 for the scanning electrode. As shown in this figure, the scanning electrode 7 is formed on the inner surface of the upper substrate 3 so as to come into contact with the upper surface of the sealing material 27 at the end of the scanning electrode 7. Further, a large number of signal electrodes 6 are formed on the inner surface of the lower substrate 2, and a scanning electrode connection wiring 21 is formed so as to be in contact with the lower surface of the sealing material 27. Here, inside the sealing material 27, conductive materials such as metal particles and particles obtained by metal-plating the surface of a plastic ball are mixed in a binder such as resin, and scanning in contact with the upper surface and the lower surface of the sealing material 27, respectively. The electrode 7 and the scanning electrode connection wiring 21 are electrically connected to each other with anisotropy to form a vertical conductive portion 19.

【0072】

Hereinafter, the configuration in which the lower substrate 2 is electrically connected from the inner surface to the outer surface is the same as in the case of the signal electrode routing wiring 11. That is, the scanning electrode connection wiring 14 is formed on the outer surface of the lower substrate 2, and the through holes 38 are formed in the lands 23 and 25 at the tips of the scanning electrode connection wirings 21 and 14 on both the inner surface side and the outer surface side. Has been done. The inside of the through hole 38 is filled with a conductive material such as silver paste, and this conductive material constitutes the in-hole connection portion 20, and the inner surface side and outer surface side connection wirings 21 and 14 for scanning electrodes are electrically connected to each other. Is connected to.

【0073】

Further, a through hole 38 is provided at one end of the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, and a terminal 31 of the drive IC 10 is connected to the opposite end. By adopting the wiring structure as described above, the scanning signal output from the drive IC 10 is on the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the in-hole connection portion 20, and the inner surface of the lower substrate 2. It is supplied to each scanning electrode 7 via the scanning electrode connection wiring 21 and the vertical conductive portion 19 of the above. Therefore, the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the in-hole connection portion 20, the scanning electrode connection wiring 21 on the inner surface of the lower substrate 2, and the vertical conductive portion 19 are routed for the scanning electrode. Wiring 13 will be configured.

【0074】

Instead of mixing a conductive material inside the sealing material 27 to form this portion as a vertical conductive portion 19, for example, as shown in FIG. 9, the lower side outside the sealing material 27 on the inner surface of the upper substrate 2. The scanning electrode 7 may be extended to a position above the through hole 38 of the substrate 2, an arbitrary vertical conductive material 39 may be formed above the through hole 38 of the lower substrate 2, and this portion may be used as the vertical conductive portion 40. .. The vertical conductive material 39 can be formed by printing, for example, a silver paste or the like. In the case of this configuration, there is no electrical conduction in the portion of the sealing material 27, but conduction is made between the substrates in the portion where the upper and lower conductive material 39 is formed, and the conduction path is almost the same as the arrangement and connection structure of FIG. ..

【0075】

Hereinafter, a method for manufacturing a liquid crystal display device having the above configuration will be described.

【0076】

A polyimide substrate is prepared as a material for the lower substrate 2, and a conductive thin film made of a metal material such as aluminum is formed on both the front and back surfaces of the substrate. Next, after applying a photosensitive resist on the conductive thin films on both sides of the substrate, a photomask is placed on both sides of the substrate, and exposure is performed at the same time. Next, by simultaneously patterning the conductive thin films on both the front and back surfaces of the lower substrate using well-known photolithography and etching techniques, the signal electrodes 6 on the inner surface side of the lower substrate 2 and the connecting wirings 18, 21, respectively, The signal electrode connection wiring 12 on the outer surface side, the scanning electrode connection wiring 14, the signal input wiring 41, the external connection terminal 26, and the like are collectively formed.

【0077】

Next, through holes 17 and 38 penetrating the substrate are formed by irradiating a predetermined portion of each connection wiring end portion on the substrate with a CO2 laser or the like. As another method for forming through holes, chemical etching or the like using a resist pattern as a mask may be used. After that, the through holes 17 and 38 are filled with a conductive material such as silver paste to form the in-hole connecting portions 15 and 20, and the connecting wirings on both sides of the lower substrate 2 are electrically conductive. Further, as another method for forming the in-hole connection portion, a method of adhering a conductive material to the inner wall of the through hole by using electroplating or the like may be used. In any case, in the case of the present embodiment, by making the conductive thin film materials on both the front and back surfaces of the substrate the same, the signal electrodes on the inner surface side and the outer surface side of the lower substrate 2 can be subjected to one photolithography and etching process. Since various connection wirings and the like can be formed at the same time, the manufacturing process can be greatly simplified.

【0078】

On the other hand, a transparent substrate such as polycarbonate, polyether sulfone, or acrylic resin is prepared as the material of the upper substrate 3, and a transparent conductive film such as ITO is formed on one surface (inner surface) of the substrate. Next, the transparent conductive film is patterned using a well-known photolithography and etching technique to form a striped scanning electrode 7.

【0079】

Next, polyimide or the like is applied onto the inner surfaces of both the lower substrate 2 and the upper substrate 3 and fired, and then alignment treatment is performed by a rubbing method or the like to form alignment films 35 and 36, respectively. Next, a spacer 37 for holding the cell gap is sprayed on either the lower substrate 2 or the upper substrate 3, the resin material to be the sealing material 27 is printed, and then the lower substrate 2 and the upper substrate are printed. 3 and are bonded together, and the sealing material 27 is cured to prepare an empty cell. In the case of the present embodiment, a conductive material such as metal particles is mixed in the resin material to be the sealing material 27 in order to make the portion of the sealing material 27 a vertical conductive portion.

