Stage device

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Technical field to which the invention belongs]

The present invention is a device for sequentially aligning each exposure region on a substrate at a predetermined exposure position and exposing each exposure region, particularly a circuit on a reticle surface when manufacturing a semiconductor element such as an IC or an LSI. In a step-and-repeat type exposure apparatus that projects and exposes a pattern onto a wafer surface via a projection optical system, position or position errors related to several shot regions on the semiconductor wafer are measured, and each of these is measured on the wafer. The shot arrangement of the shot region can be determined, and this determined shot arrangement can be used for alignment to sequentially align each shot region on the wafer to the position related to the reticle. The present invention relates to a stage device that can be used in a device such as a measuring machine that requires high-precision position control.

【0002】

[Conventional technology]

Such a stage device generally has a structure for recovering heat generated by a drive motor by circulating a refrigerant maintained at a constant temperature to a motor unit which is a heat source, but completely generates heat from the motor. It is structurally very difficult to block. That is, the structure is such that almost constant heat is recovered regardless of whether the amount of heat generated by the motor is large or small. Therefore, when the amount of heat generated from the motor is large, the amount of heat generated from the motor is larger than the amount of heat recovered by the refrigerant, so that the temperature on the stage table becomes high due to the electric heat from the motor.

【0003】

On the other hand, in order to stabilize the environment of the stage, temperature-controlled air is flowed from a certain direction into the space around the stage. Therefore, when the temperature on the stage table becomes high, a temperature difference occurs between the leeward side and the leeward side. This temperature difference causes a difference in thermal expansion on the table, causing distortion. When distortion occurs on the table, the posture of the reference mirror mounted on the table changes, and the coordinate shape of the stage configured by the mirror reference changes. As a result, a wafer alignment error occurs.

【0004】

As a countermeasure, monitor the calorific value of the motor, calculate the calorific value from the drive history of the motor, change the refrigerant temperature of the heat exchanger for heat recovery according to the calorific value, and keep the temperature of the stage table as high as possible. I try to keep it constant. Further, as described in Japanese Patent Application Laid-Open No. 1-195389, in a stage device such as a precision moving table using a linear motor, the temperature of the linear motor is detected by using a temperature detecting means, and the base and the linear motor The cooling means is controlled so that the temperature difference is eliminated.

【0005】

[Problems to be Solved by the Invention]

However, according to the conventional technique of changing the refrigerant temperature based on the monitoring result of the calorific value of the motor and the calculation result based on the drive history, there is a time difference between changing the temperature setting of the refrigerant and the actual cooling effect. Therefore, there is a problem that it is difficult to keep the temperature change on the table constant even if it can be suppressed to some extent.

【0006】

Further, according to the prior art described in the above publication, the feedback control is used in which the temperature detecting means detects the temperature rise of the linear motor due to the drive of the stage and then the cooling means is controlled based on the temperature detecting means. It takes a certain response time from when the temperature of the linear motor rises to when it falls. Therefore, there is a problem that the table is deformed by thermal stress due to the temperature change during that period, and the member that is the accuracy reference of the table is deformed, so that more high-precision control cannot be performed. In addition, it is difficult to attach a temperature detecting means such as a thermistor to a linear motor, a table, or the like, which causes an increase in cost. Further, there is a problem that the wiring process for attaching them to the moving body is difficult.

【0007】

In view of such problems of the prior art, an object of the present invention is to enable the stage apparatus to maintain a constant temperature on the stage regardless of fluctuations in the drive load and without using temperature detecting means. It is in.

【0008】

[Means for solving problems]

In order to achieve this object, the first stage device of the present invention controls a drive motor for driving the stage, heat recovery means for recovering heat generated by the drive motor, and heat recovery amount by the heat recovery means. In a stage device provided with a control means, the control means controls the heat recovery amount based on a drive pattern previously defined for the drive of the stage in order to control the drive of the stage. It is a feature.

【0009】

In this configuration, the drive pattern defines the drive of the stage in order to control the drive of the stage, and is obtained before driving the stage based on the drive pattern. Therefore, based on this drive pattern, the heat generated by the drive motor is generated. The situation will be obtained in advance. Based on this, the amount of heat recovery is accurately controlled in consideration of the heat transfer time, and the temperature of the stage is kept constant.

