EP2422366A4
Three dimensional integrated circuit integration using dielectric bonding first and through via formation last
16 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13 Sheet 14 Sheet 15 Sheet 16
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| WO2005122706A2 | Cites | World Intellectual Property Organization (WIPO) | Search report |
| US2006057836A1 | Cites | United States of America | Search report |
| WO2006138470A1 | Cites | World Intellectual Property Organization (WIPO) | Search report |
| US2007166997A1 | Cites | United States of America | Search report |
| US2007231950A1 | Cites | United States of America | Search report |
| US2008029896A1 | Cites | United States of America | Search report |
| US2008061419A1 | Cites | United States of America | Search report |
| US5489554A | Cites | United States of America | Search report |
| See also references of WO 2010123691A1 | Non-patent | – | Search report |
6 members in 4 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 426466 | United States of America | – | |
| 42646609 | United States of America | A | |
| 2010030357 | United States of America | W |
Members6
| Document | Office | Kind | |
|---|---|---|---|
| US2010264551A1 | United States of America | A1 | |
| WO2010123691A1 | World Intellectual Property Organization (WIPO) | A1 | |
| CN102341907A | China | A | |
| EP2422366A1 | European Patent Office (EPO) | A1 | |
| EP2422366A4This record | European Patent Office (EPO) | A4 | |
| US9406561B2 | United States of America | B2 |
11 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application withdrawnWithdrawn18W | 18W | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION HAS BEEN WITHDRAWNSTAA | STAA | |
| First examination report despatched17Q | 17Q | |
| Supplementary search report drawn up and despatchedA4 | A4 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Request for extension of the european patent (deleted)DAX | DAX | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 2422366
- Application
- 107675076
Titles3
- German
- EINBAU EINER DREIDIMENSIONALEN INTEGRIERTEN SCHALTUNG MIT DIELEKTRISCHEM KLEBEN ALS ERSTEN SCHRITT UND DURCHGANGSBILDUNG ALS LETZTEN SCHRITT
- English
- THREE DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION USING DIELECTRIC BONDING FIRST AND THROUGH VIA FORMATION LAST
- French
- INTÉGRATION DE CIRCUIT INTÉGRÉ TRIDIMENSIONNELLE UTILISANT UNE LIAISON DIÉLECTRIQUE EN PREMIER ET UNE FORMATION DE TROU D'INTERCONNEXION TRAVERSANT EN DERNIER
Classification
- CPC, 16
- H10W20/023
- H10W90/732
- H10W90/792
- H10W90/722
- H10W80/327
- H10W72/07337
- H10W90/00
- H10W72/29
- H10W72/944
- H10W72/0198
- H10W90/297
- H10W20/0253
- H10W20/0242
- H10W20/0234
- H10W20/2134
- H10W99/00
- IPC, 4
- H01L21 98
- H01L25 065
- H01L21 768
- H10W76 12
Designated states1
- Contracting states, 1
- Türkiye
