Device and method for generative production
15 claims: 12 independent, 3 dependent
- 1Verfahren zum Herstellen von Produkten mit individueller Geometrie, insbesondere Zahnersatz oder dentalen Hilfsteilen, mit den Schritten:- Herstellen mehrerer Produkte auf der Oberfläche einer Substratplatte mittels selektiven Aushärtens, insbesondere mittels selektiven Sinterns oder Schmelzens, - Bei dem das Material in aufeinanderfolgenden Schichten aufgetragen wird, - Nach jedem Schichtauftrag ein oder mehrere vorbestimmte Bereiche mittels einer energiereichen Strahlung selektiv ausgehärtet und mit einem oder mehreren Bereichen der darunterliegenden Schicht verbunden werden, - wobei die vorbestimmten Bereiche anhand einer Querschnittsgeometrie des Produkts in der jeweiligen Schicht vorbestimmt werden, - Bereitstellen einer Substratplatte welche in ein erstes Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und zumindest ein weiteres Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) unterteilt ist, - Herstellen eines ersten Produkts auf dem ersten Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) durch aufeinanderfolgendes Auftragen von Materialschichten auf das erste Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und selektives Aushärten von vorbestimmten Bereichen jeder aufgetragenen Materialschicht nach deren Auftrag, - Herstellen von zumindest einem weiteren Produkt auf dem zumindest einen weiteren Substratplattensegment durch aufeinanderfolgendes Auftragen von Materialschichten auf das weitere Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und selektives Aushärten von vorbestimmten Bereichen jeder aufgetragenen Materialschicht nach deren Auftrag, dadurch gekennzeichnet, dass das erste und jedes weitere Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) lösbar miteinander oder mit einem Grundträgern verbunden sind und während des Herstellungsvorgang mittels einer Hubvorrichtung in einer vertikalen Richtung angehoben und abgesenkt wird und die Hebe- und Senkbewegung der Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) unabhängig voneinander ist und dass die Substratplattensegmente an einem Endlosförderband befestigt sind oder solcherart miteinander verbunden sind, dass sie in Gestalt einer Gliederkette ein Endlosförderband bilden.
- 2Verfahren zum Herstellen von Produkten mit individueller Geometrie, insbesondere Zahnersatz oder dentalen Hilfsteilen, mit den Schritten:- Herstellen mehrerer Produkte auf der Oberfläche einer Substratplatte mittels selektiven Aushärtens, insbesondere mittels selektiven Sinterns oder Schmelzens, - Bei dem das Material in aufeinanderfolgenden Schichten aufgetragen wird, - Nach jedem Schichtauftrag ein oder mehrere vorbestimmte Bereiche mittels einer energiereichen Strahlung selektiv ausgehärtet und mit einem oder mehreren Bereichen der darunterliegenden Schicht verbunden werden, - wobei die vorbestimmten Bereiche anhand einer Querschnittsgeometrie des Produkts in der jeweiligen Schicht vorbestimmt werden, - Bereitstellen einer Substratplatte welche in ein erstes Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und zumindest ein weiteres Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) unterteilt ist, - Herstellen eines ersten Produkts auf dem ersten Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) durch aufeinanderfolgendes Auftragen von Materialschichten auf das erste Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und selektives Aushärten von vorbestimmten Bereichen jeder aufgetragenen Materialschicht nach deren Auftrag, - Herstellen von zumindest einem weiteren Produkt auf dem zumindest einen weiteren Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) durch aufeinanderfolgendes Auftragen von Materialschichten auf das weitere Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und selektives Aushärten von vorbestimmten Bereichen jeder aufgetragenen Materialschicht nach deren Auftrag dadurch gekennzeichnet, dass - in einem ersten Verfahrensschritt eine Materialschicht oberhalb von zumindest zwei, vorzugsweise mehreren Substratplattensegmenten (12, 112, 212, 312, 412, 512, 612, 712), die lösbar miteinander verbunden sind, solcherart aufgetragen wird, dass oberhalb des ersten Substratplattensegments (12, 112, 212, 312, 412, 512, 612, 712), ein erster Schichtabschnitt und oberhalb jedes weiteren Substratplattensegments (12, 112, 212, 312, 412, 512, 612, 712) ein entsprechend weiterer Schichtabschnitt aufgetragen wird, - in einem zweiten Verfahrensschritt die Materialschicht selektiv ausgehärtet wird, und - der maximale Abstand zwischen dem ersten Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und dem zur Herstellung des ersten Produkts darauf aufgetragenen Schichtabschnitts in zumindest einem, vorzugsweise mehreren, insbesondere allen Verfahrensstadien sich von dem maximalen Abstand zwischen dem weiteren Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) und dem zur Herstellung des weiteren Produkts darauf aufgetragenen Schichtabschnitts unterscheidet, - wobei mehrere Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) in einem Arbeitsgang mit einer einzigen Materialauftragsvorrichtung (33, 133, 233, 333, 633, 733) mit Material beschichtet werden.
- 3Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) so nebeneinander bereitgestellt werden, dass zwischen den Substratplattensegmenten (12, 112, 212, 312, 412, 512, 612, 712) kein Material hindurchtreten kann.
- 4Verfahren nach Anspruch 2, dadurch gekennzeichnet, dass die Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) als Segmente einer Endlosfördervorrichtung (120, 620) ausgebildet sind.
- 5Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Material in einem ersten Fertigungsabschnitt in einem quasi kontinuierlichen Verfahren auf die Substratplatte aufgetragen und selektiv vorbestimmte Bereiche einer jeweils aufgetragenen Schicht ausgehärtet werden und in einem zweiten Fertigungsabschnitt fertig ausgehärtete Produkte quasi kontinuierlich entnommen werden.
- 6Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zwischen den Substratplattensegmenten (12, 112, 212, 312, 412, 512, 612, 712) eine Trennwand bereitgestellt wird, welche den oberhalb jedes Substratplattensegments bestehenden Bauraum von dem oberhalb eines benachbarten Substratplattensegments bestehenden Bauraum abtrennt und die Trennwand vorzugsweise durch Aushärten des aufgetragenen Materials während des Herstellungsvorgangs des Produkts hergestellt wird.
- 7Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass vor jedem Materialauftrag die ausgehärteten Bereiche der zuvor aufgetragenen Schicht oberflächlich beschliffen werden.
- 8Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zur Aushärtung des ersten und des zumindest einen weiteren Produkts, insbesondere aller weiteren Produkte eine einzige Strahlungsquelle (40, 140, 240, 340, 640), insbesondere ein einziger Strahlengang einer einzigen Strahlungsquelle (40, 140, 240, 340, 640) genutzt wird.
- 9Verfahren nach einem der vorhergehenden Ansprüche 2-8, dadurch gekennzeichnet, dass jedes Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) während des Herstellungsvorgang mittels einer Hubvorrichtung in einer vertikalen Richtung angehoben und abgesenkt wird und die Hebe- und Senkbewegung der Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) unabhängig voneinander ist.
- 10Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass mehrere Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) in einem Arbeitsgang mit einer einzigen Materialauftragsvorrichtung (33, 133, 233, 333, 633, 733) mit Material beschichtet werden.
- 11Vorrichtung zur Herstellung von Produkten mit individueller Geometrie, umfassend - eine Substratplatte - eine Materialauftragsvorrichtung (33, 133, 233, 333, 633, 733) zum Auftragen von Material oberhalb der Substratplatte, - eine Strahlungsquelle (40, 140, 240, 340, 640) für einen hochenergetischen Strahl, - Strahlführungsmittel zum Führen des Strahls auf vorbestimmte Bereiche einer auf die Substratplatte aufgetragenen Materialschicht, - Die Substratplatte in mehrere Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) unterteilt ist, dadurch gekennzeichnet, dass das erste und jedes weitere Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) lösbar miteinander oder mit einem Grundträger verbunden sind und während des Herstellungsvorgangs mittels einer Hubvorrichtung in einer vertikalen Richtung anhebbar und absenkbar sind und die Hebe- und Senkbewegung der Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) unabhängig voneinander ist und dass die Substratplattensegmente an einem Endlosförderband befestigt sind oder solcherart miteinander verbunden sind, dass sie in Gestalt einer Gliederkette ein Endlosförderband bilden.
