Semiconductor light-emitting apparatus having wavelength conversion portion and method of fabricating the same

BACKGROUND OF THE INVENTION

1. Field of the Invention

0001The present invention relates to a light-emitting apparatus having a semiconductor light-emitting device. In particular, the invention relates to a semiconductor light-emitting apparatus in which a semiconductor light-emitting device, or excitation light source, and a wavelength conversion portion are combined to chiefly emit white light.

2. Description of the Related Art

0002<figref idref="f0001">Fig. 1</figref> shows a known light-emitting apparatus that uses a wavelength conversion material. This light-emitting apparatus can include an insulating base 10, a semiconductor light-emitting device 12, and a light transmitting substrate 16 which is arranged on the insulating base 10. A pair of lead electrodes 11 can be formed on the surface of a substrate under the insulating base 10. The insulating base 10 can also have a concave portion 13 and a curved portion 14. The semiconductor light-emitting device 12 can be placed at the center of the bottom of the concave portion 13. The curved portion 14 can be continuous to the periphery of the concave portion 13. The semiconductor light-emitting device 12 placed at the center of the bottom of the concave portion 13 can be electrically connected with the pair of lead electrodes 11. A wavelength conversion layer 15 can be formed on a surface of the light transmitting substrate 16 where it faces the base 10.

0003For the sake of efficient light reflection, a reflecting film 17 made of Ag or the like can be formed on the inside of the concave portion 13 and the surface of the curved portion 14. The wavelength conversion layer 15 can be made of a resin in which phosphor materials are dispersed. The phosphor materials can be configured/selected for emitting light when excited by excitation light emitted from the semiconductor light-emitting device 12. The wavelength conversion layer 15 can be formed on the light transmitting substrate 16 by such means as screen printing. The light transmitting substrate 16 can be placed so that the wavelength conversion layer 15 is opposed to the semiconductor light-emitting device 12 and can be situated substantially directly above the concave portion 13 accommodating the device 12. The base 10 having the concave portion 13 and the curved portion 14 can, in conjunction with the light transmitting substrate 16 provided with the wavelength conversion layer 15, define a space which is filled with a translucent sealing material 18 to seal the semiconductor light-emitting device 12 and the wavelength conversion layer 15. Incidentally, the reflecting film 17 on the curved portion 14 may be coated with a second wavelength conversion layer 19 (for example, see <patcit id="pcit0001" dnum="JP2004056075A"><text>Japanese Unexamined Patent Application Publication No. 2004-56075 A</text></patcit> or its corresponding <patcit id="pcit0002" dnum="US6809342B"><text>U.S. Patent No. 6,809,342</text></patcit>).

0004In the light-emitting apparatus described above, the concave portion 13 for accommodating the semiconductor light-emitting device and the curved portion 14 can and often should be formed for the sake of improved light emission efficiency. Suppose, for example, the light-emitting apparatus of this configuration is applied in a white chip LED (a surface mountable LED device emitting light in the white wavelength range) or the like for use in a liquid crystal display backlight of a cellular phone or mobile information terminal. The mold for forming the base 10 having the concave portion 13 and the curved portion 14 can and often should have a high degree of precision, and thus may require extremely high skill for fabrication. As a result, there have been problems relating to increased costs for the white chip LED, difficulty in manufacturing, etc.

0005With an extremely simple configuration in which the first wavelength conversion layer 15 is formed alone without the curved portion 14 or the second wavelength conversion layer 19, the light-emitting apparatus can develop unevenness in color inside. A reason for this is as follows: When the light-emitting apparatus is viewed from its optical axis, the color of the excitation light is dominant in an area immediately near the semiconductor light-emitting device 12. Meanwhile, the color complementary to that of the excitation light, occurring from the wavelength conversion layer, is dominant in surrounding areas somewhat away from the area immediately near the semiconductor light-emitting device 12. In terms of intensity (intensity distribution), there have been problems in that the intensity peaks at the area immediately near the semiconductor light-emitting device 12 and it decreases toward the periphery.

0006Next, we will analyze the case where the base 10 is provided with the concave portion 13 alone without the curved portion 14, and only the second wavelength conversion layer 19 is formed on the inside of the concave portion 13 without the first wavelength conversion layer 15. Here, when the light-emitting apparatus is viewed from its optical axis, the light of the semiconductor light-emitting device 12 has difficulty in reaching the second wavelength conversion layer 19. Consequently, the complementary color of the excitation light, i.e., the light from the wavelength conversion layer 19 is dominant in the area immediately near the wavelength conversion layer 19 while the color of the light emitted from the semiconductor light-emitting device 12 is dominant in the other areas. That is, unevenness in color has also occurred in this case. As for intensity distribution, there have also been problems similar to the intensity problems described above.

