Methods of forming capacitators, methods of forming capacitator-over-bit line memory circuitry, and related integrated circuitry constructions

<b>Technical Field</b>

0001This invention relates to methods of forming capacitors, to methods of forming capacitor-over-bit line memory circuitry, and to related integrated circuitry constructions.

<b>Background Art</b>

0002As integrated circuitry continues to shrink in size, efforts are ongoing to find novel methods of forming integrated circuitry structures and related integrated circuitry which improve upon those methods currently utilized and the resultant structures formed thereby.

0003One type of integrated circuitry is memory circuitry. Such circuitry has been and continues to be the focus of intense efforts to reduce the size of the circuitry, increase the speed with which such circuitry operates, and maintain or increase the ability of such circuitry to perform its memory function.

0004Accordingly, this invention arose out of concerns associated with improving the methods by which integrated circuitry, and in particular, integrated memory circuitry is formed. This invention also arose out of concerns associated with providing improved integrated circuitry constructions.

<b>Disclosure of the Invention</b>

0005Methods of forming capacitors, methods of forming capacitor-over-bit line memory circuitry, and related integrated circuitry constructions are described. In one embodiment, a capacitor storage node is formed having an uppermost surface and an overlying insulative material over the uppermost surface. Subsequently, a capacitor dielectric functioning region is formed discrete from the overlying insulative material operably proximate at least a portion of the capacitor storage node. A cell electrode layer is formed over the capacitor dielectric functioning region and the overlying insulative material. In another embodiment, a capacitor storage node is formed having an uppermost surface and a side surface joined therewith. A protective cap is formed over the uppermost surface and a capacitor dielectric layer is formed over the side surface and protective cap. A cell electrode layer is formed over the side surface of the capacitor storage node. In yet another embodiment, a plurality of capacitor storage nodes are formed arranged in columns. A common cell electrode layer is formed over the plurality of capacitor storage nodes. Cell electrode layer material is removed from between the columns and isolates individual cell electrodes over individual respective capacitor storage nodes. After the removing of the cell electrode layer material, conductive material is formed over portions of remaining cell electrode material thereby placing some of the individual cell electrodes into electrical communication with one another.

<b>Brief Description of the Drawings</b>

0006Preferred embodiments of the invention are described below with reference to the following accompanying drawings. <ul id="ul0001" list-style="none" compact="compact"><li>Fig. 1 is a diagrammatic side sectional view of a semiconductor wafer fragment in process in accordance with one embodiment of the present invention.</li><li>Fig. 2 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 1.</li><li>Fig. 3 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 2.</li><li>Fig. 4 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 3.</li><li>Fig. 5 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 4.</li><li>Fig. 6 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 5.</li><li>Fig. 7 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 6.</li><li>Fig. 8 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 7.</li><li>Fig. 9 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 8.</li><li>Fig. 10 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 9.</li><li>Fig. 11 is a view of the Fig. 1 wafer fragment at a processing step which is subsequent to that which is shown in Fig. 10.</li><li>Fig. 12 is a view which is taken along line 12-12 in Fig. 11.</li><li>Fig. 13 is a schematic circuit diagram of electronic circuitry formed in accordance with the inventive methodologies.</li></ul>

<b>Best Modes for Carrying Out the Invention and Disclosure of Invention</b>

0007Referring to Fig. 1, a semiconductor wafer fragment in process is shown generally at 20 and comprises semiconductive substrate 22. In the context of this document, the term "semiconductive substrate" is defined to mean any construction comprising semiconductive material, including, but not limited to, bulk semiconductive materials such as a semiconductive wafer (either alone or in assemblies comprising other materials thereon), and semiconductive material layers (either alone or in assemblies comprising other materials). The term "substrate" refers to any supporting structure, including, but not limited to, the semiconductive substrates described above.

0008Conductive lines 24, 26, 28, and 30 are formed over substrate 22 and include a gate oxide layer (not specifically shown), a conductive polysilicon layer 32, a silicide layer 34, an insulative cap 36, and sidewall spacers 38. Other conductive line constructions can, of course, be used. Isolation oxide regions 40 are provided in the form of field oxide regions. Isolation regions 40 can also be provided through other techniques such as shallow trench isolation techniques. Diffusion regions 42, 44, and 46 are formed within substrate 22 intermediate respective conductive lines. The diffusion regions typically comprise regions of the substrate which are implanted with suitable impurities.

0009Referring to Fig. 2, an insulative layer such as borophosphosilicate glass (BPSG) 48 is formed over substrate 22 and openings 50, 52 are formed therein. The openings are formed over and join with respective diffusion regions 42, 46. Conductive material 54, e.g. conductively doped polysilicon, is formed over the substrate and within opening 50, 52. Conductive material 54 can be subsequently planarized for isolation purposes. Conductive material 54 establishes electrical communication with the respective diffusion regions over which it is formed and will provide electrical communication between capacitor storage nodes which are to be formed as described below.

