EP1559520B1

Method for dynamically aligning substrates bearing printed reference marks and codes for automated cutting or scoring.

Abstract

This record has no abstract on file.

EP1559520B1, drawing sheet 1
Sheet 1 of 7

Term

Term ended

Expired 25 January 2025, 1.7 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

22 claims: 18 independent, 4 dependent

  1. 1
    A method of cutting and/or scoring a substrate (20) according to an amendable cutting plan relative to graphics (375) printed on an upper or lower surface of the substrate (20), the method comprising the following steps:(a) pre-printing on said surface of said substrate (20) said graphics (375), and at least a first registration mark (360') and a second registration mark (360");(b) automatically transporting said substrate (20) from an in-stack region (210) to a cutting table station (230) along an x-axis, said cutting table station (230) defining a reference frame;(c) while step (b) is carried out, optically detecting presence of said first registration mark (360') and detecting position thereof relative to said cutting table station reference frame;comprising the further following steps: (d) while step (b) is carried out and subsequent to step (c), detecting presence of said second registration mark (360") and detecting position thereof relative to said cutting table station reference frame;(e) using positional information acquired at step (c) and at step (d) to amend said cutting plan as needed to account for actual position and orientation of said substrate (20) on said cutting table station (230);and (f) cutting and/or scoring said substrate (20) according to said cutting plan as amended at step (e).
  2. 3
    The method according to any of the previous claims, wherein step (f) is carried out from a lower surface of said substrate (20).
  3. 4
    The method according to any of the previous claims, wherein said surface of said substrate (20) is pre-printed with at least one set of encoded-into-print instructions (370);and step (e) includes further amending said cutting plan according to said encoded-into-print instructions (370).
  4. 5
    The method according to any of the previous claims, wherein step (e) enables human input of correctional information.
  5. 6
    The method according to any of the previous claims, wherein transport velocity of said substrate (20) is in a range up to 2 m/sec.
  6. 7
    The method according to any of the previous claims, wherein step (d) achieves x-axis positional accuracy of said second registration mark (360") within an acceptable range.
  7. 8
    The method according to any of the previous claims, wherein steps (b), (c), (d), and (e) are carried out under computer control.
  8. 9
    An automated apparatus to cut and/or score a substrate (20) according to an amendable cutting plan relative to graphics (375) printed on an upper or lower surface of the substrate (20), which surface is also printed with at least a first registration mark (360') and a second registration mark (360"), the apparatus including:computer means (260, 510) including a processor (520) able to execute a software program (550) to control said automated apparatus, said computer means (260, 510) including at least memory (540) containing at least said amendable cutting plan;a carrier medium carrying said software program (550) and an amendment program to amend said amendable cutting plan;an in-stack region (210) wherein substrates (20) to be cut and/or scored are stackable;a cutting table station (230) whereon said substrate (20) will be cut and/or scored, said cutting table station (230) defining a cutting table station reference frame;a loadframe (290), coupled for control by said computer means (260, 510), to transport said substrate (20) along an x-axis from said in-stack region (210) to said cutting table station (230);the apparatus further including: a position detector (350), coupled to said computer means (260, 510), to detect presence and position relative to said cutting table station reference frame of said first and said second registration mark (360', 360") as said substrate (20) is transported by said loadframe (290) onto said cutting table station (230);said computer means (260, 510) coupled to receive data representing position of said loadframe (290) and to receive data from said position detector (350) representing position of said first registration mark (360') and said second registration mark (360"), and to amend said amendable cutting plan as needed to account for actual position and orientation of said substrate (20) on said cutting table station (230);and a cutter and/or scorer, coupled to said computer means (260, 510), to cut and/or score said substrate (20) according to said amendable cutting plan.
  9. 11
    The apparatus of any of claims 9 or 10, wherein transport velocity of said loadframe (290) and said substrate (20) is greater when said first registration mark (360') is detected than when said second registration mark (360") is detected such that acceptably good transport throughput is attained while maintaining acceptable accuracy of positional measurement of said second registration mark (360").
  10. 12
    The apparatus of any of claims 9 to 11, wherein transport velocity of said substrate (20) is in a range up to 2 m/sec.
  11. 13
    The apparatus of any of claims 9 to 12, wherein said position detector (350) detects position of said second registration mark (360") with an acceptable positional accuracy range.
  12. 14
    The apparatus of any of claims 9 to 13, wherein said cutter and/or scorer cuts and/or scores a surface of said substrate (20).
  13. 15
    The apparatus of any of claims 9 to 14, wherein:said surface of said substrate (20) is further pre-printed with at least one set of machine readable encoded-into-print instructions (370);and said computer means (260, 510) further amends said amendable cutting plan in according with said encoded-into-print instructions (370).
  14. 16
    The apparatus of any of claims 9 to 15, wherein said computer means (260, 510) can accept human input of information relative to actual position of said substrate (20) on said cutting table system (230).
  15. 17
    The apparatus of any of claims 9 to 16, wherein said apparatus is a short run cutting and scoring apparatus.
  16. 18
    A carrier medium carrying computer-readable instructions (550) that when executed by a computer processor (520) will cause a short run cutting and scoring apparatus to carry out the following method steps to cut and/or score a substrate (20) according to an amendable cutting plan relative to graphics (375) printed on an upper or lower surface of the substrate (20), which surface is also printed with at least a first registration mark (360') and a second registration mark (360"), the method steps comprising:(a) automatically transporting said substrate (20) from an in-stack region (210) of said apparatus to a cutting table station (230) of said apparatus along an x-axis, said cutting table station (230) defining a reference frame;(b) while step (a) is carried out, detecting presence of said first registration mark (360') and detecting position thereof relative to said cutting table station reference frame;characterized by (c) while step (a) is carried out and subsequent to step (b), detecting presence of said second registration mark (360") and detecting position thereof relative to said cutting table station reference frame;(d) using positional information acquired at step (b) and at step (c) to amend said cutting plan as needed to account for actual position and orientation of said substrate (20) on said cutting table station (230);and (e) cutting and/or scoring said substrate (20) according to said cutting plan as amended at step (d).
  17. 21
    The medium of any of claims 18 to 20, wherein;further printed on said surface of said substrate (20) is a set of encoded-to-print instructions (370);and step (d) includes further amending said amendable cutting plan according to said encoded-to-print instructions (370).
  18. 22
    The medium of any of claims 18 to 20, wherein step (d) includes enabling human input of correctional information to said amendable cutting plan.
Independent claims18