【0080】

Next, the liquid crystal cell is manufactured by injecting liquid crystal into the empty cell from the liquid crystal injection port of the sealing material by a vacuum injection method or the like and sealing the liquid crystal injection port. Further, after the retardation plate 4 and the polarizing plate 5 are sequentially attached to the outer surface side of the upper substrate 3, the drive IC 10 is mounted on the outer surface side of the lower substrate 2 in the form of face-down mounting, face-up mounting, or the like. Through the above steps, the liquid crystal display device 1 of the present embodiment is completed.

【0081】

In the liquid crystal display device 1 of the present embodiment, the signal electrode 6 on the inner surface of the lower substrate 2 and the scanning electrode 7 on the inner surface of the upper substrate 3 are electrically connected on the outer surface of the lower substrate 2, and the electrodes are connected to these electrodes. A drive IC10 that supplies signals is mounted. In the conventional configuration, the routing wiring of each electrode is routed to the outside of the display area on the inner surface of the lower substrate, for example, whereas in the configuration of the present embodiment, the routing wiring for the signal electrode is routed. 11. Both of the routing wiring 13 for the scanning electrode are routed from the inner surface of each of the lower substrate 2 and the upper substrate 3 to the outer surface side of the lower substrate 2 through the inside of the lower substrate 2.

【0082】

Therefore, according to the present embodiment, in the conventional configuration, the routing area provided outside the display area on the inner surface of the lower substrate, and the mounting area for the FPC and electronic components are not required. The frame can be made much narrower than that. In addition, a large number of connection wirings can be laid out on the entire outer surface side of the lower board 2 including the inside of the display area 9, and the pitch between the connection wirings can be designed with a margin, so that the routing resistance is reduced. There is no problem of increase.

【0083】

Further, as in the case where polyimide is used as the material of the lower substrate 2 in the present embodiment, the lower substrate 2 does not necessarily have to be a transparent substrate. In addition to a transparent substrate such as quartz, a resin substrate such as polyimide, a ceramic substrate, or the like can also be used, and the degree of freedom in selecting the material of the lower substrate 2 is improved. For example, when a ceramic substrate is used for the lower substrate 2, the rigidity of the lower substrate is improved, so that the substrate is less likely to be deformed, and a liquid crystal display device having excellent cell gap uniformity and display uniformity can be obtained. Be done. Further, both the upper and lower substrates may be made of a flexible substrate such as a plastic film substrate. With this configuration, the liquid crystal display device can be made thinner and lighter, damage such as cracking of the substrate is less likely to occur, and curved surface display is possible by bending the substrate. It becomes suitable for electronic devices such as.

【0084】

Further, since the external connection terminal 26 is provided on the peripheral edge of the outer surface of the lower board 2, when an FPC or the like for supplying a drive signal to the drive IC 10 is further mounted, the external connection terminal 26 and the FPC Alignment when connecting terminals can be easily performed. Further, stress may be generated in the joint portion at the time of FPC joining or after joining, but if the position is the peripheral portion of the substrate outside the display area 9, the stress does not adversely affect the display.

【0085】

In the case of the present embodiment, since the positions of the through holes 17, 38 of the lower substrate 2 are arranged outside the sealing material 27, the portions of the through holes 17, 38, which are connected in the holes 15, 20 are above the lower substrate 2. Even if the shape is slightly raised, the cell gap in the display area 9 inside the sealing material 27 does not change due to the influence, and there is no problem in displaying the image.

【0086】

Further, in the present embodiment, as described above, since the signal electrodes 6 and the like on the inner surface side of the lower substrate 2 and the various connection wirings and the like on the outer surface side are made of the same material such as aluminum, the manufacturing process is simplified. However, the signal electrodes 6 and the like on the inner surface side of the lower substrate 2 and various connection wirings and the like on the outer surface side may be formed of different materials. For example, a metal material such as silver (or an alloy containing silver) or aluminum having high light reflectance is used for the signal electrode 6 on the inner surface side, and a metal material such as copper which is a low resistance material is used for the connection wiring on the outer surface side. May be used. In this way, the above-mentioned advantage of simplification of the manufacturing process cannot be obtained, but the routing resistance can be further reduced.

【0087】

Regarding the configuration of the lower substrate 2, not only the substrate for conducting conduction of the conductive layer on the inner and outer surfaces by forming a conductive layer on the inner and outer surfaces of the substrate and penetrating the substrate, for example, as shown in FIG. It may be composed of a substrate having one or more internal conductive layers 42 inside the lower substrate 2, such as a so-called multilayer printed wiring board. In this case, the electrical conduction between the inner surface and the outer surface of the lower substrate 2 penetrates and conducts between the inner surface of the lower substrate 2 and the internal conductive layer 42, and the in-hole connection portion 44 in the via hole 43, And the intra-hole connection 46 in the via hole 45 that penetrates and conducts between the outer surface of the lower substrate 2 and the internal conductive layer 42 (or if there are two or more internal conductive layers, it penetrates and penetrates each other's internal conductive layers). It will be done by the in-hole connection in the conducting via hole).

【0088】

When this type of board is used for the lower substrate 2, for example, when the number of routing wires increases and it becomes difficult to route a large number of routing wires only on the outer surface of the lower substrate, some of the routing wires are drawn. It is also possible to route the wiring through the internal conductive layer. By doing so, the degree of freedom of routing is improved, and it becomes possible to cope with an increase in display capacity.

【0089】

[Second Embodiment] Hereinafter, the second embodiment of the present invention will be described with reference to FIGS. 14 to 16.

