EP1580800A4

Method for cutting semiconductor substrate

Abstract

This record has no abstract on file.

EP1580800A4, drawing sheet 1 — Sheet 1 of 25

Term

Term ended

Projected expiry passed 11 September 2023, 3 years ago.

25 sheets

Sheet 1
Sheet 2
Sheet 3
Sheet 4
Sheet 5
Sheet 6
Sheet 7
Sheet 8
Sheet 9
Sheet 10
Sheet 11
Sheet 12
Sheet 13
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Sheet 15
Sheet 16
Sheet 17
Sheet 18
Sheet 19
Sheet 20
Sheet 21
Sheet 22
Sheet 23
Sheet 24
Sheet 25

Every citation, both ways

Citations
Document	Relation	Office	Category	Cited during	Relevant claims
WO0222301A1	Cites	World Intellectual Property Organization (WIPO)	X	Search report	1-13,15-18
WO0222301A	Cites	World Intellectual Property Organization (WIPO)	–	–	–
See also references of WO 2004051721A1	Non-patent	–	–	Search report	–

207 members in 12 offices; this record represents the family

This recordMember, by publication datePriority claim2 more offices are in the list below

Priority claims3

Priority claims
Document	Office	Kind	Date
2002351600	Japan	–	2002-12-03
2002351600	Japan	A	2002-12-03
0311624	Japan	W	2003-09-11

Members207

Family members, oldest first
Document	Office	Kind
WO03076118A1	World Intellectual Property Organization (WIPO)	A1	2003-09-18
WO03076119A1	World Intellectual Property Organization (WIPO)	A1	2003-09-18
WO03076120A1	World Intellectual Property Organization (WIPO)	A1	2003-09-18
AU2003211575A1	Australia	A1	2003-09-22
AU2003211581A1	Australia	A1	2003-09-22
AU2003220851A1	Australia	A1	2003-09-22
JP2003266185A	Japan	A	2003-09-24
TW200304857A	Taiwan Province of China	A	2003-10-16
TW200304858A	Taiwan Province of China	A	2003-10-16
JP2003334675A	Japan	A	2003-11-25
JP2003334812A	Japan	A	2003-11-25
JP2003338467A	Japan	A	2003-11-28
JP2003338468A	Japan	A	2003-11-28
JP2003338636A	Japan	A	2003-11-28
JP2003338652A	Japan	A	2003-11-28
TW200307322A	Taiwan Province of China	A	2003-12-01
JP2004001076A	Japan	A	2004-01-08
WO2004051721A1	World Intellectual Property Organization (WIPO)	A1	2004-06-17
AU2003262077A1	Australia	A1	2004-06-23
TW200416954A	Taiwan Province of China	A	2004-09-01
TW200417439A	Taiwan Province of China	A	2004-09-16
WO2004082006A1	World Intellectual Property Organization (WIPO)	A1	2004-09-23
AU2003262079A1	Australia	A1	2004-09-30
KR20040093139A	Republic of Korea	A	2004-11-04
KR20040099323A	Republic of Korea	A	2004-11-26
JP2005001001A	Japan	A	2005-01-06
EP1498215A1	European Patent Office (EPO)	A1	2005-01-19
EP1498216A1	European Patent Office (EPO)	A1	2005-01-19
JP3624909B2	Japan	B2	2005-03-02
JP2005096459A	Japan	A	2005-04-14
JP2005167281A	Japan	A	2005-06-23
JPWO2003076118A1	Japan	A1	2005-06-30
JPWO2003076119A1	Japan	A1	2005-07-07
JPWO2003076120A1	Japan	A1	2005-07-07
JP3670267B2	Japan	B2	2005-07-13
CN1642687A	China	A	2005-07-20
CN1642688A	China	A	2005-07-20
JP2005197760A	Japan	A	2005-07-21
KR20050084878A	Republic of Korea	A	2005-08-29
US2005202596A1	United States of America	A1	2005-09-15
EP1580800A1	European Patent Office (EPO)	A1	2005-09-28
KR20050106100A	Republic of Korea	A	2005-11-08
CN1703770A	China	A	2005-11-30
EP1610364A1	European Patent Office (EPO)	A1	2005-12-28
CN1717784A	China	A	2006-01-04
US2006011593A1	United States of America	A1	2006-01-19
JP3761566B2	Japan	B2	2006-03-29
JP2006114937A	Japan	A	2006-04-27
JP2006114938A	Japan	A	2006-04-27
JP2006121113A	Japan	A	2006-05-11
JP2006128723A	Japan	A	2006-05-18
JP2006135354A	Japan	A	2006-05-25
JP2006135355A	Japan	A	2006-05-25
JP2006175520A	Japan	A	2006-07-06
US2006148212A1	United States of America	A1	2006-07-06
JP2006203256A	Japan	A	2006-08-03
JP2006212708A	Japan	A	2006-08-17
JP2006231413A	Japan	A	2006-09-07
JP3822626B2	Japan	B2	2006-09-20
JP3867100B2	Japan	B2	2007-01-10
JP3867104B2	Japan	B2	2007-01-10
JP3867105B2	Japan	B2	2007-01-10
TWI270431B	Taiwan Province of China	B	2007-01-11
JP3869850B2	Japan	B2	2007-01-17
JP2007083309A	Japan	A	2007-04-05
JP2007136554A	Japan	A	2007-06-07
JP3935186B2	Japan	B2	2007-06-20
JP3935189B2	Japan	B2	2007-06-20
US2007158314A1	United States of America	A1	2007-07-12
CN1328002C	China	C	2007-07-25
KR100749972B1	Republic of Korea	B1	2007-08-16
JP3990710B2	Japan	B2	2007-10-17
JP3990711B2	Japan	B2	2007-10-17
TWI289890B	Taiwan Province of China	B	2007-11-11
KR20070114398A	Republic of Korea	A	2007-12-03
JP4050534B2	Japan	B2	2008-02-20
CN100383926C	China	C	2008-04-23
TWI296218B	Taiwan Province of China	B	2008-05-01
KR100832941B1	Republic of Korea	B1	2008-05-27
KR100853057B1	Republic of Korea	B1	2008-08-19
EP1610364A4	European Patent Office (EPO)	A4	2008-08-27
KR100855136B1	Republic of Korea	B1	2008-08-28
JP4146863B2	Japan	B2	2008-09-10
KR100866171B1	Republic of Korea	B1	2008-10-30
CN100440443C	China	C	2008-12-03
CN100448593C	China	C	2009-01-07
CN101369554A	China	A	2009-02-18
TW200914185A	Taiwan Province of China	A	2009-04-01
CN101412154A	China	A	2009-04-22
TW200924113A	Taiwan Province of China	A	2009-06-01
EP1498215A4	European Patent Office (EPO)	A4	2009-07-01
EP1498216A4	European Patent Office (EPO)	A4	2009-07-01
EP1580800A4This record	European Patent Office (EPO)	A4	2009-09-16
JP4358502B2	Japan	B2	2009-11-04
JP2009296008A	Japan	A	2009-12-17
US2010015783A1	United States of America	A1	2010-01-21
JP4409840B2	Japan	B2	2010-02-03
JP4463796B2	Japan	B2	2010-05-19
EP2199008A2	European Patent Office (EPO)	A2	2010-06-23
EP2199009A2	European Patent Office (EPO)	A2	2010-06-23

