Light-emitting diode and a method of manufacturing thereof

[Technical Field]

0001The disclosure relates to a light emitting device and a manufacturing method thereof.

[Background Art]

0002Recently, a light emitting diode (LED) is spotlighted as a light emitting device. Since the LED can convert electric energy into light energy with high efficiency and long life span of about 5 years or more, the LED can remarkably reduce the energy consumption and repair and maintenance cost. In this regard, the LED is spotlighted in the next-generation lighting field.

0003Such an LED includes a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, in which the active layer generates light according to current applied thereto through the first and second conductive semiconductor layers.

0004The LED may be classified into a lateral type LED and a vertical type LED.

0005According to the lateral type LED, a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer are formed on a growth substrate, and the second conductive semiconductor layer, the active layer and the first conductive semiconductor layer are partially removed such that a part of the first conductive semiconductor layer can be exposed to form an electrode layer. Thus, the light emitting area may be reduced so that the light efficiency may be degraded.

0006In addition, according to the lateral type LED, since the first conductive semiconductor layer, the active layer and the second conductive semiconductor layer are formed on the growth substrate having low thermal conductivity, the heat dissipation is not easy.

0007In contrast, according to the vertical type LED, a first electrode layer is formed on the first conductive semiconductor layer and a second electrode layer is formed under the second conductive semiconductor layer, so it is not necessary to remove the active layer to form the electrode layer. Thus, the light emitting area may not be reduced, so that the light efficiency may be improved as compared with that of the lateral type LED.

0008In addition, according to the vertical type LED, heat is transferred through the second electrode layer, so the heat dissipation is easy.

0009Meanwhile, the vertical type LED may employ the electroplating scheme and the wafer bonding scheme when the second electrode serving as a support substrate is formed under the second conductive semiconductor layer.

0010If the support substrate is manufactured through the electroplating scheme, the manufacturing process may be facilitated, but the reliability of the LED may be degraded. In addition, if the support substrate is manufactured through the wafer bonding scheme, the manufacturing process may be complicated, but the reliability of the LED may be improved.

0011In particular, if the support substrate is manufactured through the wafer bonding scheme, since the growth substrate and the support substrate are made from heterogeneous materials, the crack or debonding may occur in the LED after the wafer has been bonded due to thermal stress caused by difference in thermal expansion coefficient.

0012Prior art document <patcit id="pcit0001" dnum="US20040169181A1"><text>US 2004/0169181 A1</text></patcit> discloses a light emitting diode chip emitting blue light in response to applied electrical power which includes a passivation layer between the thin film layer and LED chip and a second passivation layer over the thin film layer.

0013Prior art document <patcit id="pcit0002" dnum="EP0854524A2"><text>EP 0 854 524 A2</text></patcit> discloses a group III-nitride semiconductor device that has a low voltage-drop p-contact and comprises a substrate layer, a metal electrode and an intermediate layer sandwiched between the substrate layer and the metal electrode.

0014Prior art document <patcit id="pcit0003" dnum="US6891871B1"><text>US 6,891,871 B1</text></patcit> discloses a semiconductor luminescent element with a dielectric film containing sequentially a silicon nitride film on a boundary surface side and a silicon oxide film on a reverse side.

[Disclosure]

[Technical Problem]

0015The embodiment provides a light emitting diode having a novel structure and a manufacturing method thereof.

[Technical Solution]

0016A light emitting device according to the embodiment may include a light emitting diode as recited in claim 1. A method of manufacturing a light emitting device according to the embodiment may include the steps as recited in claim 14.

[Advantageous Effects]

0017The embodiment can provide a light emitting device having a novel structure and a manufacturing method thereof.

[Description of Drawings]

0018<ul id="ul0001" list-style="none" compact="compact"><li><figref idref="f0001 f0002 f0003">FIGS. 1 to 10</figref> are views showing the procedure for manufacturing a light emitting device according to the first embodiment;</li><li><figref idref="f0004 f0005 f0006">FIGS. 11 to 19</figref> are views showing the procedure for manufacturing a light emitting device according to the second embodiment;</li><li><figref idref="f0006 f0007 f0008 f0009 f0010 f0011">FIGS. 20 to 33</figref> are views showing the procedure for manufacturing a light emitting device according to the third embodiment; and</li><li><figref idref="f0011 f0012 f0013 f0014 f0015">FIGS. 34 to 46</figref> are views showing the procedure for manufacturing a light emitting device according to the fourth embodiment.</li></ul>

[Best Mode]

[Mode for Invention]

0019In the description of the embodiments, it will be understood that, when a layer (or film), a region, a pattern, or a structure is referred to as being "on" or "under" another substrate, another layer (or film), another region, another pad, or another pattern, it can be "directly" or "indirectly" on the other substrate, layer (or film), region, pad, or pattern, or one or more intervening layers may also be present. Such a position of the layer has been described with reference to the drawings.