0007<patcit id="pcit0003" dnum="WO03107441A"><text>WO 03/107441 A</text></patcit> discloses an emitter package exhibiting limited wavelength variations between batches and consistent wavelength and emission characteristics with operation. The emitter package comprises a semiconductor emitter and a conversion material. The conversion material is arranged to absorb substantially all of the light emitting from the semiconductor emitter and re-emit light at one or more different wavelength spectrums of light. The conversion material is also arranged so that there is not an excess of conversion material to block said re-emitted light as it emits from said emitter package, said emitter package emitting light at said one or more wavelength spectrums from said conversion material. The semiconductor emitter is preferably a light emitting diode (LED) or laser diode.

0008<patcit id="pcit0004" dnum="US20030132701A1"><text>US 2003/0132701 A1</text></patcit> discloses a light emitting apparatus provided with a fluorescent substance sealed within a cured epoxy resin. More particularly, in a light emitting apparatus comprising a light emitting device, a fluorescent substance is provided which is capable of absorbing at least a portion of light emitted by the light emitting device and emitting light having a different wavelength, and a color converting member which contains the fluorescent substance and directly coat the light emitting device, the color converting member contains at least an epoxy resin derived from triazine and a mixing ratio of the epoxy resin derived from triazine to the acid anhydride curing agent in the color converting member is from 100:80 to 100:240. However, there are no separate wavelength conversion layers like the present invention.

0009<patcit id="pcit0005" dnum="EP1107321A"><text>EP-A-1 107 321</text></patcit> discloses a light emitting diode comprising a light emitting diode element mounted on a glass epoxy substrate. The light emitting diode element is protected at its surface side by a resin seal member. A light emitting diode element for blue luminescence, formed of gallium nitride type compound semiconductor is used as the above-mentioned light emitting diode element; and a fluorescent material containing layer composed of a fluorescent material dispersed into an adhesive is arranged on the back side of this light emitting diode element. On the back side of the light emitting diode element, blue luminescence is converted in wavelength to produce white luminescence of high intensity.

0010<patcit id="pcit0006" dnum="WO03034508A"><text>WO 03/034508 A</text></patcit> discloses a light emitting device comprising a luminescent element and coating layers including a phosphor and provided in contact with each other. More particularly, a light emitting device comprises a luminescent element placed on a support and coating layers which bind a phosphor for absorbing a light from the luminescent element and converting the wave length thereof to the surface of the luminescent element, wherein the coating layers comprise an inorganic material comprising an oxide and a hydroxide of at least one element selected from the group consisting of Si, Al, Ga, Ti, Ge, P, B, Zr, Y, Sn, Pb and alkaline earth metals the light emitting device wherein the adhesive comprises the same inorganic material as that for the coating layers. Accordingly, there are no wavelength conversion layers separately formed on a bottom of a concave and in an opening thereof with a distance there between like the present invention.

SUMMARY OF THE INVENTION

0011To solve the foregoing and other related problems, intensive studies have been made to obtain equivalent or better properties from light emitting devices. As a result, the above and/or other problems can be solved or mediated by the provision of different embodiments of the invention.

0012According to an aspect of the invention, a semiconductor light-emitting apparatus is provided as forth in claim 1.

0013According to another aspect of the invention, there can be provided a method of fabricating a semiconductor light-emitting apparatus as set forth in claim 9.

0014Preferred embodiments of the present invention may be gathered from the dependent claims.

0015In accordance with the present invention, it is possible to fabricate a semiconductor light-emitting apparatus of low profile with great ease and/or at low cost.

0016Moreover, it is possible to obtain light emission with significantly high efficiency as compared to apparatuses that utilize only the light transmitted through a wavelength conversion layer or only the light reflected from a wavelength conversion layer. Moreover, since the process of forming a curved area in the concave portion may not be required, a low-profile apparatus can be fabricated at low cost. In addition, light-emitting apparatuses of this type can be manufactured by using conventional LED lead frames as is, which can eliminate the need for special molds.

0017The excitation light that is emitted in every direction from the semiconductor light-emitting device can generally undergo sufficient wavelength conversion before being emitted out of the light-emitting apparatus. This means a significant improvement to reducing color unevenness and intensity unevenness. In particular, when near-ultraviolet light is used as the excitation light source, the configuration capable of reducing intensity unevenness and suppressing the transmission of the near-ultraviolet light can prevent a light guide plate and the like from ultraviolet degradation. Moreover, when constituent light sources of white light, such as blue light, are used as the excitation light source, it is possible to fabricate a white LED of reduced color unevenness and intensity unevenness.