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75 legal events, as 10 offices reported them to INPADOC

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Events

Legal events, newest first
	Event	Code	Office
2023-10-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2023-10-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2023-10-04	Patent expired after termination of 20 yearsExpiredPE20	PE20	GB
2023-10-03	Patent expired because of reaching the maximum lifetime of a patentExpiredMK	MK	BE
2023-09-28	Announcement of lapse in spainLapsedFD2A	FD2A	ES
2023-09-15	Patent ceasedCeasedPL	PL	CH
2023-09-13	Patent expired because of reaching the maximum lifetime of a patentExpiredMK	MK	NL
2023-09-11	Expiry of rightR071	R071	DE
2023-06-14	Opt-out of the competence of the unified patent court (upc) registeredP01	P01	EP
2023-02-28	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2023-01-31	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2022-11-30	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2022-11-30	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2022-10-31	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2022-10-31	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2022-10-31	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2022-09-30	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2018-08-13	Fee paymentPLFP	PLFP	FR
2017-08-10	Fee paymentPLFP	PLFP	FR
2016-08-16	Fee paymentPLFP	PLFP	FR
2016-07-29	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2016-07-29	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2016-05-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-08-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-07-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-06-18	No opposition filed against granted patent, or epo opposition proceedings concluded without decisionGrantedR097	R097	DE
2015-06-17	Patent lapsedLapsedMM4A	MM4A	IE
2015-05-13	No opposition filedOpposition26N	26N	EP
2015-04-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-04-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-04-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-04-10	No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE	PLBE	EP
2015-04-10	Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA	STAA	EP
2015-03-05	No opposition filed against granted patent, or epo opposition proceedings concluded without decisionGrantedR097	R097	DE
2015-01-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-01-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-01-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-01-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2015-01-30	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2014-11-28	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2014-11-28	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2014-10-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2014-10-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2014-10-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2014-10-15	Deletion acc. to par. 5 (withdrawal of the translation of the ep patent)MK05	MK05	AT
2014-08-13	Translation filed for an european patent granted for nl, confirming art. 52 par. 1 or 6 of the patents act 1995GrantedT3	T3	NL
2014-07-24	Definitive protectionFG2A	FG2A	ES
2014-07-17	Dpma publication of mentioned ep patent grantGrantedR096	R096	DE
2014-07-02	European patents granted designating irelandGrantedFG4D	FG4D	IE
2014-06-15	Reference to at number (ep patent validated in austria)REF	REF	AT
2014-06-13	European patent takes effect as a national patent in ch/liEP	EP	CH
2014-06-13	New agentNV	NV	CH
2014-06-04	Designated contracting statesAK	AK	EP
2014-06-04	European patent grantedGrantedFG4D	FG4D	GB
2014-05-02	(expected) grantORIGINAL CODE: 0009210GRAA	GRAA	EP
2014-04-25	Grant fee paidORIGINAL CODE: EPIDOSNIGR3GRAS	GRAS	EP
2014-01-15	Intention to grant announcedINTG	INTG	EP
2013-12-17	Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP	GRAP	EP
2013-07-24	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2013-07-24	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2013-07-24	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2013-07-24	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2013-07-24	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2010-03-10	First examination report despatched17Q	17Q	EP
2009-09-16	Supplementary search report drawn up and despatchedA4	A4	EP
2009-09-16	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2009-09-16	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2009-09-16	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2009-09-16	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2009-09-16	Information provided on ipc code assigned before grantRIC1	RIC1	EP
2006-03-29	Request for extension of the european patent (deleted)DAX	DAX	EP
2005-09-28	Request for examination filed17P	17P	EP
2005-09-28	Designated contracting statesAK	AK	EP
2005-09-28	Request for extension of the european patentAX	AX	EP
2005-08-12	Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI	PUAI	EP

Method for cutting semiconductor substrate

Abstract

Term

Priority claims3

Members207

Over the term

Events

Numbers

Titles3

Classification

Designated states1