0020The thickness and size of each layer shown in the drawings may be exaggerated, omitted or schematically drawn for the purpose of convenience or clarity. In addition, the size of elements does not utterly reflect an actual size.

0021<figref idref="f0001 f0002 f0003">FIGS. 1 to 10</figref> are views showing the procedure for manufacturing a light emitting device according to the first embodiment.

0022Referring to <figref idref="f0001">FIG. 1</figref>, a light emitting semiconductor layer including a first conductive (conductivity) semiconductor layer 502, an active layer 503 and a second conductive semiconductor layer 504 is formed on a growth substrate 501.

0023In addition, the light emitting semiconductor layer is mesa-etched to form a plurality of unit devices, and a first passivation layer 509 is formed such that the light emitting semiconductor layer is surrounded by the first passivation layer 509. Then, the first passivation layer 509 is removed in such a manner that the second conductive semiconductor layer 504 can be partially exposed and an ohmic contact layer 510 is formed on the second conductive semiconductor layer 504.

0024After that, a reflective layer 511 is formed on the first passivation layer 509 and the ohmic contact layer 510 and a first wafer bonding layer 508 is formed on the reflective layer 511, thereby forming a first structure 100.

0025For instance, the growth substrate 501 may include one selected from the group consisting of Al₂O₃, SiC, Si, AIN, GaN, AlGaN, glass, and GaAs.

0026Although not shown in the drawings, a buffer layer including at least one of InGaN, AIN, SiC, SiCN, and GaN can be formed the growth substrate 501 before the first conductive semiconductor layer 502 is grown on the growth substrate 501.

0027The light emitting semiconductor layer including the first conductive semiconductor layer 502, the active layer 503 and the second conductive semiconductor layer 504 can be formed by using group-III nitride-based semiconductor elements. For instance, the first conductive semiconductor layer 502 may include a GaN layer including n type impurities such as Si, and the second conductive semiconductor layer 504 may include a GaN layer including p type impurities such as Mg. In addition, electrons are recombined with holes at the active layer 503 so that the active layer 503 generates light. The active layer 503 may include one of InGaN, AlGaN, GaN, and AlInGaN. The wavelength of the light emitted from the light emitting device may vary depending on materials used for the active layer 503.

0028Although not shown in the drawings, an interface modification layer can be formed on the second conductive semiconductor layer 504.

0029The interface modification layer may include the superlattice structure, one of InGaN, GaN, AlInN, AIN, InN and AlGaN doped with first conductive impurities, one of InGaN, GaN, AlInN, AIN, InN and AlGaN doped with second conductive impurities, or one of group-III nitride-based elements having nitrogen-polar surfaces. In particular, the interface modification layer having the superlattice structure may be formed by using nitride or carbon nitride including group-II, group-III, or group-IV elements.

0030The first passivation layer 509 is formed at an upper peripheral portion of the light emitting semiconductor layer while surrounding the lateral sides of the light emitting semiconductor layer. For instance, the first passivation layer 509 may include an electric insulating material, such as SiO₂, Al₂O₃, or SiN_x. The first passivation layer 509 may have a thickness of about 10nm to 100nm.

0031An ohmic contact interface is formed between the ohmic contact layer 510 and the second conductive semiconductor layer 504. For instance, the ohmic contact layer 510 may include at least one of ITO, ZnO, IZO, and NiO-Au.

0032A current blocking area can be formed on the ohmic contact layer 510 in order to spread current by preventing the current applied to the light emitting semiconductor layer from being concentrated onto a local area. For instance, the current blocking area may include an electric insulating material, an empty space filled with air or a material forming a schottky contact interface with respect to the second conductive semiconductor layer 504.

0033The reflective layer 511 is formed on the ohmic contact layer 510 and the first passivation layer 509 and has an area larger than that of the ohmic contact layer 510.

