HK1048552B

Overmolded electronics

Abstract

This record has no abstract on file.

No projected expiry on record.

39 members in 16 offices

This recordMember, by publication datePriority claim6 more offices are in the list below

Priority claims
Document	Office	Kind	Date
31295199	United States of America	A	1999-05-17
0011984	United States of America	W	2000-05-02

Family members, oldest first
Document	Office	Kind
WO0070569A1	World Intellectual Property Organization (WIPO)	A1	2000-11-23
AU5125500A	Australia	A	2000-12-05
KR20020001885A	Republic of Korea	A	2002-01-09
BR0010643A	Brazil	A	2002-05-28
EP1210698A1	European Patent Office (EPO)	A1	2002-06-05
CN1361906A	China	A	2002-07-31
EP1210698A4	European Patent Office (EPO)	A4	2002-08-14
US6441741B1	United States of America	B1	2002-08-27
MXPA01011769A	Mexico	A	2002-12-05
US2002180602A1	United States of America	A1	2002-12-05
JP2002544745A	Japan	A	2002-12-24
HK1047493A	Hong Kong, China	A	2003-02-21
HK1047493A1	Hong Kong, China	A1	2003-02-21
HK1048552A	Hong Kong, China	A	2003-04-04
HK1048552A1	Hong Kong, China	A1	2003-04-04
AR030526A1	Argentina	A1	2003-08-27
AU773911B2	Australia	B2	2004-06-10
US6778089B2	United States of America	B2	2004-08-17
AU2004210589A1	Australia	A1	2004-10-07
US2005012620A1	United States of America	A1	2005-01-20
AR039512A2	Argentina	A2	2005-02-23
KR100484856B1	Republic of Korea	B1	2005-04-22
US7109868B2	United States of America	B2	2006-09-19
CN1280775C	China	C	2006-10-18
JP2007026454A	Japan	A	2007-02-01
AU2004210589B2	Australia	B2	2007-02-15
HK1048552BThis record	Hong Kong, China	B	2007-03-30
EP1210698B1	European Patent Office (EPO)	B1	2007-09-05
AT372570T	Austria	T	2007-09-15
ATE372570T1	Austria	T1	2007-09-15
DE60036294D1	Germany	D1	2007-10-18
HK1047493B	Hong Kong, China	B	2007-11-02
PT1210698E	Portugal	E	2007-12-13
DE60036294T2	Germany	T2	2007-12-27
ES2292442T3	Spain	T3	2008-03-16
DK1210698T3	Denmark	T3	2008-05-19
JP4648267B2	Japan	B2	2011-03-09
BR0010643B1	Brazil	B1	2014-12-02
BRPI0010643B1	Brazil	B1	2014-12-02