Forging alloys using a lubricative, thermal resistive and friction reducing pad

A system for forging a workpiece, the system comprising: a die (10, 30, 32, 50, 52, 70, 72); an alloy workpiece (20, 40, 80); and a wafer (100, 110, 120, 130, 140, 150, 160) located between at least one part of the die and at least one part of the alloy workpiece, wherein the wafer comprises a plurality of layers including: a first layer comprising a first thermal resistance and a first coefficient of friction; and a second layer comprising a second thermal resistance and a second friction coefficient, where the first thermal resistance is greater than the second thermal resistance, the first friction coefficient being greater than the second friction coefficient, characterized in that the layers of the plurality of layers are fixed to each other by at least one means selected from at least one fastener, a seam (128) or at least one staple (118).