0034For instance, the reflective layer 511 may include one selected from the group consisting of Ag, an Ag alloy, a solid solution including Ag, Rh, a Rh alloy, a solid solution including Rh, Al, an Al alloy, a solid solution including Al, Pt, a Pt alloy, a solid solution including Pt, Pd, a Pd alloy, a solid solution including Pd, a Pt alloy, a solid solution including Pt, Au, an Au alloy, a solid solution including Au, Ni, a Ni alloy, a solid solution including Ni, and silicide such as Ag-Si, Rh-Si, Pd-Si, Ni-Si, Cr-Si or Pt-Si.

0035The first wafer bonding layer 508 is formed on the reflective layer 511 and includes a material having electric conductivity such that the first wafer bonding layer 508 may represent strong bonding strength under the predetermined pressure and the temperature of 300°C to 600°C.

0036For instance, the first wafer bonding layer 508 may include at least one selected from the group consisting of Au, Ag, Al, Si, Ge, W, Mo, V, Sc, Hf, Ir, Re, Co, Zr, Ru, Ta, Nb, Mn, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and rare-earth metal.

0037Referring to <figref idref="f0001">FIG. 2</figref>, a second structure 200 is prepared. The second structure 200 includes a support substrate 601 formed at top and bottom surfaces thereof with second and third wafer bonding layers 602 and 603, respectively.

0038The support substrate 601 is an electric conductive layer. The support substrate 601 may be a wafer substrate including at least one of Si, SiGe, ZnO, GaN, AlSiC and GaAs, or may be a metal, an alloy or a solid solution including at least one of Cu, Ni, Ag, Al, Nb, Ta, Ti, Au, Pd, and W.

0039The support substrate 601 can be prepared in the form of a sheet, a disk, or a foil having a thickness of about 5µm to 1mm. The support substrate 601 can be formed through the electro-plating, physical vapor deposition (PVD), or chemical vapor deposition (CVD).

0040Similar to the first wafer bonding layer 508, the second and third wafer bonding layers 602 and 603 may include at least one selected from the group consisting of Au, Ag, Al, Si, Ge, W, Mo, V, Sc, Hf, Ir, Re, Co, Zr, Ru, Ta, Nb, Mn, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and rare-earth metal.

0041Referring to <figref idref="f0001">FIG. 3</figref>, a third structure 300 is prepared. The third structure 300 includes a sacrificial separation layer 702 and a fourth wafer bonding layer 703 formed on a temporary substrate 701.

0042The temporary substrate 701 may include a material representing difference in thermal expansion coefficient within 2ppm/°C with respect to that of the growth substrate 501. The temporary substrate 701 can be formed by using a material the same as that of the growth substrate 501. For instance, the temporary substrate 701 may include one of Al₂O₃, SiC, Si, and GaAs.

0043The sacrificial separation layer 702 may include one of group II-VI compounds including ZnO, which is subject to the thermal-chemical decomposition reaction as laser beam is irradiated thereto; group III-V compounds including GaN; ITO; PZT; and SU-8. In addition, the sacrificial separation layer 702 may include one of Al, Au, Ag, Cr, Ti, SiO₂, and SiN_x, which are rapidly dissolved in a wet solution.

0044Similar to the first wafer bonding layer 508, the fourth wafer bonding layer 703 may include at least one selected from the group consisting of Au, Ag, Al, Si, Ge, W, Mo, V, Sc, Hf, Ir, Re, Co, Zr, Ru, Ta, Nb, Mn, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and rare-earth metal.

0045Referring to <figref idref="f0001">FIG. 4</figref>, a complex structure is formed by bonding the first structure 100 shown in <figref idref="f0001">FIG. 1</figref>, the second structure 200 shown in <figref idref="f0001">FIG. 2</figref> and the third structure 300 shown in <figref idref="f0001">FIG. 3</figref>.

0046The first wafer bonding layer 508 is bonded to the second wafer bonding layer 602, and the third wafer bonding layer 603 is bonded to the fourth wafer bonding layer 703.

0047The first to third structures 100, 200 and 300 can be bonded under the predetermined pressure and the temperature of about 300°C to 600°C at the atmosphere of vacuum, nitrogen (N₂), or argon (Ar).