BRIEF DESCRIPTION OF THE DRAWINGS

0018These and other objects, features, and advantages of the present invention will become clear from the following description of exemplary embodiments and with reference to the accompanying drawings, wherein:

0019<figref idref="f0001">Fig. 1</figref> is a schematic diagram showing a semiconductor light-emitting apparatus according to a known packaging technique;

0020<figref idref="f0002">Figs. 2A-2C</figref> are schematic diagrams showing an embodiment of a semiconductor light-emitting apparatus made in accordance with the principles of the present invention, where <figref idref="f0002">Fig. 2A</figref> is a sectional view taken along the line IIA-IIA of <figref idref="f0002">Fig. 2B, Fig. 2B</figref> is a schematic plan view, and <figref idref="f0002">Fig. 2C</figref> is a sectional view taken along the line IIC-IIC of <figref idref="f0002">Fig. 2B</figref>;

0021<figref idref="f0003">Fig. 3</figref> is a diagram showing the intensity distribution of a comparative example of the semiconductor light-emitting apparatus of <figref idref="f0002">Figs. 2A-2C</figref>;

0022<figref idref="f0004">Fig. 4</figref> is a diagram showing the intensity distribution of a particular fabrication of the semiconductor light-emitting apparatus of <figref idref="f0002">Figs. 2A-2C</figref>;

0023<figref idref="f0005">Figs. 5A and 5B</figref> are schematic diagrams showing another embodiment of a semiconductor light-emitting apparatus made in accordance with the principles of the invention, where <figref idref="f0005">Fig. 5A</figref> is a sectional view of the same, and <figref idref="f0005">Fig. 5B</figref> is a plan view of the same;

0024<figref idref="f0006">Fig. 6</figref> is a diagram showing the intensity distribution of a comparative example of the semiconductor light-emitting apparatus of <figref idref="f0005">Figs. 5A-B</figref>;

0025<figref idref="f0007">Fig. 7</figref> is a diagram showing the intensity distribution of a particular fabrication of the semiconductor light-emitting apparatus of <figref idref="f0005">Figs. 5A-B</figref>; and

0026<figref idref="f0008">Fig. 8</figref> is a chart showing the emission spectra of the light emitted from a particular fabrication of a semiconductor light-emitting apparatus of <figref idref="f0005">Figs. 5A-B</figref> as compared to a comparative semiconductor light-emitting apparatus.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

0027Hereinafter, description will be given of the present invention with reference to the drawing figures, wherein like reference numerals designate identical or corresponding elements throughout the several figures. Incidentally, various modifications can be made without departing from the gist of the invention. It is intended that various modifications of the exemplary embodiments described herein can be made and would fall within the scope of the present invention.

0028<figref idref="f0002">Figs. 2A-2C</figref> are explanatory diagrams showing an embodiment of the semiconductor light-emitting apparatus made in accordance with the principles of the invention. <figref idref="f0002">Fig. 2A</figref> is a sectional view taken along the line IIA-IIA of <figref idref="f0002">Fig. 2B. Fig. 2B</figref> is a schematic plan view. <figref idref="f0002">Fig. 2C</figref> is a sectional view taken along the line IIC-IIC of <figref idref="f0002">Fig. 2B</figref>.

0029The semiconductor light-emitting apparatus of <figref idref="f0002">Fig. 2A</figref> can include an insulating base 7, a semiconductor light-emitting device 1, and a wavelength conversion portion. The insulating base 7 can also include a concave portion 6. The semiconductor light-emitting device 1 can be arranged at the bottom of the concave portion 6. Here, the wavelength conversion portion can be composed of a first wavelength conversion layer 3 formed on the bottom of the concave portion 6, and a second wavelength conversion layer 5 formed in the opening of the concave portion 6 at a distance above the semiconductor light-emitting device 1. The space defined by the concave portion 6 of the base 7 and the second wavelength conversion layer 5 can be filled with a sealing material 4 for transmitting light emitted from the semiconductor light-emitting device 1.

0030The base 7 can include and/or consist of a substrate part 7a and a reflecting frame part 7b. The substrate part 7a can be provided with at least a pair of lead electrodes 8, or an anode electrode and a cathode electrode. The lead electrodes 8 can project out of the base 7. The reflecting frame part 7b can be arranged on the substrate part 7a and can have the concave portion 6 in its center. The pair of lead electrodes 8 can be formed so that the electrodes 8 are exposed in the bottom area of the concave portion 6. In the shown example, the semiconductor light-emitting device is surrounded by the reflecting frame part 7b, and the concave portion 6 is formed in the center of the same. Nevertheless, the reflecting frame part 7b may be formed in other manners, including on either one of the pairs of opposed sides and not on the other. For example, in the plan view of <figref idref="f0002">Fig. 2B</figref>, the reflecting frame part 7b can be formed on the right and left alone, and not on the top and bottom. The concave portion 6 can be formed in the middle.

0031Examples of the methods for forming the concave portion 6 into which the semiconductor light-emitting device 1 can be arranged and fixed are, though not restrictive, described as follows.

0032Integral molding methods can be used such that the electrodes 8 are loaded as insert members into a mold, and the material is injected into the mold so that the base 7 (the substrate part 7a and the reflecting frame part 7b) is insert-molded.

0033Bonding-after methods can be used such that the electrodes 8 are fixed to the surface of the substrate part 7a before the reflecting frame part 7b is attached to form the base 7.