- 12Vorrichtung zur Herstellung von Produkten mit individueller Geometrie, umfassend - eine Substratplatte - eine Materialauftragsvorrichtung (33, 133, 233, 333, 633, 733) zum Auftragen von Material oberhalb der Substratplatte, - eine Strahlungsquelle (40, 140, 240, 340, 640) für einen hochenergetischen Strahl, - Strahlführungsmittel zum Führen des Strahls auf vorbestimmte Bereiche einer auf die Substratplatte aufgetragenen Materialschicht, - Die Substratplatte in mehrere Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) unterteilt ist, dadurch gekennzeichnet, dass - die Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) die lösbar miteinander verbunden sind, und dass die Substratplattensegmente und die Materialzufuhreinrichtung mittels eines oder mehrerer Aktuatoren solcherart relativ individuell zueinander bewegbar sind, dass der Abstand zwischen der Ebene der Oberfläche eines ersten Substratplattensegments (12, 112, 212, 312, 412, 512, 612, 712) und eines zur Herstellung eines ersten Produkts darauf aufgetragenen Schichtbereichs der Materialschicht sich von dem Abstand zwischen der Ebene der Oberfläche eines weiteren Substratplattensegments (12, 112, 212, 312, 412, 512, 612, 712) und eines zur Herstellung des weiteren Produkts darauf aufgetragenen Schichtbereichs der Materialschicht unterscheidet und dass die Materialauftragsvorrichtung (33, 133, 233, 333, 633, 733) zum simultanen Auftragen einer Materialschicht oberhalb einer Anzahl der mehreren Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) in einem Arbeitsgang ausgebildet ist.
- 13Vorrichtung nach einem der vorhergehenden Ansprüche 11 bis 12, gekennzeichnet durch eine Materialentfernungsvorrichtung (490, 790), insbesondere eine Material-Absaugeinrichtung, wobei die Materialentfernungsvorrichtung (490, 790) ausgebildet ist, um nicht ausgehärtetes Material aus einem ein gefertigtes Produkt umgebenden Bereich zu entfernen, und so angeordnet ist, dass sie das Material auf einem ersten Substratplattensegment zu entfernen kann und hierbei das Material auf einem weiteren, hierzu benachbarten Substratplattensegment (12, 112, 212, 312, 412, 512, 612, 712) belassen kann.
- 14Vorrichtung nach einem der vorhergehenden Ansprüche 11-13, dadurch gekennzeichnet, dass die Substratplattensegmente (12, 112, 212, 312, 412, 512, 612, 712) an einem Endlos-Förderband (120, 620) angeordnet sind, welches teilweise oder vollständig in einer Bearbeitungskammer verläuft, die gegen die Umgebung soweit abgedichtet ist, dass darin eine kontrollierte, insbesondere inerte Atmosphäre eingestellt werden kann.
- 15Vorrichtung nach einem der vorhergehenden Ansprüche 11-14, gekennzeichnet durch eine Steuerung zur Ansteuerung der Strahlführungsmittel des hochenergetischen Strahls, welche ausgebildet ist, um die Strahlführungsmittel so anzusteuern, dass die Trennwand während des Herstellungsvorgangs des Produkts durch Aushärten des aufgetragenen Materials hergestellt wird.
Independent claims15
113 paragraphs, as filed
The invention relates to a method for producing products with an individual geometry, in particular dentures or dental accessories, with the steps of producing a number of products on the surface of a substrate plate by means of selective curing, in particular by means of selective sintering or melting, in which the material is applied in successive layers , after each layer application, one or more predetermined areas of the applied layer are selectively cured by means of high-energy radiation and connected to one or more areas of the underlying layer, the predetermined areas being predetermined based on a cross-sectional geometry of the product in the respective layer. A further aspect of the invention is a device for carrying out such a method.
Additive manufacturing processes, i.e. manufacturing processes in which a material is formed into an individual product in an additive manufacturing process, are used in the manufacture of prototypes and are now also used in product manufacture, especially in the manufacture of individually shaped products or small series application found. Out of<patcit id="pcit0001" dnum="EP1021997A"><text>EP 1 021 997</text></patcit> it is known, for example, to produce individually shaped dentures or dental accessories by means of a selective laser sintering process under certain parameters.
In addition to such a selective laser sintering or laser melting process (SLS, SLM) for metallic powders, which is particularly suitable for dentures, other additive manufacturing processes can also be suitable for other products, for example processes in which a granulate or other solid material is blown through a high-energy beam, such as sintered or melted, for example by a laser beam or electron beam, and connected and cured in this way, or processes in which a plastic present in solid or liquid form is selectively cured by photopolymerization by a high-energy beam, such as a laser beam or a focused light beam.
These generative manufacturing processes regularly work in such a way that successive layers of the curable material are applied to a substrate plate, for example by the substrate plate being lowered successively and discontinuously into a liquid bath of the curable material or by successive layers being applied to the substrate plate one on top of the other using a powder application device. After each layer application process, certain parts of the layer are selectively cured and in this way the product is built up layer by layer. Once the product has been completed by curing the last layer, uncured areas of the material can be removed and often reused. In principle, the SLS or SLM process is in<patcit id="pcit0002" dnum="EP0734842A1"><text>EP 0734842 A1</text></patcit> described, the disclosure of which is fully incorporated in this regard.
A fundamental problem of additive manufacturing processes is the long period of time that elapses between the creation of the manufacturing data and the completion of the product. It is known to generatively build up several products on a substrate plate at the same time in order to increase the number of products manufactured in a certain period of time. This procedure is particularly useful for products with very small dimensions in relation to the dimensions of the substrate plate and leads to an effective increase in productivity.
Out of<patcit id="pcit0003" dnum="EP0734842A1"><text>EP 0734842 A1</text></patcit> it is known to reduce the downtime of a production device by using a substrate plate that is detachably fastened to a carrier and, as a result, immediately after the products on this substrate plate have been completed, the substrate plate can be removed and replaced with a new substrate plate in order to start a new manufacturing process. While this configuration allows the time required to remove the products from the substrate plate not to be included in the downtime of the manufacturing device, the device still has the disadvantage that only when the manufacturing data of all products are present, which are to be manufactured on a substrate plate, the manufacturing process can be started and the total time for the manufacture of a product cannot be decisively reduced as a result, particularly in the case of an individual manufacture of many small products.
Out of<patcit id="pcit0004" dnum="WO2008128502A"><text>WO 2008/128502</text></patcit> a device is known which follows the same basic idea and provides a conveying device within the production device, with which one or more construction containers as well as dosing or storage containers can be conveyed in order to achieve simple, fast and safe powder handling within the production device. With this device, products can be manufactured quickly in one construction container using one powder material and then, after these products have been completed, products can be manufactured in a second construction container using a different powder material. However, with this manufacturing device, too, the manufacturing process requires at least as long as the time between the creation of the manufacturing data for all products on the substrate plate and the completion of the products, so that the manufacturing with regard to each one of a plurality of products that are built up continues takes a relatively long time ago.
Out of<patcit id="pcit0005" dnum="WO2004014636A"><text>WO 2004/014636</text></patcit> a method for the layer-by-layer generative production of three-dimensional objects is known, in which several objects are produced simultaneously in two construction areas. In this case, a layer is applied in one construction area and selective curing by means of radiation is achieved in another construction area. Four process chambers are provided, which can be in the form of spatially separate individual chambers or as partial areas of two double chambers or a quadruple chamber. Furthermore, it is provided that a laser can be connected to one of the process chambers via a switching device. The device described in this way and the method described for the additive manufacturing of products with this device has the disadvantage that separate control of the application process in each of the process chambers is required for the purpose of simultaneous production with alternating curing and layer application in the respective process chambers. Although the device and the method are suitable for the complex special application of manufacturing several products with different starting materials in correspondingly different process chambers, the manufacturing process and the device are complex both in terms of structure and control and can therefore contribute to efficiency in terms of productivity Manufacturing numerous small products and the time that elapses between the completion of the manufacturing data for a product and the completion of the product itself can be further optimized.
Out of<patcit id="pcit0006" dnum="DE29907262"><text>DE 299 07 262</text></patcit> a device for producing a three-dimensional object is known. In this device, one or more construction platforms are provided on a platform support, which serve as a construction base or base for an object to be formed. The construction platforms are attached to the platform support using positioning pins and clamping elements. The platform support is attached to a base plate which can be raised and lowered in the vertical direction by means of a height adjustment device.