0048The third structure 300 is disposed in opposition to the first structure 100 about the second structure 200. Since the thermal expansion coefficient of the first structure 100 is similar to that of the third structure 300, the crack or debonding caused by the difference in the thermal expansion coefficient can be prevented when the first structure 100 is bonded with the second structure 200.

0049Therefore, the first and second structures 100 and 200 can be bonded at the temperature of 300°C or above where the difference in the thermal expansion coefficient may exert great influence upon the first and second structures 100 and 200.

0050Referring to <figref idref="f0002">FIG. 5</figref>, the growth substrate 501 is separated from the complex structure shown in <figref idref="f0001">FIG. 4</figref>.

0051The growth substrate 501 can be separated through the laser lift-off scheme by using eximer laser, or the growth substrate 501 can be separated through the dry or wet etching scheme.

0052In detail, if the eximer laser beam having a predetermined wavelength is irradiated onto the growth substrate 501, thermal energy is concentrated onto the boundary surface between the growth substrate 501 and the first conductive semiconductor layer 502, so that the interface of the first conductive semiconductor layer 502 is thermo-chemically decomposed into Ga and N molecules, thereby separating the growth substrate 501.

0053Referring to <figref idref="f0002">FIG. 6</figref>, a second passivation layer 800 is formed on top surfaces of the first conductive semiconductor layer 502 and the first passivation layer 509, and lateral sides of the first passivation layer 509, the reflective layer 511 and the first wafer bonding layer 508.

0054For instance, the second passivation layer 800 may include an electric insulating material, such as SiO₂, Al₂O₃, or SiN_x. The second passivation layer 800 may have a thickness of about 100nm to 1000nm.

0055The second passivation layer 800 may be thicker than the first passivation layer 509 and can be formed by using a material different from the material for the first passivation layer 509.

0056The first and second passivation layers 509 and 800 protect the light emitting semiconductor layer from external conductive materials or moisture.

0057Referring to <figref idref="f0002">FIG. 7</figref>, the second passivation layer 800 formed on the first conductive semiconductor layer 502 is partially removed to form a light extracting structure 900 on the first conductive semiconductor layer 502.

0058The light extracting structure 900 can be prepared in the form of an irregular concave-convex pattern through the wet etching process, or in the form of a regular concave-convex pattern through the lithography process.

0059Referring to <figref idref="f0003">FIG. 8</figref>, a first electrode layer 1000 is formed on the first conductive semiconductor layer 502.

0060An ohmic contact interface is formed between the first electrode layer 1000 and the first conductive semiconductor layer 502.

0061Referring to <figref idref="f0003">FIG. 9</figref>, an isolation etching 1100 is performed to expose the temporary substrate 701 such that a plurality of light emitting structures can be formed on the temporary substrate 701.

0062Referring to <figref idref="f0003">FIG. 10</figref>, the temporary substrate 701 is removed through the laser lift-off scheme, the drying etching scheme, the wet etching scheme, the CMP scheme, or the polishing scheme.

0063When the temporary substrate 701 is removed through the laser lift-off scheme, the sacrificial separation layer 702 is thermo-chemically decomposed, so that the temporary substrate 701 can be separated.

0064Then, the third and fourth wafer bonding layers 603 and 703 are removed and a die bonding layer 1300 is formed under the support substrate 601. The die bonding layer 1300 is securely boned to a circuit board, on which the light emitting device is mounted, or a die at low resistance.

0065In this manner, the light emitting diode according to the first embodiment can be manufactured.

0066<figref idref="f0004 f0005 f0006">FIGS. 11 to 19</figref> are views showing the procedure for manufacturing a light emitting device according to the second embodiment.

0067The manufacturing method for the light emitting device according to the second embodiment is similar to that of the first embodiment, so the description about processes described in the first embodiment will be omitted in order to avoid redundancy.

0068Referring to <figref idref="f0004">FIG. 11</figref>, a light emitting semiconductor layer including a first conductive semiconductor layer 502, an active layer 503 and a second conductive semiconductor layer 504 is formed on a growth substrate 501. In addition, the light emitting semiconductor layer is mesa-etched to form a plurality of unit devices, and a first passivation layer 509 and an ohmic contact layer 510 are formed such that the light emitting semiconductor layer is surrounded by the first passivation layer 509 and the ohmic contact layer 510. Then, a reflective layer 511 is formed on the first passivation layer 509 and the ohmic contact layer 510 and a second passivation layer 800 is formed on the reflective layer 511 and the first passivation layer 509. After that, the second passivation layer 800 is partially removed in order to form a first wafer bonding layer 508 on the exposed reflective layer 511, thereby forming a first structure 100.

