Antenna sheet, transponder, and booklet

ES 2 563 451 T3

DESCRIPTION

Antenna sheet, transponder and booklet

The present invention relates to an antenna sheet, a transponder and a booklet.

The priority of Japanese Patent Application No. 2007-239982, filed September 14, 2007, and Japanese Patent Application No. 2008-187007, filed July 18, 2008.

Previous technique

There are known conventional technologies for organizing an antenna coil of wire wound on a substrate and connecting it to an IC module to form a communication unit of the contactless type that carries out data communications with an external read / write device (see for example, Japanese Patent No. 3721520).

In recent years, systems using a contactless IC card and contactless IC tags are used with the aim of improving security. To implement the excellent features of such contactless IC cards, IC labels and the like in a booklet, such as a passport and a passbook, it has been proposed to form a contactless type information medium by pressing an entry of CI, with an antenna that connects to a non-contact CI module, between base materials with outer cover and mount the medium in the booklet by attaching it to a front cover or similar to this.

Since such a booklet allows electronic data to enter the IC input and be printed, improved security and the like features can be achieved.

Japanese Patent Application, First Publication No. 2002-042068, describes an example of a booklet like the one described above. In this booklet, a contactless type information medium is attached to an inner face of a back cover of the booklet. The non-contact type information medium is configured such that, on one side of the upper face of a first sheet of base material, a second sheet of base material having an opening with a predetermined width is attached to form a hole, an IC chip and an antenna coil attached to it are presented in this hole and an adhesive layer is presented on the underside side of the first base material sheet.

Disclosure of the invention

Problems solved by the invention

However, in the conventional technology described above, when the part where the IC module and the wound wire antenna coil are connected is subject to repeated bending, since the wire wound antenna has an extremely narrow diameter of, by For example, about 0.05mm to 0.2mm, there is a problem that the wound wire antenna coil is prone to breaking after hitting the edge of the IC module terminal section.

In addition, when ultrasonic welding and the like is used to connect the wound wire antenna coil to the terminal section of the IC module, there is a problem of tightness in the connection sections of the wire wound antenna coil, which makes it prone to breakage.

Furthermore, during a manufacturing process, it is necessary to wire each individual wound wire antenna to the substrate, making it difficult to increase productivity.

Furthermore, many booklets such as the one described above are formed in a traditional way using paper and the like. Since chloride ions, water and the like can easily penetrate the paper, the impregnation of such substances sometimes leads to deterioration of the antenna and the like of the attached non-contact type information medium. As a result, there is an adverse effect on the durability of the non-contact type information medium, leading to problems such as the possibility of a decrease in performance of the contactless type information medium while the booklet is in use.

Also, in conventional technology, since the IC module is fixed to the substrate, when a product is manufactured in which the substrate and the IC module are covered with paper and the like, there is a problem that the product becomes more thick. In this case, due to the flexibility of the paper, there is a problem that the region in which the IC module is installed expands and comes into contact with other components, breaking the IC module and the like.

The present invention has been made taking these circumstances into account and seeks to present an antenna sheet, a transponder and a booklet that, when a product is manufactured using a flexible base material such as paper to press an IC module, allow the product is fine.

ES 2 563 451 T3

Means to solve the problem

The invention is defined by the independent claims. Preferred embodiments are described in the dependent claims. To solve the problems described above, an antenna sheet of the present invention includes a flexible substrate, and an antenna coil that is connected to a terminal section of an external IC module that includes an IC chip and is disposed on the substrate. ; a storage section that stores at least a part of the IC module that is formed on the substrate.

When the terminal section of the IC chip is connected to a connecting section of the antenna sheet, at least a part of the IC module can be stored in the storage section. Accordingly, when the IC module is secured to the substrate, the thickness of at least a part of the IC module is absorbed into the storage section, allowing the product (eg, an inlet) to be thin.

The antenna coil of the antenna sheet of the present invention is formed in the form of a film, the width of the connecting section of the antenna coil connecting to the terminal section is greater than the width of the antenna coil, and a pair of the connecting sections are arranged opposite each other at the parts pressing the storage section on the substrate.

With this configuration, when the IC module terminal section and the antenna coil connection section are subjected to repeated bending and a stress acts on the antenna coil, since the antenna is created in the form of a film, in Compared with a conventional wound wire antenna coil, flexibility is improved and stress concentration can be prevented. Also, as the width of the connecting section to be connected to the terminal section of the IC module is increased, the stress can spread across the width and prevent it from concentrating. Also, as the antenna coil is formed on the substrate, the substrate functions as a reinforcing element for the antenna coil. This can prevent the antenna coil from hitting the edge of the IC module terminal section. Thus, breakage of the antenna coil is prevented.

When the connecting sections are connected to the terminal section, since the connecting section of the antenna coil, which is film-shaped and has an increased width, is connected to the terminal section of the IC module, it is unlikely that squeezing occurs during connection as occurs when using a conventional wound wire antenna coil. Thus, breakage of the connecting sections can be prevented.

In addition, when the substrate is plasticized and flows due to heat, since the antenna coil is created in the form of a film, compared to a conventional wire wound antenna, the contact area of ​​the antenna coil with the substrate increases and The flow resistance of the antenna coil can be increased. Thus, the antenna coil can be prevented from moving in accordance with the flow of the substrate, and the reliability of data communication can be improved.

Also, as the antenna coil in the form of a film can be manufactured collectively by, for example, etching and the like, compared to the manufacturing process in which the wire wound antenna coils are individually wound, the productivity it can be noticeably increased.

The antenna sheet of the present invention includes a chloride ion resistant layer created to cover the antenna coil.

With this configuration, since the chloride ion resistant layer is created to cover the antenna coil, even if it is incorporated in a booklet made of paper and the like, the antenna coil is not damaged by chloride ions. that penetrate the paper.

The antenna sheet of the present invention includes a waterproof layer created to cover the antenna coil.

With this configuration, since the waterproof layer is created to cover the antenna coil, even if incorporated in a booklet made of paper and the like, the antenna coil is not damaged by chloride ions penetrating the paper. .

Furthermore, in the antenna sheet of the present invention, the width of the connecting sections is less than or similar to the width of the terminal section.

With this configuration, the connecting sections can be connected to the terminal section along the entire width in the width direction. This allows the connecting sections to be more reliably connected to the terminal section and increases the reliability of the antenna coil.

Furthermore, in the antenna sheet of the present invention, the terminal section and the connecting sections are connected so as to overlap in the direction joining the opposing connecting sections and the length of the connecting sections is greater than the length of a region where they overlap with the section

ES 2 563 451 T3 terminal.

With this configuration, when connecting the connecting sections and the terminal section, when they are connected so that they overlap in the direction that joins the opposing connecting sections, the edge of the terminal section is further from the inside than from the side sides. in the direction of the length of the connecting sections. Consequently, the edge of the terminal section comes into contact with the connecting sections, the width of which is greater than the antenna coil. Thus, when the part where the terminal section of the IC module is connected to the connecting sections of the antenna coil is subject to repeated bending, the edge of the terminal section can be received by the connecting sections with a width increased. This can prevent stress concentration and can prevent breakage of the antenna coil.

Furthermore, in the antenna sheet of the present invention, slot holes are provided in the substrate and in the connecting sections.

With this configuration, if bending and the like are applied and cracks occur across the connecting sections, when the cracks reach the slot holes, there is communication between the width-shifting cracks and the slot holes running spread lengthwise, which stops the progression of cracks across the width. Thus, the cracks can be prevented from crossing the slot holes and progressing in width, and the breakage of the antenna coil can be prevented.

Furthermore, in the antenna sheet of the present invention, a through hole is formed which penetrates the substrate in a region of the substrate where the antenna coil is not formed.

With this configuration, when the base materials are attached to both sides of the antenna sheet, the base materials can be attached through the through hole. The through hole can also increase the flexibility of the antenna sheet, make the antenna sheet lighter, and reduce the amount of base material used.

Furthermore, in the antenna sheet of the present invention, the connecting sections of the antenna sheet are welded to the terminal section of the IC module at a plurality of points.

With this configuration, when the terminal section of the IC module is connected to the connecting section of the antenna sheet, a plurality of points can be alloyed or thermally fused and thus fixed. Compared with when fixed at a single point, the connecting force of the terminal section of the IC module and the connecting section of the antenna sheet with respect to bending can be increased.

The antenna sheet including the transponder can prevent breakage of the antenna coil, increasing the reliability of data communication and also increasing productivity.

Therefore, according to the transponder of the present invention, an input can be presented that allows the breakage of the antenna coil to be prevented, which has high data communication reliability and high productivity.

In addition, the transponder of the present invention includes a pair of base materials that press down on the antenna sheet and the IC module.

With this configuration, the antenna sheet including the transponder can prevent breakage of the antenna coil, increase data communication reliability, and also increase productivity. The base materials can also reinforce the connection points between the connection sections of the antenna sheet and the terminal section of the IC module.

Therefore, according to the present invention, a transponder can be provided which can prevent breakage of the antenna coil and which has high data communication reliability and high productivity.

Furthermore, in the transponder of the present invention, a base material opening is provided for storing at least a part of the IC module in at least one of the base material pair.

With this configuration, the thickness of the section of the IC module that is stored in the opening of the base material is absorbed by the base material, allowing the transponder to be thinner.

Furthermore, in the transponder of the present invention, a through hole is formed in the antenna sheet, and the pair of base materials is joined through the through hole.

