Subsea electronic modules
Abstract
A module for use as a subsea electronic module of a subsea well, comprises an input (7) for receiving signals from a sensor arrangement which senses at least one parameter of a well, the module including a plurality of separate, different electronic circuits (9), each of which is selectable to be in communication with said input and each of which is adapted to co-operate with a respective, different form of such a sensor arrangement.

Term
Projected expiry 27 April 2030.
- Priority
- Filed
- Published
- Today
- Projected expiry
3 claims: 1 independent, 2 dependent
- 1A module for use as a subsea electronic module of a subsea well, comprising an input for receiving signals from a sensor arrangement which senses at least one parameter of a well, wherein the module includes a plurality of separate, different electronic circuits, each of which circuits is selectable to be in communication with said input, wherein each of said circuits is adapted to co-operate with a respective form of one of a plurality of different sensor arrangements each of which senses the same at least one parameter of a well.
18 paragraphs, as filed
Field of the Invention
The present invention relates to subsea electronic modules.
Background of the Invention
Environmental conditions in subsea wells, such as hydrocarbon extraction wells, are monitored by pressure and/or temperature sensor arrangements located 'downhole' at the base of the well bore. Such sensor arrangements are manufactured by at least ten separate manufacturers and each requires an electronic card, supplied by the manufacturer, to interface between the electrical output of the sensor arrangement and the Intelligent Well Interface Standardisation (IWIS) standard adopted by the well operator. Such interface cards are typically located within a subsea electronic module (SEM) normally housed within a subsea control module (SCM) mounted on the well Christmas tree. As an alternative, some SEM suppliers house the cards in a separate container, along with the need for additional connectors. Either method requires a tailor-made configuration of an SEM or separate container for a particular installation, dependent on the well operator's preferences for sensor arrangement type and manufacturer, thus resulting in lack of standardisation and addition and costs to supply SEMs. Furthermore, the delivery timescales of manufacturers' cards invariably do not match the delivery requirements of the well system. This invention substantially reduces the need for tailoring SEMs to cater for different sensor arrangements and thus facilitates SEM standardisation, resulting in cost and delivery delay reduction.
Summary of the Invention
According to the present invention, there is provided a module for use as a subsea electronic module of a subsea well, comprising an input for receiving signals from a sensor arrangement which senses at least one parameter of a well, wherein the module includes a plurality of separate, different electronic circuits, each of which circuits is selectable to be in communication with said input, wherein each of said circuits is adapted to co-operate with a respective form of one of a plurality of different sensor arrangements each of which senses the same at least one parameter of a well.
Preferably, said circuits are carried by a circuit card in the module.
In the following embodiment of the invention, said circuits are or conform to the circuitries of respective ones of different sensor arrangement manufacturers, incorporated as IWIS interface cards on to said circuit card. This permits the use of the different sensor arrangements, thus avoiding having to tailor the SEM to suit just a respective installation, and the use of a circuit card having the standard card format of the SEM.
Brief Description of the Drawings
<ul id="ul0001" list-style="none"><li><figref idref="f0001">Fig. 1</figref> is a longitudinal sectional view of an SEM incorporating the invention; and</li><li><figref idref="f0001">Fig. 2</figref> is a cross-sectional view of the SEM.</li></ul>
Description of Embodiment of the Invention.
SEMs contain a multiplicity of printed circuit electronic cards to implement the electronic control and monitoring of the well and the surface platform to well communication system. The format of the printed circuit cards is typically standardised to facilitate commonality of their mechanical mounting arrangement.
<figref idref="f0001">Fig. 1</figref> shows schematically a longitudinal sectional view of a typical SEM. The electronics is housed in a sealed cylindrical container 1, with a power supply 2, and typically divided into a number of bays to facilitate standardisation to accommodate various sizes of installation. In this example, three bays 3, 4 and 5 are shown, each accommodating a number of standard format printed circuit cards 6, which communicate with each other and externally through connectors 7 via a printed motherboard 8. <figref idref="f0001">Fig. 2</figref> is a cross-sectional view through the bay 3.
