EP1569263A3

Method for joining two wafers and wafer assembly

Abstract

The invention relates to a method for connecting two wafers (11, 12), in which a contact region (15) is formed between the wafers (11, 12) by overlaying the two wafers (11, 12) and in which the contact region (15) is formed. is heated locally and temporarily. Furthermore, the invention relates to a wafer arrangement in which two superimposed wafers (11, 12), between whose opposite surfaces a contact region (15) is located, are connected to each other at selected regions (21) of their contact region. The method for connecting two wafers (11, 12), as well as the wafer arrangement, are particularly suitable for processing particularly temperature-sensitive components.

EP1569263A3, drawing sheet 1 — Sheet 1 of 1

Term

Term ended

Projected expiry passed 8 February 2025, 1.6 years ago.

1 sheet

Sheet 1

Every citation, both ways

Citations
Document	Relation	Office	Category	Cited during	Relevant claims
EP0232935A1	Cites	European Patent Office (EPO)	X	Search report	1,31
EP0539741A1	Cites	European Patent Office (EPO)	X	Search report	1,31
EP0758145A2	Cites	European Patent Office (EPO)	X	Search report	1
EP1369912A2	Cites	European Patent Office (EPO)	X	Search report	1
DE19646476A1	Cites	Germany	XY	Search report	1-3,7,8,22,23,31-34
US2001014514A1	Cites	United States of America	XY	Search report	1,9,22-32,34
WO2004015756A1	Cites	World Intellectual Property Organization (WIPO)	Y	Search report	4-6
GB2244374A	Cites	United Kingdom	X	Search report	1
DE4219132A1	Cites	Germany	XY	Search report	1,9,22,23,31,32,34
US5460318A	Cites	United States of America	XY	Search report	1-3,7-9,22,23,31,32,34
US5481082A	Cites	United States of America	Y	Search report	9-21
US5500540A	Cites	United States of America	X	Search report	1

10 members in 4 offices; this record represents the family

This recordMember, by publication datePriority claim

Priority claims4

Priority claims
Document	Office	Kind	Date
102004009625	Germany	–	2004-02-27
102004009625	Germany	A	2004-02-27
102004012013	Germany	–	2004-03-11
102004012013	Germany	A	2004-03-11

Members10

Family members, oldest first
Document	Office	Kind
EP1569263A2	European Patent Office (EPO)	A2	2005-08-31
JP2005244241A	Japan	A	2005-09-08
DE102004012013A1	Germany	A1	2005-09-22
US2005211678A1	United States of America	A1	2005-09-29
EP1569263A3This record	European Patent Office (EPO)	A3	2009-05-06
US7872210B2	United States of America	B2	2011-01-18
US2011079911A1	United States of America	A1	2011-04-07
EP1569263B1	European Patent Office (EPO)	B1	2011-11-23
US8471385B2	United States of America	B2	2013-06-25
DE102004012013B4	Germany	B4	2013-08-22

36 legal events, as 4 offices reported them to INPADOC

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Events

Legal events, newest first
	Event	Code	Office
2020-02-28	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2020-01-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2020-01-31	Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25	PG25	EP
2019-10-23	Gb: european patent ceased through non-payment of renewal feeCeasedGBPC	GBPC	EP
2019-09-03	Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal feeWithdrawnR119	R119	DE
2018-05-31	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2018-04-30	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2018-04-30	Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP	PGFP	EP
2018-02-23	Fee paymentPLFP	PLFP	FR
2017-02-17	Fee paymentPLFP	PLFP	FR
2016-02-18	Fee paymentPLFP	PLFP	FR
2012-12-27	No opposition filed against granted patent, or epo opposition proceedings concluded without decisionGrantedR097	R097	DE
2012-10-31	No opposition filedOpposition26N	26N	EP
2012-09-28	No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE	PLBE	EP
2012-09-28	Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA	STAA	EP
2012-01-19	Dpma publication of mentioned ep patent grantGrantedR096	R096	DE
2011-11-23	Designated contracting statesAK	AK	EP
2011-11-23	European patent grantedGrantedNOT ENGLISHFG4D	FG4D	GB
2011-10-21	(expected) grantORIGINAL CODE: 0009210GRAA	GRAA	EP
2011-10-21	Grant fee paidORIGINAL CODE: EPIDOSNIGR3GRAS	GRAS	EP
2011-08-31	Title (correction)METHOD FOR JOINING TWO WAFERSRTI1	RTI1	EP
2011-08-26	Information related to communication of intention to grant a patent modifiedORIGINAL CODE: EPIDOSCIGR1GRAC	GRAC	EP
2011-08-24	Information related to communication of intention to grant a patent modifiedORIGINAL CODE: EPIDOSCIGR1GRAC	GRAC	EP
2011-08-10	Despatch of communication of intention to grant a patentORIGINAL CODE: EPIDOSNIGR1GRAP	GRAP	EP
2010-05-05	Designated contracting states (corrected)RBV	RBV	EP
2010-01-13	Designation fees paidAKX	AKX	EP
2009-12-09	First examination report despatched17Q	17Q	EP
2009-11-04	Request for examination filed17P	17P	EP
2009-05-06	Designated contracting statesAK	AK	EP
2009-05-06	Request for extension of the european patentAX	AX	EP
2009-04-03	Search report despatchedORIGINAL CODE: 0009013PUAL	PUAL	EP
2008-03-26	Party data changed (applicant data changed or rights of an application transferred)RAP1	RAP1	EP
2008-03-19	Party data changed (applicant data changed or rights of an application transferred)RAP1	RAP1	EP
2005-08-31	Designated contracting statesAK	AK	EP
2005-08-31	Request for extension of the european patentAX	AX	EP
2005-07-15	Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI	PUAI	EP

Method for joining two wafers and wafer assembly

Abstract

Term

Priority claims4

Members10

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Events

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Titles3

Classification

Designated states36