IL231333B

System and method for pain reduction during skin puncture and breakable tip therefor

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Published
  4. Today

99 members in 26 offices

This recordMember, by publication datePriority claim16 more offices are in the list below

Priority claims3

Priority claims
DocumentOfficeKindDate
201113225782United States of AmericaA
201113253572United States of AmericaA
2012053744United States of AmericaW

Members99

Family members, oldest first
DocumentOfficeKind
CA2580792A1CanadaA1
WO2006034324A2World Intellectual Property Organization (WIPO)A2
WO2006034324A3World Intellectual Property Organization (WIPO)A3
EP1791510A2European Patent Office (EPO)A2
US2008255483A1United States of AmericaA1
EP1791510A4European Patent Office (EPO)A4
CA2756890A1CanadaA1
WO2010110823A1World Intellectual Property Organization (WIPO)A1
WO2010111611A2World Intellectual Property Organization (WIPO)A2
WO2010111611A3World Intellectual Property Organization (WIPO)A3
US7981071B2United States of AmericaB2
AU2010229783A1AustraliaA1
US2011270154A1United States of AmericaA1
US2011319812A1United States of AmericaA1
US2012016292A1United States of AmericaA1
MX2011010069AMexicoA
EP2411074A2European Patent Office (EPO)A2
US2012029422A1United States of AmericaA1
KR20120013348ARepublic of KoreaA
CN102395397AChinaA
JP2012521809AJapanA
HK1166282A1Hong Kong, ChinaA1
CA2864411A1CanadaA1
WO2013036507A1World Intellectual Property Organization (WIPO)A1
WO2013036625A1World Intellectual Property Organization (WIPO)A1
TW201317021ATaiwan Province of ChinaA
RU2011141339ARussian FederationA
EP2411074A4European Patent Office (EPO)A4
CA2580792CCanadaC
US8622952B2United States of AmericaB2
US8668664B2United States of AmericaB2
MX2014002653AMexicoA
AU2012304728A1AustraliaA1
CO6940397A2ColombiaA2
CN103826686AChinaA
EP2753393A1European Patent Office (EPO)A1
JP5549987B2JapanB2
RU2523203C2Russian FederationC2
CN102395397BChinaB
JP2014525331AJapanA
HK1194695A1Hong Kong, ChinaA1
US2014371542A1United States of AmericaA1
EP2753393A4European Patent Office (EPO)A4
EP1791510B1European Patent Office (EPO)B1
AU2010229783B2AustraliaB2
IL215355AIsraelA
WO2015081181A1World Intellectual Property Organization (WIPO)A1
DK1791510T3DenmarkT3
ES2539111T3SpainT3
US9168340B2United States of AmericaB2
EP2411074B1European Patent Office (EPO)B1
CN103826686BChinaB
TWI551321BTaiwan Province of ChinaB
US9463287B1United States of AmericaB1
US2016317759A1United States of AmericaA1
CA2984324A1CanadaA1
CA2984327A1CanadaA1
WO2016178941A1World Intellectual Property Organization (WIPO)A1
WO2016178952A1World Intellectual Property Organization (WIPO)A1
EP2753393B1European Patent Office (EPO)B1
US9539171B2United States of AmericaB2
US2017021113A1United States of AmericaA1
AU2012304728B2AustraliaB2
PT2753393TPortugalT
DK2753393T3DenmarkT3
SMT201700133BSan MarinoB
LT2753393TLithuaniaT
HRP20170297T1CroatiaT1
BRPI1010273A2BrazilA2
JP6133295B2JapanB2
SI2753393T1SloveniaT1
US9675766B2United States of AmericaB2
ES2617237T3SpainT3
PL2753393T3PolandT3
CY1118791T1CyprusT1
KR101759559B1Republic of KoreaB1
RS55721B1SerbiaB1
HUE033710T2HungaryT2
CN107708777AChinaA
CN107735131AChinaA
EP3288615A1European Patent Office (EPO)A1
EP3288616A1European Patent Office (EPO)A1
CA2756890CCanadaC
IL231333BThis recordIsraelB
US2018264205A1United States of AmericaA1
HK1249871A1Hong Kong, ChinaA1
EP3288616A4European Patent Office (EPO)A4
EP3288615A4European Patent Office (EPO)A4
MX363990BMexicoB
EP3288616B1European Patent Office (EPO)B1
CA2864411CCanadaC
EP3288615B1European Patent Office (EPO)B1
BRPI1010273B1BrazilB1
DK3288616T3DenmarkT3
US10695508B2United States of AmericaB2
ES2789359T3SpainT3
CN107735131BChinaB
BR112014005067B1BrazilB1
BRPI1010273B8BrazilB8