EP3579291A3

Method of forming niobium nitride electrode for capacitor

Abstract

A method of manufacturing a semiconductor device includes forming a preliminary lower electrode layer on a substrate, the preliminary lower electrode layer including a niobium oxide; converting at least a portion of the preliminary lower electrode layer to a first lower electrode layer comprising a niobium nitride by performing a nitridation process on the preliminary lower electrode layer; forming a dielectric layer on the first lower electrode layer; and forming an upper electrode on the dielectric layer.

EP3579291A3, drawing sheet 1
Sheet 1 of 1

Term

12.6 yearsto projected expiry

Projected expiry 10 May 2039, counted from filing; an application has no term until it is granted.

  1. Priority
  2. Filed
  3. Published
  4. Today
  5. Projected expiry

1 sheet

  1. Sheet 1