Optoelectronic device

Optoelectronic component, in which an optoelectronic chip (1) is fastened on a chip carrier part (2) of a leadframe (7), in which the leadframe (7) has a connection part (8) arranged at a distance from the chip carrier part (2) an electrical contact of the optoelectronic chip (7) is electrically connected. The chip carrier part (2) has, for improved dissipation of the heat from the chip (1), a plurality of external connections (4, 5, 6) which protrude from this at various points of a sheathing (3) at a distance from one another.