0034The material(s) for making the base 7 can be selected from among ones that develop no electric short circuit between the anode and cathode electrodes, or the lead electrodes 8. The substrate part 7a can be made of an insulating material such as insulating resins including a glass fiber containing epoxy resin, and ceramics. In a practical viewpoint, it is sometimes preferable to use materials having relatively high melting points so that no deformation occurs at temperatures expected at the time of packaging with solder materials. The reflecting frame part 7b can be made of an insulating material having heat resistance to soldering temperatures (around 200°C or below), such as high melting point insulating resins made of liquid polymers including liquid crystal polyester, and ceramics. It may also be preferable for the concave portion 6 to be formed in the center, and that the material be white or the like in color, having a certain degree of high reflectivity. For integral molding, the substrate part 7a and the reflecting frame part 7b can be made of liquid crystal polymers. White liquid crystal polymer materials are sometimes superior in many respects, including insulation performance, heat resistance, high reflectivity, and formability. In addition, a layer of high reflectivity material may be formed on the inside 71 of the concave portion 6 of the base 7 by such means as coating, plating, vapor deposition, and the like.

0035The concave portion 6 may be shaped generally like a truncated cone, a truncated pyramid, partially hemispherical surface, etc. The concave portion 6 can also have an inclined inner periphery. However, in the case of a white LED intended for use as a light source of a display backlight in a cellular phone, the inner periphery may be shaped generally perpendicular for the sake of a desired reduction in device profile. Thus, the reflecting frame part 7b can be generally rectangular in the angle of the inner periphery without departing from the spirit and scope of the invention.

0036The semiconductor light-emitting device 1 can be attached to the bottom of the concave portion 6. In the example shown in <figref idref="f0002">Figs. 2A-2C</figref>, the semiconductor light-emitting device 1 is electrically and mechanically fixed onto one of the electrodes 8 by die bonding using an Ag paste. A conductive wire 2 that extends from the top of the semiconductor light-emitting device and the other electrode 8 can be connected by wire bonding.

0037The semiconductor light-emitting device 1 may be made of any semiconductor material, and preferably of a material that emits light having energy capable of exciting the wavelength conversion material. Semiconductor materials for emitting light in the range of ultraviolet light and blue light are preferable in particular instances. It is also sometimes preferable that the semiconductor light-emitting device 1 fall within the range of 300 and 490 nm in the light emission peak wavelength. Examples of the semiconductor materials for making the semiconductor light-emitting device 1 include light-emitting diodes (LEDs) such as group-III nitride compound (for example, In-Ga-Al-N compound) semiconductors, zinc oxide compound (for example, Zn-Mg-O compound) semiconductors, zinc selenide compound (for example, Zn-Mg-Se-S-Te compound) semiconductors, and silicon carbide compound (for example, Si-Ge-C) semiconductors. However, the semiconductor materials are not limited thereto. It is only preferable in certain circumstances that they emit light within the foregoing range of light emission peak wavelengths. Incidentally, semiconductor light-emitting devices fixed onto sub mounts shall also be referred to as "semiconductor light-emitting devices" and fall within the scope of the present invention.

0038Note that the embodiment of <figref idref="f0002">Figs. 2A-2C</figref> deals with the case where the bottom side of the semiconductor light-emitting device 1 establishes electric connection with one of the electrodes 8, and the top side establishes electric connection with the other electrode 8. It is also possible, however, to use a semiconductor device that can establish electric connection with both the electrodes 8 at an identical side, or to different combinations of side, bottom or top mount electrodes.

0039For example, if a semiconductor device that has a pair of LED electrodes on its top side is used as a semiconductor light-emitting device 1 as shown in <figref idref="f0002">Figs. 2A-2C</figref>, the semiconductor light-emitting device can be mechanically bonded onto the substrate part 7a with an adhesive such as an epoxy resin. The anode and cathode electrodes formed on the top side of the semiconductor light-emitting device can be electrically bonded to the respective corresponding lead electrodes 8 in pair by conductive wires 2. Among other typical electrode connection methods available are the following: those in which the anode and cathode electrodes of the semiconductor light-emitting device 1 are electrically connected to the corresponding lead electrodes 8 and the device is fixed to the base 7 at the same time by such means as Au-Sn or other eutectic materials, Au bumps, anisotropic conductive sheets, and conductive resins typified by an Ag paste; and those in which either one of the electrodes of the device is electrically connected to the corresponding lead electrode 8 and fixed to the base 7 by using the foregoing materials while the other electrode and the corresponding lead electrode 8 are electrically bonded by a conductive wire. Furthermore, in order to improve the heat radiation of the semiconductor light-emitting device 1, the base 7 may be made of metal or other conductive materials. Here, the base 7 may also function as one of the lead electrodes 8.