0069According to the second embodiment, different from the first embodiment, the second passivation layer 800 is formed when the first structure 100 is manufactured. The second passivation layer 800 surrounds the lateral side and the top surface of the reflective layer 511 and partially makes contact with the lateral side of the first wafer bonding layer 508.

0070Referring to <figref idref="f0004">FIG. 12</figref>, a second structure 200 is prepared. The second structure 200 includes a support substrate 601 formed at top and bottom surfaces thereof with second and third wafer bonding layers 602 and 603, respectively.

0071Referring to <figref idref="f0004">FIG. 13</figref>, a third structure 300 is prepared. The third structure 300 includes a sacrificial separation layer 702 and a fourth wafer bonding layer 703 formed on a temporary substrate 701.

0072Referring to <figref idref="f0004">FIG. 14</figref>, a complex structure is formed by bonding the first structure 100 shown in <figref idref="f0004">FIG. 11</figref>, the second structure 200 shown in <figref idref="f0004">FIG. 12</figref> and the third structure 300 shown in <figref idref="f0004">FIG. 13</figref>.

0073The first wafer bonding layer 508 is bonded to the second wafer bonding layer 602, and the third wafer bonding layer 603 is bonded to the fourth wafer bonding layer 703.

0074Referring to <figref idref="f0005">FIG. 15</figref>, the growth substrate 501 is separated from the complex structure shown in <figref idref="f0004">FIG. 14</figref>.

0075Referring to <figref idref="f0005">FIG. 16</figref>, a light extracting structure 900 is formed on the first conductive semiconductor layer 502.

0076Referring to <figref idref="f0005">FIG. 17</figref>, a first electrode layer 1000 is formed on the first conductive semiconductor layer 502.

0077Referring to <figref idref="f0006">FIG. 18</figref>, an isolation etching 1100 is performed to expose the temporary substrate 701 such that a plurality of light emitting structures can be formed on the temporary substrate 701.

0078Referring to <figref idref="f0006">FIG. 19</figref>, the temporary substrate 701 is removed through the laser lift-off scheme, the drying etching scheme, the wet etching scheme, the CMP scheme, or the polishing scheme. When the temporary substrate 701 is removed through the laser lift-off scheme, the sacrificial separation layer 702 is thermo-chemically decomposed, so that the temporary substrate 701 can be separated.

0079Then, the third and fourth wafer bonding layers 603 and 703 are removed and a die bonding layer 1300 is formed under the support substrate 601. The die bonding layer 1300 is securely boned to a circuit board, on which the light emitting device is mounted, or a die at low resistance.

0080In this manner, the light emitting diode according to the second embodiment can be manufactured.

0081<figref idref="f0006 f0007 f0008 f0009 f0010 f0011">FIGS. 20 to 33</figref> are views showing the procedure for manufacturing a light emitting device according to the third embodiment.

0082The manufacturing method for the light emitting device according to the third embodiment is similar to that of the first embodiment, so the description about processes described in the first embodiment will be omitted in order to avoid redundancy.

0083Referring to <figref idref="f0006">FIG. 20</figref>, a light emitting semiconductor layer including a first conductive semiconductor layer 502, an active layer 503 and a second conductive semiconductor layer 504 is formed on a growth substrate 501. In addition, the light emitting semiconductor layer is mesa-etched to form a plurality of unit devices, and a first passivation layer 509 is formed such that the light emitting semiconductor layer is surrounded by the first passivation layer 509. Then, the first passivation layer 509 is removed such that the second conductive semiconductor layer 504 can be partially exposed. After that, an ohmic contact layer 510 is formed on the second conductive semiconductor layer 504. Then, a reflective layer 511 is formed on the first passivation layer 509 and the ohmic contact layer 510 and a first wafer bonding layer 508 is formed on the reflective layer 511, thereby forming a first structure 100.

0084Referring to <figref idref="f0006">FIG. 21</figref>, a second structure 200 is prepared. The second structure 200 includes a first support substrate 601 formed at top and bottom surfaces thereof with second and third wafer bonding layers 602 and 603, respectively.