【0090】

Similar to the first embodiment, the present embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, and is a liquid crystal display having a display electrode that also serves as a light reflecting unit, that is, a so-called reflecting electrode. This is an example of a device. The difference from the first embodiment is that the upper substrate and the lower substrate have substantially the same shape, and the positions of the through holes and the external connection terminals on the lower substrate are different. In the first embodiment, the lower substrate is made larger than the outer shape of the upper substrate and the through holes are arranged outside the sealing material, and the external connection terminals are arranged from the upper substrate to the lower substrate on the outer surface of the lower substrate. In contrast to the arrangement along the substrate side of the overhanging region, in the present embodiment, the upper substrate and the lower substrate are arranged in substantially the same size, and the through holes are arranged directly under the sealing material. That is, the through holes are arranged in the forming region of the sealing material. Further, the external connection terminals are arranged in the area where the upper and lower boards overlap on the outer surface of the lower board.

【0091】

As described above, since the schematic configuration of the liquid crystal display device of the present embodiment is the same as that of the first embodiment, illustration and description of the common configuration will be omitted. FIG. 14 is a view corresponding to FIG. 6 of the first embodiment, and is a perspective view showing a state in which the upper substrate and the lower substrate are overlapped, and FIG. 15 is a cross section taken along the line AA'of FIG. FIG. 16 is a cross-sectional view taken along the line B-B'of FIG. In these drawings, the same reference numerals are given to the components common to those in FIGS. 1 to 13.

【0092】

In the liquid crystal display device 50 of the present embodiment, as shown in FIG. 14, a large number of signal electrodes 6 (first conductive portions) are provided in a stripe shape on the inner surface of the lower substrate 2, and each signal electrode is provided. At one end in the length direction (wiring forming direction) of 6, a signal electrode connection wiring 18 having a through hole in the center of the land 16 at the tip is provided. On the inner surface of the upper substrate 3 facing this, a large number of scanning electrodes 7 (second conductive portions) are provided in a stripe shape in a direction orthogonal to the signal electrode 6. Then, as shown in FIGS. 15 and 16, on the outer surface of the lower substrate 2, the signal electrode connection wiring 12 constituting a part of the signal electrode routing wiring 11 (first routing conductive portion) is formed. (First outer surface connection part) and scanning electrode connection wiring 14 (second outer surface connection part) that forms part of the scanning electrode routing wiring 13 (second routing conductive part), respectively. It is arranged and electrically connected to the drive IC 10. Further, an external connection terminal 26, a signal input wiring 41, and the like are provided on the outer surface of the lower substrate 2. The above configuration is the same as that of the first embodiment.

【0093】

Further, in the case of the first embodiment, since the positions of the through holes 38 are arranged apart from the positions of the sealing material 27 (upper and lower conductive portions), they are placed on the outer inner surface of the sealing material of the lower substrate 2. A scanning electrode connection wiring 21 for electrically connecting the sealing material 27 and the in-hole connection portion 20 in the through hole 38 was formed. On the other hand, in the case of the present embodiment, since the through hole 38 and the sealing material 27 are at the same position, they correspond to the scanning electrode connection wiring 21 on the inner surface of the lower substrate 2 in the first embodiment. There is no particular need for anything. Therefore, in the region where the sealing material 27 is arranged on the inner surface of the lower substrate 2, the number of rectangular lands 22 corresponding to the number of each scanning electrode 7 on the upper substrate 3 arranged at a position facing the sealing material 27 is 22. Is provided. Through holes 38 penetrating between the inner and outer surfaces of the lower substrate 2 are formed in the center of these lands 22.

【0094】

That is, when FIG. 6 and FIG. 14 are compared again, in the first embodiment, as shown in FIG. 6, the land 16 portion of each signal electrode connection wiring 18 on the inner surface of the lower substrate 2 is a sealing material. The portion of the circular land 23 that is located outside the 27 (outside the upper substrate 3) and is provided with the through hole 38 at the end of the connection wiring 21 for each scanning electrode is the outside of the sealing material 27 (upper substrate 3). It is located outside the). On the other hand, in the present embodiment, as shown in FIG. 14, the land 16 portion of each signal electrode connection wiring 18 on the inner surface of the lower substrate 2 is located directly below the sealing material 27, and each of them is located. The portion of the rectangular land 22 for vertical conduction provided corresponding to the scanning electrode 7 is also located directly below the sealing material 27. That is, the lands 22 for conducting conduction between the upper and lower substrates, and the lands 16 and 23 and the through holes 17 and 38 for conducting conduction from the inner surface to the outer surface of the lower substrate 2 are all arranged in the forming region of the sealing material 27. Has been done.

【0095】

Looking at this configuration in terms of cross-sectional structure, it is as shown in FIGS. 15 and 16. That is, when cut in the direction along the signal electrode 6, as shown in FIG. 15, the signal electrode 6 on the inner surface of the lower substrate 2 and the signal electrode connection wiring 18 integrated with the signal electrode 6 are formed, and the connection wiring 18 for the signal electrode is formed. A connection wiring 12 for a signal electrode is formed on the outer surface of the lower substrate 2. Through holes 17 penetrating the substrate are formed in the lands 16 and 24 of the connection wirings 18 and 12 for both signal electrodes immediately below the sealing material 27. The inside of the through hole 17 is filled with a conductive material such as silver paste, and this conductive material connects the connection wiring 18 for the signal electrode on the inner surface side and the connection wiring 12 for the signal electrode on the outer surface side to connect the inside of the hole. It constitutes part 15. Further, the terminal 31 of the drive IC 10 is connected to the end of the signal electrode connection wiring 12 on the outer surface of the lower substrate 2 on the side opposite to the side where the through hole 17 is provided. Similar to the first embodiment, various structures as shown in FIGS. 11 (a), 11 (b), and 12 can be adopted as the specific configuration of the intra-hole connection portion.

【0096】

By adopting the wiring structure as described above, the image signal from the drive IC 10 is the signal on the inner surface of the signal electrode connection wiring 12, the hole connection portion 15, and the lower substrate 2 on the outer surface of the lower substrate 2. It is supplied to each signal electrode 6 via the electrode connection wiring 18. Therefore, the signal electrode connection wiring 12 on the outer surface of the lower substrate 2, the hole connection portion 15, and the signal electrode connection wiring 18 on the inner surface of the lower substrate 2 constitute the signal electrode routing wiring 11. become.

