EP2016207A4
Plating solution for electroless deposition of copper
Abstract
This record has no abstract on file.
Term
0.6 yearsto projected expiry
Projected expiry 10 May 2027, counted from filing; an application has no term until it is granted.
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Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| US4650691A | Cites | United States of America | Search report |
| VASKELIS A ET AL: "KINETICS OF ELECTROLESS COPPER DEPOSITION USING COBALT(II)-ETHYLENEDIAMINE COMPLEX COMPOUNDS AS REDUCING AGENTS", JOURNAL OF APPLIED ELECTROCHEMISTRY, SPRINGER, DORDRECHT, NL, vol. 32, no. 3, 1 March 2002 (2002-03-01), pages 297 - 303, XP001114901, ISSN: 0021-891X, DOI: 10.1023/A:1015599527638 | Non-patent | – | Search report |
| See also references of WO 2007134182A1 | Non-patent | – | Search report |
707 members in 15 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 382906 | United States of America | – | |
| 38290606 | United States of America | A | |
| 2007068691 | United States of America | W |
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Numbers
- Publication
- 2016207
- Application
- 77621019
Titles3
- German
- BESCHICHTUNGSLÖSUNG FÜR STROMLOSE VERKUPFERUNG
- English
- PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER
- French
- SOLUTION DE PLACAGE POUR DÉPÔT DE CUIVRE SANS COURANT
Classification
- CPC, 5
- C23C18/38
- C23C18/48
- C23C18/1642
- C23C18/1687
- H10P14/46
- IPC, 1
- C23C18 00
Designated states32
- Contracting states, 32
- Austria
- Belgium
- Bulgaria
- Switzerland
- Cyprus
- Czechia
- Germany
- Denmark
- Estonia
- Spain
- Finland
- France
- United Kingdom
- Greece
- Hungary
- Ireland
- Iceland
- Italy
- Liechtenstein
- Lithuania
- Luxembourg
- Latvia
- Monaco
- Malta
and 8 moreShow fewer
- Netherlands (Kingdom of the)
- Poland
- Portugal
- Romania
- Sweden
- Slovenia
- Slovakia
- Türkiye