While the known manufacturing methods and devices can only be used to manufacture individual products, the size of which is roughly the size of the substrate plate, both productively and with an overall manufacturing time that is reasonable for each individual product, it is for products whose dimensions are much smaller than the substrate plate , only possible to ensure productivity by jointly manufacturing several products on one substrate plate, however, the manufacturing time for a single product cannot be reduced to a desirably short period of time in this case, but is increased by preparing manufacturing data for all products to be manufactured on the substrate plate and then manufacturing all products simultaneously.
Another problem in the generative manufacturing of small products, which is to be understood as meaning products whose base area is smaller, in particular by at least one order of magnitude smaller than the surface of the substrate plate, is that in many areas of application with individual product geometries, generative manufacturing is considered to be made-to-order takes place, such as in the manufacture of dentures in dental laboratories. In this case, the individual orders typically do not arrive at the same time but at different times when the user of the manufacturing device receives them. In this case, in order to achieve high productivity and utilization of the plant, the user has to bundle several orders in order to manufacture the products contained in the bundled orders on one substrate plate at the same time. However, this creates a significant delay between the receipt of the order and the completion of the product, especially for the order received first. On the other hand, if the user wants to process each order in the shortest possible time and manufacture the corresponding individual product, he is forced to carry out the manufacturing process on a substrate plate with only one or a few products, which leads to an overall low utilization of the manufacturing device and low productivity.
It is an object of the invention to further develop the known production methods such that both high productivity and a short production time for each individual product can be achieved even with products whose dimensions are small in relation to the substrate plate dimensions. It is another object of the invention to provide a manufacturing method and apparatus which shortens the time from receipt of an order for a small product to be individually manufactured to completion of the product without adversely affecting the productivity of the manufacturing method and apparatus.
This object is achieved according to the invention by a method according to claim 1 or 2.
The method according to the invention is characterized in that a substrate plate is provided on which a first and a further product can be produced simultaneously in a first and a corresponding further substrate plate segment and these substrate plate segments are detachably connected to one another or to a base support. This makes it possible to remove a single substrate plate segment after the product built on it has been completed, in order to be able to detach the product from the substrate plate segment while another product is still being produced additively on another substrate plate segment.
In particular, in the method according to the invention, the material layers can be applied to the at least two substrate plate segments in such a way that at least one of the material layers extends over both substrate plate segments. In this case, the method can proceed in such a way that a material layer is first applied to the at least two substrate plate segments and this material layer is selectively cured in the area above both substrate plate segments.
The substrate plate segments can in particular interact with a single coating device in such a way that a product is built up on a substrate plate segment in a first production stage, for example with an nth layer above the substrate plate and another product is built up on another substrate plate segment in a different production stage, for example with an m-th built-up layer above the substrate plate, where m is not equal to n and the nth and mth layers are applied in one operation by the coating device.
With the method according to the invention, several products can thus be manufactured on a substrate plate with production start times staggered over time, the products being partially manufactured simultaneously and also being detached from the substrate plate at different times. In this way, it is possible to utilize the substrate plate with several products with the aim of high productivity, but at the same time to avoid that the production start time cannot be until after all production data for all products to be manufactured on the substrate plate have been completed. Instead, the production start time can be determined individually for each substrate plate segment and accordingly an individual production end time can also be achieved for each substrate plate segment. In this way, the time it takes to manufacture an individual product is significantly reduced.
In principle, it should be understood that the substrate plate can be divided into two, three or more substrate plate segments. In this case, this subdivision is to be understood in particular as an actual physical subdivision into individual components which can be assembled accordingly to form a substrate plate. In principle, layers can be applied to all substrate plate segments with a single, common layer application device, which is preferred due to the efficient production associated therewith. In certain applications, however, it can be advantageous to coat the substrate plate segments with material using separate layer application devices, whereby it should also be understood here that in the method according to the invention the start of manufacture and a corresponding end of manufacture of the products on the various substrate plate segments take place at a different time, but simultaneous production takes place on several substrate plate segments, preferably with a simultaneous layer application on all substrate plate segments and subsequent selective curing of certain areas for the generative manufacture of products for the purpose of high productivity.
According to a first preferred embodiment, it is provided that the substrate plate segments are provided next to one another in such a way that no material can pass between the substrate plate segments. In particular, a corresponding seal can be provided between the individual substrate plate segments for this purpose, or the substrate plate segments can be joined together in such a way that material can not penetrate between the substrate plate segments.
It is even more preferred that the substrate plate segments are designed as segments of an endless conveyor device. This configuration enables a continuous additive manufacturing of products in a particularly efficient manner. The substrate plate segments can, for example, be attached to an endless conveyor belt or connected to one another in such a way that they form such an endless conveyor belt in the form of a link chain. In this case, the substrate plate segments can be moved in a sequential manner along an upper strand and a lower strand, with the layer application and the selective layer curing taking place during the movement along the upper strand. The removal of non-hardened, applied material from the space between the manufactured products and the removal of the products can also take place in the area of the upper run, for example by appropriate suction devices or mechanical separating devices. However, it is also possible in the same way to have the removal of non-hardened material in the area of the lower run or at the transition from the upper run to the lower run, for example due to gravity, and the finished products then either together with a substrate plate segment or directly from the substrate plate segment in the area of the lower run to decrease.
Furthermore, it is preferably provided that the substrate plate segments are designed and arranged in such a way that the first product or a group of first products is built up on a single substrate plate segment and the further product or a group of further products is built up on one or more further substrate plate segments. In this configuration, on the one hand, one or more products can be manufactured on a single substrate plate segment, in order in this way to manufacture small products with high productivity in a very short manufacturing time. On the other hand, it is also possible to produce a single product on a number of substrate plate segments. This can be advantageous in particular when larger products are to be produced using the method according to the invention, ie products whose longitudinal extension or bearing surface is larger than the surface of a substrate plate segment. It is further provided that a group of several products can be produced on two or more substrate plate segments. This can be particularly necessary for products that extend very far in only one specific direction. Thus, with the method according to the invention, a product can be produced whose length extends over several substrate bed segments. If a number of such products are to be manufactured, then, according to this development, a group can be formed by such products and this group can then be manufactured over a number of substrate plate segments.
It is even more preferred that the material is applied to the substrate sheet in a quasi-continuous process in a first production section and selectively predetermined areas of each applied layer are cured and completely cured products are removed quasi-continuously in a second production section. This manufacturing method enables high-quality generative manufacturing in a first manufacturing section and, at the same time, removal of finished products in a second manufacturing section, which does not negatively affect this generative manufacturing, which is spaced apart from the first manufacturing section. This can be achieved in particular by arranging the substrate plate segments on an endless conveyor belt or by forming such a belt with the substrate plate segments and conveying the substrate plate segments accordingly from the first to the second production section. In particular, in this configuration, the first production section can be kept in a closed, controlled, in particular inert atmosphere in order to be able to set the boundary conditions required for additive manufacturing using certain methods, whereas in the second production section the products are discharged or the second production section contains an air lock or the products are already discharged from the controlled atmosphere during the transition from the first to the second production section.
Furthermore, it is preferably provided that in a first method step a material layer is applied above at least two, preferably several, substrate plate segments, in a second method step the material layer is selectively cured, and that the maximum distance between the first substrate plate segment and one for manufacturing the first product thereon applied layer in at least one, preferably several, in particular all stages of the method differs from the maximum distance between the further substrate plate segment and a layer applied thereto for the production of the further product. In this embodiment, it is to be understood that a process stage includes the sequence of layer application and selective curing and is consequently carried out repeatedly, resulting in successive process stages. In a respective process stage, a first and second process step is carried out in succession and here on at least two, in particular several or all substrate plate segments, a layer of material is applied in one operation and this is subsequently selectively cured in order to generatively produce several products on the correspondingly several substrate plate segments. According to the invention, the layer is applied to the substrate plate segments in such a way that the distance between the applied layer and the substrate plate segments is different for at least two, in particular for each, substrate plate segment. It should be understood that this maximum distance is different during the application of the layer and also or only during the selective curing. This distance can differ in only one of several successive process stages, each consisting of the sequence of a layer application and the selective curing of this layer, but in particular the distance can differ in all process stages, ie typically that the sum of the layers applied above one substrate plate segment is different from the sum of the layers applied above another substrate plate segment, for example because the joint application to the two substrate plate segments only started at a point in time when one or several layers were applied. The method can be implemented, for example, in such a way that the substrate plate segments can be moved individually with regard to their height in order to achieve in this way that although a layer is applied to all substrate plate segments in a common plane, the distance between this layer and the substrate plate segments is different for each substrate plate segment, or by vertically adjusting the layer application device between the substrate plate segments during the application process.