【0010】

Further, the second stage device of the present invention includes a drive motor for driving the stage, a heat recovery means for recovering the heat generated by the drive motor, and a control means for controlling the amount of heat recovery by the heat recovery means. In the provided stage device, the control means controls the heat recovery amount by changing the heat recovery amount based on the drive state detected at predetermined time intervals of the stage. To do.

【0011】

In this configuration, the heat recovery amount is immediately changed based on the detected driving state at the predetermined time intervals. Therefore, by appropriately setting the predetermined time, the heat recovery amount can be accurately controlled without causing a delay, and the temperature of the stage can be kept constant.

【0012】

The third stage device of the present invention includes a drive motor for driving the stage, heat recovery means for recovering heat generated by the drive motor, and control means for controlling the amount of heat recovery by the heat recovery means. In the stage device, the control means calculates the heat generation amount of the drive motor based on the drive information which is the information related to the drive for each drive of the stage, and further integrates the heat generation amount at predetermined time intervals. The heat recovery amount is controlled by changing the heat recovery amount based on the integrated value.

【0013】

In this configuration, the calorific value for each drive of the stage is integrated at predetermined time intervals, and the heat recovery amount is immediately changed based on this. Therefore, by appropriately setting the predetermined time, the heat recovery amount can be accurately controlled without causing a delay, and the temperature of the stage can be kept constant.

【0014】

BEST MODE FOR CARRYING OUT THE INVENTION

In a preferred embodiment of the first stage apparatus of the present invention, the drive pattern defines the drive position of the stage, acceleration during acceleration / deceleration, or maximum speed. Further, the stage device is used for step movement in an exposure device that exposes each exposure region on the substrate while sequentially stepping the substrate according to a given exposure layout, and the control means is exposure. The drive pattern is obtained based on the layout. Further, the control means obtains the heat generation pattern of the drive motor based on this drive pattern, obtains the operation pattern of the heat recovery means based on this, and controls the drive of the stage based on this. Further, the control means generates a heat generation pattern of the drive motor based on the amount of current flowing through the drive motor obtained based on the drive pattern, the acceleration time per predetermined time of the stage, or the drive amount per predetermined time of the stage. Is what you want.

【0015】

In this configuration, the drive pattern of the stage is read in advance from the job layout information and the number of wafers, and the heat generation amount of the drive motor is predicted from the information, and based on this, the heat is recovered at the same time as or prior to the drive of the stage. The amount can be changed. As a result, the temperature change on the stage becomes very small. As a result, the change in coordinates on the stage becomes small, and high-precision alignment is always performed.

【0016】

In a preferred embodiment of the second stage apparatus of the present invention, the control means changes the heat recovery amount based on the moving distance of the stage at predetermined time intervals. That is, for each predetermined time, it is determined whether or not the movement distance of the stage for each predetermined time is equal to or greater than a predetermined maximum value and equal to or less than a predetermined minimum value, and the value is equal to or greater than the predetermined maximum value. If there is, the heat recovery amount is lowered by a predetermined value, and if it is less than a predetermined minimum value, the heat recovery amount is increased by a predetermined value. Alternatively, the control means calculates the amount of heat generated by the drive motor based on the current passed through the drive motor at the predetermined time intervals, and changes the amount of heat recovery based on the amount of heat generated.

【0017】

In a preferred embodiment of the third stage apparatus of the present invention, the drive information is the amount of current flowing through the drive motor per predetermined time, the acceleration time per predetermined time of the stage, or the drive amount per predetermined time of the stage. .. The heat recovery amount has an upper limit and a lower limit, and the control means controls the heat recovery amount so that the heat recovery amount does not exceed the upper limit or the lower limit.

【0018】

In any of the first to third stage devices, the control means measures the heat recovery amount so that the temperature change of the stage and the drive motor becomes as small as possible, that is, the heat generation amount and the heat recovery amount by the drive motor become equal. Control. Further, as the heat recovery means, one that recovers heat with a refrigerant can be used, and in that case, the control means controls the amount of heat recovery by controlling the temperature of the refrigerant. Further, as the drive motor, a linear motor having a stator having a coil or a magnet and a mover having a coil or a magnet moving linearly along the stator can be used. Further, the control means controls the amount of heat recovery in consideration of the difference between the heat transfer path for heat recovery by the heat recovery means and the heat transfer path for heat generated by the drive motor.