0085Referring to <figref idref="f0007">FIG. 22</figref>, a third structure 300 is prepared. The third structure 300 includes a first sacrificial separation layer 702 and a fourth wafer bonding layer 703 formed on a first temporary substrate 701.

0086Referring to <figref idref="f0007">FIG. 23</figref>, a first complex structure is formed by bonding the first structure 100 shown in <figref idref="f0006">FIG. 20</figref>, the second structure 200 shown in <figref idref="f0006">FIG. 21</figref> and the third structure 300 shown in <figref idref="f0007">FIG. 22</figref>.

0087The first wafer bonding layer 508 is bonded to the second wafer bonding layer 602, and the third wafer bonding layer 603 is bonded to the fourth wafer bonding layer 703.

0088Referring to <figref idref="f0007">FIG. 24</figref>, the first temporary substrate 701 is removed through the laser lift-off scheme, the drying etching scheme, the wet etching scheme, the CMP scheme, or the polishing scheme.

0089When the first temporary substrate 701 is removed through the laser lift-off scheme, the first sacrificial separation layer 702 is thermo-chemically decomposed, so that the first temporary substrate 701 can be separated.

0090Then, the third and fourth wafer bonding layers 603 and 703 are removed and a fifth wafer bonding layer 604 is formed under the first support substrate 601.

0091In this manner, a second complex structure 400 is formed.

0092The fifth wafer bonding layer 604 can be formed by using a material having electric conductivity such that the fifth wafer bonding layer 604 may represent strong bonding strength under the predetermined pressure and the temperature of 300°C to 600°C. For instance, the fifth wafer bonding layer 604 may include at least one selected from the group consisting of Au, Ag, Al, Si, Ge, W, Mo, V, Sc, Hf, Ir, Re, Co, Zr, Ru, Ta, Nb, Mn, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and rare-earth metal.

0093Referring to <figref idref="f0007">FIG. 25</figref> a fourth structure 500 is prepared. The fourth structure 500 includes a second support substrate 605 formed at top and bottom surfaces thereof with sixth and seventh wafer bonding layers 606 and 607, respectively.

0094The second support substrate 605 is an electric conductive layer. The second support substrate 605 may be a wafer substrate including at least one of Si, SiGe, ZnO, GaN, AlSiC and GaAs, or may be a metal, an alloy or a solid solution including at least one of Cu, Ni, Ag, Al, Nb, Ta, Ti, Au, Pd, and W.

0095The second support substrate 605 can be prepared in the form of a sheet, a disk, or a foil having a thickness of about 10µm to 1 mm. The second support substrate 605 can be formed through the electro-plating, physical vapor deposition (PVD), or chemical vapor deposition (CVD).

0096The second support substrate 605 may be thicker than the first support substrate 601. In detail, the crack or debonding may occur in the light emitting semiconductor layer when the process shown in <figref idref="f0007">FIG. 23</figref> is performed due to the difference in thermal expansion coefficient between the light emitting semiconductor layer and the first support substrate 601. In order to reduce the problem derived from the difference in thermal expansion coefficient, the first support substrate 601 is formed with a thin thickness and the second support substrate 605 thicker than the first support substrate 601 is additionally formed in the process shown in <figref idref="f0008">FIG. 27</figref>, which will be described later.

0097Similar to the fifth wafer bonding layer 604, the sixth and seventh wafer bonding layers 606 and 607 may include at least one selected from the group consisting of Au, Ag, Al, Si, Ge, W, Mo, V, Sc, Hf, Ir, Re, Co, Zr, Ru, Ta, Nb, Mn, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and rare-earth metal.

0098Referring to <figref idref="f0008">FIG. 26</figref>, a fifth structure 600 is prepared. The fifth structure 600 includes a second sacrificial separation layer 705 and an eighth wafer bonding layer 706 formed on a second temporary substrate 704.

0099The second temporary substrate 704 may include a material representing difference in thermal expansion coefficient within 2ppm/°C with respect to that of the growth substrate 501. The second temporary substrate 704 can be formed by using a material the same as that of the growth substrate 501. For instance, the second temporary substrate 704 may include one of Al₂O₃, SiC, Si, and GaAs.