With this configuration, the base materials can be attached through the through hole in the antenna sheet. This increases the strength of the bond between the transponder and the base materials and can prevent detachment of the base materials from the antenna sheet.

ES 2 563 451 T3

Furthermore, in the transponder of the present invention, a covering material is attached to a face of at least one of the pair of base materials.

With this configuration, the texture and external appearance of the transponder can be changed to suit your purpose, allowing it to be applied in various fields. Also, since the transponder includes an antenna sheet, it becomes possible to present a transponder that can prevent breakage of the antenna coil and achieve highly reliable data communication and high productivity.

Furthermore, in the transponder of the present invention, the pair of base materials are porous or have a fibrous structure.

With this configuration, since the thickness of the antenna sheet can be absorbed by base materials that are porous or have a fibrous structure, a flatter transponder can be manufactured.

When the transponder of the present invention is applied to a data carrier with an IC of the contactless type, such as, for example, a transport voucher in the form of an IC card or an electronic purse card, the antenna sheet including the input It can prevent breakage of the antenna coil of the non-contact type IC data carrier, thus increasing the reliability of data communication and increasing productivity.

When the transponder of the present invention is applied in an insert for a booklet or cover of a booklet, such as, for example, an identification certificate in the form of a booklet such as a passport or savings book, the antenna sheet including the insertion can prevent breakage of the antenna coil of the data carrier with Ci of the contactless type, thus increasing the reliability of data communication and increasing productivity.

A problem with using a conventional substrate made from a thermoplastic material with a low softening point such as PET-G is that, when making a product by thermally laminating the substrate, the wound wire antenna attached to the substrate moves in accordance with softening and flow of the substrate due to heat, which affects data communication characteristics and reduces reliability.

On the contrary, since the antenna sheet substrate described above is made of polyethylene naphthalate or polyethylene terephthalate, the heat resistance temperature of the substrate can be increased compared to that of thermoplastic materials conventionally used with a low softening point like PET-G. Accordingly, when, for example, a product is manufactured by thermal lamination of a substrate, even if the substrate is subjected to heat, it can be prevented from plasticizing and flowing. Therefore, the antenna coil can be prevented from moving in accordance with the flow of the substrate, and the reliability of data communication can be increased.

Effect of the invention

According to the present invention, when a flexible base material such as paper is used to press an IC module and make a product, an antenna sheet, a transponder and a booklet can be presented which can make the product thin.

Brief description of the drawings

FIG. 1A is a plan view of an antenna sheet according to a first embodiment of the present invention.

FIG. 1B is a bottom view of an antenna sheet according to a first embodiment of the present invention.

FIG. 2A is a cross-sectional view of a connecting section of a jumper wire and an antenna circuit of the antenna sheet according to the first embodiment of the present invention.

FIG. 2B is a cross-sectional view of a connection section of a jumper wire and an antenna circuit of the antenna sheet according to the first embodiment of the present invention.

FIG. 3A is a plan view of an IC module according to the first embodiment of the present invention.

FIG. 3B is a sectional view taken along the line AA 'in a plan view of an IC module according to the first embodiment of the present invention.

FIG. 4A is an enlarged plan view of an entrance according to the first embodiment of the present invention.

FIG. 4B is a sectional view taken along the line BB 'in an enlarged plan view of an entrance according to the first embodiment of the present invention.

FIG. 5A is an explanatory cross-sectional view of a method of manufacturing an entrance according to the first embodiment of the present invention.

FIG. 5B is an explanatory cross-sectional view of a method of manufacturing an inlet according to the first embodiment of the present invention.

ES 2 563 451 T3

FIG. 6 is an enlarged plan view of an antenna sheet and input according to a second embodiment of the present invention.

FIG. 7A is a plan view of an antenna sheet and input according to a third embodiment of the present invention.

FIG. 7B is a plan view of an antenna sheet and input according to the third embodiment of the present invention.

FIG. 7C is a plan view of an antenna sheet and an input according to the third embodiment of the present invention.

FIG. 8A is a plan view of an insert in accordance with one embodiment of the present invention.

FIG. 8B is a front view of an insert in accordance with the embodiment of the present invention. FIG. 9A is an explanatory plan view of a method of manufacturing an antenna sheet according to the embodiment of the present invention.

FIG. 9B is an explanatory plan view of a method of manufacturing an IC module according to the embodiment of the present invention.

FIG. 10 is an explanatory plan view of a method of manufacturing an insert according to the embodiment of the present invention.

FIG. 11 is a perspective view of a schematic configuration of an electronic passport according to the embodiment of the present invention.

FIG. 12 is a plan view of an example of deformation of an antenna sheet according to the embodiment of the present invention.

FIG. 13 is a view showing a booklet to which a contactless type information medium is attached according to a fourth embodiment of the present invention.

FIG. 14 is a view showing a template of an IC input of the same contactless type information medium.

FIG. 15 is a cross-sectional view of the same contactless type information medium attached to the same booklet 101.

FIG. 16 is a view showing a cutting state of the same IC input when the same contactless type information medium is manufactured.

FIG. 17 is a view showing the dimensions of each part of the same contactless type information medium in an example.

FIG. 18A is a view showing an IC input a modification of a contactless type information medium of the present invention.

FIG. 18B is a view showing a CI input a modification of a contactless type information medium of the present invention.

Reference symbols

<td>1, 1A, 1B, 1C, 1D two 4 7 8, 9 12, 13 18 19B, 19C, 19D twenty 22 25 30 40 41, 42 100</td><td>Antenna sheet 1 Substratum Antenna coil Opening Protrusions connecting the antenna (connection sections) Reinforcement patterns (reinforcement sections) Slot holes Through holes IC module IC chip Antenna ground (terminal section) Entry Insertion Base materials Electronic passport (insert with cover, data carrier with contactless type IC)</td>

<td>101, 101A 110, 110A 112 112A 113 114 115 116 W1, W2, W3, W4 L, L3, L4</td><td>Booklet 101 Contactless information medium Leaf Through hole Antenna coil IC chip Porous base materials Adhesive (chloride ion resistant layer) Width Length</td>

ES 2 563 451 T3

Best way to carry out the invention <First mode of realization>

Subsequently, a first embodiment of the invention based on the drawings will be explained.

(Antenna sheet)

FIG. 1A is a plan view of an antenna sheet 1 according to this embodiment and FIG. 1B is a bottom view. As shown in FIG. 1A, the antenna sheet 1 includes a flexible substrate 2 formed from, for example, polyethylene naphthalate (PEN) or polyethylene terephthalate (PET). The thickness of the substrate 2 is selected as suitable within a range of, for example, about 0.02mm to about 0.10mm. An antenna circuit 3 is formed on a surface of the substrate 2.

The antenna circuit 3 is made by etching or the like to model a thin aluminum film formed on the surface of the substrate 2 and is created in the form of a thin film having a thickness of about 0.02mm to 0.05mm.

The antenna circuit 3 includes an antenna coil 4 created in an approximately rectangular spiral shape that corresponds to the shape of the substrate 2. An inner end of the antenna coil 4 expands in volume in an approximately circular shape, which forms a terminal section 5. The bent parts (the corners of the rectangle) of the antenna coil 4 are created in the roughly circular arc shape.

An outer end 6 of the antenna coil 4 is directed towards a corner of the substrate 2. An approximately rectangular opening 7 is slightly formed on the side of the antenna coil 4 of a corner of the substrate 2. The opening 7 can store a part of a CI module explained later. Although the opening 7 is described here as a storage section that can store a part of the IC module, this is not limiting of the invention. For example, instead of presenting an opening in the substrate 2, a recess may be provided as a storage section, with part of the IC module housed in this recess. Compared to using a gap, an opening gets a deeper storage section with more space to store the IC module and can therefore increase how flat the antenna sheet 1 is.

The outer end 6 of the antenna coil 4 that is directed towards a corner of the substrate 2 is directed towards a side 7a of the opening 7 and is connected to a ground that connects the antenna 8 (connection section) which is formed along long side 7a. The projection connecting the antenna 8 is an approximately rectangular terminal section formed by increasing the width W1 of the antenna coil 4.

A ground connecting the antenna 9 (connecting section) is formed on a side 7b opposite the side 7a of the opening 7 where the projection connecting the antenna 8 is formed. A wire 10 is a part of the antenna coil 4 and It is connected to the projection connecting the antenna 9 formed opposite the projection connecting the antenna 8. Similar to the projection connecting the opposite antenna 8, the projection connecting the antenna 9 is created approximately rectangular in shape along the side 7b of the opening 7 as the width W2 of the wire 10 increases. One end of the wire 10 connects with the projection connecting the antenna 9 and another side of the end increases in volume approximately circularly to form a terminal section 11.

As shown in FIG. 1B, the reinforcement patterns 12 and 13 (reinforcement sections) that reinforce the projections that connect the antenna 8 and 9 are formed on a face on a side opposite to the face where the loop antenna 3 is formed, in correspondence with the regions of formation of the projections connecting the antenna 8 and 9. The reinforcement patterns 12 and 13 are created with a rectangular shape corresponding to the shapes of the projections connecting the antenna 8 and 9 along the contours of the projections connecting the antenna 8 and 9 when viewed from above by, by example, etching and the like of a thin metal film as used for antenna circuit 3 or by similar means.