【0019】

[Example]

[First Example] FIG. 1 is a perspective view showing a wafer stage of the semiconductor exposure apparatus according to the first embodiment of the present invention. As shown in the figure, this stage device includes an X linear motor 3 and Y linear motors 6a and 6b that drive the fine movement stage 2 and the Y sliders 4a and 4b constituting the X stage in the X-axis direction and the Y-axis direction, respectively. Also provided are a heat recovery means (not shown) for recovering the heat generated by the X linear motor 3 and a control means for controlling the amount of heat recovered by the heat recovery means.

【0020】

The wafer 1 to which the photosensitizer is applied and exposed is placed on the stage table via the wafer holder. The wafer table can be driven in the optical axis direction (Z-axis direction) of the projection lens and in the rotation direction centered on the optical axis by a fine movement mechanism (not shown) of the fine movement stage 2. Two orthogonal bar mirrors for laser interferometers (not shown) are mounted on the wafer table, and the wafer table is XY and XY and Y-axis interferometers for X-axis and Y-axis measurement and rotation measurement parallel to the X-axis. Positioning in the direction of rotation is done. The laser interferometer has a problem that the measured value changes when the refractive index in the air changes due to a temperature change. Therefore, it is necessary to keep the stage space around the stage device at a constant temperature at all times, and the temperature-controlled air is always passed through the optical path of the interferometer. Therefore, when the wafer holder does not have a heat source, the wafer table can be kept in a state where there is no temperature unevenness as long as the temperature is substantially the same as the temperature of the air flowing in the stage space.

【0021】

The heat recovery means circulates a liquid adjusted to the temperature set by the heat exchanger (hereinafter referred to as a motor coolant) in the housing of the X linear motor 3 or further in the housings of the Y linear motors 6a and 6b. Has a structure. Most of the heat generated from the coil of the X linear motor 3 is released by the motor coolant circulated through the housing. When the stage device is stopped, there is almost no heat generated from the X linear motor 3, so the temperature of the motor coolant flowing inside the housing of the X linear motor 3 is almost the same as the temperature of the air flowing in the stage space. By setting the temperature to, the temperature of the wafer holder can be kept substantially the same as the temperature of the air in the stage space. However, when the acceleration and deceleration of the X stage are repeated, a large amount of current flows through the coil of the X linear motor 3, and the heat generated from the coil cannot be completely discharged by the motor coolant, which is part of the heat generation. Is emitted from the coil surface. In the structure of this embodiment, heat generated from the coil surface of the X linear motor 3 in particular warms the wafer holder via the X stage. On the other hand, if the temperature of the motor coolant is set lower than the temperature of the stage space, the wafer holder accustomed to the temperature of the stage space loses heat through the X stage, so heat is generated from the motor. Without, the temperature of the wafer holder will be lower than the temperature of the stage space. However, when the X linear motor 3 generates heat, the wafer holder is warmed as described above. Therefore, if the amount of heat supplied by the heat generated by the X linear motor 3 and the amount of heat taken away by the motor coolant can be successfully canceled, the temperature of the wafer holder can be kept constant at all times.

【0022】

One method of calculating the amount of heat generated from the X linear motor 3 is to calculate the amount of current of the X linear motor 3 per unit time by measuring the current directly input to the coil. There is. Alternatively, when the difference in driving force depending on the position of the wafer table is small and the driving pattern such as acceleration and maximum speed during acceleration / deceleration is predetermined, the driving amount is monitored to obtain X linear. It is also possible to estimate the amount of heat generated from the motor 3.

【0023】

For example, consider the case where the wafer table is triangularly driven as shown in FIG. Assuming that the acceleration during acceleration / deceleration is α and β, the drive distance is X, the acceleration / deceleration time during acceleration / deceleration is ta and tb, and the maximum speed is V, the current flowing through the X linear motor 3 is proportional to the acceleration. Since the integrated value of the square of the thermal energy, that is, the current corresponds to the integrated value of the square of the acceleration, the parameter P related to the thermal energy is as follows in the drive of FIG.

【0024】

P = (acceleration)²dt = α²ta + β²tb In addition, the following equation holds. X = (α²ta + β²tb) / 2 V = αta = βtb Therefore, the following equation holds. P = α²ta + β²tb = (α²+ αβ) ta = (2β (α)²+ αβ)))^1/2 X^1/2 【0025】

Therefore, the parameter P is proportional to the square root of the drive distance X. In addition, the coefficient changes depending on the acceleration / deceleration. Therefore, the square root of the driving distance can be monitored, and the parameter P can be calculated from the acceleration / deceleration at that time.