It is even further preferred to develop the method by the steps of removing material arranged on the first substrate plate segment which has not been cured, without removing material of a further substrate plate segment in the process, and then removing material arranged on the further substrate plate segment which has not cured became. For the quasi-continuous generative manufacturing according to the invention, it is particularly advantageous at the removal point if the uncured material can be removed in such a way that a neighboring area is not affected and the uncured material remains in this neighboring area. During additive manufacturing, the uncured material has a support function and serves to accommodate and carry overlying layers. The uncured material should therefore generally not be removed before the product has been fully built up and cured. However, in order to prevent the necessity under such a specification that finished products first have to cover a longer distance, which serves to ensure process reliability, until they reach the removal point at which the uncured material is removed, it is advantageous if the material removal device can accomplish the material removal without affecting the immediately adjacent substrate plate segment here. This enables rapid and quasi-continuous production and avoids providing a safety distance between the layer application device and the material removal device.
Furthermore, it is preferred that in a first phase of the manufacturing process only layer areas of a layer are selectively cured, which serve to manufacture the first product and in a last phase of the manufacturing process only layer areas of a layer are selectively cured, which serve to produce the further product and preferably in a middle phase of the production process lying between the first and the last phase, layer regions of a layer are cured which serve to produce the first and the further product. With the quasi-continuous and simultaneous production of products in different stages of completion achieved in this way, a productive and rapid process for the individual production of small products using an additive manufacturing process is achieved.
According to a further preferred embodiment, it is provided that a partition is provided between the substrate plate segments, which partition separates the installation space above each substrate plate segment from the installation space above an adjacent substrate plate segment. Such a partition enables or simplifies the removal of uncured material above a substrate plate segment without affecting the uncured material in a substrate plate segment adjacent thereto. It is to be understood that such a partition wall can be provided as part of the production device and in this case can be designed in such a way, for example, that it is tracked simultaneously with the layer application in order to have an exact height or slightly less than this exact height that the corresponds to the upper layer surface of the material application in the area between two substrate plate segments.
It can be provided in particular that the partition is produced by curing the applied material during the manufacturing process of the product. With this further development, such a partition wall is produced from the applied material at the edge of a substrate plate segment during the production process. This procedure has the advantage that there is no need for structurally complex adjustments to the partition wall. Instead, a corresponding partition wall is built up along the edge area of a substrate plate segment, which grows higher with each layer application and in this way is tracked to the total height of the material layer bed. The dividing wall can then be removed when removing the products from the substrate plate segment or in the course of removing uncured material from the adjacent substrate plate segment.
The two aforementioned embodiments can be further developed in that the partition wall between two substrate plate segments is connected to at least one of the two substrate plate segments. By connecting the dividing wall to the two substrate plate segments, which separates them from one another, a secure seal against the passage of material between the substrate plate segments can also be achieved at the same time. The connection can be achieved here by generative construction of the partition on one or both substrate plate segments or by appropriate structural connection of a partition wall component belonging to the device. According to a further preferred embodiment, it is provided that each substrate plate segment is moved individually in relation to the layer application device in such a way that the distance perpendicular to the surface of the substrate plate and the layer applied with a layer application device is changed and the resulting height of the material bed on a substrate plate segment is different from the Height of the material bed is on another substrate plate segment. According to this embodiment, the height of each substrate plate segment can be moved individually, for example by means of an actuator that acts alternately on the substrate plate segments or by means of a plurality of actuators, each of which is provided for one substrate plate segment. The result of this is that the substrate plate segments can be placed at different heights in order to then subsequently apply a layer of material in a plane above the substrate plate segments. This layer of material is then individually different distance from the respective substrate plate segments, ie in particular at an individual distance from the plane of the surface of the substrate plate segments on which the first layer of material has been applied to the respective substrate plate segment. The embodiment is suitable for generatively producing a product in a first process stage on a first substrate plate segment and another product in a different production stage on another substrate plate segment with a common layer application on the two substrate plate segments and can be applied to a corresponding number of substrate plate segments with a corresponding number of products in different process stages be applied.
Furthermore, it is preferred that the hardened areas of the previously applied layer are surface-ground before each application of material. The geometric precision of the generative manufacturing process is further increased by such surface processing, which can be carried out in particular as grinding, but also by other machining manufacturing processes with a geometrically defined or geometrically undefined cutting edge. In particular, such a machining operation provides a defined bearing surface and connection point for the layer above and for the areas to be cured therein. In addition, a defined layer thickness is set by the machining, which is advantageous for a reproducible geometric manufacturing result.
It is even more preferred that a single radiation source, in particular a single beam path of a single radiation source, is used to cure the first and the at least one further product, in particular all further products. In principle, it should be understood that multiple radiation sources or multiple beam paths of a single radiation source can also be used to speed up the manufacturing process. However, the production method according to the invention is characterized in particular by the fact that it produces a number of products at the same time and these products are in different production stages, ie in particular are made up of a different number of layers. What is special here, however, is that both the application of a layer can be carried out by a single layer application device for all substrate plate segments and products to be manufactured built on them, and that the specific areas of a layer for all products to be manufactured can also be cured by a single radiation source .
According to a further preferred embodiment it is provided that each substrate plate segment is raised and lowered in a vertical direction during the manufacturing process by means of a lifting device and the lifting and lowering movement of the substrate plate segments is independent of one another. The independent lifting and lowering movement can be brought about in particular by an actuator acting on a plurality of substrate plate segments or by an actuator in each case which is assigned to one substrate plate segment in each case.
It is even more preferred that a plurality of substrate plate segments are coated with material in one operation using a single material application device. This development enables an efficiently working layer application device with at the same time individual production progress of the respective products that are produced on the respective several substrate plate segments.
Finally, the procedure can be further developed through the steps: Application of an nth material layer to a substrate carrier plate, selective curing of parts of the material layer by means of the action of high-energy radiation, in particular laser radiation, on these parts of the material layer, guiding the high-energy radiation over the nth material layer according to guide data, which are derived from the geometric data an x-th cross-sectional area of a first product were determined, Applying an n+1 th layer of material to the n th layer of material, guiding the high-energy radiation over the n+1 th layer of material according to guiding data, which were determined from the geometric data of an x+1 th cross-sectional area of the first product, guiding the high-energy radiation over the nth material layer according to guidance data, which were determined from the geometric data of a yth cross-sectional area of a second product, and guiding the energetic radiation over the n+1 th layer of material according to guiding data determined from the geometric data of a y+1 th cross-sectional area of the second product, where x is not equal to y. In this development, at least two products are produced by subjecting them to selective curing in a common layer application in two different layer areas of one and the same layer, different heights being shown in the products themselves in this layer compared to the substrate plate.
Another aspect of the invention is an apparatus according to claim 11 or 12.
The device according to the invention is characterized in that a material application device is arranged above a substrate plate, with which a material layer can be applied to all substrate plate segments of the substrate plate in one operation. Furthermore, a radiation source is provided above the substrate plate. Material application device and radiation source are controlled by a production control device in such a way that the material layer applied in the first operation can be selectively cured in a further operation with the radiation source, is divided into several segments. The segments can be releasably connected to one another, by which is meant that one segment is connected to only one adjacent segment, or one segment can be connected to a plurality of surrounding segments. Alternatively, it is also provided that the segments are arranged next to one another and each segment is detachably connected to a base support. With the device according to the invention, it is possible in this way to generatively manufacture a number of products distributed over a number of substrate plate segments and to move the height of the substrate plate segments relative to one another in such a way that the products are manufactured in different manufacturing stages on the different substrate plate segments and the product or products that have been produced on a first substrate plate segment, to be removed with and detached from the substrate plate segment before one or more products are removed and detached from another substrate plate segment.