By forming the reinforcement patterns 12 and 13 in correspondence with the forming regions of the connecting section 8 on the face of a side opposite to the face on which the antenna circuit 3 is formed which includes the connecting projection the antenna 8 of the substrate 2, the connection section 8 can be supported both by the substrate 2 and by the reinforcing patterns 12 and 13 formed on the rear side of the latter, through which the connection section 8 can be reinforced. This increases the flexural strength of the connection section 8 and can prevent breakage of the antenna coil 4 even when the section where the terminal section 25 of an IC module 20 and the connection section 8 of the coil are connected antenna 4 is subject to repeated bending.

A jumper wire 14 is formed on a face on a side opposite to the face on which the antenna circuit 3 of the substrate 2 is formed and connects the terminal section 5 of the antenna coil 4 to the terminal section 11. The jumper wire 14 is formed using, for example, a method similar to that used for antenna circuit 3. Both ends of jumper wire 14 are increased in volume in an approximately circular fashion to form terminal sections 15 and 16. Terminal sections 15 and 16 of jumper wire 14 are presented in

ES 2 563 451 T3 corresponds to the formation regions of the terminal section 5 and the terminal section 11 of the antenna coil 4 respectively. The terminal sections 15 and 16 of the jumper wire 14 and the terminal sections 5 and 11 of the antenna coil 4 are electrically connected together in conductive sections 17, which are formed in a plurality of ways as points in the formation regions of terminal sections 15 and 16.

As shown in FIG. 2A, the conductive section 17 is formed, for example, by a pressing process that applies pressure to the terminal section 15 (terminal section 16) of the jumper wire 14 and the terminal section 5 (terminal section 11) of the antenna coil 4 so that it presses them from both sides, thus breaking the substrate 2 and achieving physical contact between the terminal sections 5 and 15 (11 and 16).

The conduction section 17 can be formed using a method other than connecting by the pressing process described above; as shown in FIG. 2B, for example, it is allowed to form a through hole 19A that penetrates the forming regions of the terminal sections 5 and 15 (11 and 16), fill the through hole 19A with conductive paste 19 such as silver paste and electrically connects terminal section 15 (terminal section 16) of jumper wire 14 with terminal section 5 (terminal section 11) of antenna coil 4.

(IC module)

Later, an IC module 20 connected to the antenna circuit 3 of the antenna sheet 1 will be explained.

FIG. 3A is a plan view of an IC module 20 according to this embodiment and FIG. 3B is a cross-sectional view taken along line AA 'of FIG. 3A.

As shown in FIGS. 3A and 3B, the IC module 20 is formed from a connection frame 21, an IC chip 22 mounted on the connection frame 21, and a resin sealing section 23 that seals the IC chip 22.

The connecting frame 21 is created roughly in the shape of a rectangle with rounded corners in the shape of circular arches when viewed from above. The connecting frame 21 is formed from, for example, a metal film of copper wire and the like made by weaving the copper wire into a film and coating that film with silver.

The connection frame 21 includes a socket base 24 that firmly supports the IC chip 22 and an antenna ground 25 (terminal section) that connects to an input / output panel of the IC chip 22.

The base of the die 24 is slightly larger than the outer shape of the IC chip 22 and is attached to the bottom of the IC chip 22. A gap S is present between the base of the die 24 and the antenna boss 25, isolating itself from electrical form of each other.

The antenna boss 25 is connected to the I / O panel of the IC chip 22 by joining the wires 26 of, for example, gold (Au). Since the antenna boss 25 is used as a terminal section of the IC module 20 that connects to an external circuit, it is formed by extending along the length (direction of length L) of the IC module 20.

The resin sealing section 23 is formed approximately in the shape of a square with the rounded corners in the shape of a circular arc when viewed from above. The resin sealing section 23 is formed from, for example, a resin material such as epoxy resin and covers IC chip 22, IC chip input / output panel 22, bonding wires 26, the connection section between the antenna boss 25 and the bonding wires 26, etc. The resin sealing section 23 fills into the gap S between the base of the die 24 and the antenna boss 25 and extends through both. Here, the thickness T1 of the IC module 20 is, for example, about 0.3 mm.

(Input (also called transponder))

As shown in FIGS. 4A and 4B, by electrically connecting the antenna boss 25 of the IC module 20 to the pins connecting the antenna 8 and 9 of the antenna sheet 1 and thereby securing the IC module 20 to the sheet. of antenna 1, an input 30 is formed that includes the antenna sheet 1 the IC module 20.

Here, the opening 7 of the antenna sheet 1 opens approximately square in shape corresponding to the resin sealing section 23 and somewhat larger than the external shape of the resin sealing section 23, allowing the opening 7 Store the approximately square shaped resin seal section 23 of the IC module 20.

The width W3 of the pair of projections connecting the antenna 8 and 9 provided opposite each other on both sides of the aperture 7 of the antenna sheet 1 is approximately the same, or slightly less, than the width W4 of the antenna projection 25 IC module 20.

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The length L3 of the projections connecting the antenna 8 and 9 of the antenna sheet 1 is greater than the length L4 of the overlapping sections of the antenna projection 25 of the IC module 20 and the projections that connect the antenna 8 and 9 In this embodiment, the length L3 of the projections connecting the antenna 8 and 9 is approximately twice the length L4 of the overlapping sections of the antenna projection 25 and the projections connecting the antenna 8 and 9.

Later, an operation of this embodiment will be explained.

When the input 30 shown in FIGS. 4A and 4B is subject to repeated bending, this applies a stress to the section where the antenna boss 25 of the IC module 20 connects to the bosses that connect the antenna 8 and 9 of the antenna sheet 1. At this point, since the antenna coil 4 is formed by modeling a thin aluminum film on the substrate 2, its flexibility is higher than that of the conventional antenna coil formed by winding a wire and it is prevented from the effort is concentrated on specific points.

If the antenna coil 4 is made of aluminum in this way, a lower cost can be achieved than when using another metal, such as copper, to form the antenna coil 4. Furthermore, when the projection connecting the antenna 8 of antenna coil 4 and antenna boss 25 of IC module 20, optimizing the bonding conditions allows them to be thermally alloyed or melted and firmly bonded together.

The width W3 of the projections connecting the antenna 8 and 9 of the antenna coil 4 connected to the antenna projection 25 of the IC module 20 becomes greater than the width W1 and W2 of the antenna coil 4, so that it is approximately the same, or slightly less, than the width W4 of the antenna boss 25. This can spread the stress in the direction of the width W3 and prevent it from concentrating. Furthermore, the antenna connecting projections 8 and 9 can be connected along the entire width of the antenna projection 25 in the width direction W4 and the antenna connecting projections 8 and 9 can be reliably connected to the antenna projection. antenna 25, increasing the reliability of antenna coil 4 and input 30.

The length L3 of the projections connecting the antenna 8 and 9 of the antenna sheet 1 is made greater than the length L4 of the overlapping sections between the antenna projection 25 of the IC module 20 and the projections connecting the antenna 8 and 9. Furthermore, in this embodiment, the length L3 of the projections connecting the antenna 8 and 9 is approximately twice as long as the length L4 of the overlapping sections between the antenna projection 25 and the projections connecting the antenna 8 and 9. As a result, the edges 25e of the antenna boss 25 are connected so that they are positioned approximately in the center of the inside of the ends of the antenna connecting bosses 8 and 9 on the side of the antenna coil 4. Consequently, the edges 25e of the antenna boss 25 approximately contact the centers of the bosses connecting the antenna 8 and 9 whose width W3 is greater than the widths W1 and W2 of the antenna coil 4.

Therefore, when the sections where the antenna boss 25 of the IC module 20 connects to the bosses that connect the antenna 8 and 9 of the antenna coil 4 are subject to repeated bending, the edges 25e of the antenna boss 25 they can be received approximately in the centers of the projections connecting the antenna 8 and 9 whose width W3 becomes larger. This can prevent stress concentration on antenna coil 4 and thus can prevent breakage of antenna coil 4.

Furthermore, since the antenna coil 4 and the projections connecting the antenna 8 and 9 are formed on the substrate 2, the substrate 2 functions as a reinforcing material for them. This prevents the antenna coil 4 with small widths W1 and W2 from making contact with the edges 25e of the antenna boss 25 and can prevent breakage of the antenna coil 4.

The reinforcement patterns 12 and 13 that reinforce the projections that connect the antenna 8 and 9 are formed on a face of the substrate 2 that is on the opposite side to the face of the antenna circuit 3, in correspondence with the regions of formation of the projections connecting antenna 8 and 9. Therefore, the projections connecting the antenna 8 and 9 are supported both by the substrate 2 and by the reinforcement patterns 12 and 13 on its rear face, through which the projections connecting the antenna 8 and 9 can be reinforced. .

Therefore, the flexural strength of the projections connecting the antenna 8 and 9 is increased and, when the sections in which the antenna projection 25 of the IC module is connected to the projections connecting the antenna 8 and 9 of the antenna coil 4 are subject to repeated bending, breakage of the projections connecting antenna 8 and 9 and breakage of the antenna coil are prevented.

Even if the substrate 2 breaks due to stress, for example, the reinforcement patterns 12 and 13 can be made to contact the protrusions connecting the antenna 8 and 9, through which they can assist the protrusions connecting the antenna 8 and 9 and prevent the antenna coil 4 from breaking.

Furthermore, since the thin film antenna coil 4 of this embodiment can be manufactured collectively by, for example, etching and the like, as compared to a manufacturing process in which the wire wound antenna coils are wound individually, the productivity of the sheet can be increased.

ES 2 563 451 T3 antenna 1 remarkably.