0010Referring to Fig. 3, a layer of material 56 is formed over substrate 22 and has a generally planar outer surface 58. For purposes of the ongoing discussion, layer 56 comprises a first insulative layer of material. An exemplary material is BPSG.

0011Referring to Fig. 4, a plurality of openings are formed over or within layer 56, with exemplary openings being shown at 60, 62. In the illustrated and preferred embodiment, opening 60, 62 are formed to expose uppermost portions of conductive material 54.

0012Referring to Fig. 5, conductive material 64 is formed over substrate 22 and received within openings 60, 62. In the illustrated example, conductive material 64 is formed sufficiently to overfill the openings. It is possible, however, to only partially fill or underfill the openings for purposes which will become apparent below.

0013Referring to Fig. 6, portions of conductive material 64 are removed, as by planarization or other methods, to electrically isolate the conductive material within the openings formed within and laterally adjacent insulative layer 56. Such forms, in one embodiment, a plurality of capacitor storage nodes. Exemplary storage nodes are shown at 66, 68. The storage nodes, as formed, are arranged in columns which are disposed into and out of the plane of the page upon which Fig. 6 appears. Specifically, in this example storage node 66 constitutes one of a plurality of storage nodes arranged in one column which extends into and out of the plane of the page; and, storage node 68 constitutes one of a plurality of storage nodes in a different column which extends into and out of the plane of the page. Each column constitutes an array of storage nodes. The storage nodes can also be formed as containers or cup-like structures, with subsequent processing taking place substantially as described below.

0014Referring to Fig. 7, portions of conductive material 64 are removed sufficiently to less than fill each opening 66, 68 respectively. Accordingly, such constitutes but one way in which each opening can be less than filled with conductive material. It is possible, as mentioned above, for each opening to be less than filled with conductive material by other techniques. For example, a conformal deposition of conductive material, e.g. polysilicon, can be conducted to less than fill the openings.

0015In this example, overfilled portions of conductive material 64 are removed to below outer surface 58 of first insulative material layer 56, thereby partially filling each respective opening. Accordingly, each storage node received within layer 56 has an upper surface 66a, 68a respectively, which is disposed elevationally below outer surface 58. The illustrated upper surfaces 66a, 68a constitute uppermost surfaces, and each storage node has a side surface 66b, 68b respectively joined with its associated uppermost surface.

0016Referring to Fig. 8, an overlying insulative material 70 is formed over the uppermost surfaces 66a, 68b of respective storage nodes 66, 68. In the illustrated example, the formation of insulative material 70 constitutes filling remaining opening portions with insulative material. Insulative material 70 is preferably different from material comprising layer 56 for reasons which will become apparent below. An exemplary material is an oxide formed through decomposition of TEOS. In this example and for purposes of the ongoing discussion, insulative material 70 comprises a second different insulative layer of material, at least a portion of which is disposed within remaining opening portions. Such material can be formed by overfilling the remaining opening portions and planarizing the material relative to outer surface 58 of layer 56. Alternately by way of example only, the layer can be etched back through a timed etch.

0017In one embodiment, a sufficient amount of insulative material is formed over each storage node such that an insulative material surface 70a is generally coplanar with generally planar outer surface 58. Alternately considered, protective caps 72 are formed over uppermost surfaces 66a, 68a, with each cap being formed within at least a remaining portion of each opening. The protective caps are insulative in nature and formed over, and in this example, not laterally proximate conductive material comprising each storage node.

0018Referring to Fig. 9, portions of first insulative material layer 56 are removed to expose portions of side surfaces 66b, 68b respectively. In one embodiment, material of layer 56 is etched selectively relative to insulative material 70. Such constitutes removing material which is laterally adjacent each storage node sufficiently to expose respective side portions thereof. In this example, storage node portions are partially exposed by the removal of material of layer 56. Accordingly, side surfaces 66b, 68b have respective first portions (undesignated) which are disposed elevationally higher than an adjacent insulative material upper surface 74, and respective second portions (undesignated) which are disposed elevationally lower than the adjacent insulative material upper surface 74. In another embodiment, the removal of material of layer 56 comprises etching such material faster than any of second insulative material 70 sufficiently to expose portions of each capacitor node.

0019Referring to Fig. 10, a layer of roughened polysilicon 76, e.g. hemispherical grain (HSG) polysilicon or cylindrical grain polysilicon, is formed over exposed portions of each storage node. A capacitor dielectric layer 78 is formed over the exposed side surfaces of each storage node and corresponding portions of each node's protective cap 72. Such forms capacitor dielectric functioning regions which are discrete from the overlying insulative material 70 operably proximate at least a portion of the capacitor storage node.

