EP2388231A2

Fluid storage and dispensing systems and processes

Abstract

Fluid storage and dispensing systems and processes involving various devices, structures and arrangements, as well as techniques and methods, for fluid storage and dispensing, including, without limitation, pre-connect verification couplings that are usefully employed in application to fluid storage and dispensing packages, to ensure proper coupling and avoid fluid contamination issues, empty detect systems that are usefully employed for fluid storage and dispensing packages incorporating liners that are pressure-compressed in the fluid dispensing operation, ergonomically enhanced structures for facilitating removal of a dispense connector from a capped vessel, cap integrity assurance systems for preventing misuse of vessel caps, and keycoding systems for ensuring coupling of proper dispense assemblies and vessels. Fluid storage and dispensing systems are described, which achieve zero or near-zero headspace character, and prevent or ameliorate solubilization effects in liquid dispensing from liners in overpack vessels.

EP2388231A2, drawing sheet 1
Sheet 1 of 54

Term

Term ended

Projected expiry passed 5 June 2026, 0.3 years ago.

  1. Priority and filed
  2. Published
  3. Projected expiry
  4. Today

13 claims: 9 independent, 4 dependent

  1. 1
    A connector adapted for coupling with a fluid storage and dispensing package including a collapsible liner, the connector comprising a probe including an opening arranged for placement within an upper portion of an interior volume of the liner, wherein the probe is adapted to deliver process material to a process system.
  2. 3
    The connector of any one of claims 1 or 2, wherein the probe is in fluid communication with a vent for venting of gas from the interior volume of the liner.
  3. 4
    The connector of any one of claims 1 to 3, wherein the probe is arranged to permit extraction of gas from the interior volume of the liner prior to dispensing of liquid from the interior volume of the liner.
  4. 5
    The connector of any one of claims 1 to 4, wherein the probe is a stubby probe having a terminus disposed in an upper portion of the interior volume of the liner.
  5. 6
    The connector of any one of claims 1 to 5, wherein the connector comprises a first keycode structure arranged to complementarily fit with a second keycode structure associated with the cap in order to verify proper matching of the connector to the cap.
  6. 7
    A fluid storage and dispensing package comprising a substantially rigid outer container, a collapsible liner disposed within the outer container, and a connector according to any one of claims 1 to 6.
  7. 9
    he fluid storage and dispensing package of any one of claims 7 or 8, further comprising a cap fitted to the container, wherein the cap comprises a non-reuse structure adapted to render the cap non-reusable subsequent to initial engagement of the cap with the container.
  8. 10
    The fluid storage and dispensing package of any one of claims 7 to 9, coupled with a source of pressurizing gas for delivery of pressurizing gas into the package to exert pressure on the liner for pressure-mediated dispensing of fluid from the liner.
  9. 11
    A method of manufacturing a semiconductor or microelectronic product, comprising use of a fluid reagent, and supplying the fluid reagent from a fluid storage and dispensing package including a liner holding the fluid reagent to a process tool for semiconductor or microelectronic device manufacturing, wherein:the fluid storage and dispensing package comprises a connector having a probe including an opening arranged for placement within an upper portion of an interior volume of the liner, and the fluid reagent is dispensed through the probe;the liner is subjected to imposition of external pressure thereon for pressure-dispensing of the fluid reagent during said supplying;and the liner is maintained in a zero or near-zero headspace state during pressure-dispensing of the fluid reagent.
  10. 13
    The method of any one of claims 11 or 12, wherein flow circuitry is provided between the fluid storage and dispensing package and the process tool for semiconductor or microelectronic device manufacturing, and wherein minimum headspace is maintained in the flow circuitry during pressure-dispensing of the fluid.