(Input manufacturing method)

Later, a manufacturing method of the input 30 by connecting the projections connecting the antenna 8 and 9 of the antenna sheet 1 to the antenna projection 25 of the IC module 20 will be explained.

When the lugs connecting the antenna 8 and 9 of the antenna sheet 1 are connected to the antenna boss 25 of the IC module 20, as shown in FIGS. 4A and 4B, the resin sealing section 23 of the IC module 20 is stored in the opening 7 of the antenna sheet 1 and the antenna boss 25 is connected to the bosses that connect the antenna 8 and 9 so that they remain facing each other.

The connection between antenna boss 25 and antenna connecting bosses 8 and 9 is achieved by, for example, resistance welding or laser welding. As shown in FIG. 5A, in resistance welding, a pair of welding electrodes 31 and 32 are separated and brought into contact in the width direction W4 of the antenna boss 25 of the IC module 20. Next, a pressure of about 5N / mm² at 70N / mm², and preferably about 40 N / mm² of the welding electrodes 31 and 32 between the antenna protrusion 25 and the protrusion connecting the antenna 8. That is, a pressure of approximately 2.5 N / mm is applied² at 35 N / mm², and preferably about 20 N / mm² of each of the welding electrodes 31 and 32. Joining can be more reliable if welding is performed at multiple points.

When pressure is applied, a welding current I is supplied from one welding electrode 31 to the other welding electrode 32. A voltage is applied between the welding electrodes 31 and 32 for a time of about 0.5 ms to 10, 0 ms, so that the welding current I reaches, for example, about 300A to 600A. Therefore, the current I applied from the welding electrode 31 enters the projection connecting the antenna 8 of the antenna projection 25 and enters the antenna projection 25 of the projection connecting the antenna 8 at the point where the other welding electrode 32 comes into contact. At this point, heat is generated at the interface between the antenna boss 25 and the boss connecting the antenna 8 at the section where the welding electrodes 31 and 32 come into contact.

Due to the heat generated at this interface, the antenna boss 25 and the antenna connecting boss 8 are welded and thermally alloyed or melted, thereby joining them. Furthermore, if the direction of the welding current I is reversed, a well-balanced junction can be achieved between the antenna boss 25 and the boss connecting the antenna 8 at the sections where the welding electrodes 31 and 32 come into contact. Contact.

If the voltage, the pressure power, and the voltage application time are adjusted as described above, the bonding conditions can be optimized, allowing the antenna boss 25 and the antenna connecting boss 8 to alloy or merge. thermally melt and bond firmly.

When pressure is applied between the antenna boss 25 and the antenna connecting boss 8 as described above, the contact resistance of the antenna boss 25 and the antenna connecting boss 8 decreases. This weakens resistance heating and reduces the welding energy of the boss connecting antenna 8, which is made from aluminum having a lower welding temperature than antenna boss 25. Therefore, the scattering of the projection connecting the antenna 8 during welding can be prevented and a stable joint can be obtained.

Subsequently, the projection connecting the antenna 9 and the antenna projection 25 are joined by welding, according to the same procedure as that used for the joining of the projection connecting the antenna 8 and the antenna projection 25.

Therefore, an inlet 30 can be manufactured in which the antenna boss 25 of the IC module 20 and the bosses connecting the antenna 8 and 9 of the antenna sheet 1 are welded at two points in the width direction. W4.

As shown in FIG. 5B, in resistance welding, a pair of welding electrodes 31 and 32 can be arranged separately in the direction of the length L of the IC module 20, making one of the welding electrodes 31 come into contact with the projection connecting antenna 8 and bringing the other welding electrode 32 into contact with a point on antenna projection 25 where antenna projection 25 and antenna connecting projection 8 meet. In this case, the antenna boss 25 and the antenna connecting boss 8 are pressed by applying a pressure of about 5 N / mm² at 70 N / mm², preferably about 40 N / mm², to the welding electrode 32 provided on the antenna boss 25.

Subsequently, when the above pressure is applied, a welding current I is supplied from one welding electrode 31 to the other welding electrode 32. The current, voltage and application time of the welding current I are the same as in welding. by resistance described in FIG. 5A. At this point, the current I applied from the welding electrode 31 enters the protrusion connecting the antenna 8 and enters the antenna protrusion 25 from the protrusion connecting the antenna 8 at the point where the other welding electrode 32 enters

ES 2 563 451 T3 contact. At this point, heat is generated at the interface between the antenna boss 25 and the boss connecting the antenna 8 in the section where the other welding electrode 32 comes into contact, through which they are welded and alloyed or they thermally melt and bond.

If the pressure at the time of welding of the projection connecting the antenna 8 is relatively high compared to the antenna projection 25, the contact resistance of the welding section on the side of the projection connecting the antenna 8 becomes relatively short. Therefore, the resistance heating of the welding section on the side of the projection connecting the antenna 8 can be relatively reduced compared to the antenna projection 25, and the welding energy of the resistance heating of the connecting projection can be reduced. antenna 8. This can prevent the protrusion connecting the antenna 8, which has a welding temperature that is relatively low compared to the antenna protrusion 25, from being scattered during welding and a stable joint can be achieved, through which it can increase the reliability of the connection and the reliability of the data carrier.

Next, the welding electrodes 31 and 32 are moved in the width directions W3 and W4 of the boss connecting the antenna 8 and the antenna boss 25 and a similar procedure is used to join them by welding at a plurality of points in the width directions W3 and W4.

If a procedure similar to that used when joining the antenna boss 8 and antenna boss 25 is used, then the antenna boss 9 and antenna boss 25 are joined by welding at a plurality of points in the width directions W3 and W4.

Thus, an inlet 30 can be fabricated in which the antenna boss 25 of the IC module 20 and the bosses connecting the antenna 8 and 9 of the antenna sheet 1 are joined by welding at a plurality of points in the directions of the width W3 and W4.

As described above, when the IC module 20 is secured to the substrate 2, the opening 7 that can store the resin sealing section 23 of the IC module 20 is formed in the antenna sheet 1, where it is absorbed the thickness of the resin sealing section 23 of the IC module 20 in the opening 7 of the substrate 2, which allows the inlet 30 to be thinner.

Furthermore, if the pair of welding electrodes 31 and 32 are arranged spaced on the antenna boss 25 in the width directions W3 and W4 and if the antenna boss 25 is welded to the bosses connecting the antenna 8 and 9 by resistance welding, a larger joint area can be achieved than when joining a conventional wound wire antenna coil by ultrasonic welding and the like.

Also, if the pair of welding electrodes 31 and 32 are arranged spaced apart in the direction of the length L of IC module 20, only the other welding electrode 32 needs to be positioned on the antenna boss 25. This allows the boss to antenna 25 becomes smaller.

When the antenna boss 25 is connected to the antenna connecting bosses 8 and 9 by welding them at a plurality of points in the width W3 and width W4 directions and joining them, the antenna boss 25 and the antenna connecting bosses 8 and 9 can be set at a plurality of points. This can increase the bonding force between the antenna boss 25 of the IC module 20 and the bosses connecting the antenna 8 and 9 of the antenna sheet 1 with respect to bending.

When the antenna boss 25 and the antenna connecting bosses 8 and 9 are welded, since the antenna boss 8 and 9 that are membranous and have an increased width W3 are welded to the antenna boss 25, there is no restriction during connection as in a conventional wound wire antenna coil. Therefore, the breakage of the antenna coil 4 can be prevented.

Furthermore, since the length L3 of the projections connecting the antenna 8 and 9 is greater than the length of the antenna projection 25 extending in the direction of the length L, the supporting area of ​​the IC module 20 can be increased and the substrate 2 which is supported by the projections connecting the antenna 8 and 9. This increases durability against stress and can prevent breakage of the antenna coil 4 even when there is a bending in the projections connecting the antenna 8 and 9.

Furthermore, the reinforcement patterns 12 and 13 are formed in the regions of formations of the projections that connect the antenna 8 and 9 on one face of the substrate 2 of the antenna sheet 1 that is on the opposite side to the face on which The projections connecting the antenna 8 and 9 are formed. Consequently, during resistance welding, heat can be transmitted to the reinforcement patterns 12 and 13 and released to the outside. This can prevent substrate 2 from overheating and melting. Therefore, the dirt can be prevented from adhering to the resistance welding system and the product, and also, a decrease in the flexural strength of the antenna sheet 1 can be prevented.

Furthermore, since the input 30 includes the antenna sheet 1 described above, breakage of the

ES 2 563 451 T3 antenna coil 4 due to the antenna sheet 1, which increases the reliability of data communications and further increases the productivity of the input 30. Therefore, it is possible to present the input 30 which allows Antenna coil 4, which has high data communication reliability and high productivity, is prevented from breaking.

As described above, according to this embodiment, an antenna sheet 1 can be provided which prevents breakage of the antenna coil 4, increases reliability and also increases productivity. Also, if this antenna sheet 1 is included, an IC input 30 can be provided that allows to prevent breakage of the antenna coil 4, which has increased reliability and increased productivity.

<Second mode of realization>

Subsequently, referring to FIG. 1A to FIG. 3B, from FIG. 4B to 5B and FIG. 6, a second embodiment of the present invention will be explained. An antenna sheet 1A of this embodiment differs from the antenna sheet 1 described in the first embodiment in that the slot holes 18 are formed in the projections connecting the antenna 8 and 9. Since the other features are similar to the first embodiment, like reference numerals are added to like parts and like parts are not explained repeatedly.