0020A common cell electrode layer 80 is formed over capacitor dielectric layer 78, insulative material 70, and the previously-exposed side surfaces of the storage nodes. In this example, layer 80 is formed laterally proximate the respective side surface first portions which were previously exposed. Alternately considered, the array of storage nodes is first electrically interconnected in a capacitor array configuration with common cell electrode layer 80.

0021Referring to Fig. 11, a number of processing steps have taken place. First, material of common cell electrode layer 80 has been removed from between the columns defined by each of the respective storage nodes. Common cell electrode layer material is also preferably removed from over the individual protective caps. In one embodiment, cell electrode material is left only over generally vertical surfaces. Such serves to isolate individual cell electrodes over their respective capacitor storage nodes. In one embodiment, the removal of material of the common cell electrode layer 80 comprises anisotropically etching such layer and forming individual bands or rings 82, 84 around the node portions which were previously exposed. Overlying insulative layer 70 provides protection during the removal of the material of cell electrode layer 80 so that the risk of exposure and removal of layer 78 adjacent polysilicon 76 can be greatly reduced if not eliminated. In turn, subsequent risks of shorting between the cell plate and storage node can be greatly reduced if not eliminated. In a preferred embodiment, such bands are also formed over portions of the protective caps as shown. In a preferred embodiment, such is accomplished through a maskless etch. In the context of this document, the term "maskless" will be understood to only mean no masking of the area of the layer being etched for purposes of isolating the layer, without requiring no masking of the layer elsewhere on the substrate.

0022A third insulative material 86 is formed over the substrate including the isolated cell electrodes or bands 82, 84. An exemplary material is BPSG. Such material is formed over remaining cell electrode material. Openings 88 are patterned and etched into layer 86, and preferably expose at least some of the remaining cell electrode material or rings 82, 84. Conductive material 90, e.g. conductively doped polysilicon, is formed within openings 88 and preferably electrically interconnects at least some of the isolated individual cell electrodes. Material 90 can be planarized to have a generally planar upper surface which is coplanar with the upper surface of material 86. Alternately considered, formation of openings 88 constitutes etching a plurality of trenches into the third insulative material and exposing isolated individual cell electrodes. Subsequently, conductive material 90 is formed over the substrate and fills the trenches. Such constitutes second electrically interconnecting some of the isolated cell electrodes with conductive material. By "second electrically interconnecting" is meant that initially, when the cell electrode layer is blanket deposited over the substrate, the cell electrodes for the individual storage capacitors can be considered as being first electrically interconnected. When the conductive material of the cell electrode layer is removed from between the columns of arranged storage capacitors, such can be considered as electrically disconnecting the cell electrodes for the individual storage capacitors. Hence, when conductive material 90 is formed over the selected, isolated cell electrode material, such can be considered as electrically interconnecting some of the cell electrode material for a second time thereby placing them into electrical communication with one another.

0023Conductive material 92 is subsequently formed over the substrate and pattemed into conductive lines which extend to outside circuitry. Exemplary outside circuitry includes sensing circuitry.

0024Referring to Figs. 11 and 12, integrated circuitry is provided. In one embodiment, a capacitor storage node is provided and includes an uppermost surface 66a and a side surface 66b joined therewith. A protective cap 70 is provided over uppermost surface 66a, and a capacitor dielectric layer 78 is disposed over side surface 66b. A cell electrode band 82 is disposed proximate at least a portion of storage node side surface 66b, and not over storage node uppermost surface 66a. Protective cap 70 has a side surface (not specifically designated), and in one embodiment, cell electrode band 82 is disposed laterally proximate at least a portion of the protective cap side surface. In another embodiment, cell electrode band 82 is disposed over less than an entirety of storage node side surface 66b. In yet another embodiment, cell electrode band 82 has an uppermost portion which extends elevationally higher than any material of capacitor storage node 66.

0025In another embodiment, integrated circuitry includes a capacitor storage node 66 having an uppermost surface 66a. An insulative material 70 overlies uppermost surface 66a. A capacitor dielectric functioning region which is discrete from overlying insulative material 70 is disposed operably proximate at least a portion of the capacitor storage node. A cell electrode layer 82 is disposed laterally proximate the capacitor dielectric functioning region and overlying insulative material 70. In one embodiment, a substantial portion of the dielectric functioning region is disposed only laterally proximate the capacitor storage node. In another embodiment, the dielectric functioning region comprises a layer of dielectric material 78 which extends over overlying insulative material 70 and defines a non-dielectric functioning region. In another embodiment, the dielectric functioning region defines a band of dielectric material (Fig. 12) which laterally encircles at least a portion of storage node 66. In yet another embodiment, cell electrode layer 82 defines a band of conductive material which laterally encircles at least a portion of storage node 66. In yet another embodiment, cell electrode layer 82 comprises an uppermost band portion which extends elevationally higher than storage node uppermost surface 66a.