0040There are various forms available for the base 7, the semiconductor light-emitting device 1, and the lead electrodes 8. Regardless of the form that is used, the semiconductor light-emitting device 1 can be fixed onto the base 7, and the anode and cathode lead electrodes 8 can be electrically connected to the corresponding anode and cathode electrodes of the semiconductor light-emitting device 1.

0041The first wavelength conversion layer 3 can be formed in the bottom area of the concave portion 6. In the example shown in <figref idref="f0002">Figs. 2A-2C</figref>, the first wavelength conversion layer 3 is formed on the top area of the substrate part 7a and on the semiconductor light-emitting device 1 at the bottom of the concave portion 6. The first wavelength conversion layer 3 can have one or more layers of wavelength conversion materials within a thickness smaller than the height of the semiconductor light-emitting device 1. The ideal thickness depends on various properties, including the wavelength conversion efficiencies of various wavelength conversion materials. In a practical viewpoint, the wavelength conversion layer can have a thickness around 20 to 200 µm since the semiconductor light-emitting device generally has a thickness of 300 µm or so. As employed in this specification, the "wavelength conversion portion (or layer)" will refer not only to the layer made of wavelength conversion material alone, but also to the entire area where wavelength conversion material concentrates densely. Suppose, for example, that phosphor particles, or wavelength conversion material, are mixed into a thermosetting resin. Then, the wavelength conversion layer can refer to an entire area of the sealing portion 4 to be described later where the phosphor particles are distributed densely.

0042Although not a restrictive list of methods, the first wavelength conversion layer 3 may be formed by any of the following methods: (1) placing the semiconductor light-emitting device 1 on the bottom of the concave portion 6, and then applying a wavelength conversion material such as an inorganic phosphor directly to the bottom of the concave portion 6 to form the first wavelength conversion layer 3; (2) mixing the wavelength conversion material for forming the first wavelength conversion layer 3 into the material for forming the sealing portion 4, injecting the mixed material into the concave portion 6, and hardening the sealing portion 4 when the wavelength conversion material in the mixed material settles out to the bottom area of the concave portion 6 by its own weight and lies densely in this area, so that this area creates the first wavelength conversion layer 3; and (3) attaching, onto the bottom of the concave portion 6a, a wavelength-conversion-material-containing sheet that has a predetermined thickness and a wavelength conversion material at a predetermined density.

0043The first wavelength conversion layer 3 can also be formed on the top of the semiconductor light-emitting device 1. Here, the semiconductor light-emitting apparatus can be improved by providing a more even intensity distribution due to the excitation light being emitted directly upward from the semiconductor light-emitting device 1. This configuration allows light to be wavelength converted and scattered as well.

0044In <figref idref="f0002">Figs. 2(A), 2(C)</figref> and <figref idref="f0005">5(A)</figref>, the first wavelength conversion layer 3 has approximately the same thickness throughout the layer. However, distribution of phosphors that form the first wavelength conversion layer 3 is not limited thereto, and can include various thickness layers and layers that have changing thicknesses.

0045The sealing portion 4 can be made of a light transmitting material which maintains the distance from the semiconductor light-emitting device 1 and the first wavelength conversion layer 3 to the second wavelength conversion layer 5. The material may also be capable of transmitting both the excitation light from the semiconductor light-emitting device 1 and the wavelength conversion light converted by the wavelength conversion material. Some examples include thermosetting resins and low melting point glass. Incidentally, if the second wavelength conversion layer 5 is a preformed sheet, the sealing portion 4 may be formed to be hollow (or sealed with a gaseous material) when accompanied with a configuration that fixes the sheet to the reflecting frame part 7b.

0046Examples of materials that can be used for making the sealing portion 4 are the following: materials that have a high transmittance up to shortwave regions covering the peak wavelength of light emission from the semiconductor light-emitting device 1; materials that have a constituent material of the first wavelength conversion layer 3 that can be mixed and dispersed therein; and materials in which the constituent material of the first wavelength conversion layer 3 can settle out (be distributed) densely at the bottom of the concave portion 6 when heated and left standing, etc. Specific examples include thermosetting resins containing at least one resin selected from the group consisting of epoxy resins, silicone resins, polydimethylsiloxane derivatives having epoxy groups, oxetane resins, acryl resins, and cycloolefin resins. To reduce ultraviolet-based yellowing, epoxy resins made of epoxy resin materials containing hydrogenated bisphenol A diglycidyl ether, alycyclic epoxy carboxylate, and organic sulfonium-hexafluoroantimonate can be used.

0047The sealing portion 4 can be shaped so that its top surface that corresponds to a position substantially directly above the semiconductor light-emitting device 1 sinks into a generally recessed surface. This can facilitate the formation of the second wavelength conversion layer 5. In addition, the second wavelength conversion layer 5 can efficiently scatter the excitation light and the once-wavelength-converted light which is wavelength-converted by the first wavelength conversion layer 3. Examples of methods that can be used to form a generally recessed surface on the sealing portion 4 are as follows: heating the material of the sealing portion 4 for hardening, at which time the surface is formed naturally through solvent evaporation; controlling the composition of the material of the sealing portion 4 and the amount of injection of the same to cause a meniscus phenomenon, and harden it in that state to form the recessed surface; and forming the recessed surface by compression molding or the like.