【0026】

On the other hand, it is well known that the amount of heat taken from an object is proportional to the temperature difference between the objects. Therefore, the cancellation of the supplied heat amount can be achieved by changing the set temperature of the motor coolant at any time according to the calorific value.

【0027】

In the semiconductor exposure apparatus, for the wafer coated with the photosensitive material, the wafer pattern is first monitored with an alignment microscope to align the wafer, and then each shot is sequentially sent under the projection lens to expose the reticle image. Then, after the final shot is exposed, the wafer is replaced. These operations are controlled by the control device. Therefore, at that time, the square root of the drive distance for each drive of the wafer table is monitored, and the amount of heat generated by the motor is calculated. Then, the heat generation of the motor can be canceled by obtaining the integrated value of the calorific value at regular time intervals and determining the set temperature value of the motor coolant from the integrated value according to a preset table. However, in this method, since the set temperature of the coolant is changed after the heat generation of the motor is found, the cooling control is inevitably delayed, and the temperature tends to be kept constant only within a certain range. ..

【0028】

Therefore, in this embodiment, since the drive pattern of the wafer table is determined when the job layout is determined, the heat generation amount is not calculated after the drive is completed, but as shown in FIG. 3, the wafer table Prior to driving, the amount of heat generated is calculated in advance based on the driving pattern of the stage. FIG. 3 is a flowchart showing processing in the control means of the stage device of FIG. As shown in the figure, when the job is started, the control means first calculates the drive pattern of the wafer table based on the layout information of the job to be used in advance (step S1). Next, based on this drive pattern, the control pattern of the set temperature of the coolant to be set is obtained from the integrated value of the expected calorific value at regular time intervals (step S2). Then, almost at the same time as actually starting the driving of the wafer table (step S3), the control of the set temperature of the coolant is started (step S5). As a result, the temperature control can be made more stable. Therefore, highly accurate alignment can be expected by accurate temperature control.

【0029】

Even if the acceleration / deceleration of the wafer table differs depending on the purpose, if the value is determined in advance, the set temperature of the coolant can be calculated in consideration of the value. If the value has not been determined, or if the expected acceleration or drive distance is slightly different from the actual value, the wafer table control information is constantly monitored separately from the forecast, and based on that, the predicted cooling is performed sequentially. The set temperature of the liquid may be corrected. For example, the driving amount of the wafer table is integrated (step S4), the driving amount is compared with the driving pattern (step S6), the temperature of the coolant is reset based on the comparison result (step S7), and the integrated value is obtained. (Step S7) should be reset.

【0030】

[Second Example] FIG. 4 is a schematic block diagram showing a configuration of a precision moving table according to a second embodiment of the present invention. In the figure, 101 is a moving body, 102 is a linear motor mover coupled to the stage 101, 103 is a linear motor stator, and 104 is a drive control for driving a linear motor to move the stage 101 precisely. A unit, 105 is a drive command unit that sets how to drive the stage 101, 106 is a refrigerant that cools a linear motor, 107 is a temperature control unit that controls the temperature of the refrigerant 106, and 108 is a target temperature of the refrigerant 106. This is the target temperature setting unit to be set.

【0031】

Figure 5 shows the appearance of this precision moving table. As shown in the figure, this precision moving table is mounted so as to straddle the base 508, two parallel guides 507 arranged so as to face each other along both ends on the upper surface of the base 508, and both guides 507. It is equipped with a Y stage 502 and an X stage 501 mounted on the Y stage 502. The Y stage 502 is horizontally supported by a guide 507 via an air bearing and vertically also supported on a base 508 via an air bearing and can slide linearly along the guide 507. Is. The X stage 501 is horizontally supported by the Y stage 502 via air bearings and vertically supported on the base 508 via air bearings. The X stage 501 slides on the Y stage 502 in a direction perpendicular to the moving direction of the Y stage 502. 503 is a hydrostatic fluid bearing (air bearing) mounting plate for the X stage 501, and 504 is a hydrostatic fluid bearing mounting plate for the Y stage 502. A table for holding objects to be precisely moved is provided on the X stage 501.

