A lighting device and corresponding method of assembly

Technical field

0001The present invention relates to lighting devices.

0002One or more embodiments may refer to solid-state lighting devices, such as LED lighting devices.

Technological Background

0003In integrating the structure of a solid-state lighting device, for example in general lighting applications, some requirements are to be met, e.g.: <ul id="ul0001" list-style="dash" compact="compact"><li>achieving steady and reliable protection conditions (for example as Ingress Protection, IP grade),</li><li>offering a simple assembling and fixation process,</li><li>efficiently adjusting the tolerances of the parts being assembled, also with reference to ambient conditions (e.g. in order to take into account the day-night temperature variations).</li></ul>

0004Various integrated solutions may employ, for example, rather complex mechanical connections and/or additional components/processes, such as for example screws (either self-threading or not), brackets, gaskets, additional mechanical fixation structures, that affect the overall performance due to the interaction of the various components.

0005Various solutions may create rather bulky and complex structures, which may affect the compactness of solid-state lighting sources (for example LED lighting sources) and which may not enable to reduce the complexity of the mounting system.

Object and Summary

0006The need is therefore felt of solutions adapted to overcome the above-mentioned drawbacks.

0007One or more embodiments aim at satisfying such requirements.

0008According to one or more embodiments, said object is achieved thanks to a lighting device having the features specifically set forth in the claims that follow.

0009One or more embodiments may refer to a corresponding method.

0010The claims are an integral part of the technical teaching provided herein with reference to the invention.

0011One or more embodiments may offer one or more of the following advantages: <ul id="ul0002" list-style="dash" compact="compact"><li>a high level of isolation (sealing) with the ability of absorbing mechanical tolerances,</li><li>availability of a reliable and standardized coupling system with high levels of isolation (sealing) also as regards the ability of absorbing small displacements due to ambient conditions,</li><li>stable fixation during the device lifetime, and protection against climatic and/or temperature variations.</li></ul>

Brief description of the Figures

0012One or more embodiments will now be described, by way of non-limiting example only, with reference to the enclosed figures, wherein: <ul id="ul0003" list-style="dash" compact="compact"><li><figref idref="f0001">Figure 1</figref> schematically shows a lighting device according to embodiments,</li><li><figref idref="f0002">Figures 2 and 3</figref> schematically show possible details of embodiments,</li><li><figref idref="f0002">Figure 4</figref> shows a possible geometry of embodiments, and</li><li><figref idref="f0003">Figures 5 to 7</figref> show various possibilities to implement embodiments.</li></ul>

Detailed Description

0013In the following description, numerous specific details are given to provide a thorough understanding of various exemplary embodiments. One or more embodiments may be practiced without one or more specific details, or with other methods, components, materials, etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the embodiments. Reference throughout this specification to "one or more embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

0014The headings provided herein are for convenience only and do not interpret the scope or meaning of the embodiments.

0015The following description relates to one or more embodiments of a solid-state lighting device (module or system), e.g. a LED lighting device, wherein the general problem arises of mutually connecting (at least) two components A and B, made of the same material or of different materials.

0016One or more embodiments may involve the connection of said parts or components while providing a certain degree of protection against the intrusion of solid components ("Ingress Protection" or IP degree, according to the current terminology in the field).

0017The Figures refer to two components denoted in general by A and B, which generally represent two parts of a solid-state lighting device, e.g. a LED lighting device.

0018For merely exemplary and non-limiting purposes such a device, denoted on the whole by 100, may include a solid-state light radiation source L, which may be single or plural, e.g. comprising a LED array mounted on the base plate 12.

0019As shown in <figref idref="f0001">Figure 1</figref>, in one or more embodiments source L may then be applied onto a heat sink with a cover made of light-permeable (e.g. transparent) material, optionally with optical features (e.g. a lens).

0020One or more embodiments may therefore refer to a lighting device 100 adapted to house a lighting source L arranged between a first component A and a second component B.

0021In one or more embodiments, as exemplified herein, parts or components A and B to be mutually connected, while providing device 100 with a certain protection against the intrusion of solid components (e.g. IP degree) may be a cover (component A) and a heat sink (component B), which are mutually connected along corresponding facing edges surrounding source L.