【0097】

On the other hand, when cut in the direction along the scanning electrode 7, the scanning electrode 7 is formed on the inner surface of the upper substrate 3 so as to come into contact with the upper surface of the sealing material 27, as shown in FIG. Further, on the inner surface of the lower substrate 2, along with a large number of signal electrodes 6, a land 22 for connecting to the scanning electrode 7 is formed so as to be in contact with the lower surface of the sealing material 27. A conductive material such as metal particles is mixed inside the sealing material 27, and the scanning electrodes 7 and the lands 22 that are in contact with the upper surface and the lower surface of the sealing material 27 are electrically connected to form the vertical conductive portion 19. doing.

【0098】

Further, through holes 38 are formed in the lands 22 on the inner surface side of the lower substrate 2 and the lands 25 at the tip of the scanning electrode connection wiring 14 on the outer surface side. The inside of the through hole 38 is filled with a conductive material such as silver paste, and this conductive material constitutes the in-hole connection portion 20, and electrically connects the land 22 on the inner surface side and the connection wiring 14 for the scanning electrode on the outer surface side. Is connected. Further, the terminal 31 of the drive IC 10 is connected to the end portion of the lower substrate 2 on the outer surface of the scanning electrode connection wiring 14 on the side opposite to the side where the through hole 38 is provided. By adopting the wiring structure as described above, the scanning signal output from the drive IC 10 is on the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the hole connection portion 20, and the inner surface of the lower substrate 2. It is supplied to each scanning electrode 7 via the land 22 and the vertical conduction portion 19. Therefore, the scanning electrode connection wiring 14 on the outer surface of the lower substrate 2, the in-hole connection portion 20, the land 22 on the inner surface of the lower substrate 2, and the vertical conductive portion 19 constitute the scanning electrode routing wiring 13. Will be done.

【0099】

In the case of the present embodiment, as in the first embodiment, the land 16 of the connection wiring 18 for each signal electrode on the inner surface of the lower substrate 2 and the portion of the land 22 connected to the scanning electrode 7 are the sealing material 27. Since it does not protrude to the outside of the above, the outer shape of the lower substrate 2 and the outer shape of the upper substrate 3 can be made to the same size. As a result, the frame can be further narrowed as compared with the first embodiment.

【0100】

[Third Embodiment] Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. 17 and 18.

【0101】

Similar to the first and second embodiments, the present embodiment is an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device, and a display electrode that also serves as a light reflecting unit, a so-called reflective electrode, is used. This is an example of a liquid crystal display device having. The liquid crystal display device of the present embodiment is an example of realizing a reflective color liquid crystal display device by providing a color filter on the lower substrate.

【0102】

Since the schematic configuration of the liquid crystal display device of the present embodiment is the same as that of the first and second embodiments, illustration and description of the common configuration will be omitted. FIG. 17 is a sectional view corresponding to FIG. 7 (cross-sectional view taken along the line AA'of FIG. 6) of the first embodiment, and FIG. 18 is FIG. 8 (B- of FIG. 6) of the first embodiment. It is a cross-sectional view corresponding to (cross-sectional view along the B'line). In these drawings, the components common to those in FIGS. 7 and 8 are designated by the same reference numerals.

【0103】

In the liquid crystal display device 52 of the present embodiment, as shown in FIGS. 17 and 18, an insulating film 53 is formed over the entire display area so as to cover the signal electrode 6 of the lower substrate 2, and the insulating film 53 is covered with the insulating film 53. A color filter 54 is formed on the surface. The color filter 54 is a grid-like light-shielding material composed of a color material layer 55 of three colors of red (R), green (G), and blue (B) formed corresponding to each pixel, a metal film, a black resist, and the like. It is composed of a film 56 (black matrix). Then, the alignment film 35 is formed on the color filter 54. The electrode configurations of the signal electrode 6, the scanning electrode 7, and the like, the routing wiring 11 for the signal electrode, the routing wiring 13 for the scanning electrode, and the like are exactly the same as those in the first embodiment.

【0104】

In the liquid crystal display device of the present embodiment, since the color filter 54 is provided on the inner surface of the lower substrate 2, the size can be reduced by a narrow frame, and a color liquid crystal display device with high display quality can be realized. , It will be suitable for portable electronic devices and the like, which are expected to be further colored in the future. Further, in the present embodiment, the color filter is formed on the lower substrate side, but it may be formed on the upper substrate side, and the effect is not hindered at all.

【0105】

[Fourth Embodiment] Hereinafter, a fourth embodiment of the present invention will be described with reference to FIGS. 19 and 20.

【0106】

Similar to the first to third embodiments, the present embodiment is also an example in which the liquid crystal device of the present invention is applied to a passive matrix type liquid crystal display device. However, while the first to third embodiments are examples of the type of reflective liquid crystal display device having a reflective electrode, the liquid crystal display device of the present embodiment separates the reflective layer and the display electrode. This is an example of a reflective liquid crystal display device of the type provided in.

【0107】

Since the overall configuration of the liquid crystal display device of the present embodiment is the same as that of the first and second embodiments, illustration and description of the common configuration will be omitted. FIG. 19 is a sectional view corresponding to FIG. 7 (cross-sectional view taken along the line AA'of FIG. 6) of the first embodiment, and FIG. 20 is FIG. 8 (B- of FIG. 6) of the first embodiment. It is a cross-sectional view corresponding to (cross-sectional view along the B'line). In these drawings, the components common to those in FIGS. 7 and 8 are designated by the same reference numerals.