【0032】

The linear motor 505, which is the driving means of the X stage 501, is mounted inside the Y stage 502. The two linear motors 506, which are the driving means of the Y stage 502, are mounted on the outside of the two guides 507, respectively. The linear motors 505 and 506 are composed of a stator 533 and a mover 532 that slides on the stator 533, respectively. A refrigerant passage for cooling is formed in the stator 533, and a flexible tube 522 for inflow of refrigerant is connected to this refrigerant passage.

【0033】

FIG. 6 shows the configuration of the linear motors 505 and 506. As shown in the figure, these linear motors have permanent magnets 37 arranged to face each other, and these are attached to upper and lower yokes 12 which are magnetic flux passages. The upper and lower yokes 12 are connected to each other via a spacer 13 to form a box-shaped mover 532. The coil 11 of the linear motor is fixed between the two coil support members 10. The two coil support members 10 are connected by a connecting member 15 to form a stator 533. Since the stator coil 11 is arranged in the magnetic field formed by the box-shaped mover, thrust can be generated by energizing the coil 11. The coil support member 10 is provided with a refrigerant passage 16 through which a cooling refrigerant flows. The cooling means shown in FIG. 6 is provided with a refrigerant passage in the support member supporting the coil, but the cooling means is not limited to this, and the heat of the coil is heated by immersing both sides of the coil in the refrigerant using a cooling jacket. May be collected.

【0034】

The stator 533 corresponds to the linear motor stator 103 of FIG. 4, and the mover 532 corresponds to the linear motor mover 102 of FIG.

【0035】

Next, the operation of the device will be described with reference to FIG. When the drive command unit 105 creates a drive profile of the stage 101 and gives a drive command to the drive control unit 104 and the target temperature setting unit 108, the drive control unit 104 sends a current to the linear motor according to the given drive command. Precisely drive stage 101. At this time, Joule heat is generated by the current flowing through the coil of the linear motor. However, when the precision moving table is like a wafer stage of a stepper, the temperature is stable because almost no current flows through the coil of the linear motor when the device is not operating, but the device is operating. When this starts, a current flows through the coil of the linear motor to generate heat, so the temperature of the linear motor suddenly rises repeatedly. Therefore, if the temperature setting of the refrigerant is constant, the temperature of the table will change significantly. Therefore, in this embodiment, the target temperature setting unit 108 changes the target temperature to the temperature control unit 107 according to the flowchart shown in FIG.

【0036】

That is, the target temperature setting unit 108 calculates the movement distance of the stage 101 based on the drive command value given to the drive control unit 104 by the drive command unit 105 after clearing the movement integration value L of the stage 101 to zero (step 400). Then, for a certain period of time S, the moving distance of the stage 101 is integrated into L (step 401). After a certain period of time S has elapsed, the moving integrated value L is compared with the reference value M (step 402), and if L> M, the set temperature T to the temperature control unit 107 is lowered by T1 (step 403). Also, the moving integrated value L is compared with the reference value N (step 404), and if L <N, the set temperature T is raised by T2 (step 405). Next, limits are applied by TA and TB so that the set temperature T does not exceed the range of the minimum value TA or the maximum value TB (step 406). This prevents the set temperature T from being raised and lowered too much. In this way, the target temperature setting unit 108 repeats the operation of changing the set temperature T according to the movement integrated value L at regular intervals S for a certain period of time.

【0037】

FIG. 8 is a diagram for explaining the change in the set temperature T of the refrigerant due to such processing and the temperature change in the table due to the change. FIG. (A) is a graph showing the temporal change of the travel distance integrated value L of the stage 101. FIG. 3B is a graph showing the temporal change of the set temperature T of the refrigerant. FIG. 3C is a graph showing the temporal change of the temperature of the table. The time axes in these three graphs match.

【0038】

As shown in Fig. (A), when the integrated value L for each fixed time S exceeds the reference value M, the set temperature T is lowered by T1 as shown in Fig. (B). The set temperature T continues to decrease by T1 while the integrated value L exceeds M, but does not decrease below that when the integrated value L reaches the minimum value TA. When the integrated value L does not exceed M, the set temperature T is increased by T2. And when it reaches the maximum value TB, it will not be raised any more. In this way, the set temperature is changed as shown in Fig. (B). At this time, the temperature change of the refrigerant and the temperature change of the table are as shown in curves 81 and 82 of FIG. That is, the temperature change 82 of the table is 1/10 or less of the temperature change of the table when the set temperature T of the refrigerant is not changed.