0026In another embodiment, a capacitor-over-bit line memory array is provided and includes a substrate 22 having a pair of spaced-apart conductive lines 26, 28 disposed thereover. A pair of diffusion regions 42, 46 are received within substrate 22 operably proximate conductive lines 26, 28. Conductive material 54 is disposed over and in electrical communication with diffusion regions 26, 28 respectively, and extends away therefrom. A pair of capacitor storage nodes 66, 68 are provided, each of which is operably joined with and in electrical communication with a respective one of the diffusion regions through the conductive material disposed thereover. Each storage node has an uppermost surface 66a, 68a respectively, and a respective side surface 66b, 68b joined therewith. A protective cap 70 is provided over each uppermost surface 66a, 68a, and a capacitor dielectric layer 78 is disposed over each side surface 66b, 68b. Cell electrode bands 82, 84 are respectively disposed proximate at least a portion of each associated storage node side surface 66b, 68b respectively, and not over the associated storage node uppermost surface 66a, 68a. The capacitor-over-bit line circuitry just described can have any of the constructions discussed above.

0027Referring to Fig. 13, a circuit schematic is shown which depicts a DRAM cell having an access transistor, a bit line BL, a storage capacitor C, and a segmented field plate column line PL. In a preferred embodiment, the segmented field plate column line PL is defined by either or both of conductive materials 90, 92 (Fig. 11). Whereas in the past, the field plate or cell electrode was shared by all of the capacitors in the memory array of a DRAM, the present invention provides methods by which discrete columns of capacitors can be connected into columns which can be selectively used, individually and directly in sensing applications.

