EP2248162A4
Isolated transistors and diodes and isolation and termination structures for semiconductor die
11 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| US2006125045A1 | Cites | United States of America | Search report |
| US6163052A | Cites | United States of America | Search report |
| US6835627B1 | Cites | United States of America | Search report |
| See also references of WO 2009108311A2 | Non-patent | – | Search report |
266 members in 10 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 72615 | United States of America | – | |
| 7261508 | United States of America | A | |
| 2009001187 | United States of America | W |
Members266
| Document | Office | Kind | |
|---|---|---|---|
| US2004032005A1 | United States of America | A1 | |
| US2004033666A1 | United States of America | A1 | |
| WO2004017373A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO2004017395A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2003258204A1 | Australia | A1 | |
| AU2003262679A1 | Australia | A1 | |
| AU2003262679A8 | Australia | A8 | |
| US2004063291A1 | United States of America | A1 | |
| WO2004030036A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2003275136A1 | Australia | A1 | |
| WO2004017373A9 | World Intellectual Property Organization (WIPO) | A9 | |
| WO2004017395A9 | World Intellectual Property Organization (WIPO) | A9 | |
| US2004251497A1 | United States of America | A1 | |
| US2004259318A1 | United States of America | A1 | |
| US2005014324A1 | United States of America | A1 | |
| US2005014329A1 | United States of America | A1 | |
| US2005023606A1 | United States of America | A1 | |
| US6855985B2 | United States of America | B2 | |
| US2005042815A1 | United States of America | A1 | |
| US6900091B2 | United States of America | B2 | |
| KR20050054918A | Republic of Korea | A | |
| EP1543546A1 | European Patent Office (EPO) | A1 | |
| US2005142724A1 | United States of America | A1 | |
| US2005142791A1 | United States of America | A1 | |
| US2005142792A1 | United States of America | A1 | |
| KR20050069984A | Republic of Korea | A | |
| KR20050071528A | Republic of Korea | A | |
| WO2004017373A3 | World Intellectual Property Organization (WIPO) | A3 | |
| US2005158939A1 | United States of America | A1 | |
| US6943426B2 | United States of America | B2 | |
| EP1573822A2 | European Patent Office (EPO) | A2 | |
| EP1576651A2 | European Patent Office (EPO) | A2 | |
| CN1689144A | China | A | |
| CN1698208A | China | A | |
| JP2005536057A | Japan | A | |
| JP2005536060A | Japan | A | |
| US2005269597A1 | United States of America | A1 | |
| US2005272207A1 | United States of America | A1 | |
| US2005272230A1 | United States of America | A1 | |
| JP2006514425A | Japan | A | |
| US2006157818A1 | United States of America | A1 | |
| US2006223257A1 | United States of America | A1 | |
| US7135738B2 | United States of America | B2 | |
| EP1543546A4 | European Patent Office (EPO) | A4 | |
| US7176548B2 | United States of America | B2 | |
| US7202536B2 | United States of America | B2 | |
| US7211863B2 | United States of America | B2 | |
| US7265434B2 | United States of America | B2 | |
| US7276431B2 | United States of America | B2 | |
| US7279378B2 | United States of America | B2 | |
| US7279399B2 | United States of America | B2 | |
| CN100347824C | China | C | |
| US2007272986A1 | United States of America | A1 | |
| US2007278568A1 | United States of America | A1 | |
| US2007278612A1 | United States of America | A1 | |
| WO2007142937A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO2007142969A1 | World Intellectual Property Organization (WIPO) | A1 | |
| TW200805510A | Taiwan Province of China | A | |
| US2008023762A1 | United States of America | A1 | |
| WO2007142969B1 | World Intellectual Property Organization (WIPO) | B1 | |
| US7329583B2 | United States of America | B2 | |
| US2008042232A1 | United States of America | A1 | |
| US2008044978A1 | United States of America | A1 | |
| US2008048287A1 | United States of America | A1 | |
| WO2007142937A3 | World Intellectual Property Organization (WIPO) | A3 | |
| US2008061367A1 | United States of America | A1 | |
| US2008061368A1 | United States of America | A1 | |
| US2008061375A1 | United States of America | A1 | |
| US2008061376A1 | United States of America | A1 | |
| US2008061377A1 | United States of America | A1 | |
| US2008061400A1 | United States of America | A1 | |
| US2008067585A1 | United States of America | A1 | |
| US2008067586A1 | United States of America | A1 | |
| US2008067588A1 | United States of America | A1 | |
| TW200816367A | Taiwan Province of China | A | |
| EP1573822A4 | European Patent Office (EPO) | A4 | |
| US2008116513A1 | United States of America | A1 | |
| US2008122006A1 | United States of America | A1 | |
| CN101217111A | China | A | |
| US2008191277A1 | United States of America | A1 | |
| US2008197408A1 | United States of America | A1 | |
| US2008197445A1 | United States of America | A1 | |
| US2008197446A1 | United States of America | A1 | |
| CN100416852C | China | C | |
| US2008210980A1 | United States of America | A1 | |
| US2008213972A1 | United States of America | A1 | |
| US7422938B2 | United States of America | B2 | |
| US2008217699A1 | United States of America | A1 | |
| US2008217729A1 | United States of America | A1 | |
| US2008230812A1 | United States of America | A1 | |
| US7445979B2 | United States of America | B2 | |
| US7449380B2 | United States of America | B2 | |
| US2008290449A1 | United States of America | A1 | |
| US2008290450A1 | United States of America | A1 | |
| US2008290451A1 | United States of America | A1 | |
| US2008290452A1 | United States of America | A1 | |
| US2008293214A1 | United States of America | A1 | |
| CN101355084A | China | A | |
| WO2004030036A3 | World Intellectual Property Organization (WIPO) | A3 | |
| US7489007B2 | United States of America | B2 |
Showing 100 of 266
34 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | |
| Supplementary search report drawn up and despatchedA4 | A4 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Request for extension of the european patent (deleted)DAX | DAX | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 2248162
- Application
- 97160683
Titles3
- German
- ISOLIERTE TRANSISTOREN UND DIODEN SOWIE ISOLIER- UND ABSCHLUSSSTRUKTUREN FÜR HALBLEITERCHIP
- English
- ISOLATED TRANSISTORS AND DIODES AND ISOLATION AND TERMINATION STRUCTURES FOR SEMICONDUCTOR DIE
- French
- TRANSISTORS ISOLES ET DIODES ET ISOLATION ET STRUCTURES DE TERMINAISON POUR MATRICE A SEMI-CONDUCTEURS
Classification
- CPC, 20
- H10D62/112
- H10D30/663
- H10D62/108
- H10D62/109
- H10D62/105
- H10D62/104
- H10D62/116
- H10D62/153
- H10D62/314
- H10D62/307
- H10D62/378
- H10D62/371
- H10D64/256
- H10D30/665
- H10D30/603
- H10D30/83
- H10D8/422
- H10D8/25
- H10P30/222
- H10P30/221
- IPC, 12
- H01L21 76
- H01L21 762
- H01L21 336
- H01L29 78
- H01L21 265
- H01L29 417
- H01L29 06
- H01L29 10
- H01L29 866
- H01L29 808
- H01L29 08
- H01L29 861
Designated states1
- Contracting states, 1
- Türkiye