0048The second wavelength conversion layer 5 can be arranged at an appropriate distance from the semiconductor light-emitting device 1 and the first wavelength conversion layer 3 so that it covers the vicinity of the opening end of the concave portion 6 (see <figref idref="f0002">Fig. 2A</figref>), at least over the semiconductor light-emitting device 1 in plan view. In the embodiment shown in <figref idref="f0002">Fig. 2B</figref>, the second wavelength conversion layer 5 is arranged at the center of the opening of the concave portion 6 and has an area narrower than the opening. In another embodiment shown in <figref idref="f0005">Figs. 5A and 5B</figref>, the second wavelength conversion layer 5 is formed to cover the entire opening of the concave portion 6.

0049The second wavelength conversion layer 5 can be formed by mixing an appropriate binder resin and a wavelength conversion material, and arranging this mixed material onto the sealing portion 4 directly above the semiconductor light-emitting device 1 by such means as potting using a dispenser. As described previously, the sealing portion 4 can be shaped so that its top sinks into a generally curved surface. The recess formed in the top of the sealing portion 4 can be filled with the constituent material of the second wavelength conversion layer 5 to form the second wavelength conversion layer 5. The binder resin of the second wavelength conversion layer 5 may be the same material as the constituent material of the sealing portion 4. Any material may be used and preferably has excellent adhesiveness with the sealing portion 4 and causes little or no degradation due to the excitation light.

0050As for the thickness of the second wavelength conversion layer 5, even a single layer of particles of the wavelength conversion material is effective. Since excessive thicknesses can lower the output efficiency, a thickness in the range of 20 µm to 150 µm may be desirable in some circumstances. A thickness that is smaller than that of the first wavelength conversion layer 3 is also often preferable.

0051The wavelength conversion materials for forming the first wavelength conversion layer 3 and the second wavelength conversion layer 5 convert the peak wavelength of light emission from the semiconductor light-emitting device 1 into longer peak wavelengths of light emission. The wavelength conversion materials may contain one or more types of materials. In consideration of color unevenness, the first wavelength conversion layer 3 and the second wavelength conversion layer 5 can be made of the same wavelength conversion material. Nevertheless, the first wavelength conversion layer 3 and the second wavelength conversion layer 5 may be made of respective different wavelength conversion materials, depending on the physical properties of the constituent materials, such as reflectance. Examples of wavelength conversion materials include the following. A₃B₅O₁₂:M phosphors (A: at least one element selected from among Y, Gd, Lu, and Tb; B: at least one element selected from A1 and Ga; and M: at least one ion selected from among Ce³⁺, Tb³⁺, Eu³⁺, Cr³⁺, Nd³⁺, and Er³⁺); rare-earth doped barium-aluminum-magnesium compound phosphors (BAM phosphors); sulfide compound phosphors typified by Y₂O₂S:Eu³⁺ and ZnS:Cu,Al; rare-earth doped thiogallate phosphors such as (Sr,Ca)S:Eu²⁺, CaGa₂S₄:Eu²⁺, and SrGa₂S₄:Eu²⁺; and phosphors containing at least one of aluminate compositions such as TbAlO₃:Ce³⁺. These phosphors may be used alone, or two or more types in combination. If necessary, the wavelength conversion layers may include scattering agents such as barium sulfate, magnesium oxide, and/or silicon oxide for the sake of assisting the reflection of the excitation light and the wavelength conversion light.

0052Even if the excitation light resides in the ultraviolet or near-ultraviolet region and does not include a white light source, the excitation light can undergo the same wavelength conversion, reflection, etc. as in the foregoing case where the excitation light constitutes a light source of white light. The light can be emitted from the opening of the concave portion 6. When the excitation light is in the ultraviolet or near-ultraviolet region, however, the external emission of the excitation light can cause the ultraviolet degradation of electronic parts such as a light guide plate. It may therefore be preferable to prevent the excitation light from being emitted outside of the light-emitting apparatus as much as possible. In the case where the excitation light should be excluded from the light to be emitted from the semiconductor light-emitting apparatus, or, for example, where a semiconductor light-emitting device for emitting ultraviolet rays is used, then, it is usually preferable that the thicknesses and constituent materials of the first wavelength conversion layer 3 and the second wavelength conversion layer 5 be adjusted to reduce ultraviolet rays to be emitted outside. The external emission of the ultraviolet rays can also be reduced by configuring the semiconductor light-emitting apparatus so that the light emitted from the semiconductor light-emitting device always takes the path through the first wavelength conversion layer 3 and/or the second wavelength conversion layer 5. For example, in the embodiment shown in <figref idref="f0005">Figs. 5A and 5B</figref>, the second wavelength conversion layer 5 is arranged to cover the entire opening of the concave portion 6 so that all the emitted light can be turned into wavelength conversion light.