【0108】

In the liquid crystal display device 58 of the present embodiment, as shown in FIGS. 19 and 20, the light reflectance of aluminum, silver (or an alloy containing silver) or the like is high over the entire display area on the lower substrate 2. A reflective layer 59 made of a metal thin film is formed. An insulating film 60 is formed so as to cover the reflective layer 59, and a large number of signal electrodes 6 are formed in stripes on the insulating film 60. Since the signal electrode 6 is in a state of being directly formed on the lower substrate 2 outside the forming region of the insulating film 60 and the reflective layer 59, the connection structure of the through holes 17 and 38 is the first implementation. It is exactly the same as the form.

【0109】

Further, as shown in FIG. 21, the connection wiring 18 for the signal electrode is formed at the same time when the reflective layer 59 is formed, and at least the insulating film 60 is formed on the surface of the reflective layer 59 in the display region, and the insulating film 60 is formed on the insulating film 60. A large number of signal electrodes 6 may be formed in a striped shape, and the signal electrodes 6 may be stretched to be electrically conductive with the signal electrode connection wiring 18.

【0110】

In the case of the present embodiment, the signal electrode 6 does not also serve as a light reflecting layer, and the reflecting layer 59 is separately formed below the signal electrode 6. Therefore, at the time of display, the light incident from the outside of the upper substrate 3 and transmitted through the liquid crystal layer 28 is reflected on the surface of the reflection layer 59 so that the image is displayed, so that the light is positioned above the reflection layer 59. The signal electrode 6 to be used must be transparent. Therefore, in the present embodiment, the signal electrode 6 is formed of a transparent conductive film such as ITO, like the scanning electrode 7 of the upper substrate 3. Further, as in the first embodiment, as shown in FIG. 20, on the inner surface of the lower substrate 2, the vertical conductive portion 19 of the sealing material 27 portion and the hole connecting portion 20 of the through hole 38 portion are formed. The scanning electrode connection wiring 21 for electrically connecting the two is provided, and the scanning electrode connection wiring 21 is a metal such as aluminum or silver (or an alloy containing silver) which is the same material as the reflective layer 59. It may be formed of a film, or may be formed of a transparent conductive film such as ITO, which is the same material as the signal electrode 6. In any case, as long as the same material as the reflective layer 59 or the signal electrode 6 is used, the manufacturing process is not increased.

【0111】

On the other hand, on the outer surface side of the lower substrate 2, a signal electrode connection wiring 12, a scanning electrode connection wiring 14, a signal input wiring, and the like are provided, and the wiring of these wirings is the first embodiment. However, a low resistance metal material such as copper is used as the wiring material.

【0112】

Also in the liquid crystal display device 58 of the present embodiment, through holes 17 and 38 are provided on the lower substrate 2, and the routing wires 11 and 13 of the signal electrode 6 and the scanning electrode 7 are drawn to the outer surface side of the lower substrate 2. It is possible to obtain the same effect as that of the first to third embodiments that the frame can be narrowed by rotating and mounting the drive IC10.

【0113】

Further, in the case of the present embodiment, since the reflection layer 59 and the signal electrode 6 are provided separately, the characteristics required as the reflection layer and the characteristics required as the signal electrode can be considered separately, and in particular, the design of the signal electrode You can increase the degree of freedom of. Moreover, in the case of this embodiment, since a low resistance metal material such as copper is used for various connection wirings on the outer surface of the lower substrate 2, the manufacturing process becomes slightly complicated because it is different from the conductive layer material on the inner surface side. , The routing resistance can be reduced and the display quality can be improved.

【0114】

[Fifth Embodiment] Hereinafter, a fifth embodiment of the present invention will be described with reference to FIG. 22.

【0115】

In the first to fourth embodiments described above, an example of a passive matrix type liquid crystal display device is shown, but in the present embodiment, the present invention is an active matrix type reflective liquid crystal display device using a TFD as a switching element. An application example of is shown. FIG. 22 (a) is a perspective view showing the overall configuration of the liquid crystal display device of the present embodiment, and FIG. 22 (b) is an enlarged view of one pixel in FIG. 22 (a).

【0116】

As shown in FIG. 22A, the liquid crystal display device 61 of the present embodiment has two substrates, that is, an element substrate 62 (first substrate) on the side on which the TFD element is formed and a facing substrate 63 (first substrate). 2 substrates) are arranged to face each other, and a liquid crystal (not shown) is enclosed between these substrates. Although not shown, an alignment film is actually formed on the inner surface of each substrate in contact with the liquid crystal. A large number of data lines 64 (first conductive portion) are provided on the inner surface side of the element substrate 62, and a large number of pixel electrodes 65 are connected to each data line 64 via the TFD element 66. .. On the other hand, on the inner surface side of the facing substrate 63, a large number of strip-shaped scanning lines 67 (second conductive portions) are formed in a direction intersecting the data lines.

【0117】

Further, a data line connection wiring and a scanning line connection wiring (both not shown) are provided on the outer surface of the element substrate 62, and a data line drive circuit and a scanning line drive for driving the data line 64 and the scanning line 67, respectively. Circuits (all not shown) are formed.

【0118】

As shown in FIG. 22 (b), the TFD element 66 is an insulating film composed of, for example, a first conductive film 68 made of a tantalum film and a tantalum oxide film formed on the surface of the first conductive film 68 by anodization. It is composed of 69 and a second conductive film 70 made of a metal film such as chromium, aluminum, titanium, and molybdenum formed on the surface of the insulating film 69. Then, the first conductive film 68 of the TFD element 66 is connected to the data line 64, and the second conductive film 70 is connected to the pixel electrode 65. In the case of the present embodiment, the pixel electrode 65 is a reflective electrode that also serves as a light reflecting layer, and is formed of a metal thin film having a high light reflectance such as aluminum. Alternatively, as in the fourth embodiment, the pixel electrode 65 may be formed of a transparent conductive film such as ITO, and a reflective layer may be separately formed below the pixel electrode 65. On the other hand, the scanning line 67 on the inner surface of the facing substrate 63 is formed of a transparent conductive film such as ITO.

