Nova Patents
IL160184A0

Slurry composition for use in chemical mechanical polishing of metal wiring

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Published
  4. Today

37 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

Priority claims3

Priority claims
DocumentOfficeKindDate
20010047895Republic of KoreaA
20020028052Republic of KoreaA
0201492Republic of KoreaW

Members37

Family members, oldest first
DocumentOfficeKind
KR20030014338ARepublic of KoreaA
WO03015148A1World Intellectual Property Organization (WIPO)A1
EP1421610A1European Patent Office (EPO)A1
TW591089BTaiwan Province of ChinaB
IL160184A0This recordIsraelA0
CN1539162AChinaA
KR100459101B1Republic of KoreaB1
US2004244911A1United States of AmericaA1
EP1421610A4European Patent Office (EPO)A4
JP2004538636AJapanA
US2005062016A1United States of AmericaA1
US6930054B2United States of AmericaB2
US6953389B2United States of AmericaB2
US2005227491A1United States of AmericaA1
CN1243370CChinaC
CN1757699AChinaA
EP1645606A1European Patent Office (EPO)A1
TW200612465ATaiwan Province of ChinaA
JP2006108628AJapanA
KR20060043826ARepublic of KoreaA
SG121931A1SingaporeA1
EP1421610B1European Patent Office (EPO)B1
DE60215956D1GermanyD1
KR100680509B1Republic of KoreaB1
DE60215956T2GermanyT2
TWI281188BTaiwan Province of ChinaB
EP1645606B1European Patent Office (EPO)B1
DE602005001748D1GermanyD1
JP2007243209AJapanA
JP3987490B2JapanB2
CN100374527CChinaC
DE602005001748T2GermanyT2
US7452815B2United States of AmericaB2
IL160184AIsraelA
JP4220983B2JapanB2
MY140094AMalaysiaA
IL169006AIsraelA