As shown in FIG. 6, the slot holes 18 are presented in the antenna connecting projections 8 and 9 of the antenna sheet 1A, and extend along the direction of the length L3 of the antenna connecting projections 8 and 9. A plurality of slot holes 18 are formed in the width direction W3 of the projections connecting the antenna 8 and 9. The slot holes 18 are formed so that, when the projections connecting the antenna 8 and 9 are attached to the antenna boss 25 of the IC module 20, the edges 25e of the antenna boss 25 are in the middle of the slot holes 18.

In the antenna sheet 1A formed in this way, if the junction section between the projections connecting the antenna 8 and 9 and the antenna projection 25 is subject to bending and the like and cracks occur in the width direction W due to because the edges 25e of the antenna boss 25 make contact with the antenna connecting bosses 8 and 9, when the cracks reach the slot holes 18, there is communication between the cracks moving in the width direction W and the slot holes 18 extending in the direction of the length L3, which stops the progression of the cracks in the width direction W.

Therefore, the cracks can be prevented from crossing the slot holes 18 and progressing in the width direction W of the projections connecting the antenna 8 and 9, and the breakage of the antenna coil 4 can be prevented.

Furthermore, since a plurality of slot holes 18 are formed in the width direction W of the projections connecting the antenna 8 and 9, when a crack has advanced beyond an outer side slot hole 18, another hole of groove 18 adjacent to this may prevent further progression of the crack.

<Third mode of realization>

Subsequently, referring to FIG. 1A to FIG. 5B, and from FIG. 7A to FIG. 7C, a third embodiment of the present invention will be explained. The antenna sheets 1B to 1D of this embodiment differ from the antenna sheet 1 described in the first embodiment in that the through holes 19B to 19D are formed in the substrate 2. Since the other features are similar to the first embodiment, like reference numerals are added to like parts and like parts are not explained repeatedly.

As shown in FIG. 7A, in the antenna sheet 1B, an approximately rectangular through hole 19B is formed in a region of the substrate 2 where the antenna coil 4 is not formed and penetrates the substrate 2. As shown in FIG. 7B, in the antenna sheet 1C, a plurality of approximately rectangular through holes 19C are formed in the region of the substrate 2 where the antenna coil 4 is not formed, which substrate 2 is created in a lattice fashion. As shown in FIG. 7C, in the antenna sheet 1D, a plurality of approximately circular through holes 19D are formed in rows in the region of the substrate 2 where the antenna coil 4 is not formed.

When the through holes 19B to 19D are thus formed in the substrates 2 of the antenna sheets 1B to 1D, the base materials (explained below) can be attached through the through holes 19B to 19D, when the materials base sticks to both sides of antenna sheets 1B to 1D. This can prevent detachment of the base materials from the antenna sheets 1B to 1D. The through holes 19B to 19D increase the flexibility of the antenna sheets 1B to 1D, make them lighter and allow the amount of material used for the substrate 2 to be reduced.

(Insertion)

ES 2 563 451 T3

Later, referring to FIG. 8A and FIG. 8B, an insert 40 including the IC input 30 described in the above embodiment will be explained.

As shown in FIGS. 8A and 8B, an insert 40 includes the inlet 30 described in the above embodiment and a pair of base materials 41 and 42 that press the inlet 30. The insert 40 is formed to a desired thickness T2 by pressing the inlet 30 between the base materials 41 and 42 and joining them in a single piece by lamination.

A porous base material, a base material having a fibrous structure or the like, is used as the base materials 41 and 42. For example, an insulating plastic film (PET-G: non-crystalline copolyester, PVC: vinyl chloride resin, etc.), or a synthetic insulating sheet (Teslin {trademark}, a synthetic polyolefin sheet manufactured by PPG Industries) or Yupo {trademark} a synthetic polypropylene sheet manufactured by Yupo Corporation).

Since the insert 40 includes the input 30 that includes the antenna sheet 1 described in the first embodiment, the antenna sheet 1 can prevent breakage of the antenna coil 4, the reliability of data communication can be increased and increase productivity. Furthermore, the base materials 41 and 42 can reinforce the connection points between the projections connecting the antenna 8 and 9 of the antenna sheet 1 and the antenna projection 25 of the IC module 20.

Therefore, an insert 40 can be presented in which breakage of the antenna coil 4 is prevented and which achieves highly reliable data communication and high productivity.

When using the input 30 that includes the antenna sheets 1B to 1D with the through holes 19B to 19D, described in the third embodiment, in the insert 40, the base materials 41 and 42 can be joined through the holes thru 19B to 19D.

This can increase the bond strength of inlet 30 to base materials 41 and 42 and prevents detachment of base materials 41 and 42 from inlet 30.

When the base materials 41 and 42 are forcibly detached, due to the difference in the bonding forces of the section in which they were bonded together and the section in which they were bonded to the inlet 30, the inlet is broken 30 by tearing the base materials 41 and 42. This can prevent unauthorized modification of the insert 40.

By forming the through holes 19B to 19D in the antenna sheet 1, the flexibility of the insert 40 can be increased, made lighter, and the amount of material used for the substrate 2 of the antenna sheet 1 can be reduced.

(Insert manufacturing method)

Later, a manufacturing method of insert 40 will be explained.

First, the inlet 30 is pressed between the pair of base materials 41 and 42 and joins them.

When the aforementioned synthetic sheets are used as the base materials 41 and 42, the CI input 30 is bonded to the base materials 41 and 42 using an adhesive lamination method that applies an adhesive to the antenna sheet 1 or to the faces of the base materials 41 and 42 that come into contact with the antenna sheet 1 and bond them at a relatively low temperature of, for example, about 70 ° C to 140 ° C.

As the adhesive, for example, EVA-based (ethylvinylacetate resin), EAA-based (ethylene acrylic acid copolymer resin), polyester-based, polyurethane-based and the like can be used.

Instead of applying an adhesive coating, an adhesive sheet using the resin used in the above-mentioned adhesives can be pressed between the antenna sheet 1 and the base materials 41 and 42.

When the aforementioned thermoplastic film is used as base materials 41 and 42, the inlet 30 is bonded to the base materials 41 and 42 using a thermal lamination method that melts them together by applying pressure to them while they are heated to a temperature exceeding the softening temperature of the base materials 41 and 42, for example, about 130 ° C to 170 ° C. To achieve a reliable melt bond, the aforementioned adhesive can also be used when using the thermal lamination method.

After the inlet 30 has been bonded to the base materials 41 and 42 to form a single piece, the external shape of this single desired piece is formed.

Therefore, the insert 40 shown in FIG. 8A and FIG. 8B.

ES 2 563 451 T3

Here, the softening temperature of the base materials 41 and 42 is approximately 100 ° C to 150 ° C for PET-G and approximately 80 ° C to 100 ° C for PVC.

As described in the first embodiment, the substrate 2 of the antenna sheet 1 is made from PEN or PET. The softening temperature of PEN is approximately 269 ° C and the softening temperature of PET is approximately 258 ° C. That is, compared to a thermoplastic material having a low softening point such as PET-G, which was used for substrates in conventional antenna sheets, the heat resistance temperature of the substrate 2 can be increased.

Consequently, when the base materials 41 and 42 and the inlet 30 are heated to approximately 130 ° C to 170 ° C, the base materials 41 and 42 soften, while the substrate 2 of the antenna sheet 1 does not. makes. Thus, when the input 30 including the antenna sheet 1 and the base materials 41 and 42 are laminated and joined by thermal lamination, even if heat is applied to the substrate 2 of the antenna sheet 1, it can be prevented substrate 2 to plasticize and flow. Therefore, the antenna coil 4 can be prevented from moving according to the flow of the substrate 2, and the reliability of data communication can be increased.

Even if the substrate 2 is heated above its softening temperature so that it is plasticized by the heat and flows, since the antenna coil 4 is created in the form of a film as described above, compared to an antenna coil of conventional wound wire, there is a greater contact area of ​​the antenna coil 4 with the substrate 2, through which the resistance to flow of the antenna coil 4 can be increased. Therefore, the antenna coil 4 can be prevented from moving in accordance with the flow of the substrate 2 and the reliability of data communication can be improved.

(Method for serial manufacturing of the antenna sheet, input and insertion)

Later, a method for mass production of the antenna sheet 1, IC input 30 and insert 40 described above will be explained. The following explanation focuses on a mass manufacturing method and will not explain other steps. For steps other than the mass manufacturing method, publicly known manufacturing methods may be used.

As shown in FIG. 9A, thin aluminum films are collectively formed on the substrate sheet 50 with a plurality of forming regions for the antenna sheets 1 arranged therein in a matrix. Next, the formed thin aluminum films are collectively patterned and an antenna circuit 3 is formed in each forming region 1a. Similar to antenna circuit 3, jumper wires 14 and reinforcement patterns 12 and 13 (see FIG. 1B) are collectively created in each forming region 1a on the back face of substrate sheet 50 relative to each other. with the face on which the antenna circuit is formed 3.

Subsequently, the terminal sections 5 and the terminal sections 11 of the antenna coil 4 of the antenna circuit 3 are collectively connected to the terminal sections 15 and 16 of the jumper cables 14. Resin sealing 23 of the IC modules 20 are presented collectively in the formation regions 1a. Next, the antenna sheets 1 that are collectively created in the plurality of forming regions 1a in the substrate sheet 50 are cut and separated as individual antenna sheets 1.

In this way, a large number of antenna sheets 1 can be mass produced collectively, and the productivity of manufacturing the antenna sheets 1 can be increased.

