EP1597751A4
Advanced microelectronic connector assembly and method of manufacturing
Abstract
This record has no abstract on file.
Term
Term ended
Projected expiry passed 17 September 2023, 3 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
27 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4 Sheet 5 Sheet 6 Sheet 7 Sheet 8 Sheet 9 Sheet 10 Sheet 11 Sheet 12 Sheet 13 Sheet 14 Sheet 15 Sheet 16 Sheet 17 Sheet 18 Sheet 19 Sheet 20 Sheet 21 Sheet 22 Sheet 23 Sheet 24 Sheet 25 Sheet 26 Sheet 27
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| EP0740370A1 | Cites | European Patent Office (EPO) | A | Search report | – |
| EP0878872A2 | Cites | European Patent Office (EPO) | X | Search report | 1-12,15,16,18,21,25,26,28-34 |
| WO9809347A1 | Cites | World Intellectual Property Organization (WIPO) | A | Search report | – |
| EP0878872A | Cites | European Patent Office (EPO) | – | – | – |
| WO9809347A | Cites | World Intellectual Property Organization (WIPO) | – | – | – |
| EP0740370A | Cites | European Patent Office (EPO) | – | – | – |
| See also references of WO 2004027835A2 | Non-patent | – | – | Search report | – |
27 members in 8 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 246840 | United States of America | – | |
| 24684002 | United States of America | A | |
| 0330184 | United States of America | W |
Members27
| Document | Office | Kind | |
|---|---|---|---|
| WO02075860A1 | World Intellectual Property Organization (WIPO) | A1 | |
| US2002160663A1 | United States of America | A1 | |
| TW538567B | Taiwan Province of China | B | |
| KR20030090672A | Republic of Korea | A | |
| EP1374348A1 | European Patent Office (EPO) | A1 | |
| US2004005820A1 | United States of America | A1 | |
| WO2004027835A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2003270887A1 | Australia | A1 | |
| AU2003270887A8 | Australia | A8 | |
| CN1505855A | China | A | |
| JP2004523078A | Japan | A | |
| US6773302B2 | United States of America | B2 | |
| KR20050067151A | Republic of Korea | A | |
| WO2004027835A3 | World Intellectual Property Organization (WIPO) | A3 | |
| US6962511B2 | United States of America | B2 | |
| EP1597751A2 | European Patent Office (EPO) | A2 | |
| JP2006503405A | Japan | A | |
| CN1774842A | China | A | |
| CN1257583C | China | C | |
| KR100612522B1 | Republic of Korea | B1 | |
| KR100649810B1 | Republic of Korea | B1 | |
| EP1374348A4 | European Patent Office (EPO) | A4 | |
| EP1597751A4This record | European Patent Office (EPO) | A4 | |
| JP4287374B2 | Japan | B2 | |
| EP2587596A2 | European Patent Office (EPO) | A2 | |
| EP2587596A3 | European Patent Office (EPO) | A3 | |
| CN1774842B | China | B |
21 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| Intention to grant announcedINTG | INTG | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP | GRAP | |
| Party data changed (applicant data changed or rights of an application transferred)RAP1 | RAP1 | |
| First examination report despatched17Q | 17Q | |
| Supplementary search report drawn up and despatchedA4 | A4 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Request for extension of the european patent (deleted)DAX | DAX | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 1597751
- Application
- 37526019
Titles3
- German
- ERWEITERTE MIKROELEKTRONISCHE VERBINDERBAUGRUPPE UND VERFAHREN ZUR HERSTELLUNG
- English
- ADVANCED MICROELECTRONIC CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURING
- French
- ENSEMBLE CONNECTEUR MICROELECTRONIQUE PERFECTIONNE ET PROCEDE DE FABRICATION CORRESPONDANT
Classification
- CPC, 9
- H01R24/64
- H01R13/6633
- H01R13/6658
- H01R13/7172
- H01R13/7175
- H01R13/719
- H01R13/7195
- Y10S439/939
- H01R13/514
- IPC, 7
- H01R24 00
- H01R13 66
- H01R13 33
- H01R13 717
- H01R13 719
- H01R43 00
- H10P95 00
Designated states1
- Contracting states, 1
- Türkiye