The device according to the invention can be further developed in that the material application device is designed for the simultaneous application of a material layer above a number of the plurality of substrate plate segments in one operation.
Furthermore, the device according to the invention can be further developed in that the substrate plate segments and the material feed device can be moved individually relative to each other by means of one or more actuators in such a way that that the distance between the plane of the surface of a first substrate sheet segment and a layer region of the layer of material applied thereto to produce a first product differs from the distance between the plane of the surface of another substrate sheet segment and a layer region of the same layer of material applied thereto to produce the further product.
The device according to the invention can be further developed by a material removal device, in particular a material suction device, wherein the material removal device is designed to remove uncured material from an area surrounding a manufactured product and is arranged in such a way that it removes the material on a first Can remove substrate plate segment and thereby the material on another, this can leave adjacent substrate plate segment.
According to a further preferred embodiment, it is provided that the device according to the invention has a control for controlling the guiding device of the high-energy beam, which is designed to control the guiding device in such a way that in a first phase of the production process only layer regions of a layer are selectively cured, which are used to produce a first product on a first substrate plate segment, in a final phase of the manufacturing process only layer areas of a layer are selectively cured which are used to manufacture a further product on a further substrate plate segment and in a middle phase of the manufacturing process lying between the first and the last phase layer areas of a layer are hardened which are used to produce the serve the first and the further product.
The device according to the invention can be further developed by a controller for controlling the material application device and/or for controlling at least one actuator for the relative movement between the substrate plate segments and the material application device, which is designed in order to provide the height of the material bed on a first substrate plate segment that results after the application of all material layers is different from the height of the material bed on another substrate plate segment that results after the application of all material layers. With this, products of different heights can be produced on different substrate plate segments and these can be finished at the same time.
Furthermore, it is preferably provided that a processing device for removing a surface portion of the hardened material areas, preferably for superficial grinding, of the hardened material areas of a previously applied material layer is arranged on the material application device.
It is also preferably provided that the substrate plate segments are arranged on an endless conveyor belt which runs partially or completely in a processing chamber which is sealed off from the environment to such an extent that a controlled, in particular inert atmosphere can be set in it.
The device can be further developed by at least one lifting device which is or can be coupled to each substrate plate segment in order to raise and lower the respective substrate plate segment in a vertical direction independently of the other substrate plate segments during the manufacturing process.
The device according to the invention can be further developed by a single radiation source, which is used, in particular by means of a single beam path, for curing the products produced on all substrate plate segments.
The device according to the invention can be developed even further by a partition arranged between the substrate plate segments, which separates the installation space above each substrate plate segment from the installation space above an adjacent substrate plate segment.
It is preferably further provided that the partition between two substrate plate segments is connected to at least one of the two substrate plate segments or is sealed against this substrate plate segment in such a way that no material can pass between partition and substrate plate segment.
According to a further preferred embodiment, the device is characterized by a controller for controlling the guiding device of the high-energy beam, which is designed to control the guiding device in such a way that the partition wall is produced during the manufacturing process of the product by curing the applied material.
Finally, the device according to the invention can be further developed by a controller for controlling the guiding device of the high-energy beam, which is designed to guide the high-energy radiation over the nth material layer according to guiding data, which are derived from the geometric data of an xth cross-sectional area of a first product were determined to cure parts of the nth layer of material by exposure to high-energy radiation, to guide the high-energy radiation over an n+1-th layer of material according to guide data, which were determined from the geometric data of an x+1-th cross-sectional area of the first product, in order to cure parts of the n+1-th layer of material by exposure to the high-energy radiation, to guide the high-energy radiation over the nth material layer according to guidance data, which were determined from the geometric data of a yth cross-sectional area of a second product, to cure parts of the nth layer of material by exposure to the high-energy radiation and to guide the high-energy radiation over the n+1st layer of material according to guiding data determined from the geometric data of a y+1th cross-sectional area of the second product to parts of the n+1 th layer of material by exposure to the high-energy radiation, where x is not equal to y.
Preferred embodiments of the invention are described with reference to the enclosed figures. Show it:<ul id="ul0001" list-style="none"><li><figref idref="f0001">Figure 1A</figref> a schematic, longitudinally sectioned side view of a first embodiment of the invention,</li><li><figref idref="f0001">Figure 1B</figref> a top view of the embodiment according to FIG<figref idref="f0001">Figure 1A</figref>,</li><li><figref idref="f0002">2</figref> a schematic, longitudinally sectioned side view of a second embodiment of the invention,</li><li><figref idref="f0003">3</figref> a schematic, longitudinally sectioned side view of a third embodiment of the invention,</li><li><figref idref="f0004">4</figref> a schematic, longitudinally sectioned side view of a fourth embodiment of the invention,</li><li><figref idref="f0005">figure 5</figref> a schematic view of a production arrangement according to a fifth embodiment of the invention, and.</li><li><figref idref="f0006">6</figref> a schematic view of a production arrangement according to a sixth embodiment of the invention,</li><li><figref idref="f0007">7</figref> a schematic view of a production arrangement according to a seventh embodiment of the invention,</li><li><figref idref="f0008">8</figref> an eighth embodiment of the invention.</li></ul>
<figref idref="f0001">Figure 1A</figref> 12 shows a receiving device 20 for a total of eight drawers 10a-h arranged in two rows and four columns, as shown in FIG<figref idref="f0001">Figure 1B</figref> can be seen. Each slot 10a-h has an individually height-adjustable substrate plate segment 12a-f. Each substrate plate segment 12a-f is individually height-adjustable in a vertical direction 11 within its slot 10a-f. Here, the vertical direction 11 for each of the substrate plate segments 12a-f is parallel to one another and perpendicular to the upper surface 13a-f of the substrate plate segments 12a-f, which is horizontal, ie perpendicular to the direction of gravity.
The evaluations within the receiving device 20 are designed to receive a slot 10a-f in each case, in which a substrate plate segment 12a-f is arranged. However, it should be understood that substrate plate segments can also be inserted into the receiving device 20 which have a larger base area of the substrate plate 12a, for example a base area that is twice as large or four times as large as that in<figref idref="f0001">Fig. 1a, b</figref> represented substrate plate segments and occupy the corresponding two or four slots.
A filler block 12g, 12h, which does not represent a substrate plate segment and is not used for the manufacture of products, is inserted in the slots 10g and 10h.
Each substrate plate segment 12a-f can be adjusted in height by means of an actuator 14a-f, which can be, for example, a linear actuator operated by an electric motor. The actuator 14a-f is part of the insert 10a-f.
Each slot 10a-f is surrounded by a housing which is open at the top and has a rectangular, in particular square, cross-section and comprises four walls, as shown by the walls 15a-18a in the slot 10a by way of example. The substrate plate segment 12a moves within these walls and seals at its lateral edge area with the walls in such a way that coating material applied to the substrate plate segment cannot pass between the substrate plate segment and the walls.
The upper end edges of the walls are flush with a surface 21 of the receptacle 20 when the drawers 10a-e are inserted into the receptacle. In the same way, an upper surface of the slide-in units 10g, h is flush with the surface 21 of the receiving device 20.
A powder applicator 30 is provided which includes a powder feeder 32 from which powder can be dispensed onto the surface 21 of the receptacle and which further includes a pusher 33 which extends along a direction of movement 31 reciprocally across the surface 21 and the substrate plate segments 12a-f or inserts 10a-h can move. The slide 33 distributes the powder discharged from the powder conveyor 32 and applies a layer of powder above the substrate plate segments 12a-f.
The powder application device further comprises a collecting device 34 for excess powder. The slide 33 pushes the powder that could not be applied as a powder layer above the substrate plate segments into the collecting device 34 .
As in<figref idref="f0001">Figure 1A</figref> As can be seen, the substrate plate segments 12a-f are set to different heights by means of their actuators 14a-f, i.e. the distance between the upper surface 13a-f of each substrate plate segment and the plane of the surface 21, along which the slide 33 moves and, as a squeegee, the Applying powder is different.