The IC module 20 is produced in series in parallel with the series production of the antenna sheets 1.

As shown in FIG. 9B, the connecting frames 21 are collectively formed in the forming regions 20a in a metal belt 60 in which a plurality of forming regions 20a are arranged in a matrix for the IC modules 20. Next, the IC chips 22 are collectively attached to the die bases 24 of the connection frames 21 in the forming regions 20a and the input / output panels of the IC chips 22 are collectively connected by bonding. wires to antenna bosses 25 (see FIG. 3B). The resin sealing sections 23 are collectively formed in each of the forming regions. The IC modules 20 are collectively formed in the forming regions 20a and then cut and separated as individual IC modules 20.

While the resin sealing section 23 of each separate IC module 20 is stored in the aperture 7 of each separate antenna sheet 1, the antenna sheets 1 and IC modules 20 are joined by resistance welding as above. previously described.

In this way, the inputs 30 can be mass-produced collectively and manufacturing productivity can be increased.

ES 2 563 451 T3

Subsequently, as shown in FIG. 10, a plurality of forming regions 40a are presented for inserts 40 in a first base material sheet 71 and in a second base material sheet 72. Inlets 30 are presented in each of the formation regions 40a of the first sheet of base material 71. Next, the second base material sheet is arranged at the inlets 30 so that the forming regions 40a of the first base material sheet 71 and the forming regions 40a of the second base material sheet 72 overlap. .

As in the manufacturing method of insert 40 described above, the base material sheets 71 and 72 are attached to the inlet 30 using a joining method that is suitable for the material quality of the base material sheet 71. The collectively formed inserts 40 are then cut into the forming regions 40a as necessary, with a plurality of inserts 40 joined together or with separate individual inserts 40.

In this way, inserts 40 can be mass produced collectively and manufacturing productivity can be increased.

(Electronic passport)

Later, an electronic passport 100 will be explained as an example of data carrier with the contactless type IC.

As shown in FIG. 11, an electronic passport 100 includes the insert 40 described above as the cover. A cover material 43 is attached to one face of the insert 40 and becomes the cover of the electronic passport 100.

When the cover material 43 is attached to the insert 40 in this way, the external appearance and texture of the thread 10 that includes the insert 40 may be similar to that of a conventional passport. Also, since the insert 40 includes the antenna sheet 1 described above, an electronic passport 100 can be provided in which breakage of the antenna coil 4 can be prevented and which has high data communication reliability and high productivity. .

The present invention is not limited to the embodiment described above. For example, the shape of the antenna coil need not be rectangular. The number of windings of the antenna coil 4 is not limited to the embodiment described above. Regarding the quality of the antenna circuit material, it can be made from a material other than aluminum, such as gold, silver or copper.

Since the terminal section 25 of the IC module 20 is normally made from copper, when the antenna coil 4 is made of copper, the connection section 8 of the antenna coil 4 and the terminal section 25 of the IC module 20 can be made of the same metal, which increases the bonding performance between connecting section 8 and terminal section 25.

As shown in FIG. 12, the perforations M can be formed in the antenna sheet 1. Once the IC input has been squeezed between the base materials and binds to them, when the base materials try to dislodge from the input, the stress is concentrated at the perforations M in the antenna sheet 1, whereby the antenna sheet 1 is cut along the perforations M and the antenna sheet 1 is broken. Therefore, an unauthorized modification of the data carrier with ICs of the contactless type can be prevented.

When an adhesive material is used to bond the gate to the base materials, the adhesive can be applied in a predetermined pattern so that the bonding force of the gate and the base materials is not uniform. As a consequence, when the base materials try to dislodge from the inlet, a non-uniform stress acts on the antenna sheet, cutting and breaking the antenna sheet. Therefore, an unauthorized modification of the data carrier with ICs of the contactless type can be prevented.

It is possible to form slot holes, extending along the projection connecting the antenna, at a single point across the width. This can increase the connection area between the boss connecting the antenna and the antenna boss.

It is not necessary for the opening to be formed in the substrate of the antenna sheet. Furthermore, the position of the opening is not limited to that described in the embodiment. For example, the opening can be formed along one side of the substrate. The entire CI module can be stored in the aperture. The shape of the aperture can be freely formed according to the shape of the IC module to be stored therein.

Base material openings for storage of at least a part of the IC module can be formed in the base materials that depress the input, in approximately the same position as the opening in the antenna sheet. As a consequence, when the inlet is pressed between the base materials, at least a part of the IC module can be stored in the openings of the base material, whereby the thickness of that section can be absorbed by the base materials and the insert can perform fine.

ES 2 563 451 T3

When the antenna sheet 1 shown in FIG. 4B is pressed between a pair of base materials and becomes a product, a storage section (an opening or a gap) having approximately the same shape as antenna boss 25 when viewed from above and antenna boss 25 can be stored in this storage section. A storage section (an opening or a gap) may be present which has approximately the same shape as the resin sealing shape of the IC chip 22 when viewed from above in the base material to be attached to the side opposite the side of the antenna boss 25 and the resin seal of IC chip 22 can be stored in this storage section.

With this configuration, when the antenna sheet 1 is pressed between a pair of base materials and becomes a product, the thickness of the product can be reduced and the antenna sheet 1 can be fixed more reliably by the pair of base materials. .

The junction section between the boss connecting the antenna and the antenna boss of the module, which are joined by resistance welding, can be covered with epoxy resin, urethane resin and the like. This can increase the reliability, vibration resistance, impact resistance, abrasion resistance and the like of the joint section.

Although the embodiment describes an electronic passport as an example of a data carrier with a contactless IC including an insert, the insert of the present invention can also be used, for example, in electronic identification documents and various types. of activity history documents that can be confirmed electronically.

When the input of the present invention is applied, for example, on a data carrier of the card type with an IC of the contactless type, such as a transport voucher with an IC or an electronic purse card, the antenna sheet including The input can prevent breakage of the antenna coil of the IC transport ticket, the electronic purse card and the like, increasing the reliability of data communication and increasing productivity.

<Fourth mode of realization>

An information medium of the contactless type (hereinafter abbreviated as "information medium") according to a fourth embodiment of the present invention will be explained based on the drawings.

FIG. 13 is a perspective view of a booklet 101 that includes an information medium 110 of this embodiment. The information medium 110 is clamped while being pressed between one of the two cover elements 102, which constitute a front cover and a rear cover of the booklet 101 and an internal bonding sheet 103 that is attached to that cover element 102. A plurality of sheets of text 104 are bound between the front cover and the back cover, which allows the booklet 101 to be used for various purposes such as a passbook.

Incidentally, the information medium 110 may be fixed to the face of one of the cover elements 102 of the booklet 101. In this case, the information means 110 is preferably fixed to the inner face of the cover element 102 (the face wherein the cover elements 102 touch the text sheets 104), rather than on the outer face. This configuration can protect the information medium 110 from external collisions against the booklet 101.

Alternatively, the information medium 110 may be attached to one of the pages of the text sheets 104 of the booklet 101. For example, a predetermined page of the text sheets 104 is given a larger area than the other pages. and it is folded so that that area becomes the same as on the other pages, which allows the information medium 110 to be stored in a space formed by the folded section. The folded section is sealed by a method such as gumming or binding.

FIG. 14 is a view showing a mold of an IC input 111 constituting a part of the information medium 110. The IC input 111 includes an insulating sheet 112, an antenna coil 113 formed on both sides of the sheet 112, and a IC chip 114 attached to sheet 112.

Various types of resins such as polyethylene terephthalate (PET) can be suitably used as the sheet material 112. The antenna coil 113 is formed by a method such as etching, wire welding or printing, using a conductor such as aluminum or silver. Of these, aluminum is inexpensive, which makes it preferred when considering manufacturing cost. The antenna coil 113 includes an antenna loop 113A provided on one face of the antenna coil 113 and a jumper wire 113B provided on another face. The end of the jumper wire 113B is electrically connected to the antenna loop 113A through the through hole (not shown) presented in the sheet or by a method such as pressing.

IC chip 114 is electrically connected to antenna coil 113 by soldering or the like and is

ES 2 563 451 T3 attached to sheet 112. This allows the input of IC 111 to transmit and receive data from / to an external data reading device and the like in a non-contact manner.

FIG. 15 is a cross-sectional view of an information medium 110 attached to a booklet 101. The information medium 110 is formed by using two porous sheet-like base materials 115 that press the IC input 111 above and below. The CI inlet 111 and the porous base materials 115 are joined in one piece by an adhesive 116.

In connection with a manufacturing step of the information medium 110 described below, the porous base materials 115 should preferably have thermoplasticity. Specifically, a base material can be obtained if a resin such as polyethylene, polypropylene, polyvinylchloride, polyvinylidene chloride, polystyrene, polyvinyl acetate, polyester or a combination of these resins is used, which is subjected to a process such as mixing with porous particles such as silica, foaming by adding air during kneading and stretching followed by punching. Since this type of base material is commercially available as resin sheet and synthetic paper in which the printability is given by inkjet, offset and the like, these can be used.

Similarly, adhesive 116 is preferably hot melt. Specifically, adhesives made from various types of thermoplastic resins, such as ethylvinylacetate copolymer (EVA) -based, ethylene-acrylic acid copolymer (EAA) -based, and ethylene-acrylic acid copolymer (EAA) -based can be suitably used. ethylene methyl acrylic acid, polyester-based, polyamide-based, polyurethane-based, and olefin-based.

