EP2248074B1

Rfid tag for direct and indirect food contact

Abstract

This record has no abstract on file.

EP2248074B1, drawing sheet 1
Sheet 1 of 3

Term

2.4 yearsleft in the term

Expires 26 February 2029.

  1. Priority
  2. Filed
  3. Granted
  4. Today
  5. Expires

9 claims: 2 independent, 7 dependent

  1. 1
    An RFID device (10) configured for use in direct or indirect food packaging applications, comprising;an RFID inlay (102) having a chip (16) encoded with product information and an antenna (14, 15) bonded to said chip (16);first (12) and second (24) substrates, each of said substrates having first and second surfaces, and first and second transversely extending edges and first and second longitudinally extending sides;and wherein said RFID inlay (102) is disposed between each of said first (12) and second (24) substrates and each of said first and second longitudinally extending sides and each of said first and second transversely extending edges are sealed to one another so as to create a sealed enclosure for said RFID inlay (102), wherein said second substrate (24) has an area that is greater than an area of said first substrate (12);the second substrate extends beyond the edges of the first substrate so as to overlap the first substrate;and characterised in that a portion of the antenna (14, 15) is covered with fire resistant or fire retardant materials.
  2. 5
    A method for producing an RFID device in connection with a food carrier (40), comprising the steps of:providing an RFID inlay (102) manufactured using a strap (20, 22), the inlay (102) having an antenna (14, 15);covering a portion of the antenna (14, 15) with fire resistant or fire retardant materials;placing said RFID inlay (102) on a first substrate (12);covering said RFID inlay (102) and said first substrate (12) with a second substrate (24);and adhering said first (12) and second (24) substrates together with said RFID inlay (102) contained there between to form a laminated assembly;and affixing said laminated assembly to a food carrier (40), wherein said second substrate (24) has an area that is greater than an area of said first substrate (12);and the second substrate (24) extends beyond the edges of the first substrate (12) so as to overlap the first substrate (12).