0100The second sacrificial separation layer 705 may include one of group II-VI compounds including ZnO, which is subject to the thermal-chemical decomposition reaction as laser beam is irradiated thereto; group III-V compounds including GaN; ITO; PZT; and SU-8. In addition, the second sacrificial separation layer 705 may include one of Al, Au, Ag, Cr, Ti, SiO₂, and SiN_x, which are rapidly dissolved in a wet solution.

0101Similar to the fifth wafer bonding layer 604, the eighth wafer bonding layer 706 may include at least one selected from the group consisting of Au, Ag, Al, Si, Ge, W, Mo, V, Sc, Hf, Ir, Re, Co, Zr, Ru, Ta, Nb, Mn, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and rare-earth metal.

0102Referring to <figref idref="f0008">FIG. 27</figref>, a third complex structure 700 is formed by bonding the second complex structure 400 shown in <figref idref="f0007">FIG. 24</figref>, the fourth structure 500 shown in <figref idref="f0007">FIG. 25</figref> and the fifth structure 600 shown in <figref idref="f0008">FIG. 26</figref>.

0103The fifth wafer bonding layer 604 is bonded to the sixth wafer bonding layer 606, and the seventh wafer bonding layer 607 is bonded to the eighth wafer bonding layer 706.

0104Referring to <figref idref="f0008">FIG. 28</figref>, the growth substrate 501 is separated from the third complex structure 700 shown in <figref idref="f0008">FIG. 27</figref>.

0105Referring to <figref idref="f0009">FIG. 29</figref>, a second passivation layer 800 is formed on top surfaces of the first conductive semiconductor layer 502 and the first passivation layer 509, and lateral sides of the first passivation layer 509, the reflective layer 511 and the first wafer bonding layer 508.

0106Referring to <figref idref="f0009">FIG. 30</figref>, the second passivation layer 800 formed on the first conductive semiconductor layer 502 is partially removed to form a light extracting structure 900 on the first conductive semiconductor layer 502.

0107Referring to <figref idref="f0010">FIG. 31</figref>, a first electrode layer 1000 is formed on the first conductive semiconductor layer 502.

0108Referring to <figref idref="f0010">FIG. 32</figref>, an isolation etching 1100 is performed to expose the second temporary substrate 704 such that a plurality of light emitting structures can be formed on the second temporary substrate 704.

0109Referring to <figref idref="f0011">FIG. 33</figref>, the second temporary substrate 704 is removed through the laser lift-off scheme, the drying etching scheme, the wet etching scheme, the CMP scheme, or the polishing scheme.

0110When the second temporary substrate 704 is removed through the laser lift-off scheme, the second sacrificial separation layer 705 is thermo-chemically decomposed, so that the second temporary substrate 704 can be separated.

0111Then, the seventh and eighth wafer bonding layers 607 and 706 are removed and an ohmic electrode layer 1200 and a die bonding layer 1300 are formed under the second support substrate 605. The die bonding layer 1300 is securely boned to a circuit board, on which the light emitting device is mounted, or a die at low resistance.

0112In this manner, the light emitting diode according to the third embodiment can be manufactured.

0113<figref idref="f0011 f0012 f0013 f0014 f0015">FIGS. 34 to 46</figref> are views showing the procedure for manufacturing a light emitting device according to the fourth embodiment.

0114The manufacturing method for the light emitting device according to the fourth embodiment is similar to that of the third embodiment, so the description about processes described in the third embodiment will be omitted in order to avoid redundancy.

0115Referring to <figref idref="f0011">FIG. 34</figref>, a light emitting semiconductor layer including a first conductive semiconductor layer 502, an active layer 503 and a second conductive semiconductor layer 504 is formed on a growth substrate 501. In addition, the light emitting semiconductor layer is mesa-etched to form a plurality of unit devices, and a first passivation layer 509 is formed such that the light emitting semiconductor layer is surrounded by the first passivation layer 509. Then, the first passivation layer 509 is removed such that the second conductive semiconductor layer 504 can be partially exposed, and an ohmic contact layer 510 is formed on the second conductive semiconductor layer 504. After that, a reflective layer 511 is formed on the first passivation layer 509 and the ohmic contact layer 510, and a second passivation layer 800 is formed on the reflective layer 511 and the first passivation layer 509. Then, the second passivation layer 800 is partially removed in order to form a first wafer bonding layer 508 on the exposed reflective layer 511, thereby forming a first structure 100.

0116According to the fourth embodiment, different from the third embodiment, the second passivation layer 800 is formed when the first structure 100 is manufactured.