After each powder application process, which is started by moving the slider 33 from the in<figref idref="f0001">Figure 1A</figref> shown right-hand position to a left-hand position in the area of the collecting trough 34 as seen from here, the layer applied during this powder application process above each substrate plate segment 12a-f is cured in predetermined areas by means of a radiation source, here a high-power laser 40. This selective curing is based on control data corresponding to the cross-section of a product in each layer applied. In this selective curing process, the cured areas are simultaneously bonded to corresponding underlying areas of the product that have been previously cured. The hardening process can take place in particular as selective laser sintering or selective laser melting. In principle, however, other curing principles, such as photopolymerization, can also be applied to the principle of the invention. The beam of the high-power laser 40 is directed with beam steering means in such a way that it hits the predetermined areas of the previously applied layer and selectively cures these areas above all the previously coated substrate plate segments.
For this purpose, the beam steering means are coupled in terms of signals to a control device. Manufacturing data for at least the products to be manufactured at the same time are stored in the control device. The production data include in particular position data which characterize the position of a respective product on the substrate plate and geometry data which characterize the geometry of the respective product. The geometric data is prepared in such a way that it contains the geometric data of individual cross-sections of the product. The respective position of such a cross section and the geometric data stored for this cross section corresponds to the position of the respectively applied material layer from which this product cross section is produced and the geometry of the product in this material layer. In the illustrated embodiment with products standing vertically on the plate, the geometric data therefore correspond to horizontal cross-sectional planes through this product.
After the selected areas have hardened, slide 33 moves from the left position to the in<figref idref="f0001">Figure 1A</figref> right position shown. Here, the surface of the selectively hardened areas is ground using a grinding device arranged on the slider, in order to achieve a defined surface for the subsequent coating and hardening process and greater geometric precision of the generatively manufactured component.
After this process, the substrate plate segments 12a-f are lowered by a predefined distance, which corresponds to the layer thickness of the layer subsequently applied. As a result of this lowering process, the surface of the previously applied layer and the selectively cured areas therein are no longer in alignment with the surface 21 along which the slide 33 moves with a lower squeegee edge, but below by the distance by which the substrate plate segment was lowered the plane of this surface 21. Following this, a metered amount of powder is again delivered from the powder feeder 32 onto the surface 21 and, by moving the slider 33 to the left, this powder is applied as a layer above each lowered substrate plate segment.
The process is repeated until a product is completed within the powder bed applied in layers in this way above a substrate plate segment. That's how it is<figref idref="f0001">Figure 1A</figref> as can be seen, the time of completion of one or more products above a substrate plate segment in the various drawers 10a-f differs; in the example shown, the product or products on the substrate plate segment 12e in drawer 10e is typically placed before the product or products on the substrate plate segment 12c in the Slot 10c can be completed if the products manufactured therein have approximately the same height. The insert 10a is shown in the maximum raised position of the substrate plate segment 12a, which corresponds to the start of production.
After the products are completed on a single tray 10a-f, that tray can be removed from the cradle 20 and replaced with a new tray with the substrate plate in the uppermost position. The products in the removed tray can be detached from the substrate plate after uncured powder material has been removed. New products can be manufactured simultaneously on the newly deployed segment. A high level of productivity in the generative manufacturing of products is achieved as a result of the time-delayed but simultaneous construction of products in the device, which is possible in this way.
<figref idref="f0002">2</figref> shows a second embodiment of the invention, in which several substrate plate segments 112a-c can be coupled as modules 110a-c on an endless conveyor belt 120. A plurality of coupling points 122a, b, c, d .
The actuator within each module is designed to adjust the height of each substrate plate segment 112a-c individually.
As in<figref idref="f0002">2</figref> As can be seen, the substrate plate segments 112a and 112b are designed as single segments, whereas the substrate plate segment 112c is designed as a double segment and extends along the conveyor belt 120 over twice the length.
Each module 110a-c is, in turn, like the drawers according to FIG<figref idref="f0001">Figure 1A</figref>, B, are provided with side walls within which the substrate plate segments 112a-c can move vertically in an edge sealed manner. The peripheral walls terminate with their upper edges flush with a surface 121 onto which powder can in turn be discharged from a powder conveyor 132 . The surface 121 is horizontal, ie perpendicular to the direction of gravity and by moving a slide 133 with a lower squeegee edge, which rests on the surface 121, in a direction 131, the applied powder is distributed over the substrate plate segments 112a-c and finally, after moving the slide from FIG<figref idref="f0002">2</figref> shown right position into a left position offset horizontally to the left, excess powder is pushed into a collecting container 134 .
Again, the in<figref idref="f0002">2</figref> illustrated embodiment by stepwise lowering of the substrate plate segments 112a-c in each individual way, a powder bed of different heights is set in each individual module 110a-c and thereby a different production progress is achieved, ie the layer applied in one operation of the slider 133 has a distance to the upper surface of the substrate plate segment 112c, which is different from the distance to the surface of the substrate plate segment 112b, which in turn is different from the surface of the substrate plate segment 112a. In this way, products with different manufacturing stages or are generated generatively in different manufacturing stages, as can be seen from the product 160, 161a that is in module 110a shortly before completion and the product 160b that is about half-completed in module 110b.
For the function of the production arrangement according to<figref idref="f0002">2</figref> it is provided that the manufacturing progress in the modules 110a-c increases starting from the right in the conveying direction of the conveyor belt 120 to the left, as represented by the arrow 123. As soon as the products have been completed in a manufacturing module, the conveyor belt is advanced far enough for this module to be removed, or the module is removed and the conveyor belt advanced by the corresponding length of the module. In this case, a new module can be inserted on the right-hand side adjacent to the illustrated position of the slide 133 and additive manufacturing can be started in this new module. The removed module can be further processed in a further production section; in particular, the unhardened powder material can be removed from this and the products manufactured therein can be removed from the substrate plate segment. The particular advantage here is that in the finished substrate plate segment, which was previously subjected to simultaneous production with the other substrate plate segments, it is now possible to remove the uncured powder and the finished products without removing the powder from other substrate plate segments must be or the manufacturing process must be stopped in the other substrate plate segments.
<figref idref="f0003">3</figref> shows another embodiment of the invention. In a way with the embodiments of<figref idref="f0001">Figures 1A</figref>, B and 2, a plurality of substrate plate segments 212a-c are arranged next to one another and each surrounded by side walls in a sealed manner to the edge regions of each substrate plate segment. The side walls terminate with their upper edges flush with a surface 221 along which a slider 233 of a powder application device moves in a direction 231 with its lower edge serving as a squeegee edge. The pusher 233 applies a layer of powder above the substrate plate segments 212a-c in one working stroke and pushes excess powder into a collecting trough 234.
A laser beam source 240 is also provided, which serves to selectively cure predetermined areas of the applied powder layer above each substrate plate segment. A controller for the production device is provided, which is designed in such a way that after each layer application process, predetermined areas above each substrate plate segment are cured by means of the laser beam source 240, as previously described.
In contrast to those in the<figref idref="f0001">Figures 1A</figref>, B and 2 is in the embodiment according to FIG<figref idref="f0003">3</figref> a respective actuator 214a-c, which is used to individually adjust the height of the substrate plate segments 212a-c and thereby individually change the distance between the upper surface of the respective substrate plate segment and the plane in which the squeegee edge of the slide 133 moves, not part of a Module, which is used in a recording device. Instead, these actuators 214a-c are integrated into the fixture 220 and the substrate plate segments 212a-c can be detachably coupled to the actuators 214a-c.
with the inside<figref idref="f0003">3</figref> In the embodiment shown, a quasi-continuous production of products can thus be carried out in the same way by means of a generative production process such as SLS (Selective Laser Sintering) or SLM (Selective Laser Melting), with products being produced simultaneously in several substrate plate segments, which are in a different production stage for each substrate plate segment are. This is achieved by the fact that the height of the substrate plate segments can be adjusted individually and it is thereby achieved that a powder bed is applied above each substrate plate segment, the height of which differs between adjacent substrate plate segments, although the respective new layers of the curable material are applied in a single operation by means of a single slide 133 is applied to the plurality of substrate plate segments 212a-c.
