EP1679291A1

Process for the manufacturing of low reflection coating

Abstract

Die Erfindung beschreibt ein Verfahren zur Herstellung einer reflexionsmindernden Beschichtung auf einem transparenten Substrat, bei dem mindestens eine Schicht, die Silicium, Sauerstoff, Kohlenstoff und Wasserstoff enthält, auf mindestens einer Seite des Substrats abgeschieden wird und anschließend in dieser mindestens einen Schicht der Kohlenstoff- und Wasserstoffgehalt reduziert wird sowie eine reflexionsmindernde Schicht.

Term

Term ended

Projected expiry passed 9 January 2026, 0.7 years ago.

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40 claims: 2 independent, 38 dependent

  1. c-de-0001
    A process for producing a reflection-reducing coating on a transparent substrate containing at least one layer containing silicon, oxygen, carbon and hydrogen, is deposited on at least one side of the substrate and is subsequently reduced in this at least one layer of the carbon and hydrogen content.
  2. c-de-0005
    A method according to any one of claims 1 to 4, characterized, that at least one layer is deposited on both sides of the substrate.
  3. c-de-0006
    A method according to any one of claims 1 to 5, characterized, that at least one layer is deposited in a layer thickness in the range of 5 to 400 nm on the substrate.
  4. c-de-0009
    A method according to any one of claims 1 to 8, characterized, that at least one layer is annealed.
  5. c-de-0012
    A method according to any one of claims 1 to 8, characterized, that the at least one layer is treated in the presence of oxygen.
  6. c-de-0016
    A method according to any one of claims 1 to 15, characterized, that a glass or plastic pane is used as the transparent substrate.
  7. c-de-0018
    A method according to any one of claims 1 to 17, characterized, that the at least one layer is deposited in a PVD process, a CVD process or a combination of both processes.
  8. c-de-0029
    A method according to any one of claims 1 to 28, characterized, that two layers are deposited on at least one side of the substrate, wherein the substrate adjacent layer prior to the removal of carbon, 5 to 30 atom% silicon, 20 to 60 atom% oxygen, 2 to 30 atomic% of carbon and 2 to 30 atomic % comprising hydrogen and remote from the substrate layer is 20 to 35 atomic% silicon, 40 to 67 atomic% of oxygen and 0 to 15 atomic% of carbon and 5 to 20 atomic% of hydrogen comprises.
  9. c-de-0030
    A method according to any one of claims 1 to 29, characterized, that at least one layer is adjusted hydrophobically on its surface.
  10. c-de-0032
    A method according to any one of claims 1 to 31, characterized, that via the at least one layer a covering layer is deposited, consisting essentially of carbon and fluorine.
  11. c-de-0034
    Anti-reflection layer on a transparent substrate having a refractive index n contains n> 1.4, silicon, oxygen, carbon and hydrogen, and a refractive index n 'of n' 3 nm less than 10% by volume.
  12. c-de-0037
    Layer according to any one of claims 34 to 36, characterized, that on the layer an additional Hydrophobisierungsschicht is applied by ≥ 0.3 nm thickness.
  13. c-de-0039
    Toughened with at least one coating or layer according to any one of claims 1 to 38th