【0119】

In the case of the liquid crystal display device 61 of the present embodiment, one end of each data line 64 on the inner surface of the element substrate 62 is formed in a rectangular shape, and a through hole penetrating the inner surface side and the outer surface side of the element substrate 62 is formed in this portion. 71 is formed. The cross-sectional structure is the same as that in FIGS. 7 and 8 of the first embodiment in which the signal electrode 6 is replaced with the data line 64 of the present embodiment.

【0120】

That is, while the data line 64 is formed on the inner surface of the element substrate 62, the connection wiring for the data line is formed on the outer surface of the element substrate 62, and the through hole 71 penetrating the substrate is formed at the tip of both wirings. It is formed. The inside of the through hole 71 is filled with a conductive material such as silver paste, and this conductive material constitutes an in-hole connection portion by connecting the data line on the inner surface side and the connection wiring for the data line on the outer surface side. To do. A drive IC is connected to the other end of the data line connection wiring. By adopting the wiring structure as described above, the image signal output from the drive IC is supplied to each data line 64 via the data line connection wiring on the outer surface of the element board 62 and the in-hole connection portion. To. That is, the data line connection wiring and the in-hole connection portion on the outer surface of the element substrate 62 constitute the data line routing wiring.

【0121】

On the other hand, on the scanning line 67 side of the facing substrate 63, the scanning line 67 is formed so as to be in contact with the upper surface of the sealing material. A conductive material such as metal particles is mixed in the sealing material, and the upper surface and the lower surface of the sealing material are electrically connected to form a vertical conductive portion. Lands and through holes are formed in the portion corresponding to the lower part of the vertical conductive portion of the element substrate 62, and the inside of the through holes is filled with a conductive material such as silver paste, and this conductive material constitutes the intra-hole connection portion. , The connection wiring for the scanning line on the inner surface side and the outer surface side is electrically connected. Further, a drive IC is connected to the other end of the scanning line connection wiring on the outer surface of the element substrate. By adopting the wiring structure as described above, the scanning signal output from the drive IC passes through the scanning line connection wiring on the outer surface of the element substrate 62, the in-hole connection portion, and the vertical conduction portion, and the opposite substrate 63. It is supplied to each scan line 67 above. That is, the scanning line connection wiring, the in-hole connection portion, and the vertical conductive portion on the outer surface of the element substrate 62 constitute the scanning line routing wiring.

【0122】

This embodiment is an example of an active matrix type liquid crystal display device using a TFD element, but in this case as well, the same effect as the example of the passive matrix type liquid crystal display device of the first to fourth embodiments is obtained. be able to. That is, the space for arranging the routing wiring outside the display area on the inner surface of the element board 62 is not required, and the area for forming the data line drive circuit, scanning line drive circuit, etc. required for the TFD active matrix type liquid crystal display device is formed on the element board. Since it can be placed on the outer surface side of 62, it is possible to significantly narrow the frame. Further, since the entire outer surface side of the element substrate 62 can be used as a space for routing and wiring, a sufficient wiring pitch can be secured and the routing resistance does not increase.

【0123】

[Sixth Embodiment] Hereinafter, the sixth embodiment of the present invention will be described with reference to FIG. 23.

【0124】

In this embodiment, an example of application of the present invention to an active matrix type reflective liquid crystal display device using a TFT as a switching element is shown. FIG. 23 (a) is a perspective view showing the overall configuration of the liquid crystal display device of the present embodiment, and FIG. 23 (b) is an enlarged view of one pixel in FIG. 23 (a).

【0125】

As shown in FIG. 23 (a), the liquid crystal display device 73 of the present embodiment has substantially the same configuration as that of the fifth embodiment of the TFD type liquid crystal display device. That is, the element substrate 74 (first substrate) and the opposing substrate 75 (second substrate) on the side on which the TFT element is formed are arranged to face each other, and a liquid crystal (not shown) is enclosed between these substrates. On the inner surface side of the element substrate 74, a large number of source lines 76 (data line, first conductive part) and a large number of gate lines 77 (scanning line, first conductive part) are provided in a grid pattern so as to intersect each other. Has been done. A TFT element 78 is formed in the vicinity of the intersection of each source line 76 and each gate line 77, and a pixel electrode 79 is connected via each TFT element 78. On the other hand, a common electrode 80 (second conductive portion) is formed on the entire inner surface side of the facing substrate 75 corresponding to the display region.

【0126】

Further, a connection wiring for a source line and a connection wiring for a gate line (both are not shown) are provided on the outer surface of the element substrate 74, and a source line drive circuit and a gate line drive circuit for driving the source line 76 and the gate line 77, respectively. (Both are not shown) are formed respectively.

【0127】

As shown in FIG. 23 (b), the TFT element 78 includes a gate electrode 81 extending from the gate wire 77, an insulating film (not shown) covering the gate electrode 81, and a polycrystalline silicon or amorphous material formed on the insulating film. It has a semiconductor layer 82 made of silicon or the like, a source electrode 83 extending from a source wire 76 connected to a source region in the semiconductor layer 82, and a drain electrode 84 connected to a drain region in the semiconductor layer 82. .. Then, the drain electrode 84 of the TFT element 78 is connected to the pixel electrode 79. In the case of the present embodiment as well, as in the fifth embodiment, the pixel electrode 79 is a reflective electrode that also serves as a light reflecting layer, and is formed of a metal thin film having a high light reflectance such as aluminum. Alternatively, as in the fourth embodiment, the pixel electrode 79 may be formed of a transparent conductive film such as ITO, and a reflective layer may be separately formed below the pixel electrode 79. On the other hand, the common electrode 80 on the facing substrate 75 side is formed of a transparent conductive film such as ITO.

