EP2016607A4
Semiconductor components and systems having encapsulated through wire interconnects (twi) and wafer level methods of fabrication
Abstract
This record has no abstract on file.
Term
0.3 yearsto projected expiry
Projected expiry 29 January 2027, counted from filing; an application has no term until it is granted.
- Priority
- Filed
- Published
- Today
- Projected expiry
17 sheets
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Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| EP1662566A2 | Cites | European Patent Office (EPO) | – | Search report | – |
| JP2001044357A | Cites | Japan | – | Search report | – |
| US2003082851A1 | Cites | United States of America | – | Search report | – |
| US5793103A | Cites | United States of America | – | Search report | – |
| US6002177A | Cites | United States of America | – | Search report | – |
| JPH11274354A | Cites | Japan | A | Search report | 1-17,25-35 |
| JP11274354A | Cites | Japan | – | – | – |
26 members in 6 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 409638 | United States of America | – | |
| 40963806 | United States of America | A | |
| 2007002336 | United States of America | W |
Members26
| Document | Office | Kind | |
|---|---|---|---|
| US2007246819A1 | United States of America | A1 | |
| TW200741919A | Taiwan Province of China | A | |
| WO2007133302A2 | World Intellectual Property Organization (WIPO) | A2 | |
| WO2007133302A3 | World Intellectual Property Organization (WIPO) | A3 | |
| KR20080111156A | Republic of Korea | A | |
| EP2016607A2 | European Patent Office (EPO) | A2 | |
| JP2009534865A | Japan | A | |
| US7659612B2 | United States of America | B2 | |
| US2010047934A1 | United States of America | A1 | |
| KR101009874B1 | Republic of Korea | B1 | |
| US2011024745A1 | United States of America | A1 | |
| US7883908B2 | United States of America | B2 | |
| EP2016607A4This record | European Patent Office (EPO) | A4 | |
| JP4853747B2 | Japan | B2 | |
| US8120167B2 | United States of America | B2 | |
| US2012043670A1 | United States of America | A1 | |
| TWI362709B | Taiwan Province of China | B | |
| US8217510B2 | United States of America | B2 | |
| US2012288997A1 | United States of America | A1 | |
| EP2016607B1 | European Patent Office (EPO) | B1 | |
| US8404523B2 | United States of America | B2 | |
| US8581387B1 | United States of America | B1 | |
| US2014038406A1 | United States of America | A1 | |
| US8741667B2 | United States of America | B2 | |
| US2014225259A1 | United States of America | A1 | |
| US9018751B2 | United States of America | B2 |
76 legal events, as 9 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
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|---|---|---|---|
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Amendment of ipc main classPREVIOUS MAIN CLASS: H01L0023480000R079 | R079 | DE | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Patent lapsedLapsedMM4A | MM4A | IE | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Notification of lapseLapsedST | ST | FR | |
| Gb: european patent ceased through non-payment of renewal feeCeasedGBPC | GBPC | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Patent ceasedCeasedPL | PL | CH | |
| No opposition filed against granted patent, or epo opposition proceedings concluded without decisionGrantedR097 | R097 | DE | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| No opposition filedOpposition26N | 26N | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE | PLBE | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA | STAA | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
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| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Invalidated european patentMG4D | MG4D | LT | |
| Discontinued in the netherlands as no translation has been filedVDEP | VDEP | NL | |
| Deletion acc. to par. 5 (withdrawal of the translation of the ep patent)MK05 | MK05 | AT | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Dpma publication of mentioned ep patent grantGrantedR096 | R096 | DE | |
| European patents granted designating irelandGrantedFG4D | FG4D | IE | |
| European patent takes effect as a national patent in ch/liEP | EP | CH | |
| Reference to at number (ep patent validated in austria)REF | REF | AT | |
| Designated contracting statesAK | AK | EP | |
| European patent grantedGrantedFG4D | FG4D | GB | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
| Grant fee paidORIGINAL CODE: EPIDOSNIGR3GRAS | GRAS | EP | |
| Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP | GRAP | EP | |
| Request for extension of the european patent (deleted)DAX | DAX | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Supplementary search report drawn up and despatchedA4 | A4 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | EP | |
| Amendment of ipc main classPREVIOUS MAIN CLASS: H01J0017490000R079 | R079 | DE | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Request for extension of the european patentAX | AX | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 2016607
- Application
- 77494045
Titles3
- German
- HALBLEITERKOMPONENTEN UND SYSTEME MIT EINGEKAPSELTEN DURCHGANGSDRAHTVERBINDUNGEN (TWI) UND HERSTELLUNGSVERFAHREN AUF WAFERNIVEAU
- English
- SEMICONDUCTOR COMPONENTS AND SYSTEMS HAVING ENCAPSULATED THROUGH WIRE INTERCONNECTS (TWI) AND WAFER LEVEL METHODS OF FABRICATION
- French
- COMPOSANTS SEMI-CONDUCTEURS, SYSTÈMES COMPRENANT DES INTERCONNEXIONS DE FIL TRAVERSANT (TWI) ENCAPSULÉES ET PROCÉDÉS DE FABRICATION DE NIVEAUX DE TRANCHES
Classification
- CPC, 60
- G01R1/06716
- H10W70/60
- G01R1/07307
- H10W70/095
- H10W74/019
- H10W74/016
- H10W20/023
- H10W20/20
- H10W70/635
- H10W72/01225
- H10W72/221
- H10W72/244
- H10W72/222
- H10W72/252
- H10W90/722
- H10W72/07141
- H10W72/07511
- H10W72/07532
- H10W72/07533
- H10W72/075
- H10W72/01551
- H10W90/00
- H10W72/983
- H10W70/65
- H10W70/654
- H10W72/01925
- H10W72/923
- H10W72/59
- H10W72/952
- H10W72/29
- H10W72/932
- H10W72/922
- H10W72/9415
- H10W72/944
- H10W72/5453
- H10W90/752
- H10W72/5363
- H10W72/536
- H10W72/5434
- H10W72/5522
- H10W72/5524
- H10W72/5525
- H10W72/07553
- H10W72/581
- H10W72/01
- H10W90/297
- H10W90/24
- H10W74/00
- H10W20/0238
- H10W20/0245
- H10W72/552
- H10W72/522
- H10W72/534
- H10W72/555
- H10W72/523
- H10W72/525
- H10W76/12
- H10W20/056
- H10W20/063
- H10W72/072
- IPC, 6
- H01L23 48
- H01L23 498
- H01L21 60
- H01L25 065
- H10P14 40
- H10W74 01
Designated states1
- Contracting states, 1
- Türkiye