0053A semiconductor light-emitting apparatus having an oblong rectangular shape in plan view as shown in <figref idref="f0002">Figs. 2A and 2B</figref> was fabricated. A description of this specific fabrication is now provided as an example of an apparatus and method that corresponds to the embodiment shown in <figref idref="f0002">Figs. 2A-C</figref>. Initially, a white thermosetting resin having a high melting point was insert molded with Ag-plated lead electrodes 8 as the insert members. As a result, a base 7 having a concave portion 6 and integrated electrodes 8 was fabricated. Here, in the section taken along the line IIC-IIC shown in <figref idref="f0002">Fig. 2C</figref>, the concave portion 6 was formed so that the top surfaces of the lead electrodes 8 and the inside of the concave portion 6 of the reflecting frame part 7b formed an angle of approximately 90°. Furthermore, in the section taken along the line IIA-IIA of <figref idref="f0002">Fig. 2A</figref>, the concave portion 6 was formed so that the top surfaces of the lead electrodes 8 and the inside of the concave portion 6 of the reflecting frame part 7b formed an obtuse angle.

0054For the semiconductor light-emitting device 1, a semiconductor device for emitting blue light, made of an InGaN compound semiconductor (having a light emission peak wavelength of 470 nm) formed on an n-type SiC substrate, was used. A cathode electrode formed on this n-type substrate and its corresponding lead electrode 8 were electrically bonded to each other and mechanically fixed to the base 7 with an Ag paste.

0055Next, for the sake of simultaneous formation of the first wavelength conversion layer 3 and the sealing portion 4, an epoxy resin was mixed with an appropriate amount of YAG phosphor to form the constituent material. Incidentally, YAG phosphors generate wavelength conversion light of yellow when excited by blue light of near 470 nm. This constituent material was filled into the concave portion 6, and left standing so that the phosphor naturally settled out to the bottom area of the concave portion 6. Then, under the condition of 150°C and after hour, the material was hardened to simultaneously form the first wavelength conversion layer 3 and the sealing portion 4.

0056Next, the constituent material of the second wavelength conversion layer 5, <i>i.e.,</i> a mixed material of epoxy resin and the previously described phosphor, was applied to a recess in the top of the sealing portion 4 which had been generated by itself during the hardening of the epoxy resin. The resultant mixture was hardened at 150°C for one hour, to form the second wavelength conversion layer 5.

0057<figref idref="f0004">Fig. 4</figref> shows the intensity distribution of the semiconductor light-emitting apparatus, as viewed from its optical axis, when the semiconductor light-emitting device as described in the above fabrication description was energized and lit by a current of 1 mA. In <figref idref="f0004">Fig. 4</figref>, white areas have higher intensities, and black areas lower intensities.

0058For a comparative example, a semiconductor light-emitting apparatus having the same oblong rectangular shape was fabricated under the same condition as in the above described configuration/fabrication of the embodiment of <figref idref="f0002">Figs. 2A-C</figref>. In the comparative example, the first wavelength conversion layer 3 and the sealing portion 4 were formed under the same conditions, whereas the second wavelength conversion layer 5 was not formed.

0059<figref idref="f0003">Fig. 3</figref> shows the intensity distribution of the semiconductor light-emitting apparatus, as viewed from its optical axis, when the semiconductor light-emitting device of the comparative example (without the second wavelength conversion layer 5) was energized and lit by the same current of 1 mA. Again, in <figref idref="f0003">Fig. 3</figref>, white areas have higher intensities, and black areas lower intensities.

0060As shown in <figref idref="f0003">Fig. 3</figref>, blue light to white light were observed with high intensities in the semiconductor light-emitting apparatus of the comparative example since the excitation light from the semiconductor light-emitting device 1 was dominant in the area immediately near the device 1. In the surrounding areas away from the area immediately near the semiconductor light-emitting device 1, on the other hand, it was observed that the wavelength conversion light from the wavelength conversion material, i.e., yellow light, was dominant. Moreover, as compared to the area immediately near the semiconductor light-emitting device 1, the surrounding areas were significantly low in intensity, with remarkable unevenness both in the intensity distribution and in color on the whole.

0061In contrast, the semiconductor light-emitting apparatus used to create the light intensity distribution of <figref idref="f0004">Fig. 4</figref> showed more uniform white light emission over almost all areas, with no noticeable unevenness in intensity distribution as compared to that of <figref idref="f0003">Fig. 3</figref>.

0062Next, a semiconductor light-emitting apparatus having a square shape in plan view as shown in <figref idref="f0005">Figs. 5A and 5B</figref> was fabricated. A description of this specific fabrication (fabrication II) is now provided as an example of an apparatus and method that corresponds to the embodiment shown in <figref idref="f0005">Figs. 5A-B</figref>.