0028Advantages can also be achieved in improving the voltage swing across the capacitors in the memory array and in improving the differential voltage signal as compared with the differential signal produced by an array having a common shared cell plate layer. Other advantages will be apparent to the skilled artisan. Aspects of the invention may involve any of the following numbered clauses. <ul id="ul0002" list-style="none"><li>1. A method of forming a capacitor comprising: <ul id="ul0003" list-style="none" compact="compact"><li>forming a capacitor storage node having an uppermost surface and an overlying insulative material over the uppermost surface;</li><li>after forming the capacitor storage node and the overlying insulative material, forming a capacitor dielectric functioning region discrete from the overlying insulative material operably proximate at least a portion of the capacitor storage node; and</li><li>forming a cell electrode layer over the capacitor dielectric functioning region and the overlying insulative material.</li></ul></li><li>2. The method of clause 1, wherein the forming of the capacitor storage node comprises: <ul id="ul0004" list-style="none" compact="compact"><li>forming a layer of material over a substrate;</li><li>forming an opening received within the layer of material; and</li><li>forming a layer of conductive material within the opening to less than fill the opening.</li></ul></li><li>3. The method of clause 1, wherein the forming of the capacitor storage node comprises: <ul id="ul0005" list-style="none" compact="compact"><li>forming a layer of material over a substrate;</li><li>forming an opening received within the layer of material;</li><li>overfilling the opening with conductive material; and</li><li>removing a sufficient amount of the conductive material to less than fill the opening.</li></ul></li><li>4. The method of clause 1, wherein the forming of the capacitor storage node comprises: <ul id="ul0006" list-style="none" compact="compact"><li>forming a layer of material over a substrate, the layer of material having a generally planar outer surface; and</li><li>forming the storage node to be received within the layer of material and to have an upper surface elevationally below the generally planar outer surface.</li></ul></li><li>5. The method of clause 1, wherein: <ul id="ul0007" list-style="none" compact="compact"><li>the forming of the capacitor storage node comprises: <ul id="ul0008" list-style="none" compact="compact"><li>forming a layer of material over a substrate;</li><li>forming an opening received within the layer of material; and</li><li>forming a layer of conductive material within the opening to less than fill the opening; and</li></ul></li><li>the forming of the insulative material comprises filling remaining opening portions with the insulative material.</li></ul></li><li>6. The method of clause 1, wherein: <ul id="ul0009" list-style="none" compact="compact"><li>the forming of the capacitor storage node comprises: <ul id="ul0010" list-style="none" compact="compact"><li>forming a layer of material over a substrate, the layer of material having a generally planar outer surface;</li><li>forming the storage node to be received within the layer of material and to have an upper surface elevationally below the generally planar outer surface; and</li></ul></li><li>the forming of the insulative material comprises forming a sufficient amount of the insulative material over the storage node to have an insulative material surface which is generally coplanar with the generally planar outer surface of the layer of material.</li></ul></li><li>7. The method of clause 1, wherein: <ul id="ul0011" list-style="none" compact="compact"><li>the forming of the capacitor storage node comprises: <ul id="ul0012" list-style="none" compact="compact"><li>forming a layer of material over a substrate;</li><li>forming an opening received within the layer of material; and</li><li>forming a layer of conductive material within the opening to less than fill the opening; and</li></ul></li><li>prior to the forming of the capacitor dielectric function region, etching the layer of material selectively relative to the insulative material and exposing a side surface of the storage node.</li></ul></li><li>8. The method of clause 7 further comprising forming a layer of roughened polysilicon over the exposed side surface of the storage node.</li><li>9. The method of clause 1 further comprising after the forming of the cell electrode layer, conducting a maskless etch of the cell electrode layer leaving cell electrode material only over generally vertical surfaces.</li><li>10. The method of clause 1, wherein the forming of the capacitor storage node comprises forming said node as a capacitor storage node container.</li><li>11. A method of forming a capacitor comprising: <ul id="ul0013" list-style="none" compact="compact"><li>forming a capacitor storage node having an uppermost surface and a side surface joined therewith;</li><li>forming a protective cap over the uppermost surface;</li><li>forming a capacitor dielectric layer over the side surface and protective cap; and</li><li>forming a cell electrode layer over the side surface of the capacitor storage node.</li></ul></li><li>12. The method of clause 11, wherein the forming of the capacitor storage node comprises: <ul id="ul0014" list-style="none" compact="compact"><li>forming a layer of material over a substrate;</li><li>forming an opening received within the layer of material; and</li><li>forming conductive material within the opening.</li></ul></li><li>13. The method of clause 11, wherein the forming of the capacitor storage node comprises: <ul id="ul0015" list-style="none" compact="compact"><li>forming a layer of material over a substrate;</li><li>forming an opening received within the layer of material; and</li><li>filling the opening with conductive material.</li></ul></li><li>14. The method of clause 11, wherein: <ul id="ul0016" list-style="none" compact="compact"><li>the forming of the capacitor storage node comprises: <ul id="ul0017" list-style="none" compact="compact"><li>forming a layer of material over a substrate;</li><li>forming an opening received within the layer of material; and</li><li>less than filling the opening with conductive material; and</li></ul></li><li>the forming of the protective cap comprises forming the cap at least within a remaining opening portion.</li></ul></li><li>15. The method of clause 11, wherein the forming of the capacitor storage node comprises forming conductive material laterally adjacent a layer of material, and further comprising after the forming of the protective cap, removing material of the laterally adjacent layer of material and exposing a side surface portion of the storage node.</li><li>16. The method of clause 11, wherein the forming of the capacitor storage node comprises forming conductive material laterally adjacent a layer of material, and further comprising after the forming of the protective cap, selectively etching material of the laterally adjacent layer of material relative to the protective cap and exposing a side surface portion of the storage node.