【0128】

In the case of the liquid crystal display device 73 of the present embodiment, one end of each source line 76 on the inner surface of the element substrate 74 is formed in a rectangular shape, and a through hole penetrating the inner surface side and the outer surface side of the element substrate 74 is formed in this portion. 85 is formed. Similarly, one end of each gate wire 77 is also formed in a rectangular shape, and through holes 86 penetrating the inner surface side and the outer surface side of the element substrate 74 are formed in this portion. The cross-sectional structure of the through holes 85 and 86 is similar to that in FIGS. 7 and 8 of the first embodiment in which the signal electrode 6 is replaced with the source wire 76 or the gate wire 77 of the present embodiment. ..

【0129】

That is, while the source wire 76 is formed on the inner surface of the element substrate 74, the connection wiring for the source wire is formed on the outer surface of the element substrate 74, and a through hole 85 penetrating the substrate is formed at the tip of both wirings. It is formed. The inside of the through hole 85 is filled with a conductive material such as silver paste, and this conductive material connects the source wire 76 on the inner surface side and the connection wiring for the source wire on the outer surface side to form an in-hole connection portion. Configure. A drive IC is connected to the other end of the source wire connection wiring. By adopting the wiring structure as described above, the image signal output from the drive IC is supplied to each source line 76 via the source line connection wiring on the outer surface of the element substrate 74 and the in-hole connection portion. To. Therefore, the connection wiring for the source line and the connection portion in the hole on the outer surface of the element substrate 74 form the routing wiring for the source line.

【0130】

The same wiring structure is adopted on the gate wire side, and the scanning signal output from the drive IC is sent to each gate wire 77 via the gate wire connection wiring on the outer surface of the element substrate 74 and the in-hole connection portion. Be supplied. Therefore, the connection wiring for the gate wire and the connection portion in the hole on the outer surface of the element substrate 74 form the routing wiring for the gate wire.

【0131】

On the other hand, the common electrode 80 of the facing substrate 75 is formed so that a part of the common electrode 80 is in contact with the upper surface of the sealing material. A conductive material such as metal particles is mixed in the sealing material, and the upper surface and the lower surface of the sealing material are electrically connected to form a vertical conductive portion. Lands and through holes are formed in the lower part of the upper and lower conductive portions of the element substrate 74, and the inside of the through holes is filled with a conductive material such as silver paste, and this conductive material constitutes the intra-hole connection portion. , The connection wiring for the common electrode on the inner surface side and the outer surface side is electrically connected. The connection wiring for the common electrode is grounded at an arbitrary location on the outer surface side of the element substrate 74.

【0132】

This embodiment is an example of an active matrix type liquid crystal display device using a TFT element, but in this case as well, the same effect as the example of the active matrix type liquid crystal display device of the fifth embodiment can be obtained. .. That is, the space for arranging the routing wiring outside the display area on the inner surface of the element substrate 74 is not required, and the drive circuit forming area such as the source line drive circuit and the gate line drive circuit required for the TFT active matrix type liquid crystal display device is provided. Since it can be arranged on the outer surface side of the element substrate 74, a significantly narrower frame can be achieved. Further, since the entire outer surface side of the element substrate 74 can be used as a space for routing and wiring, a sufficient wiring pitch can be secured and the routing resistance does not increase.

【0133】

[Electronic device] An example of an electronic device provided with the liquid crystal display device of the above embodiment will be described. FIG. 24 is a perspective view showing an example of a mobile phone. In FIG. 24, reference numeral 1000 indicates a mobile phone main body, and reference numeral 1001 indicates a liquid crystal display unit using the above liquid crystal display device.

【0134】

FIG. 25 is a perspective view showing an example of a wristwatch-type electronic device. In FIG. 25, reference numeral 1100 indicates a watch body, and reference numeral 1101 indicates a liquid crystal display unit using the above liquid crystal display device.

【0135】

FIG. 26 is a perspective view showing an example of a portable information processing device such as a word processor and a personal computer. In FIG. 26, reference numeral 1200 indicates an information processing device, reference numeral 1202 indicates an input unit such as a keyboard, reference numeral 1204 indicates an information processing apparatus main body, and reference numeral 1206 indicates a liquid crystal display unit using the above liquid crystal display device.

【0136】

Since the electronic devices shown in FIGS. 24 to 26 include a liquid crystal display unit using the liquid crystal display device of the above embodiment, the entire device is small due to the small liquid crystal panel provided by the narrowed frame. It is possible to realize an electronic device having a relatively wide display area and excellent portability.

【0137】

The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the first and second embodiments, a passive matrix type liquid crystal display device having a reflective electrode has a different through-hole formation position, and in the third embodiment, an example of a liquid crystal display device provided with a color filter. In the fourth embodiment, an example of a liquid crystal display device having a reflective layer and a display electrode separately, in the fifth embodiment, an example of a TFD active matrix type liquid crystal display device, and in the sixth embodiment, a TFT active matrix type liquid crystal. Although examples of the display device have been described, the feature points of these embodiments may be combined as appropriate.

【0138】

In addition, it goes without saying that the specific description of the constituent materials, shapes, manufacturing methods, etc. of each liquid crystal display device exemplified in the above embodiment can be changed as appropriate. Further, the liquid crystal device of the present invention can be applied not only to a direct-view type but also to a liquid crystal light bulb of a projection type liquid crystal device (projector).