0063Initially, a white thermosetting resin having a high melting point was insert molded with Ag-plated lead electrodes 8 as the insert members. As a result, a base 7 having a concave portion 6 and integrated electrodes 8 was fabricated. Here, the concave portion 6 was shaped like a bowl so that the top surfaces of the lead electrodes 8 and the inside of the concave portion 6 of the reflecting frame part 7b formed an angle of approximately 50°.

0064For the semiconductor light-emitting device 1, a semiconductor device for emitting ultraviolet rays, made of an InGaN compound semiconductor (having a light emission peak wavelength of 395 nm) formed on an n-type SiC substrate, was used. A cathode electrode formed on this n-type substrate and its corresponding lead electrode 8 were electrically bonded to each other and mechanically fixed to the base 7 with an Ag paste.

0065Next, for the sake of simultaneous formation of the first wavelength conversion layer 3 and the sealing portion 4, predetermined proportions of blue, red, and green light emission phosphors, or a barium-aluminum-magnesium compound phosphor (BAM phosphor), Y₂O₂S:Eu³⁺, and ZnS:Cu,Al, respectively, were mixed to form a wavelength conversion material. The thus obtained mixed phosphors were mixed and dispersed into an epoxy resin at a rate of 20% by weight. The employed epoxy resin contained a certain amount of UV absorbents. Alternatively, it can be noted that resin having high UV resistance by itself may have been used. The resulting constituent material was filled into the concave portion 6, and left standing so that the phosphors naturally settled out to the bottom area of the concave portion 6. Then, under the condition of 150°C and after 1 hour, the material was hardened to simultaneously form the first wavelength conversion layer 3 and the sealing portion 4.

0066Next, the constituent material of the second wavelength conversion layer 5, <i>i.e.,</i> the mixed material that included epoxy resin and 20% by weight of the foregoing described mixed phosphors, was applied to a recess in the top of the sealing portion 4 which had been generated by itself during the hardening of the epoxy resin. The resultant material was hardened at 150°C for one hour to form the second wavelength conversion layer 5. Note that in the previously described fabrication, the second wavelength conversion layer 5 was formed only in the center area of the opening of the concave portion 6, not in the surrounding areas. In the presently described fabrication, the second wavelength conversion layer 5 was formed over the entire opening of the concave portion 6 as shown in <figref idref="f0005">Figs. 5A and 5B</figref>. The first wavelength conversion layer 3 and the second wavelength conversion layer 5 both had a thickness of approximately 130 µm.

0067<figref idref="f0007">Fig. 7</figref> shows the intensity distribution of the semiconductor light-emitting apparatus, as viewed from its optical axis, when the above-described fabrication II of the semiconductor light-emitting device was energized and lit by a current of 1 mA. In <figref idref="f0007">Fig. 7</figref>, white areas have higher intensities, and black areas lower intensities.

0068For comparative example, a semiconductor light-emitting apparatus having the same square shape was fabricated under the same conditions as in fabrication II. In the comparative fabrication example however, the first wavelength conversion layer 3 and the sealing portion 4 were formed under the same conditions, whereas the second wavelength conversion layer 5 was not formed.

0069<figref idref="f0006">Fig. 6</figref> shows the intensity distribution of the semiconductor light-emitting apparatus, as viewed from its optical axis, when the semiconductor light-emitting device of the comparative example to fabrication II was energized and lit by the same current of 1 mA as was used with fabrication II. Again, in <figref idref="f0006">Fig. 6</figref>, white areas have higher intensities, and black areas lower intensities.

0070As shown in <figref idref="f0006">Fig. 6</figref>, when the semiconductor light-emitting apparatus of the comparative example to fabrication II was used, light emission of high intensity was observed only in the area immediately near the semiconductor light-emitting device 1. This shows significant unevenness in the intensity distribution. Meanwhile, as shown in <figref idref="f0007">Fig. 7</figref>, uniform light emission is exhibited substantially all over, with substantially no noticeable unevenness in the intensity distribution as compared to <figref idref="f0006">Fig. 6</figref>.

0071To check how much of the excitation light from the ultraviolet light-emitting device 1 (i.e., the ultraviolet rays) was included in the constituent sources of the light emitted from the semiconductor light-emitting apparatus, a spectral analysis was conducted on the light emitted from the semiconductor light-emitting apparatuses of the fabrication II device and the comparative example to fabrication II device. <figref idref="f0008">Fig. 8</figref> shows the results. In the spectral analysis, the semiconductor light-emitting apparatuses were installed in the integrating sphere of a spectroscopic analyzer, energized by a current of 20 mA, and measured for the light emitted at that time.

0072It can be confirmed from <figref idref="f0008">Fig. 8</figref> that the light emitted from the semiconductor light-emitting apparatus according to fabrication II contains 50% or less excitation light, i.e., light having a peak wavelength of 395 nm, as compared to the comparative example to fabrication II described above where the second wavelength conversion layer is not formed.