0117Referring to <figref idref="f0011">FIG. 35</figref>, a second structure 200 is prepared. The second structure 200 includes a first support substrate 601 formed at top and bottom surfaces thereof with second and third wafer bonding layers 602 and 603, respectively.

0118Referring to <figref idref="f0011">FIG. 36</figref>, a third structure 300 is prepared. The third structure 300 includes a first sacrificial separation layer 702 and a fourth wafer bonding layer 703 formed on a first temporary substrate 701.

0119Referring to <figref idref="f0012">FIG. 37</figref>, a first complex structure is formed by bonding the first structure 100 shown in <figref idref="f0011">FIG. 34</figref>, the second structure 200 shown in <figref idref="f0011">FIG. 35</figref> and the third structure 300 shown in <figref idref="f0011">FIG. 36</figref>.

0120The first wafer bonding layer 508 is bonded to the second wafer bonding layer 602, and the third wafer bonding layer 603 is bonded to the fourth wafer bonding layer 703.

0121Referring to <figref idref="f0012">FIG. 38</figref>, the first temporary substrate 701 is removed through the laser lift-off scheme, the drying etching scheme, the wet etching scheme, the CMP scheme, or the polishing scheme.

0122When the first temporary substrate 701 is removed through the laser lift-off scheme, the first sacrificial separation layer 702 is thermo-chemically decomposed, so that the first temporary substrate 701 can be separated.

0123Then, the third and fourth wafer bonding layers 603 and 703 are removed and a fifth wafer bonding layer 604 is formed under the first support substrate 601.

0124In this manner, a second complex structure 400 is formed.

0125Referring to <figref idref="f0012">FIG. 39</figref>, a fourth structure 500 is prepared. The fourth structure 500 includes a second support substrate 605 formed at top and bottom surfaces thereof with sixth and seventh wafer bonding layers 606 and 607, respectively.

0126Referring to <figref idref="f0012">FIG. 40</figref>, a fifth structure 600 is prepared. The fifth structure 600 includes a second sacrificial separation layer 705 and an eighth wafer bonding layer 706 formed on a second temporary substrate 704.

0127Referring to <figref idref="f0013">FIG. 41</figref>, a third complex structure 700 is formed by bonding the second complex structure 400 shown in <figref idref="f0012">FIG. 38</figref>, the fourth structure 500 shown in <figref idref="f0012">FIG. 39</figref> and the fifth structure 600 shown in <figref idref="f0012">FIG. 40</figref>.

0128The fifth wafer bonding layer 604 is bonded to the sixth wafer bonding layer 606, and the seventh wafer bonding layer 607 is bonded to the eighth wafer bonding layer 706.

0129Referring to <figref idref="f0013">FIG. 42</figref>, the growth substrate 501 is separated from the third complex structure 700 shown in <figref idref="f0013">FIG. 41</figref>.

0130Referring to <figref idref="f0014">FIG. 43</figref>, a light extracting structure 900 is formed on the first conductive semiconductor layer 502.

0131Referring to <figref idref="f0014">FIG. 44</figref>, a first electrode layer 1000 is formed on the first conductive semiconductor layer 502.

0132Referring to <figref idref="f0015">FIG. 45</figref>, an isolation etching 1100 is performed to expose the second temporary substrate 704 such that a plurality of light emitting structures can be formed on the second temporary substrate 704.

0133Referring to <figref idref="f0015">FIG. 46</figref>, the second temporary substrate 704 is removed through the laser lift-off scheme, the drying etching scheme, the wet etching scheme, the CMP scheme, or the polishing scheme.

0134When the second temporary substrate 704 is removed through the laser lift-off scheme, the second sacrificial separation layer 705 is thermo-chemically decomposed, so that the second temporary substrate 704 can be separated.

0135Then, the seventh and eighth wafer bonding layers 607 and 706 are removed and an ohmic electrode layer 1200 and a die bonding layer 1300 are formed under the second support substrate 605. The die bonding layer 1300 is securely boned to a circuit board, on which the light emitting device is mounted, or a die at low resistance.

0136In this manner, the light emitting diode according to the fourth embodiment can be manufactured.

0137Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.

[Industrial Applicability]

0138The embodiments are applicable for the method of manufacturing the semiconductor diode used as an electronic device or a light source.