Nova Patents
EP2829155B1

Resistance heater

Abstract

This record has no abstract on file.

EP2829155B1, drawing sheet 1
Sheet 1 of 4

Term

6.5 yearsleft in the term

Expires 20 March 2033.

  1. Priority
  2. Filed
  3. Granted
  4. Today
  5. Expires

8 claims: 1 independent, 7 dependent

  1. 1
    Use of a resistance heater (1) for processing a semiconductor wafer, the resistance heater (1) comprising:a body (2) comprising: at least one heating surface (4), the at least one heating surface (4) being generally smooth and generally flat;a recess (5) formed in the body (2);and first and second end portions (7a, 7b), wherein the recess (5) is not formed in the first and second end portions (7a, 7b), characterized in that at least a portion of the body (2) has a horizontally symmetrical cross-sectional shape, wherein horizontally symmetrical means symmetrical with respect to a plane parallel to the at least one heating surface (4), and wherein the cross-sectional shape extends along at least a portion of the body (2), and wherein the recess (5) is formed in portions of both first and second surfaces of the body (2) forming a generally I-shaped cross-sectional shape, or wherein the recess (5) is formed in portions of both first and second surfaces of the body (2) forming a generally H-shaped cross-sectional shape.
  2. 8
    Use according to any one of claims 1 to 7, comprising the steps of:(a) supporting a semiconductor wafer on the at least one heating surface (4) of the resistance heater (1);(b) applying an electric current to the heater (1);and (c) heating the semiconductor wafer to a predetermined temperature.