【0039】

In this embodiment, the set temperature T is controlled based on the integrated value L of the moving distance of the stage. Instead, the current value flowing through the coil of the linear motor is integrated, and the same applies accordingly. The set temperature T of the refrigerant may be changed. By using the current value of the coil in this way, the temperature change of the linear motor can be predicted more directly so that the error is reduced, so that the temperature change of the table is controlled to be minimized more accurately. can do.

【0040】

[Third Example] In the first embodiment, the calorific value is calculated in advance based on the drive pattern of the stage, but instead, in this embodiment, in the same device configuration of FIG. , The calorific value of the X linear motor 3 is calculated from the drive information such as the drive command to the X linear motor 3 at the same time for each drive of the X stage. Then, the integrated value of the calorific value is obtained at regular time intervals, and based on this integrated value, the temperature set value of the motor coolant is determined with reference to a preset table.

【0041】

FIG. 9 shows a state of change in the calorific value of the X linear motor 3 and the temperature set value of the motor coolant in the wafer exposure operation when the temperature of the motor coolant is controlled in this way. When the X linear motor 3 is stopped, the set temperature of the motor coolant is T0. At the time of driving, the amount of heat generated differs depending on the driving duty at that time. Even with the same exposure operation, the step size and exposure time are different between the state of condition A and the state of condition B, and the amount of heat generated from the X linear motor 3 is different, so that the temperature setting value of the motor coolant is also different.

【0042】

In this embodiment, the temperature set value of the motor coolant is changed immediately according to the amount of heat generated, but if there is a difference between the heat transfer path of heat generation and the heat transfer path of cooling, the motor By gradually changing the temperature setting value of the coolant with a gradient, or conversely, by setting the temperature setting value larger for a certain period of time so that the final target value is reached after a certain period of time. It is also possible to improve the temperature stability of the controlled object.

【0043】

Further, in the present embodiment, the wafer stage of the semiconductor exposure apparatus has been described as an example, but the present invention has a mechanism having a heat generation source such as a motor and a cooling device capable of setting the temperature in the reticle stage of the exposure apparatus, a robot, or the like. It can also be applied in.

【0044】

[Implementation of Exposure Device] Next, an embodiment of a scanning exposure device on which the stage device shown in the above-described embodiment is mounted as a wafer stage will be described with reference to FIG.

【0045】

The lens barrel surface plate 96 is supported from the floor or base 91 via a damper 98. The lens barrel surface plate 96 supports the reticle surface plate 94 and also supports the projection optical system 97 located between the reticle stage 95 and the wafer stage 93.

【0046】

The wafer stage is supported on a stage surface plate supported from the floor or the base, and the wafer is placed and positioned. Further, the reticle stage can be moved by mounting the reticle on which the circuit pattern is formed, which is supported on the reticle stage surface plate supported by the lens barrel surface plate. The exposure light for exposing the reticle mounted on the reticle stage 95 to the wafer on the wafer stage 93 is generated from the illumination optical system 99.

【0047】

The wafer stage 93 is scanned in synchronization with the reticle stage 95. During scanning of the reticle stage 95 and the wafer stage 93, the positions of both are continuously detected by the interferometer and fed back to the drive units of the reticle stage 95 and the wafer stage 93, respectively. As a result, the scanning start positions of the two can be accurately synchronized, and the scanning speed of the constant speed scanning region can be controlled with high accuracy. While both are scanning the projection optical system, the reticle pattern is exposed on the wafer and the circuit pattern is transferred.

【0048】

In the present embodiment, since the stage device of the above-described embodiment is used as the wafer stage, the heat generated by the linear motor can be quickly recovered, so that high-speed and high-precision exposure is possible.

【0049】

[Example of Device Manufacturing Method] Next, an example of a method for manufacturing a semiconductor device using the exposure apparatus described above will be described. FIG. 11 shows a manufacturing flow of semiconductor devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, etc.). In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask production), a mask with the designed pattern is produced. In step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called the pre-process, and the actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. Step 5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer produced in step 4, and includes a process of assembling (dicing, bonding), a packaging process (chip encapsulation), and the like. .. In step 6 (inspection), inspections such as operation confirmation test and durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, the semiconductor device is completed and shipped (step 7).