【0139】

[Effect of the invention]

As described in detail above, according to the configuration of the liquid crystal apparatus of the present invention, the routing area and the mounting area for FPCs, electronic components, etc., which have been conventionally provided outside the display area on the inner surface of the substrate, are not required. The frame portion can be significantly narrowed as compared with the conventional case. In addition, the routing conductive portion can be laid out over the entire outer surface side of the first substrate including the display area, and the pitch between the routing conductive portions can be designed with a margin, and the routing resistance is reduced. There is no problem of increase. Further, the degree of freedom in selecting the substrate material is improved, and at the same time, one substrate also functions as a mounting substrate for the drive circuit, so that the number of connecting parts can be reduced. As described above, by providing the small liquid crystal device with a narrow frame, it is possible to realize an electronic device having a wide display area and excellent portability in spite of the small size of the whole device.

[Simple explanation of drawings]

[Figure 1]

It is a perspective view which looked at the whole liquid crystal display device of 1st Embodiment of this invention from the top surface side.

[Figure 2]

The same is a perspective view of the liquid crystal display device as viewed from the bottom surface side.

[Fig. 3]

It is a top view (electrode forming surface) of the lower substrate constituting the liquid crystal display device.

[Fig. 4]

It is the bottom view of the lower substrate.

[Fig. 5]

The same is a lower surface (electrode forming surface) view of the upper substrate constituting the liquid crystal display device.

[Fig. 6]

The same is a perspective view showing a state in which the upper substrate and the lower substrate are overlapped with each other.

[Fig. 7]

It is a figure which shows the cross-sectional structure of the liquid crystal display device, and is the cross-sectional view along the line AA'in FIG.

[Fig. 8]

The same is a cross-sectional view taken along the line B-B'of FIG.

[Fig. 9]

It is sectional drawing which shows the other example of the vertical conduction part of the liquid crystal display device.

[Fig. 10]

It is sectional drawing which shows the other example of the mounting form of the drive IC of the liquid crystal display device.

[Fig. 11]

It is a figure which shows the example of the connection part in a hole of the lower substrate.

[Fig. 12]

It is a figure which shows another example of the connection part in a hole.

[Fig. 13]

It is a figure which shows still another example of the connection part in a hole.

[Fig. 14]

It is a perspective view which shows the state which superposed the upper substrate and the lower substrate in the liquid crystal display device of the 2nd Embodiment of this invention.

[Fig. 15]

It is a figure which shows the cross-sectional structure of the liquid crystal display device, and is the cross-sectional view along the line AA'in FIG.

[Fig. 16]

The same is a cross-sectional view taken along the line B-B'of FIG.

[Fig. 17]

It is a figure which shows the cross-sectional structure of the liquid crystal display device of the 3rd Embodiment of this invention, and is the cross-sectional view corresponding to the line AA'in FIG.

[Fig. 18]

It is a figure which shows the cross-sectional structure of the liquid crystal display device, and is the cross-sectional view corresponding to the line B-B'of FIG.

[Fig. 19]

It is a figure which shows the cross-sectional structure of the liquid crystal display device of 4th Embodiment of this invention, and is the cross-sectional view corresponding to the line AA'in FIG.

[Fig. 20]

It is a figure which shows the cross-sectional structure of the liquid crystal display device, and is the cross-sectional view corresponding to the line B-B'of FIG.

[Fig. 21]

In the same embodiment, it is a cross-sectional view corresponding to the line AA'in FIG. 6 showing another example of the connection structure of the signal electrode and the connection wiring for the signal electrode.

[Fig. 22]

It is a figure which shows the liquid crystal display device of the 5th Embodiment of this invention, (a) is the perspective view which looked at the whole from the top surface side, (b) is the enlarged view of one pixel.

[Fig. 23]

It is a figure which shows the liquid crystal display device of the 6th Embodiment of this invention, is (a) the perspective view which looked at the whole from the top surface side, (b) is the enlarged view of one pixel.

[Fig. 24]

It is a perspective view which shows an example of the electronic device of this invention.

[Fig. 25]

It is a perspective view which shows the other example of the electronic device of this invention.

[Fig. 26]

It is a perspective view which shows still another example of the electronic device of this invention.

[Fig. 27]

It is a perspective view which shows an example of the conventional liquid crystal apparatus to which COF mounting was applied.

[Fig. 28]

It is a perspective view which shows an example of the conventional liquid crystal apparatus to which COG mounting was applied.

[Fig. 29]

It is a top view which shows the structure of the upper substrate in the conventional passive matrix type liquid crystal apparatus.

[Fig. 30]

It is a plan view which shows the structure of the lower substrate.

[Explanation of symbols]

1,50,52,58,61,73 Liquid crystal display device (liquid crystal device) 2 Lower board (first board) 3 Upper board (second board) 5 Polarizing plate (polarizing means) 6 Signal electrode (first conductive part) 7 Scanning electrode (second conductive part) 10,32 Drive IC (electronic component) 11 Routing wiring for signal electrodes (first routing conductive part) 12 Connection wiring for signal electrodes (first connection on the outer surface) 13 Routing wiring for scanning electrode (second routing conductive part) 14 Connection wiring for scanning electrode (second outer surface connection part) 15,30,44,46 In-hole connection (first in-hole connection) 17,38 Through hole 18 Connection wiring for signal electrodes 19,40 Vertical conduction part (connection part between boards) 20 In-hole connection (second in-hole connection) 21 Connection wiring for scanning electrode (second inner surface connection part) 26 External connection terminal 27 Sealing material 28 Liquid crystal layer 42 Internal conductive layer 43,45 beer hall 54 color filter 59 Reflective layer 62,74 Element board (first board) 63,75 Opposed board (second board) 64 Data line (first conductive part) 66 TFD element 67 Scanning line (second conductive part) 76 Source line (data line, first conductive part) 77 Gate line (scanning line, first conductive part) 78 TFT element 80 Common electrode (second conductive part)