EP2016207A4

Plating solution for electroless deposition of copper

Abstract

This record has no abstract on file.

Term

0.6 yearsto projected expiry

Projected expiry 10 May 2027, counted from filing; an application has no term until it is granted.

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Every citation, both ways

Citations
DocumentRelationOfficeCited during
US4650691ACitesUnited States of AmericaSearch report
VASKELIS A ET AL: "KINETICS OF ELECTROLESS COPPER DEPOSITION USING COBALT(II)-ETHYLENEDIAMINE COMPLEX COMPOUNDS AS REDUCING AGENTS", JOURNAL OF APPLIED ELECTROCHEMISTRY, SPRINGER, DORDRECHT, NL, vol. 32, no. 3, 1 March 2002 (2002-03-01), pages 297 - 303, XP001114901, ISSN: 0021-891X, DOI: 10.1023/A:1015599527638Non-patentSearch report
See also references of WO 2007134182A1Non-patentSearch report