【0050】

FIG. 12 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by thin film deposition. In step 14 (ion driving), ions are driven into the wafer. In step 15 (resist treatment), a photosensitizer is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), the part other than the developed resist image is scraped off. In step 19 (resist peeling), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to manufacture a semiconductor device having a high degree of integration, which was difficult to manufacture in the past.

【0051】

[Effect of the invention]

As described above, according to the present invention, in order to control the drive of the stage, the amount of heat recovery is controlled based on the drive pattern defined in advance for the drive of the stage, so that the heat recovery amount is controlled regardless of the fluctuation of the drive load. The temperature of the stage can be kept constant. Even if it is used in an exposure device and the heat generated by the drive motor cannot be completely blocked by a coolant, etc., the temperature change of the table on the stage can be made as small as possible, and the shape of the mirror or reference mark on the table can be minimized. As a result, highly accurate alignment can always be achieved.

【0052】

Further, since the heat recovery amount is changed based on the drive state detected at each predetermined time of the stage, the temperature of the stage can be kept constant regardless of the fluctuation of the drive load. That is, the temperature of the refrigerant can be changed so that the temperature change of the stage and the drive motor is minimized according to the driving state of the stage, and the table on the stage is deformed by thermal stress or becomes a reference for the accuracy of the table. Deformation of the member can be prevented. Therefore, highly accurate table drive control is possible.

【0053】

Further, for each drive of the stage, the calorific value of the drive motor is calculated based on the drive information, and the calorific value is integrated every predetermined time, and the heat recovery amount is calculated every predetermined time based on the integrated value. Since the change is made, the temperature of the stage can be kept constant regardless of the fluctuation of the drive load. Further, it is used in an exposure apparatus, and even when the heat generated from the drive motor cannot be completely blocked by the coolant, the temperature change of the table on the stage can be reduced. Therefore, the posture and shape of the mirror on the table can be stabilized. As a result, the stability of the coordinates of the stage can be improved and the superposition performance can be improved.

【0054】

Further, in any case, since it is not necessary to provide a temperature detecting means such as a thermistor inside the stage, it is possible to reduce the cost, reduce the weight of the stage, reduce the size of the stage, omit the wiring, and the like.

[Simple explanation of drawings]

[Figure 1]

It is a perspective view which shows the outline of the main part of the wafer stage of the semiconductor exposure apparatus which concerns on 1st Example of this invention.

[Figure 2]

It is a figure which shows the speed and current value at the time of acceleration / deceleration of the stage apparatus of FIG.

[Fig. 3]

It is a flowchart which shows the process in the control means of the stage apparatus of FIG.

[Fig. 4]

It is a schematic block diagram which shows the structure of the precision moving table which concerns on 2nd Example of this invention.

[Fig. 5]

It is a perspective view which shows the appearance of the precision moving table of FIG.

[Fig. 6]

It is a perspective view which shows the structure of the linear motor in the precision movement table of FIG.

[Fig. 7]

It is a flowchart which shows the operation of the target temperature setting part of the refrigerant in the precision moving table of FIG.

[Fig. 8]

It is a graph which shows the change of the set temperature of a refrigerant by the process of FIG. 7 and the temperature change of a table by it.

[Fig. 9]

It is a graph which shows the change of the calorific value of the X linear motor and the temperature setting value of the motor coolant in the exposure operation of the wafer by the 3rd Example of this invention.

[Fig. 10]

It is a figure which shows the structure of the scanning type exposure apparatus which mounted the stage apparatus of this invention as a wafer stage.

[Fig. 11]

It is a figure which shows the flow of manufacturing of a micro device.

[Fig. 12]

It is a figure which shows the detailed flow of the wafer process in FIG.

[Explanation of symbols]

1: Wafer, 2: Fine movement stage, 3: X linear motor, 4a, 4b: Y slider, 5: Y guide, 6a, 6b: Y linear motor, 7a, 7b: Stage platen, 10: Coil support member, 11 : Coil, 12: Yoke, 13: Spacer, 15: Connecting member, 16: Refrigerant passage, 37: Permanent magnet, 101: Stage, 102: Linear motor stator, 103: Linear motor stator, 104: Stage drive control unit , 105: drive command unit, 106: refrigerant, 107: refrigerant temperature control unit, 108: target temperature setting unit for refrigerant, 501: X stage, 502: Y stage, 503, 504: mounting plate, 505: linear motor, 506: linear Motor, 507: Guide, 508: Base, 522: Flexible tube, 532: Movable, 533: Stator.