A substance that is resistant to chloride ions is mixed into the adhesive 116 and prevents permeation of chloride ions. That is, the layer that includes the adhesive 116 also functions as a chloride ion resistant layer, which covers the antenna coil 113 formed at the input of CI 111 and prevents chloride ions from coming into contact with the coil of antenna 113, thereby preventing deterioration such as corrosion. Such an adhesive 116 can be easily obtained by adding an epoxy-based crosslinking agent to an EAA-based aqueous emulsion adhesive or using a gravure coating to apply an acrylic emulsion adhesive and the like according to a predetermined coating thickness, etc.

In order to form a chloride ion resistant layer using adhesive 116, in addition to the quality of the material, the thickness of the layer formed by adhesive 116 must also be taken into account. Several tests were carried out to clarify the relationship between these. .

The methods used in the tests will be explained.

(Test samples)

By using a “TESLIN sheet” (a product manufactured by PPG Industry; thickness = 380 pm) as porous base materials, an IC input having an aluminum antenna coil was squeezed and attached to a sheet made from PET.

As the adhesive, three types of conventional adhesives were used: an EMAA-based adhesive, an EMAA-based adhesive containing an epoxy-based crosslinking agent, and an acrylic-based 116 adhesive; coating thickness and additive amounts varied. These samples were used in a salt water spray test described below.

Samples were also created in which each of the adhesives meeting these conditions was applied directly to the IC inlet without squeezing it between the porous base materials and these samples were used in a hydrochloride assay described below.

(Test 1: Salt water spray test)

A salt water spray test was carried out according to ISO10373-1 and the results were evaluated in the following three steps.

A: No corrosion, B: Partial corrosion, C: Total corrosion and poor performance.

(Test 2: Hydrochloride test)

An exclusively established method for testing, carried out according to the following procedures.

(1) A drop of 2N hydrochloride (HC1) was put on each sample, obtained by applying each type of adhesive directly to an IC inlet, which was then covered from above with a PET film so as not to dry out.

(2) Each sample was then placed in an oven at 80 ° C and the time it took for the aluminum to

ES 2 563 451 T3 melt.

Table 1 shows the results obtained for each sample in Test 1 and Test 2.

Table 1

<td>Adhesive</td><td>Coating thickness</td><td>Essay 1</td><td>Essay 2</td>

<td>EMAA based thermoplastic adhesive</td><td>4 pm</td><td>C</td><td>1 minute</td>

<td>EMAA based thermoplastic adhesive</td><td>8 pm</td><td>C</td><td>2 minutes</td>

<td>EMAA based thermoplastic adhesive</td><td>12 pm</td><td>B</td><td>4 minutes</td>

<td>EMAA based thermoplastic adhesive + 1% epoxy based crosslinking agent</td><td>4 pm</td><td>B</td><td>3 minutes</td>

<td>EMAA based thermoplastic adhesive + 5% epoxy based crosslinking agent</td><td>4 pm</td><td>TO</td><td>10 minutes</td>

<td>Thermoplastic acrylic based adhesive</td><td>4 pm</td><td>B</td><td>3 minutes</td>

<td>Thermoplastic acrylic based adhesive</td><td>8 pm</td><td>TO</td><td>8 minutes</td>

As shown in Table 1, the results of Test 1 and Test 2 indicated a consistently good correlation. Samples that were bonded using only an EMAA-based thermoplastic adhesive in a conventional way could not obtain sufficient durability against salt water spray, even when the thickness of the adhesive coating was increased.

In contrast, when an epoxy-based crosslinking agent was added to the EMAA-based thermoplastic adhesive, the adhesive becomes resistant to chloride ions. Durability was improved by increasing the mix ratio of the epoxy-based crosslinking agent.

In addition, acrylic-based adhesives had greater durability against salt water spray than EMAA-based adhesives and were resistant to chloride ions. The resistance to chloride ions was increased by making the coating thicker.

The above results indicate that by adjusting the mixing ratio of a substance that is resistant to chloride ions or by selecting an adhesive made from a material that is resistant to chloride ions and adjusting the thickness of the coating, A chloride ion resistant layer can be formed having a desired resistance to chloride ions.

A method for manufacturing an information medium 110 configured as described above will be explained.

First, an antenna coil 113 is manufactured by providing an antenna loop 113A and a jumper wire 113B on a sheet 112. An IC chip 114 is connected to the antenna coil 113 to form a Ci input 111. Up to At this point, the method is similar to a conventional method for manufacturing an IC input.

As shown in FIG. 16, to achieve a good bond between the CI inlet 111 and the porous base materials 115, the periphery of the sheet 112 is cut; furthermore, a region of the sheet 112 that is within the antenna loop 113A is eliminated, which forms a through hole 112A that penetrates in the direction of the thickness of the sheet 112.

The through hole 112A can be suitably formed using a punch mold. Therefore, even in cases such as where IC inputs are mass-produced by forming many antenna coils on a single large sheet, punching allows many through-holes to be made easily.

With respect to achieving good bonding with the porous base materials, the size of the through hole 112A is preferably set such that the area of ​​a cross section that intersects octagonally in the thickness direction of the through hole 112A occupies 60 % or more of the innermost region enclosed in the antenna of the antenna loop 113A. With respect to the same point, the area of ​​the sheet 112 is preferably set at not less than 3% and less than 20% of the area of ​​the porous base material 115 to which it is attached.

One face of each of the two porous base materials 115 formed to a suitable size is coated with an adhesive 116 which has been made resistant to chloride ions as described above. The adhesive coated faces 116 are disposed opposite the CI inlet 111, which is then squeezed and exerted by the porous base materials 115 above and below. In this way, a chloride ion resistant layer including adhesive 116 is formed so that it covers antenna coil 113.

When the porous base materials 115 are made from thermoplastic resin, if heat is applied to it

ES 2 563 451 T3 time pressure is applied, the porous base materials 115 soften and deform, through which projections and voids on the surface of an IC input 111 due to IC chip 114 and the like are absorbed by the porous base materials 115. As a result, an information medium 110 having a flat top and bottom faces can be obtained.

A conventional method of manufacturing an IC card and the like can be used in the above process, which can be carried out using, for example, a heat press.

As shown in FIG. 15, the information medium 110 obtained in this way is pressed between the front cover member 102 and the inner bonding sheet 103 and, when they have been joined in one piece using an adhesive (not shown), can be obtained the booklet 101 which includes the information medium 110.

The porous base materials 115 that make up the outer faces of the information medium 110 have a good and close fixation to various types of adhesive and therefore can be excellently bonded without problems, even when using an emulsion-based adhesive. in water and the like used in the binding of a conventional booklet. Furthermore, since the outer faces of the information medium 110 are formed flat without projections or gaps, the information medium 110 can be attached without spoiling the external appearance of the booklet 101.

When the cover members 102 are attached to the information medium 110, it is preferable to use a reaction cure type adhesive without a change in volume. When using a volume change dry cure type adhesive, if a part of the information medium includes projections and voids, the amount of adhesive used will increase in the voids. As a result, there is a further reduction in volume when it dries and there are cases where the external appearance is spoiled due to the partial collapse of the covering elements 102 and the like that overlap the voids.

As the adhesive without change in volume, for example, an epoxy-based adhesive of the mixed two-part type, a silicone-based adhesive of the moisture-curing type, a urethane-based adhesive of the curing type can be used. on the one hand and the like. Various hot melt adhesives can also be used, such as EVA-based, EAA-based, polyester-based, polyamide-based, polyurethane-based, and olefin-based. Of these adhesives, from the standpoint of performance and durability, a reactive type hot melt adhesive is preferred.

Next, the information medium 110 and the booklet 101 of this embodiment will be explained using examples.

(Examples)

1. Create a CI entry

A PET sheet having a thickness of 38 microns (pm) was used as sheet 112. Aluminum deposition and printing of a mask layer having the same shape as antenna coil 113 was carried out on both sheet faces 112 and a pattern etching was used to form an antenna loop 113A on one side and a jumper wire 113B on the other side. In addition, the antenna loop 113A and the jumper wire 113B were joined by caulking and an IC chip 114 was soldered to the connection terminal section of the antenna coil 113.

FIG. 17 shows the dimensions of each section of a 110A information medium in this test. The outer periphery of the approximately square antenna loop 113A is 80 millimeters (mm) x 48mm and its inner periphery is 67mm x 37mm.

Subsequently, a portion of sheet 112 that is within antenna loop 113A was punched to form a through hole 112A having an approximately 65mm x 35mm square shape. Furthermore, leaving an outline that is 2mm from the outer periphery of the antenna loop 113A and the IC chip 114, the sheet 112 that was further from the outside than that was removed by drilling. Therefore, the orthogonal cross-sectional area in the thickness direction of the through hole 112A becomes about 91% of the region within the periphery of the antenna loop 113A. Thus, the entry of CI 111 occurred.

two. Preparation of porous base materials

A Teslin sheet (a product manufactured by PPG Industries; thickness: 380 pm) was used as the material for the 115 porous base materials. An adhesive was applied, obtained by mixing 1 part by weight of a soluble epoxy curing agent with 20 parts by weight of an EMAA-based aqueous emulsion adhesive (AC-3100, a product manufactured by Chuo Rika Kogyo Corporation) to one side of each sheet with an amount of 5 g / m² (coating thickness: approximately 5 pm). After drying, two 150mm x 200mm sheets were cut, obtaining the porous base materials 115. At this point, the area of ​​the CI 111 inlet was 15% of the area of ​​the porous base materials 115.