</li><li>17. The method of clause 11, wherein the forming of the cell electrode layer comprises forming the cell electrode layer over the protective cap and storage node side surface, and removing material of the cell electrode layer from over protective cap.</li><li>18. The method of clause 11, wherein the forming of the cell electrode layer comprises forming the cell electrode layer over the protective cap and storage node side surface, and without a mask, anisotropically etching the cell electrode layer.</li><li>19. The method of clause 11, wherein: <ul id="ul0018" list-style="none" compact="compact"><li>the forming of the capacitor storage node comprises forming conductive material laterally adjacent a layer of material, and further comprising after the forming of the protective cap, removing material of the laterally adjacent layer of material and exposing a side surface portion of the storage node; and</li><li>the forming of the cell electrode layer comprises forming the cell electrode layer over the protective cap and the storage node side surface portion which was exposed, and anisotropically etching the cell electrode layer.</li></ul></li><li>20. The method of clause 11, wherein: <ul id="ul0019" list-style="none" compact="compact"><li>the forming of the capacitor storage node comprises forming conductive material laterally adjacent a layer of material, and further comprising after the forming of the protective cap, selectively etching material of the laterally adjacent layer of material relative to the protective cap and exposing a side surface portion of the storage node; and</li><li>the forming of the cell electrode layer comprises forming the cell electrode layer over the protective cap and the storage node side surface portion which was exposed, and anisotropically etching the cell electrode layer.</li></ul></li><li>21. The method of clause 11, wherein the forming of the protective cap comprises forming said cap from insulative material.</li><li>22. A method of forming a plurality of capacitors comprising: <ul id="ul0020" list-style="none" compact="compact"><li>forming a plurality of capacitor storage nodes arranged in columns;</li><li>forming a capacitor dielectric layer over at least portions of the capacitor storage nodes;</li><li>forming a common cell electrode layer over the plurality of capacitor storage nodes;</li><li>removing cell electrode layer material from between the columns and isolating individual cell electrodes over individual respective capacitor storage nodes; and</li><li>after the removing of the cell electrode layer material, forming conductive material over portions of remaining cell electrode material and placing some of the individual cell electrodes into electrical communication with one another.</li></ul></li><li>23. The method of clause 22, wherein the forming of the capacitor storage nodes comprises: <ul id="ul0021" list-style="none" compact="compact"><li>forming an insulative layer of material;</li><li>forming openings received within the insulative layer of material; and</li><li>forming conductive material received within the openings.</li></ul></li><li>24. The method of clause 22, wherein the forming of the capacitor storage nodes comprises: <ul id="ul0022" list-style="none" compact="compact"><li>forming an insulative layer of material;</li><li>forming openings received within the insulative layer of material; overfilling the openings with conductive material; and</li><li>removing portions of the conductive material and isolating the capacitor storage nodes within the openings.</li></ul></li><li>25. The method of clause 22, wherein the forming of the capacitor storage nodes comprises: <ul id="ul0023" list-style="none" compact="compact"><li>forming a first insulative layer of material;</li><li>forming openings received within the first insulative layer of material;</li><li>overfilling the openings with conductive material;</li><li>removing portions of the conductive material to below an outer surface of the first insulative layer of material;</li><li>forming a second different insulative layer of material at least within remaining opening portions; and</li><li>removing material of the first insulative layer of material selectively relative to material of the second insulative layer of material and exposing a side surface of the conductive material.</li></ul></li><li>26. The method of clause 22, wherein the removing of the cell electrode layer material comprises anisotropically etching the cell electrode layer material.</li><li>27. The method of clause 22, wherein the forming of the conductive material over the remaining cell electrode material portions comprises: <ul id="ul0024" list-style="none" compact="compact"><li>forming an insulative layer of material over the remaining cell electrode material;</li><li>exposing at least some of the remaining cell electrode material portions through the insulative layer; and</li><li>forming the conductive material over the remaining cell electrode material portions.</li></ul></li><li>28. The method of clause 22, wherein the forming of the conductive material over the remaining cell electrode material portions comprises: <ul id="ul0025" list-style="none" compact="compact"><li>forming an insulative layer of material over the remaining cell electrode material;</li><li>etching a trench into the insulative layer and exposing at least some of the remaining cell electrode material portions; and</li><li>forming the conductive material within the trench.</li></ul></li><li>29. The method of clause 22, wherein the forming of the conductive material over the remaining cell electrode material portions comprises: <ul id="ul0026" list-style="none" compact="compact"><li>forming an insulative layer of material over the remaining cell electrode material;</li><li>etching a trench into the insulative layer and exposing at least some of the remaining cell electrode material portions;</li><li>forming the conductive material within the trench; and</li><li>planarizing the conductive material within the trench relative to an insulative layer outer surface.</li></ul></li><li>30. The method of clause 22, wherein: <ul id="ul0027" list-style="none" compact="compact"><li>the forming of the capacitor storage nodes comprises: <ul id="ul0028" list-style="none" compact="compact"><li>forming a first insulative layer of material;</li><li>forming openings received within the first insulative layer of material;</li><li>overfilling the openings with conductive material;</li><li>removing portions of the conductive material to below an outer surface of the first insulative layer of material;</li><li>forming a second different insulative layer of material at least within remaining opening portions; and</li><li>removing material of the first insulative layer of material selectively relative to material of the second insulative layer of material and exposing a side surface of the conductive material; and</li></ul></li><li>the removing of the cell electrode layer material comprises anisotropically etching the cell electrode layer material.