Device with through-hole interconnection and method for manufacturing the same

A device having improved electrical connection includes a first substrate (11) including a first side and a second side; a functional element (12) on the first side of the first substrate; a pad (13) that is electrically connected to the functional element; and a through-hole interconnection (15) provided in a hole extending through the first substrate from the first side to the second side, the through-hole interconnection including a first conductive material (17) and being electrically connected to the pad, and a conductive region (18) that is provided along a portion of an inner surface of the hole, and is made of a second conductive material, different from the first conductive material.