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Next, a hole corresponding in size to the IC chip connection frame 114 was drilled to one of the porous base materials 115, and a hole corresponding in size to the IC chip mold 114 was drilled in the other porous base material 115.

3. Manufacture of the information medium

The CI inlet 111 and the porous base materials 115 were arranged so that the reading frame and IC chip template 114 were stored in the holes formed in the respective porous base materials 115. Next, the CI inlet CI 111 was laminated by pressing it up and down by the porous base materials 115 and was temporarily fastened by local heating.

The porous base materials 115 and the CI inlet 111 that were temporarily clamped by local heating were squeezed between two stainless steel plates and subjected to heating and pressurization to fully bond, thus obtaining the information medium 110A. Heating and pressurization conditions were suitably adjusted between a heating unit temperature of 100 ° C to 160 ° C, pressure of 5 kgF / cm² at 30 kgF / cm² and a processing time of 15 seconds to 120 seconds.

Four. Attachment to the booklet

A booklet cover fabric (Enviromate H, a product manufactured by ICG Holliston) was used as the material for the cover elements 102. This was cut to the same size as the information medium 110A to obtain the cover elements 102.

A moisture cure hot melt adhesive (Esdain 9635, a product manufactured by Sekisui Fuller Corp.) was melted with a hot roll coater and an amount of 20 g / m2 was applied.² to the coverage elements. The outer faces of the porous base materials 115 of the information medium 110A were affixed to the cover members 102 coated with the hot melt adhesive, pressurized with rollers, and thereafter subjected to an aging process.

Subsequently, a plurality of text sheets 104 and an inner tie sheet 103 are assembled and their centers are sewn using a sewing machine, thus making a text section with the inner tie sheet 103 attached to an outer section. Next, a water-based emulsion adhesive (SP-2850, a product manufactured by Konishi Corp.) was applied in an amount of 20 g / m² to the porous base materials 115 on the side of the information medium 110A opposite the side fixed to the cover elements 102 and the porous base materials 115 were fixed to the inner bonding sheet 103. Thus, the obtained booklet is opened and is cut to 125mm x 180mm, resulting in a booklet 101. That is, the dimensions of the porous base materials 115 shown in FIG. 17 are the dimensions when the booklet 101A is folded.

(Comparative example)

In a comparative example, although the entry of CI 111 was performed using the same method as in the example, the size of the through hole 112A was 40 mm x 30 mm. The cross-sectional area orthogonal to the thickness direction of the through hole 112A was approximately 48% of the region within the periphery of the antenna loop 113A.

Furthermore, the CI 111 input was attached to a booklet using the same procedure as in the example, to obtain a booklet having approximately the same external appearance.

The front and back covers of the booklet 101A of the example manufactured as described above are uniformly formed, with no projections or gaps being generated by the attachment of the information medium 110A. Furthermore, in various durability evaluation experiments, including storing it in an environment with high temperature and high humidity and exposing it to a bending test, the CI 111 input did not suffer deterioration, especially from the antenna coil 113 and therefore , excellent results were achieved.

When trying to remove only the IC input from the comparative example booklet, in the comparative example booklet, the IC input could be separated from the porous base materials and removed without breaking the antenna coil. On the other hand, in the example booklet 101A, when attempting to peel off the porous base materials 115, since the porous base materials 115 are directly and firmly attached in the through hole 112A with a large area and around the inlet of CI 111, a part of the antenna coil 113 and the porous base materials 115 broke and the CI 111 inlet could not be removed in a serviceable state.

According to the information medium 110 of this embodiment, when the CI input 111 is pressed between the porous base materials 115, which have been coated with the chloride ion resistant adhesive 116 and binds to them in As a single piece, a chloride ion resistant layer is formed so that it covers the antenna coil 113 which includes the antenna loop 113A and the jumper wire 113B. Therefore, even when the

ES 2 563 451 T3 information medium 110 is fixed to a booklet, the chloride ions that penetrate the covering elements 102 and the internal bonding sheet 103 are prevented from reaching the antenna coil 113 and acting on it, by means of which excellently prevents the deterioration of the antenna coil 113. Therefore, even when the information medium is applied in a booklet, a configuration can be achieved in which the information medium operates with high reliability for a long period of time.

In addition, since the IC input 111 is pressed up and down by the porous base materials 115, the projections and voids due to the IC chip 114 and the like are absorbed by the porous base materials 115, through which the information medium can be configured with uniform upper and lower faces. As a result, even when the information medium 110 is applied in a booklet, the external appearance is not spoiled.

Furthermore, since the through hole 112A is present in the sheet 112 of the CI inlet 111, at the point of the through hole 112A, the porous base materials 115 are firmly fixed by the adhesive 116 without the sheet 112 between them. Therefore, all of the information medium 110 can be stably joined. Also, it is difficult to extract only the CI input for counterfeiting and the like, so the security can be increased.

Although the preferred embodiments of the invention have been described above, the technical field of the invention is not limited to these embodiments and can be modified in various ways, without departing from the spirit or scope of the present invention.

For example, while each embodiment describes an example in which the adhesive 116 is resistant to chloride ions, the chloride ion resistant layer can be formed instead using a chloride ion resistant substance other than adhesive 116, such as an epoxy-based resin.

In this case, the chloride ion resistant layer can be formed at the CI 111 inlet by a coating method or it can be formed on the faces of the porous base materials 115 that will bond to the CI 111 inlet. In the latter case, a chloride ion resistant layer and an adhesive can be formed on the surfaces of porous base materials using a printing device and the like that can perform multi-color printing, allowing two layers of effectively without modifying the process much.

The through hole formed in sheet 112 is not limited to the single hole described in the embodiments. For example, a plurality of through holes 112B and 112C may be present, as in the modifications shown in FIG. 18A and FIG. 18B. This configuration achieves a plurality of dispersed points where the porous base materials are firmly bonded, achieving a highly secure information medium that is more difficult to dislodge.

Although each embodiment describes an example of an information medium in which the IC input is pressed into the porous base materials, the information medium can be configured without presenting porous base materials and with an ion-resistant layer. chloride formed directly at the CI inlet. Although such an information medium is slightly less uniform than that including porous base materials, it can be applied in a booklet if an adhesive is properly selected to bond it to the front cover member and inner bonding sheet. Therefore, it becomes possible to eliminate the deterioration of the antenna coil and the functions of the information medium are ensured, while using the booklet for a long period of time.

The fourth embodiment described above can be applied in any of the first to third embodiment. For example, the antenna coil 4 from the first to third embodiments can be covered with the adhesive 116 which forms the chloride ion resistant layer of the fourth embodiment.

Furthermore, an adhesive that is not resistant to chloride ions can be applied to the antenna coil 4 and then this adhesive can be covered with a layer resistant to chloride ions.

In the fourth embodiment described above, the porous base materials in sheet form 115 that press the antenna coil 113 so that they cover it can be presented on both sides of the sheet 112 in its entirety and the adhesive 116 that constitutes A chloride ion resistant layer can be formed on the faces of the porous base materials 115 that are opposite the sheet 112. This allows resistance to chloride ions to form easily; furthermore, both faces of the contactless type information medium 110 may be flat and when the information medium 110 is attached to the booklet, projections and gaps are less likely to be generated on the page to which it is attached.

As described in the fourth embodiment, when the porous base materials 115 are attached by the adhesive 116 to the sheet 112, since the adhesive 116 is resistant to chloride ions, it functions as a layer resistant to chloride ions. chloride. This enables the chloride ion resistant layer to be formed at the same time as the porous base materials are set, thus increasing manufacturing efficiency.

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Furthermore, as described in the fourth embodiment, sheet 112 includes a through hole 112A that penetrates in the thickness direction of sheet 112 and porous base materials 115 are joined in through hole 112A without sheet 112 between. media, whereby the porous base materials 115 are joined directly through the through hole. Therefore, the porous base materials 115 can be more firmly attached and the security can be increased.

Furthermore, as described in the fourth embodiment, the cross-sectional area in the direction in which the line of the axis of the through hole 112A intersects orthogonally is given a value that is not less than 60% of the area of ​​the region within the loop of antenna coil 113; likewise, the area of ​​the sheet 112 at the time of bonding to the porous base materials 115 is not less than 3% and less than 20% of the area of ​​the porous base materials 115, through which the base materials porous 115 can bond more firmly.

Furthermore, as described in the fourth embodiment, since the antenna coil 113 includes aluminum, it can be formed economically and reliably.

Furthermore, as described in the fourth embodiment, by applying the contactless type information medium 110 to the booklet 101, the antenna coil 113 of the contactless type information medium 110 attached to the booklet 101 is less likely to deteriorate and can be used stably for a long period of time.

Although the fourth embodiment describes a case in which the adhesive 116 forms a chloride ion resistant layer so that it covers the antenna coil 113, this is not limiting of the invention. For example, in addition to or instead of a chloride ion resistant layer, a water resistant layer may be formed to cover the antenna coil 113.

As the material for a waterproof layer, rubber latex such as natural rubber latex and styrene butadiene copolymer latex, vinyl acetate-vinyl chloride based resin, polyester based resin, polyurethane based resin, resin can be used. with (meta) acrylic base such as alkyl ester / acid (meta) acrylate-styrene, alkyl ester / meta (acrylic acid) copolymer or epoxy based resin, etc.

Industrial applicability

When a product is manufactured using a base material such as paper to press the IC module, the present invention can be applied on an antenna sheet, a transponder, a booklet and the like, which can make the product thin.