EP2992829A1

Ultrasound probe with optimized thermal management

Abstract

An ultrasound probe comprising a housing, a transducer assembly operable to transmit ultrasonic energy towards a zone of the probe adapted to be acoustically coupled to an object or area of interest, a cooling system comprising a heat transfer device arranged to transfer heat generated by the transducer assembly to one or more regions or areas located outside such transducer assembly. The heat transfer device comprises a graphene-based material.

EP2992829A1, drawing sheet 1
Sheet 1 of 6

Term

7.9 yearsto projected expiry

Projected expiry 2 September 2034, counted from filing; an application has no term until it is granted.

  1. Priority and filed
  2. Published
  3. Today
  4. Projected expiry

18 claims: 5 independent, 13 dependent

  1. 1
    An ultrasound probe comprising:a) a housing (6);b) a transducer assembly (1) operable to transmit ultrasonic energy towards a zone of the probe adapted to be acoustically coupled to an object or area of interest;c) a cooling system comprising a heat transfer device (2, 5) arranged to transfer heat generated by the transducer assembly to one or more regions or areas (103, 7) located outside such transducer assembly (1), characterized in that such heat transfer device (2, 5) comprises a graphene-based material.
  2. 13
    Probe according to any claim 7 to 12, wherein the heat storing device (7, 103) is a thermostating device based on Phase Change Material (PCM), able to absorb heat maintaining the temperature constant.
  3. 14
    Probe according to any claim 7 to 13, wherein the heat storing device (7, 103) comprises graphene, such heat storing device being arranged to fill available spaces inside the probe housing (6) to temporarily store heat drained away from the transducer assembly (1).
  4. 15
    Probe according to any claim 7 to 14 wherein the heat storing device (7, 103) comprises a composite material including a PCM and a filler charged with graphene.
  5. 17
    Probe according to any claim 7 to 16, wherein the heat storing device (7, 103) is an organic reversible PCM that accumulates heat in the form of latent heat while changing phase from solid to liquid and releases accumulated heat when changing phase from liquid to solid.