</li></ul></li><li>31. The method of clause 22, wherein: <ul id="ul0029" list-style="none" compact="compact"><li>the forming of the capacitor storage nodes comprises: <ul id="ul0030" list-style="none" compact="compact"><li>forming a first insulative layer of material;</li><li>forming openings received within the first insulative layer of material;</li><li>overfilling the openings with conductive material;</li><li>removing portions of the conductive material to below an outer surface of the first insulative layer of material;</li><li>forming a second different insulative layer of material at least within remaining opening portions; and</li><li>removing material of the first insulative layer of material selectively relative to material of the second insulative layer of material and exposing a side surface of the conductive material; and</li></ul></li><li>the forming of the conductive material over the remaining cell electrode material portions comprises: <ul id="ul0031" list-style="none" compact="compact"><li>forming a third insulative layer of material over the remaining cell electrode material;</li><li>exposing at least some of the remaining cell electrode material portions through the third insulative layer; and</li><li>forming the conductive material over the remaining cell electrode material portions.</li></ul></li></ul></li><li>32. The method of clause 22, wherein: <ul id="ul0032" list-style="none" compact="compact"><li>the forming of the capacitor storage nodes comprises: <ul id="ul0033" list-style="none" compact="compact"><li>forming a first insulative layer of material;</li><li>forming openings received within the first insulative layer of material;</li><li>overfilling the openings with conductive material;</li><li>removing portions of the conductive material to below an outer surface of the first insulative layer of material;</li><li>forming a second different insulative layer of material at least within remaining opening portions; and</li><li>removing material of the first insulative layer of material selectively relative to material of the second insulative layer of material and exposing a side surface of the conductive material; and</li></ul></li><li>the forming of the conductive material over the remaining cell electrode material portions comprises: <ul id="ul0034" list-style="none" compact="compact"><li>forming a third insulative layer of material over the remaining cell electrode material;</li><li>etching a trench into the third insulative layer and exposing at least some of the remaining cell electrode material portions; and</li><li>forming the conductive material within the trench.</li></ul></li></ul></li><li>33. A method of forming capacitor-over-bit line memory circuitry comprising: <ul id="ul0035" list-style="none" compact="compact"><li>forming an opening in a first insulative material;</li><li>forming a conductive capacitor storage node within at least a portion of the opening;</li><li>forming a second insulative material over the capacitor storage node;</li><li>selectively removing portions of the first insulative material relative to the second insulative material and exposing a portion of the conductive capacitor storage node; and</li><li>forming a capacitor dielectric layer and a cell electrode layer operably proximate the exposed portion of the conductive capacitor storage node.</li></ul></li><li>34. The method of clause 33, wherein: <ul id="ul0036" list-style="none" compact="compact"><li>the forming of the conductive capacitor storage node comprises partially filling the opening with conductive material; and</li><li>the forming of the second insulative material comprises filling a remaining opening portion with second insulative material.</li></ul></li><li>35. The method of clause 33, wherein: <ul id="ul0037" list-style="none" compact="compact"><li>the forming of the conductive capacitor storage node comprises only partially filling the opening with conductive material; and</li><li>the forming of the second insulative material comprises filling a remaining opening portion with second insulative material.</li></ul></li><li>36. The method of clause 33, wherein: <ul id="ul0038" list-style="none" compact="compact"><li>the forming of the conductive capacitor storage node comprises partially filling the opening with conductive material;</li><li>the forming of the second insulative material comprises filling a remaining opening portion with second insulative material; and</li><li>the removing of the portions of the first insulative material comprise exposing a side surface of the storage node.</li></ul></li><li>37. The method of clause 33, wherein: <ul id="ul0039" list-style="none" compact="compact"><li>the removing of the portions of the first insulative material comprises exposing a side surface of the storage node; and</li><li>the forming of the cell electrode layer comprises forming a band of cell electrode layer material around the side surface which was previously exposed.</li></ul></li><li>38. The method of clause 33, wherein: <ul id="ul0040" list-style="none" compact="compact"><li>the forming of the conductive capacitor storage node comprises partially filling the opening with conductive material;</li><li>the forming of the second insulative material comprises filling a remaining opening portion with second insulative material;</li><li>the removing of the portions of the first insulative material comprises exposing a side surface of the storage node; and</li><li>the forming of the cell electrode layer comprises forming a band of cell electrode layer material around the side surface which was previously exposed.</li></ul></li><li>39. A method of forming capacitor-over-bit line memory circuitry comprising: <ul id="ul0041" list-style="none" compact="compact"><li>forming a plurality of openings in a first insulative material;</li><li>less than filling the openings with a conductive material comprising capacitor storage nodes;</li><li>filling the remaining openings with a second insulative material;</li><li>etching the first insulative material faster than any of the second insulative material sufficient to expose portions of individual capacitor storage nodes;</li><li>forming a capacitor dielectric layer and a common cell electrode layer operably proximate portions of the conductive capacitor storage nodes which were previously exposed;</li><li>anisotropically etching the common cell electrode layer and isolating individual cell electrodes over individual respective capacitor storage nodes; and</li><li>electrically interconnecting some of the isolated individual cell electrodes with conductive material.</li></ul></li><li>40. The method of clause 39, wherein the less than filling of the openings comprises overfilling the openings with the conductive material and removing overfilled portions of the conductive material.</li><li>41. The method of clause 39, wherein the etching of the common cell electrode layer comprises forming respective bands around the individual storage node portions which were previously exposed.