<figref idref="f0004">4</figref> shows a fourth embodiment of the invention, which is characterized by certain features. In the<figref idref="f0004">4</figref> The embodiment shown is based on the fundamentally similar principle as that in FIGS<figref idref="f0001 f0002 f0003">Figures 1A - 3</figref> embodiments shown and has a substrate plate segment 312a, which can be arranged adjacent to other substrate plate segments (not shown) and can be individually adjusted in its height. It is to be understood that the<figref idref="f0004">4</figref> principle explained below on the in the<figref idref="f0001 f0002 f0003">Figures 1A - 3</figref> illustrated embodiments can be applied.
<figref idref="f0004">4</figref> shows a first dosing module 310a, which serves as a dosing platform and is filled with powder before the start of a manufacturing process. For this purpose, a height-adjustable base plate 312a is moved to the lowest position within the dosing module. A radiator field 380 is arranged above the dosing module 310a, which preheats the powder filled into the dosing module 310a.
A squeegee 333 is horizontally displaceable along a direction 331 . A heating strip 335 is arranged in front of the doctor blade 333 in the direction of movement, which continuously heats the powder moved through the doctor blade or keeps it at the preheated temperature.
Adjacent to the dosing module 310a, the substrate plate segment 312b is arranged in a building module 310b. The substrate plate segment 312b is individually and independently of the base plate 312a vertically displaceable in the building module 310a.
In relation to the direction of movement 331 of the squeegee 333, the construction module 310b lies between the dosing module 310a and a collection module 310c, which is used to collect excess powder that the squeegee 333 has pushed over the construction module 310b. A base plate 312c is also arranged in the collecting module 310c and can be vertically displaced individually and independently of the base plate 312a and the substrate plate segment 312b.
Basically, it should be understood that the in<figref idref="f0004">4</figref> The embodiment shown can also have several such construction modules substrate plate segments instead of the illustrated individual construction module 310b with substrate plate segment 312b. These several building modules would be arranged next to one another in the application direction 313 and the majority of the substrate plate segments would be placed overall between a dosing module 310a arranged at one end with respect to the displacement path 331 of the doctor blade 333 and a collecting module 310c arranged at the other end.
A radiator array 380c is also arranged above the collection module 310c, which is used to keep the excess material collected in the collection module at a desired temperature.
A heater 315b is built into the substrate plate segment 312b, which keeps the substrate plate segment and the powder bed arranged on it at a desired temperature.
In the<figref idref="f0004">4</figref> The embodiment shown is optimized overall in such a way that a desired, preheated powder state of the powder is achieved before the selective curing process by the radiator fields 380a, b, the heating band 335 and the heater 315b being provided.
The one with the in<figref idref="f0004">4</figref> The manufacturing process that can be achieved in the illustrated embodiment consists of a sequence in which first the substrate plate segment 312b is lowered by a certain amount, which corresponds to the layer thickness to be applied, and the platform 312a of the dosing module 315a is raised by a certain amount, which results from the cross section of the platform and calculated based on the powder volume required for the subsequent application process.
The preheated powder volume from the area of the dosing module is then pushed over the substrate plate segment 312b by horizontal movement of the squeegee 333 and a layer is thereby applied to the substrate plate segment 312b or possibly further substrate plate segments. Excess powder is fed into the collection module.
After this powder layer has been applied, the powder layer is selectively cured in predetermined areas by means of a laser 340 and the areas cured in the process are connected to previously cured areas in the underlying layer.
The squeegee 333 then moves back, with the previously hardened areas being surface-ground by means of a grinding device, which is arranged in front of the squeegee in the direction of movement from left to right, in order to improve the geometric accuracy of the generatively manufactured product and the connection of the subsequent areas to be cured. As an alternative to this configuration, in which the grinding process is carried out in a return stroke process of the coating device, it is possible to carry out the grinding process together with the production step of renewed powder application grinding device is in the direction of movement of the powder application in front of the position at which the powder is applied.
After the squeegee 333 in its in<figref idref="f0004">4</figref> Once returned to the right hand position shown, the process begins again and is repeated until the product to be created is completed above substrate plate segment 312b or any other substrate plate segment arranged in a series of substrate plate segments. The laser beam of the laser beam source 340 is guided selectively over each layer in such a way that previously calculated areas of this layer, which correspond to the cross section of the products to be produced in the respective layer on all substrate plate segments, are selectively cured.
After completion of the manufacturing process, the product can be separated from the substrate plate segment. In this context, it should be understood that several products can also be manufactured above a substrate plate segment and that several substrate plate segments can also be coated next to one another in different production stages with the single squeegee 333 and selectively cured with the single laser 340 .
The powder collected in the collecting module 310c can be raised by raising the platform 312c and conveyed back from left to right into the dosing insert by moving the squeegee 333 accordingly, in order to start a new manufacturing process and use the powder again. Alternatively, the function of the dosing module and collection module can now be swapped over in the subsequent production process, so that the layer application process now takes place by moving the squeegee from left to right and the grinding process by a correspondingly reverse movement from right to left. In this case, the mobile unit consisting of the heating strip, doctor blade and grinding device should preferably be designed to be adjustable by 180° around a vertical axis.
<figref idref="f0005">figure 5</figref> shows another embodiment of the invention. In the<figref idref="f0005">figure 5</figref> The manufacturing arrangement shown comprises a process chamber 1000, which has a first lock 1010 and a second lock 1020.
Substrate plate segments are fed through the first lock 1010 and placed on a conveyor belt 1030 . The substrate plate segments are temporarily stored on this conveyor belt and can be preheated if necessary.
The substrate plate segments can be placed on a construction platform 420b of a construction insert 410b by means of a robot arm 1040 in order to produce generative products thereon. The building block 410b is as before with respect to the embodiment according to FIG<figref idref="f0004">4</figref> explained with regard to the three modules 312a-c shown there, flanked by a dosing insert 410a and a receiving insert 410c and it is to be understood that several substrate plate segments can also be arranged next to each other between the dosing insert and the receiving insert in order to achieve quasi-continuous production in the previously explained way to perform.
After completion of the generatively manufactured products in the module, at in<figref idref="f0005">figure 5</figref> illustrated embodiment, the substrate plate segment 412b can be moved into a lower position. In this lower position, the installation space above the substrate plate segment 412b is connected to a powder suction channel 490, which is embedded in the wall which delimits the installation space as a side wall. The uncured powder can then be sucked out of the area above the substrate plate segment 412b via this powder suction channel 490 .
The powder suction channel 490 is also designed in such a way that the powder pushed into the collecting tray can also be sucked out through the suction channel 490, it being understood that this may or may not be provided as an optional additional function. In this regard, reference is made in particular to the different modes of operation of the embodiment with dosing module and collection module, which correspond to the embodiment according to FIG<figref idref="f0004">4</figref> were explained.
After the non-hardened powder has been sucked out of the area above the substrate plate segment 412b, the construction platform can be moved vertically to the uppermost position and the substrate plate segment 412b can again be gripped by the robot arm 1040 and fed to a second conveyor belt 1050.
The second conveyor belt 1050 is used to convey the substrate plate segment 412b together with the products arranged on it through a tempering oven 1060 in order to subject the products situated thereon to tempering and thereby produce the desired component properties. After the tempering has taken place, the substrate plate segment 412b can be removed from the process chamber 1000 through the lock 1020 .
By building according to<figref idref="f0005">figure 5</figref> it becomes possible to carry out both the preheating and provision of the plates, as well as the entire additive manufacturing and powder handling as well as the subsequent tempering in a controlled atmosphere, in particular an inert gas or active gas atmosphere within a process chamber 1000.
<figref idref="f0006">6</figref> shows a further aspect of the device according to the invention and of the method according to the invention. are shown in<figref idref="f0006">6</figref> four substrate plate segments 512a-d arranged in two rows and two columns. As can be seen, each of the substrate plate segments is individually adjustable in height by means of a respective lifting/lowering device 514a-d. Both the substrate plate segments in a row and the substrate plate segments in a column can be vertically displaced independently of one another, so that products can be produced generatively in different production stages on each of the substrate plate segments.
Partition walls are to be provided between the respective substrate plate segments for the purpose of the individual construction of a powder bed above the respective substrate plate segment. In the embodiment shown, it is provided that these partitions are not part of the device, but that the partitions are continuously built up by selective hardening of the powder material in the edge area of the respective substrate plate segments and consequently grow vertically with the generatively manufactured product in the central area of the substrate plate segment. As an alternative to this, it can be provided that partition walls are provided as part of the production device and are arranged in such a way that their upper edge is flush with a plane in which a powder application blade moves.