Previous catering in an SEM for the pressure and/or temperature sensor arrangement of a particular manufacturer required special mechanical and electrical connection arrangements. This invention allows the standard format of SEM electronic cards to be utilised by the incorporation of sensor circuitries conforming with those of different sensor arrangements and at the same time facilitates standard electrical interconnection (via the motherboard). In the present embodiment, in bay 3, there is a standard SEM card which carries separate electronic circuits 9, each being adapted to conform with a particular, different manufacturer's circuitry, for co-operating with that manufacturer's sensor arrangement, the circuits 9 being selectable to be in communication with such a sensor arrangement in use of the SEM.
Investigation has shown that typically circuits 9 conforming with the circuitries of four different manufacturers can be incorporated on a standard SEM electronic card and in general this is adequate to accommodate most applications.
An alternative to integrating circuits 9 on to a standard SEM board is to fix the manufacturers' circuit boards on to a blank SEM board. In general this is not the preferred arrangement since the assembly costs are greater and the board is likely to take up two board spaces in the SEM board locating rack.
Advantages of using the invention
<ol id="ol0001"><li>1/ Removal of dependency of delivery of sensor cards from various manufacturers.</li><li>2/ Removal of the need for the tailoring of SEMs to cater for a variety of sensor arrangements and thus facilitates SEM standardisation, resulting in cost reduction.</li></ol>
2 sheets
Sheet 1 Sheet 2
11 members in 5 offices
Priority claims5
| Document | Office | Kind | Date |
|---|---|---|---|
| 0911395 | United Kingdom | A | |
| 0911395 | United Kingdom | A | |
| 0911395 | United Kingdom | – | |
| 0911395 | – | – | – |
| GB20090011395 | – | – | – |
Members11
| Document | Office | Kind | |
|---|---|---|---|
| GB0911395D0 | United Kingdom | D0 | |
| GB2471496A | United Kingdom | A | |
| US2011001483A1 | United States of America | A1 | |
| AU2010202699A1 | Australia | A1 | |
| EP2282005A2This record | European Patent Office (EPO) | A2 | |
| BRPI1002047A2 | Brazil | A2 | |
| US8373418B2 | United States of America | B2 | |
| GB2471496B | United Kingdom | B | |
| EP2282005A3 | European Patent Office (EPO) | A3 | |
| AU2010202699B2 | Australia | B2 | |
| BRPI1002047A8 | Brazil | A8 |
14 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTAA | STAA | |
| Request for examination filed17P | 17P | |
| Designated contracting states (corrected)RBV | RBV | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Search report despatchedPUAL | PUAL | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phasePUAI | PUAI |
Numbers
- Publication
- 2282005
- Publication, DOCDB
- 2282005
- Publication, EPODOC
- EP2282005
- Application
- 10161146
- Application, DOCDB
- 10161146
- Application, EPODOC
- EP20100161146
Titles3
- German
- Unterwasserelektronikmodule
- English
- Subsea electronic modules
- French
- Modules électroniques sous-marins
Classification
- CPC, 5
- E21B33/0355
- E21B47/001
- E21B47/12
- H05K1/14
- H05K7/14
- IPC, 3
- E21B47 00
- E21B33 035
- E21B47 12
Designated states40
- Contracting states, 36
- Austria
- Belgium
- Bulgaria
- Switzerland
- Cyprus
- Czechia
- Germany
- Denmark
- Estonia
- Spain
- Finland
- France
- United Kingdom
- Greece
- Croatia
- Hungary
- Ireland
- Iceland
- Italy
- Liechtenstein
- Lithuania
- Luxembourg
- Latvia
- Monaco
and 12 moreShow fewer
- North Macedonia
- Malta
- Netherlands (Kingdom of the)
- Norway
- Poland
- Portugal
- Romania
- Sweden
- Slovenia
- Slovakia
- San Marino
- Türkiye
- Extension states, 4
- Albania
- Bosnia and Herzegovina
- Montenegro
- Serbia