0022In one or more embodiments, this may take place in the manners exemplified in <figref idref="f0002 f0003">Figures 2 to 7</figref> wherein, for simplicity of illustration, there are shown in an ideal cross-section only said facing edges, denoted by A and B. It will therefore be assumed that, in one or more embodiments, the joining arrangements exemplified in <figref idref="f0002 f0003">Figures 2 to 7</figref> are reproduced along the whole length of said facing edges surrounding source L (for example extending along a path which may be quadrangular, circular, elliptical, polygonal, mixtilinear, etc.).

0023In one or more embodiments, in order to ensure a protection for device 100 (for example an IP protection), a material may be used for sealingly coupling (e.g. fixing) components A and B.

0024In one or more embodiments, such a sealing coupling between parts A and B may comprise a sub-system made of different materials.

0025For example, <figref idref="f0002">Figure 2</figref> refers to possible embodiments wherein such a sub-system may be a layered structure including three materials G1, G2 and G3.

0026In one or more examples, material G1 may be a solid glue, material G2 may be an elastic glue and material G3 may be a solid glue (which may be the same as, or different from solid glue G1).

0027On the other hand, the diagram in <figref idref="f0002">Figure 3</figref> exemplifies embodiments wherein the layered structure includes two materials G1 and G2, which may consist for example in a solid glue and an elastic glue.

0028The presence in the layered structure G1, G2, G3 (<figref idref="f0002">Figure 2</figref>) or G1, G2 (<figref idref="f0002">Figure 3</figref>) of a component - i.e. a layer, for example glue G2 - which is resiliently deformable enables, in one or more embodiments, to ensure a correct coupling (e.g. fixation) between components A and B, while ensuring a certain deformability (flexibility) of the assembly.

0029In one or more embodiments, the obtained device 100 is adapted to "change its shape" thanks to the elongation / the displacement of the mutual position of components A and B, due to the possible relative 3D movement (in the directions X, Y, Z), for example due to ambient conditions.

0030This may be true irrespective of whether the components are made of the same material or of different materials. This is made possible by the coupling (sealing) system which is adapted to resiliently (for example elastically) change its shape according to the various possible illustrated arrangements.

0031In one or more embodiments, the arrangement of three layers G1, G2, G3 in <figref idref="f0002">Figure 2</figref> may ensure a sealing between components A and B, while layer G2 (which in the illustrated example is sandwiched between layers G1 and G3) is able to absorb displacements in any direction X, Y, Z of component A with respect to component B (or vice versa; of course, the movement is relative), without losing the IP protection and without inducing tensions, stresses or damages into components A and B.

0032Similar statements may apply to the structure with two layers, G1 and G2, exemplified in <figref idref="f0002">Figure 3</figref>, having layer G2 coupled to layer G1.

0033<figref idref="f0002">Figures 2 and 3</figref> exemplify embodiments wherein the edges of mutually coupled components A and B have generally planar opposing faces (with the interposition of layers G1, G2 and, in the case of <figref idref="f0002">Figure 3</figref>, G3).

0034<figref idref="f0002">Figures 4</figref> and following exemplify one or more embodiments (relating to <figref idref="f0001">Figure 1</figref>) wherein the opposing faces of components A and B may have a sculptured shape, with complementary structured portions, for example one or various reliefs 10 in either part (e.g. component A) entering into one or various cavities 20 provided in the other part (component B, in the illustrated examples).

0035The sequence of <figref idref="f0003">Figures 5 to 7</figref> (referring to components A and B having complementary sculptured portions 10, 20; however, the same criteria may also apply to parts A and B with planar opposing faces) exemplifies the possibility to apply layers G1 and G3 (e.g. glues) to components A and B (for example to relief 10 of component A and to cavity 20 of component B), and then to interpose layer G2 between them.

0036For example, this may take place by applying a "precursor" of layer G2 (in the case of a glue, such a precursor may the glue itself at a liquid or viscous state) onto material G3.

0037For example, in the presence of cavity 20, the precursor of layer G2 may be "cast" into cavity 20 already covered by layer G3.

0038The connection between parts A and B may then be achieved by pressing component A against component B, so that layer G2 takes on the desired final shape.

0039Of course, without prejudice to the underlying principles of the invention, the details and the embodiments may vary, even appreciably, with respect to what has been described herein by way of non-limiting example only, without departing from the scope of the invention, said scope being defined by the annexed claims.