EP3970184A4
Method of measuring misregistration in the manufacture of topographic semiconductor device wafers
Abstract
This record has no abstract on file.
Term
13.4 yearsto projected expiry
Projected expiry 14 February 2040, counted from filing; an application has no term until it is granted.
- Priority
- Filed
- Published
- Today
- Projected expiry
10 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| CN106933046A | Cites | China | Search report |
| US2006098199A1 | Cites | United States of America | Search report |
| US2015160073A1 | Cites | United States of America | Search report |
| US2018342063A1 | Cites | United States of America | Search report |
| US7170604B2 | Cites | United States of America | Search report |
| See also references of WO 2020168140A1 | Non-patent | – | Search report |
22 members in 5 offices
Priority claims7
| Document | Office | Kind | Date |
|---|---|---|---|
| 201962805737P | United States of America | – | |
| 201962805737 | United States of America | P | |
| 201962864323P | United States of America | – | |
| 201962864323 | United States of America | P | |
| 201962870264P | United States of America | – | |
| 201962870264 | United States of America | P | |
| 2020018200 | United States of America | W |
Members22
| Document | Office | Kind | |
|---|---|---|---|
| WO2020168140A1 | World Intellectual Property Organization (WIPO) | A1 | |
| WO2020168142A1 | World Intellectual Property Organization (WIPO) | A1 | |
| WO2020168140A9 | World Intellectual Property Organization (WIPO) | A9 | |
| WO2020168142A9 | World Intellectual Property Organization (WIPO) | A9 | |
| TW202043757A | Taiwan Province of China | A | |
| TW202043758A | Taiwan Province of China | A | |
| US2021191279A1 | United States of America | A1 | |
| US2021200104A1 | United States of America | A1 | |
| EP3931865A1 | European Patent Office (EPO) | A1 | |
| US11281112B2 | United States of America | B2 | |
| EP3970184A1 | European Patent Office (EPO) | A1 | |
| US2022171296A1 | United States of America | A1 | |
| JP2022529077A | Japan | A | |
| JP2022530842A | Japan | A | |
| US11573497B2 | United States of America | B2 | |
| EP3931865A4 | European Patent Office (EPO) | A4 | |
| EP3970184A4This record | European Patent Office (EPO) | A4 | |
| JP7254217B2 | Japan | B2 | |
| TWI814987B | Taiwan Province of China | B | |
| TWI821524B | Taiwan Province of China | B | |
| US11880141B2 | United States of America | B2 | |
| JP7595599B2 | Japan | B2 |
12 legal events, as 2 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | Office | |
|---|---|---|---|
| Opt-out of the competence of the unified patent court (upc) registeredP01 | P01 | EP | |
| Supplementary search report drawn up and despatchedA4 | A4 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Amendment of ipc main classPREVIOUS MAIN CLASS: H01L0021670000R079 | R079 | DE | |
| Request for validation of the european patent (deleted)DAV | DAV | EP | |
| Request for extension of the european patent (deleted)DAX | DAX | EP | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: REQUEST FOR EXAMINATION WAS MADESTAA | STAA | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADESTAA | STAA | EP |
Numbers
- Publication
- 3970184
- Application
- 207561507
Titles3
- German
- VERFAHREN ZUR MESSUNG VON FEHLREGISTRIERUNGEN BEI DER HERSTELLUNG VON HALBLEITERWAFERN
- English
- METHOD OF MEASURING MISREGISTRATION IN THE MANUFACTURE OF TOPOGRAPHIC SEMICONDUCTOR DEVICE WAFERS
- French
- PROCÉDÉ DE MESURE DE DÉFAUT D'ALIGNEMENT DANS LA FABRICATION DE TRANCHES DE DISPOSITIF À SEMI-CONDUCTEUR TOPOGRAPHIQUE
Classification
- CPC, 8
- G03F7/70633
- H10P74/27
- H10P74/203
- H10P74/23
- G06T7/0004
- G06T2207/30148
- G03F7/70641
- G03F7/70683
- IPC, 4
- H01L21 66
- G03F7 20
- H10P72 00
- H10P72 50
Designated states1
- Contracting states, 1
- Türkiye