</li><li>42. The method of clause 39, wherein the interconnecting of the isolated cell electrodes comprises: <ul id="ul0042" list-style="none" compact="compact"><li>forming a third insulative material over the isolated cell electrodes;</li><li>etching a trench into the third insulative material and exposing the isolated individual cell electrodes; and</li><li>filling the trench with conductive material.</li></ul></li><li>43. The method of clause , 39 wherein: <ul id="ul0043" list-style="none" compact="compact"><li>the etching of the common cell electrode layer comprises forming respective bands around the individual storage node portions which were previously exposed; and</li><li>the interconnecting of the isolated cell electrodes comprises: <ul id="ul0044" list-style="none" compact="compact"><li>forming a third insulative material over the isolated cell electrodes;</li><li>etching a trench into the third insulative material and exposing some of the band portions of the individual storage node portions; and</li><li>filling the trench with conductive material.</li></ul></li></ul></li><li>44. Integrated circuitry comprising: <ul id="ul0045" list-style="none" compact="compact"><li>a capacitor storage node having an uppermost surface and a side surface joined therewith;</li><li>a protective cap over the uppermost surface;</li><li>a capacitor dielectric layer over the side surface; and</li><li>a cell electrode band disposed proximate at least a portion of the storage node side surface and not over the storage node uppermost surface.</li></ul></li><li>45. The integrated circuitry of clause 44, wherein the protective cap has a side surface, and the cell electrode band is disposed laterally proximate at least a portion of the protective cap side surface.</li><li>46. The integrated circuitry of clause 44, wherein the cell electrode band is disposed over less than an entirety of the storage node side surface.</li><li>47. The integrated circuitry of clause 44, wherein the cell electrode band has an uppermost portion which extends elevationally higher than any material of the capacitor storage node.</li><li>48. The integrated circuitry of clause 44, wherein: <ul id="ul0046" list-style="none" compact="compact"><li>the protective cap has a side surface, and the cell electrode band is disposed laterally proximate at least a portion of the protective cap side surface; and</li><li>the cell electrode band has an uppermost portion which extends elevationally higher than any material of the capacitor storage node.</li></ul></li><li>49. The integrated circuitry of clause 44, wherein: <ul id="ul0047" list-style="none" compact="compact"><li>the cell electrode band is disposed over less than an entirety of the storage node side surface; and</li><li>the cell electrode band has an uppermost portion which extends elevationally higher than any material of the capacitor storage node.</li></ul></li><li>50. Integrated circuitry comprising: <ul id="ul0048" list-style="none" compact="compact"><li>a capacitor storage node having an uppermost surface;</li><li>an insulative material overlying the uppermost surface;</li><li>a capacitor dielectric functioning region discrete from the overlying insulative material and disposed operably proximate at least a portion of the capacitor storage node; and</li><li>a cell electrode layer disposed laterally proximate the capacitor dielectric functioning region and the overlying insulative material.</li></ul></li><li>51. The integrated circuitry of clause 50, wherein a substantial portion of the dielectric functioning region is disposed only laterally proximate the capacitor storage node.</li><li>52. The integrated circuitry of clause 50, wherein the dielectric functioning region comprises a layer of dielectric material which extends over the overlying insulative material and defines a non-dielectric functioning region.</li><li>53. The integrated circuitry of clause 50, wherein the dielectric functioning region defines a band of dielectric material which laterally encircles at least a portion of the storage node.</li><li>54. The integrated circuitry of clause 50, wherein the cell electrode layer defines a band of conductive material which laterally encircles at least a portion of the storage node.</li><li>55. The integrated circuitry of clause 50, wherein the cell electrode layer defines a band of conductive material which laterally encircles at least a portion of the storage node and comprises an uppermost band portion which extends elevationally higher than the storage node uppermost surface.</li><li>56. A capacitor-over-bit line memory array comprising: <ul id="ul0049" list-style="none" compact="compact"><li>a substrate; ,</li><li>a pair of spaced-apart conductive lines disposed over the substrate;</li><li>a pair of diffusion regions received within the substrate operably proximate the conductive lines;</li><li>conductive material disposed over and in electrical communication with the diffusion regions, the conductive material extending away from the diffusion regions;</li><li>a pair of capacitor storage nodes, each of which being operably joined with and in electrical communication with a respective one of the diffusion regions through the conductive material disposed thereover, each storage node having an uppermost surface and a side surface joined therewith;</li><li>a protective cap over each uppermost surface;</li><li>a capacitor dielectric layer over each side surface; and</li><li>a cell electrode band disposed proximate at least a portion of each storage node side surface and not over the associated storage node uppermost surface.</li></ul></li><li>57. The capacitor-over-bit line memory array of clause 56, wherein each protective cap has a side surface, and the cell electrode band associated therewith is disposed laterally proximate at least a portion of the protective cap side surface.</li><li>58. The capacitor-over-bit line memory array of clause 56, wherein each cell electrode band is disposed over less than an entirety of its associated storage node side surface.</li><li>59. The capacitor-over-bit line memory array of clause 56, wherein each cell electrode band has an uppermost portion which extends elevationally higher than any material of its associated capacitor storage node.</li><li>60. The capacitor-over-bit line memory array of clause 56, wherein: <ul id="ul0050" list-style="none" compact="compact"><li>each protective cap has a side surface, and the cell electrode band associated therewith is disposed laterally proximate at least a portion of the protective cap side surface; and</li><li>each cell electrode band has an uppermost portion which extends elevationally higher than any material of its associated capacitor storage node.</li></ul></li><li>61. The capacitor-over-bit line memory array of clause 56, wherein: <ul id="ul0051" list-style="none" compact="compact"><li>each cell electrode band is disposed over less than an entirety of its associated storage node side surface; and</li><li>each cell electrode band has an uppermost portion which extends elevationally higher than any material of its associated capacitor storage node.</li></ul></li></ul>