IL278947A

Tailored conductive interconnect structures having microstructures supported by a shrinkable polymer

Abstract

This record has no abstract on file.

IL278947A, drawing sheet 1 — Sheet 1 of 10

Term

No projected expiry on record.

10 sheets

Sheet 1
Sheet 2
Sheet 3
Sheet 4
Sheet 5
Sheet 6
Sheet 7
Sheet 8
Sheet 9
Sheet 10

11 members in 5 offices

This recordMember, by publication datePriority claim

Priority claims8

Priority claims
Document	Office	Kind	Date
201816029507	United States of America	A	2018-07-06
201816029507	United States of America	A	2018-07-06
2019030949	United States of America	W	2019-05-06
2019030949	United States of America	W	2019-05-06
16029507	–	–	–
PCTUS2019030949	–	–	–
US201816029507	–	–	–
WO2019US30949	–	–	–

Members11

Family members, oldest first
Document	Office	Kind
US2020015349A1	United States of America	A1	2020-01-09
WO2020009744A1	World Intellectual Property Organization (WIPO)	A1	2020-01-09
US10721815B2	United States of America	B2	2020-07-21
US2021014959A1	United States of America	A1	2021-01-14
IL278947D0	Israel	D0	2021-01-31
EP3818789A1	European Patent Office (EPO)	A1	2021-05-12
IL278947AThis record	Israel	A	2021-05-31
IL278947B	Israel	B	2021-05-31
JP2021526316A	Japan	A	2021-09-30
JP7113917B2	Japan	B2	2022-08-05
US11638348B2	United States of America	B2	2023-04-25

2 legal events, as the office reported them to INPADOC

Over the term

Point at a mark for the event

Events

Legal events, newest first
	Event	Code
2021-09-30	Patent grantedGrantedFF	FF
2021-09-30	Patent renewedKB	KB