<figref idref="f0007">7</figref> shows a seventh embodiment of the invention. The embodiment has an endless conveyor belt 620 along which a plurality of substrate plate segments 612a-e are arranged in the conveying direction 621.
The substrate plate segments 612a-e are placed such that their top surface lies in a common plane.
A plurality of coating devices 630a-d are arranged above the substrate plate segments 612a-e. The individual coating devices 630a-d each comprise a squeegee 633a-d. The bottom edge of the squeegee 633a is spaced one layer from the surface of the substrate plate segments 612a-e. The lower edge of squeegee 633b is one layer further away from the surface of the substrate plate segments 612a-e than the previous squeegee 633a, and in the same way the lower edges of the squeegee 633c, d are correspondingly one layer thickness more from the surface of the substrate plate segments compared to the preceding, adjacent squeegee raised.
Basically, the in<figref idref="f0007">7</figref> illustrated embodiment is to be understood in such a way that a large number of individual coating devices a, b, c, d . . . arranged next to one another are provided in such a vertically staggered height arrangement.
Between each two layer application devices 633a, b, c . . . there is an area in which the applied layer can be selectively cured by means of a laser 640a, b, c, d. A corresponding laser is assigned to each individual coating device.
The conveyor belt 620 is moved continuously or discontinuously during production in such a way that the upper run moves in the in<figref idref="f0007">7</figref> shown constellation moved from right to left. As a result, a material bed is applied by successive layers above the substrate plate segments 612a, b, c . . . In the same way, the overall height of the products produced additively on the respective substrate plate segments increases.
The principle of the<figref idref="f0007">7</figref> The embodiment shown is to be understood on the one hand that the desired height of the powder bed and thus the manufactured products can be achieved by a large number of powder application devices and the sum of the layers applied with these powder application devices in one movement of the conveyor belt. Alternatively, the conveyor belt 620 can also be reciprocally moved back and forth several times during a manufacturing process and the multiple powder application devices or the conveyor belt can be displaced vertically in order to apply a number of M x N powder layers during a manufacturing process using a number of N powder application devices, where M corresponds to the number of reciprocating movements of the conveyor belt. Here it is to be understood that after each reciprocal movement of the conveyor belt, the N powder application devices are raised by an amount or the conveyor belt is lowered by an amount which corresponds to N times the layer thickness in order to achieve that the furthest to the right and consequently the lowest lying powder application device in the subsequent application process applies its layer to the layer previously applied by the furthest to the left and consequently the highest arranged powder application device.
After the products have been finished accordingly, the uncured powder material 590 is suctioned off in the conveying direction to the left of the conveyor belt 520 from the area above a substrate plate segment on which the finished products lie. It is to be understood that such a powder suction takes place only above the substrate plate segment lying furthest to the left, whereas the substrate plate segment lying to the right is not yet sucked off due to the products which are generally not yet finished there. This can be achieved by means of partitions constructed in parallel between the substrate plate segments.
After the non-hardened powder has been sucked off, the products produced on the substrate plate segment can be separated from it. If necessary, after this separation process, the surfaces of the substrate plate segment can be prepared flat again by means of a device for surface smoothing arranged to the left of the suction device, in particular a milling or grinding station or a device for laser smoothing, in order to subsequently feed the substrate plate segment into a new additive manufacturing process.
It is to be understood that the multiple radiation sources can be provided by individual laser sources, respectively, or by one or more laser sources whose beam can be split and consequently directed to a corresponding number of locations. It should also be understood here that the divided beam and the multiple beam paths generated from it can also be guided individually over the respective layers by appropriate radiation guide means in order to selectively cure each layer individually. According to the invention, the layer application process for all substrate plate segments takes place in a common first operation, followed by a selective curing process in a second operation. With a corresponding number of individual coating devices, this can take place with continuous movement of the conveyor belt or—with reciprocal movement of the conveyor belt—in a quasi-continuous process.
<figref idref="f0008">8</figref> a further embodiment of the invention can be seen. In this embodiment, a plurality of substrate plate segments 712a, b are arranged one above the other and the installation space above the respective substrate plate segments is limited by common side walls 715-718. The substrate plate segments 712a, b . Using a layer application device, layers are applied iteratively in the installation space provided above the uppermost substrate plate segment 712b and selectively cured using a laser beam source. It should be understood here that the layer application process can be carried out in the same way as explained above using a squeegee. This squeegee moves at the in<figref idref="f0008">8</figref> shown embodiment in a horizontal plane, ie perpendicular to the conveying direction of the substrate plate segments 712a, b.
As soon as a sufficiently high powder bed has been applied above a substrate plate segment and the generatively manufactured product embedded therein is finished, a new substrate plate segment can be placed on top of it, being coupled in a corresponding manner to a conveyor device for the vertical movement.
The substrate plate segments with finished products built on them can be removed in a production section arranged below the layer application device and the construction space in which generative production is carried out, in that the powder is sucked off and the products are separated from the substrate plate segment. For this purpose, in particular, a duct suction can be used, as with respect<figref idref="f0005">figure 5</figref> was explained in order to subsequently promote the products in an area that is not limited by side walls and thereby allow the removal of the products or the entire substrate plate segment from the vertical conveyor.
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| Document | Relation | Office |
|---|---|---|
| DE102007047326A1 | Cites | Germany |
| DE29907262U | Cites | Germany |
6 members in 3 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 09168566 | European Patent Office (EPO) | A | |
| EP20090168566 | – | – | – |
Members6
| Document | Office | Kind | |
|---|---|---|---|
| EP2289652A1 | European Patent Office (EPO) | A1 | |
| WO2011023714A1 | World Intellectual Property Organization (WIPO) | A1 | |
| US2012211155A1 | United States of America | A1 | |
| EP2289652B1 | European Patent Office (EPO) | B1 | |
| US9067360B2 | United States of America | B2 | |
| EP2289652B2This record | European Patent Office (EPO) | B2 |
85 legal events, as 9 offices reported them to INPADOC
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|---|---|---|---|
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
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| Designated contracting statesAK | AK | EP | |
| Epo decision maintaining patent in amended form now finalR102 | R102 | DE | |
| Patent maintained in amended formORIGINAL CODE: 0009272PUAH | PUAH | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: PATENT MAINTAINED AS AMENDEDSTAA | STAA | EP | |
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| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
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| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapse because of not paying annual feesLapsedMM01 | MM01 | AT | |
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| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Gb: european patent ceased through non-payment of renewal feeCeasedGBPC | GBPC | EP | |
| Opposition filed against patentOppositionR026 | R026 | DE | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
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| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
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| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
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| Opposition filed against patentOppositionR026 | R026 | DE | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
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| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Invalidated european patentMG4D | MG4D | LT | |
| Discontinued in the netherlands as no translation has been filedVDEP | VDEP | NL | |
| Dpma publication of mentioned ep patent grantGrantedR096 | R096 | DE | |
| European patents granted designating irelandGrantedLANGUAGE OF EP DOCUMENT: GERMANFG4D | FG4D | IE | |
| Reference to at number (ep patent validated in austria)REF | REF | AT | |
| European patent takes effect as a national patent in ch/liEP | EP | CH | |
| Designated contracting statesAK | AK | EP | |
| European patent grantedGrantedNOT ENGLISHFG4D | FG4D | GB | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
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| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Amendment of ipc main classPREVIOUS MAIN CLASS: B22F0003105000R079 | R079 | DE | |
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| Designated contracting statesAK | AK | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 2289652
- Publication, DOCDB
- 2289652
- Publication, EPODOC
- EP2289652
- Application
- 91685669
- Application, DOCDB
- 09168566
- Application, EPODOC
- EP20090168566
Titles3
- German
- Vorrichtung und Verfahren zur generativen Fertigung
- English
- Device and method for generative production
- French
- Dispositif et procédé de fabrication générative
Classification
- CPC, 11
- B29C64/176
- A61C13/0013
- A61C13/0018
- B29C64/153
- B22F10/28
- B22F10/66
- B22F12/86
- B22F12/13
- B22F10/68
- B22F10/32
- Y02P10/25
- IPC, 1
- B29C64 153
Designated states1
- Contracting states, 1
- Türkiye
